BQ24078RGTT [TI]

具有电源路径和 4.35V VBAT 的独立型单节 1.5A 线性电池充电器 | RGT | 16 | -40 to 85;


型号：	BQ24078RGTT
厂家：	TEXAS INSTRUMENTS
描述：	具有电源路径和 4.35V VBAT 的独立型单节 1.5A 线性电池充电器 \| RGT \| 16 \| -40 to 85 电池
文件：	总43页 (文件大小：2590K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

bq2407x 1.5A 高电池电压锂离子电池充电器

（具有电源路径管理 IC）

1 特性

3 说明

•

完全符合 USB 充电器标准

bq2407x 是一个集成型锂离子电池线性充电器系列，

具有适用于空间受限型便携式应用的系统电源路径管

理功能。这类器件通过 USB 端口或交流适配器运行，

最高支持 1.5A 的充电电流。它们在输入电压范围内具

有输入电压保护功能，因此支持非稳压适配器。

bq2407x 的 USB 输入电流限制精度和启动序列使得这

款器件能够符合 USB-IF 涌入电流规范。此外，输入动

态电源管理 (V_IN-DPM) 可防止因错误配置 USB 电源而

引起的系统崩溃，并且可最大程度地提高能够从适配器

中获得的功率。

–

最大输入电流可选 100mA 和 500mA

100mA 最大电流限制可确保充电符合 USB-IF

标准

–

基于输入的动态电源管理 (V_IN-DPM)，用于保护

免受不良 USB 电源损害

•

28V 输入额定值，具有过压保护

集成的动态电源路径管理 (DPPM) 功能可同时独立

进行系统供电和电池充电

•

具有用于进行电流监控的输出 (ISET)，可支持高达

1.5A 的充电电流

bq2407x 具有动态电源路径管理 (DPPM) 功能，可在

为系统供电的同时独立为电池充电。当输入电流限制引

起系统输出降至 DPPM 阈值时，DPPM 电路将减少充

电电流；因此，可在为系统负载供电时随时监测充电电

流。这个特性减少了电池上充放电周期的数量，可实现

充电正常终止并使得系统能够在由有缺陷或者不完整的

电池组供电的情况下运行。

针对墙式充电器的高达 1.5A 的可编程输入电流限

制

•

系统输出跟踪电池电压

带有 SYSOFF 输入的电池断开功能。

可编程预充电和快速充电安全定时器

反向电流、短路和热保护

负温度系数 (NTC) 热敏电阻输入

专有启动序列可限制浪涌电流

器件信息⁽¹⁾

电池充电电压 V_BAT

：

器件型号

bq24076

bq24078

封装

封装尺寸（标称值）

–

bq24076 - 4.4V（典型值）

bq24078 - 4.35V（典型值）

VQFN (16)

3.00mm x 3.00mm

•

状态指示 - 正在充电/充电完成，电源正常

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

2 应用范围

典型应用电路

•

智能电话

1kW

便携式媒体播放器

便携式导航设备

低功耗手持设备

便携式游戏机

耳机

1kW

SYSTEM

OUT

1mF

可穿戴设备

4.7mF

bq24076

bq24078

家庭自动化

EN2

BAT

VSS

便携式医疗设备

System

ON/OFF

Control

SYSOFF

4.7mF

PACK+

TEMP

PACK-

1.18kW

1.13kW

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLUSCM1

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

9.3 Feature Description................................................. 13

9.4 Device Functional Modes........................................ 24

10 Application and Implementation........................ 26

10.1 Application Information.......................................... 26

10.2 Typical Application ................................................ 26

11 Power Supply Recommendations ..................... 31

12 Layout................................................................... 31

12.1 Layout Guidelines ................................................. 31

12.2 Layout Example .................................................... 32

12.3 Thermal Considerations........................................ 33

13 器件和文档支持 ..................................................... 34

13.1 器件支持................................................................ 34

13.2 相关链接................................................................ 34

13.3 接收文档更新通知 ................................................. 34

13.4 社区资源................................................................ 34

13.5 商标....................................................................... 34

13.6 静电放电警告......................................................... 34

13.7 Glossary................................................................ 34

14 机械、封装和可订购信息....................................... 34

特性.......................................................................... 1

应用范围................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

说明（续）.............................................................. 3

Device Comparison Table..................................... 3

Pin Configuration and Functions......................... 4

Specifications......................................................... 5

8.1 Absolute Maximum Ratings ..................................... 5

8.2 ESD Ratings.............................................................. 5

8.3 Recommended Operating Conditions....................... 6

8.4 Thermal Information.................................................. 6

8.5 Dissipation Ratings ................................................... 6

8.6 Electrical Characteristics........................................... 7

8.7 Typical Characteristics.............................................. 9

Detailed Description ............................................ 11

9.1 Overview ................................................................. 11

9.2 Functional Block Diagram ....................................... 12

4 修订历史记录

Changes from Original (October 2017) to Revision A

Page

•

Changed I_INTest Conditions From: T_J= 85°C To: T_J< 85°C in the Electrical Characteristics table..................................... 7

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

5 说明（续）

此外，该系列充电器可提供经稳压的系统输入，即使在电池完全放电的情况下，也可使系统在连接电源后实现瞬间

开启。当适配器无法提供峰值系统电流时，电源路径管理架构还允许使用电池来补充系统电流，进而支持使用更小

的适配器。

电池充电发生于以下三个阶段：调节、恒定电流和恒定电压。在所有的充电阶段，一个内部控制环路监测 IC 结温

并且如果超过此内部温度阈值则减少充电电流。充电器功率级和充电电流感应功能完全集成在了一起。该充电器具

高精度电流和电压调节环路、充电状态显示和充电终止功能。输入电流限制和充电电流可使用外部电阻编程设定。

6 Device Comparison Table

OPTIONAL

FUNCTION

PART NUMBER^{(1) (2)}

V_OVP

V_BAT(REG)

V_OUT(REG)

V_DPPM

bq24072

bq24073

bq24074

bq24075

bq24076

bq24078

bq24079

6.6 V

10.5 V

6.6 V

4.2 V

4.4 V

4.35 V

4.1 V

V_BAT+ 225 mV

4.4 V

V_O(REG)– 100 mV

4.3 V

4.4 V

ITERM

SYSOFF

5.5 V

V_BAT+ 210mV

5.5 V

V_BAT+100 mV

4.3 V

(1) For all available packages, see the orderable addendum at the end of the data sheet

(2) This product is RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and is suitable for

use in specified lead-free soldering processes. In addition, this product uses package materials that do not contain halogens, including

bromine (Br) or antimony (Sb) above 0.1% of total product weight.

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

7 Pin Configuration and Functions

RGT Package

16-Pin VQFN

Top View

BAT

ILIM

OUT

CHG

Thermal

Pad

Not to scale

Pin Functions

I/O

DESCRIPTION

NAME

NO.

Charger Power Stage Output and Battery Voltage Sense Input. Connect BAT to the positive terminal of the battery. Bypass

BAT to VSS with a 4.7-μF to 47-μF ceramic capacitor.

BAT

2, 3

I/O

Charge Enable Active-Low Input. Connect CE to a high logic level to suspend charging. When CE is high, OUT is active and

battery supplement mode is still available. Connect CE to a low logic level to enable the battery charger. CE is internally

pulled down with approximately 285 kΩ. Do not leave CE unconnected to ensure proper operation.

Open-Drain Charging Status Indication Output. CHG pulls to VSS when the battery is charging. CHG is high impedance when

charging is complete and when charger is disabled. Connect CHG to the desired logic voltage rail using a 1kΩ-100kΩ

resistor, or use with an LED for visual indication.

CHG

EN1

EN2

Input Current Limit Configuration Inputs. Use EN1 and EN2 control the maximum input current and enable USB compliance.

See Table 2 for the description of the operation states. EN1 and EN2 are internally pulled down with ≉285 kΩ. Do not leave

EN1 or EN2 unconnected to ensure proper operation.

Adjustable Current Limit Programming Input. Connect a 1100-Ω to 8-kΩ resistor from ILIM to VSS to program the maximum

input current (EN2=1, EN1=0). The input current includes the system load and the battery charge current. Leaving ILIM

unconnected disables all charging.

ILIM

Input Power Connection. Connect IN to the external DC supply (AC adapter or USB port). The input operating range is 4.35 V

to 6.6 V (bq24076 and bq24078). The input can accept voltages up to 26 V without damage but operation is suspended.

Connect bypass capacitor 1 μF to 10 μF to VSS.

Fast Charge Current Programming Input. Connect a 590-Ω to 8.9-kΩ resistor from ISET to VSS to program the fast charge

current level. Charging is disabled if ISET is left unconnected. While charging, the voltage at ISET reflects the actual charging

current and can be used to monitor charge current. See Charge Current Translator for more details.

ISET

I/O

System Supply Output. OUT provides a regulated output when the input is below the OVP threshold and above the regulation

voltage. When the input is out of the operation range, OUT is connected to V_BATexcept when SYSOFF is high. Connect OUT

to the system load. Bypass OUT to VSS with a 4.7-μF to 47-μF ceramic capacitor.

OUT

10, 11

Open-drain Power Good Status Indication Output. PGOOD pulls to VSS when a valid input source is detected. PGOOD is

high-impedance when the input power is not within specified limits. Connect PGOOD to the desired logic voltage rail using a

1-kΩ to 100-kΩ resistor, or use with an LED for visual indication.

PGOOD

SYSOFF

System Enable Input. Connect SYSOFF high to turn off the FET connecting the battery to the system output. When an

adapter is connected, charging is also disabled. Connect SYSOFF low for normal operation. SYSOFF is internally pulled up

to V_BATthrough a large resistor (approximately 5 MΩ). Do not leave SYSOFF unconnected to ensure proper operation.

There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad

must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the

primary ground input for the device. VSS pin must be connected to ground at all times.

Thermal

Pad

–

Timer Programming Input. TMR controls the pre-charge and fast-charge safety timers. Connect TMR to VSS to disable all

safety timers. Connect a 18-kΩ to 72-kΩ resistor between TMR and VSS to program the timers a desired length. Leave TMR

unconnected to set the timers to the default values.

TMR

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

Pin Functions (continued)

I/O

DESCRIPTION

NAME

NO.

External NTC Thermistor Input. Connect the TS input to the NTC thermistor in the battery pack. TS monitors a 10-kΩ NTC

thermistor. For applications that do not use the TS function, connect a 10-kΩ fixed resistor from TS to VSS to maintain a valid

voltage level on TS.

VSS

–

Ground. Connect to the thermal pad and to the ground rail of the circuit.

Table 1. EN1/EN2 Settings

EN2

EN1

MAXIMUM INPUT CURRENT INTO IN PIN

100 mA. USB100 mode

500 mA. USB500 mode

Set by an external resistor from ILIM to VSS

Standby (USB suspend mode)

8 Specifications

8.1 Absolute Maximum Ratings⁽¹⁾

over the 0°C to 125°C operating free-air temperature range (unless otherwise noted)

MIN

–0.3

MAX

UNIT

IN (with respect to VSS)

BAT (with respect to VSS)

V_I

Input Voltage

Input Current

OUT, EN1, EN2, CE, TS, ISET, PGOOD, CHG, ILIM,

TMR, ITERM, SYSOFF, TD (with respect to VSS)

–0.3

I_I

1.6

OUT

Output Current

(Continuous)

I_O

BAT (Discharge mode)

BAT (Charging mode)

1.5⁽²⁾

Output Sink Current CHG, PGOOD

Junction temperature

°C

T_J

–40

–65

150

T_stg

Storage temperature

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage

values are with respect to the network ground terminal unless otherwise noted.

(2) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces

charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge

current may not be reached.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

±1500

V_(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

C101⁽²⁾

±500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

8.3 Recommended Operating Conditions

MIN

4.35

MAX

UNIT

IN voltage range

V_I

6.4

IN operating voltage range

I_IN

Input current, IN pin

1.5

I_OUT

I_BAT

I_CHG

T_J

Current, OUT pin

4.5

Current, BAT pin (Discharging)

Current, BAT pin (Charging)

Junction Temperature

4.5

1.5⁽¹⁾

125

8000

8900

–40

1100

590

°C

Ω

R_ILIM

R_ISET

R_ITERM

R_TMR

Maximum input current programming resistor

(2)

Fast-charge current programming resistor

Ω

Termination current programming resistor

Timer programming resistor

kΩ

(1) The IC operational charging life is reduced to 20,000 hours, when charging at 1.5A and 125°C. The thermal regulation feature reduces

charge current if the IC’s junction temperature reaches 125°C; thus without a good thermal design the maximum programmed charge

current may not be reached.

(2) Use a 1% tolerance resistor for R_ISETto avoid issues with the R_ISETshort test when using the maximum charge current setting.

8.4 Thermal Information

bq2407x

THERMAL METRIC⁽¹⁾

RGT (VQFN)

16 PIN

44.5

UNIT

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

54.2

17.2

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

1.0

ψ_JB

17.1

R_θJC(bot)

3.8

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

8.5 Dissipation Ratings

POWER RATING

PACKAGE⁽¹⁾

R_θJA

R_θJC

T_A≤ 25°C

T_A= 85°C

(2)

RGT

39.47°C/W

2.4°C/W

2.3 W

225 mW

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is

connected to the ground plane by a 2 × 3 via matrix.

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

8.6 Electrical Characteristics

Over junction temperature range (0° ≤ T_J≤ 125°C) and the recommended supply voltage range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

INPUT

UVLO

V_hys

Undervoltage lock-out

V_IN: 0 V → 4 V

V_IN: 4 V → 0 V

3.2

3.3

3.4

Hysteresis on UVLO

200

300

Input power detected when V_IN> V_BAT+ V_IN(DT)

V_BAT= 3.6 V, VIN: 3.5 V → 4 V

V_IN(DT)

Input power detection threshold

Hysteresis on V_IN(DT)

130

V_hys

V_BAT= 3.6 V, V_IN: 4 V → 3.5 V

Time measured from V_IN: 0 V → 5 V 1 μs

rise-time to PGOOD = LO

t_DGL(PGOOD)

Deglitch time, input power detected status

1.2

V_OVP

Input overvoltage protection threshold

Hysteresis on OVP

V_IN: 5 V → 7 V

V_IN: 7 V → 5V

6.4

6.6

110

6.8

V_hys

μs

t_DGL(OVP)

Input overvoltage blanking time (OVP fault deglitch)

Time measured from V_IN: 11 V → 5 V with 1 μs

fall-time to PGOOD = LO

t_REC

Input overvoltage recovery time

1.2

ILIM, ISET SHORT-CIRCUIT DETECTION (CHECKED DURING STARTUP)

I_SC

Current source

V_IN> UVLO and V_IN> V_BAT+ V_IN(DT)

1.3

V_SC

520

QUIESCENT CURRENT

CE = LO or HI, input power not detected,

No load on OUT pin, T_J= 85°C

I_BAT(PDWN)

Sleep current into BAT pin

4.1

μA

EN1= HI, EN2=HI, V_IN= 6 V, T_J< 85°C

EN1= HI, EN2=HI, V_IN= 10 V, T_J< 85°C

I_IN

Standby current into IN pin

Active supply current, IN pin

200

CE = LO, V_IN= 6 V, no load on OUT pin,

V_BAT> V_BAT(REG), (EN1, EN2) ≠ (HI, HI)

I_CC

1.5

POWER PATH

V_DO(IN-OUT)

V_IN– V_OUT

V_IN= 4.3 V, I_IN= 1 A, V_BAT= 4.2 V

I_OUT= 1 A, V_IN= 0 V, V_BAT> 3 V

V_IN> V_OUT+ V_DO(IN-OUT), V_BAT< 3.2 V

300

475

100

V_DO(BAT-OUT)

V_BAT– V_OUT

3.31

3.41

3.51

V_O(REG)

OUT pin voltage regulation

Maximum input current

V_BAT

145mV

V_BAT

210mV

V_BAT

275mV

V_IN> V_OUT+ V_DO(IN-OUT), V_BAT≥ 3.2 V

EN1 = LO, EN2 = LO

475

100

500

I_INmax

EN1 = HI, EN2 = LO

450

EN2 = HI, EN1 = LO

K_ILIM/R_ILIM

1610

I_LIM= 500 mA to 1.5 A

1500

1330

200

1720

1500

K_ILIM

Maximum input current factor

AΩ

I_LIM= 200 mA to 500 mA

EN2 = HI, EN1 = LO, R_ILIM= 8 kΩ to 1.1 kΩ

1525

I_INmax

V_IN-DPM

Programmable input current limit range

Input voltage threshold when input current is

reduced

EN2 = LO, EN1 = X

4.35

4.5

4.63

Output voltage threshold when charging current is

reduced

V_BAT

125mV

V_BAT

100mV

V_BAT+

85mV

V_DPPM

_OUT≤ V_BAT

–40mV

V_BSUP1

Enter battery supplement mode

V_BAT= 3.6 V, R_ILIM= 1.5 kΩ, R_LOAD= 10 Ω → 2 Ω

V_OUT

V_BAT–20mV

≥

V_BSUP2

V_O(SC1)

V_O(SC2)

Exit battery supplement mode

V_BAT= 3.6 V, R_ILIM= 1.5 kΩ, R_LOAD= 2 Ω → 10 Ω

V_IN> V_UVLOand V_IN> V_BAT+ V_IN(DT)

Output short-circuit detection threshold, power-on

0.8

0.9

Output short-circuit detection threshold, supplement

mode V_BAT– V_OUT> V_O(SC2)indicates short-circuit

V_IN> V_UVLOand V_IN> V_BAT+ V_IN(DT)

200

250

300

t_DGL(SC2)

t_REC(SC2)

Deglitch time, supplement mode short circuit

Recovery time, supplement mode short circuit

250

μs

BATTERY CHARGER

I_BAT

Source current for BAT pin short-circuit detection

V_BAT= 1.5 V

1.6

7.5

1.8

4.4

4.35

V_BAT(SC)

BAT pin short-circuit detection threshold

V_BATrising

('76)

4.358

4.31

2.9

4.44

4.39

3.1

V_BAT(REG)

Battery charge voltage

('78)

V_LOWV

Pre-charge to fast-charge transition threshold

Deglitch time on pre-charge to fast-charge transition

Deglitch time on fast-charge to pre-charge transition

V_IN> V_UVLOand V_IN> V_BAT+ V_IN(DT)

t_DGL1(LOWV)

t_DGL2(LOWV)

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

Electrical Characteristics (continued)

Over junction temperature range (0° ≤ T_J≤ 125°C) and the recommended supply voltage range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

V_BAT(REG)> V_BAT> V_LOWV, V_IN= 5 V CE = LO,

EN1 = LO, EN2 = HI

Battery fast charge current range

100

1500

I_CHG

CE = LO, EN1= LO, EN2 = HI,

Battery fast charge current

V_BAT> V_LOWV, V_IN= 5 V, I_INmax > I_CHG, no load on OUT pin,

thermal loop and DPPM loop not active

K_ISET/R_ISET

K_ISET

Fast charge current factor

Pre-charge current

797

890

K_PRECHG/R_ISET

975

AΩ

I_PRECHG

K_PRECHG

Pre-charge current factor

118

AΩ

CE = LO, (EN1, EN2) ≠ (LO, LO),

0.09×I_CHG

0.1×I_CHG

0.11×I_CHG

V_BAT> V_RCH, t < t_MAXCH, V_IN= 5 V, DPPM loop and thermal

loop not active

Termination comparator detection threshold

(internally set)

I_TERM

CE = LO, (EN1, EN2) = (LO, LO),

0.027×I_CHG

0.033×I_CHG0.040×I_CHG

V_BAT> V_RCH, t < t_MAXCH, V_IN= 5 V, DPPM loop and thermal

loop not active

I_BIAS(ITERM)

t_DGL(TERM)

Current for external termination-setting resistor

Deglitch time, termination detected

V_IN> V_UVLOand V_IN> V_BAT+ V_IN(DT)

μA

V_BAT(REG)

–140mV

V_BAT(REG)

–100mV

V_BAT(REG)

–60mV

V_RCH

Recharge detection threshold

V_IN> V_UVLOand V_IN> V_BAT+ V_IN(DT)

t_DGL(RCH)

t_DGL(NO-IN)

Deglitch time, recharge threshold detected

Delay time, input power loss to OUT LDO turn-off

62.5

V_BAT= 3.6 V. Time measured from

V_IN: 5 V → 3 V 1 μs fall-time

I_BAT(DET)

t_DET

Sink current for battery detection

Battery detection timer

V_BAT= 2.5 V

7.5

BAT high or low

250

BATTERY CHARGING TIMERS

t_PRECHG

t_MAXCHG

t_PRECHG

t_MAXCHG

K_TMR

Pre-charge safety timer value

TMR = floating

1440

1800

18000

2160

Charge safety timer value

Pre-charge safety timer value

Charge safety timer value

Timer factor

TMR = floating

14400

21600

18 kΩ < R_TMR< 72 kΩ

R_TMR× K_TMR

10×R _TMR×K_TMR

s/kΩ

BATTERY-PACK NTC MONITOR⁽¹⁾

I_NTC

NTC bias current

V_IN> UVLO and V_IN> V_BAT+ V_IN(DT)

Battery charging, V_TSFalling

μA

V_HOT

High temperature trip point

Hysteresis on high trip point

Low temperature trip point

Hysteresis on low trip point

Deglitch time, pack temperature fault detection

TS function disable threshold

270

300

330

V_HYS(HOT)

V_COLD

Battery charging, V_TSRising from V_HOT

Battery charging, V_TSRising

2100

2000

2200

V_HYS(COLD)

t_DGL(TS)

V_DIS(TS)

Battery charging, V_TSFalling from V_COLD

TS fault detected to charger disable

TS unconnected

300

V_IN- 200mV

THERMAL REGULATION

T_J(REG)

Temperature regulation limit

125

155

°C

T_J(OFF)

Thermal shutdown temperature

Thermal shutdown hysteresis

T_JRising

T_J(OFF-HYS)

LOGIC LEVELS ON EN1, EN2, CE, SYSOFF, TD

V_IL

V_IH

I_IL

Logic LOW input voltage

Logic HIGH input voltage

Input sink current

0.4

1.4

V_IL= 0 V

μA

I_IH

Input source current

V_IH= 1.4 V

LOGIC LEVELS ON PGOOD, CHG

V_OLOutput LOW voltage

I_SINK= 5 mA

0.4

(1) These numbers set trip points of 0°C and 50°C while charging, with 3°C hysteresis on the trip points, with a Vishay Type 2 curve NTC

with an R25 of 10 kΩ.

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8.7 Typical Characteristics

V_IN= 6 V, EN1=1, EN2=0, bq24078 application circuit, T_A= 25°C, unless otherwise noted.

600

500

0.7

0.6

0.5

0.4

0.3

0.2

400

300

200

100

0.1

125

120

125

130

135

140

145

100

Temperature (^oC)

Junction Temperature (°C)

I_L= 1 A

Figure 2. Dropout Voltage vs Temperature

Figure 1. Thermal Regulation

4.6

4.4

4.2

120

100

VBAT = 3 V

3.8

VBAT = 3.9 V

3.6

3.4

3.2

4.5

2.5

3.5

125

100

V_BAT- Battery Voltage (V)

Junction Temperature (°C)

I_L= 1 A

V_IN= 5 V

Figure 3. Dropout Voltage vs Temperature

No Input Supply

Figure 4. bq24078

Output Regulation Voltage vs Battery Voltage

4.45

4.43

4.40

4.38

4.35

3.80

3.78

3.76

3.74

3.72

3.70

3.68

3.66

3.64

3.62

3.60

4.33

4.30

100

125

100

125

Junction Temperature (°C)

V_IN= 5 V, V_BAT= 3.5 V, I_L= 1 A

V_IN= 5 V, I_L= 1 A

Figure 5. bq24078

Output Regulation Voltage vs Temperature

Figure 6. bq24076

Output Regulation Voltage vs Temperature

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Typical Characteristics (continued)

V_IN= 6 V, EN1=1, EN2=0, bq24078 application circuit, T_A= 25°C, unless otherwise noted.

4.500

6.70

4.450

6.65

V_IRising

4.400

4.350

6.60

6.55

4.300

4.250

4.200

V_IFalling

6.50

6.45

100

125

Junction Temperature (°C)

6.6 V

Figure 7. bq24076

Figure 8. bq24076/78

BAT Regulation Voltage vs Temperature

Overvoltage Protection Threshold vs Temperature

1.05

1.03

310

305

300

295

290

1.01

0.99

0.97

285

280

0.95

3.6

V_BAT- Battery Voltage (V)

3.8

3.4

4.2

3.2

3.4

3.6

3.8

4.2

V_BAT- Battery Voltage (V)

R_ISET= 900 Ω

R_ISET= 3 kΩ

Figure 9. Fastcharge Current vs Battery Voltage

Figure 10. Fastcharge Current vs Battery Voltage

105

104

31.5

103

102

101

100

30.5

29.5

28.5

2.2

2.4

2.6

2.8

2.2

2.4

2.6

2.8

V_BAT- Battery Voltage (V)

R_ISET= 900 Ω

R_ISET= 3 kΩ

Figure 11. Precharge Current vs Battery Voltage

Figure 12. Precharge Current vs Battery Voltage

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9 Detailed Description

9.1 Overview

The bq2407x devices are integrated Li-Ion linear chargers and system power path management devices targeted

at space-limited portable applications. The device powers the system while simultaneously and independently

charging the battery. This feature reduces the number of charge and discharge cycles on the battery, allows for

proper charge termination and enables the system to run with a defective or absent battery pack. This feature

also allows instant system turn-on even with a totally discharged battery. The input power source for charging the

battery and running the system can be an AC adapter or a USB port. The devices feature Dynamic Power Path

Management (DPPM), which shares the source current between the system and battery charging, and

automatically reduces the charging current if the system load increases. When charging from a USB port, the

input dynamic power management (V_IN-DPM) circuit reduces the input current if the input voltage falls below a

threshold, thus preventing the USB port from crashing. The power-path architecture also permits the battery to

supplement the system current requirements when the adapter cannot deliver the peak system currents.

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9.2 Functional Block Diagram

250mV

V_BAT

V_O(SC1)

OUT-SC1

OUT-SC2

t_DGL(SC2)

OUT

ISET

EN2

Short Detect

225mV

Precharge

V_IN-LOW

2.25V

Fastcharge

USB100

USB500

T_J

ILIM

V_REF-ILIM

J(REG)

USB-susp

Short Detect

V_DPPM

V_OUT

V_O(REG)

EN2

EN1

V_BAT(REG)

BAT

V_BAT

V_OUT

40mV

CHARGEPUMP

SYSOFF

(bq24075

bq24079

bq24076

bq24078)

I_BIAS-ITERM

Supplement

V_LOWV

225mV

(’72, ’73, ’75)

ITERM

bq24074

V_RCH

V_BAT(SC)

~3V

I TERM-floating

V_IN

I_NTC

BAT-SC

V_BAT+ V

IN-DT

t_DGL(NO-IN)

V_HOT

t_DGL(TS)

t_DGL(PGOOD)

Charge Control

V_UVLO

V_OVP

V_COLD

t_BLK(OVP)

V_DIS(TS)

EN1

EN2

USB Suspend

(bq24072,

bq24073)

CHG

Halt timers

Reset timers

V_IPRECHG

V_ICHG

Dynamically

Controlled

Oscillator

PGOOD

V_ISET

Fast-Charge

Timer

Timer fault

TMR

Pre-Charge

Timer

~100mV

Timers disabled

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9.3 Feature Description

9.3.1 Undervoltage Lockout (UVLO)

The bq2407x family remains in power down mode when the input voltage at the IN pin is below the undervoltage

threshold (UVLO).

During the power down mode the host commands at the control inputs (CE, EN1 and EN2) are ignored. The Q1

FET connected between IN and OUT pins is off, and the status outputs CHG and PGOOD are high impedance.

The Q2 FET that connects BAT to OUT is ON. (If SYSOFF is high, Q2 is off). During power down mode, the

V_OUT(SC2)circuitry is active and monitors for overload conditions on OUT.

9.3.2 Power On

When V_INexceeds the UVLO threshold, the bq2407x powers up. While V_INis below V_BAT+ V_IN(DT), the host

commands at the control inputs (CE, EN1 and EN2) are ignored. The Q1 FET connected between IN and OUT

pins is off, and the status outputs CHG and PGOOD are high impedance. The Q2 FET that connects BAT to

OUT is ON. (If SYSOFF is high, Q2 is off). During this mode, the V_OUT(SC2)circuitry is active and monitors for

overload conditions on OUT.

Once V_INrises above V_BAT+ V_IN(DT), PGOOD is driven low to indicate the valid power status and the CE, EN1,

and EN2 inputs are read. The device enters standby mode if (EN1 = EN2 = HI) or if an input overvoltage

condition occurs. In standby mode, Q1 is OFF and Q2 is ON so OUT is connected to the battery input. (If

SYSOFF is high, FET Q2 is off). During this mode, the V_OUT(SC2)circuitry is active and monitors for overload

conditions on OUT.

When the input voltage at IN is within the valid range: V_IN> UVLO AND V_IN> V_BAT+ V_IN(DT)AND V_IN< V_OVP, and

the EN1 and EN2 pins indicate that the USB suspend mode is not enabled [(EN1, EN2) ≠ (HI, HI)] all internal

timers and other circuit blocks are activated. The device then checks for short-circuits at the ISET and ILIM pins.

If no short conditions exists, the device switches on the input FET Q1 with a 100mA current limit to checks for a

short circuit at OUT. When V_OUTis above V_O(SC1), the FET Q1 switches to the current limit threshold set by EN1,

EN2 and R_ILIMand the device enters into the normal operation. During normal operation, the system is powered

by the input source (Q1 is regulating), and the device continuously monitors the status of CE, EN1 and EN2 as

well as the input voltage conditions.

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Feature Description (continued)

PGOOD = Hi-Z

CHG = Hi-Z

BATTFET ON

UVLO<V_IN<V_OVP

and

V_IN>V_BAT+V_IN(DT)

Yes

PGOOD = Low

Yes

EN1=EN2=1

ILIM or ISET short?

Begin Startup

I_IN(MAX)100mA

Yes

V_OUTshort?

Input Current

Limit set by EN1

and EN2

CE = Low

Yes

Begin Charging

Figure 13. Startup Flow Diagram

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Feature Description (continued)

9.3.3 Overvoltage Protection (OVP)

The bq2407x accepts inputs up to 28 V without damage. Additionally, an overvoltage protection (OVP) circuit is

implemented that shuts off the internal LDO and discontinues charging when V_IN> V_OVPfor a period long than

t_DGL(OVP). When in OVP, the system output (OUT) is connected to the battery and PGOOD is high impedance.

Once the OVP condition is removed, a new power on sequence starts (see Power On). The safety timers are

reset and a new charge cycle will be indicated by the CHG output.

9.3.4 Dynamic Power-Path Management

The bq2407x features an OUT output that powers the external load connected to the battery. This output is

active whenever a source is connected to IN or BAT. The following sections discuss the behavior of OUT with a

source connected to IN to charge the battery and a battery source only.

9.3.4.1 Input Source Connected (ADAPTER or USB)

With a source connected, the dynamic power-path management (DPPM) circuitry of the bq2407x monitors the

input current continuously. For the bq24076/78, OUT is regulated to 210 mV above the voltage at BAT. When the

BAT voltage falls below 3.2 V, OUT is clamped to 3.41 V. This allows for proper startup of the system load even

with a discharged battery. The current into IN is shared between charging the battery and powering the system

load at OUT. The bq2407x has internal selectable current limits of 100 mA (USB100) and 500 mA (USB500) for

charging from USB ports, as well as a resistor-programmable input current limit.

The bq2407x is USB IF compliant for the inrush current testing. The USB specification allows up to 10 μF to be

hard started, which establishes 50 μC as the maximum inrush charge value when exceeding 100 mA. The input

current limit for the bq2407x prevents the input current from exceeding this limit, even with system capacitances

greater than 10 μF. The input capacitance to the device must be selected small enough to prevent a violation

(<10 μF), as this current is not limited. Figure 14 demonstrates the start-up of the bq2407x and compares it to

the USB-IF specification.

10μC

50μC

100 μs/div

Figure 14. USB-IF Inrush Current Test

The input current limit selection is controlled by the state of the EN1 and EN2 pins as shown in the EN1/EN2

Settings table in Pin Configuration and Functions. When using the resistor-programmable current limit, the input

current limit is set by the value of the resistor connected from the ILIM pin to VSS, and is given by the equation:

I_IN-MAX= K_ILIM/R_ILIM

(1)

The input current limit is adjustable up to 1.5 A. The valid resistor range is 1.1 kΩ to 8 kΩ.

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Feature Description (continued)

When the IN source is connected, priority is given to the system load. The DPPM and Battery Supplement

modes are used to maintain the system load. Figure 16 illustrates examples of the DPPM and supplement

modes. These modes are explained in detail in the following sections.

9.3.4.1.1 Input DPM Mode (V_IN-DPM)

The bq2407x utilizes the V_IN-DPM mode for operation from current-limited USB ports. When EN1 and EN2 are

configured for USB100 (EN2=0, EN1=0) or USB500 (EN2=0, EN1=1) modes, the input voltage is monitored. If

V_INfalls to V_IN-DPM, the input current limit is reduced to prevent the input voltage from falling further. This prevents

the bq2407x from crashing poorly designed or incorrectly configured USB sources. Figure 15 shows the V_IN-DPM

behavior to a current limited source. In this figure, the input source has a 400-mA current limit and the device is

in USB500 mode (EN1=1, EN2=0).

OUT

200mA/div

Input collapses

(5V)

500mV/div

Input regulated to V

IN_DPM

USB500 Current Limit

200mA/div

Input current limit is

reduced to prevent

crashing the supply

BAT

4 ms/div

Figure 15. V_IN-DPM Waveform

9.3.4.1.2 DPPM Mode

When the sum of the charging and system load currents exceeds the maximum input current (programmed with

EN1, EN2, and ILIM pins), the voltage at OUT decreases. Once the voltage on the OUT pin falls to V_DPPM, the

bq2407x enters DPPM mode. In this mode, the charging current is reduced as the OUT current increases in

order to maintain the system output. Battery termination is disabled while in DPPM mode.

9.3.4.1.3 Battery Supplement Mode

While in DPPM mode, if the charging current falls to zero and the system load current increases beyond the

programmed input current limit, the voltage at OUT reduces further. When the OUT voltage drops below the

V_BSUP1threshold, the battery supplements the system load. The battery stops supplementing the system load

when the voltage at OUT rises above the V_BSUP2threshold.

During supplement mode, the battery supplement current is not regulated (BAT-FET is fully on), however there is

a short circuit protection circuit built in. Figure 31 demonstrates supplement mode. If during battery supplement

mode, the voltage at OUT drops V_O(SC2)below the BAT voltage, the OUT output is turned off if the overload

exists after t_DGL(SC2). The short circuit recovery timer then starts counting. After t_REC(SC2), OUT turns on and

attempts to restart. If the short circuit remains, OUT is turned off and the counter restarts. Battery termination is

disabled while in supplement mode.

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Feature Description (continued)

1200 mA

900 mA

400 mA

0 mA

900 mA

500 mA

0 mA

500 mA

0 mA

-300 mA

3.8 V

3.7 V

~3.6 V

DPPM Loop Active

Supplement Mode

Figure 16. bq24076/78 DPPM and Battery Supplement Modes (V_OREG= V_BAT+ 210 mV, V_BAT= 3.6 V)

9.3.4.2 Input Source Not Connected

When no source is connected to the IN input, OUT is powered strictly from the battery. During this mode the

current into OUT is not regulated, similar to Battery Supplement Mode, however the short circuit circuitry is

active. If the OUT voltage falls below the BAT voltage by 250 mV for longer than t_DGL(SC2), OUT is turned off. The

short circuit recovery timer then starts counting. After t_REC(SC2), OUT turns on and attempts to restart. If the short

circuit remains, OUT is turned off and the counter restarts. This ON/OFF cycle continues until the overload

condition is removed.

9.3.5 Battery Charging

Set CE low to initiate battery charging. First, the device checks for a short-circuit on the BAT pin by sourcing

I_BAT(SC)to the battery and monitoring the voltage. When the BAT voltage exceeds V_BAT(SC), the battery charging

continues. The battery is charged in three phases: conditioning pre-charge, constant current fast charge (current

regulation) and a constant voltage tapering (voltage regulation). In all charge phases, an internal control loop

monitors the IC junction temperature and reduces the charge current if an internal temperature threshold is

exceeded.

Figure 17 illustrates a normal Li-Ion charge cycle using the bq2407x:

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Feature Description (continued)

PRECHARGE

CC FAST CHARGE

CV TAPER

DONE

BAT(REG)

O(CHG)

Battery Current

Battery Voltage

LOWV

CHG = Hi-z

(PRECHG)

(TERM)

Figure 17. Typical Charge Cycle

In the pre-charge phase, the battery is charged at with the pre-charge current (I_PRECHG). Once the battery voltage

crosses the V_LOWVthreshold, the battery is charged with the fast-charge current (I_CHG). As the battery voltage

reaches V_BAT(REG), the battery is held at a constant voltage of V_BAT(REG)and the charge current tapers off as the

battery approaches full charge. When the battery current reaches I_TERM, the CHG pin indicates charging done by

going high-impedance.

Note that termination detection is disabled whenever the charge rate is reduced because of the actions of the

thermal loop, the DPPM loop or the V_IN(LOW)loop.

The value of the fast-charge current is set by the resistor connected from the ISET pin to VSS, and is given by

the equation:

I_CHG= K_ISET/R_ISET

(2)

The charge current limit is adjustable up to 1.5 A. The valid resistor range is 590 Ω to 5.9 kΩ. If I_CHGis

programmed as greater than the input current limit, the battery will not charge at the rate of I_CHG, but at the

slower rate of I_IN(MAX)(minus the load current on the OUT pin, if any). In this case, the charger timers will be

proportionately slowed down.

9.3.5.1 Charge Current Translator

When the charger is enabled, internal circuits generate a current proportional to the charge current at the ISET

input. The current out of ISET is 1/400 (±10%) of the charge current. This current, when applied to the external

charge current programming resistor, R_ISET, generates an analog voltage that can be monitored by an external

host to calculate the current sourced from BAT.

V_ISET= I_CHARGE/ 400 × R_ISET

(3)

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Feature Description (continued)

Begin Charging

Yes

Battery short detected?

Start Precharge

CHG = Low

t_PRECHARGE

Elapsed?

V_BAT> V_LOWV

Yes

End Charge

Flash CHG

Start Fastcharge

I_CHARGEset by ISET

t_FASTCHARGE

Elapsed?

I_BAT< I_TERM

Yes

End Charge

Flash CHG

Charge Done

CHG = Hi-Z

TD = Low

(’72, ’73 Only)

(’74, ’75 = YES)

Yes

Termination Reached

BATTFET Off

Wait for V_BAT< V_RCH

V_BAT< V_RCH

Yes

Run Battery Detection

Battery Detected?

Yes

Figure 18. Battery Charging Flow Diagram

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Feature Description (continued)

9.3.5.2 Battery Detection and Recharge

The bq2407x automatically detects if a battery is connected or removed. Once a charge cycle is complete, the

battery voltage is monitored. When the battery voltage falls below V_RCH, the battery detection routine is run.

During battery detection, current (I_BAT(DET)) is pulled from the battery for a duration t_DETto see if the voltage on

BAT falls below V_LOWV. If not, charging begins. If it does, then it indicates that the battery is missing or the

protector is open. Next, the precharge current is applied for t_DETto close the protector if possible. If V_BAT< V_RCH

then the protector closed and charging is initiated. If V_BAT> V_RCH, then the battery is determined to be missing

and the detection routine continues.

9.3.5.3 Battery Disconnect (SYSOFF Input, bq24076, bq24078)

The bq24076 and bq24078 feature a SYSOFF input that allows the user to turn the FET Q2 off and disconnect

the battery from the OUT pin. This is useful for disconnecting the system load from the battery, factory

programming where the battery is not installed or for host side impedance track fuel gauging, such as bq27500,

where the battery open circuit voltage level must be detected before the battery charges or discharges. The

/CHG output remains low when SYSOFF is high. Connect SYSOFF to VSS, to turn Q2 on for normal operation.

SYSOFF is internally pulled to VBAT through ~5 MΩ resistor.

9.3.5.4 Dynamic Charge Timers (TMR Input)

The bq2407x devices contain internal safety timers for the pre-charge and fast-charge phases to prevent

potential damage to the battery and the system. The timers begin at the start of the respective charge cycles.

The timer values are programmed by connecting a resistor from TMR to VSS. The resistor value is calculated

using the following equation:

t_PRECHG= K_TMR× R_TMR

(4)

(5)

t_MAXCHG= 10 × K_TMR× R_TMR

Leave TMR unconnected to select the internal default timers. Disable the timers by connecting TMR to VSS.

Reset the timers by toggling the CE pin, or by toggling EN1, EN2 pin to put the device in and out of USB

suspend mode (EN1 = HI, EN2 = HI).

Note that timers are suspended when the device is in thermal shutdown, and the timers are slowed proportionally

to the charge current when the device enters thermal regulation.

During the fast charge phase, several events increase the timer durations.

•

The system load current activates the DPPM loop which reduces the available charging current

The input current is reduced because the input voltage has fallen to V_IN(LOW)

The device has entered thermal regulation because the IC junction temperature has exceeded T_J(REG)

During each of these events, the internal timers are slowed down proportionately to the reduction in charging

current. For example, if the charging current is reduced by half for two minutes, the timer clock is reduced to half

the frequency and the counter counts half as fast resulting in only one minute of "counting" time.

If the pre charge timer expires before the battery voltage reaches V_LOWV, the bq2407x indicates a fault condition.

Additionally, if the battery current does not fall to I_TERMbefore the fast charge timer expires, a fault is indicated.

The CHG output flashes at approximately 2 Hz to indicate a fault condition. The fault condition is cleared by

toggling CE or the input power, entering/ exiting USB suspend mode, or an OVP event.

9.3.5.5 Status Indicators (PGOOD, CHG)

The bq2407x contains two open-drain outputs that signal its status. The PGOOD output signals when a valid

input source is connected. PGOOD is low when (V_BAT+ V_IN(DT)) < V_IN< V_OVP. When the input voltage is outside

of this range, PGOOD is high impedance.

The charge cycle after power-up, CE going low, or exiting OVP is indicated with the CHG pin on (low - LED on),

whereas all refresh (subsequent) charges will result in the CHG pin off (open - LED off). In addition, the CHG

signals timer faults by flashing at approximately 2 Hz.

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Table 2. PGOOD Status Indicator

INPUT STATE

V_IN< V_UVLO

PGOOD OUTPUT

High-impedance

Low

V_UVLO< V_IN< V_BAT+ V_IN(DT)

V_BAT+ V_IN(DT)< V_IN< V_OVP

V_IN> V_OVP

High-impedance

Table 3. CHG Status Indicator

CHARGE STATE

Charging

CHG OUTPUT

Low (for first charge cycle)

Flashing at 2 Hz

Charging suspended by thermal loop

Safety timers expired

Charging done

Recharging after termination

IC disabled or no valid input power

Battery absent

High-impedance

9.3.5.6 Thermal Regulation and Thermal Shutdown

The bq2407x contain a thermal regulation loop that monitors the die temperature. If the temperature exceeds

T_J(REG), the device automatically reduces the charging current to prevent the die temperature from increasing

further. In some cases, the die temperature continues to rise despite the operation of the thermal loop,

particularly under high VIN and heavy OUT system load conditions. Under these conditions, if the die

temperature increases to T_J(OFF), the input FET Q1 is turned OFF. FET Q2 is turned ON to ensure that the

battery still powers the load on OUT. Once the device die temperature cools by T_J(OFF-HYS), the input FET Q1 is

turned on and the device returns to thermal regulation. Continuous overtemperature conditions result in a

"hiccup" mode. During thermal regulation, the safety timers are slowed down proportionately to the reduction in

current limit.

Note that this feature monitors the die temperature of the bq2407x. This is not synonymous with ambient

temperature. Self heating exists due to the power dissipated in the IC because of the linear nature of the battery

charging algorithm and the LDO associated with OUT. A modified charge cycle with the thermal loop active is

shown in Figure 19. Battery termination is disabled during thermal regulation.

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

PRECHARGE

THERMAL

REGULATION

CC FAST

CHARGE

CV TAPER

DONE

O(REG)

O(CHG)

Battery Voltage

Battery Current

(LOWV)

HI-z

(PRECHG)

(TERM)

J(REG)

IC Junction Temperature, T

Figure 19. Charge Cycle Modified by Thermal Loop

9.3.6 Battery Pack Temperature Monitoring

The bq2407x features an external battery pack temperature monitoring input. The TS input connects to the NTC

thermistor in the battery pack to monitor battery temperature and prevent dangerous over-temperature

conditions. During charging, I_NTCis sourced to TS and the voltage at TS is continuously monitored. If, at any

time, the voltage at TS is outside of the operating range (V_COLDto V_HOT), charging is suspended. The timers

maintain their values but suspend counting. When the voltage measured at TS returns to within the operation

window, charging is resumed and the timers continue counting. When charging is suspended due to a battery

pack temperature fault, the CHG pin remains low and continues to indicate charging.

For applications that do not require the TS monitoring function, connect a 10-kΩ resistor from TS to VSS to set

the TS voltage at a valid level and maintain charging.

The allowed temperature range for 103AT-2 type thermistor is 0°C to 50°C. However, the user may increase the

range by adding two external resistors. See Figure 20 for the circuit details. The values for Rs and Rp are

calculated using the following equations:

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

V_H´ V_C

-(R_TH+ R_TC) ±

(R_TH+R_TC)²- 4 R

´ R_TC

´(R_TC- R_TH)

(V_H- V_C) ´ I_TS

Rs =

(6)

V ´ R + R_S

(

)

I_TS´ R + R_S- V

Rp =

(

)

where

•

R_TH: Thermistor Hot Trip Value found in thermistor data sheet

R_TC: Thermistor Cold Trip Value found in thermistor data sheet

V_H: IC's Hot Trip Threshold = 0.3 V nominal

V_C: IC's Cold Trip Threshold = 2.1 V nominal

I_TS: IC's Output Current Bias = 75 µA nominal

NTC Thermsitor Semitec 103AT-4

(7)

Rs and Rp 1% values were chosen closest to calculated values in Table 4.

Table 4. Calculated Values

COLD TEMP RESISTANCE

HOT TEMP RESISTANCE AND

EXTERNAL BIAS RESISTOR,

AND TRIP THRESHOLD, Ω (°C)

TRIP THRESHOLD, Ω (°C)

Rs (Ω)

Rp (Ω)

28000 (–0.6)

28480 (–1)

33890 (–5)

4000 (51)

3536 (55)

3021 (60)

4026 (51)

3536 (55)

3021 (60)

∞

487

845000

549000

158000

150000

140000

1000

76.8

576

1100

RHOT and RCOLD are the thermistor resistance at the desired hot and cold temperatures, respectively. The

temperature window cannot be tightened more than using only the thermistor connected to TS, it can only be

extended.

I_NTC

bq2407x

R_S

PACK+

TEMP

V_COLD

R_P

PACK-

V_HOT

Figure 20. Extended TS Pin Thresholds

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

9.4 Device Functional Modes

9.4.1 Sleep Mode

When the input is between UVLO and V_IN(DT), the device enters sleep mode. After entering sleep mode for >20

mS the internal FET connection between the IN and OUT pin is disabled and pulling the input to ground will not

discharge the battery, other than the leakage on the BAT pin. If one has a full 1000-mAHr battery and the

leakage is 10 μA, then it would take 1000 mAHr / 10 μA = 100000 hours (11.4 years) to discharge the battery.

The self-discharge of the battery is typically five times higher than this.

9.4.2 Explanation of Deglitch Times and Comparator Hysteresis

NOTE

Figure 21 to Figure 25 are not to scale.

OVP

- V

hys(OVP)

OVP

Typical Input Voltage

Operating Range

t < t

DGL(OVP)

+ V

IN(DT)

BAT

+ V

- V

IN(DT) hys(INDT)

BAT

UVLO

UVLO - V

hys(UVLO)

PGOOD

DGL(PGOOD)

DGL(OVP)

DGL(NO-IN)

DGL(PGOOD)

Figure 21. Power-Up, Power-Down, Power Good Indication

DGL1(LOWV)

BAT

LOWV

t < t

DGL2(LOWV)

t < t

DGL1(LOWV)

DGL2(LOWV)

CHG

Fast-Charge

Pre-Charge

PRE-CHG

Pre-Charge

Figure 22. Precharge to Fast-Charge, Fast- to Pre-Charge Transition – t_DGL1(LOWV), t_DGL2(LOWV)

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

Device Functional Modes (continued)

BAT

RCH

Re-Charge

t < t

DGL(RCH)

Figure 23. Recharge – t_DGL(RCH)

Turn

Q2 OFF

Force

Q2 ON

Force

Q2 ON

Turn

Q2 OFF

REC(SC2)

- V

OUT

BAT

Recover

O(SC2)

t < t

DGL(SC2)

Figure 24. OUT Short-Circuit – Supplement Mode

COLD

- V

hys(COLD)

COLD

Suspend

Charging

Resume

Charging

t < t

DGL(TS)

- V

hys(HOT)

HOT

Figure 25. Battery Pack Temperature Sensing – TS Pin. Battery Temperature Increasing

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

10 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

10.1 Application Information

The bq2407x devices power the system while simultaneously and independently charging the battery. The input

power source for charging the battery and running the system can be an AC adapter or a USB port. The devices

feature dynamic power-path management (DPPM), which shares the source current between the system and

battery charging and automatically reduces the charging current if the system load increases. When charging

from a USB port, the input dynamic power management (VIN-DPM) circuit reduces the input current limit if the

input voltage falls below a threshold, preventing the USB port from crashing. The power-path architecture also

permits the battery to supplement the system current requirements when the adapter cannot deliver the peak

system currents.

The bq2407x is configurable to be host controlled for selecting different input current limits based on the input

source connected, or a fully stand alone device for applications that do not support multiple types of input

sources.

10.2 Typical Application

V_IN= UVLO to V_OVP, I_FASTCHG= 800 mA, I_IN(MAX)= 1.3 A, Battery Temperature Charge Range = 0°C to 50°C,

6.25-hour Fastcharge Safety Timer

1.5 kW

SYSTEM

Adaptor

DC+

OUT

4.7 mF

1 mF

GND

VSS

bq24076

bq24078

HOST

EN2

EN1

SYSOFF

BAT

4.7 mF

PACK+

TEMP

46.4 kW

1.18 kW

1.13 kW

PACK-

Figure 26. Using bq24076/bq24078 in a Host-Controlled Charger Application

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

Typical Application (continued)

10.2.1 Design Requirements

•

Supply voltage = 5 V

Fast charge current of approximately 800 mA; ISET - pin 16

Input current limit = 1.3 A; ILIM - pin 12

Termination current threshold = 110 mA; ITERM – pin 15 (bq24074 only)

Safety timer duration, Fast-Charge = 6.25 hours; TMR – pin 14

TS – Battery Temperature Sense = 10 kΩ NTC (103AT-2)

10.2.2 Detailed Design Procedure

10.2.2.1 bq2407x Charger Design Example

See Figure 26 for a schematic of the design example.

10.2.2.1.1 System ON/OFF (SYSOFF) (bq24076 or bq24078 only)

Connect SYSOFF high to disconnect the battery from the system load. Connect SYSOFF low for normal

operation

10.2.2.2 Calculations

10.2.2.2.1 Program the Fast Charge Current (ISET):

R_ISET= K_ISET/ I_CHG

K_ISET= 890 AΩ from the electrical characteristics table.

R_ISET= 890 AΩ / 0.8 A = 1.1125 kΩ

Select the closest standard value, which for this case is 1.13 kΩ. Connect this resistor between ISET (pin 16)

and V_SS

10.2.2.2.2 Program the Input Current Limit (ILIM)

R_ILIM= K_ILIM/ I_{I_MAX}

K_ILIM= 1550 AΩ from the electrical characteristics table.

R_ISET= 1550 AΩ / 1.3 A = 1.192 kΩ

Select the closest standard value, which for this case is 1.18 kΩ. Connect this resistor between ILIM (pin 12) and

V_SS

10.2.2.2.3 Program 6.25-hour Fast-Charge Safety Timer (TMR)

R_TMR= t_MAXCHG/ (10 × K_TMR

)

K_TMR= 48 s/kΩ from the electrical characteristics table.

R_TMR= (6.25 hr × 3600 s/hr) / (10 × 48 s/kΩ) = 46.8 kΩ

Select the closest standard value, which for this case is 46.4 kΩ. Connect this resistor between TMR (pin 2) and

V_SS

10.2.2.3 TS Function

Use a 10-kΩ NTC thermistor in the battery pack (103AT-2). For applications that do not require the TS

monitoring function, connect a 10-kΩ resistor from TS to VSS to set the TS voltage at a valid level and maintain

charging.

10.2.2.4 CHG and PGOOD

LED Status: Connect a 1.5-kΩ resistor in series with a LED between OUT and CHG to indicate charging status.

Connect a 1.5-kΩ resistor in series with a LED between OUT and PGOOD to indicate when a valid input source

is connected.

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

Typical Application (continued)

Processor Monitoring Status: Connect a pullup resistor (on the order of 100 kΩ) between the power rail of the

processor and CHG and PGOOD.

10.2.2.5 Selecting IN, OUT, and BAT Pin Capacitors

In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin,

input, output and battery pins. Using the values shown on the application diagram, is recommended. After

evaluation of these voltage signals with real system operational conditions, one can determine if capacitance

values can be adjusted toward the minimum recommended values (DC load application) or higher values for fast

high amplitude pulsed load applications. Note if designed high input voltage sources (bad adaptors or wrong

adaptors), the capacitor needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values

so a 16-V capacitor may be adequate for a 30-V transient (verify tested rating with capacitor manufacturer).

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

Typical Application (continued)

10.2.3 Application Curves

V_IN

5 V/div

V_CHG

5 V/div

Charging Initiated

V_OUT

4.4 V

1 A/div

500 mV/div

5 V/div

V_BAT

I_BAT

3.6 V

V_PGOOD

2 V/div

V_BAT

Battery Inserted

500 mA/div

I_BAT

Battery Detection Mode

4 ms/div

400 ms/div

R_LOAD= 10 Ω

Figure 27. Adapter Plug-In

Battery Connected

Figure 28. Battery Detection

Battery Inserted

V_CHG

5 V/div

1 A/div

I_OUT

500 mA/div

I_BAT

500 mA/div

200 mV/div

V_OUT

4.4 V

2 V/div

Battery

Removed

V_BAT

Battery Detection Mode

400 ms/div

R_LOAD= 20 Ω to 9 Ω

Figure 30. Entering and Exiting DPPM Mode

Figure 29. Battery Detection

Battery Removed

1 A/div

I_OUT

1 A/div

I_BAT

500 mA/div

I_BAT

500 mA/div

Supplement Mode

V_OUT

3.81 V

200 mV/div

V_OUT

4.4 V

V_BAT

3.8 V

V_BAT

500 mV/div

3.6 V

Tracking to V_BAT+210 mV

1 ms/div

R_LOAD= 25 Ω to 4.5 Ω

R_LOAD= 20 Ω to 4.5 Ω

Figure 31. Entering and Exiting Battery Supplement Mode

Figure 32. Entering and Exiting Battery Supplement Mode

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

Typical Application (continued)

V_CE

5 V/div

10 V/div

V_IN

V_CHG

5 V/div

1 V/div

V_OUT

4.4 V

V_BAT

500 mV/div

4.2 V

3.6 V

Mandatory Precharge

I_BAT

500 mA/div

1 A/div

10 ms/div

40 ms/div

R_LOAD= 10 Ω

V_IN= 6 V to 15 V

Figure 33. Charger ON/OFF Using CE

Figure 34. OVP Fault

V_SYSOFF

5 V/div

V_SYSOFF

V_BAT

4 V

V_OUT

5.5 V

2 V/div

V_BAT

4 V

2 V/div

V_OUT

Battery Powering

System

500 mA/div

System Power Off

I_BAT

500 mA/div

4 ms/div

400 ms/div

V_IN= 0 V

V_IN= 6 V

Figure 36. System ON/OFF With Input Not Connected

bq24076, bq24078

Figure 35. System ON/OFF With Input Connected

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

11 Power Supply Recommendations

Some adapters implement a half rectifier topology, which causes the adapter output voltage to fall below the

battery voltage during part of the cycle. To enable operation with adapters under those conditions, the bq2407x

family keeps the charger on for at least 20 msec (typical) after the input power puts the part in sleep mode. This

feature enables use of external adapters using 50 Hz networks. The input must not drop below the UVLO voltage

for the charger to work properly. Thus, the battery voltage should be above the UVLO to help prevent the input

from dropping out. Additional input capacitance may be needed.

12 Layout

12.1 Layout Guidelines

•

To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter

capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq2407x, with short

trace runs to both IN, OUT and GND (thermal pad).

•

All low-current GND connections should be kept separate from the high-current charge or discharge paths

from the battery. Use a single-point ground technique incorporating both the small signal ground path and the

power ground path.

•

The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum

charge current in order to avoid voltage drops in these traces

The bq2407x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad

to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is

also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full

PCB design guidelines for this package are provided in QFN/SON PCB Attachment Application Note

(SLUA271).

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

12.2 Layout Example

Figure 37. Layout Schematic

bq24076, bq24078

www.ti.com.cn

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

12.3 Thermal Considerations

The bq24076/78 family is packaged in a thermally enhanced MLP package. The package includes a thermal pad

to provide an effective thermal contact between the IC and the printed circuit board (PCB). The power pad

should be directly connected to the V_SSpin. Full PCB design guidelines for this package are provided in

QFN/SON PCB Attachment Application Note (SLUA271). The most common measure of package thermal

performance is thermal impedance (θ_JA) measured (or modeled) from the chip junction to the air surrounding the

package surface (ambient). The mathematical expression for θ_JAis:

θ_JA= (T_J- T) / P

where

•

T_J= chip junction temperature

T = ambient temperature

P = device power dissipation

(8)

Factors that can influence the measurement and calculation of θ_JAinclude:

•

Whether or not the device is board mounted

Trace size, composition, thickness, and geometry

Orientation of the device (horizontal or vertical)

Volume of the ambient air surrounding the device under test and airflow

Whether other surfaces are in close proximity to the device being tested

Due to the charge profile of Li-Ion batteries the maximum power dissipation is typically seen at the beginning of

the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack voltage

increases to ≉3.4 V within the first 2 minutes. The thermal time constant of the assembly typically takes a few

minutes to heat up so when doing maximum power dissipation calculations, 3.4 V is a good minimum voltage to

use. This is verified, with the system and a fully discharged battery, by plotting temperature on the bottom of the

PCB under the IC (pad should have multiple vias), the charge current and the battery voltage as a function of

time. The fast charge current will start to taper off if the part goes into thermal regulation.

The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal

PowerFET. It can be calculated from the following equation when a battery pack is being charged :

P = [V_(IN)– V_(OUT)] × I_(OUT)+ [V_(OUT)– V_(BAT)] × I_(BAT)

(9)

The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is

recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage

and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or

higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop

is always active.

bq24076, bq24078

ZHCSGY5A –OCTOBER 2017–REVISED DECEMBER 2017

www.ti.com.cn

13 器件和文档支持

13.1 器件支持

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 相关链接

下面的表格列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件，以及申请样片或购买产品的

快速链接。

表 5. 相关链接

器件

产品文件夹

请单击此处

立即订购

请单击此处

技术文档

请单击此处

工具和软件

请单击此处

支持和社区

请单击此处

bq24076

bq24078

13.3 接收文档更新通知

要接收文档更新通知，请导航至 TI.com 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品

信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

13.4 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，

并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。

TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在

e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。

设计支持

TI 参考设计支持可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

13.5 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.6 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

14 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知和修

订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

BQ24076RGTR

BQ24076RGTT

BQ24078RGTR

BQ24078RGTT

ACTIVE

VQFN

RGT

3000 RoHS & Green

250 RoHS & Green

3000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 85

B24076

NIPDAU

B24076

B24078

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Apr-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

BQ24076RGTR

BQ24076RGTT

BQ24078RGTR

BQ24078RGTT

VQFN

RGT

3000

250

330.0

180.0

330.0

180.0

12.4

12.5

12.4

12.5

3.3

1.1

8.0

12.0

3000

250

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Apr-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

BQ24076RGTR

BQ24076RGTT

BQ24078RGTR

BQ24078RGTT

VQFN

RGT

3000

250

338.0

205.0

338.0

205.0

355.0

200.0

355.0

200.0

50.0

33.0

50.0

33.0

3000

250

Pack Materials-Page 2

PACKAGE OUTLINE

RGT0016C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

3.1

2.9

PIN 1 INDEX AREA

3.1

2.9

SIDE WALL

METAL THICKNESS

DIM A

OPTION 1

0.1

OPTION 2

0.2

1.0

0.8

SEATING PLANE

0.08

0.05

0.00

1.68 0.07

(DIM A) TYP

EXPOSED

THERMAL PAD

12X 0.5

SYMM

1.5

0.30

16X

0.18

0.1

C A B

PIN 1 ID

(OPTIONAL)

SYMM

0.05

0.5

0.3

16X

4222419/D 04/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

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EXAMPLE BOARD LAYOUT

RGT0016C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

1.68)

SYMM

16X (0.6)

16X (0.24)

SYMM

(2.8)

(0.58)

TYP

12X (0.5)

(

0.2) TYP

VIA

(0.58) TYP

(R0.05)

ALL PAD CORNERS

(2.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED

METAL

EXPOSED

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4222419/D 04/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGN

RGT0016C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

1.55)

16X (0.6)

16X (0.24)

SYMM

(2.8)

12X (0.5)

METAL

ALL AROUND

SYMM

(2.8)

(R0.05) TYP

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 17:

85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:25X

4222419/D 04/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

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邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

BQ24078RGTT [TI]

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