BQ27425YZFT-G2A [TI]
适用于钴酸锂电池的系统侧 Impedance Track™ 电量监测计 | YZF | 15 | -40 to 85;
| 型号： | BQ27425YZFT-G2A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于钴酸锂电池的系统侧 Impedance Track™ 电量监测计 | YZF | 15 | -40 to 85 电池 |
| 文件： | 总36页 (文件大小：1355K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
bq27425-G2
www.ti.com.cn
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
系统一侧 Impedance Track™™ 具有集成感测电阻器的电量计
查询样品: bq27425-G2
1
特性
应用范围
23
•
单节串联锂离子电池电量计
•
•
•
•
智能手机、功能型手机和平板电脑
数码相机与数码摄像机
手持终端设备
–
–
–
驻留在系统主板上
支持嵌入式或可拆除电池
由具有集成低压降稳压器 (LDO) 的电池直接供
电
MP3 或多媒体播放器
说明
–
低值集成感测电阻器
（典型值 10mΩ）
德州仪器 (TI) bq27425 是一款易于配置的微控制器外
设，此外设提供针对单节锂离子电池的系统侧电量监
测。 此器件要求最小用户配置和系统微控制器固件开
发。
•
•
根据已获专利的 Impedance Track™™ 技术可以
很轻松的进行电量计量监测
–
–
–
用平滑滤波器报告剩余电量和充电状态 (SOC)
针对电池老化、温度和速率变化进行自动调节
电池健康状况（老化）估计
bq27425 采用获专利的 Impedance Track™ 算法支持
电量监测，可提供剩余电池容量 (mAh)，充电状态 (%)
和电池电压 (mV) 等信息。
微控制器外设支持：
–
–
400kHz I2C ™ 串行接口
通过 bq27425 进行电池电量监测只需将 PACK+ (P+)
与 PACK- (P-) 连接至可拆卸电池组或嵌入式电池电
路。 15 引脚 2.69mm x 1.75mm，0.5mm 焊球间距
CSP 封装非常适合于空间受限类应用。
可配置的 SOC 中断，或
电池低数字输出报警
–
内部温度传感器，或
主机报告的温度
•
15 引脚 2.69mm x 1.75mm，0.5mm 焊球间距
CSP 封装
TYPICAL APPLICATION
Single Cell Li-Ion
Battery Pack
Voltage
Sense
VBAT
PACK +
PROTECTION
IC
VCC
REGIN
LDO
System
Interface
bq27425
To Charger
T
DATA
I2C
SRX
VSS
CHG
DSG
GPOUT
BIN
FETs
PACK -
Integrated
Current
Sense
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Impedance Track™ is a trademark of Texas Instruments.
2
3
is a trademark of ~NXP B.V. Corp Netherlands.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012–2013, Texas Instruments Incorporated
English Data Sheet: SLUSB23
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DEVICE INFORMATION
AVAILABLE OPTIONS
TAPE and
REEL
FORMAT QUANTITY
FIRMWARE
COMM.
BATTERY
TYPE
CHEM_ID
VERSION
PACKAGE
(1)
(2)
(3)
PART NUMBER
bq27425YZFR-G2A
bq27425YZFT-G2A
bq27425YZFR-G2B
bq27425YZFT-G2B
TA
3000
LiCoO2
(4.2 V max charge)
0x128
0x312
250
2.05
(0x0205)
–40°C to
85°C
CSP-15
I2C
3000
LiMn2O4
(4.3 - 4.35 V max charge)
250
(1) Refer to the CHEM_ID subcommand to confirm the battery chemistry type.
(2) Refer to the FW_VERSION subcommand to confirm the firmware version.
(3) For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI
website at www.ti.com.
THERMAL INFORMATION
bq27425-G2
THERMAL METRIC(1)
UNITS
YZF (15-PINS)
θJA
Junction-to-ambient thermal resistance
70
17
20
1
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
18
n/a
θJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
www.ti.com.cn
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
PIN DIAGRAM AND PACKAGE DIMENSIONS
(TOP VIEW)
(BOTTOM VIEW)
A3
A2
A1
B3
B2
B1
C3
C2
C1
E3
E2
E1
E3
E2
E1
D3
D2
D1
C3
C2
C1
B3
B2
B1
A3
A2
A1
D3
D2
D1
E
Pin A1
Index Area
D
DIM
MIN
TYP
MAX
2720
1780
UNITS
D
E
2660
1720
2690
1750
ꢀm
PIN FUNCTIONS
PIN
TYPE(1)
DESCRIPTION
NAME
SRX
NO.
Integrated Sense Resistor and Coulomb Counter input typically connected to battery PACK- terminal. For best
performance decouple with 0.1μF ceramic capacitor to Vss.
B1
IA
VSS
C1
D1
E1
D2
E2
P, IA
Device ground and Integrated Sense Resistor termination.
VCC
P
P
I
Regulator output and bq27425 processor power. Decouple with 1μF ceramic capacitor to Vss.
Regulator input. Decouple with 0.1μF ceramic capacitor to Vss.
REGIN
CE
Chip Enable. Internal LDO is disconnected from REGIN when driven low.
Cell-voltage measurement input. ADC input. Recommend 4.8V maximum for conversion accuracy.
BAT
I
Slave I2C serial communications clock input line for communication with system (Master). Use with 10kΩ pull-up
resistor (typical).
SCL
SDA
A3
B3
I
Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10kΩ
pull-up resistor (typical).
I/O
Battery-insertion detection input. A logic high to low transition is detected as a battery insertion event. Recommend
using a pull-up resistor >1MΩ (1.8 MΩ typical) to VCC for reduced power consumption. An internal pull-up resistor
option is also available using the Operation Configuration[BI_PU_EN] register bit.
BIN
C3
I
General Purpose open-drain output. May be configured as a Battery Low indicator or perform SOC interrupt
(SOC_INT) function.
GPOUT
A2
O
A1, B2
N/A
I/O
No internal connection. May be left floating.
NC
C2, D3,
E3
Reserved for factory use. Must be left floating for proper operation.
(1) I/O = Digital input/output, IA = Analog input, P = Power connection
Copyright © 2012–2013, Texas Instruments Incorporated
3
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
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ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
VALUE
–0.3 to 6.0
–0.3 to 2.75
–0.3 to 6.0
–0.3 to 6.0
–0.3 to VCC + 0.3
–40 to 85
UNIT
V
VREGIN
VCC
VIOD
VBAT
VI
Regulator input range
Supply voltage range
V
Open-drain I/O pins (SDA, SCL, GPOUT)
BAT input pin
V
V
Input voltage range to all other pins (SRX, BIN)
Operating free-air temperature range
Storage temperature range
V
TA
°C
°C
Tstg
–65 to 150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
TA = 25°C and VREGIN = VBAT = 3.6V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
2.8
TYP
MAX
4.5
UNIT
No operating restrictions
VREGIN
Supply voltage
V
No NVM writes
2.45
2.8
External input capacitor for internal
LDO between REGIN and VSS
CREGIN
CLDO25
ICC
0.1
1
μF
μF
μA
μA
μA
μA
V
Nominal capacitor values specified.
Recommend a 5% ceramic X5R type
capacitor located close to the device.
External output capacitor for internal
LDO between VCC and VSS
0.47
Fuel gauge in NORMAL mode.
ILOAD > Sleep Current
NORMAL operating-mode current(1)
118
23
8
SLEEP mode operating mode
current(1)
Fuel gauge in SLEEP mode.
ILOAD < Sleep Current
ISLP
HIBERNATE operating-mode
current(1)
Fuel gauge in HIBERNATE mode.
ILOAD < Hibernate Current
IHIB
Fuel gauge in SHUTDOWN mode.
CE Pin < VIL(CE) max.
ISHD
SHUTDOWN mode current(1)
1
Output low voltage on open-drain
pins (SCL, SDA, GPOUT)
VOL(OD)
IOL = 1 mA
0.4
0.6
Output high voltage on open-drain
pins (SDA, SCL, GPOUT)
External pullup resistor connected to VCC
VOH(OD)
VIL
VCC – 0.5
V
Input low voltage, all digital pins
Input high voltage (SDA, SCL)
Input high voltage (BIN)
V
V
V
V
1.2
1.2
VIH
VA2
Input voltage range (BAT)
VSS
–
5
0.040
0.3
0.125
(1)(2)
VA3
Input voltage range (SRX)
VSS
–
V
0.040
Ilkg
Input leakage current (I/O pins)
Power-up communication delay
μA
tPUCD
250
ms
(1) Specified by design. Not production tested.
(2) Limited by ISRX maximum recommend input current with some margin for the Integrated Sense Resistor tolerance
POWER-ON RESET
TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIT+
Positive-going voltage on VCC
(Regulator output)
1.98
2.20
2.31
V
VHYS
Power-on reset hysteresis
43
115
185
mV
4
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
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ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
2.5V LDO REGULATOR
TA = –40°C to 85°C, CLDO25 = 1μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
NOM
MAX
UNIT
2.7V ≤ VREGIN ≤ 4.5V, IOUT ≤ 5mA
2.45V ≤ VREGIN < 2.7V (low battery),
2.4
2.5
2.6
V
VREG25
Regulator output voltage
2.4
V
V
IOUT ≤ 3mA
VIH(CE)
VIL(CE)
CE High-level input voltage
CE Low-level input voltage
2.65
VREGIN = 2.7 to 4.5V
0.8
INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
Input voltage range
Conversion time
Resolution
TEST CONDITIONS
VSR = V(SRX) – VSS
Single conversion
MIN
TYP
MAX
UNIT
V
(1)(2)
VSR
–0.040
0.040
tSR_CONV
1
s
14
15
bits
μV
VOS(SR)
INL
Input offset
10
Integral nonlinearity error
Effective input resistance(1)
Input leakage current(1)
±0.007
±0.034 % FSR
ZIN(SR)
Ilkg(SR)
2.5
MΩ
TA = 25°C
0.3
μA
(1) Specified by design. Not tested in production.
(2) Limited by ISRX maximum recommend input current with some margin for the Integrated Sense Resistor tolerance.
INTEGRATED SENSE RESISTOR CHARACTERISTICS
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SRXRES
ISRX
Resistance of Integrated Sense TA = 25°C
Resistor from SRX to VSS.(1)(2)
10
mΩ
Recommended Sense Resistor Long term RMS, average device
2000
2500
3500
mA
mA
mA
input current.(1)(3)
utilization.
Peak RMS current, 10% device
utilization.(3)
Peak pulsed current, 250mS max,
1% device utilization.(3)
(1) Specified by design. Not tested in production.
(2) Firmware compensation applied for temperature coefficient of resistor.
(3) Device utilization is the long term usage profile at a specific condition compared to the average condition.
ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIN(ADC)
GTEMP
Input voltage range
0.05
1
Temperature sensor voltage
gain
–2
mV/°C
tADC_CONV
Conversion time
Resolution
125
15
ms
bits
mV
MΩ
kΩ
14
8
VOS(ADC)
ZADC
Input offset
1
Not measuring cell voltage
Measuring cell voltage
TA = 25°C
Effective input resistance
(BAT)(1)
100
Ilkg(ADC)
Input leakage current(1)
0.3
μA
(1) Specified by design. Not tested in production.
Copyright © 2012–2013, Texas Instruments Incorporated
5
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
EEPROM MEMORY CHARACTERISTICS
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Bytes
Years
Cycles
Array Size
256
Data retention(1)
Programming write cycles(1)
10
100K
(1) Specified by design. Not production tested
I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
300
UNIT
ns
tr
SCL/SDA rise time
SCL/SDA fall time
tf
300
ns
tw(H)
SCL pulse duration (high)
SCL pulse duration (low)
Setup for repeated start
Start to first falling edge of SCL
Data setup time
600
1.3
600
600
100
0
ns
tw(L)
μs
ns
tsu(STA)
td(STA)
tsu(DAT)
th(DAT)
tsu(STOP)
t(BUF)
ns
ns
Data hold time
ns
Setup time for stop
600
66
ns
Bus free time between stop and
start
μs
fSCL
Clock frequency(1)
400
kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (Refer to I2C INTERFACE and I2C Command Waiting Time)
t
t
t
t
t
f
t
r
(BUF)
SU(STA)
w(H)
w(L)
SCL
SDA
t
t
t
d(STA)
su(STOP)
f
t
r
t
t
su(DAT)
h(DAT)
REPEATED
START
STOP
START
Figure 1. I2C-Compatible Interface Timing Diagrams
6
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
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ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
GENERAL DESCRIPTION
The bq27425 accurately predicts the battery capacity and other operational characteristics of a single Li-based
rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-of-
charge (SOC).
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command( ), are used to read and write information contained within the bq27425 control and status registers,
as well as its data locations. Commands are sent from system to gauge using the bq27425’s I2C serial
communications engine, and can be executed during application development, system manufacture, or end-
equipment operation.
The key to the bq27425’s high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance
Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-
charge predictions that can achieve high accuracy across a wide variety of operating conditions and over the
lifetime of the battery.
The bq27425 measures charge/discharge activity by monitoring the voltage across a small-value integrated
sense resistor (10 mΩ typical) located between the system’s Vss and the battery’s PACK– terminal. When a cell
is attached to the bq27425, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV),
and cell voltage under loading conditions.
The bq27425 uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host
processor can provide temperature data for the bq27425.
To minimize power consumption, the bq27425 has several power modes: INITIALIZATION, NORMAL, SLEEP,
and HIBERNATE. The bq27425 passes automatically between these modes, depending upon the occurrence of
specific events, though a system processor can initiate some of these modes directly. More details can be found
in Section Power Modes.
NOTE
FORMATTING CONVENTIONS IN THIS DOCUMENT:
Commands: italics with parentheses and no breaking spaces, that is,
RemainingCapacity( ).
NVM Data: italics, bold, and breaking spaces, that is, Design Capacity.
Register bits and flags: brackets and italics, that is, [TDA]
NVM Data bits: brackets, italics and bold, that is: [LED1]
Modes and states: ALL CAPITALS, that is, UNSEALED mode.
Copyright © 2012–2013, Texas Instruments Incorporated
7
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
DATA COMMANDS
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Standard Data Commands
The bq27425 uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. Additional options for
transferring data, such as spooling, are described in Section, I2C INTERFACE. Standard commands are
accessible in NORMAL operation. Read/Write permissions depend on the active access mode, SEALED or
UNSEALED (for details on the SEALED and UNSEALED states, refer to Section Access Modes.)
Note: Data values read by the host may be invalid during initialization for a period of up to 3 seconds.
Table 1. Standard Commands
NAME
COMMAND
CODE
UNITS
SEALED ACCESS
Control( )
CNTL
TEMP
VOLT
0x00 / 0x01
0x02 / 0x03
0x04 / 0x05
0x06 / 0x07
0x08 / 0x09
0x0a / 0x0b
0x0c / 0x0d
0x0e / 0x0f
0x10 / 0x11
0x16 / 0x17
0x18 / 0x19
0x1c / 0x1d
0x1e / 0x1f
0x20 / 0x21
0x2c / 0x2d
0x32 / 0x33
0x3a / 0x3b
0x3c / 0x3d
N/A
0.1°K
mV
R/W
R/W
R
Temperature( )
Voltage( )
Flags( )
FLAGS
N/A
mAh
mAh
mAh
mAh
mA
R
NominalAvailableCapacity( )
FullAvailableCapacity( )
RemainingCapacity( )
FullChargeCapacity( )
AverageCurrent( )
Debug1( )
R
R
RM
R
FCC
R
R
num
mW
%
R
AveragePower( )
StateOfCharge( )
IntTemperature( )
StateOfHealth( )
R
SOC
SOH
R
0.1°K
%
R
R
Debug2( )
num
num
N/A
mAh
R
Debug3( )
R
OperationConfiguration( )
DesignCapacity( )
OpConfig
R
R
8
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
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ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
Control(): 0x00/0x01
Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control( ) command allows the system to control specific features of the
bq27425 during normal operation and additional features when the bq27425 is in different access modes, as
described in Table 2.
Table 2. Control( ) Subcommands
CNTL FUNCTION
CONTROL_STATUS
DEVICE_TYPE
CNTL DATA
0x0000
0x0001
0x0002
0x0007
0x0008
0x000c
0x000d
0x0011
0x0012
0x0013
SEALED ACCESS DESCRIPTION
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Reports the status of device.
Reports the device type (0x0425).
FW_VERSION
Reports the firmware version of the device.
PREV_MACWRITE
CHEM_ID
Returns previous MAC command code.
Reports the chemical identifier of the Impedance Track™ configuration
Forces the [BAT_DET] bit set when the [BIE] bit is 0.
Forces the [BAT_DET] bit clear when the [BIE] bit is 0.
Forces CONTROL_STATUS [HIBERNATE] to 1.
Forces CONTROL_STATUS [HIBERNATE] to 0.
BAT_INSERT
BAT_REMOVE
SET_HIBERNATE
CLEAR_HIBERNATE
SET_CFGUPDATE
Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters
CONFIG UPDATE mode.
SEALED
0x0020
0x0041
0x0042
No
No
No
Places the bq27425 in SEALED access mode.
Performs a full device reset.
RESET
SOFT_RESET
Gauge exits CONFIG UPDATE mode.
Copyright © 2012–2013, Texas Instruments Incorporated
9
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
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CONTROL_STATUS: 0x0000
Instructs the fuel gauge to return status information to control addresses 0x00/0x01. The status word includes the
following information.
Table 3. CONTROL_STATUS Bit Definitions
bit7
bit6
RSVD
bit5
SS
bit4
bit3
CCA
bit2
BCA
bit1
QMAX_UP
VOK
bit0
High Byte
Low Byte
RSVD
RSVD
CALMODE
SLEEP
RES_UP
RSVD
HIBERNATE
RSVD
LDMD
RUP_DIS
RSVD = Reserved.
SS = Status bit indicating the bq27425 is in the SEALED State. Active when set.
CALMODE = Status bit indicating the bq27425 is in calibration mode. Active when set.
CCA = Status bit indicating the bq27425 Coulomb Counter Auto-Calibration routine is active. The CCA routine will take place
approximately 3 minutes and 45 seconds after the initialization as well as periodically as conditions permit. Active when
set.
BCA = Status bit indicating the bq27425 board calibration routine is active. Active when set.
QMAX_UP = Status bit indicating Qmax has Updated. True when set. This bit is cleared after power on reset or when [BAT_DET] bit is
set. When this bit is cleared, it enables fast learning of battery Qmax.
RES_UP = Status bit indicating that resistance has been updated. True when set. This bit is cleared after power on reset or when
[BAT_DET] bit is set. Also this bit can only be set after Qmax is updated. ([QMAX_UP] set). When this bit is cleared, it
enables fast learning of battery impedance.
HIBERNATE = Status bit indicating a request for entry into HIBERNATE from SLEEP mode has been issued. True when set. Default is 0.
SLEEP = Status bit indicating the bq27425 is in SLEEP mode. True when set.
LDMD = Status bit indicating the algorithm is using constant-power mode. True when set. Default is 1. Note: The bq27425 always
uses constant-power mode.
RUP_DIS = Status bit indicating the bq27425 Ra table updates are disabled. Updates are disabled when set.
VOK = Status bit indicating cell voltages are OK for Qmax updates. True when set.
DEVICE_TYPE: 0x0001
Instructs the fuel gauge to return the device type to addresses 0x00/0x01. The value returned is 0x0425.
FW_VERSION: 0x0002
Instructs the fuel gauge to return the firmware version to addresses 0x00/0x01. Refer to AVAILABLE OPTIONS
for the expected data value.
PREV_MACWRITE: 0x0007
Instructs the fuel gauge to return the previous command written to addresses 0x00/0x01. The value returned is
limited to less than 0x0015.
CHEM_ID: 0x0008
Instructs the fuel gauge to return the chemical identifier for the Impedance Track™ configuration to addresses
0x00/0x01. Refer to AVAILABLE OPTIONS for the expected data value.
BAT_INSERT: 0X000C
This subcommand forces the Flags() [BAT_DET] bit to set when the battery insertion detection is disabled via
OpConfig[BIE=0]. In this case, the gauge does not detect battery insertion from the BIN pin’s logic state, but
relies on the BAT_INSERT host subcommand to indicate battery presence in the system. This subcommand also
starts Impedance Track™ gauging.
BAT_REMOVE: 0X000D
This subcommand forces the Flags() [BAT_DET] bit to clear when the battery insertion detection is disabled via
OpConfig[BIE=0]. In this case, the gauge does not detect battery removal from the BIN pin’s logic state, but
relies on the BAT_REMOVE host subcommand to indicate battery removal from the system.
10
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SET_HIBERNATE: 0x0011
Instructs the fuel gauge to force the CONTROL_STATUS[HIBERNATE] bit to 1. If the necessary conditions are
met, this enables the gauge to enter the HIBERNATE power mode after the transition to SLEEP power state is
detected. The [HIBERNATE] bit is automatically cleared upon exiting from HIBERNATE mode.
CLEAR_HIBERNATE: 0x0012
Instructs the fuel gauge to force the CONTROL_STATUS[HIBERNATE] bit to 0. This prevents the gauge from
entering the HIBERNATE power mode after the transition to SLEEP power state is detected. It can also be used
to force the gauge out of HIBERNATE mode.
SET_CFGUPDATE: 0x0013
Instructs the fuel gauge to set the Flags[CFGUPMODE] bit to 1 and enter CONFIG UPDATE mode. This
command is only available when the fuel gauge is UNSEALED. Note: A SOFT_RESET subcommand is typically
used to exit CONFIG UPDATE mode to resume normal gauging.
SEALED: 0x0020
Instructs the fuel gauge to transition from UNSEALED state to SEALED state. The fuel gauge should always be
set to SEALED state for use in end equipment.
RESET : 0x0041
This command instructs the fuel gauge to perform a full device reset and reinitialize RAM data to the default
values from ROM. The gauge sets the Flags[ITPOR] bit and enters the INITIALIZE mode. Refer to Figure 2. This
command is only available when the fuel gauge is UNSEALED.
SOFT_RESET : 0x0042
This command instructs the fuel gauge to perform a partial (soft) reset from any mode with an OCV
measurement. The Flags[ITPOR, CFGUPMODE] bits are cleared and a resimulation occurs to update
StateOfCharge( ). Refer to Figure 2. This command is only available when the fuel gauge is UNSEALED.
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Temperature( ): 0x02/0x03
This read-/write-word function returns an unsigned integer value of the temperature in units of 0.1 K measured by
the fuel gauge. If Op Config[TEMPS] bit = 0 (default), a read command will return the internal temperature sensor
value and write command will be ignored. If Op Config[TEMPS] bit = 1, a write command sets the temperature to
be used for gauging calculations while a read command returns to temperature previously written.
Voltage( ): 0x04/0x05
This read-only function returns an unsigned integer value of the measured cell-pack voltage in mV with a range
of 0 to 6000 mV.
Flags( ): 0x06/0x07
This read-word function returns the contents of the gas-gauge status register, depicting the current operating
status.
Table 4. Flags Bit Definitions
bit7
OT
bit6
UT
bit5
bit4
bit3
bit2
bit1
FC
bit0
CHG
DSG
High Byte
Low Byte
RSVD
ITPOR
RSVD
RSVD
EEFAIL
SOC1
OCVTAKEN
RSVD
CFGUPMODE BAT_DET
SOCF
OT = Over-Temperature condition is detected. [OT] is set when Temperature( ) ≥ Over Temp (default = 55 °C). [OT] is cleared
when Temperature( ) < Over Temp - Temp Hys.
UT = Under-Temperature condition is detected. [UT] is set when Temperature( ) ≤ Under Temp (default = 0 °C). [UT] is
cleared when Temperature( ) > Under Temp + Temp Hys.
RSVD = Reserved.
RSVD = Reserved.
RSVD = Reserved.
EEFAIL = EEPROM Write Fail. True when set. This bit is set after a single EEPROM write failure. All subsequent EEPROM writes
are disabled. A power on reset or RESET subcommand is required to clear the bit to re-enable EEPROM writes.
FC = Full-charge is detected. If the FC Set% (default =100%) is a positive threshold , [FC] is set when SOC ≥ FC Set % and is
cleared when SOC ≤ FC Clear % (default = 98%). Alternatively, if FC Set% = -1, [FC] is set when the fuel gauge has
detected charge termination.
CHG = Fast charging allowed. If the TCA Set% (Terminate Charge Alarm Set %) is a positive threshold (default = 99%), [CHG]
is cleared when SOC ≥ TCA Set % and is set when SOC ≤ TCA Clear % (default = 95%). Alternatively, if TCA Set% = -
1, the TCA thresholds are disabled and the [CHG] bit is cleared when the fuel gauge has detected a taper condition.
OCVTAKEN = Cleared on entry to relax mode and Set to 1 when OCV measurement is performed in relax
RSVD = Reserved.
ITPOR = Indicates a Power On Reset or RESET subcommand has occurred. True when set. This bit is cleared after the
SOFT_RESET subcommand is received.
CFGUPMODE = Fuel gauge is in CONFIG UPDATE mode. True when set. Default is 0. Refer to CONFIG UPDATE Mode section for
details.
BAT_DET = Battery insertion detected. True when set. When OpConfig[BIE]] is set, [BAT_DET] is set by detecting a logic high to low
transition at BIN pin. when OpConfig[BIE]] is low, [BAT_DET] is set when host issues BAT_INSERT subcommand and
clear when host issues BAT_REMOVE subcommand.
SOC1 = If set, StateOfCharge() <= SOC1 Set Threshold. The [SOC1] bit will remain set until StateOfCharge() >= SOC1 Clear
Threshold.
SOCF = If set, StateOfCharge() <= SOCF Set Threshold. The [SOCF] bit will remain set until StateOfCharge() >= SOCF Clear
Threshold.
DSG = Discharging detected. True when set.
12
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NominalAvailableCapacity( ): 0x08/0x09
This read-only command pair returns the uncompensated (less than C/20 load) battery capacity remaining. Units
are mAh.
FullAvailableCapacity( ): 0x0a/0x0b
This read-only command pair returns the uncompensated (less than C/20 load) capacity of the battery when fully
charged. Units are mAh. FullAvailableCapacity( ) is updated at regular intervals, as specified by the IT algorithm.
RemainingCapacity( ): 0x0c/0x0d
This read-only command pair returns the compensated battery capacity remaining. Units are mAh.
FullChargeCapacity( ): 0x0e/0f
This read-only command pair returns the compensated capacity of the battery when fully charged. Units are
mAh. FullChargeCapacity( ) is updated at regular intervals, as specified by the IT algorithm.
AverageCurrent( ): 0x10/0x11
This read-only command pair returns a signed integer value that is the average current flow through the
sense resistor. In NORMAL mode, it is updated once per second and is calculated by dividing the 1 second
change in coulomb counter data by 1 second. Large current spikes of short duration will be averaged out in
this measurement. Units are mA.
AveragePower( ): 0x18/0x19
This read-only function returns an signed integer value of the average power during battery charging and
discharging. It is negative during discharge and positive during charge. A value of 0 indicates that the battery is
not being discharged. The value is reported in units of mW.
StateOfCharge( ): 0x1c/0x1d
This read-only function returns an unsigned integer value of the predicted remaining battery capacity expressed
as a percentage of FullChargeCapacity( ), with a range of 0 to 100%.
IntTemperature( ): 0x1e/0x1f
This read-only function returns an unsigned integer value of the internal temperature sensor in units of 0.1 K
measured by the fuel gauge. If OpConfig[TEMPS] = 0, this command will return the same value as
Temperature( ).
StateOfHealth( ): 0x20/0x21
0x20 SOH percentage: this read-only function returns an unsigned integer value, expressed as a percentage of
the ratio of predicted FCC(25°C, SOH LoadI) over the DesignCapacity(). The FCC(25°C, SOH LoadI) is the
calculated full charge capacity at 25°C and the SOH LoadI which is programmed in factory (default = –400mA).
The range of the returned SOH percentage is 0x00 to 0x64, indicating 0 to 100% correspondingly.
0x21 SOH Status: this read-only function returns an unsigned integer value, indicating the status of the SOH
percentage:
•
•
•
0x00: SOH not valid (initialization)
0x01: Instant SOH value ready
0x02: Initial SOH value ready
–
–
Calculation based on default Qmax
May not reflect SOH for currently inserted pack
•
•
0x03: SOH value ready
–
–
Calculation based on learned Qmax
Most accurate SOH for currently inserted pack following a Qmax update
0x04-0xFF: Reserved
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OperationConfiguration( ): 0x3a/0x3b
This read-only function returns the contents of the NVM Operation Configuration (Op Config) register and is
most useful for system level debug to quickly determine device configuration.
DesignCapacity( ): 0x3c/0x3d
This read-only function returns the value stored in Design Capacity and is expressed in mAh. This is intended to
be the theoretical or nominal capacity of a new pack and is used as an input for the algorithm to scale the
normalized resistance tables and for the calculation of StateOfHealth().
DebugX( ):
Several read-only functions such as Debug1( ), Debug2( ), Debug3( ) provide information useful for debug
purposes. For factory use only.
Extended Data Commands
Extended commands offer additional functionality beyond the standard set of commands. They are used in the
same manner; however unlike standard commands, extended commands are not limited to 2-byte words. The
number of command bytes for a given extended command ranges in size from single to multiple bytes, as
specified in Table 5.
Table 5. Extended Commands
NAME
COMMAND CODE
UNITS
SEALED
ACCESS(1) (2)
UNSEALED
ACCESS(1) (2)
(2)
(2)
DataClass( )
DataBlock( )
BlockData( )
0x3e
0x3f
N/A
N/A
N/A
N/A
N/A
N/A
N/A
R/W
R
R/W
R/W
R/W
R/W
R/W
R
0x40…0x5f
0x60
BlockDataCheckSum( )
BlockDataControl( )
Reserved
R/W
N/A
R
0x61
0x62...0x7f
(1) SEALED and UNSEALED states are entered via commands to Control( ) 0x00/0x01
(2) In sealed mode, data CANNOT be accessed through commands 0x3e and 0x3f.
OperationConfiguration( ): 0x3a/0x3b
SEALED and UNSEALED Access: This command returns the Operation Configuration register setting
DesignCapacity( ): 0x3c/0x3d
SEALED and UNSEALED Access: This command returns the value is stored in Design Capacity and is
expressed in mAh. This is intended to be the theoretical or nominal capacity of a new pack and is used as an
input for the algorithm to scale the normalized resistance tables.
DataClass( ): 0x3e
UNSEALED Access: This command sets the data class to be accessed. The class to be accessed should be
entered in hexadecimal.
SEALED Access: This command is not available in SEALED mode.
DataBlock( ): 0x3f
UNSEALED Access: This command sets the data block to be accessed. When 0x00 is written to
BlockDataControl( ), DataBlock( ) holds the block number of the data to be read or written. Example: writing a
0x00 to DataBlock( ) specifies access to the first 32 byte block and a 0x01 specifies access to the second 32
byte block, and so on.
SEALED Access: Issuing a 0x01 instructs the BlockData( ) command to transfer the Manufacturer Info block.
14
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BlockData( ): 0x40…0x5f
UNSEALED Access: This data block is the remainder of the 32 byte data block when accessing general block
data.
SEALED Access: This data block is used to access the Manufacturer Info block. No other NVM or RAM data
blocks are accessible in SEALED mode.
BlockDataChecksum( ): 0x60
UNSEALED Access: This byte contains the checksum on the 32 bytes of block data read or written. The least-
significant byte of the sum of the data bytes written must be complemented ( [255 – x] , for x the least-significant
byte) before being written to 0x60. For a block write, the correct complemented checksum must be written before
the BlockData( ) will be transferred to NVM or RAM.
SEALED Access: This byte contains the checksum for the 8 bytes of the Manufacturer Info block.
BlockDataControl( ): 0x61
UNSEALED Access: This command is used to control the data access mode. Writing 0x00 to this command
enables BlockData( ) to access NVM and RAM.
SEALED Access: This command is not available in SEALED mode.
Reserved – 0x62 – 0x7f
BLOCK DATA INTERFACE
Accessing Block Data
The bq27425 contains both re-writable EEPROM non-volatile memory (NVM) and ROM-based data blocks. Upon
device RESET, the ROM-based data blocks are copied to associated volatile RAM space to initialize default
configuration and data constants to be used by the fuel gauging algorithm. Re-writable NVM-based data blocks
contain information expected to change such as: calibration, customer data and Impedance Track fuel gauging
data tables. If the application requires a change to the NVM or RAM configuration data, the host can update the
data blocks in CONFIG UPDATE mode. RAM-based data changes are temporary and must be applied by the
host using CONFIG UPDATE mode after each device RESET; while changes to the NVM data blocks are
permanent. The data blocks can be accessed in several different ways, depending on the access mode and what
data is being accessed.
Commonly accessed data block locations, frequently read by a system, are conveniently accessed through
specific instructions, already described in Section Data Commands. These commands are available when the
bq27425 is either in UNSEALED or SEALED modes.
Most data block locations, however, are only accessible in UNSEALED mode by use of the bq27425 evaluation
software or by data block transfers. These locations should be optimized and/or fixed during the development
and manufacture processes. Once established, the values generally remain unchanged during end-equipment
operation.
To access data locations individually, the block containing the desired data NVM location(s) must be transferred
to the command register locations, where they can be read to the system or changed directly. This is
accomplished by sending the set-up command BlockDataControl( ) (0x61) with data 0x00. Up to 32 bytes of data
can be read directly from the BlockData( ) (0x40…0x5f), externally altered, then rewritten to the BlockData( )
command space. Alternatively, specific locations can be read, altered, and rewritten if their corresponding offsets
are used to index into the BlockData( ) command space. Finally, the data residing in the command space is
transferred to the associated data block, once the correct checksum for the whole block is written to
BlockDataChecksum( ) (0x60).
Occasionally, a data CLASS will be larger than the 32-byte block size. In this case, the DataBlock( ) command is
used to designate which 32-byte block the desired locations reside in. The correct command address is then
given by 0x40 + offset modulo 32. For example, to access Sleep Current in the Gas Gauging class, the
DataClass( ) is issued 82 (0x52) to set the class. Because the offset is 34, it resides in the second 32-byte block.
Hence, DataBlock( ) is issued 0x01 to set the block offset, and the offset used to index into the BlockData( )
memory area is 0x40 + 34 modulo 32 = 0x40 + 2 = 0x40 + 2 = 0x42.
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Reading and writing subclass data are block operations up to 32 bytes in length. If during a write the data length
exceeds the maximum block size, then the data is ignored.
None of the data written to memory are bounded by the bq27425, the values are not rejected by the fuel gauge.
Writing an incorrect value may result in hardware failure due to firmware program interpretation of the invalid
data. The data written to NVM blocks is persistent, so a power-on reset does not resolve the fault.
ACCESS MODES
The bq27425 supports SEALED and UNSEALED access modes to control data NVM access permissions
according to Table 6.
Table 6. Data NVM Access
Security Mode
UNSEALED
SEALED
Data NVM
R/W
Manufacturer Info
R/W
R
None
SEALING/UNSEALING DATA BLOCKS
The bq27425 implements a key-access security scheme to transition from a SEALED state to the UNSEALED
state. Devices are shipped from the factory in the UNSEALED state and should be SEALED prior to use in end-
equipment. The Sealed to Unseal key can only be updated in the UNSEALED state.
To SEAL from UNSEALED: The host sends the SEALED subcommand 0x0020 to the Control( ) register.
After receiving the SEALED command, the CONTROL_STATUS[SS] bit is set within 2 seconds.
To UNSEAL from SEALED: Host sends the keys to the Control( ) register. The keys must be sent
consecutively, with no other data written to Control( ) . Note: To avoid conflict with normal subcommands, the
keys must be different from the codes presented in the CNTL DATA column of the Table 2 table. The first
word is Key 0 and the second word is Key 1. The order of the keys sent are Key 1 followed by Key 0. The
order of the bytes for each key entered through the Control( ) command is the reverse of what is read from
the part. For an example, if the 4-byte Sealed to Unseal key is 0x56781234, key 1 is 0x1234 and key 0 is
0x5678. So, the host should write 0x3412 followed by 0x7856 to unseal the part. After receiving the correct
key sequence the CONTROL_STATUS[SS] bit is cleared.
16
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DATA BLOCK SUMMARY
Table 7. Data Block Summary
Default
Value
(-G2B)
Units
(EVSW
Units)*
Subclas
s ID
Data
Type
Min
Value
Max
Value
Class
Subclass
Offset
Name
Configuration
[RAM]
2
Safety [RAM]
0
Over Temp
I2
-1200
-1200
0
1200
1200
255
550
0.1°C
(°C)
2
4
Under Temp
Temp Hys
I2
0
0.1°C
(°C)
U1
50
0.1°C
(°C)
36
49
68
Charge Termination
[RAM]
3
4
TCA Set %
I1
I1
-1
-1
-1
-1
0
100
100
100
100
255
255
255
255
700
3000
99
95
100
98
10
15
2
%
%
TCA Clear %
5
FC Set %
I1
%
6
FC Clear %
I1
%
Discharge [RAM]
Power [RAM]
0
SOC1 Set Threshold
SOC1 Clear Threshold
SOCF Set Threshold
SOCF Clear Threshold
Hibernate I
U1
U1
U1
U1
I2
%
1
0
%
2
0
%
3
0
5
%
9
0
3
mA
mV
11
Hibernate V
I2
2400
2550
System Data
[NVM]
58
80
81
Manufacturer Info
[NVM]
0 - 7
Block A 0 - 7
H1
0x00
0xff
0x00
-
Gas Gauging
[NVM/RAM]
IT Cfg [RAM]
55
57
0
Max Delta Voltage
TermV Valid t
I2
U1
I2
-32000
32000
255
200
2
mV
sec
0
0
Current Thresholds
[RAM]
Dsg Current Threshold
Chg Current Threshold
Quit Current
2000
2000
1000
0xFF
167
133
250
0.1 h
0.1 h
0.1 h
-
2
I2
0
4
I2
0
82
State [NVM]
2
Update Status
H1
0x00
0x04
(0x34)
3
5
Reserve Cap-mAh
Op Config
I2
H2
I2
0
0x0000
0
9000
0xffff
0
mAh
-
0x89f8
12
Design Capacity
32767
1340
mAh
(1000)
14
Design Energy
I2
0
32767
4960
mWh
(3800)
18
22
29
30
32
Terminate Voltage
SOHLoadI
I2
I2
2800
3700
0
3200
50
mV
mA
%
-32767
SOCI Delta
U1
I2
0
0
0
100
1000
5000
1
Taper Current
Taper Voltage
75
mA
mV
I2
4100
(4200)
34
36
Sleep Current
V at Chg Term
I2
I2
0
0
100
10
mA
mV
5000
4190
(4290)
38
39
40
Transient Factor Charge
Transient Factor Discharge
RDL Tempco
U1
U1
F4
0
0
255
255
179
179
num
num
num
1.0e-20
4.0e+1
0.000393
2-10
(num)
Ω
Ra Tables
[NVM/RAM]
88
89
R_a NVM
[NVM]
0 - 28
0 - 28
Cell0 R_a 0 - 14
Cell0 R_a 0 - 14
I2
I2
183
183
183
183
[Table]
[Table]
2-10
Ω
R_a RAM
[RAM]
(num)
Calibration
[NVM]
104
Data [NVM]
0
2
3
CC Offset
I2
I1
I1
-32768
-128
32767
127
-1312
mV
uV
Board Offset
Int Temp Offset
0
0
-128
127
°0.1°C
(°C)
4
0
Pack V Offset
CC Gain
I1
-128
127
0
mV
105
CC Cal [NVM]
F4
1.0e-1
4.0e+1
0.47095
num
(2-10Ω)
4
CC Cal Temp
I2
0
32767
2982
0.1K
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Table 7. Data Block Summary (continued)
Default
Value
(-G2B)
Units
(EVSW
Units)*
Subclas
s ID
Data
Type
Min
Value
Max
Value
Class
Subclass
Offset
Name
107
Current [RAM]
19
CC Delta
F4
2.9826e 1.193046e
559538.8
num
(2-10Ω)
+4
+6
Security
112
Codes [RAM]
0
Sealed to Unsealed
H4
0x00000
000
0xffffffff
0x36720414
-
18
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FUNCTIONAL DESCRIPTION
FUEL GAUGING
The bq27425 is an easy to configure fuel gauge that measures the cell voltage, temperature, and current to
determine battery state of charge (SOC). The bq27425 monitors charge and discharge activity by sensing the
voltage across an integrated small-value resistor (10 mΩ typ.) between the SRX and VSS pins and in series with
the cell. By integrating charge passing through the battery, the battery’s SOC is adjusted during battery charge or
discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the
amount of charge passed. When an application load is applied, the impedance of the cell is measured by
comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.
Measurements of OCV and charge integration determine chemical state of charge and chemical capacity
(Qmax). The initial Qmax values are taken from the Design Capacity. The bq27425 acquires and updates the
battery-impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value,
to determine FullChargeCapacity( ) and StateOfCharge( ), specifically for the present load and temperature.
FullChargeCapacity( ) is reported as capacity available from a fully charged battery under the present load and
temperature until Voltage(
)
reaches the Terminate Voltage. NominalAvailableCapacity(
)
and
FullAvailableCapacity( ) are the uncompensated (no or light load) versions of RemainingCapacity( ) and
FullChargeCapacity( ) respectively.
FUEL GAUGING CONFIGURATIONS
The bq27425 features easy to configure data NVM to speed-up fuel gauging design. Users are required to
configure Design Capacity, Termination Voltage, and Operation Configuration (see The Operation
Configuration Register section for details) to achieve optimal performance. The Impedance Track™ algorithm
uses these parameters along with built-in parameters to achieve accurate battery fuel gauging.
Several built-in parameters are used in the Impedance Track™ algorithm to identify different modes of battery:
•
•
•
Charging : Chg Current Threshold (default = DesignCapacity /13.3 ),
Discharging: Dsg Current Threshold (default = DesignCapacity /16.7 )
Relax: Quit Current Threshold (default = DesignCapacity /25.0 )
To achieve accurate fuel gauging, the bq27425 uses a Constant Power Model for fuel gauging. This model uses
the average discharge power from the beginning of the discharge cycle until present time to compute load-
compensated capacity such as RemainingCapacity( ) and FullChargeCapacity( ) in the Impedance Track™
algorithm.
SOC Smoothing Feature
Rapid changes in operating conditions, such as temperature or discharge current, can lead to sudden changes in
the algorithm's immediate calculation of RemainingCapacity( ), FullChargeCapacity( ) and StateOfCharge( ).
SOC Smoothing provides filtered data to the host resulting in more gradual changes to SOC-related data when
conditions vary and can provide a better end-user experience. The feature is enabled via Op Config
[SMOOTHEN].
Copyright © 2012–2013, Texas Instruments Incorporated
19
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
The Operation Configuration (Op Config) Register
Gauge operation is configured via the Operation Configuration (Op Config) data NVM register, as indicated in
Table 8. This register is programmed/read via the methods described in Section Accessing the Data NVM.
Table 8. Op Config Register Definition
bit7
bit6
RSVD0
0
bit5
BIE
0
bit4
BI_PU_EN
0
bit3
RSVD1
1
bit2
RSVD0
0
bit1
RSVD0
0
bit0
RSVD1
1
High Byte SMOOTHEN
Default =
1
0x89
Low Byte
Default =
RSVD1
1
RSVD1
1
SLEEP
1
RMFCC
1
RSVD1
1
BATLOWEN
0
GPIOPOL
0
TEMPS
0
0xF8
SMOOTHEN = Enables the SOC smoothing feature. (See SOC Smoothing Feature.) True when set.
BIE = Battery Insertion Enable. If set, the battery insertion is detection via BIN pin input. If cleared, the detection relies
on the host to issue BAT_INSERT subcommand to indicate battery presence in the system.
BI_PU_EN = Enables internal weak pull-up on BIN pin. True when set. If false, an external pull-up resistor is expected.
SLEEP = The fuel gauge can enter sleep, if operating conditions allow. True when set.
RMFCC = RM is updated with the value from FCC on valid charge termination. True when set.
BATLOWEN = If set, the BAT_LOW function for GPOUT pin is selected. If cleared, the SOC_INT function is selected for
GPOUT.
GPIO_POL = GPOUT pin is active-high if set or active-low if cleared.
TEMPS = Selects the temperature source. Enables the host to write Temperature( ) if set. If cleared, the internal
temperature sensor is used for Temperature( ).
RSVD0 = Reserved. Default is 0. (Set to 0 for proper operation)
RSVD1 = Reserved. Default is 1. (Set to 1 for proper operation)
20
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
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ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
DETAILED PIN DESCRIPTIONS
GPOUT Pin
The GPOUT Pin is a multiplex pin and the polarity of the pin output can be selected via the [GPIO_POL] bit of
the Operation Configuration. The function is defined by [BATLOWEN]. If set, the Battery Low Indicator
(BAT_LOW) function for GPOUT pin is selected. If cleared, the SOC interrupt (SOC_INT) function is selected for
GPOUT.
When the BAT_LOW function is activated, the signaling on the multiplexed pin follows the status of the [SOC1]
bit in the Flags( ) register. The bq27425 has two flags accessed by the Flags( ) function that warns when the
battery’s SOC has fallen to critical levels. When StateOfCharge( ) falls below the first capacity threshold,
specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once
StateOfCharge( ) rises above SOC1 Set Threshold. The bq27425’s GPOUT pin automatically reflects the status
of the [SOC1] flag when OpConfig[BATLOWEN=0].
When StateOfCharge( ) falls below the second capacity threshold, SOCF Set Threshold, the [SOCF] (State of
Charge Final) flag is set, serving as a final discharge warning. Similarly, when StateOfCharge( ) rises above
SOCF Clear Threshold and the [SOCF] flag has already been set, the [SOCF] flag is cleared.
When the SOC_INT function is activated, the GPOUT pin generates 1ms pulse width under various conditions as
described in Table 9.
Table 9. SOC_INT Function Definition
Enable Condition
Pulse Width Description
Change in
SOC
(SOCI Delta) ≠ 0
1ms
During charge, when the SOC is greater than (>) the points, 100% - n × (SOCI
Delta) and 100%;
During discharge, when the SOC reaches (≤) the points 100% - n × (SOCI Delta)
and 0%;
where n is an integer starting from 0 to the number generating SOC no less than
0%
Examples:
For SOCI Delta = 1% (default), the SOC_INT intervals are 0%, 1%, 2%, ….. 99%,
and 100%.
For SOCI Delta = 10%, the SOC_INT intervals are 0%, 10%, 20%, ….. 90%, and
100%.
State Change (SOCI Delta) ≠ 0
1ms
1ms
Upon detection of entry to a charge or a discharge state.. Relaxation is not
included.
Battery
[BIE] bit is set in
OpConfig
When battery removal is detected by BIN pin.
Removal
Copyright © 2012–2013, Texas Instruments Incorporated
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bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
Battery Detection (BIN)
The function of OpConfig[BIE] bit is described in the Table 10 table below. When battery insertion is detected
and INITIALIZATION mode is completed, the bq27425 transitions to NORMAL mode to start Impedance Track™
fuel gauging. When battery insertion is not detected, the bq27425 remains in INITIALIZATION mode.
Table 10. Battery Detection
OpConfig[BIE]
Battery Insertion Requirement
Battery Removal Requirement
1
(1) Host drives BIN pin from logic high to low (1) Host drives BIN pin from logic low to high to
to signal battery insertion.
or
signal battery removal.
or
(2) A weak pull-up resistor can be used
(between BIN and VCC pin). When battery
pack with pull-down is connected, it can
generate a logic low to signal battery
insertion.
(2) When battery pack with pull-down is removed,
the weak pull-up resistor can generate a logic high
to signal battery removal.
0
Host sends BAT_INSERT subcommand to
signal battery insertion.
Host sends BAT_REMOVE subcommand to signal
battery removal.
DETECTING CHARGE TERMINATION
The bq27425 detects charge termination when (1) AverageCurrent( ) < Taper Current (default = 75 mA) for 80
seconds, (2) during the same 80 seconds, the accumulated change in capacity > 0.25mAh / 40 seconds, and (3)
Voltage( ) > (Charging Voltage – 100mV). When this occurs, the Flags( )[CHG] bit is cleared. Also, if the
[RMFCC] bit of Operation Configuration is set, then RemainingCapacity(
FullChargeCapacity( ).
)
is set equal to
22
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
www.ti.com.cn
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
OPERATING MODES
The bq27425 has different operating modes: POR, INITIALIZATION, NORMAL, CONFIG UPDATE, SLEEP, and
HIBERNATE. Upon power up from OFF or SHUTDOWN, a Power On Reset (POR) occurs and the fuel gauge
begins INITIALIZATION. In NORMAL mode, the bq27425 is fully powered and can execute any allowable task.
Configuration data in RAM and NVM can be updated by the host using the CONFIG UPDATE mode. In SLEEP
mode the fuel gauge turns off the high frequency oscillator clock to enter a reduced-power state, periodically
taking measurements and performing calculations. In HIBERNATE mode the fuel gauge is in a very low power
state, but can be woken up by communication or certain I/O activity.
In SHUTDOWN mode, the LDO is disabled so internal power and all volatile data is lost. Since no gauging
occurs in SHUTDOWN mode, additional gauging error can be introduced if the system has significant battery
charge/discharge activity prior to re-INITIALIZATION.
OFF
REGIN pin = OFF,
pin = OFF
V
CC
Entry to SHUTDOWN
REGIN pin > VREGIN min
SHUTDOWN
REGIN pin > V
min,
CE pin set LOW
(from any mode)
REGIN
pin = OFF
V
CC
Exit From SHUTDOWN
CE pin raised HI
via RESET
subcommand
(from any mode)
Power On Reset [POR]
Copy configuration ROM
defaults to RAM data.
Set Flags[ITPOR] = 1.
Exit from CONFIG UPDATE
Flags [CFGUPMODE] = 0 AND [ITPOR] = 0
(via SOFT_RESET or a 240 second timeout)
CONFIG UPDATE
INITIALIZATION
Host can change RAM and
NVM based data blocks.
(No gauging in this mode.)
.
Initialize algorithm and data.
Check for battery insertion.
.
(No gauging in this mode.)
Flags
[BAT _DET ] =
0
ICC = Normal
Entry to CONFIG UPDATE
Flags [CFGUPMODE] = 1
(via SET_CFGUPDATE
subcommand)
Exit From NORMAL
Entry to NORMAL
Flags [BAT _DET ] =
0
Flags [ BAT _DET ] =
1
Exit From HIBERNATE
VCELL POR threshold
<
Exit From HIBERNATE
Communication Activity
NORMAL
OR
bq27425 clears CONTROL_STATUS
[HIBERNATE ] =
Recommend Host also set Control
Status [HIBERNATE ] = 0
0
Fuel gauging and data
updated every 1s
ICC = Normal
Exit From SLEEP
Op Config [SLEEP ] = 0
OR
( ) | > Sleep Current
AverageCurrent
|
OR
Current is Detected above I
WAKE
HIBERNATE
Entry to SLEEP
Wakeup From HIBERNATE
Op Config
[
SLEEP ] =
AND
( )
1
SLEEP
Communication to gauge
AND
Comm address is NOT for bq27425
Disable all subcircuits
except GPIO
|
<
Sleep Current
|
AverageCurrent
.
Fuel gauging and data
updated every 20 seconds
ICC = Hibernate
ICC = Sleep
Exit From WAIT _HIBERNATE
Host must set CONTROL_STATUS
] = 0
[HIBERNATE
AND
VCELL > Hibernate Voltage
Exit From WAIT _ HIBERNATE
Cell relaxed
AND
WAIT _HIBERNATE
| AverageCurrent () | < Hibernate
Entry to System Shutdown
Current
Host has set CONTROL_STATUS
1
OR
Fuel gauging and data
updated every 20 seconds
[HIBERNATE ] =
OR
VCELL < Hibernate Voltage
Cell relaxed
AND
< Hibernate Voltage
VCELL
ICC = Sleep
System Shutdown
Figure 2. Power Mode Diagram
Copyright © 2012–2013, Texas Instruments Incorporated
23
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
POR and INITIALIZATION Modes
Upon Power On Reset (POR), the fuel gauge copies ROM-based configuration defaults to RAM and begins
INITIALIZATION mode where essential data is initialized and will remain in INITIALIZATION mode as halted-
CPU state when an adapter, or other power source is present to power the bq27425 (and system), yet no battery
has been detected. The occurrence of POR or a Control( ) RESET subcommand will set the Flags( ) [ITPOR]
status bit to indicate that RAM has returned to ROM default data. When battery insertion is detected, a series of
initialization activities begin including an OCV measurement. In addition CONTROL_STATUS[QMAX_UP] and
[RES_UP] bits are cleared to allow fast learning of Qmax and impedance.
Some commands, issued by a system processor, can be processed while the bq27425 is halted in this mode.
The gauge will wake up to process the command, and then return to the halted state awaiting battery insertion.
The current consumption of INITIALIZATION mode is similar to NORMAL mode.
CONFIG UPDATE Mode
If the application requires different configuration data for the bq27425. The host can update both NVM and RAM
based parameters using the Control( ) SET_CFGUPDATE subcommand to enter CONFIG UPDATE mode as
indicated by the Flags( ) [CFGUPMODE] status bit. In this mode, fuel gauging is suspended while the host uses
the Extended Data Commands to modify the configuration data blocks. To resume fuel gauging, the host sends a
Control( ) SOFT_RESETsubcommand to exit CONFIG UPDATE mode and clear both Flags( ) [ITPOR] and
[CFGUPMODE] bits. After a timeout of approximately 240 seconds (4 minutes), the gauge will automatically exit
CONFIG UPDATE mode if it has not received a SOFT_RESET subcommand from the host.
NORMAL Mode
The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent( ),
Voltage( ) and Temperature( ) measurements are taken once per second, and the interface data set is updated.
Decisions to change states are also made. This mode is exited by activating a different power mode.
Because the gauge consumes the most power in NORMAL mode, the Impedance Track™ algorithm minimizes
the time the fuel gauge remains in this mode.
SLEEP Mode
SLEEP mode is entered automatically if the feature is enabled (Operation Configuration [SLEEP]) = 1) and
AverageCurrent( ) is below the programmable level Sleep Current (default = 10mA). Once entry into SLEEP
mode has been qualified, but prior to entering it, the bq27425 performs an ADC autocalibration to minimize
offset.
During SLEEP mode, the bq27425 periodically takes data measurements and updates its data set. However, a
majority of its time is spent in an idle condition.
The bq27425 exits SLEEP if any entry condition is broken, specifically when: AverageCurrent( ) rises above
Sleep Current (default = 10mA).
HIBERNATE Mode
HIBERNATE mode could be used when the system equipment needs to enter a very low-power state, and
minimal gauge power consumption is required. This mode is ideal when a system equipment is set to its own
HIBERNATE, SHUTDOWN, or OFF modes.
Before the fuel gauge can enter HIBERNATE mode, the system must set the [HIBERNATE] bit of the
CONTROL_STATUS register. The gauge waits to enter HIBERNATE mode until it has taken a valid OCV
measurement and the magnitude of the average cell current has fallen below Hibernate Current. The gauge can
also enter HIBERNATE mode if the cell voltage falls below Hibernate Voltage. The gauge will remain in
HIBERNATE mode until the system issues a direct I2C command to the gauge. I2C communication that is not
directed to the gauge will only briefly wake it up and the gauge immediately returns to HIBERNATE mode.
It is the system’s responsibility to wake the bq27425 after it has gone into HIBERNATE mode and to prevent a
charger from charging the battery before the [OCVTAKEN] bit is set which signals an OCV reading is taken. After
waking, the gauge can proceed with the initialization of the battery information.
24
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
www.ti.com.cn
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
I2C INTERFACE
The bq27425-G2 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Host generated
ADDR[6:0] 0 A
Gauge generated
S
CMD[7:0]
(a) 1-byte write
A
DATA [7:0]
A
P
S
ADDR[6:0]
1
A
DATA [7:0]
(b) quick read
DATA [7:0]
N P
S
ADDR[6:0] 0 A
CMD[7:0]
A
Sr
ADDR[6:0]
1
A
N P
(c) 1- byte read
S
ADDR[6:0] 0 A
CMD[7:0]
A
Sr
ADDR[6:0]
1
A
DATA [7:0]
A
A
. . .
DATA [7:0]
A . . . A P
N P
(d) incremental read
S
ADDR[6:0] 0 A
CMD[7:0]
A
DATA [7:0]
DATA [7:0]
(e) incremental write
(S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge , and P = Stop).
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the bq27425-G2 or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
Attempt to read an address above 0x6B (NACK command):
I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27425-G2 is holding
the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of
the lines low, the I2C engine enters the low-power sleep mode.
Copyright © 2012–2013, Texas Instruments Incorporated
25
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all
packets addressed to the bq27425-G2. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual
1-byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host must not issue any standard command more than two times per
second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
S
S
S
ADDR [6:0] 0 A
ADDR [6:0] 0 A
ADDR [6:0] 0 A
CMD [7:0]
CMD [7:0]
CMD [7:0]
A
A
A
DATA [7:0]
DATA [7:0]
ADDR [6:0]
A
A
P
P
66ms
66ms
Sr
1
A
DATA [7:0]
A
DATA [7:0]
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL £ 400 kHz)
S
S
ADDR [6:0] 0 A
ADDR [6:0] 0 A
CMD [7:0]
CMD [7:0]
A
A
DATA [7:0]
ADDR [6:0]
A
DATA [7:0]
DATA [7:0]
A
P
66ms
DATA [7:0]
Sr
1
A
A
N P
66ms
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL £ 100 kHz)
S
ADDR [6:0] 0 A
DATA [7:0]
CMD [7:0]
DATA [7:0]
A
Sr
ADDR [6:0]
66ms
1
A
DATA [7:0]
A
DATA [7:0]
A
A
N P
Waiting time inserted after incremental read
I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short
clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (
INITIALIZATION , NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority
of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent
yet more significant clock stretch periods may occur as blocks of NVM are updated. The following table
summarizes the approximate clock stretch duration for various fuel gauge operating conditions.
Approximate
Gauging Mode
Operating Condition / Comment
Duration
SLEEP
Clock stretch occurs at the beginning of all traffic as the device wakes up.
≤ 4 ms
HIBERNATE
INITIALIZATION Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit).
≤ 4 ms
24 ms
NORMAL
Normal Ra table NVM updates.
NVM block writes.
72 ms
Restored NVM block write after loss of power.
End of discharge Ra table NVM update.
116 ms
144 ms
26
Copyright © 2012–2013, Texas Instruments Incorporated
bq27425-G2
www.ti.com.cn
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
REFERENCE (EVM) SCHEMATIC
Copyright © 2012–2013, Texas Instruments Incorporated
27
bq27425-G2
ZHCSAF4A –OCTOBER 2012–REVISED FEBRUARY 2013
www.ti.com.cn
REVISION HISTORY
Changes from Original (October 2012) to Revision A
Page
•
AVAILABLE OPTIONS table: Replaced "Contact Factory" with orderable quantities for bq27425YZFR-G2A and
bq27425YZFT-G2B ............................................................................................................................................................... 2
AVAILABLE OPTIONS table: Added CHEM_ID column ...................................................................................................... 2
RECOMMENDED OPERATING CONDITIONS: Added SHUTDOWN mode specifications ................................................ 4
Changed the CHEM_ID subcommand section: (CHEM_ID: 0x0008) ................................................................................ 10
DATA BLOCK SUMMARY: Updated Default Value column to show -G2B version differences in (Green Text) ............... 17
DATA BLOCK SUMMARY: Changed Units value from Reserve Cap-mAh and Design Capacity from "mA" to "mAh" .... 17
DATA BLOCK SUMMARY: Updated several Class/Subclass descriptions to correct [RAM] vs [NVM] indication. ........... 17
OPERATING MODES: Added text "In SHUTDOWN mode, ...." ........................................................................................ 23
Changed Figure 2, POWER MODE DIAGRAM. Added OFF and SHUTDOWN modes to diagram. ................................. 23
•
•
•
•
•
•
•
•
28
Copyright © 2012–2013, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ27425YZFR-G2A
BQ27425YZFR-G2B
ACTIVE
ACTIVE
DSBGA
DSBGA
YZF
YZF
15
15
3000 RoHS & Green
3000 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
BQ27425
SNAGCU
BQ27425
G2B
BQ27425YZFT-G2A
BQ27425YZFT-G2B
ACTIVE
ACTIVE
DSBGA
DSBGA
YZF
YZF
15
15
250
250
RoHS & Green
RoHS & Green
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
BQ27425
BQ27425
G2B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jun-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ27425YZFR-G2A
BQ27425YZFR-G2B
BQ27425YZFT-G2A
BQ27425YZFT-G2B
DSBGA
DSBGA
DSBGA
DSBGA
YZF
YZF
YZF
YZF
15
15
15
15
3000
3000
250
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
2.0
2.0
2.0
2.0
2.8
2.8
2.8
2.8
0.7
0.7
0.7
0.7
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jun-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ27425YZFR-G2A
BQ27425YZFR-G2B
BQ27425YZFT-G2A
BQ27425YZFT-G2B
DSBGA
DSBGA
DSBGA
DSBGA
YZF
YZF
YZF
YZF
15
15
15
15
3000
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
250
Pack Materials-Page 2
PACKAGE OUTLINE
YZF0015
DSBGA - 0.625 mm max height
SCALE 6.500
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.625 MAX
SEATING PLANE
0.05 C
0.35
0.15
BALL TYP
1 TYP
SYMM
E
D
SYMM
2
TYP
C
B
0.5
TYP
A
1
2
3
0.35
0.25
C A B
15X
0.5 TYP
0.015
4219381/A 02/2017
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
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EXAMPLE BOARD LAYOUT
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
15X ( 0.245)
(0.5) TYP
1
3
2
A
B
SYMM
C
D
E
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
0.05 MIN
(
0.245)
METAL
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.245)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219381/A 02/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
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EXAMPLE STENCIL DESIGN
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
15X ( 0.25)
1
2
3
A
B
(0.5)
TYP
METAL
TYP
SYMM
C
D
E
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4219381/A 02/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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