BQ27532-G1 [TI]
适用于 bq2425x 充电器的电池管理单元 Impedance Track™ 电量监测计;
| 型号： | BQ27532-G1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 bq2425x 充电器的电池管理单元 Impedance Track™ 电量监测计 电池 |
| 文件： | 总30页 (文件大小：868K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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bq27532-G1
ZHCSCT0 –SEPTEMBER 2014
bq27532-G1 用于 bq2425x 充电器的电池管理单元 Impedance Track™
电量监测计
1 特性
3
说明
1
•
电池电量计和充电器控制器适用于 1 节锂离子电池
应用（最高容量 14,500mAh）
bq27532-G1 系统端，锂离子电池管理单元是具有
Impedance Track™ 电量监测功能和对单节锂离子电
池组进行充电控制的微控制器外设。 电量监测计对系
统微控制器固件开发的要求极低。 电量监测计可配合
bq2425x 单节开关模式充电器管理嵌入式电池（不可
拆卸）或可拆卸电池组。
•
•
驻留在系统主板上
基于已获专利的 Impedance Track™ 技术的电池电
量计量
–
–
对电池放电曲线建模以精确预测剩余电量
针对电池老化、电池自放电以及温度和速率低效
情况进行自动调节
此电量监测计使用已经获得专利的 Impedance Track
算法来进行电量计量，并提供诸如剩余电量 (mAh)，
充电状态 (%)，续航时间（分钟），电池电压 (mV)、
和温度 (°C) 和 SoH (%) 等信息。
–
低值感测电阻器（5 至 20mΩ）
•
•
采用可定制充电配置文件的电池充电控制器
–
–
可根据温度配置的充电电压和电流
可选择运行状态 (SoH) 和多级别充电配置文件
通过该器件进行电池电量监测只需将 PACK+
无主机自主电池管理系统
(P+)、PACK– (P–) 和热敏电阻 (T) 连接至可拆卸电池
组或嵌入式电池电路。 15 引脚 NanoFree™ 芯片级封
装 (CSP) 的尺寸为 2.61mm × 1.96mm，引线间距
0.5mm。 它是空间受限类应用的理想选择。
–
减少了软件开销，提升了各平台间的可移植性同
时缩短了 OEM 设计周期
–
提高了安全性
•
运行时间提升
器件信息(1)
封装
–
通过 Impedance Track™ 技术延长电池续航时
间
部件号
封装尺寸（标称值）
bq27532-G1
CSP (15)
2.61mm x 1.96mm
–
–
能够对充电器终端进行更精确的控制
提高了再充电阈值
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
•
•
智能充电 – 定制化和自适应充电配置文件
4 简化电路原理图
–
–
基于 SoH 的充电器控制
温度水平充电 (TLC)
SW
SYS
SYSTEM LOAD
BQ2425x
4.35V t 10.5V
VIN
适用于 bq2425x 单节开关模式电池充电器的独立电
池充电控制器
用于连接系统微控制器端口的 400kHz I2C 接口
Charger BAT
•
2
应用
PGND
•
•
•
•
智能手机、功能型手机和平板电脑
数码相机与视频摄像机
手持式终端
I2C
BQ27532-G1
Single Cell Li-Ion Battery Pack
P+
T
BAT
TS
BI/TOUT
SYSTEM LOAD
REGIN
CE
MP3 或多媒体播放器
PROTECTION IC
I2C
VCC
SRP
Application
Processor
P-
FETs
SOCINT
VSS
SRN
1
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
English Data Sheet: SLUSBU6
bq27532-G1
ZHCSCT0 –SEPTEMBER 2014
www.ti.com.cn
目录
7.13 I2C-compatible Interface Communication Timing
Characteristics ........................................................... 7
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
简化电路原理图........................................................ 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Handling Ratings....................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Supply Current .......................................................... 5
7.14 Typical Characteristics............................................ 7
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
8.5 Programming........................................................... 12
Application and Implementation ........................ 17
9.1 Typical Application .................................................. 18
8
9
10 Power Supply Recommendations ..................... 21
10.1 Power Supply Decoupling..................................... 21
11 Layout................................................................... 22
11.1 Layout Guidelines ................................................. 22
12 器件和文档支持 ..................................................... 23
12.1 文档支持................................................................ 23
12.2 商标....................................................................... 23
12.3 静电放电警告......................................................... 23
12.4 术语表 ................................................................... 23
13 机械封装和可订购信息 .......................................... 24
7.6 Digital Input and Output DC Electrical
Characteristics ........................................................... 5
7.7 Power-on Reset ........................................................ 5
7.8 2.5-V LDO Regulator ................................................ 5
7.9 Internal Clock Oscillators .......................................... 5
7.10 ADC (Temperature and Cell Measurement)
Characteristics ........................................................... 6
7.11 Integrating ADC (Coulomb Counter)
Characteristics ........................................................... 6
7.12 Data Flash Memory Characteristics........................ 6
5 修订历史记录
日期
修订版本
注释
2014 年 9 月
*
最初发布版本
2
Copyright © 2014, Texas Instruments Incorporated
bq27532-G1
www.ti.com.cn
ZHCSCT0 –SEPTEMBER 2014
6 Pin Configuration and Functions
(TOP VIEW)
(BOTTOM VIEW)
A3
A2
A1
B3
B2
B1
C3
C2
C1
E3
E2
E1
E3
E2
E1
D3
D2
D1
C3
C2
C1
B3
B2
B1
A3
A2
A1
D3
D2
D1
E
Pin A1
Index Area
D
DIM
MIN
TYP
MAX
2640
1986
UNITS
D
E
2580
1926
2610
1956
ꢀm
Pin Functions
PIN
NUMBER
TYPE(1)
DESCRIPTION
NAME
BAT
E2
E3
I
Cell-voltage measurement input. ADC input. TI recommends 4.8 V maximum for conversion accuracy.
Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with
BI/TOUT
IO
pullup resistor > 1 MΩ (1.8 MΩ typical).
BSCL
BSDA
B2
C3
O
Battery charger clock output line for chipset communication. Use without external pullup resistor. Push-pull output.
Battery charger data line for chipset communication. Use without external pullup resistor. Push-pull output.
IO
Chip enable. Internal LDO is disconnected from REGIN when driven low.
Note: CE has an internal ESD protection diode connected to REGIN. TI recommends maintaining VCE ≤ VREGIN under
all conditions.
CE
D2
I
REGIN
SCL
E1
A3
P
I
Regulator input. Decouple with 0.1-μF ceramic capacitor to VSS.
Slave I2C serial communications clock input line for communication with system (master). Open-drain IO. Use with
10-kΩ pullup resistor (typical).
Slave I2C serial communications data line for communication with system (master). Open-drain IO. Use with 10-kΩ
pullup resistor (typical).
SDA
B3
A2
B1
IO
IO
AI
SOC state interrupts output. Generates a pulse as described in SLUUB04, bq27532-G1 Technical Reference Manual.
Open-drain output.
SOC_INT
SRN
Analog input pin connected to the internal coulomb counter where SRN is nearest the VSS connection. Connect to 5-
to 20-mΩ sense resistor.
Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK– connection. Connect to
5- to 20-mΩ sense resistor.
SRP
TS
A1
D3
AI
AI
P
Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.
Regulator output and bq27532-G1 device power. Decouple with 1-μF ceramic capacitor to VSS. Pin is not intended to
power additional external loads.
VCC
VSS
D1
C1, C2
P
Device ground
(1) IO = Digital input-output, AI = Analog input, P = Power connection
Copyright © 2014, Texas Instruments Incorporated
3
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ZHCSCT0 –SEPTEMBER 2014
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
UNIT
V
VREGIN
Regulator input range
5.5
(2)
6.0
V
VCE
CE input pin
VREGIN + 0.3
V
V
V
V
V
V
VCC
VIOD
VBAT
Supply voltage range
Open-drain IO pins (SDA, SCL, SOC_INT)
BAT input pin
2.75
5.5
5.5
(2)
6.0
VI
Input voltage range to all other pins
(BI/TOUT, TS, SRP, SRN, BSCL, BSDA)
VCC + 0.3
85
TA
Operating free-air temperature range
–40
°C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.
7.2 Handling Ratings
MIN
–65
0
MAX
150
1.5
UNIT
Tstg
Storage temperature range
Electrostatic discharge
°C
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001,
BAT pin
(1)
V(ESD)
kV
Charged device model (CDM), per JEDEC specification
JESD22-C101, all other pins(2)
0
2
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
TA = –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
2.8
NOM
MAX
UNIT
No operating restrictions
4.5
2.8
VREGIN
Supply voltage
V
No flash writes
2.45
External input capacitor for internal LDO
between REGIN and VSS
CREGIN
CLDO25
tPUCD
0.1
μF
Nominal capacitor values specified.
Recommend a 5% ceramic X5R-type
capacitor located close to the device.
External output capacitor for internal LDO
between VCC and VSS
0.47
1
μF
Power-up communication delay
250
ms
7.4 Thermal Information
THERMAL METRIC(1)
CSP
UNIT
(15 PINS)
RθJA
RJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
70
17
20
1
Junction-to-board thermal resistance
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ψJB
18
n/a
RθJC(bottom) Junction-to-case (bottom) thermal resistance
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Copyright © 2014, Texas Instruments Incorporated
bq27532-G1
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ZHCSCT0 –SEPTEMBER 2014
7.5 Supply Current
TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Fuel gauge in NORMAL mode
ILOAD > Sleep current
(1)
ICC
Normal operating-mode current
118
μA
Fuel gauge in SLEEP+ mode
ILOAD < Sleep current
(1)
ISLP+
Sleep+ operating-mode current
Low-power storage-mode current
Hibernate operating-mode current
62
23
8
μA
μA
μA
Fuel gauge in SLEEP mode
ILOAD < Sleep current
(1)
ISLP
Fuel gauge in HIBERNATE mode
ILOAD < Hibernate current
(1)
IHIB
(1) Specified by design. Not production tested. Actual supply current consumption will vary slightly depending on firmware operation and
dataflash configuration.
7.6 Digital Input and Output DC Electrical Characteristics
TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output voltage, low (SCL, SDA,
SOC_INT, BSDA, BSCL)
VOL
IOL = 3 mA
0.4
V
VOH(PP)
VOH(OD)
Output voltage, high (BSDA, BSCL) IOH = –1 mA
VCC – 0.5
VCC – 0.5
V
Output voltage, high (SDA, SCL,
SOC_INT)
External pullup resistor connected to
VCC
Input voltage, low (SDA, SCL)
Input voltage, low (BI/TOUT)
Input voltage, high (SDA, SCL)
Input voltage, high (BI/TOUT)
Input voltage, low (CE)
–0.3
–0.3
1.2
0.6
0.6
VIL
VIH
V
V
BAT INSERT CHECK MODE active
BAT INSERT CHECK MODE active
VREGIN = 2.8 to 4.5 V
1.2
VCC + 0.3
0.8
VIL(CE)
VIH(CE)
V
Input voltage, high (CE)
2.65
(1)
Ilkg
Input leakage current (IO pins)
0.3
μA
(1) Specified by design. Not production tested.
7.7 Power-on Reset
TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
Positive-going battery voltage input at VCC
Power-on reset hysteresis
MIN
TYP
2.15
115
MAX
UNIT
V
VIT+
2.05
2.20
VHYS
mV
7.8 2.5-V LDO Regulator
TA = –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
2.8 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA(1)
2.3
2.5
2.6
V
VREG25
Regulator output voltage (VCC)
2.45 V ≤ VREGIN < 2.8 V (low battery),
2.3
V
IOUT ≤ 3 mA
(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.
7.9 Internal Clock Oscillators
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
MIN
TYP
8.389
MAX
UNIT
MHz
kHz
fOSC
High-frequency oscillator
Low-frequency oscillator
fLOSC
32.768
Copyright © 2014, Texas Instruments Incorporated
5
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ZHCSCT0 –SEPTEMBER 2014
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7.10 ADC (Temperature and Cell Measurement) Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VSS – 0.125
VSS – 0.125
0.05
TYP
MAX
UNIT
VADC1
VADC2
VIN(ADC)
GTEMP
Input voltage range (TS)
Input voltage range (BAT)
Input voltage range
2
5
1
V
V
V
Internal temperature sensor voltage
gain
–2
mV/°C
tADC_CONV Conversion time
Resolution
125
15
ms
bits
mV
MΩ
MΩ
kΩ
14
VOS(ADC)
Input offset
1
(1)
ZADC1
Effective input resistance (TS)
8
8
Device not measuring cell voltage
Device measuring cell voltage
(1)
ZADC2
Effective input resistance (BAT)
Input leakage current
100
(1)
Ilkg(ADC)
0.3
μA
(1) Specified by design. Not tested in production.
7.11 Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VSR = V(SRP) – V(SRN)
MIN
TYP
MAX
UNIT
VSR
Input voltage range,
V(SRP) and V(SRN)
–0.125
0.125
V
tSR_CONV
Conversion time
Single conversion
1
s
bits
Resolution
14
15
±0.034
0.3
VOS(SR)
INL
Input offset
10
μV
Integral nonlinearity error
Effective input resistance
Input leakage current
±0.007
% FSR
MΩ
(1)
ZIN(SR)
2.5
(1)
Ilkg(SR)
μA
(1) Specified by design. Not tested in production.
7.12 Data Flash Memory Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
MIN
10
TYP
MAX
UNIT
Years
Cycles
ms
(1)
tDR
Data retention
Flash-programming write cycles(1)
20,000
(1)
tWORDPROG
Word programming time
2
(1)
ICCPROG
Flash-write supply current
Data flash master erase time
Instruction flash master erase time
Flash page erase time
5
10
mA
(1)
tDFERASE
tIFERASE
tPGERASE
200
200
20
ms
(1)
(1)
ms
ms
(1) Specified by design. Not production tested
6
Copyright © 2014, Texas Instruments Incorporated
bq27532-G1
www.ti.com.cn
ZHCSCT0 –SEPTEMBER 2014
7.13 I2C-compatible Interface Communication Timing Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
300
UNIT
ns
tr
SCL or SDA rise time
SCL or SDA fall time
tf
300
ns
tw(H)
SCL pulse duration (high)
SCL pulse duration (low)
Setup for repeated start
Start to first falling edge of SCL
Data setup time
600
1.3
600
600
100
0
ns
tw(L)
μs
tsu(STA)
td(STA)
tsu(DAT)
th(DAT)
tsu(STOP)
t(BUF)
fSCL
ns
ns
ns
Data hold time
ns
Setup time for stop
600
66
ns
Bus free time between stop and start
μs
(1)
Clock frequency
400
kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz (see I2C Interface and I2C Command Waiting Time).
Figure 1. I2C-compatible Interface Timing Diagrams
7.14 Typical Characteristics
2.65
2.6
8.8
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
VREGIN = 2.7 V
VREGIN = 4.5 V
2.55
2.5
2.45
2.4
2.35
-40
-20
0
20
40
60
80
100
Temperature (qC)
Temperature (qC)
D001
D002
图 2. Regulator Output Voltage vs. Temperature
图 3. High-Frequency Oscillator Frequency vs. Temperature
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ZHCSCT0 –SEPTEMBER 2014
www.ti.com.cn
Typical Characteristics (接下页)
34
33.5
33
5
4
3
2
32.5
32
1
0
-1
-2
-3
-4
-5
31.5
31
30.5
30
-40
-20
0
20
40
60
80
100
-30
-20
-10
0
10
20
30
40
50
60
Temperature (qC)
Temperature (qC)
D003
D004
图 4. Low-Frequency Oscillator Frequency vs. Temperature
图 5. Reported Internal Temperature Measurement vs.
Temperature
8
版权 © 2014, Texas Instruments Incorporated
bq27532-G1
www.ti.com.cn
ZHCSCT0 –SEPTEMBER 2014
8 Detailed Description
8.1 Overview
The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single, Li-
based, rechargeable cell. It can be interrogated by a system processor to provide cell information, such as
remaining capacity and state-of-charge (SOC) as well as SOC interrupt signal to the host.
The fuel gauge can control a bq2425x Charger IC without the intervention from an application system processor.
Using the bq27532-G1 and bq2425x chipset, batteries can be charged with the typical constant-current,
constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.
The fuel gauge can also be configured to suggest charge voltage and current values to the system so that the
host can control a charger that is not part of the bq2425x charger family.
注
Formatting conventions used in this document:
Commands: italics with parentheses and no breaking spaces, for example, Control( )
Data flash: italics, bold, and breaking spaces, for example, Design Capacity
Register bits and flags: brackets and italics, for example, [TDA]
Data flash bits: brackets, italics and bold, for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode
版权 © 2014, Texas Instruments Incorporated
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ZHCSCT0 –SEPTEMBER 2014
www.ti.com.cn
8.2 Functional Block Diagram
REGIN
LDO
POR
2.5 V
VCC
BAT
HFO
HFO
SRN
SRP
CC
LFO
HFO/128
4R
HFO/128
MUX
ADC
R
Wake
Comparator
TS
Internal
Temp
Sensor
BI/TOUT
HFO/4
SDA
SCL
SOCINT
22
22
Instruction
ROM
I2C Slave
Engine
CPU
VSS
I/O
Controller
Instruction
FLASH
BSDA
BSCL
I2C Master
Engine
8
8
Wake
and
Watchdog
Timer
GP Timer
and
PWM
Data
SRAM
Data
FLASH
10
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bq27532-G1
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ZHCSCT0 –SEPTEMBER 2014
8.3 Feature Description
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command( ), are used to read and write information contained within the control and status registers, as well as
its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine,
and can be executed during application development, pack manufacture, or end-equipment operation.
Cell information is stored in non-volatile flash memory. Many of these data flash locations are accessible during
application development. They cannot, generally, be accessed directly during end-equipment operation. Access
to these locations is achieved by either use of the companion evaluation software, through individual commands,
or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data
flash subclass and offset must be known.
The key to the high-accuracy gas gauging prediction is the TI proprietary Impedance Track™ algorithm. This
algorithm uses cell measurements, characteristics, and properties to create SOC predictions that can achieve
less than 1% error across a wide variety of operating conditions and over the lifetime of the battery.
The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-
value series sense resistor (5 to 20 mΩ, typical) located between the system VSS and the battery PACK–
terminal. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell open-
circuit voltage (OCV), and cell voltage under loading conditions.
The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient
(NTC) thermistor with R25 = 10.0 kΩ ±1%, B25/85 = 3435 K ± 1% (such as Semitec NTC 103AT). The fuel
gauge can also be configured to use its internal temperature sensor. When an external thermistor is used, a
18.2-kΩ pullup resistor between the BI/TOUT and TS pins is also required. The fuel gauge uses temperature to
monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.
To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, SLEEP+,
HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending
upon the occurrence of specific events, though a system processor can initiate some of these modes directly.
For complete operational details, see SLUUB04, bq27532-G1 Technical Reference Manual.
8.4 Device Functional Modes
8.4.1 Functional Description
The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge
monitors the charging and discharging of the battery by sensing the voltage across a small-value resistor (5 mΩ
to 20 mΩ, typical) between the SRP and SRN pins and in series with the cell. By integrating charge passing
through the battery, the battery SOC is adjusted during battery charge or discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the
amount of charge passed. When an application load is applied, the impedance of the cell is measured by
comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.
Measurements of OCV and charge integration determine chemical SOC and chemical capacity (Qmax). The
initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is
also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-impedance profile
during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine
FullChargeCapacity(
FullChargeCapacity( ) is reported as capacity available from a fully-charged battery under the present load and
temperature until Voltage( reaches the Terminate Voltage. NominalAvailableCapacity( and
)
and StateOfCharge( ), specifically for the present load and temperature.
)
)
FullAvailableCapacity( ) are the uncompensated (no or light load) versions of RemainingCapacity( ) and
FullChargeCapacity( ), respectively.
The fuel gauge has two flags accessed by the Flags( ) function that warn when the battery SOC has fallen to
critical levels. When RemainingCapacity( ) falls below the first capacity threshold as specified in SOC1 Set
Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity( ) rises
above SOC1 Clear Threshold.
When the voltage is discharged to Terminate Voltage, the SOC will be set to 0.
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8.5 Programming
8.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. Additional details are
found in the SLUUB04, bq27532-G1 Technical Reference Manual.
Table 1. Standard Commands
SEALED
ACCESS
UNSEALED
ACCESS
NAME
COMMAND CODE
UNIT
Control( )
0x00 and 0x01
0x02 and 0x03
0x04 and 0x05
0x06 and 0x07
0x08 and 0x09
0x0A and 0x0B
0x0C and 0x0D
0x0E and 0x0F
0x10 and 0x11
0x12 and 0x13
0x14 and 0x15
0x16 and 0x17
0x18 and 0x19
0x1A and 0x1B
0x1C and 0x1D
0x1E and 0x1F
0x20 and 0x21
0x22 and 0x23
0x24 and 0x25
0x26 and 0x27
0x28 and 0x29
0x2A and 0x2B
0x2C and 0x2D
0x2E and 0x2F
0x30 and 0x31
0x32
NA
mA
RW
RW
R
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
R
AtRate( )
AtRateTimeToEmpty( )
Temperature( )
Voltage( )
Minutes
0.1 K
mV
RW
R
Flags( )
Hex
mAh
mAh
mAh
mAh
mA
R
NominalAvailableCapacity( )
FullAvailableCapacity( )
RemainingCapacity( )
FullChargeCapacity( )
AverageCurrent( )
InternalTemperature( )
ResScale( )
R
R
R
R
R
0.1 K
Num
Num
% / num
Counters
%
R
R
ChargingLevel( )
R
StateOfHealth( )
R
CycleCount( )
R
StateOfCharge( )
R
R
InstantaneousCurrentReading( )
FineQPass( )
mA
R
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
mAh
num
mA
R
FineQPassFract( )
ProgChargingCurrent( )
ProgChargingVoltage( )
LevelTaperCurrent( )
CalcChargingCurrent( )
CalcChargingVoltage( )
ChargerStatus( )
R
R
mV
R
mA
R
mA
R
mV
R
Hex
Hex
Hex
Hex
Hex
Hex
Hex
Hex
mAh
mAh
mAh
mAh
%
R
ChargReg0( )
0x33
RW
RW
RW
RW
RW
RW
RW
R
ChargReg1( )
0x34
ChargReg2( )
0x35
ChargReg3( )
0x36
ChargReg4( )
0x37
ChargReg5( )
0x38
ChargReg6( )
0x39
RemainingCapacityUnfiltered( )
RemainingCapacityFiltered( )
FullChargeCapacityUnfiltered( )
FullChargeCapacityFiltered( )
TrueSOC( )
0x6C and 0x6D
0x6E and 0x6F
0x70 and 0x71
0x72 and 0x73
0x74 and 0x75
0x76 and 0x77
R
R
R
R
MaxCurrent( )
mA
R
12
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8.5.2 Control( ): 0x00 and 0x01
Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control( ) command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as
described in Table 2. Additional details are found in the SLUUB04, bq27532-G1 Technical Reference Manual.
Table 2. Control( ) Subcommands
CONTROL
DATA
SEALED
ACCESS
CONTROL FUNCTION
DESCRIPTION
CONTROL_STATUS
DEVICE_TYPE
FW_VERSION
HW_VERSION
MLC_ENABLE
0x0000
0x0001
0x0002
0x0003
0x0004
Yes
Yes
Yes
Yes
Yes
Reports the status of HIBERNATE, IT, and so on
Reports the device type (for example, 0x0532 for bq27532-G1)
Reports the firmware version on the device type
Reports the hardware version of the device type
Charge profile is based on MaxLife profile
Charge profile is solely based on charge temperature tables and, if enabled, State
of Health
MLC_DISABLE
0x0005
Yes
CLEAR_IMAX_INT
PREV_MACWRITE
CHEM_ID
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x000D
0x000E
0x0011
0x0012
0x0013
0x0014
Yes
Yes
Yes
No
Clears the IMAX status bit and the interrupt signal from SOC_INT pin.
Returns previous MAC subcommand code
Reports the chemical identifier of the Impedance Track™ configuration
Forces the device to measure and store the board offset
Forces the device to measure the internal CC offset
Forces the device to store the internal CC offset
Request the gauge to take a OCV measurement
Forces the BAT_DET bit set when the [BIE] bit is 0
Forces the BAT_DET bit clear when the [BIE] bit is 0
Forces CONTROL_STATUS [HIBERNATE] to 1
Forces CONTROL_STATUS [HIBERNATE] to 0
Forces CONTROL_STATUS [SNOOZE] to 1
BOARD_OFFSET
CC_OFFSET
No
CC_OFFSET_SAVE
OCV_CMD
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
BAT_INSERT
BAT_REMOVE
SET_HIBERNATE
CLEAR_HIBERNATE
SET_SLEEP+
CLEAR_SLEEP+
Forces CONTROL_STATUS [SNOOZE] to 0
When the gauge is not connected to the charger through I2C, this command
indicates to the gauge that there is a charger input current limiting loop active.
Disables charge termination detection by the gauge.
ILIMIT_LOOP_ENABLE
0x0015
Yes
When the gauge is not connected to the charger through I2C, this command
indicates to the gauge that battery charge current is not limited. Allows charge
termination detection by the gauge.
ILIMIT_LOOP_DISABLE
SHIPMODE_ENABLE
SHIPMODE_DISABLE
0x0016
0x0017
0x0018
Yes
Yes
Yes
Commands the bq2425x to turn off BATFET after a delay time programmed in data
flash so that system load does not draw power from the battery
Commands the bq2425x to disregard turning off BATFET before the delay time or
commands BATFET to turn on if a VIN had power during the SHIPMODE enabling
process
CHG_ENABLE
CHG_DISABLE
0x001A
0x001B
Yes
Yes
Enable charger. Charge will continue as dictated by the gauge charging algorithm.
Disable charger (Set CE bit of bq2425x)
Enables the gas gauge to control the charger while continuously resetting the
charger watchdog
GG_CHGRCTL_ENABLE
GG_CHGRCTL_DISABLE
SMOOTH_SYNC
0x001C
0x001D
0x001E
Yes
Yes
Yes
The gas gauge stops resetting the charger watchdog
Synchronizes RemainingCapacityFiltered( ) and FullChargeCapacityFiltered( ) with
RemainingCapacityUnfiltered( ) and FullChargeCapacityUnfiltered( )
DF_VERSION
SEALED
0x001F
0x0020
0x0021
0x0041
Yes
No
No
No
Returns the Data Flash Version
Places device in SEALED access mode
Enables the Impedance Track™ algorithm
Forces a full reset of the bq27532-G1 device
IT_ENABLE
RESET
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8.5.3 Charger Data Commands
The charger registers are mapped to a series of single-byte Charger Data Commands to enable system reading
and writing of battery charger registers. During charger power up, the registers are initialized to Charger Reset
State. The fuel gauge can change the values of these registers during the System Reset State.
Each of the bits in the Charger Data Commands can be read or write. Note that System Access can be different
from the read or write access as defined in bq2425x charger hardware. The fuel gauge may block write access to
the charger hardware when the bit function is controlled by the fuel gauge exclusively. For example, the
[VBATREGx] bits of Chrgr_Reg2 are controlled by the fuel gauge and cannot be modified by system.
The fuel gauge reads the corresponding registers of Chrgr_Reg0( ) and Chrgr_Reg2( ) every second to mirror
the charger status. Other registers in the bq2425x device are read when registers are modified by the fuel gauge.
表 3. Charger Data Commands
COMMAND
CODE
bq2425x CHARGER
MEMORY LOCATION
SEALED
ACCESS
UNSEALED
ACCESS
REFRESH
RATE
NAME
ChargerStatus( )
Chrgr_Reg0( )
Chrgr_Reg1( )
Chrgr_Reg2( )
Chrgr_Reg3( )
Chrgr_Reg4( )
Chrgr_Reg5( )
Chrgr_Reg6( )
CHGRSTAT
CHGR0
CHGR1
CHGR2
CHGR3
CHGR4
CHGR5
CHGR6
0x32
0x33
0x34
0x35
0x36
0x37
0x38
0x39
NA
R
R
Every second
Every second
Data change
Every second
Data change
Every second
Data change
Data change
0x00
0x01
0x02
0x03
0x04
0x05
0x06
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
RW
8.5.4 Communications
8.5.4.1 I2C Interface
The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Host generated
ADDR[6:0] 0 A
Gauge generated
S
CMD[7:0]
(a) 1-byte write
A
DATA [7:0]
A
P
S
ADDR[6:0]
1
A
DATA [7:0]
(b) quick read
DATA [7:0]
N P
S
ADDR[6:0] 0 A
CMD[7:0]
A
Sr
ADDR[6:0]
1
A
N P
(c) 1- byte read
S
ADDR[6:0] 0 A
CMD[7:0]
A
Sr
ADDR[6:0]
1
A
DATA [7:0]
A
A
. . .
DATA [7:0]
A . . . A P
N P
(d) incremental read
S
ADDR[6:0] 0 A
CMD[7:0]
A
DATA [7:0]
DATA [7:0]
(e) incremental write
(S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge , and P = Stop).
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
14
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The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
Attempt to read an address above 0x6B (NACK command):
8.5.4.2 I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding
the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of
the lines low, the I2C engine enters the low-power SLEEP mode.
8.5.4.3 I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-
byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host must not issue any standard command more than two times per
second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
S
S
S
ADDR [6:0] 0 A
ADDR [6:0] 0 A
ADDR [6:0] 0 A
CMD [7:0]
CMD [7:0]
CMD [7:0]
A
A
A
DATA [7:0]
DATA [7:0]
ADDR [6:0]
A
A
P
P
66ms
66ms
Sr
1
A
DATA [7:0]
A
DATA [7:0]
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL £ 400 kHz)
S
S
ADDR [6:0] 0 A
ADDR [6:0] 0 A
CMD [7:0]
CMD [7:0]
A
A
DATA [7:0]
ADDR [6:0]
A
DATA [7:0]
DATA [7:0]
A
P
66ms
DATA [7:0]
Sr
1
A
A
N P
66ms
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL £ 100 kHz)
S
ADDR [6:0] 0 A
DATA [7:0]
CMD [7:0]
DATA [7:0]
A
Sr
ADDR [6:0]
66ms
1
A
DATA [7:0]
A
DATA [7:0]
A
A
N P
Waiting time inserted after incremental read
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8.5.4.4 I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short
clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes
(INITIALIZATION, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority
of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent
yet more significant clock stretch periods may occur as blocks of data flash are updated. The following table
summarizes the approximate clock stretch duration for various fuel gauge operating conditions.
GAUGING
MODE
APPROXIMATE
DURATION
OPERATING CONDITION / COMMENT
SLEEP
HIBERNATE
Clock stretch occurs at the beginning of all traffic as the device wakes up.
≤ 4 ms
INITIALIZATION Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit).
≤ 4 ms
24 ms
NORMAL
Normal Ra table data flash updates.
Data flash block writes.
72 ms
Restored data flash block write after loss of power.
End of discharge Ra table data flash update.
116 ms
144 ms
16
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
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9.1 Typical Application
CPMID
1µF
LO
1.0PH
PMID
VIN
CIN
IN
SW
System Load
R1
R2
CBOOT
33nF
2.2µF
VDPM
bq24250
BOOT
PGND
SYS
LDO
1µF
22ꢀF
STAT
BAT
TS
GPIO1
GPIO2
EN1
EN2
1ꢀF
LDO
R3
/CE
INT
VGPIO
Host
GPIO3
SCL
SCL
SDA
SDA
ILIM
ISET
Optional
BAT
VCC
0.1µF
Optional for non-
removable pack
bq27532-G1
1µF
BSDA
1.8M
BSCL
BI/TOUT
TS
0.033µF
18.2k
SOC_INT
SCL
1k
TEMP
PACK+
+
RNTC
0.1µF
0.1µF
SDA
PACK-
SRP
SRN
0.01
CE
Optional
REGIN
VSS
VSS
0.1µF
图 6. Schematic
18
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Typical Application (接下页)
9.1.1 Design Requirements
Several key parameters must be updated to align with a given application's battery characteristics. For highest
accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance
and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful
and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a
"golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell
origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on
system production time. If going this route, it is recommended to average the voltage and current measurement
calibration data from a large sample size and use these in the golden file. 表 4, Key Data Flash Parameters for
Configuration, shows the items that should be configured to achieve reliable protection and accurate gauging
with minimal initial configuration.
表 4. Key Data Flash Parameters for Configuration
NAME
DEFAULT
UNIT
RECOMMENDED SETTING
Set based on the nominal pack capacity as interpreted from cell manufacturer's
datasheet. If multiple parallel cells are used, should be set to N × Cell Capacity.
Design Capacity
1000
mAh
Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy
is divided by this value.
Design Energy Scale
1
-
Set to desired runtime remaining (in seconds / 3600) × typical applied load
between reporting 0% SOC and reaching Terminate Voltage, if needed.
Reserve Capacity-mAh
Cycle Count Threshold
0
mAh
mAh
900
Set to 90% of configured Design Capacity.
Should be configured using TI-supplied Battery Management Studio software.
Default open-circuit voltage and resistance tables are also updated in
conjunction with this step. Do not attempt to manually update reported Device
Chemistry as this does not change all chemistry information! Always update
chemistry using the appropriate software tool (that is, bqStudio).
Chem ID
0100
hex
Load Mode
Load Select
1
1
-
-
Set to applicable load model, 0 for constant current or 1 for constant power.
Set to load profile which most closely matches typical system load.
Set to initial configured value for Design Capacity. The gauge will update this
parameter automatically after the optimization cycle and for every regular
Qmax update thereafter.
Qmax Cell 0
1000
4200
mAh
mV
Set to nominal cell voltage for a fully charged cell. The gauge will update this
parameter automatically each time full charge termination is detected.
Cell0 V at Chg Term
Set to empty point reference of battery based on system needs. Typical is
between 3000 and 3200 mV.
Terminate Voltage
Ra Max Delta
3200
44
mV
mΩ
Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed.
Set based on nominal charge voltage for the battery in normal conditions
(25°C, etc). Used as the reference point for offsetting by Taper Voltage for full
charge termination detection.
Charging Voltage
Taper Current
4200
100
100
60
mV
mA
mV
mA
mA
mA
mA
Set to the nominal taper current of the charger + taper current tolerance to
ensure that the gauge will reliably detect charge termination.
Sets the voltage window for qualifying full charge termination. Can be set
tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer
JEITA temperature ranges that use derated charging voltage.
Taper Voltage
Sets threshold for gauge detecting battery discharge. Should be set lower than
minimal system load expected in the application and higher than Quit Current.
Dsg Current Threshold
Chg Current Threshold
Quit Current
Sets the threshold for detecting battery charge. Can be set higher or lower
depending on typical trickle charge current used. Also should be set higher
than Quit Current.
75
Sets threshold for gauge detecting battery relaxation. Can be set higher or
lower depending on typical standby current and exhibited in the end system.
40
Current profile used in capacity simulations at onset of discharge or at all times
if Load Select = 0. Should be set to nominal system load. Is automatically
updated by the gauge every cycle.
Avg I Last Run
–299
Power profile used in capacity simulations at onset of discharge or at all times
if Load Select = 0. Should be set to nominal system power. Is automatically
updated by the gauge every cycle.
Avg P Last Run
–1131
mW
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Typical Application (接下页)
表 4. Key Data Flash Parameters for Configuration (接下页)
NAME
DEFAULT
UNIT
RECOMMENDED SETTING
Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in
setting above typical standby currents else entry to SLEEP may be
unintentionally blocked.
Sleep Current
15
mA
Charge T0
0
10
45
50
60
50
50
50
50
0
°C
°C
Sets the boundary between charging inhibit and charging with T0 parameters.
Sets the boundary between charging with T0 and T1 parameters.
Sets the boundary between charging with T1 and T2 parameters.
Sets the boundary between charging with T2 and T3 parameters.
Sets the boundary between charging with T3 and T4 parameters.
Sets the charge current parameter for T0.
Charge T1
Charge T2
°C
Charge T3
°C
Charge T4
°C
Charge Current T0
Charge Current T1
Charge Current T2
Charge Current T3
Charge Current T4
Charge Voltage T0
Charge Voltage T1
Charge Voltage T2
Charge Voltage T3
Charge Voltage T4
% Des Cap
% Des Cap
% Des Cap
% Des Cap
% Des Cap
20-mV
20-mV
20-mV
20-mV
20-mV
Sets the charge current parameter for T1.
Sets the charge current parameter for T2.
Sets the charge current parameter for T3.
Sets the charge current parameter for T4.
210
210
207
205
0
Sets the charge voltage parameter for T0.
Sets the charge voltage parameter for T1.
Sets the charge voltage parameter for T2.
Sets the charge voltage parameter for T3.
Sets the charge voltage parameter for T4.
Adds temperature hysteresis for boundary crossings to avoid oscillation if
temperature is changing by a degree or so on a given boundary.
Chg Temp Hys
5
°C
Sets the voltage threshold for voltage regulation to system when charge is
disabled. It is recommended to program to same value as Charging Voltage
and maximum charge voltage that is obtained from Charge Voltage Tn
parameters.
Chg Disabled
Regulation V
4200
mV
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to current.
CC Gain
CC Delta
10
10
mohms
mohms
Counts
Counts
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to passed charge.
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines native offset of coulomb counter hardware
that should be removed from conversions.
CC Offset
Board Offset
–1418
0
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines native offset of the printed circuit board
parasitics that should be removed from conversions.
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines voltage offset between cell tab and ADC
input node to incorporate back into or remove from measurement, depending
on polarity.
Pack V Offset
0
mV
9.1.2 Detailed Design Procedure
9.1.2.1 BAT Voltage Sense Input
A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to
reduce noise on this sensitive high-impedance measurement node.
20
版权 © 2014, Texas Instruments Incorporated
bq27532-G1
www.ti.com.cn
ZHCSCT0 –SEPTEMBER 2014
9.1.2.2 SRP and SRN Current Sense Inputs
The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage
measured across the sense resistor. These components should be placed as close as possible to the coulomb
counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatch-
induced measurement errors.
9.1.2.3 Sense Resistor Selection
Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift
sense resistor with a 1-W power rating.
9.1.2.4 TS Temperature Sense Input
Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away
from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the
capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use
removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering
performance.
9.1.2.5 Thermistor Selection
The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type
(NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting
coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the
default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for
example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest
accuracy temperature measurement performance.
9.1.2.6 REGIN Power Supply Input Filtering
A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection
(PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of
coupling into the internal supply rails of the fuel gauge.
9.1.2.7 VCC LDO Output Filtering
A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge
load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage
ripple inside of the fuel gauge.
10 Power Supply Recommendations
10.1 Power Supply Decoupling
Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic
capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable
and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF
capacitor at VCC will suffice for satisfactory device performance.
版权 © 2014, Texas Instruments Incorporated
21
bq27532-G1
ZHCSCT0 –SEPTEMBER 2014
www.ti.com.cn
11 Layout
11.1 Layout Guidelines
11.1.1 Sense Resistor Connections
Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The
differential traces should be connected at the inside of the sense resistor pads and not anywhere along the high-
current trace path to prevent false increases to measured current that could result when measuring between the
sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads
from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely
matched in length as possible else additional measurement offset could occur. It is further recommended to add
copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to
shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that
could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as
close as possible to the coulomb counter input pins.
11.1.2 Thermistor Connections
The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as
possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses
periodically during temperature sensing windows.
11.1.3 High-Current and Low-Current Path Separation
For best possible noise performance, it is extremely important to separate the low-current and high-current loops
to different areas of the board layout. The fuel gauge and all support components should be situated on one side
of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the
low-current ground around instead of under high-current traces will further help to improve noise rejection.
22
版权 © 2014, Texas Instruments Incorporated
bq27532-G1
www.ti.com.cn
ZHCSCT0 –SEPTEMBER 2014
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档ꢀ
如需以下任何 TI 文档的副本，请致电 (800) 477-8924 联系德州仪器 (TI) 文献咨询中心或致电 (512) 434-1560 联
系支持中心。 订购时，可通过文档标题或文献编号识别文档。 也可通过 TI 网站获取更新版本的文档，网
址：www.ti.com。
1. 《bq27532-G1 技术参考手册用户指南》(SLUUB04)
2. 《bq27532EVM，带 bq27532 电池管理单元 Track™ 电量监测计和 bq24250 2.0A，适用于单节应用的开关模
式电池充电器用户指南》(SLUUB58)
12.2 商标
Impedance Track, NanoFree are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.4 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、首字母缩略词和定义。
版权 © 2014, Texas Instruments Incorporated
23
bq27532-G1
ZHCSCT0 –SEPTEMBER 2014
www.ti.com.cn
13 机械封装和可订购信息
以下页中包括机械封装和可订购信息。 这些信息是针对指定器件可提供的最新数据。 这些数据会在无通知且不对
本文档进行修订的情况下发生改变。 欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
24
版权 © 2014, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ27532YZFR-G1
BQ27532YZFT-G1
ACTIVE
ACTIVE
DSBGA
DSBGA
YZF
YZF
15
15
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
BQ27532
BQ27532
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE OUTLINE
YZF0015
DSBGA - 0.625 mm max height
SCALE 6.500
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.625 MAX
SEATING PLANE
0.05 C
0.35
0.15
BALL TYP
1 TYP
SYMM
E
D
SYMM
2
TYP
C
B
D: Max = 2.64 mm, Min = 2.58 mm
E: Max = 1.986 mm, Min =1.926 mm
0.5
TYP
A
1
2
3
0.35
0.25
C A B
15X
0.5 TYP
0.015
4219381/A 02/2017
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
15X ( 0.245)
(0.5) TYP
1
3
2
A
B
SYMM
C
D
E
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
0.05 MIN
(
0.245)
METAL
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.245)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219381/A 02/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
15X ( 0.25)
1
2
3
A
B
(0.5)
TYP
METAL
TYP
SYMM
C
D
E
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4219381/A 02/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
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邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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