BQ24092 [TI]

1A, Single-Input, Single Cell Li-Ion Battery Charger; 1A ,单输入,单节锂离子电池充电器
BQ24092
型号: BQ24092
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1A, Single-Input, Single Cell Li-Ion Battery Charger
1A ,单输入,单节锂离子电池充电器

电池
文件: 总31页 (文件大小:1071K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
1A, Single-Input, Single Cell Li-Ion Battery Charger  
Check for Samples: bq24090, bq24091  
1
FEATURES  
Available in Small 10-Pin MSOP Package  
CHARGING  
APPLICATIONS  
1% Charge Voltage Accuracy  
Smart Phones  
PDAs  
MP3 Players  
Low-Power Handheld Devices  
10% Charge Current Accuracy  
Pin Selectable USB 100mA and 500mA  
Maximum Input Current Limit  
Programmable Termination and Precharge  
Threshold  
DESCRIPTION  
PROTECTION  
The bq2409x series of devices are highly integrated  
Li-ion linear chargers devices targeted at  
space-limited portable applications. The devices  
operate from either a USB port or AC adapter. The  
high input voltage range with input overvoltage  
protection supports low-cost unregulated adapters.  
6.6V Over-Voltage Protection  
Input Voltage Dynamic Power Management  
125°C Thermal Regulation; 150°C Thermal  
Shutdown Protection  
OUT Short-Circuit Protection and ISET  
Short Detection  
The bq2409x has a single power output that charges  
the battery. A system load can be placed in parallel  
with the battery as long as the average system load  
does not keep the battery from charging fully during  
the 10 hour safety timer.  
Operation Over JEITA Range via Battery  
NTC – 1/2 Fast-Charge-Current at Cold,  
4.06V at Hot, bq24092/3  
Fixed 10 Hour Safety Timer  
The battery is charged in three phases: conditioning,  
constant current and constant voltage. In all charge  
phases, an internal control loop monitors the IC  
junction temperature and reduces the charge current  
if an internal temperature threshold is exceeded.  
SYSTEM  
Automatic Termination and Timer Disable  
Mode (TTDM) for Absent Battery Pack With  
Thermistor  
Status Indication – Charging/Done  
1.5kW  
bq24090  
Adaptor  
DC+  
1
2
3
4
5
10  
9
System Load  
IN  
OUT  
1.5kW  
Battery Pack  
GND  
ISET  
VSS  
TS  
CHG  
ISET2  
NC  
+
8
1kW  
1mF  
1mF  
7
PRETERM  
PG  
OR  
6
VDD  
2kW  
TTDM  
USB Port  
ISET/100/500mA  
VBUS  
GND  
GND  
D+  
D+  
D-  
Host  
D-  
Disconnect after Detection  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010, Texas Instruments Incorporated  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
DESCRIPTION CONTINUED  
The charger power stage and charge current sense functions are fully integrated. The charger function has high  
accuracy current and voltage regulation loops, charge status display, and charge termination. The pre-charge  
current and termination current threshold are programmed via an external resistor. The fast charge current value  
is also programmable via an external resistor.  
ORDERING INFORMATION  
PART #  
bq24090  
bq24091  
bq24092  
bq24093  
VO(REG)  
4.20 V  
4.20 V  
4.20 V  
4.20 V  
VOVP  
6.6 V  
6.6 V  
6.6 V  
6.6 V  
JEITA  
TS/CE  
PG  
Yes  
Yes  
Yes  
Yes  
PACKAGE  
Marking  
bq24090  
bq24091  
No  
10kNTC  
100kNTC  
10kNTC  
100kNTC  
10 PIN 5x3mm2  
10 PIN 5x3mm2  
10 PIN 5x3mm2  
10 PIN 5x3mm2  
No  
Yes  
Yes  
Product Preview  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
IN (with respect to VSS)  
–0.3 to 7  
–0.3 to 7  
V
V
OUT (with respect to VSS)  
Input Voltage  
PRE-TERM, ISET, ISET2, TS, CHG, PG, ASI, ASO (with respect to  
VSS)  
–0.3 to 7  
V
Input Current  
IN  
1.25  
1.25  
A
A
Output Current (Continuous)  
Output Sink Current  
Junction temperature  
Storage temperature  
OUT  
CHG  
15  
mA  
°C  
°C  
TJ  
–40 to 150  
–65 to 150  
TSTG  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage  
values are with respect to the network ground terminal unless otherwise noted.  
PACKAGE DISSIPATION RATINGS(1) (2)  
PACKAGE  
RqJA  
RqJC  
T
A 25°C  
DERATING FACTOR  
TA > 25°C  
POWER RATING  
5x3mm MSOP  
52°C/W  
48°C/W  
1.92 W  
19.2 mW/°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a copper pad on the board. This is  
connected to the ground plane by a 2×3 via matrix  
2
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
RECOMMENDED OPERATING CONDITIONS(1)  
MIN  
3.5  
MAX  
7
UNIT  
V
IN voltage range  
VIN  
IN operating voltage range, Restricted by VDPM and VOVP  
4.45  
6.45  
1.0  
V
IIN  
Input current, IN pin  
A
IOUT  
Current, OUT pin  
1.0  
A
TJ  
Junction temperature  
0
1
125  
10  
°C  
kΩ  
kΩ  
kΩ  
RPRE-TERM  
RISET  
RTS  
Programs precharge and termination current thresholds  
Fast-charge current programming resistor  
10k NTC thermistor range without entering BAT_EN or TTDM  
0.675  
1.66  
49.9  
258  
(1) Operation with VIN less than 4.5V or in drop-out may result in reduced performance.  
ELECTRICAL CHARACTERISTICS  
Over junction temperature range 0°C TJ 125°C and recommended supply voltage (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
INPUT  
UVLO  
Undervoltage lock-out Exit  
VIN: 0V 4V Update based on sim/char  
3.15  
175  
3.3  
3.45  
280  
V
VIN: 4V0V,  
VUVLO_FALL = VUVLO_RISE –VHYS-UVLO  
VHYS_UVLO  
Hysteresis on VUVLO_RISE falling  
227  
mV  
(Input power good if VIN > VOUT + VIN-DT);  
VOUT = 3.6V, VIN: 3.5V 4V  
Input power good detection threshold  
is VOUT + VIN-DT  
VIN-DT  
30  
80  
31  
45  
145  
mV  
mV  
ms  
VHYS-INDT  
tDGL(PG_PWR)  
Hysteresis on VIN-DT falling  
VOUT = 3.6V, VIN: 4V 3.5V  
Time measured from VIN: 0V 5V 1ms rise-time to  
PG = low, VOUT = 3.6V  
Deglitch time on exiting sleep.  
tDGL(PG_NO-  
Deglitch time on VHYS-INDT power  
down. Same as entering sleep.  
Time measured from VIN: 5V 3.2V 1ms fall-time to  
PG = OC, VOUT = 3.6V  
29  
ms  
PWR)  
VOVP  
Input over-voltage protection threshold VIN: 5V 7V  
6.5  
6.65  
113  
95  
6.8  
V
tDGL(OVP-SET)  
VHYS-OVP  
Input over-voltage blanking time  
Hysteresis on OVP  
VIN: 5V 7V  
VIN: 7V 5V  
ms  
mV  
Time measured from VIN: 7V 5V 1ms fall-time to  
PG = LO  
tDGL(OVP-REC)  
Deglitch time exiting OVP  
30  
4.4  
4.3  
ms  
Feature active in USB mode; Limit Input Source  
Current to 50mA; VOUT = 3.5V; RISET = 825Ω  
4.34  
4.24  
4.46  
4.36  
USB/Adaptor low input voltage  
protection. Restricts lout at VIN-DPM  
VIN-DPM  
V
Feature active in Adaptor mode; Limit Input Source  
Current to 50mA; VOUT = 3.5V; RISET = 825Ω  
USB input I-Limit 100mA  
USB input I-Limit 500mA  
ISET2 = Float; RISET = 825Ω  
ISET2 = High; RISET = 825Ω  
85  
92  
100  
500  
IIN-USB-CL  
mA  
430  
462  
ISET SHORT CIRCUIT TEST  
Highest Resistor value considered a  
fault (short). Monitored for Iout>90mA Reset.  
Riset: 600Ω → 250, Iout latches off. Cycle power to  
RISET_SHORT  
tDGL_SHORT  
IOUT_CL  
280  
500  
ms  
A
Deglitch time transition from ISET  
short to Iout disable  
Clear fault by cycling IN or TS/BAT_EN  
1
VIN = 5V, VOUT = 3.6V, VISET2 = Low, Riset:  
600Ω → 250, Iout latches off after tDGL-SHORT  
Maximum OUT current limit Regulation  
(Clamp)  
1.05  
0.75  
1.4  
BATTERY SHORT PROTECTION  
OUT pin short-circuit detection  
threshold/ precharge threshold  
VOUT(SC)  
VOUT:3V 0.5V, no deglitch  
0.8  
77  
15  
0.85  
V
Recovery VOUT(SC) + VOUT(SC-HYS); Rising, no  
Deglitch  
VOUT(SC-HYS)  
IOUT(SC)  
OUT pin Short hysteresis  
mV  
mA  
Source current to OUT pin during  
short-circuit detection  
10  
20  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
MAX UNIT  
ELECTRICAL CHARACTERISTICS (continued)  
Over junction temperature range 0°C TJ 125°C and recommended supply voltage (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
QUIESCENT CURRENT  
IOUT(PDWN)  
IOUT(DONE)  
IIN(STDBY)  
Battery current into OUT pin  
OUT pin current, charging terminated  
Standby current into IN pin  
VIN = 0V  
1
mA  
6
VIN = 6V, VOUT > VOUT(REG)  
TS = LO, VIN 6V  
125  
1.0  
mA  
TS = open, VIN = 6V, TTDM – no load on OUT pin,  
VOUT > VOUT(REG), IC enabled  
ICC  
Active supply current, IN pin  
0.8  
mA  
BATTERY CHARGER FAST-CHARGE  
VOUT(REG)  
VO_HT(REG)  
Battery regulation voltage  
VIN = 5.5V, IOUT = 25mA, (VTS-45°CVTS VTS-0°C  
)
4.16  
4.02  
4.2  
4.23  
4.1  
V
V
Battery hot regulation Voltage,  
bq24092/3  
VIN = 5.5V, IOUT = 25mA, VTS-60°CVTS VTS-45°C  
4.06  
VOUT(REG) > VOUT > VLOWV; VIN = 5V, ISET2=Lo,  
RISET = 675 to 10.8kΩ  
Programmed Output “fast charge”  
current range  
IOUT(RANGE)  
10  
1000  
520  
mA  
Adjust VIN down until IOUT = 0.5A, VOUT = 4.15V,  
RISET = 675 , ISET2=Lo (adaptor mode); Tj 100°C  
VDO(IN-OUT)  
IOUT  
Drop-Out, VIN – VOUT  
325  
mV  
A
Output “fast charge” formula  
VOUT(REG) > VOUT > VLOWV; VIN = 5V, ISET2 = Lo  
RISET = KISET /IOUT; 50 < IOUT < 800 mA  
RISET = KISET /IOUT; 25 < IOUT < 50 mA  
RISET = KISET /IOUT; 10 < IOUT < 25 mA  
KISET/RISET  
540  
510  
480  
350  
565  
580  
680  
KISET  
Fast charge current factor  
527  
AΩ  
520  
PRECHARGE – SET BY PRETERM PIN  
Pre-charge to fast-charge transition  
threshold  
VLOWV  
2.4  
2.5  
70  
32  
2.6  
V
Deglitch time on pre-charge to  
fast-charge transition  
tDGL1(LOWV)  
ms  
ms  
Deglitch time on fast-charge to  
pre-charge transition  
tDGL2(LOWV)  
IPRE-TERM  
Refer to the Termination Section  
Pre-charge current, default setting  
Pre-charge current formula  
VOUT < VLOWV; RISET = 1080;  
RPRE-TERM= High Z  
%IOUT-  
18  
20  
22  
CC  
%
PRECHG  
RPRE-TERM = KPRE-CHG (/%) × %PRE-CHG (%)  
RPRE-TERM/KPRE-CHG%  
VOUT < VLOWV, VIN = 5V, RPRE-TERM = 2k to 10k;  
RISET = 1080, RPRE-TERM = KPRE-CHG × %IFAST-CHG  
where %IFAST-CHG is 20 to 100%  
,
90  
84  
100  
100  
110  
117  
/%  
/%  
KPRE-CHG  
% Pre-charge Factor  
VOUT < VLOWV, VIN = 5V, RPRE-TERM = 1k to 2k;  
RISET = 1080, RPRE-TERM = KPRE-CHG × %IFAST-CHG  
,
where %IFAST-CHG is 10% to 20%  
TERMINATION – SET BY PRE-TERM PIN  
Termination Threshold Current, default VOUT > VRCH; RISET = 1k;  
%IOUT-  
9
10  
11  
setting  
RPRE-TERM= High Z  
CC  
%
TERM  
Termination Current Threshold  
Formula  
RPRE-TERM = KTERM (/%) × %TERM (%)  
VOUT > VRCH, VIN = 5V, RPRE-TERM = 2k to 10k;  
RPRE-TERM/ KTERM  
RISET = 750KTERM × %IFAST-CHG, where %IFAST-CHG  
is 10 to 50%  
182  
174  
71  
200  
199  
75  
216  
224  
81  
KTERM  
% Term Factor  
/%  
mA  
VOUT > VRCH, VIN = 5V, RPRE-TERM = 1k to 2k; RISET  
= 750KTERM × %Iset, where %Iset is 5 to 10%  
Current for programming the term. and  
pre-chg with resistor. ITerm-Start is the  
initial PRE-TERM current.  
IPRE-TERM  
RPRE-TERM = 2k, VOUT = 4.15V  
%TERM  
Termination current formula  
RTERM/ KTERM  
29  
%
tDGL(TERM)  
Deglitch time, termination detected  
ms  
Elevated PRE-TERM current for,  
tTerm-Start, during start of charge to  
prevent recharge of full battery,  
ITerm-Start  
80  
85  
92  
mA  
Elevated termination threshold initially  
active for tTerm-Start  
tTerm-Start  
1.25  
min  
4
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
 
 
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
ELECTRICAL CHARACTERISTICS (continued)  
Over junction temperature range 0°C TJ 125°C and recommended supply voltage (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
RECHARGE OR REFRESH  
Recharge detection threshold –  
Normal Temp  
VO(REG)  
-0.120  
VO(REG)  
0.070  
-
VIN = 5V, VTS = 0.5V, VOUT: 4.25V VRCH  
VIN = 5V, VTS = 0.2V, VOUT: 4.15V VRCH  
VO(REG)-0.095  
V
V
VRCH  
Recharge detection threshold – Hot  
Temp  
VO(REG)  
-0.130  
VO(REG)  
0.080  
-
VO(REG)-0.105  
Deglitch time, recharge threshold  
detected  
VIN = 5V, VTS = 0.5V, VOUT: 4.25V 3.5V in 1ms;  
tDGL(RCH) is time to ISET ramp  
tDGL1(RCH)  
tDGL2(RCH)  
29  
ms  
ms  
Deglitch time, recharge threshold  
detected in OUT-Detect Mode  
VIN = 5V, VTS = 0.5V, VOUT = 3.5V inserted; tDGL(RCH)  
is time to ISET ramp  
3.6  
BATTERY DETECT ROUTINE  
VOUT Reduced regulation during  
VO(REG)  
-0.450  
VO(REG)-  
VREG-BD  
VO(REG)-0.400  
V
battery detect  
350  
IBD-SINK  
Sink current during VREG-BD  
VIN = 5V, VTS = 0.5V, Battery Absent  
7
10  
mA  
ms  
tDGL(HI/LOW  
Regulation time at VREG or VREG-BD  
High battery detection threshold  
Low battery detection threshold  
25  
VO(REG)-0.100  
VREG-BD +0.1  
REG)  
VO(REG)  
-0.150  
VO(REG)-  
0.050  
VBD-HI  
VBD-LO  
VIN = 5V, VTS = 0.5V, Battery Absent  
VIN = 5V, VTS = 0.5V, Battery Absent  
V
V
VREG-BD  
+0.50  
VREG-BD  
+0.15  
BATTERY CHARGING TIMERS AND FAULT TIMERS  
Restarts when entering Pre-charge; Always enabled  
when in pre-charge.  
tPRECHG  
tMAXCH  
Pre-charge safety timer value  
Charge safety timer value  
1700  
1940  
2250  
s
s
Clears fault or resets at UVLO, TS/BAT_EN disable,  
OUT Short, exiting LOWV and Refresh  
34000  
38800  
45000  
BATTERY-PACK NTC MONITOR (Note 1); TS pin: 10k and 100k NTC  
INTC-10k  
NTC bias current, bq24090/2  
NTC bias current, bq24091/3  
VTS = 0.3V  
VTS = 0.3V  
48  
50  
52  
mA  
mA  
INTC-100k  
4.8  
5.0  
5.2  
10k NTC bias current when Charging  
is disabled, bq24090/2  
INTC-DIS-10k  
INTC-DIS-100k  
VTS = 0V  
VTS = 0V  
27  
30  
34  
mA  
mA  
10k NTC bias current when Charging  
is disabled, bq24091/3  
4.4  
5.0  
5.8  
INTC is reduced prior to entering  
TTDM to keep cold thermistor from  
entering TTDM, bq24090/2  
INTC-FLDBK-10k  
VTS: Set to 1.525V  
4
5
6.5  
mA  
INTC is reduced prior to entering  
INTC-FLDBK-100k TTDM to keep cold thermistor from  
entering TTDM, bq24091/3  
VTS: Set to 1.525V  
1.1  
1.5  
1.9  
mA  
Termination and timer disable mode  
Threshold – Enter  
VTTDM(TS)  
VTS: 0.5V 1.7V; Timer Held in Reset  
1550  
1600  
1650  
mV  
VHYS-TTDM(TS)  
VCLAMP(TS)  
Hysteresis exiting TTDM  
VTS: 1.7V 0.5V; Timer Enabled  
100  
1950  
57  
mV  
mV  
ms  
ms  
TS maximum voltage clamp  
VTS = Open (Float)  
1800  
2000  
Deglitch exit TTDM between states  
Deglitch enter TTDM between states  
tDGL(TTDM)  
8
INTC adjustment (90 to 10%; 45 to 6.6uS) takes  
place near this spec threshold. VTS: 1.425V →  
1.525V  
TS voltage where INTC is reduce to  
keep thermistor from entering TTDM  
VTS_I-FLDBK  
1475  
mV  
CTS  
Optional Capacitance – ESD  
Low temperature CHG Pending  
0.22  
mF  
Low Temp Charging to Pending;  
VTS: 1.0V 1.5V  
VTS-0°C  
1205  
765  
1230  
1255  
815  
mV  
Charge pending to low temp charging;  
VTS: 1.5V 1V  
VHYS-0°C  
VTS-10°C  
VHYS-10°C  
VTS-45°C  
VHYS-45°C  
Hysteresis at 0°C  
86  
790  
35  
mV  
mV  
mV  
mV  
mV  
Low temperature, half charge,  
bq24092/3  
Normal charging to low temp charging;  
VTS: 0.5V 1V  
Low temp charging to normal CHG;  
VTS: 1.0V 0.5V  
Hysteresis at 10°C, bq24092/3  
High temperature at 4.1V  
Hysteresis at 45°C  
Normal charging to high temp CHG;  
VTS: 0.5V 0.2V  
263  
278  
10.7  
293  
High temp charging to normal CHG;  
VTS: 0.2V 0.5V  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): bq24090 bq24091  
 
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
MAX UNIT  
ELECTRICAL CHARACTERISTICS (continued)  
Over junction temperature range 0°C TJ 125°C and recommended supply voltage (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
High temp charge to pending;  
VTS: 0.2V 0.1V  
VTS-60°C  
High temperature Disable, bq24092/3  
170  
178  
186  
mV  
mV  
Charge pending to high temp CHG;  
VTS: 0.1V 0.2V  
VHYS-60°C  
Hysteresis at 60°C, bq24092/3  
11.5  
Normal to Cold Operation; VTS: 0.6V 1V  
Cold to Normal Operation; VTS: 1V 0.6V  
Battery charging  
50  
12  
30  
88  
Deglitch for TS thresholds: 10C,  
bq24092/3  
tDGL(TS_10C)  
ms  
tDGL(TS)  
Deglitch for TS thresholds: 0/45/60C.  
Charge Enable Threshold, (10k NTC)  
ms  
VTS-EN-10k  
VTS: 0V 0.175V;  
80  
96  
mV  
HYS below VTS-EN-10k to Disable, (10k  
NTC)  
VTS-DIS_HYS-10k  
VTS-EN-100k  
VTS: 0.125V 0V;  
12  
150  
50  
mV  
mV  
mV  
Charge Enable Threshold, bq24090/2 VTS: 0V 0.175V;  
140  
160  
VTS-DIS_HYS-  
HYS below VTS-EN-100k to Disable,  
VTS: 0.125V 0V;  
bq24091/3  
100k  
THERMAL REGULATION  
TJ(REG)  
Temperature regulation limit  
125  
155  
20  
°C  
°C  
°C  
TJ(OFF)  
Thermal shutdown temperature  
Thermal shutdown hysteresis  
TJ(OFF-HYS)  
LOGIC LEVELS ON ISET2  
VIL  
VIH  
IIL  
Logic LOW input voltage  
Sink 8 mA  
0.4  
V
V
Logic HIGH input voltage  
Sink current required for LO  
Source current required for HI  
ISET2 Float Voltage  
Source 8 mA  
VISET2= 0.4V  
VISET2= 1.4V  
1.4  
2
9
8
mA  
mA  
mV  
IIH  
1.1  
575  
VFLT  
900  
1225  
LOGIC LEVELS ON CHG AND PG  
VOL  
Output LOW voltage  
ISINK = 5 mA  
0.4  
1
V
ILEAK  
Leakage current into IC  
V CHG = 5V, V PG = 5V  
mA  
6
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
PIN CONFIGURATION  
bq2409x  
1
2
3
4
5
10  
9
IN  
OUT  
TS  
ISET  
VSS  
8
CHG  
ISET2  
NC  
7
PRETERM  
PG  
6
PIN FUNCTIONS  
NAME  
PIN  
I/O DESCRIPTION  
Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass  
capacitors 1mF to 10mF, connect from IN to VSS  
IN  
1
I
O
I
.
Battery Connection. System Load may be connected. Average load should not be excessive, allowing  
battery to charge within the 10 hour safety timer window. Expected range of bypass capacitors 1mF to  
10mF.  
OUT  
10  
4
Programs the Current Termination Threshold (5 to 50% of Iout which is set by ISET) and Sets the  
Pre-Charge Current to twice the Termination Current Level.  
PRE-TERM  
Expected range of programming resistor is 1k to 10k(2k: Ipgm/10 for term; Ipgm/5 for precharge)  
Programs the Fast-charge current setting. External resistor from ISET to VSS defines fast charge current  
value. Range is 10.8k (50mA) to 675 (800mA).  
ISET  
2
7
I
I
Programming the Input/Output Current Limit for the USB or Adaptor source:  
High = 500mAmax, Low = ISET, FLOAT = 100mAmax.  
ISET2  
Temperature sense pin connected to bq24090/2 -10k at 25°C NTC thermistor & bq24091/3 -100k at  
25°C NTC thermistor, in the battery pack. Floating TS Pin or pulling High puts part in TTDM “Charger”  
Mode and disable TS monitoring, Timers and Termination. Pulling pin Low disables the IC. If NTC  
sensing is not needed, connect this pin to VSS through an external 10 k/100kresistor. A 250kfrom  
TS to ground will prevent IC entering TTDM mode when battery with thermistor is removed.  
TS  
9
I
VSS  
CHG  
PG  
3
8
5
6
Ground terminal  
O
O
Low (FET on) indicates charging and Open Drain (FET off) indicates no Charging or Charge complete.  
Low (FET on) indicates the input voltage is above UVLO and the OUT (battery) voltage.  
NC  
NA Do not make a connection to this pin (for internal use) – Do not route through this pin  
There is an internal electrical connection between the exposed thermal pad and the VSS pin of the  
Thermal PAD  
and Package  
Pad  
device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit  
board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be  
5x3mm2  
connected to ground at all times  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
Typical Application Circuit: bq2409x  
IOUT_FAST_CHG = 540mA; IOUT_PRE_CHG = 108mA; IOUT_TERM = 54mA  
1.5kW  
bq2409x  
Adaptor  
1
2
3
4
5
10  
9
System Load  
DC+  
GND  
IN  
OUT  
TS  
Battery Pack  
1.5kW  
ISET  
VSS  
+
8
CHG  
ISET2  
NC  
1kW  
1mF  
1mF  
7
PRETERM  
PG  
OR  
6
VDD  
2kW  
TTDM  
USB Port  
ISET/100/500 mA  
VBUS  
GND  
GND  
D+  
D+  
D-  
Host  
D-  
Disconnect after Detection  
8
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
FUNCTIONAL BLOCK DIAGRAM  
Internal Charge  
Current Sense  
w/ Multiple Outputs  
IN  
OUT  
+
80 mV  
Input  
Power  
Detect  
-
IN  
OUT  
+
_
_
+
+
_
OUT  
IN-DPMREF  
OUTREGREF  
Charge  
Pump  
I
x 1.5 V  
OUT  
540 AW  
TJ°C  
_
+
125°CREF  
FAST CHARGE  
PRE-CHARGE  
ISET  
IN  
_
+
1.5V  
Pre-CHG Reference  
_
+
USB100/500REF  
USB Sense  
Resistor  
T
oC  
J
Term Reference  
_
+
+
_
150oC  
REF  
Thermal Shutdown  
Charge  
Pump  
75mA+  
X2 Gain (1: 2)  
Term:Pre-CHGX2  
PRE-TERM  
+Increased from 75mA to 85mA for  
IN  
_
1st minute of charge.  
+
OVP  
REF  
CHG  
+
_
On During  
1st Charge Only  
OUT  
VTERM_EN  
+
_
ON:  
OFF:  
ISET2 (LO = ISET, HI = USB500,  
FLOAT = USB100)  
0.9V Float  
CHARGE  
CONTROL  
PG  
oC  
VCOLD-10  
_
+
HI = Half CHG (JEITA)  
HI = 4.06Vreg (JEITA)  
_
+
oC  
VHOT-45  
VCOLD-FLT  
_
+
_
+
VHOT-FLT  
LO = TTDM MODE  
HI = Suspend CHG  
TS  
VTTDM  
+
_
TS - bq24090  
VCE  
+
_
HI=CHIP DISABLE  
+
_
VDISABLE  
Cold Temperature  
Sink Current  
= 45mA  
Disable  
Sink Current  
= 20mA  
VCLAMP = 1.4V  
_
+
_
+
5mA  
45mA  
Bq24090 is as shown  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
TYPICAL OPERATIONAL CHARACTERISTICS  
SETUP: bq2409x typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)  
POWER UP, DOWN, OVP, DISABLE AND ENABLE WAVEFORMS  
Vin  
5V/div  
Vin  
5V/div  
Vchg  
2V/div  
2V/div  
Vchg  
Vpg  
2V/div  
Vpg  
2V/div  
Viset  
Viset  
2V/div  
2V/div  
t - time - 20ms/div  
t - time - 100ms/div  
Figure 1. OVP 8V Adaptor - Hot Plug  
Figure 2. OVP from Normal Power-up  
Operation – VIN 0V 5V 6.8V 5V  
10kresistor from TS to GND. 10kis shorted to disable the IC.  
Fixed 10kresistor, between TS and GND.  
Vpg  
5V/div  
Vpg  
2V/div  
Vchg  
Vchg  
2V/div  
2V/div  
Vout  
2V/div  
500mV/div  
Vts  
Battery Detect Mode  
Viset  
2V/div  
Vin  
5V/div  
t - time - 50ms/div  
t - time - 20ms/div  
Figure 3. TS Enable and Disable  
Figure 4. Hot Plug Source w/No Battery – Battery Detection  
1 Battery Detect Cycle  
1V/div  
Vout  
Vin  
2V/div  
Vchg  
Vout  
Viset  
500mV/div  
5V/div  
1V/div  
Viset  
1V/div  
Vts  
1V/div  
Vts  
2V/div  
Entered TTDM  
t - time - 5ms/div  
t - time - 10ms/div  
Figure 5. Battery Removal – GND Removed 1st, 42 Load  
Figure 6. Battery Removal with OUT and  
TS Disconnect 1st, With 100 Load  
Continuous battery detection when not in TTDM.  
10  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
 
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
TYPICAL OPERATIONAL CHARACTERISTICS (continued)  
SETUP: bq2409x typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)  
Vout  
1V/div  
Vchg  
Battery Declared Absent  
5V/div  
Viset  
1V/div  
V_0.1 W_OUT  
100mV/div  
t - time - 20ms/div  
Figure 7. Battery Removal with fixed TS = 0.5V  
PROTECTION CIRCUITS WAVEFORMS  
CH4: Iout (1A/Div)  
Battery voltage swept from 0V to 4.25V to 3.9V.  
CH4: Iout (1A/Div)  
1V/div  
5V/div  
1V/div  
Vout  
Vchg  
Vout  
1V/div  
Vchg 2V/div  
Battery  
Threshold  
Reached  
500mV/div  
Viset  
Viset  
I
Clamped Current  
OUT  
V_0.1 W_OUT  
V_0.1 W_OUT  
100mV/div  
100mV/div  
I
Short Detected  
SET  
and Latched Off  
t - time - 500ms/div  
t - time - 200ms/div  
Figure 8. Battery Charge Profile  
Figure 9. ISET Shorted During Normal Operation  
CH4: Iout (0.2A/Div)  
CH4: Iout (0.2A/Div)  
Vchg  
2V/div  
Vin  
2V/div  
Vchg  
Vin  
2V/div  
2V/div  
500mV/div  
Viset  
Short Detected in 100mA  
mode and Latched Off  
V_0.1W_OUT  
20mV/div  
Viset  
500mV/div  
V_0.1 W_OUT  
20mV/div  
t - time - 1ms/div  
t - time - 5ms/div  
Figure 10. ISET Shorted Prior to USB Power-up  
Figure 11. DPM – Adaptor Current Limits – Vin Regulated  
The IC temperature rises to 125°C and enters thermal regulation. Charge current is reduced to regulate the IC at  
125°C. VIN is reduced, the IC temperature drops, the charge current returns to the programmed value.  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): bq24090 bq24091  
 
 
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
TYPICAL OPERATIONAL CHARACTERISTICS (continued)  
SETUP: bq2409x typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)  
Vin  
Vout  
Vin  
2V/div  
2V/div  
Vchg  
1V/div  
Enters  
Thermal  
2V/div  
Exits  
Thermal  
Regulation  
Regulation  
Viset  
1V/div  
V_0.1W_OUT  
Viset  
V_0.1W_OUT  
500mV/div  
20mV/div  
50mV/div  
t - time - 500ms/div  
t - time - 1s/div  
Figure 12. DPM – USB Current Limits – Vin Regulated to 4.4V  
Figure 13. Thermal Reg. – Vin increases PWR/Iout Reduced  
Vin swept from 5V to 3.9V to 5V, Vbat = 4V  
546  
Kiset  
544  
Vin  
1V/div  
542  
Low to High Currents  
540  
(may occur in recharge to fast charge transion)  
Viset  
1V/div  
5V/div  
538  
Vchg  
Vpg  
High to Low Currents  
536  
(may occur in Voltage Regulation - Taper Current)  
5V/div  
534  
532  
t - time - 20ms/div  
530  
528  
.15  
0
0.2  
0.4  
0.6  
0.8  
I
- Output Current - A  
O
Figure 14. Entering and Exiting Sleep mode  
Figure 15. Kiset for Low and High Currents  
4.212  
4.21  
4.2  
V
@ 0°C  
R
100 Ω  
O
OUT =  
4.199  
V
@ 25°C  
reg  
4.208  
4.206  
4.204  
4.202  
4.2  
4.198  
4.197  
V
@ 85°C  
reg  
V
@ 25°C  
@ 85°C  
O
4.196  
4.195  
4.194  
4.193  
4.192  
V
O
V
@ 0°C  
reg  
4.198  
4.196  
4.5  
5
5.5  
- Input Voltage DC - V  
6
6.5  
0
0.2  
0.4  
0.6  
0.8  
1
V
I
I
- Output current - A  
O
Figure 16. Line Regulation  
Figure 17. Load Regulation Over Temperature  
12  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
 
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
TYPICAL OPERATIONAL CHARACTERISTICS (continued)  
SETUP: bq2409x typical applications schematic; VIN = 5V, VBAT = 3.6V (unless otherwise indicated)  
363.4  
363.2  
I
@ 25°C  
O
363  
362.8  
I
@ 85°C  
O
362.6  
362.4  
362.2  
I
@ 0°C  
O
362  
361.8  
2.5  
3
3.5  
4
4.5  
V
- Output Voltage - V  
O
Figure 18. Current Regulation Over Temperature  
FUNCTIONAL GENERAL DESCRIPTION  
The bq2409x is a highly integrated family of 5x3mm2 single cell Li-Ion chargers. The charger can be used to  
charge a battery, power a system or both. The charger has three phases of charging: Pre-charge to recover a  
fully discharged battery, fast-charge constant current to supply the buck charge safely and voltage regulation to  
safely reach full capacity. The charger is very flexible, allowing programming of the fast-charge current and  
Pre-charge/Termination Current. This charger is designed to work with a USB connection or Adaptor (DC out).  
The charger also checks to see if a battery is present.  
The charger also comes with a full set of safety features: JEITA Temperature Standard, Over-Voltage Protection,  
DPM-IN, Safety Timers, and ISET short protection. All of these features and more are described in detail below.  
The charger is designed for a single power path from the input to the output to charge a single cell Li-Ion battery  
pack. Upon application of a 5VDC power source the ISET and OUT short checks are performed to assure a  
proper charge cycle.  
If the battery voltage is below the LOWV threshold, the battery is considered discharged and a preconditioning  
cycle begins. The amount of precharge current can be programmed using the PRE-TERM pin which programs a  
percent of fast charge current (10 to 100%) as the precharge current. This feature is useful when the system load  
is connected across the battery “stealing” the battery current. The precharge current can be set higher to account  
for the system loading while allowing the battery to be properly conditioned. The PRE-TERM pin is a dual  
function pin which sets the precharge current level and the termination threshold level. The termination "current  
threshold" is always half of the precharge programmed current level.  
Once the battery voltage has charged to the VLOWV threshold, fast charge is initiated and the fast charge  
current is applied. The fast charge constant current is programmed using the ISET pin. The constant current  
provides the bulk of the charge. Power dissipation in the IC is greatest in fast charge with a lower battery voltage.  
If the IC reaches 125°C the IC enters thermal regulation, slows the timer clock by half and reduce the charge  
current as needed to keep the temperature from rising any further. Figure 19 shows the charging profile with  
thermal regulation. Typically under normal operating conditions, the IC’s junction temperature is less than 125°C  
and thermal regulation is not entered.  
Once the cell has charged to the regulation voltage the voltage loop takes control and holds the battery at the  
regulation voltage until the current tapers to the termination threshold. The termination can be disabled if desired.  
The CHG pin is low (LED on) during the first charge cycle only and turns off once the termination threshold is  
reached, regardless if termination, for charge current, is enabled or disabled.  
Further details are mentioned in the Operating Modes section.  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
FUNCTIONAL GENERAL DESCRIPTION (continued)  
Thermal  
Regulation  
Phase  
Current  
Regulation  
Phase  
Voltage Regulation and  
Charge Termination  
Phase  
Pre-  
Conditioning  
Phase  
DONE  
V
O(REG)  
I
O(OUT)  
Battery Current,  
I
FAST-CHARGE  
CURRENT  
(OUT)  
Battery  
Voltage,  
V
(OUT)  
Charge  
Complete  
Status,  
Charger  
Off  
PRE-CHARGE  
CURRENT AND  
TERMINATION  
THRESHOLD  
V
O(LOWV)  
I
(TERM)  
I
O(PRECHG)  
T
(THREG)  
0A  
Temperature, Tj  
T
DONE  
(CHG)  
T
(PRECHG)  
Figure 19. Charging Profile With Thermal Regulation  
14  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
DETAILED FUNCTIONAL DESCRIPTION  
Power-Down or Undervoltage Lockout (UVLO)  
The bq2409x family is in power down mode if the IN pin voltage is less than UVLO. The part is considered  
“dead” and all the pins are high impedance. Once the IN voltage rises above the UVLO threshold the IC will  
enter Sleep Mode or Active mode depending on the OUT pin (battery) voltage.  
Under Voltage Lockout (UVLO):  
The bq2409x family is in power down mode if the IN pin voltage is less than VUVLO. The part is considered  
“dead” and all the pins are high impedance.  
Power-up  
The IC is alive after the IN voltage ramps above UVLO (see sleep mode), resets all logic and timers, and starts  
to perform many of the continuous monitoring routines. Typically the input voltage quickly rises through the  
UVLO and sleep states where the IC declares power good, starts the qualification charge at 100mA, sets the  
input current limit threshold base on the ISET2 pin, starts the safety timer and enables the CHG pin. See  
Figure 20.  
Sleep Mode  
If the IN pin voltage is between than VOUT+VDT and UVLO, the charge current is disabled, the safety timer  
counting stops (not reset) and the PG and CHG pins are high impedance. As the input voltage rises and the  
charger exits sleep mode, the PG pin goes low, the safety timer continues to count, charge is enabled and the  
CHG pin returns to its previous state. See Figure 21  
New Charge Cycle  
A new charge cycle is started when a good power source is applied, performing a chip disable/enable (TS pin),  
exiting Termination and Timer Disable Mode (TTDM), detecting a battery insertion or the OUT voltage dropping  
below the VRCH threshold. The CHG pin is active low only during the first charge cycle, therefore exiting TTDM  
or a dropping below VRCH will not turn on the CHG pin FET, if the CHG pin is already high impedance.  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
Figure 20. TS Battery Temperature Bias Threshold and Deglitch Timers  
16  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
 
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
Apply Input  
Power  
Is power good?  
VBAT+VDT < VIN < VOVP  
& VUVLO < VIN  
No  
Turn on PG FET  
PG pin LOW  
Yes  
No  
Is chip enabled?  
VTS > VEN  
Yes  
Set Input Current Limit to 100 mA  
and Start Charge  
Perform ISET & OUT short tests  
Remember ISET2 State  
Set charge current  
based on ISET2 truth  
table.  
Return to  
Charge  
Figure 21. bq2409x Power-Up Flow Diagram  
Overvoltage-Protection (OVP) – Continuously Monitored  
If the input source applies an overvoltage, the pass FET, if previously on, turns off after a deglitch, tBLK(OVP). The  
timer ends and the CHG and PG pin goes to a high impedance state. Once the overvoltage returns to a normal  
voltage, the PG pin goes low, timer continues, charge continues and the CHG pin goes low after a 25ms  
deglitch. PG pin is optional on some packages  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
Power Good Indication (PG)  
After application of a 5V source, the input voltage rises above the UVLO and sleep thresholds (VIN>VBAT+VDT),  
but is less than OVP (VIN<VOVP,), then the PG FET turns on and provides a low impedance path to ground. See  
Figure 1, Figure 2, and Figure 14.  
CHG Pin Indication  
The charge pin has an internal open drain FET which is on (pulls down to VSS) during the first charge only  
(independent of TTDM) and is turned off once the battery reaches voltage regulation and the charge current  
tapers to the termination threshold set by the PRE-TERM resistor.  
The charge pin is high impedance in sleep mode and OVP (if PG is high impedance) and return to its previous  
state once the condition is removed.  
Cycling input power, pulling the TS pin low and releasing or entering pre-charge mode causes the CHG pin to go  
reset (go low if power is good and a discharged battery is attached) and is considered the start of a first charge.  
CHG and PG LED Pull-up Source  
For host monitoring, a pull-up resistor is used between the "STATUS" pin and the VCC of the host and for a visual  
indication a resistor in series with an LED is connected between the "STATUS" pin and a power source. If the  
CHG or PG source is capable of exceeding 7V, a 6.2V Zener should be used to clamp the voltage. If the source  
is the OUT pin, note that as the battery changes voltage, the brightness of the LEDs vary.  
Charging State  
1st Charge  
Refresh Charge  
OVP  
CHG FET/LED  
ON  
OFF  
ON for 1st Charge  
PG FET/LED  
OFF  
SLEEP  
TEMP FAULT  
VIN Power Good State  
UVLO  
SLEEP Mode  
OVP Mode  
Normal Input (VOUT + VDT < VIN  
<
ON  
VOUP  
)
PG is independent of chip disable  
IN-DPM (VIN-DPM or IN–DPM)  
The IN-DPM feature is used to detect an input source voltage that is folding back (voltage dropping), reaching its  
current limit due to excessive load. When the input voltage drops to the VIN-DPM threshold the internal pass FET  
starts to reduce the current until there is no further drop in voltage at the input. This would prevent a source with  
voltage less than VIN-DPM to power the out pin. This works well with current limited adaptors and USB ports as  
long as the nominal voltage is above 4.3V and 4.4V respectively. This is an added safety feature that helps  
protect the source from excessive loads.  
OUT  
The Charger’s OUT pin provides current to the battery and to the system, if present. This IC can be used to  
charge the battery plus power the system, charge just the battery or just power the system (TTDM) assuming the  
loads do not exceed the available current. The OUT pin is a current limited source and is inherently protected  
against shorts. If the system load ever exceeds the output programmed current threshold, the output will be  
discharged unless there is sufficient capacitance or a charged battery present to supplement the excessive load.  
18  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
ISET  
An external resistor is used to Program the Output Current (50 to 800mA) and can be used as a current monitor.  
RISET = KISET ÷ IOUT  
(1)  
(1)  
Where:  
IOUT is the desired fast charge current;  
KISET is a gain factor found in the electrical specification  
For greater accuracy at lower currents, part of the sense FET is disabled to give better resolution. Figure 15  
shows the transition from low current to higher current. Going from higher currents to low currents, there is  
hysteresis and the transition occurs around 0.15A.  
The ISET resistor is short protected and will detect a resistance lower than 340. The detection requires at  
least 80mA of output current. If a “short” is detected, then the IC will latch off and can only be reset by cycling the  
power. The OUT current is internally clamped to a maximum current between 1.1A and 1.35A and is independent  
of the ISET short detection circuitry, as shown in Figure 23. Also, see Figure 9 and Figure 10.  
4.5  
For < 45oC, 4.2V Regulation  
No Operation  
During Cold  
Fault  
4
3.5  
3
60oC to 45oC  
HOT TEMP  
4.06V  
VOUT  
Regulation  
2.5  
2
< 48oC  
0oC  
60oC  
10oC  
1.5  
1
100% of Programmed  
Current  
50%  
0.5  
0
Cold  
Fault  
IOUT  
0.8  
0
0.4  
1
1.2  
1.6  
1.8  
0.2  
0.6  
1.4  
VTS - Voltage - V  
Figure 22. Operation Over TS Bias Voltage  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
19  
Product Folder Link(s): bq24090 bq24091  
 
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
1.8  
1.6  
1.4  
IOUT Internal Clamp Range  
1.2  
1
0.8  
IOUT Programmed  
max  
0.6  
ISET Short  
Fault  
0.4  
Range  
Non Restricted  
Operating Area  
min  
0.2  
0
100  
1000  
10000  
ISET - W  
Figure 23. Programmed/Clamped Out Current  
PRE_TERM – Pre-Charge and Termination Programmable Threshold  
Pre-Term is used to program both the pre-charge current and the termination current threshold. The pre-charge  
current level is a factor of two higher than the termination current level. The termination can be set between 5%  
and 50% of the programmed output current level set by ISET. If left floating the termination and pre-charge are  
set internally at 10/20% respectively. The pre-charge-to-fast-charge, Vlowv threshold is set to 2.5V.  
RPRE-TERM = %Term × KTERM = %Pre-CHG × KPRE-CHG  
(2)  
(2)  
Where:  
%Term is the percent of fast charge current where termination occurs;  
%Pre-CHG is the percent of fast charge current that is desired during precharge;  
KTERM and KPRE-CHG are gain factors found in the electrical specifications.  
ISET2  
Is a 3-state input and programs the Input Current Limit/Regulation Threshold. A low will program a regulated fast  
charge current via the ISET resistor and is the maximum allowed input/output current for any ISET2 setting, Float  
will program a 100mA Current limit and High will program a 500mA Current limit.  
Below are two configurations for driving the 3-state ISET2 pin:  
V
CC  
V
CC  
R1  
R1 Divider  
set to 0.9 V  
Which is the  
Float Voltage  
Drive  
Logic  
To  
ISET2  
To ISET2  
Q1  
Q2  
Drive  
Logic  
OR  
R2  
20  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
TS  
The TS pin is designed to follow the new JEITA temperature standard for Li-Ion batteries. There are now four  
thresholds, 60°C, 45°C, 10°C, and 0°C. Normal operation occurs between 10°C and 45°C. If between 0°C and  
10°C the charge current level is cut in half and if between 45°C and 60°C the regulation voltage is reduced to  
4.1Vmax, see Figure 22. The TS feature is implemented using an internal 50mA current source to bias the  
thermistor (designed for use with a 10k NTC b = 3370 (SEMITEC 103AT-2 or Mitsubishi TH05-3H103F)  
connected from the TS pin to VSS. If this feature is not needed, a fixed 10k can be placed between TS and VSS to  
allow normal operation. This may be done if the host is monitoring the thermistor and then the host would  
determine when to pull the TS pin low to disable charge.  
The TS pin has two additional features, when the TS pin is pulled low or floated/driven high. A low disables  
charge (similar to a high on the BAT_EN feature) and a high puts the charger in TTDM.  
Above 60°C or below 0°C the charge is disabled. Once the thermistor reaches –10°C the TS current folds back  
to keep a cold thermistor (between –10°C and –50°C) from placing the IC in the TTDM mode. If the TS pin is  
pulled low into disable mode, the current is reduced to 30mA, see Figure 20. Since the ITS current is fixed along  
with the temperature thresholds, it is not possible to use thermistor values other than the 10k NTC (at 25°C).  
For non-JEITA spins, the operating range is between 0°C and 45°C.  
Termination and Timer Disable Mode (TTDM) -TS pin high  
The battery charger is in TTDM when the TS pin goes high from removing the thermistor (removing battery  
pack/floating the TS pin) or by pulling the TS pin up to the TTDM threshold.  
When entering TTDM, the 10 hour safety timer is held in reset and termination is disabled. A battery detect  
routine is run to see if the battery was removed or not. If the battery was removed then the CHG pin will go to its  
high impedance state if not already there. If a battery is detected the CHG pin does not change states until the  
current tapers to the termination threshold, where the CHG pin goes to its high impedance state if not already  
there (the regulated output will remain on).  
The charging profile does not change (still has pre-charge, fast-charge constant current and constant voltage  
modes). This implies the battery is still charged safely and the current is allowed to taper to zero.  
When coming out of TTDM, the battery detect routine is run and if a battery is detected, then a new charge cycle  
begins and the CHG LED turns on.  
If TTDM is not desired upon removing the battery with the thermistor, one can add a 237k resistor between TS  
and VSS to disable TTDM. This keeps the current source from driving the TS pin into TTDM. This creates 0.1°C  
error at hot and a 3°C error at cold.  
Timers  
The pre-charge timer is set to 30 minutes. The pre-charge current, can be programmed to off-set any system  
load, making sure that the 30 minutes is adequate.  
The fast charge timer is fixed at 10 hours and can be increased real time by going into thermal regulation,  
IN-DPM or if in USB current limit. The timer clock slows by a factor of 2, resulting in a clock than counts half as  
fast when in these modes. If either the 30 minute or ten hour timer times out, the charging is terminated and the  
CHG pin goes high impedance if not already in that state. The timer is reset by disabling the IC, cycling power or  
going into and out of TTDM.  
Termination  
Once the OUT pin goes above VRCH, (reaches voltage regulation) and the current tapers down to the  
termination threshold, the CHG pin goes high impedance and a battery detect route is run to determine if the  
battery was removed or the battery is full. If the battery is present, the charge current will terminate. If the battery  
was removed along with the thermistor, then the TS pin is driven high and the charge enters TTDM. If the battery  
was removed and the TS pin is held in the active region, then the battery detect routine will continue until a  
battery is inserted.  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
21  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
Battery Detect Routine  
The battery detect routine should check for a missing battery while keeping the OUT pin at a useable voltage.  
Whenever the battery is missing the CHG pin should be high impedance.  
The battery detect routine is run when entering and exiting TTDM to verify if battery is present, or run all the time  
if battery is missing and not in TTDM. On power-up, if battery voltage is greater than VRCH threshold, a battery  
detect routine is run to determine if a battery is present.  
The battery detect routine is disabled while the IC is in TTDM, or has a TS fault. See Figure 24 for the Battery  
Detect Flow Diagram.  
Refresh Threshold  
After termination, if the OUT pin voltage drops to VRCH (100mV below regulation) then a new charge is initiated,  
but the CHG pin remains at a high impedance (off).  
Starting a Charge on a Full Battery  
The termination threshold is raised by 14%, for the first minute of a charge cycle so if a full battery is removed  
and reinserted or a new charge cycle is initiated, that the new charge terminates (less than 1 minute). Batteries  
that have relaxed many hours may take several minutes to taper to the termination threshold and terminate  
charge.  
22  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
Start  
BATT_DETECT  
Start 25ms timer  
No  
Timer Expired?  
Yes  
Battery Present  
Turn off Sink Current  
Return to flow  
Yes  
Is VOUT<VREG-100mV?  
No  
Set OUT REG  
to VREG-400mV  
Enable sink current  
Reset & Start 25ms timer  
No  
Timer Expired?  
Yes  
Yes  
Battery Present  
Turn off Sink Current  
Return to flow  
Is VOUT>VREG-300mV?  
No  
Battery Absent  
Don’t Signal Charge  
Turn off Sink Current  
Return to Flow  
Figure 24. Battery Detect Routine  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
23  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
bq24090 CHARGER APPLICATION DESIGN EXAMPLE  
1.5kW  
bq24090  
Adaptor  
1
2
3
4
5
10  
9
System Load  
DC+  
GND  
IN  
OUT  
TS  
Battery Pack  
1.5kW  
ISET  
VSS  
+
8
CHG  
ISET2  
NC  
1kW  
1mF  
1mF  
7
PRETERM  
PG  
OR  
6
VDD  
2kW  
TTDM  
USB Port  
ISET/100/500 mA  
VBUS  
GND  
GND  
D+  
D+  
D-  
Host  
D-  
Requirements  
Supply voltage = 5 V  
Fast charge current: IOUT-FC = 540 mA; ISET-pin 2  
Termination Current Threshold: %IOUT-FC = 10% of Fast Charge or ~54mA  
Pre-Charge Current by default is twice the termination Current or ~108mA  
TS – Battery Temperature Sense = 10k NTC (103AT)  
Calculations  
Program the Fast Charge Current, ISET:  
RISET = [K(ISET) / I(OUT)  
]
from electrical characteristics table. . . K(SET) = 540AΩ  
RISET = [540A/0.54A] = 1.0 kΩ  
Selecting the closest standard value, use a 1.0 kresistor between ISET (pin 16) and Vss.  
Program the Termination Current Threshold, ITERM:  
RPRE-TERM = K(TERM) × %IOUT-FC  
RPRE-TERM = 200/% × 10% = 2kΩ  
Selecting the closest standard value, use a 2 kresistor between ITERM (pin 15) and Vss.  
One can arrive at the same value by using 20% for a pre-charge value (factor of 2 difference).  
RPRE-TERM = K(PRE-CHG) × %IOUT-FC  
RPRE-TERM = 100/% × 20%= 2kΩ  
TS Function  
Use a 10k NTC thermistor in the battery pack (103AT).  
To Disable the temp sense function, use a fixed 10k resistor between the TS (Pin 1) and Vss.  
24  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
www.ti.com  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
CHG and PG  
LED Status: connect a 1.5k resistor in series with a LED between the OUT pin and the CHG pin.  
Connect a 1.5k resistor in series with a LED between the OUT pin and the and PG pin.  
Processor Monitoring: Connect a pull-up resistor between the processor’s power rail and the CHG pin.  
Connect a pull-up resistor between the processor’s power rail and the PG pin.  
SELECTING IN AND OUT PIN CAPACITORS  
In most applications, all that is needed is a high-frequency decoupling capacitor (ceramic) on the power pin, input  
and output pins. Using the values shown on the application diagram, is recommended. After evaluation of these  
voltage signals with real system operational conditions, one can determine if capacitance values can be adjusted  
toward the minimum recommended values (DC load application) or higher values for fast high amplitude pulsed  
load applications. Note if designed for high input voltage sources (bad adaptors or wrong adaptors), the capacitor  
needs to be rated appropriately. Ceramic capacitors are tested to 2x their rated values so a 16V capacitor may  
be adequate for a 30V transient (verify tested rating with capacitor manufacturer).  
THERMAL PACKAGE  
The bq2409x family is packaged in a thermally enhanced MSOP package. The package includes a thermal pad  
to provide an effective thermal contact between the IC and the printed circuit board (PCB). The power pad  
should be directly connected to the VSS pin. Full PCB design guidelines for this package are provided in the  
application note entitled: Power Pad Thermally Enhanced Package Note (SLMA002). The most common  
measure of package thermal performance is thermal impedance (qJA ) measured (or modeled) from the chip  
junction to the air surrounding the package surface (ambient). The mathematical expression for qJA is:  
qJA = (TJ – T) / P  
(3)  
(3)  
Where:  
TJ = chip junction temperature  
T = ambient temperature  
P = device power dissipation  
Factors that can influence the measurement and calculation of qJA include:  
1. Whether or not the device is board mounted  
2. Trace size, composition, thickness, and geometry  
3. Orientation of the device (horizontal or vertical)  
4. Volume of the ambient air surrounding the device under test and airflow  
5. Whether other surfaces are in close proximity to the device being tested  
Due to the charge profile of Li-Ion batteries the maximum power dissipation is typically seen at the beginning of  
the charge cycle when the battery voltage is at its lowest. Typically after fast charge begins the pack voltage  
increases to 3.4V within the first 2 minutes. The thermal time constant of the assembly typically takes a few  
minutes to heat up so when doing maximum power dissipation calculations, 3.4V is a good minimum voltage to  
use. This is verified, with the system and a fully discharged battery, by plotting temperature on the bottom of the  
PCB under the IC (pad should have multiple vias), the charge current and the battery voltage as a function of  
time. The fast charge current will start to taper off if the part goes into thermal regulation.  
The device power dissipation, P, is a function of the charge rate and the voltage drop across the internal  
PowerFET. It can be calculated from the following equation when a battery pack is being charged :  
P = [V(IN) – V(OUT)] × I(OUT) + [V(OUT) – V(BAT)] × I(BAT)  
(3)  
The thermal loop feature reduces the charge current to limit excessive IC junction temperature. It is  
recommended that the design not run in thermal regulation for typical operating conditions (nominal input voltage  
and nominal ambient temperatures) and use the feature for non typical situations such as hot environments or  
higher than normal input source voltage. With that said, the IC will still perform as described, if the thermal loop  
is always active.  
Copyright © 2010, Texas Instruments Incorporated  
Submit Documentation Feedback  
25  
Product Folder Link(s): bq24090 bq24091  
bq24090, bq24091  
bq24092, bq24093  
SLUS968A JANUARY 2010REVISED FEBRUARY 2010  
www.ti.com  
Leakage Current Effects on Battery Capacity  
To determine how fast a leakage current on the battery will discharge the battery is an easy calculation. The time  
from full to discharge can be calculated by dividing the Amp-Hour Capacity of the battery by the leakage current.  
For a 0.75AHr battery and a 10mA leakage current (750mAHr/0.010mA = 75000 Hours), it would take 75k hours  
or 8.8 years to discharge. In reality the self discharge of the cell would be much faster so the 10mA leakage  
would be considered negligible.  
Layout Tips  
To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter  
capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq2409x, with short  
trace runs to both IN, OUT and GND (thermal pad).  
All low-current GND connections should be kept separate from the high-current charge or discharge paths  
from the battery. Use a single-point ground technique incorporating both the small signal ground path and the  
power ground path.  
The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum  
charge current in order to avoid voltage drops in these traces  
The bq2409x family is packaged in a thermally enhanced MLP package. The package includes a thermal pad  
to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is  
also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. It is  
best to use multiple 10mil vias in the power pad of the IC and in close proximity to conduct the heat to the  
bottom ground plane. The bottom ground place should avoid traces that “cut off” the thermal path. The thinner  
the PCB the less temperature rise. The EVM PCB has a thickness of 0.031 inches and uses 2 oz. (2.8mil  
thick) copper on top and bottom, and is a good example of optimal thermal performance.  
SPACER  
REVISION HISTORY  
Changes from Original (January 2010) to Revision A  
Page  
Changed VDO(IN-OUT), MAX value From: 500 mV To: 520 mV in the Elect Characteristics table .......................................... 4  
Changed IPRE-TERM MAX value From: 79 µA to 81µA in the Elect Characteristics table ....................................................... 4  
Changed VCLAMP(TS) MIN value From: 1900 mV to 1800 mV in the Elect Characteristics table ........................................... 5  
26  
Submit Documentation Feedback  
Copyright © 2010, Texas Instruments Incorporated  
Product Folder Link(s): bq24090 bq24091  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Feb-2010  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
BQ24090DGQR  
PREVIEW  
MSOP-  
Power  
PAD  
DGQ  
10  
10  
10  
10  
2500  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
BQ24090DGQT  
BQ24091DGQR  
BQ24091DGQT  
PREVIEW  
PREVIEW  
PREVIEW  
MSOP-  
Power  
PAD  
DGQ  
DGQ  
DGQ  
250  
MSOP-  
Power  
PAD  
MSOP-  
Power  
PAD  
250  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
Automotive  
www.ti.com/automotive  
www.ti.com/communications  
Communications and  
Telecom  
DSP  
dsp.ti.com  
Computers and  
Peripherals  
www.ti.com/computers  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Consumer Electronics  
Energy  
www.ti.com/consumer-apps  
www.ti.com/energy  
Logic  
Industrial  
www.ti.com/industrial  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Medical  
www.ti.com/medical  
microcontroller.ti.com  
www.ti-rfid.com  
Security  
www.ti.com/security  
Space, Avionics &  
Defense  
www.ti.com/space-avionics-defense  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2010, Texas Instruments Incorporated  

相关型号:

BQ24092DGQR

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24092DGQT

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24092DSGT

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24093

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24093DGQR

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24093DGQT

1A, Single-Input, Single Cell Li-Ion Battery Charger
TI

BQ24095

1A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
TI

BQ24095DGQR

1A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
TI

BQ24095DGQT

1A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
TI

BQ24095DSQR

1A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
TI

BQ24095DSQT

1A, Single-Input, Single Cell Li-Ion and Li-Pol Battery Charger
TI

BQ24100

SYNCHRONOUS SWITCHMODE, LI-ION AND LI-POL CHARGE MANAGEMENT IC WITH INTEGRATED POWERFETS
TI