BQ24202DGNRG4 [TI]

SINGLE-CHIP LI-ION AND LI-POL CHARGE MANAGEMENT IC FOR CURRENT-LIMITED APPLICATIONS; 单片锂离子和锂聚合物充电管理IC电流受限型应用
BQ24202DGNRG4
型号: BQ24202DGNRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

SINGLE-CHIP LI-ION AND LI-POL CHARGE MANAGEMENT IC FOR CURRENT-LIMITED APPLICATIONS
单片锂离子和锂聚合物充电管理IC电流受限型应用

电源电路 电源管理电路 光电二极管 监视器
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bq24200, bq24201  
bq24202, bq24203  
bq24204, bq24205  
www.ti.com  
SLUS501COCTOBER 2001REVISED MARCH 2008  
SINGLE-CHIP LI-ION AND LI-POL CHARGE MANAGEMENT IC FOR CURRENT-LIMITED  
APPLICATIONS  
1
FEATURES  
DESCRIPTION  
Designed Specifically to Work With  
Current-Limited Wall Supplies  
The bq2420x series are simple Li-Ion linear charge  
management devices targeted at low-cost and space  
limited charger applications. The bq2420x series offer  
Ideal for Low Dropout Charger Design for  
Single-Cell Li-Ion Packs With Coke or Graphite  
Anodes  
integrated  
powerFET,  
high-accuracy  
voltage  
regulation, temperature monitoring, charge status,  
and charge termination, in a single monolithic device.  
Integrated PowerFET for 500 mA  
Integrated Voltage Regulation With 0.5%  
Accuracy  
The bq2420x is designed to work with  
a
current-limited wall-mount transformer and therefore  
does not provide any current regulation. However,  
these devices offer a fixed internal current limit to  
Battery Insertion and Removal Detection  
Charge Termination by Minimum Current and  
Time  
prevent damage to the internal powerFET.  
A
time-limited pre-conditioning phase is provided to  
condition deeply discharged cells. Once the battery  
reaches the charge voltage, the high accuracy  
voltage regulation loop takes over and completes the  
charge cycle. Charge is terminated based on  
minimum current. An internal charge timer provides a  
backup safety for charge termination.  
Pre-Charge Conditioning With Safety Timer  
Sleep Mode for Low-Power Consumption  
Charge Status Output for LED or Host  
Processor Interface Indicates  
Charge-in-Progress, Charge Completion, and  
Fault Conditions  
Other standard features include an automatic sleep  
mode activated when VCC falls below the battery  
voltage and a recharge feature activated when the  
battery voltage falls below the VRCH threshold.  
Optional Temperature Monitoring Before and  
During Charge  
Small, 8-Pin Power-Pad MSOP Package  
In addition to the standard features, the core product  
provides two additional enhancements: temperature  
monitoring and status display. The temperature-  
sense circuit continuously measures battery  
temperature using an external thermistor and inhibits  
charge until the battery temperature is within the  
user-defined thresholds. The STAT pin indicates  
three conditions of operation of the charger. These  
conditions are charge-in-progress, charge complete,  
and fault. This output can be used to drive an LED or  
an interface to a microcontroller.  
TYPICAL APPLICATION  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
bq24200, bq24201  
bq24202, bq24203  
bq24204, bq24205  
www.ti.com  
SLUS501COCTOBER 2001REVISED MARCH 2008  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
AVAILABLE OPTIONS  
CHARGE  
REGULATION  
VOLTAGE  
PACKAGED  
DEVICES  
(DGN)(1)  
OPTIONAL  
FUNCTIONS  
TJ  
MARKING  
4.2 V  
4.1 V  
4.2 V  
4.1 V  
4.2 V  
4.1 V  
STAT and TS  
AZC  
AZD  
AZE  
AZF  
AZG  
AZI  
bq24200DGN  
bq24201DGN  
bq24202DGN  
bq24203DGN  
bq24204DGN  
bq24205DGN  
STAT and TS  
STAT  
STAT  
–40°C to 125°C  
(1) The DGN package is available taped and reeled. Add TR suffix to device type (e.g. bq24200DGNTR) to order. Quantities 2500 devices  
per reel.  
TERMINAL FUNCTIONS  
TERMINAL  
NO.  
I/O  
DESCRIPTION  
NAME  
bq24200  
bq24201  
bq24202  
bq24203  
bq24204  
bq24205  
BAT  
CE  
7
1
5
8
3
6
2
4
7
6
1
5
8
3
2
4
7
6
I
I
Battery voltage sense input  
Charge enable input (active low)  
Charge input voltage  
No connection. Must be left floating  
Charge current output  
Charge status output  
Temperature sense input  
VCC input  
IN  
1
I
N/C  
OUT  
STAT  
TS  
3, 5  
8
O
O
I
VCC  
VSS  
2
I
4
Ground input  
2
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bq24200, bq24201  
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bq24204, bq24205  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
16.5  
UNIT  
V
Supply voltage (Vcc with respect to GND)  
Input voltage, IN, STAT, TS (all with respect to GND)  
Input voltage, BAT, OUT (all with respect to GND)  
Output sink/source current (STAT)  
16.5  
V
7
V
15  
mA  
°C  
°C  
°C  
Tstg  
TJ  
Storage temperature range  
–65 to 150  
–40 to 125  
300  
Junction temperature range  
Lead temperature (soldering, 10 sec)  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.  
DISSIPATION RATINGS  
THERMAL IMPEDANCE  
JUNCTION-TO-AMBIENT (θJA  
THERMAL IMPEDANCE  
JUNCTION-TO-CASE (θJC  
T
A 25°C  
DERATING FACTOR  
ABOVE TA = 25°C  
PACKAGE  
)
)
POWER RATING  
8 Pin DGN(1)  
57.20°C/W  
4.4°C/W  
1.75 W  
0.017 W/°C  
(1) This data is based on using JEDEC High-K board and topside traces, top and bottom thermal pad (2 mm × 3 mm), internal 1 oz. power  
and ground planes, four thermal via underneath the die connecting to ground plane.  
RECOMMENDED OPERATING CONDITIONS  
MIN  
V(LOWV-MIN)  
V(LOWV-MIN)  
–40  
MAX  
13.5  
13.5  
125  
UNIT  
V
VCC  
VIN  
TJ  
Supply voltage  
Input voltage  
Operating junction temperature range  
°C  
ELECTRICAL CHARACTERISTICS  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
Vcc Current  
TEST CONDITIONS  
MIN  
TYP  
1.7  
MAX  
UNIT  
mA  
ICC(VCC)  
Vcc > Vcc(min)  
2.5  
5
Sum of currents into OUT and BAT pins, Vcc <  
µA  
V(SLP), 0°C TJ 85°C  
ICC(SLP)  
Sleep current  
Sum of currents into OUT and BAT pins, Vcc <  
V(SLP)  
10  
1
µA  
ICC(STDBY Standby current  
Sum of currents into Vcc, IN and TS pins,  
mA  
(Vcc–VI(TS)) 300 mV  
)
IIB(BAT)  
IIB(TB)  
Input bias current on BAT pin  
Input bias current on TS pin  
1
1
µA  
µA  
0.1 × Vcc VI(TS) 0.8 × Vcc  
VOLTAGE REGULATION  
VO(REG) + V(DO.MAX) VCC, I(TERM) < IO(OUT) 500 mA, over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
4.0795  
4.05  
TYP  
4.10 4.1205  
4.10 4.15  
4.20 4.2210  
MAX UNIT  
VO(REG) + V(DO–MAX) 10 V, I(TERM) < IO(OUT) 250 mA  
V
V
VO(REG) Output voltage  
VO(REG) + V(DO–MAX) 10 V, I(TERM) < IO(OUT) 250 mA  
4.1790  
4.15  
V
4.20  
350  
4.25  
500  
V
V(DO)  
Dropout voltage (V(IN) – V(OUT)  
)
VO(REG) + V(DO–MAX) Vcc, IO(OUT) = 500 mA  
200  
mV  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
OUTPUT CURRENT  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
Output current  
Short-circuit trip current  
(1) Assured by design, not production tested.  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
(1)  
(1)  
IO(OUT)  
I(SC)  
See  
See  
500  
1.6  
mA  
A
1
PRE-CHARGE CURRENT REGULATION  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
Pre-charge current  
Battery detection current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
mA  
I(PRECHG)  
I(DETECT)  
VI(BAT) < V(LOWV), t < t(30min)  
VI(BAT) < 2.5 V, t < t(30min)  
10  
13.5  
210  
19  
160  
300  
µA  
CHARGE TERMINATION DETECTION  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
21  
TYP  
25.5  
1.1  
MAX  
31  
UNIT  
mA  
I(TAPER)  
I(TERM)  
Taper current detect threshold  
VI(BAT) > V(RCH)  
VI(BAT) > V(RCH)  
Charge termination current detect  
threshold  
0.8  
1.4  
mA  
TEMPERATURE COMPARATOR  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
Lower temperature threshold  
Upper temperature threshold  
Accuracy  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
%VCC  
V(TS1)  
V(TS2)  
TS pin voltage  
TS pin voltage  
30  
60  
%VCC  
–0.7  
0.7 %VCC  
%VCC  
Hysteresis  
1
LOW VOLTAGE BATTERY THRESHOLD  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
2.8  
TYP  
2.95  
3.0  
MAX UNIT  
0°C TJ 85°C  
3.1  
3.2  
V
V
V(LOWV)  
LowV threshold  
2.8  
BATTERY RECHARGE THRESHOLD  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VO(REG) VO(RE VO(REG)  
Recharge threshold, VRCH (typically 100 mV below  
regulation)  
–0.115  
–0.085  
V
G)  
–0.1  
STAT OUTPUT  
Vcc VO(REG) , over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VOL(STAT)  
VOH(STAT)  
Output (low) saturation voltage  
Output (high) saturation voltage  
IO = 10 mA  
IO = –5 mA  
0.5  
V
V
Vcc–1.5  
4
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SLUS501COCTOBER 2001REVISED MARCH 2008  
CE  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VIL(CE)  
VIH(CE)  
Input (low) voltage  
IIL = 5 µA  
0
Vcc–1  
V
V
IIH = 20 µA  
Vcc–0  
.3  
Input (high) voltage  
TIMERS  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
t(PRECH Pre-charge and taper timer  
1,548 2,065 2,581  
sec  
G)  
t(TAPER) Taper timer  
1,548 2,065 2,581  
9,292 12,38 15,48  
sec  
sec  
t(CHG)  
Charge timer  
9
6
SLEEP COMPARATOR  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
2.3 V VI(BAT) VO(REG)  
MIN  
TYP  
MAX  
UNIT  
V(SLP)  
Sleep-mode threshold  
V(BAT)  
–10mV  
V
POWER-ON-RESET AND VIN RAMP RATE  
over 0°C TJ 125°C and supply voltage range (unless otherwise noted)  
PARAMETER  
POR threshold  
Slew rate  
(1) Ensured by design, not production tested.  
TEST CONDITIONS  
MIN  
2.3  
5
TYP  
MAX UNIT  
(1)  
(1)  
VPOR  
See  
See  
2.4  
2.5  
V
5×10–5  
V/µs  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
FUNCTIONAL BLOCK DIAGRAM  
DETAILED DESCRIPTION  
IN: This pin is connected to the source of the internal P-channel powerFET.  
OUT: This pin is connected to the drain of the internal P-channel powerFET.  
Battery voltage sense (BAT): Voltage sense-input tied directly to the positive side of the battery.  
Temperature sense input (TS): Input for an external battery-temperature monitoring circuit.  
Charge status output (STAT): High-impedance indication of various charge conditions.  
Supply voltage input (VCC): Power supply input  
6
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bq24200, bq24201  
bq24202, bq24203  
bq24204, bq24205  
www.ti.com  
SLUS501COCTOBER 2001REVISED MARCH 2008  
TYPICAL CHARACTERISTICS  
OUTPUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
DROPOUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
Figure 1.  
Figure 2.  
DROPOUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
SUPPLY CURRENT  
vs  
JUNCTION TEMPERATURE  
Figure 3.  
Figure 4.  
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bq24200, bq24201  
bq24202, bq24203  
bq24204, bq24205  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
APPLICATION INFORMATION  
Figure 5. Low Dropout Single-Cell Li-Ion/Li-Pol Charger  
FUNCTIONAL DESCRIPTION  
The bq2420x supports a precision Li-Ion or Li-Pol charging system suitable for single-cells with either coke or  
graphite anodes. Figure 5 shows an application schematic and Figure 6 shows the typical charge profile.  
TEMPERATURE QUALIFICATION (bq24200 and bq24202 only)  
The bq24200 and bq24201 continuously monitors battery temperature by measuring the voltage between the TS  
and VSS pins. A negative- or a positive-temperature coefficient thermistor (NTC, PTC) and an external voltage  
divider typically develop this voltage (see Figure 5). The bq24200 and bq24201 compare this voltage against the  
internal V(TS1) and V(TS2) thresholds to determine if charging is allowed (see Figure 7). The temperature sensing  
circuit is immune to any fluctuation in Vcc since both the external voltage divider and the internal thresholds are  
referenced to Vcc.  
Once a temperature outside the V(TS1) and V(TS2) thresholds is detected the bq24200 and bq24201 immediately  
suspend the charge. The bq24200 and bq24201 suspend the charge by turning off the power FET and holding  
the timer value (i.e., timers are NOT reset). Charge is resumed when the temperature returns to the normal  
range.  
8
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bq24204, bq24205  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
Figure 6. Typical Charge Profile  
Figure 7. TS Pin Thresholds  
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bq24204, bq24205  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
OPERATIONAL FLOW DIAGRAM  
Figure 8. Operational Flow Chart  
The resistor values of RT1 and RT2 are calculated by the following equations:  
For NTC Thermistors:  
10  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
ǒ5   RT   RTCǓ  
H
RT1  
+ ǒ  
3   ǒRT * RT  
Ǔ
H Ǔ  
C
(1)  
(2)  
ǒ5   RT   RTCǓ  
H
R
+ ǒ2   RT Ǔ * ǒ7   RTHǓ  
T2  
C
For PTC Thermisters:  
ǒ5   RT   RTCǓ  
H
RT1  
+ ǒ  
3   ǒRT * RT  
Ǔ
C Ǔ  
H
(3)  
(4)  
ǒ5   RT   RTCǓ  
H
R
+ ǒ2   RT Ǔ * ǒ7   RTCǓ  
T2  
H
Where RTC is the cold temperature resistance and RTH is the hot temperature resistance of thermistor, as  
specified by the thermistor manufacturer.  
RT1 or RT2 can be omitted If only one temperature (hot or cold) setting is required. Applying a voltage between  
the VTS1 and VTS2 thresholds to pin TS disables the temperature-sensing feature. Also applying a voltage  
between (VCC – 0.3 V) and Vcc suspends the charge and places the IC in the low-power standby mode.  
BATTERY PRE-CONDITIONING  
Figure 7 shows the operational flow chart for the bq2420x.  
Upon power-up, if the battery voltage is below the V(LOWV) threshold, the bq2420x applies a pre-charge current,  
I(PRECHG), to the battery. This feature revives deeply discharged cells. The bq2420x activates a safety timer,  
t(PRECHG), during the conditioning phase. If V(LOWV) threshold is not reached within the timer period, the bq2420x  
turns off the charger and enunciates FAULT on the STAT pin. In the case of a FAULT condition, the bq2420x  
reduces the current to I(DETECT). I(DETECT) is used to detect a battery replacement condition. Fault condition is  
cleared by POR or battery replacement.  
BATTERY CHARGE CURRENT  
Following a successful pre-conditioning, the bq2420x relies on an external current-limited supply to limit the  
charge current to the cell. The bq2420x continues this phase until the battery reaches the voltage regulation  
phase.  
During this phase (and all other phases of operation) in order to protect the integrated powerFET, the internal  
short circuit and thermal protection circuits are active.  
BATTERY VOLTAGE REGULATION  
The voltage regulation feedback is through the BAT pin. This input is tied directly to the positive side of the  
battery pack. The bq2420x monitors the battery-pack voltage between the BAT and VSS pins. The bq2420x is  
offered in two fixed-voltage versions: 4.1 V and 4.2 V.  
As a safety backup, the bq2420x also monitors the charge time in the voltage regulation mode. If taper current is  
not detected within this time period, t(CHG), the bq2420x turns off the charger and enunciates FAULT on the STAT  
pin. Fault condition is cleared by POR or battery replacement. Note that the safety timer is reset if the bq2420x is  
forced out of the voltage regulation mode.  
CHARGE TERMINATION AND RECHARGE  
The bq2420x monitors the charging current during the voltage regulation phase. Once the taper threshold,  
I(TAPER), is detected the bq2420x initiates the taper timer, t(TAPER). Charge is terminated after the timer expires.  
The bq2420x resets the taper timer in the event that the charge current returns above the taper threshold,  
I(TAPER)  
.
In addition to the taper current detection, the bq2420x terminates charge in the event that the charge current falls  
below the I(TERM) threshold. This feature allows for quick recognition of a battery removal condition.  
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SLUS501COCTOBER 2001REVISED MARCH 2008  
After a charge termination, the bq2420x restarts the charge once the voltage on the BAT pin falls below the  
V(RCH) threshold. This feature keeps the battery at full capacity at all times.  
SLEEP MODE  
The bq2420x enters the low-power sleep mode if the Vcc is removed from the circuit (i.e., the Vcc and IN pins  
are floating). For applications where these pins are not floating, placing a low-power 10 (1/16 W) between the  
IN and VCC pins ensures the V(SLP) conditions are met (see Figure 9).This feature prevents draining the battery  
during the absence of VCC  
.
Figure 9. Sleep Mode  
CHARGE ENABLE PIN  
The CE pin on bq24202, bq24203, bq24204 and bq24205 can be used to enable or suspend the charge. Charge  
is enabled if the voltage VIL(CE) is applied to the pin. Applying the VIH(CE) suspends the charge. During a charge  
suspend mode, the internal powerFET is turned off and all timers are reset.  
CHARGE STATUS OUTPUT  
The STAT pin on the bq2420x, indicates various conditions of operation. These conditions are summarized in  
Table 1.  
Table 1. STAT Pin  
CONDITION  
Pre-charge  
STAT  
High  
High  
Low  
Low  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
Hi-Z  
Fast-charge  
Charge-complete  
Taper timer done  
Charge suspend (due to temperature or CE input)  
Thermal shutdown  
Pre-charge timer fault  
Sleep mode  
Charge timer fault  
12  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Oct-2013  
PACKAGING INFORMATION  
Orderable Device  
BQ24200DGN  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
MSOP-  
PowerPAD  
DGN  
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
80  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Call TI  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Call TI  
AZC  
AZC  
AZC  
AZC  
AZD  
AZD  
AZE  
AZE  
AZE  
AZE  
AZF  
AZF  
AZG  
AZG  
BQ24200DGNG4  
BQ24200DGNR  
BQ24200DGNRG4  
BQ24201DGN  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
OBSOLETE  
ACTIVE  
ACTIVE  
MSOP-  
PowerPAD  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
DGN  
80  
2500  
2500  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
Green (RoHS  
& no Sb/Br)  
BQ24201DGNG4  
BQ24202DGN  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
BQ24202DGNG4  
BQ24202DGNR  
BQ24202DGNRG4  
BQ24203DGN  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
2500  
2500  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
Green (RoHS  
& no Sb/Br)  
BQ24203DGNG4  
BQ24204DGN  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
BQ24204DGNG4  
BQ24204DGNRG4  
BQ24205DGN  
MSOP-  
PowerPAD  
80  
Green (RoHS  
& no Sb/Br)  
MSOP-  
PowerPAD  
TBD  
MSOP-  
PowerPAD  
80  
80  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
AZI  
AZI  
BQ24205DGNG4  
MSOP-  
Green (RoHS  
& no Sb/Br)  
PowerPAD  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Oct-2013  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Aug-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
2500  
2500  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ24200DGNR  
BQ24202DGNR  
MSOP-  
Power  
PAD  
DGN  
DGN  
8
8
330.0  
330.0  
12.4  
12.4  
5.3  
5.3  
3.4  
3.4  
1.4  
1.4  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
MSOP-  
Power  
PAD  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Aug-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ24200DGNR  
BQ24202DGNR  
MSOP-PowerPAD  
MSOP-PowerPAD  
DGN  
DGN  
8
8
2500  
2500  
358.0  
358.0  
335.0  
335.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
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requirements. Nonetheless, such components are subject to these terms.  
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
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Applications  
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www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
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Communications and Telecom www.ti.com/communications  
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Data Converters  
DLP® Products  
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Copyright © 2013, Texas Instruments Incorporated  

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