BQ27545-G1 [TI]
单节电池、电池组侧、Impedance Track™ 电量监测计;
| 型号： | BQ27545-G1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 单节电池、电池组侧、Impedance Track™ 电量监测计 电池 |
| 文件： | 总55页 (文件大小：1579K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
适用于电池组集成的 bq27545-G1 单节锂离子电池电量计
1 特性
3 说明
1
•
电池电量计可适用于容量高达 14,500mAh 的 1 节
(1sXp) 锂离子 应用 支持高达 14500mAh 的容量
bq27545-G1 锂离子电池电量计是一款微控制器外设，
此外设能够提供针对单节锂离子电池组的电量计量。此
器件只需开发较少的系统微控制器固件即可实现精确的
电池电量计量。bq27545-G1 安装于电池组内或者带有
一个嵌入式电池（不可拆卸）的系统主板上。
•
微控制器外设提供：
–
–
用于电池温度报告的内部或者外部温度传感器
安全哈希算法 (SHA)-1 / 哈希消息认证码
(HMAC) 认证
bq27545-G1 使用已经获得专利的 Impedance Track™
算法来进行电量计量，并提供诸如剩余电量 (mAh)、
充电状态 (%)、续航时间（最小值）、电池电压 (mV)
和温度 (°C) 等信息。该器件还提供针对内部短路或电
池端子断开事件的检测功能。
–
–
使用寿命的数据记录
64 字节非易失性暂用闪存
•
•
基于已获专利的 Impedance Track™技术的电池电
量计量
–
–
用于电池续航能力精确预测的电池放电模拟曲线
针对电池老化、电池自放电以及温度和速率低效
情况进行自动调节
bq27545-G1 还 具有 针对安全电池组认证（使用
SHA-1/HMAC 认证算法）的集成支持功能。
–
低值感应电阻器（5mΩ 至 20mΩ）
该器件还采用 15 焊球 Nano-Free™ DSBGA 封装
(2.61 mm × 1.96 mm)，非常适合空间受限的 至关重
要。
先进的电量计量 特性
–
–
内部短路检测
电池端子断开侦测
器件信息(1)
•
•
高速 1 线 (HDQ) 和 I2C™接口格式，用于与主机系
统通信
器件型号
bq27545-G1
封装
YZF (15)
封装尺寸（标称值）
小型 15 焊球 Nano-Free™芯片尺寸球状引脚栅格
阵列 (DSBGA) 封装
2.61 mm × 1.96 mm
(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品
附录。
2 应用
•
•
•
•
•
智能手机
平板电脑
数码相机与视频摄像机
手持式终端
MP3 或多媒体播放器
简化原理图
Single Cell Li-Ion Battery Pack
PACK+
HDQ
REGIN
VCC
BAT
HDQ
TS
SDA
SCL
SDA
SCL
SRP
PROTECTION
IC
SE
SRN
CE
V
SS
CHG
DSG
FET
PACK
–
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSAT0
bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
目录
7.15 Typical Characteristics............................................ 9
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 16
8.5 Programming........................................................... 24
8.6 Register Maps......................................................... 39
Application and Implementation ........................ 41
9.1 Application Information............................................ 41
9.2 Typical Application ................................................. 41
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics: Supply Current................. 5
8
9
10 Power Supply Recommendations ..................... 45
10.1 Power Supply Decoupling..................................... 45
11 Layout................................................................... 45
11.1 Layout Guidelines ................................................. 45
11.2 Layout Example .................................................... 46
12 器件和文档支持 ..................................................... 47
12.1 文档支持................................................................ 47
12.2 社区资源................................................................ 47
12.3 商标....................................................................... 47
12.4 静电放电警告......................................................... 47
12.5 术语表 ................................................................... 47
13 机械、封装和可订购信息....................................... 47
7.6 Electrical Characteristics: Digital Input and Output
DC.............................................................................. 5
7.7 Electrical Characteristics: Power-On Reset.............. 5
7.8 Electrical Characteristics: 2.5-V LDO Regulator....... 5
7.9 Electrical Characteristics: Internal Clock Oscillators. 6
7.10 Electrical Characteristics: Integrating ADC
(Coulomb Counter) Characteristics............................ 6
7.11 Electrical Characteristics: ADC (Temperature and
Cell Voltage) .............................................................. 6
7.12 Electrical Characteristics: Data Flash Memory ....... 6
7.13 HDQ Communication Timing Characteristics ......... 7
7.14 I2C-Compatible Interface Timing Characteristics.... 7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision D (November 2015) to Revision E
Page
•
•
已更改 简化原理图.................................................................................................................................................................. 1
Changed the description for the SRP pin............................................................................................................................... 3
Changes from Revision C (September 2015) to Revision D
Page
•
•
•
•
•
•
•
已更改 “典型应用图表”更改为“简化原理图”............................................................................................................................. 1
已更改 封装尺寸...................................................................................................................................................................... 1
Changed "Device Options" to "Device Comparison Table" ................................................................................................... 3
Changed the descriptions for the SRP and SRN pins............................................................................................................ 3
Changed Electrical Characteristics: Power-On Reset ........................................................................................................... 5
Changed all instances of "relaxation mode" to "RELAX mode" .......................................................................................... 13
Added "FULLSLEEP mode" to the introduction in Power Modes ....................................................................................... 19
Changes from Revision B (October 2012) to Revision C
Page
•
•
已更改 将 32Ahr 更改为 14,500mAh ...................................................................................................................................... 1
已添加 ESD 额定值 表、特性 说明 部分，器件功能模式，应用和实施 部分，电源建议部分，布局 部分，器件和文档
支持 部分以及机械、封装和可订购信息 部分 ......................................................................................................................... 1
2
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
5 Device Comparison Table
PART
FIRMWARE
VERSION
PACKAGE(2)
TA
COMMUNICATION FORMAT
NUMBER(1)
BQ27545-G1
2.24
CSP–15
–40°C to 85°C
I2C, HDQ(1)
(1) bq27545-G1 is shipped in I2C mode.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
6 Pin Configuration and Functions
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
NO.
Analog input pin connected to the internal coulomb counter where SRP is nearest the CELL– connection.
Connect to a 5-mΩ to 20-mΩ sense resistor.
SRP
A1
IA
IA
Analog input pin connected to the internal coulomb counter where SRN is nearest the PACK– connection.
Connect to the 5-mΩ to 20-mΩ sense resistor.
SRN
B1
VSS
C1, C2
C3
P
O
P
Device ground
SE
Shutdown Enable output. Push-pull output.
VCC
REGIN
HDQ
TS
D1
Regulator output and processor power. Decouple with 1-µF ceramic capacitor to VSS.
E1
P
Regulator input. Decouple with 0.1-µF ceramic capacitor to VSS
.
A2
I/O
IA
I
HDQ serial communications line (Slave). Open drain.
B2
Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.
Chip Enable. Internal LDO is disconnected from REGIN when driven low.
CE
D2
BAT
E2
IA
Cell-voltage measurement input. ADC input. Recommend 4.8-V maximum for conversion accuracy.
Slave I2C serial communications clock input line for communication with system (Master). Use with 10-kΩ
pullup resistor (typical).
Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use
with 10-kΩ pullup resistor (typical).
SCL
SDA
A3
B3
I
I/O
NC
NC/GPIO D3, E3
Do not connect for proper operation; reserved for future GPIO.
(1) IA = Analog input, I/O = Digital input/output, P = Power connection, NC = No connect
Copyright © 2012–2018, Texas Instruments Incorporated
3
bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–40
MAX
5.5
UNIT
V
VI
Regulator input, REGIN
VCC
VIOD
VBAT
VI
Supply voltage
2.75
5.5
V
Open-drain I/O pins (SDA, SCL, HDQ)
BAT input, (pin E2)
V
5.5
V
Input voltage range to all others (pins GPIO, SRP, SRN, TS)
Operating free-air temperature
Functional temperature
VCC + 0.3
85
V
TA
°C
°C
°C
TF
–40
100
Tstg
Storage temperature
–65
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
±1500
±2000
±500
UNIT
BAT pin
all pins
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-
001(1)
Electrostatic
discharge
V(ESD)
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
MIN NOM
MAX
4.5
UNIT
No operating restrictions
No FLASH writes
2.8
VI
Supply voltage, REGIN
V
2.45
2.8
External input capacitor for internal LDO
between REGIN and VSS
CREGIN
0.1
µF
Nominal capacitor values specified.
Recommend a 5% ceramic X5R type capacitor
located close to the device.
External output capacitor for internal
LDO between VCC an VSS
CLDO25
tPUCD
0.47
1
µF
Power-up communication delay
250
ms
7.4 Thermal Information
bq27545-G1
THERMAL METRIC(1)
YZF (DSBGA)
UNIT
15 PINS
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
70
17
20
1
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
18
N/A
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
7.5 Electrical Characteristics: Supply Current
TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Fuel gauge in NORMAL mode
ILOAD > Sleep Current
(1)
ICC
Normal operating mode current
118
μA
Fuel gauge in SLEEP mode
ILOAD < Sleep Current
Low-power operating mode
current(1)
I(SLP)
I(FULLSLP)
I(HIB)
62
23
8
μA
μA
μA
Low-power operating mode
current(1)
Fuel gauge in FULLSLEEP mode
ILOAD < Sleep Current
HIBERNATE operating mode
Fuel gauge in HIBERNATE mode
ILOAD < Hibernate Current
(1)
current
(1) Specified by design. Not tested in production.
7.6 Electrical Characteristics: Digital Input and Output DC
TA = -40°C to 85°C; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Output voltage low (HDQ, SDA,
SCL, SE)
VOL
IOL = 3 mA
0.4
V
V
V
V
V
VOH(PP)
VOH(OD)
VIL
Output high voltage (SE)
IOH = –1 mA
VCC–0.5
VCC–0.5
–0.3
Output high voltage (HDQ, SDA,
SCL)
External pullup resistor connected to VCC
Input voltage low (HDQ, SDA, SCL)
0.6
5.5
Input voltage high (HDQ, SDA,
SCL)
VIH
1.2
VIL(CE)
VIH(CE)
Ilkg
CE Low-level input voltage
CE High-level input voltage
Input leakage current (I/O pins)
2.65
0.8
0.8
0.3
VREGIN = 2.8 V to 4.5 V
V
VREGIN–0.5
μA
7.7 Electrical Characteristics: Power-On Reset
TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIT+
Positive-going battery voltage input at
VCC
2.05
2.15
2.2
V
VHYS
Power-on reset hysteresis
115
mV
7.8 Electrical Characteristics: 2.5-V LDO Regulator
TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
TEST CONDITION
2.8 V ≤ V(REGIN) ≤ 4.5 V,
OUT ≤ 16 mA
2.45 V ≤ V(REGIN) < 2.8 V (low battery), IOUT ≤ 3 mA
MIN
2.3
TYP
MAX
UNIT
V
2.5
2.6
I
VCC
Regulator output voltage, VCC
2.3
V
Copyright © 2012–2018, Texas Instruments Incorporated
5
bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
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7.9 Electrical Characteristics: Internal Clock Oscillators
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER
Operating frequency
Operating frequency
TEST CONDITIONS
MIN
TYP
2.097
MAX
UNIT
MHz
kHz
f(OSC)
f(LOSC)
32.768
7.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
Input voltage range, V(SRN) and V(SRP)
Conversion time
TEST CONDITIONS
VSR = V(SRN) – V(SRP)
Single conversion
MIN
TYP
1
MAX
UNIT
V
VSR
–0.125
0.125
tCONV(SR)
s
Resolution
14
15
bits
μV
VOS(SR)
INL
Input offset
10
Integral nonlinearity error
Effective input resistance(1)
Input leakage current(1)
±0.007 ±0.034
FSR
MΩ
μA
ZIN(SR)
Ilkg(SR)
2.5
0.3
(1) Specified by design. Not production tested.
7.11 Electrical Characteristics: ADC (Temperature and Cell Voltage)
TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VSS – 0.125
VSS – 0.125
0.05
TYP
MAX
VCC
5
UNIT
V
VIN(TS)
Input voltage range (TS)
Input voltage range (BAT)
Input voltage range to ADC
Temperature sensor voltage gain
Conversion time
VIN(BAT)
VIN(ADC)
G(TEMP)
tCONV(ADC)
V
1
V
–2
1
mV/°C
ms
125
15
Resolution
14
bits
mV
MΩ
VOS(ADC)
Z(TS)
Input offset
(1)
Effective input resistance (TS)
bq27545-G1 not measuring
external temperature
8
8
bq27545-G1 not measuring cell
voltage
MΩ
kΩ
μA
Z(BAT)
Effective input resistance (BAT)(1)
Input leakage current
bq27545-G1 measuring cell
voltage
100
Ilkg(ADC)
0.3
(1) Specified by design. Not production tested.
7.12 Electrical Characteristics: Data Flash Memory
TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
Data retention(1)
TEST CONDITIONS
MIN
10
TYP
MAX
UNIT
Years
Cycles
ms
tDR
(1)
Flash programming write-cycles
Word programming time(1)
Flash-write supply current(1)
Data flash master erase time(1)
Flash page erase time(1)
20,000
tWORDPROG
ICCPROG
tDFERASE
tPGERASE
2
5
10
mA
200
20
ms
ms
(1) Specified by design. Not production tested.
6
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
7.13 HDQ Communication Timing Characteristics
TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
Cycle time, host to bq27545-G1
Cycle time, bq27545-G1 to host
Host sends 1 to bq27545-G1
bq27545-G1 sends 1 to host
Host sends 0 to bq27545-G1
bq27545-G1 sends 0 to host
Response time, bq27545-G1 to host
Break time
TEST CONDITIONS
MIN
190
190
0.5
32
NOM
MAX
UNIT
μs
t(CYCH)
t(CYCD)
t(HW1)
t(DW1)
t(HW0)
t(DW0)
t(RSPS)
t(B)
205
250
50
μs
μs
50
μs
86
145
145
950
μs
80
μs
190
190
40
μs
μs
t(BR)
Break recovery time
μs
t(RISE)
HDQ line rising time to logic 1 (1.2 V)
950
ns
7.14 I2C-Compatible Interface Timing Characteristics
TA = –40°C to 85°C, CREG = 0.47 μF, 2.45 V < VREGIN = VBAT < 5.5 V; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V
(unless otherwise noted)
PARAMETER
SCL/SDA rise time
TEST CONDITIONS
MIN
NOM
MAX
300
UNIT
ns
tr
tf
SCL/SDA fall time
300
ns
tw(H)
SCL pulse width (high)
SCL pulse width (low)
Setup for repeated start
Start to first falling edge of SCL
Data setup time
600
1.3
ns
tw(L)
μs
tsu(STA)
td(STA)
tsu(DAT)
th(DAT)
tsu(STOP)
tBUF
600
600
1000
0
ns
ns
ns
Data hold time
ns
Setup time for stop
600
66
ns
Bus free time between stop and start
μs
(1)
fSCL
Clock frequency
400
kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (Refer to I2C Interface.)
Copyright © 2012–2018, Texas Instruments Incorporated
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
1.2V
t(BR)
t(RISE)
t(B)
(b) HDQ line rise time
(a) Break and Break Recovery
t(DW1)
t(HW1)
t(DW0)
t(CYCD)
t(HW0)
t(CYCH)
(d) Gauge Transmitted Bit
(c) Host Transmitted Bit
1-bit
R/W
8-bit data
7-bit address
Break
t(RSPS)
(e) Gauge to Host Response
Figure 1. HDQ Timing Diagrams
t
t
t
t
t
f
t
r
(BUF)
SU(STA)
w(H)
w(L)
SCL
SDA
t
t
t
d(STA)
su(STOP)
f
t
r
t
t
su(DAT)
h(DAT)
REPEATED
START
STOP
START
Figure 2. I2C-Compatible Interface Timing Diagrams
8
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
7.15 Typical Characteristics
8.8
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
2.65
2.60
2.55
2.50
2.45
2.40
2.35
VREGIN = 2.7 V
VREGIN = 4.5 V
-40
-20
0
20
40
60
80
100
0
20
40
60
80
100
œ40
œ20
Temperature (èC)
Temperature (°C)
D002
C001
Figure 4. High-Frequency Oscillator Frequency Vs.
Temperature
Figure 3. Regulator Output Voltage Vs.
Temperature
34
33.5
33
5
4
3
2
32.5
32
1
0
-1
-2
-3
-4
-5
31.5
31
30.5
30
-40
-20
0
20
40
60
80
100
-30
-20
-10
0
10
20
30
40
50
60
Temperature (èC)
Temperature (èC)
D003
D004
Figure 5. Low-Frequency Oscillator Frequency Vs.
Temperature
Figure 6. Reported Internal Temperature Measurement Vs.
Temperature
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8 Detailed Description
8.1 Overview
The bq27545-G1 accurately predicts the battery capacity and other operational characteristics of a single Li-
based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-
of-charge (SOC) and time-to-empty (TTE).
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command(), are used to read and write information in the bq27545-G1 control and status registers, as well as its
data flash locations. Commands are sent from the system to the gauge using the bq27545-G1 serial
communications engine, and can be executed during application development, pack manufacture, or end-
equipment operation.
Cell information is stored in the bq27545-G1 in non-volatile flash memory. Many of these data flash locations are
accessible during application development. They cannot, generally, be accessed directly during end-equipment
operation. To access to these locations, use the bq27546-G1 companion evaluation software, individual
commands, or a sequence of data-flash-access commands. To access a desired data flash location, the correct
data flash Subclass and offset must be known.
The bq27545-G1 provides 64 bytes of user-programmable data flash memory, partitioned into two (2) 32-byte
blocks: Manufacturer Info Block A and Manufacturer Info Block B. This data space is accessed through a
data flash interface. For specific details on accessing the data flash, see Manufacturer Information Blocks. The
key to the bq27545-G1 high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve less than 1% error across a wide variety of operating conditions and over the
lifetime of the battery.
The bq27545-G1 measures charge/discharge activity by monitoring the voltage across a small-value series
sense resistor (5 mΩ to 20 mΩ typical) located between the CELL– and the battery’s PACK– terminal. When a
cell is attached to the bq27545-G1, cell impedance is learned based on cell current, cell open-circuit voltage
(OCV), and cell voltage under loading conditions.
The bq27545-G1 external temperature sensing is optimized with the use of a high accuracy negative
temperature coefficient (NTC) thermistor with R25 = 10 kΩ ± 1% and B25/85 = 3435 K ± 1% (such as Semitec
103AT) for measurement. The bq27545-G1 can also be configured to use its internal temperature sensor. The
bq27545-G1 uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell
protection functionality.
To minimize power consumption, the bq27545-G1 has different power modes: NORMAL, SLEEP, FULLSLEEP,
and HIBERNATE. The bq27545-G1 passes automatically between these modes, depending upon the occurrence
of specific events, though a system processor can initiate some of these modes directly. Power Modes has more
details.
NOTE
FORMATTING CONVENTIONS IN THIS DOCUMENT:
Commands: italics with parentheses() and no breaking spaces. e.g., RemainingCapacity()
Data Flash: italics, bold, and breaking spaces. e.g., Design Capacity
Register bits and flags: italics with brackets[ ]. e.g., [TDA]
Data flash bits: italics, bold, and brackets[ ]. e.g., [LED1]
Modes and states: ALL CAPITALS. e.g., UNSEALED mode
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8.2 Functional Block Diagram
REGIN
Divider
BAT
TS
CE
Oscillator
System Clock
2.5-V LDO
+
Power Mgt
ADC
VCC
Temp
Sensor
HDQ
SRP
SRN
Communications
SCL
Coulomb
-
Counter
Impedance
Track
Engine
HDQ/I2C
SDA
Peripherals
SE
Program Memory
Data Memory
VSS
8.3 Feature Description
8.3.1 Fuel Gauging
The bq27545-G1 measures the cell voltage, temperature, and current to determine battery SOC based on
Impedance Track algorithm (see the Theory and Implementation of Impedance Track Battery Fuel-Gauging
Algorithm Application Report [SLUA450] for more information). The bq27545-G1 monitors charge and discharge
activity by sensing the voltage across a small-value resistor (5 mΩ to 20 mΩ typical) between the SRP and SRN
pins and in series with the cell. By integrating charge passing through the battery, the battery’s SOC is adjusted
during battery charge or discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the
amount of charge passed. When an application load is applied, the impedance of the cell is measured by
comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.
Measurements of OCV and charge integration determine chemical state of charge and chemical capacity
(Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of
parallel cells. It is also used for the value in Design Capacity. The bq27545-G1 acquires and updates the
battery-impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value,
to determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature.
FullChargeCapacity() is reported as capacity available from a fully charged battery under the present load and
temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and
FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and
FullChargeCapacity() respectively.
The bq27545-G1 has two flags accessed by the Flags() function that warns when the battery’s SOC has fallen to
critical levels. When RemainingCapacity() falls below the first capacity threshold, specified in SOC1 Set
Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity() rises
above SOC1 Clear Threshold. All units are in mAh.
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Feature Description (continued)
When RemainingCapacity() falls below the second capacity threshold, SOCF Set Threshold, the [SOCF] (State
of Charge Final) flag is set, serving as a final discharge warning. If SOCF Set Threshold = –1, the flag is
inoperative during discharge. Similarly, when RemainingCapacity() rises above SOCF Clear Threshold and the
[SOCF] flag has already been set, the [SOCF] flag is cleared. All units are in mAh.
The bq27545-G1 has two additional flags accessed by the Flags() function that warns of internal battery
conditions. The fuel gauge monitors the cell voltage during relaxed conditions to determine if an internal short
has been detected. When this condition occurs, [ISD] will be set. The bq27545-G1 also has the capability of
detecting when a tab has been disconnected in a 2-cell parallel system by actively monitoring the SOH. When
this conditions occurs, [TDD] will be set.
8.3.2 Impedance Track Variables
The bq27545-G1 has several data flash variables that permit the user to customize the Impedance Track
algorithm for optimized performance. These variables are dependent upon the power characteristics of the
application as well as the cell itself.
8.3.2.1 Load Mode
Load Mode is used to select either the constant-current or constant-power model for the Impedance Track
algorithm as used in Load Select (see Load Select). When Load Mode is 0, the Constant Current Model is used
(default). When Load Mode is 1, the Constant Power Model is used. The [LDMD] bit of CONTROL_STATUS
reflects the status of Load Mode.
8.3.2.2 Load Select
Load Select defines the type of power or current model to be used to compute load-compensated capacity in the
Impedance Track algorithm. If Load Mode = 0 (Constant Current), then the options presented in Table 1 are
available.
Table 1. Constant-Current Model Used When Load Mode = 0
Load Select Value
CURRENT MODEL USED
Average discharge current from previous cycle: There is an internal register that records the average discharge current through each
entire discharge cycle. The previous average is stored in this register.
0
1 (default)
Present average discharge current: This is the average discharge current from the beginning of this discharge cycle until present time.
Average current: based off the AverageCurrent()
2
3
4
5
6
Current: based off of a low-pass-filtered version of AverageCurrent() (τ = 14 s)
Design capacity/5: C Rate based off of Design Capacity /5 or a C/5 rate in mA.
Use the value specified by AtRate()
Use the value in User_Rate-mA: This gives a completely user-configurable method.
If Load Mode = 1 (Constant Power) then the following options are available:
Table 2. Constant-Power Model Used When Load Mode = 1
Load Select Value
POWER MODEL USED
Average discharge power from previous cycle: There is an internal register that records the average discharge power through each
entire discharge cycle. The previous average is stored in this register.
0
1
2
3
4
5
6
Present average discharge power: This is the average discharge power from the beginning of this discharge cycle until present time.
Average current × voltage: based off the AverageCurrent() and Voltage().
Current × voltage: based off of a low-pass-filtered version of AverageCurrent() (τ = 14 s) and Voltage()
Design energy/5: C Rate based off of Design Energy /5 or a C/5 rate in mA.
Use the value specified by AtRate()
Use the value in User_Rate-Pwr. This gives a completely user-configurable method.
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8.3.2.3 Reserve Cap-mAh
Reserve Cap-mAh determines how much actual remaining capacity exists after reaching
0
RemainingCapacity(), before Terminate Voltage is reached when Load Mode = 0 is selected. A loaded rate or
no-load rate of compensation can be selected for Reserve Cap by setting the [RESCAP] bit in Pack
Configuration data flash register.
8.3.2.4 Reserve Energy
Reserve Energy determines how much actual remaining capacity exists after reaching 0 RemainingCapacity()
which is equivalent to 0 remaining power, before Terminate Voltage is reached when Load Mode = 1 is
selected. A loaded rate or no-load rate of compensation can be selected for Reserve Cap by setting the
[RESCAP] bit in Pack Configuration data flash register..
8.3.2.5 Design Energy Scale
Design Energy Scale is used to select the scale/unit of a set of data flash parameters. The value of Design
Energy Scale can be either 1 or 10 only, other values are not supported. For battery capacities larger than
6 AHr, Design Energy Scale = 10 is recommended.
Table 3. Data Flash Parameter Scale/Unit Based On Design Energy Scale
DATA FLASH
Design Energy
Reserve Energy
Avg Power Last Run
User Rate-Pwr
T Rise
DESIGN ENERGY SCALE = 1 (default)
DESIGN ENERGY SCALE = 10
mWh
mWh
cWh
cWh
mW
cW
mWh
cWh
No Scale
Scaled by ×10
8.3.2.6 Dsg Current Threshold
This register is used as a threshold by many functions in the bq27545-G1 to determine if actual discharge current
is flowing into or out of the cell. The default for this register should be sufficient for most applications. This
threshold should be set low enough to be below any normal application load current but high enough to prevent
noise or drift from affecting the measurement.
8.3.2.7 Chg Current Threshold
This register is used as a threshold by many functions in the bq27545-G1 to determine if actual charge current is
flowing into or out of the cell. The default for this register should be sufficient for most applications. This threshold
should be set low enough to be below any normal charge current but high enough to prevent noise or drift from
affecting the measurement.
8.3.2.8 Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
The Quit Current is used as part of the Impedance Track algorithm to determine when the bq27545-G1 enters
RELAX mode from a current flowing mode in either the charge direction or the discharge direction. The value of
Quit Current is set to a default value that should be above the standby current of the system.
Either of the following criteria must be met to enter RELAX mode:
1. | AverageCurrent() | < | Quit Current | for Dsg Relax Time.
2. | AverageCurrent() | < | Quit Current | for Chg Relax Time.
After about 6 minutes in RELAX mode, the bq27545-G1 attempts to take accurate OCV readings. An additional
requirement of dV/dt < 1 µV/s is required for the bq27545-G1 to perform Qmax updates. These updates are used
in the Impedance Track algorithms. It is critical that the battery voltage be relaxed during OCV readings and that
the current is not higher than C/20 when attempting to go into RELAX mode.
Quit Relax Time specifies the minimum time required for AverageCurrent() to remain above the QuitCurrent
threshold before exiting RELAX mode.
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8.3.2.9 Qmax
Qmax contains the maximum chemical capacity of the active cell profiles, and is determined by comparing states
of charge before and after applying the load with the amount of charge passed. They also correspond to capacity
at low rate of discharge, such as C/20 rate. For high accuracy, this value is periodically updated by the bq27545-
G1 during operation. Based on the battery cell capacity information, the initial value of chemical capacity should
be entered in Qmax field. The Impedance Track algorithm will update this value and maintain it in the Pack
profile.
8.3.2.10 Update Status
The Update Status register indicates the status of the Impedance Track algorithm.
Table 4. Update Status Definitions
UPDATE STATUS
STATUS
Qmax and Ra data are learned, but Impedance Track is not enabled. This should be the standard setting for a
golden image.
0x02
0x04
0x05
Impedance Track is enabled but Qmax and Ra data are not learned.
Impedance Track is enabled and only Qmax has been updated during a learning cycle.
Impedance Track is enabled. Qmax and Ra data are learned after a successful learning cycle. This should be the
operation setting for end equipment.
0x06
This register should only be updated by the bq27545-G1 during a learning cycle or when IT_ENABLE
subcommand is received. Refer to the How to Generate Golden Image for Single-Cell Impedance Track Device
Application Note (SLUA544) for learning cycle details.
8.3.2.11 Avg I Last Run
The bq27545-G1 logs the current averaged from the beginning to the end of each discharge cycle. It stores this
average current from the previous discharge cycle in this register. This register should never be modified. It is
only updated by the bq27545-G1 when required.
8.3.2.12 Avg P Last Run
The bq27545-G1 logs the power averaged from the beginning to the end of each discharge cycle. It stores this
average power from the previous discharge cycle in this register. To get a correct average power reading the
bq27545-G1 continuously multiplies instantaneous current times Voltage() to get power. It then logs this data to
derive the average power. This register should never require modification. It is only updated by the bq27545-G1
when required.
8.3.2.13 Delta Voltage
The bq27545-G1 stores the maximum difference of Voltage() during short load spikes and normal load, so the
Impedance Track algorithm can calculate remaining capacity for pulsed loads. It is not recommended to change
this value.
8.3.2.14 Ra Tables and Ra Filtering Related Parameters
These tables contain encoded data and are automatically updated during device operation. The bq27545-G1 has
a filtering process to eliminate unexpected fluctuations in Ra values while the Ra values are being updated. The
DF parameters RaFilter, RaMaxDelta, MaxResfactor, and MinResfactor control the Filtering process of Ra
values. RaMaxDelta Limits the change in Ra values to an absolute magnitude. MinResFactor and
MaxResFactor parameters are cumulative filters which limit the change in Ra values to a scale on a per
discharge cycle basis. These values are data flash configurable. No further user changes should be made to Ra
values except for reading/writing the values from a pre-learned pack (part of the process for creating golden
image files).
8.3.2.15 MaxScaleBackGrid
MaxScaleBackGrid parameter limits the resistance grid point after which back scaling will not be performed.
This variable ensures that the resistance values in the lower resistance grid points remain accurate while the
battery is at a higher DoD state.
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8.3.2.16 Max DeltaV, Min DeltaV
Maximal/Minimal value allowed for delta V, which will be subtracted from simulated voltage during remaining
capacity simulation.
8.3.2.17 Qmax Max Delta %
Maximal change of Qmax during one update, as percentage of Design Capacity. If the gauges attempts to
change Qmax exceeds this limit, changed value will be capped to old value ± DesignCapacity ×
QmaxMaxDelta/100.
8.3.2.18 Fast Resistance Scaling
When Fast Resistance Scaling is enabled by setting the [FConvEn] bit in Pack Configuration B, the algorithm
improves accuracy at the end of discharge. The RemainingCapacity() and StateOfCharge() should smoothly
converge to 0. The algorithm starts convergence improvements when cell voltage goes below (Terminate
Voltage + Term V Delta) or StateofCharge() goes below Fast Scale Start SOC. For most applications, the
default value of Term V Delta and Fast Scale Start SOC are recommended. Also TI recommends keeping
(Terminate Voltage + Term V Delta) below 3.6 V for most battery applications.
8.3.2.19 StateOfCharge() Smoothing
When operating conditions change (such as temperature, discharge current, and resistance, for example), it can
lead to large changes of compensated battery capacity and battery capacity remaining. These changes can
result in large changes of StateOfCharge(). When [SmoothEn] is enabled in Pack Configuration C, the
smoothing algorithm injects gradual changes of battery capacity when conditions vary. This results in a gradual
change of StateOfCharge() and can provide a better end-user experience for StateOfCharge() reporting.
The RemainingCapacity(), FullChargeCapacity(), and StateOfCharge() are modified depending on [SmoothEn] as
below.
[SmoothEn]
RemainingCapacity()
UnfilteredRM()
FullChargeCapacity()
UnfilteredFCC()
StateOfCharge()
0
1
UnfilteredRM()/UnfilteredFCC()
FilteredRM()/FilteredFCC()
FilteredRM()
FilteredFCC()
8.3.2.20 DeltaV Max Delta
Maximal change of Delta V value. If attempted change of the value exceeds this limit, change value will be
capped to old value ±DeltaV Max Delta.
8.3.2.21 Lifetime Data Logging Parameters
The Lifetime Data logging function helps development and diagnosis with the bq27545-G1. IT_ENABLE must be
enabled (Command 0x0021) for lifetime data logging functions to be active. bq27545-G1 logs the lifetime data as
specified in the Lifetime Data and Lifetime Temp Samples data Flash Subclasses. The data log recordings are
controlled by the Lifetime Resolution data flash subclass.
The Lifetime Data Logging can be started by setting the IT_ENABLE bit and setting the Update Time register to a
non-zero value.
Once the Lifetime Data Logging function is enabled, the measured values are compared to what is already
stored in the data flash. If the measured value is higher than the maximum or lower than the minimum value
stored in the data flash by more than the Resolution set for at least one parameter, the entire Data Flash Lifetime
Registers are updated after at least LTUpdateTime.
LTUpdateTime sets the minimum update time between DF writes. When a new maximum or minimum is
detected, a LT Update window of [update time] second is enabled and the DF writes occur at the end of this
window. Any additional max/min value detected within this window will also be updated. The first new maximum
or minimum value detected after this window will trigger the next LT Update window.
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Internal to bq27545-G1, there exists a RAM maximum or minimum table in addition to the DF maximum or
minimum table. The RAM table is updated independent of the resolution parameters. The DF table is updated
only if at least one of the RAM parameters exceeds the DF value by more than resolution associated with it.
When DF is updated, the entire RAM table is written to DF. Consequently, it is possible to see a new maximum
or minimum value for a certain parameter even if the value of this parameter never exceeds the maximum or
minimum value stored in the data flash for this parameter value by the resolution amount.
The Life Time Data Logging of one or more parameters can be reset or restarted by writing new default (or
starting) values to the corresponding data flash registers through sealed or unsealed access as described below.
However, when using unsealed access, new values will only take effect after device reset
The logged data can be accessed as R/W in UNSEALED mode from Lifetime Data Subclass (Subclass ID = 59)
of data flash. Lifetime data may be accessed (R/W) when sealed using a process identical Manufacturer Info
Block B. The DataFlashBlock command code is 4. Note only the first 32 bytes of lifetime data (not resolution
parameters) can be R/W when sealed. See Manufacturer Information Blocks for sealed access. The logging
settings such as Temperature Resolution, Voltage Resolution, Current Resolution, and Update Time can be
configured only in UNSEALED mode by writing to the Lifetime Resolution Subclass (SubclassID = 66) of the data
flash.
The Lifetime resolution registers contain the parameters that set the limits related to how much a data parameter
must exceed the previously logged maximum or minimum value to be updated in the lifetime log. For example, V
must exceed MaxV by more than Voltage Resolution to update MaxV in the data flash.
8.4 Device Functional Modes
8.4.1 System Control Function
The bq27545-G1 provides system control functions which allows the fuel gauge to enter SHUTDOWN mode to
power-off with the assistance of external circuit or provides interrupt function to the system. Table 5 shows the
configurations for SE and HDQ pins.
Table 5. SE and HDQ Pin Function
COMMUNICATION
[INTSEL]
SE PIN FUNCTION
HDQ PIN FUNCTION
MODE
I2C
Not Used
HDQ Mode(2)
(1)
0 (default)
INTERRUPT Mode
SHUTDOWN Mode
HDQ
I2C
INTERRUPT mode
HDQ Mode(2)
1
HDQ
(1) [SE_EN] bit in Pack Configuration can be enabled to use [SE] and [SHUTDWN] bits in
CONTROL_STATUS() function. The SE pin shutdown function is disabled.
(2) HDQ pin is used for communication and HDQ Host Interrupt Feature is available.
8.4.1.1 SHUTDOWN Mode
In the SHUTDOWN mode, the SE pin is used to signal external circuit to power-off the fuel gauge. This feature is
useful to shutdown the fuel gauge in a deeply discharged battery to protect the battery. By default, the
SHUTDOWN mode is in normal state. By sending the SET_SHUTDOWN subcommand or setting the [SE_EN]
bit in Pack Configuration register, the [SHUTDWN] bit is set and enables the shutdown feature. When this
feature is enabled and [INTSEL] is set, the SE pin can be in normal state or SHUTDOWN state. The
SHUTDOWN state can be entered in HIBERNATE mode (ONLY if HIBERNATE mode is enabled due to low cell
voltage), all other power modes will default SE pin to NORMAL state. Table 6 shows the SE pin state in
NORMAL or SHUTDOWN mode. The CLEAR_SHUTDOWN subcommand or clearing [SE_EN] bit in the Pack
Configuration register can be used to disable SHUTDOWN mode.
The bq27545 SE pin will be high impedance at power on reset (POR), the [SE_POL] does not affect the state of
SE pin at POR. Also [SE_PU] configuration changes will only take effect after POR. In addition, the [INTSEL]
only controls the behavior of the SE pin; it does not affect the function of [SE] and [SHUTDWN] bits.
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Table 6. SE Pin State
SHUTDOWN Mode
[INTSEL] = 1 and
([SE_EN] or [SHUTDOWN] = 1)
[SE_PU] [SE_POL]
NORMAL state SHUTDOWN state
0
0
1
1
0
1
0
1
High Impedance
0
0
1
0
High Impedance
0
1
8.4.1.2 INTERRUPT Mode
By utilizing the INTERRUPT mode, the system can be interrupted based on detected fault conditions as specified
in Table 9. The SE or HDQ pin can be selected as the interrupt pin by configuring the [INTSel] bit based on . In
addition, the pin polarity and pullup (SE pin only) can be configured according to the system needs as described
in Table 7 or Table 8.
Table 7. SE Pin in INTERRUPT Mode ([INTSEL] = 0)
[SE_PU]
[INTPOL]
INTERRUPT CLEAR
INTERRUPT SET
0
0
1
1
0
1
0
1
High Impedance
0
0
1
0
High Impedance
0
1
Table 8. HDQ Pin in INTERRUPT Mode ([INTSEL] = 1)
[INTPOL]
INTERRUPT CLEAR
INTERRUPT SET
0
0
1
High Impedance
0
High Impedance
Table 9. INTERRUPT Mode Fault Conditions
Flags() STATUS
INTERRUPT CONDITION
ENABLE CONDITION
COMMENT
BIT
The SOC1 Set/Clear interrupt is based on the[SOC1] Flag
condition when RemainingCapacity() reaches the SOC1 Set
or Clear threshold in the data flash.
SOC1 Set/Clear
[SOC1]
Always
The [OTC] Flag is set/clear based on conditions specified in
Over-Temperature: Charge.
Over Temperature Charge
[OTC]
[OTD]
OT Chg Time ≠ 0
OT Dsg Time ≠ 0
Always
Over Temperature
Discharge
The [OTD] Flag is set/clear based on conditions specified in
Over-Temperature: Discharge.
The [BATHI] Flag is set/clear based on conditions specified in
Battery Level Indication.
Battery High
Battery Low
[BATHI]
[BATLOW]
[ISD]
The [BATLOW] Flag is set/clear based on conditions
specified in Battery Level Indication.
Always
[SE_ISD] = 1 in
The [SE_ISD] Flag is set/clear based on conditions specified
Pack Configuration B in Internal Short Detection.
Internal Short Detection
Tab disconnection
detection
[SE_TDD] = 1 in
Pack Configuration B Tab Disconnection Detection.
The [TDD] Flag is set/clear based on conditions specified in
[TDD]
8.4.1.3 Battery Level Indication
The bq27545 can indicate when battery voltage has fallen below or risen above predefined thresholds. The
[BATHI] of Flags() is set high to indicate Voltage() is above the BH Set Volt Threshold for a predefined duration
set in the BH Volt Time. This flag returns to low once battery voltage is below or equal the BH Clear Volt
threshold. TI recommends configuring the BH Set Volt Threshold higher than the BH Clear Volt threshold to
provide proper voltage hysteresis.
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The [BATLOW] of Flags() is set high to indicate Voltage() is below the BL Set Volt Threshold for predefined
duration set in the BL Volt Time. This flag returns to low once battery voltage is above or equal the BL Clear
Volt threshold. TI recommends configuring the BL Set Volt Threshold lower than the BL Clear Volt threshold
to provide proper voltage hysteresis.
The [BATHI] and [BATLOW] flags can be configured to control the interrupt pin (SE or HDQ) by enabling
INTERRUPT mode. Refer to INTERRUPT Mode for details.
8.4.1.4 Internal Short Detection
The bq27545-G1 can indicate detection of an internal battery short by setting the [SE_ISD] bit in Pack
Configuration B. The device compares the self-discharge current calculated based StateOfCharge() in RELAX
mode and AverageCurrent() measured in the system. The self-discharge rate is measured at 1 hour interval.
When battery SelfDischargeCurrent() is less than the predefined (–Design Capacity/ISD Current threshold), the
[ISD] of Flags() is set high. The [ISD] of Flags() can be configured to control interrupt pin (SE or HDQ) by
enabling INTERRUPT mode. Refer to INTERRUPT Mode for details.
8.4.1.5 Tab Disconnection Detection
The bq27545-G1 can indicate tab disconnection by detecting change of StateOfHealth(). This feature is enabled
by setting [SE_TDD] bit in Pack Configuration B. The [TDD] of Flags() is set when the ratio of current
StateOfHealth() divided by the previous StateOfHealth() reported is less than TDD SOH Percent. The [TDD] of
Flags() can be configured to control an interrupt pin (SE or HDQ) by enabling INTERRUPT mode. Refer to
INTERRUPT Mode for details.
8.4.2 Temperature Measurement and the TS Input
The bq27545-G1 measures battery temperature through the TS input to supply battery temperature status
information to the fuel gauging algorithm and charger-control sections of the gauge. Alternatively, the gauge can
also measure internal temperature through its on-chip temperature sensor, but only if the [TEMPS] bit of Pack
Configuration register is cleared.
Regardless of which sensor is used for measurement, a system processor can request the current battery
temperature by calling the Temperature() function (see Authentication for specific information).
The thermistor circuit requires the use of an external 10-kΩ thermistor with negative temperature coefficient
(NTC) thermistor with R25 = 10 kΩ ± 1% and B25/85 = 3435 kΩ ± 1% (such as Semitec 103AT) that connects
between the VCC and TS pins. Additional circuit information for connecting the thermistor to the bq27545 is
shown in the 图 9.
8.4.3 Over-Temperature Indication
8.4.3.1 Over-Temperature: Charge
If during charging, Temperature() reaches the threshold of OT Chg for a period of OT Chg Time and
AverageCurrent() ≥ Chg Current Threshold, then the [OTC] bit of Flags() is set. When Temperature() falls to OT
Chg Recovery, the [OTC] of Flags() is reset.
If OT Chg Time = 0, the feature is disabled.
8.4.3.2 Over-Temperature: Discharge
If during discharging, Temperature() reaches the threshold of OT Dsg for a period of OT Dsg Time, and
AverageCurrent() ≤ –Dsg Current Threshold, then the [OTD] bit of Flags() is set. When Temperature() falls to
OT Dsg Recovery, the [OTD] bit of Flags() is reset.
If OT Dsg Time = 0, the feature is disabled.
8.4.4 Charging and Charge Termination Indication
8.4.4.1 Detection Charge Termination
For proper bq27545-G1 operation, the cell charging voltage must be specified by the user. The default value for
this variable is in the data flash Charging Voltage.
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The bq27545-G1 detects charge termination when (1) during 2 consecutive periods of Current Taper Window,
the AverageCurrent() is < Taper Current, (2) during the same periods, the accumulated change in capacity >
0.25mAh/Current Taper Window, and (3) Voltage() > Charging Voltage – Taper Voltage. When this occurs,
the [CHG] bit of Flags() is cleared. Also, if the [RMFCC] bit of Pack Configuration is set, RemainingCapacity()
is set equal to FullChargeCapacity(). When TCA_Set is set to –1, it disables the use of the charger alarm
threshold. In that case, Terminate Charge is set when the taper condition is detected. When FC_Set is set to
–1, it disables the use of the full charge detection threshold. In that case, the [FC] bit is not set until the taper
condition is met.
8.4.4.2 Charge Inhibit
The bq27545-G1 can indicate when battery temperature has fallen below or risen above predefined thresholds
(Charge Inhibit Temp Low and Charge Inhibit Temp High, respectively). In this mode, the [CHG_INH] of
Flags() is made high to indicate this condition, and is returned to its low state, once battery temperature returns
to the range [Charge Inhibit Temp Low + Temp Hys, Charge Inhibit Temp High – Temp Hys].
8.4.5 Power Modes
The bq27545-G1 has four power modes: NORMAL, SLEEP, FULLSLEEP, and HIBERNATE.
•
•
In NORMAL mode, the bq27545-G1 is fully powered and can execute any allowable task.
In SLEEP mode, the fuel gauge exists in a reduced-power state, periodically taking measurements and
performing calculations.
•
•
During FULLSLEEP mode, the bq27545-G1 periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
In HIBERNATE mode, the fuel gauge is in a very low-power state, but can be awoken by communication or
certain I/O activity.
The relationship between these modes is shown in Figure 7. Details are described in the sections that follow.
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POR
Exit From HIBERNATE
VCELL < POR threshold
Exit From HIBERNATE
NORMAL
Communication Activity
Fuel gauging and data
updated every 1s
OR
The device clears Control Status
[HIBERNATE] = 0
Exit From SLEEP
Pack Configuration [SLEEP] = 0
OR
Recommend Host also set Control
Status [HIBERNATE] = 0
| AverageCurrent( ) | > Sleep Current
OR
Current is Detected above IWAKE
Entry to SLEEP
Pack Configuration [SLEEP] = 1
AND
| AverageCurrent( ) |≤ Sleep Current
SLEEP
Fuel gauging and data
updated every 20 seconds
HIBERNATE
Wakeup From HIBERNATE
Communication Activity
AND
Comm address is NOT for the device
Disable all device
subcircuits except GPIO.
Entry to WAITFULLSLEEP
Exit From WAITFULLSLEEP
If Full Sleep Wait Time > 0,
Guage ignores Control Status
[FULLSLEEP]
Entry to FULLSLEEP
Any Communication Cmd
If Full Sleep Wait Time = 0,
Host must set Control Status
[FULLSLEEP]=1
Exit From WAIT_HIBERNATE
WAITFULLSLEEP
Host must set Control Status
[HIBERNATE] = 0
AND
FULLSLEEP Count Down
VCELL > Hibernate Voltage
Exit From
FULLSLEEP
Any
Communication
Cmd
Entry to FULLSLEEP
Count <1
Exit From WAIT_HIBERNATE
Cell relaxed
AND
| AverageCurrent() | < Hibernate
Current
WAIT_HIBERNATE
FULLSLEEP
OR
In low power state of SLEEP
mode. Gas gauging and data
updated every 20 seconds
Fuel gauging and data
updated every 20 seconds
Cell relaxed
AND
VCELL < Hibernate Voltage
Exit From SLEEP
(Host has set Control Status
[HIBERNATE] = 1
OR
VCELL < Hibernate Voltage
System Shutdown
System Sleep
Figure 7. Power Mode Diagram
8.4.5.1 NORMAL Mode
The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent(),
Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to
change states are also made. This mode is exited by activating a different power mode.
Because the gauge consumes the most power in NORMAL mode, the Impedance Track algorithm minimizes the
time the fuel gauge remains in this mode.
8.4.5.2 SLEEP Mode
SLEEP mode is entered automatically if the feature is enabled (Pack Configuration [SLEEP]) = 1) and
AverageCurrent() is below the programmable level Sleep Current. Once entry into SLEEP mode has been
qualified, but before entering it, the bq27545-G1 performs an ADC autocalibration to minimize offset.
While in SLEEP mode, the fuel gauge can suspend serial communications as much as 4 ms by holding the
comm line(s) low. This delay is necessary to correctly process host communication, because the fuel gauge
processor is mostly halted in SLEEP mode.
During the SLEEP mode, the bq27545-G1 periodically takes data measurements and updates its data set.
However, a majority of its time is spent in an idle condition.
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The bq27545-G1 exits SLEEP if any entry condition is broken, specifically when (1) AverageCurrent() rises
above Sleep Current, or (2) a current in excess of IWAKE through RSENSE is detected when the Iwake comparator
is enabled.
8.4.5.3 FULLSLEEP Mode
FULLSLEEP mode is entered automatically when the bq27545-G1 is in SLEEP mode and the timer counts down
to 0 (Full Sleep Wait Time > 0). FULLSLEEP mode is entered immediately after entry to SLEEP if Full Sleep
Wait Time is set to 0 and the host sets the [FULLSLEEP] bit in the CONTROL_STATUS register using the
SET_FULLSLEEP subcommand.
The gauge exits the FULLSLEEP mode when there is any communication activity. The [FULLSLEEP] bit can
remain set (Full Sleep Wait Time > 0) or be cleared (Full Sleep Wait Time ≤ 0) after exit of FULLSLEEP mode.
Therefore, EVSW communication activity might cause the gauge to exit FULLSLEEP MODE and display the
[FULLSLEEP] bit as clear. The execution of SET_FULLSLEEP to set [FULLSLEEP] bit is required when Full
Sleep Wait Time ≤ 0 to re-enter FULLSLEEP mode. The FULLSLEEP mode can be verified by measuring the
current consumption of the gauge. In this mode, the high frequency oscillator is turned off. The power
consumption is further reduced in this mode compared to the SLEEP mode.
While in FULLSLEEP mode, the fuel gauge can suspend serial communications as much as 4 ms by holding the
comm line(s) low. This delay is necessary to correctly process host communication, because the fuel gauge
processor is mostly halted in SLEEP mode.
The bq27545-G1 exits FULLSLEEP if any entry condition is broken, specifically when (1) AverageCurrent() rises
above Sleep Current, or (2) a current in excess of IWAKE through RSENSE is detected when the Iwake comparator
is enabled.
8.4.5.4 HIBERNATE Mode
HIBERNATE mode should be used for long-term pack storage or when the host system must enter a low-power
state, and minimal gauge power consumption is required. This mode is ideal when the host is set to its own
HIBERNATE, SHUTDOWN, or OFF mode. The gauge waits to enter HIBERNATE mode until it has taken a valid
OCV measurement (cell relaxed) and the magnitude of the average cell current has fallen below Hibernate
Current. When the conditions are met, the fuel gauge can enter HIBERNATE due to either low cell voltage or by
having the [HIBERNATE] bit of the CONTROL_STATUS register set. The gauge will remain in HIBERNATE
mode until any communication activity appears on the communication lines and the address is for bq27545. In
addition, the SE pin SHUTDOWN mode function is supported only when the fuel gauge enters HIBERNATE due
to low cell voltage.
When the gauge wakes up from HIBERNATE mode, the [HIBERNATE] bit of the CONTROL_STATUS register is
cleared. The host is required to set the bit to allow the gauge to re-enter HIBERNATE mode if desired.
Because the fuel gauge is dormant in HIBERNATE mode, the battery should not be charged or discharged in this
mode, because any changes in battery charge status will not be measured. If necessary, the host equipment can
draw a small current (generally infrequent and less than 1 mA, for purposes of low-level monitoring and
updating); however, the corresponding charge drawn from the battery will not be logged by the gauge. Once the
gauge exits to NORMAL mode, the IT algorithm will take about 3 seconds to re-establish the correct battery
capacity and measurements, regardless of the total charge drawn in HIBERNATE mode. During this period of re-
establishment, the gauge reports values previously calculated before entering HIBERNATE mode. The host can
identify exit from HIBERNATE mode by checking if Voltage() < Hibernate Voltage or [HIBERNATE] bit is cleared
by the gauge.
If a charger is attached, the host should immediately take the fuel gauge out of HIBERNATE mode before
beginning to charge the battery. Charging the battery in HIBERNATE mode will result in a notable gauging error
that will take several hours to correct. It is also recommended to minimize discharge current during exit from
Hibernate.
8.4.6 Power Control
8.4.6.1 Reset Functions
When the bq27545-G1 detects a software reset by sending [RESET] Control() subcommand, it determines the
type of reset and increments the corresponding counter. This information is accessible by issuing the command
Control() function with the RESET_DATA subcommand.
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8.4.6.2 Wake-Up Comparator
The wake-up comparator is used to indicate a change in cell current while the bq27545-G1 is in SLEEP mode.
Pack Configuration uses bits [RSNS1]–[RSNS0] to set the sense resistor selection. Pack Configuration also
uses the [IWAKE] bit to select one of two possible voltage threshold ranges for the given sense resistor
selection. An internal interrupt is generated when the threshold is breached in either charge or discharge
directions. Setting both [RSNS1] and [RSNS0] to 0 disables this feature.
Table 10. IWAKE Threshold Settings(1)
IWAKE
RSNS1
RSNS0
Vth(SRP-SRN)
Disabled
0
1
0
1
0
1
0
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
Disabled
1 mV or –1 mV
+2.2 mV or –2.2 mV
+2.2 mV or –2.2 mV
+4.6 mV or –4.6 mV
+4.6 mV or –4.6 mV
+9.8 mV or –9.8 mV
(1) The actual resistance value vs the setting of the sense resistor is not important just the actual voltage
threshold when calculating the configuration. The voltage thresholds are typical values under room
temperature.
8.4.6.3 Flash Updates
Data flash can only be updated if Voltage() ≥ Flash Update OK Voltage. Flash programming current can cause
an increase in LDO dropout. The value of Flash Update OK Voltage should be selected such that the bq27545-
G1 VCC voltage does not fall below its minimum of 2.4 V during Flash write operations.
8.4.7 Autocalibration
The bq27545-G1 provides an autocalibration feature that will measure the voltage offset error across SRP and
SRN from time-to-time as operating conditions change. It subtracts the resulting offset error from normal sense
resistor voltage, VSR, for maximum measurement accuracy.
Autocalibration of the ADC begins on entry to SLEEP mode, except if Temperature() is ≤ 5°C or Temperature() ≥
45°C.
The fuel gauge also performs a single offset calibration when (1) the condition of AverageCurrent() ≤ 100 mA
and (2) {voltage change because last offset calibration ≥ 256 mV} or {temperature change because last offset
calibration is greater than 8°C for ≥ 60 seconds}.
Capacity and current measurements will continue at the last measured rate during the offset calibration when
these measurements cannot be performed. If the battery voltage drops more than 32 mV during the offset
calibration, the load current has likely increased considerably; hence, the offset calibration will be aborted.
8.4.8 Communications
8.4.8.1 Authentication
The bq27545-G1 can act as a SHA-1/HMAC authentication slave by using its internal engine. Sending a 160-bit
SHA-1 challenge message to the bq27545-G1 will cause the gauge to return a 160-bit digest, based upon the
challenge message and a hidden, 128-bit plain-text authentication key. If this digest matches an identical one
generated by a host or dedicated authentication master, and when operating on the same challenge message
and using the same plain text keys, the authentication process is successful.
8.4.8.2 Key Programming (Data Flash Key)
By default, the bq27545-G1 contains a default plain-text authentication key of
0x0123456789ABCDEFFEDCBA9876543210. This default key is intended for development purposes. It should
be changed to a secret key and the part immediately sealed, before putting a pack into operation. Once written, a
new plain-text key cannot be read again from the fuel gauge while in SEALED mode.
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Once the bq27545-G1 is UNSEALED, the authentication key can be changed from its default value by writing to
the Authenticate() Extended Data Command locations. A 0x00 is written to BlockDataControl() to enable the
authentication data commands. The DataFlashClass() is issued 112 (0x70) to set the Security class. Up to 32
bytes of data can be read directly from the BlockData() (0x40...0x5F) and the authentication key is located at
0x48 (0x40 + 0x08 offset) to 0x57 (0x40 + 0x17 offset). The new authentication key can be written to the
corresponding locations (0x48 to 0x57) using the BlockData() command. The data is transferred to the data flash
when the correct checksum for the whole block (0x40 to 0x5F) is written to BlockDataChecksum() (0x60). The
checksum is (255 – x) where x is the 8-bit summation of the BlockData() (0x40 to 0x5F) on a byte-by-byte basis.
Once the authentication key is written, the gauge can then be SEALED again.
8.4.8.3 Key Programming (Secure Memory Key)
As the name suggests, the bq27545-G1 secure-memory authentication key is stored in the secure memory of the
bq27545-G1. If a secure-memory key has been established, only this key can be used for authentication
challenges (the programmable data flash key is not available). The selected key can only be
established/programmed by special arrangements with TI, using the TI’s Secure B-to-B Protocol. The secure-
memory key can never be changed or read from the bq27545-G1.
8.4.8.4 Executing An Authentication Query
To execute an authentication query in UNSEALED mode, a host must first write 0x01 to the BlockDataControl()
command, to enable the authentication data commands. If in SEALED mode, 0x00 must be written to
DataFlashBlock(), instead.
Next, the host writes a 20-byte authentication challenge to the Authenticate() address locations (0x40 through
0x53). After a valid checksum for the challenge is written to AuthenticateChecksum(), the bq27545 uses the
challenge to perform the SHA-1/HMAC computation, in conjunction with the programmed key. The bq27545-G1
completes the SHA-1/HMAC computation and write the resulting digest to Authenticate(), overwriting the pre-
existing challenge. The host should wait at least 45 ms to read the resulting digest. The host may then read this
response and compare it against the result created by its own parallel computation.
8.4.9 HDQ Single-Pin Serial Interface
The HDQ interface is an asynchronous return-to-one protocol where a processor sends the command code to
the bq27545-G1. With HDQ, the least significant bit (LSB) of a data byte (command) or word (data) is transmitted
first. The DATA signal on pin 12 is open drain and requires an external pullup resistor. The 8-bit command code
consists of two fields: the 7-bit HDQ command code (bits 0–6) and the 1-bit R/W field (MSB bit 7). The R/W field
directs the bq27545-G1 either to
•
•
Store the next 8 or 16 bits of data to a specified register or
Output 8 bits of data from the specified register
The HDQ peripheral can transmit and receive data as either an HDQ master or slave.
HDQ serial communication is normally initiated by the host processor sending a break command to the bq27545-
G1. A break is detected when the DATA pin is driven to a logic-low state for a time t(B) or greater. The DATA pin
should then be returned to its normal ready high logic state for a time t(BR). The bq27545-G1 is now ready to
receive information from the host processor.
The bq27545-G1 is shipped in the I2C mode. TI provides tools to enable the HDQ peripheral. The HDQ
Communication Basics Application Report (SLUA408A) provides details of HDQ communication basics.
8.4.10 HDQ Host Interruption Feature
The default bq27545-G1 behaves as an HDQ slave only device when HDQ mode is enabled. If the HDQ
interrupt function is enabled, the bq27545-G1 is capable of mastering and also communicating to a HDQ device.
There is no mechanism for negotiating who is to function as the HDQ master and take care to avoid message
collisions. The interrupt is signaled to the host processor with the bq27545-G1 mastering an HDQ message. This
message is a fixed message that will be used to signal the interrupt condition. The message itself is 0x80 (slave
write to register 0x00) with no data byte being sent as the command is not intended to convey any status of the
interrupt condition. The HDQ interrupt function is disabled by default and must be enabled by command.
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When the SET_HDQINTEN subcommand is received, the bq27545-G1 will detect any of the interrupt conditions
and assert the interrupt at one second intervals until the CLEAR_HDQINTEN command is received or the count
of HDQHostIntrTries has lapsed.
The number of tries for interrupting the host is determined by the data flash parameter named
HDQHostIntrTries.
8.4.10.1 Low Battery Capacity
This feature will work identically to SOC1. It will use the same data flash entries as SOC1 and will trigger
interrupts as long as SOC1 = 1 and HDQIntEN=1.
8.4.10.2 Temperature
This feature will trigger an interrupt based on the OTC (Over-Temperature in Charge) or OTD (Over-Temperature
in Discharge) condition being met. It uses the same data flash entries as OTC or OTD and will trigger interrupts
as long as either the OTD or OTC condition is met and HDQIntEN=1.
8.5 Programming
8.5.1 I2C Interface
The fuel gauge supports the standard I2C read, incremental read, one-byte write quick read, and functions. The
7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The 8-bit
device address is therefore 0xAA or 0xAB for write or read, respectively.
Host Generated
Fuel Gauge Generated
S
ADDR[6:0]
0
A
CMD[7:0]
(a)
A
DATA[7:0]
A
P
S
ADDR[6:0]
1
A
DATA[7:0]
N P
(b)
CMD[7:0]
ADDR[6:0]
1
A
DATA[7:0]
ADDR[6:0]
S
0
A
N P
A
Sr
(c)
A
Sr
1
A
ADDR[6:0]
(d)
A
N P
S
ADDR[6:0]
0
A
CMD[7:0]
DATA[7:0]
DATA[7:0]
. . .
Figure 8. Supported I2C Formats: (A) 1-Byte Write, (B) Quick Read, (C) 1 Byte-Read, And (D) Incremental
Read (S = Start, Sr = Repeated Start, A = Acknowledge, N = No Acknowledge, And P = Stop).
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the bq27545-G1 or the
I2C master. Quick writes function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
Attempt to write a read-only address (NACK after data sent by master):
S
ADDR[6:0]
0
A
CMD[7:0]
A
DATA[7:0]
A
P
Attempt to read an address above 0x7F (NACK command):
CMD[7:0]
S
ADDR[6:0]
0
A
N P
Attempt at incremental writes (NACK all extra data bytes sent):
CMD[7:0]
DATA[7:0]
A
DATA[7:0]
ADDR[6:0]
S
0
A
N
P
A
N
. . .
Incremental read at the maximum allowed read address:
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Programming (continued)
A
Sr
1
A
ADDR[6:0]
A
N P
S
ADDR[6:0]
0
A
CMD[7:0]
DATA[7:0]
DATA[7:0]
. . .
Address
0x7F
Data From
addr 0x7F
Data From
addr 0x00
The I2C engine releases both SDA and SCL if the I2C bus is held low for t(BUSERR). If the fuel gauge was holding
the lines, releasing them frees the master to drive the lines. If an external condition is holding either of the lines
low, the I2C engine enters the low-power sleep mode.
8.5.1.1 I2C Time-Out
The I2C engine will release both SDA and SCL if the I2C bus is held low for about 2 seconds. If the bq27545-G1
was holding the lines, releasing them will free for the master to drive the lines.
8.5.1.2 I2C Command Waiting Time
To make sure the correct results of a command with the 400-KHz I2C operation, a proper waiting time should be
added between issuing command and reading results. For subcommands, the following diagram shows the
waiting time required between issuing the control command the reading the status with the exception of the
checksum command. A 100-ms waiting time is required between the checksum command and reading result. For
read-write standard commands, a minimum of 2 seconds is required to get the result updated. For read-only
standard commands, there is no waiting time required, but the host should not issue all standard commands
more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the
watchdog timer.
S
S
ADDR[6:0] 0 A
ADDR[6:0] 0 A
CMD[7:0]
CMD[7:0]
A
A
DATA[7:0]
ADDR[6:0]
A
DATA[7:0]
DATA[7:0]
A P
66ms
DATA[7:0]
Sr
1
A
A
N P
66ms
Waiting time between control subcommand and reading results
Sr
S
ADDR[6:0] 0 A
CMD[7:0]
DATA[7:0]
A
ADDR[6:0]
66ms
1
A
DATA[7:0]
A
DATA[7:0]
A
DATA[7:0]
A
N P
Waiting time between continuous reading results
8.5.1.3 I2C Clock Stretching
I2C clock stretches can occur during all modes of fuel gauge operation. In the SLEEP and HIBERNATE modes, a
short clock stretch will occur on all I2C traffic as the device must wake up to process the packet. In NORMAL and
SLEEP+ modes, clock stretching will only occur for packets addressed for the fuel gauge. The timing of stretches
will vary as interactions between the communicating host and the gauge are asynchronous. The I2C clock
stretches may occur after start bits, the ACK/NAK bit and first data bit transmit on a host read cycle. The majority
of clock stretch periods are small (≤ 4 ms) as the I2C interface peripheral and CPU firmware perform normal data
flow control. However, less frequent but more significant clock stretch periods may occur when data flash (DF) is
being written by the CPU to update the resistance (Ra) tables and other DF parameters such as Qmax. Due to
the organization of DF, updates must be written in data blocks consisting of multiple data bytes.
An Ra table update requires erasing a single page of DF, programming the updated Ra table and a flag. The
potential I2C clock stretching time is 24-ms max. This includes 20-ms page erase and 2-ms row programming
time (×2 rows). The Ra table updates occur during the discharge cycle and at up to 15 resistance grid points that
occur during the discharge cycle.
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Programming (continued)
A DF block write typically requires a maximum of 72 ms. This includes copying data to a temporary buffer and
updating DF. This temporary buffer mechanism is used to protect from power failure during a DF update. The
first part of the update requires 20 ms time to erase the copy buffer page, 6 ms to write the data into the copy
buffer and the program progress indicator (2 ms for each individual write). The second part of the update is
writing to the DF and requires 44-ms DF block update time. This includes a 20 ms each page erase for two
pages and 2 ms each row write for two rows.
In the event that a previous DF write was interrupted by a power failure or reset during the DF write, an
additional 44-ms max DF restore time is required to recover the data from a previously interrupted DF write. In
this power failure recovery case, the total I2C clock stretching is 116-ms max.
Another case where I2C clock stretches is at the end of discharge. The update to the last discharge data will go
through the DF block update twice because two pages are used for the data storage. The clock stretching in this
case is 144-ms max. This occurs if there has been a Ra table update during the discharge.
8.5.2 Data Commands
8.5.2.1 Standard Data Commands
The bq27545-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 11. Each
protocol has specific means to access the data at each Command Code. DataRAM is updated and read by the
gauge only once per second. Standard commands are accessible in NORMAL operation mode.
Table 11. Standard Commands
SEALED
ACCESS
NAME
COMMAND CODE
UNIT
Control()
CNTL
AR
0x00/0x01
0x02/0x03
0x04/0x05
0x06/0x07
0x08/0x09
0x0A/0x0B
0x0C/0x0D
0x0E/0x0F
0x10/0x11
0x12/0x13
0x14/0x15
0x16/0x17
0x18/0x19
0x1A/0x1B
0x1C/0x1D
0x1E/0x1F
0x20/0x21
0x22/0x23
0x24/0x25
0x28/0x29
0x2A/0x2B
0x2C/0x2D
0x2E/0x2F
0x34/0x35
0x36/0x37
0x38/0x39
N/A
mA
R/W
R/W
R
AtRate()
UnfilteredSOC()
Temperature()
Voltage()
UFSOC
TEMP
VOLT
FLAGS
NAC
%
0.1K
mV
R
R
Flags()
N/A
R
NomAvailableCapacity()
FullAvailableCapacity()
RemainingCapacity()
FullChargeCapacity()
AverageCurrent()
TimeToEmpty()
FilteredFCC()
mAh
mAh
mAh
mAh
mA
R
FAC
R
RM
R
FCC
R
AI
R
TTE
Minutes
mAh
mA
R
FFCC
SI
R
StandbyCurrent()
UnfilteredFCC()
MaxLoadCurrent()
UnfilteredRM()
FilteredRM()
R
UFFCC
MLI
mAh
mA
R
R
UFRM
FRM
AP
mAh
mAh
mW/cW
0.1°K
Counts
%
R
R
AveragePower()
InternalTemperature()
CycleCount()
R
INTTEMP
CC
R
R
StateOfCharge()
StateOfHealth()
PassedCharge()
DOD0()
SOC
SOH
PCHG
DOD0
SDSG
R
%/num
mAh
HEX#
mA
R
R
R
SelfDischargeCurrent()
R
26
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
8.5.2.1.1 Control(): 0x00 and 0x01
Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control() command allows the system to control specific features of the
bq27545-G1 during normal operation and additional features when the bq27545-G1 is in different access modes,
as described in Table 12.
Table 12. Control() Subcommands
SEALED
CNTL FUNCTION
CNTL DATA
DESCRIPTION
ACCESS
Yes
Yes
Yes
Yes
No
CONTROL_STATUS
DEVICE_TYPE
FW_VERSION
HW_VERSION
Reserved
0x0000
0x0001
0x0002
0x0003
0x0004
0x0005
0x0006
0x0007
0x0008
0x0009
0x000A
0x000B
0x000C
0x0010
0x0011
0x0012
0x0013
0x0014
0x0015
0x0016
0x0017
0x0020
0x0021
0x002d
0x0041
0x0080
0x0081
0x0082
Reports the status of DF Checksum, Hibernate, IT, and so on
Reports the device type of 0x0545 (indicating bq27545-G1)
Reports the firmware version on the device type
Reports the hardware version of the device type
Not to be used
RESET_DATA
Reserved
Yes
No
Returns reset data
Not to be used
PREV_MACWRITE
CHEM_ID
Yes
Yes
No
Returns previous Control() subcommand code
Reports the chemical identifier of the Impedance Track configuration
Forces the device to measure and store the board offset
Forces the device to measure internal CC offset
Forces the device to store the internal CC offset
Reports the data flash version on the device
Sets the [FullSleep] bit in Control Status register to 1
Forces CONTROL_STATUS [HIBERNATE] to 1
Forces CONTROL_STATUS [HIBERNATE] to 0
Enables the SE pin to change state
BOARD_OFFSET
CC_OFFSET
No
CC_OFFSET_SAVE
DF_VERSION
SET_FULLSLEEP
SET_HIBERNATE
CLEAR_HIBERNATE
SET_SHUTDOWN
CLEAR_SHUTDOWN
SET_HDQINTEN
CLEAR_HDQINTEN
STATIC_CHEM_CHKSUM
SEALED
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
Disables the SE pin from changing state
Forces CONTROL_STATUS [HDQIntEn] to 1
Forces CONTROL_STATUS [HDQIntEn] to 0
Calculates chemistry checksum
Places the bq27545-G1 in SEALED access mode
Enables the Impedance Track algorithm
Toggle bq27545-G1 CALIBRATION mode
Forces a full reset of the bq27545-G1
IT_ENABLE
No
CAL_ENABLE
RESET
No
No
EXIT_CAL
No
Exit bq27545-G1 CALIBRATION mode
ENTER_CAL
No
Enter bq27545-G1 CALIBRATION mode
Reports internal CC offset in CALIBRATION mode
OFFSET_CAL
No
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8.5.2.1.1.1 CONTROL_STATUS: 0x0000
Instructs the fuel gauge to return status information to Control addresses 0x00 and 0x01. The status word
includes the following information.
Table 13. CONTROL_STATUS Flags
bit7
SE
bit6
bit5
bit4
bit3
CCA
bit2
BCA
bit1
RSVD
VOK
bit0
HDQHOSTIN
QEN
High Byte
Low Byte
FAS
SS
CALMODE
SLEEP
SHUTDWN
HIBERNATE FULLSLEEP
LDMD
RUP_DIS
SE = Status bit indicating the SE pin is active. True when set. Default is 0.
FAS = Status bit indicating the bq27545-G1 is in FULL ACCESS SEALED state. Active when set.
SS = Status bit indicating the bq27545-G1 is in the SEALED State. Active when set.
CALMODE = Status bit indicating the calibration function is active. True when set. Default is 0.
Status bit indicating the bq27545-G1 Coulomb Counter Calibration routine is active. The CCA routine will take place
approximately 1 minute after the initialization and periodically as gauging conditions change. Active when set.
CCA =
BCA = Status bit indicating the bq27545-G1 Board Calibration routine is active. Active when set.
RSVD = Reserved
HDQHOSTIN = Status bit indicating the HDQ interrupt function is active. True when set. Default is 0.
SHUTDWN = Control bit indicating that the SET_SHUTDOWN command has been sent and the state of the SE pin can change to
signal an external shutdown of the fuel gauge when conditions permit. (See the SHUTDOWN Mode section.)
HIBERNATE = Status bit indicating a request for entry into HIBERNATE from SLEEP mode has been issued. True when set. Default is
0.
Status bit indicating the bq27545-G1 is in FULLSLEEP mode. True when set. The state can be detected by monitoring
FULLSLEEP =
the power used by the bq27545-G1 because any communication will automatically clear it.
SLEEP = Status bit indicating the bq27545-G1 is in SLEEP mode. True when set.
LDMD = Status bit indicating the bq27545-G1 Impedance Track algorithm is using CONSTANT-POWER mode. True when set.
Default is 0 (CONSTANT-CURRENT mode).
RUP_DIS = Status bit indicating the bq27545-G1 Ra table updates are disabled. True when set.
VOK = Status bit indicating cell voltages are OK for Qmax updates. True when set.
QEN = Status bit indicating the bq27545-G1 Qmax updates are enabled. True when set.
8.5.2.1.1.2 DEVICE_TYPE: 0x0001
Instructs the fuel gauge to return the device type to addresses 0x00 and 0x01. The bq27545-G1 device type
returns 0x0545.
8.5.2.1.1.3 FW_VERSION: 0x0002
Instructs the fuel gauge to return the firmware version to addresses 0x00 and 0x01. The bq27545-G1 firmware
version returns 0x0224.
8.5.2.1.1.4 HW_VERSION: 0x0003
Instructs the fuel gauge to return the hardware version to addresses 0x00 and 0x01. For bq27545-G1 0x0020 is
returned.
8.5.2.1.1.5 RESET_DATA: 0x0005
Instructs the fuel gauge to return the number of resets performed to addresses 0x00 and 0x01.
8.5.2.1.1.6 PREV_MACWRITE: 0x0007
Instructs the fuel gauge to return the previous Control() subcommand written to addresses 0x00 and 0x01. The
value returned is limited to less than 0x0020.
8.5.2.1.1.7 CHEM_ID: 0x0008
Instructs the fuel gauge to return the chemical identifier for the Impedance Track configuration to addresses 0x00
and 0x01.
28
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8.5.2.1.1.8 BOARD_OFFSET: 0x0009
Instructs the fuel gauge to perform board offset calibration. During board offset calibration the [BCA] bit is set
8.5.2.1.1.9 CC_OFFSET: 0x000a
Instructs the fuel gauge to perform coulomb counter offset calibration. During calibration the [CCA] bit is set
8.5.2.1.1.10 CC_OFFSET_SAVE: 0x000b
Instructs the fuel gauge to save calibration coulomb counter offset after calibration.
8.5.2.1.1.11 DF_VERSION: 0x000c
Instructs the gas gauge to return the data flash version stored in DF Config Version to addresses 0x00 and
0x01.
8.5.2.1.1.12 SET_FULLSLEEP: 0x0010
Instructs the gas gauge to set the FullSleep bit in Control Status register to 1. This will allow the gauge to enter
the FULLSLEEP power mode after the transition to SLEEP power state is detected. In FULLSLEEP mode, less
power is consumed by disabling an oscillator circuit used by the communication engines. For HDQ
communication one host message will be dropped. For I2C communications the first I2C message will incur a 6–8
ms clock stretch while the oscillator is started and stabilized. A communication to the device in FULLSLEEP will
force the part back to the SLEEP mode.
8.5.2.1.1.13 SET_HIBERNATE: 0x0011
Instructs the fuel gauge to force the CONTROL_STATUS [HIBERNATE] bit to 1. This will allow the gauge to
enter the HIBERNATE power mode after the transition to SLEEP power state is detected and the required
conditions are met. The [HIBERNATE] bit is automatically cleared upon exiting from HIBERNATE mode.
8.5.2.1.1.14 CLEAR_HIBERNATE: 0x0012
Instructs the fuel gauge to force the CONTROL_STATUS [HIBERNATE] bit to 0. This will prevent the gauge from
entering the HIBERNATE power mode after the transition to SLEEP power state is detected unless Voltage() is
less than Hibernate V. It can also be used to force the gauge out of HIBERNATE mode.
8.5.2.1.1.15 SET_SHUTDOWN: 0x0013
Sets the CONTROL_STATUS [SHUTDWN] bit to 1, thereby enabling the SE pin to change state. The Impedance
Track algorithm controls the setting of the SE pin, depending on whether the conditions are met for fuel gauge
shutdown or not.
8.5.2.1.1.16 CLEAR_SHUTDOWN: 0x0014
Disables the SE pin from changing state. The SE pin is left in a high-impedance state.
8.5.2.1.1.17 SET_HDQINTEN: 0x0015
Instructs the fuel gauge to set the CONTROL_STATUS [HDQIntEn] bit to 1. This will enable the HDQ Interrupt
function. When this subcommand is received, the device will detect any of the interrupt conditions and assert the
interrupt at one second intervals until the CLEAR_HDQINTEN command is received or the count of
HDQHostIntrTries has lapsed (default 3).
8.5.2.1.1.18 CLEAR_HDQINTEN: 0x0016
Instructs the fuel gauge to set the CONTROL_STATUS [HDQIntEn] bit to 0. This will disable the HDQ Interrupt
function.
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8.5.2.1.1.19 STATIC_CHEM_DF_CHKSUM: 0x0017
Instructs the fuel gauge to calculate chemistry checksum as a 16-bit unsigned integer sum of all static chemistry
data. The most significant bit (MSB) of the checksum is masked yielding a 15-bit checksum. This checksum is
compared with value stored in the data flash Static Chem DF Checksum. If the value matches, the MSB will be
cleared to indicate pass. If it does not match, the MSB will be set to indicate failure. The checksum can be used
to verify the integrity of the chemistry data stored internally.
8.5.2.1.1.20 SEALED: 0x0020
Instructs the gas gauge to transition from UNSEALED state to SEALED state. The gas gauge should always be
set to SEALED state for use in customer’s end equipment as it prevents spurious writes to most Standard
Commands and blocks access to most data flash.
8.5.2.1.1.21 IT ENABLE: 0x0021
This command forces the fuel gauge to begin the Impedance Track algorithm, sets bit 2 of UpdateStatus and
causes the [VOK] and [QEN] flags to be set in the CONTROL_STATUS register. [VOK] is cleared if the voltages
are not suitable for a Qmax update. Once set, [QEN] cannot be cleared. This command is only available when
the fuel gauge is UNSEALED and is typically enabled at the last step of production after system test is
completed.
8.5.2.1.1.22 RESET: 0x0041
This command instructs the gas gauge to perform a full reset. This command is only available when the gas
gauge is UNSEALED.
8.5.2.1.1.23 EXIT_CAL: 0x0080
This command instructs the gas gauge to exit CALIBRATION mode.
8.5.2.1.1.24 Enter_cal: 0x0081
This command instructs the gas gauge to enter CALIBRATION mode.
8.5.2.1.1.25 OFFSET_CAL: 0x0082
This command instructs the gas gauge to perform offset calibration.
8.5.2.1.2 AtRate(): 0x02 and 0x03
The AtRate() read-/write-word function is the first half of a two-function command call-set used to set the AtRate
value used in calculations made by the AtRateTimeToEmpty() function. The AtRate() units are in mA.
The AtRate() value is a signed integer, with negative values interpreted as a discharge current value. The
AtRateTimeToEmpty() function returns the predicted operating time at the AtRate value of discharge. The default
value for AtRate() is zero and will force AtRateTimeToEmpty() to return 65,535. Both the AtRate() and
AtRateTimeToEmpty() commands should only be used in NORMAL mode.
8.5.2.1.3 UnfilteredSOC(): 0x04 And 0x05
This read-only function returns an unsigned integer value of the predicted remaining battery capacity expressed
as a percentage of UnfilteredFCC(), with a range of 0 to 100%.
8.5.2.1.4 Temperature(): 0x06 And 0x07
This read-only function returns an unsigned integer value of the battery temperature in units of 0.1K measured by
the fuel gauge and is used for fuel gauging algorithm. It reports either the InternalTemperature() or the external
thermistor temperature depending on the setting of [TEMPS] bit in Pack Configuration.
8.5.2.1.5 Voltage(): 0x08 And 0x09
This read-only function returns an unsigned integer value of the measured cell-pack voltage in mV with a range
of 0 to 6000 mV.
30
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8.5.2.1.6 Flags(): 0x0a And 0x0b
This read-only function returns the contents of the gas-gauge status register, depicting the current operating
status.
Table 14. Flags Bit Definitions
bit7
OTC
bit6
OTD
ISD
bit5
BATHI
TDD
bit4
BATLOW
HW1
bit3
CHG_INH
HW0
bit2
bit1
FC
bit0
CHG
DSG
High Byte
Low Byte
RSVD
SOC1
OCVTAKEN
SOCF
Over-Temperature in Charge condition is detected. True when set. Refer to the Data Flash Safety Subclass
parameters for threshold settings.
OTC =
OTD =
Over-Temperature in Discharge condition is detected. True when set. Refer to the Data Flash Safety Subclass
parameters for threshold settings.
Battery High bit indicating a high battery voltage condition. Refer to the Data Flash BATTERY HIGH parameters for
threshold settings.
BATHI =
Battery Low bit indicating a low battery voltage condition. Refer to the Data Flash BATTERY LOW parameters for
threshold settings.
BATLOW =
CHG_INH = Charge Inhibit indicates the temperature is outside the range [Charge Inhibit Temp Low, Charge Inhibit Temp
High]. True when set.
RSVD = Reserved.
Full-charged is detected. FC is set when charge termination is reached and FC Set% = –1 (see Charging and Charge
Termination Indication) or State of Charge is larger than FC Set% and FC Set% is not –1. True when set.
FC =
CHG = (Fast) charging allowed. True when set.
OCVTAKEN = Cleared on entry to RELAX mode and set to 1 when OCV measurement is performed in RELAX.
ISD = Internal Short is detected. True when set.
TDD = Tab Disconnect is detected. True when set.
HW[1:0] Device Identification. Default is 1/0
SOC1 = State-of-Charge-Threshold 1 (SOC1 Set) reached. True when set.
SOCF = State-of-Charge-Threshold Final (SOCF Set %) reached. True when set.
DSG = Discharging detected. True when set.
8.5.2.1.7 NominalAvailableCapacity(): 0x0c and 0x0d
This read-only command pair returns the uncompensated (less than C/20 load) battery capacity remaining. Units
are mAh.
8.5.2.1.8 FullAvailableCapacity(): 0x0e and 0x0f
This read-only command pair returns the uncompensated (less than C/20 load) capacity of the battery when fully
charged. Units are mAh. FullAvailableCapacity() is updated at regular intervals, as specified by the IT algorithm.
8.5.2.1.9 RemainingCapacity(): 0x10 and 0x11
This read-only command pair returns the compensated battery capacity remaining (UnfilteredRM()) when the
[SmoothEn] bit in Operating Configuration C is cleared or filtered compensated battery capacity remaining
(FilteredRM()) when [SmoothEn] is set. Units are mAh.
8.5.2.1.10 FullChargeCapacity(): 0x12 and 0x13
This read-only command pair returns the compensated capacity of fully charged battery (UnfilteredFCC()) when
the [SmoothEn] bit in Operating Configuration C is cleared or filtered compensated capacity of fully charged
battery (FilteredFCC()) when [SmoothEn] is set. Units are mAh. FullChargeCapacity() is updated at regular
intervals, as specified by the IT algorithm.
8.5.2.1.11 AverageCurrent(): 0x14 and 0x15
This read-only command pair returns a signed integer value that is the average current flow through the sense
resistor. It is updated every 1 second. Units are mA.
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8.5.2.1.12 TimeToEmpty(): 0x16 And 0x17
This read-only function returns an unsigned integer value of the predicted remaining battery life at the present
rate of discharge, in minutes. A value of 65,535 indicates battery is not being discharged.
8.5.2.1.13 FilteredFCC(): 0x18 And 0x19
This read-only command pair returns the filtered compensated capacity of the battery when fully charged when
the [SmoothEn] bit in Operating Configuration C is set. Units are mAh. FilteredFCC() is updated at regular
intervals, as specified by the IT algorithm.
8.5.2.1.14 StandbyCurrent(): 0x1a And 0x1b
This read-only function returns a signed integer value of the measured system standby current through the sense
resistor. The StandbyCurrent() is an adaptive measurement. Initially it reports the standby current programmed in
Initial Standby, and after spending some time in standby, reports the measured standby current.
The register value is updated every 1 second when the measured current is above the Deadband and is less
than or equal to 2 × Initial Standby. The first and last values that meet this criteria are not averaged in, because
they may not be stable values. To approximate a 1 minute time constant, each new StandbyCurrent() value is
computed by taking approximate 93% weight of the last standby current and approximate 7% of the current
measured average current.
8.5.2.1.15 UnfilteredFCC(): 0x1c And 0x1d
This read-only command pair returns the compensated capacity of the battery when fully charged. Units are
mAh. UnFilteredFCC() is updated at regular intervals, as specified by the IT algorithm.
8.5.2.1.16 MaxLoadCurrent(): 0x1e And 0x1f
This read-only function returns a signed integer value, in units of mA, of the maximum load conditions of the
system. The MaxLoadCurrent() is an adaptive measurement which is initially reported as the maximum load
current programmed in Initial Max Load Current. If the measured current is ever greater than Initial Max Load
Current, then MaxLoadCurrent() updates to the new current. MaxLoadCurrent() is reduced to the average of the
previous value and Initial Max Load Current whenever the battery is charged to full after a previous discharge
to an SOC less than 50%. This prevents the reported value from maintaining an unusually high value.
8.5.2.1.17 UnfilteredRM(): 0x20 And 0x21
This read-only command pair returns the compensated battery capacity remaining. Units are mAh.
8.5.2.1.18 FilteredRM(): 0x22 And 0x23
This read-only command pair returns the filtered compensated battery capacity remaining when [SmoothEn] bit in
Operating Configuration C is set. Units are mAh.
8.5.2.1.19 AveragePower(): 0x24 And 0x25
This read-word function returns an unsigned integer value of the average power of the current discharge. It is
negative during discharge and positive during charge. A value of 0 indicates that the battery is not being
discharged. The value is reported in units of mW (Design Energy Scale = 1) or cW (Design Energy Scale =
10).
8.5.2.1.20 InternalTemperature(): 0x28 And 0x29
This read-only function returns an unsigned integer value of the measured internal temperature of the device in
units of 0.1K measured by the fuel gauge.
8.5.2.1.21 CycleCount(): 0x2a And 0x2b
This read-only function returns an unsigned integer value of the number of cycles the battery has experienced
with a range of 0 to 65,535. One cycle occurs when accumulated discharge ≥ CC Threshold.
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8.5.2.1.22 StateOfCharge(): 0x2c And 0x2d
This read-only function returns an unsigned integer value of the predicted RemainingCapacity() expressed as a
percentage of FullChargeCapacity(), with a range of 0 to 100%. The StateOfCharge() can be filtered or unfiltered
because RemainingCapacity() and FullChargeCapacity() can be filtered or unfiltered based on [SmoothEn] bit
selection.
8.5.2.1.23 StateOfHealth(): 0x2e And 0x2f
0x2e SOH percentage: this read-only function returns an unsigned integer value, expressed as a percentage of
the ratio of predicted FCC(25°C, SOH Load I) over the DesignCapacity(). The FCC(25°C, SOH Load I) is the
calculated full charge capacity at 25°C and the SOH current rate which is specified by SOH Load I. The range of
the returned SOH percentage is 0x00 to 0x64, indicating 0 to 100% correspondingly.
8.5.2.1.24 PassedCharge(): 0x34 And 0x35
This signed integer indicates the amount of charge passed through the sense resistor because the last IT
simulation in mAh.
8.5.2.1.25 Dod0(): 0x36 And 0x37
This unsigned integer indicates the depth of discharge during the most recent OCV reading.
8.5.2.1.26 SelfDischargeCurrent(): 0x38 And 0x39
This read-only command pair returns the signed integer value that estimates the battery self-discharge current.
8.5.3 Extended Data Commands
Extended commands offer additional functionality beyond the standard set of commands. They are used in the
same manner; however unlike standard commands, extended commands are not limited to 2-byte words. The
number of command bytes for a given extended command ranges in size from single to multiple bytes, as
specified in Table 15. For details on the SEALED and UNSEALED states, see Access Modes.
Table 15. Extended Commands
SEALED
UNSEALED
NAME
COMMAND CODE
UNIT
ACCESS(1) (2)
ACCESS(1) (2)
Reserved
RSVD
PCR
0x38…0x39
0x3a/0x3b
0x3c/0x3d
0x3e
N/A
Hex
mAh
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
R
R
R
R
PackConfig()
DesignCapacity()
DataFlashClass()(2)
DataFlashBlock()(2)
BlockData()/Authenticate()
DCAP
R
R
DFCLS
DFBLK
A/DF
N/A
R/W
R/W
R/W
R
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
0x3f
(3)
0x40…0x53
0x54
(3)
BlockData()/AuthenticateCheckSum()
BlockData()
ACKS/DFD
DFD
0x55…0x5f
0x60
BlockDataCheckSum()
BlockDataControl()
DeviceNameLength()
DeviceName()
DFDCKS
DFDCNTL
DNAMELEN
DNAME
RSVD
R/W
N/A
R
0x61
0x62
0x63...0x6c
0x6d...0x7f
R
R
Reserved
R
R
(1) SEALED and UNSEALED states are entered through commands to Control() 0x00 and 0x01.
(2) In SEALED mode, data flash CANNOT be accessed through commands 0x3E and 0x3F.
(3) The BlockData() command area shares functionality for accessing general data flash and for using Authentication. See Authentication
for more details.
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8.5.3.1 PackConfig(): 0x3a and 0x3b
SEALED and UNSEALED Access: This command returns the value stored in Pack Configuration and is
expressed in hex value.
8.5.3.2 DesignCapacity(): 0x3c And 0x3d
SEALED and UNSEALED Access: This command returns the value stored in Design Capacity and is expressed
in mAh. This is intended to be the theoretical or nominal capacity of a new pack, but has no bearing on the
operation of the fuel gauge functionality.
8.5.3.3 DataFlashClass(): 0x3e
This command sets the data flash class to be accessed. The Subclass ID to be accessed should be entered in
hexadecimal.
SEALED Access: This command is not available in SEALED mode.
8.5.3.4 DataFlashBlock(): 0x3f
UNSEALED Access: This command sets the data flash block to be accessed. When 0x00 is written to
BlockDataControl(), DataFlashBlock() holds the block number of the data flash to be read or written. Example:
writing a 0x00 to DataFlashBlock() specifies access to the first 32 byte block and a 0x01 specifies access to the
second 32 byte block, and so on.
SEALED Access: This command directs which data flash block is accessed by the BlockData() command.
Writing a 0x00 to DataFlashBlock() specifies the BlockData() command transfers authentication data. Issuing a
0x01 or 0x02 instructs the BlockData() command to transfer Manufacturer Info Block A or B respectively.
8.5.3.5 BlockData(): 0x40 Through 0x5f
This command range is used to transfer data for data flash class access. This command range is the 32-byte
data block used to access Manufacturer Info Block A or B. Manufacturer Info Block A is read only for the
sealed access. UNSEALED access is read/write.
8.5.3.6 BlockDataChecksum(): 0x60
The host system should write this value to inform the device that new data is ready for programming into the
specified data flash class and block.
UNSEALED Access: This byte contains the checksum on the 32 bytes of block data read or written to data flash.
The least-significant byte of the sum of the data bytes written must be complemented ( [255 – x], for x the 8-bit
summation of the BlockData() (0x40 to 0x5F) on a byte-by-byte basis.) before being written to 0x60.
SEALED Access: This byte contains the checksum for the 32 bytes of block data written to Manufacturer Info
Block A. The least-significant byte of the sum of the data bytes written must be complemented ( [255 – x], for x
the 8-bit summation of the BlockData() (0x40 to 0x5F) on a byte-by-byte basis.) before being written to 0x60.
8.5.3.7 BlockDataControl(): 0x61
UNSEALED Access: This command is used to control data flash access mode. The value determines the data
flash to be accessed. Writing 0x00 to this command enables BlockData() to access general data flash.
SEALED Access: This command is not available in SEALED mode.
8.5.3.8 DeviceNameLength(): 0x62
UNSEALED and SEALED Access: This byte contains the length of the Device Name.
8.5.3.9 DeviceName(): 0x63 Through 0x6c
UNSEALED and SEALED Access: This block contains the device name that is programmed in Device Name.
8.5.3.10 Reserved: 0x6a Through 0x7f
Reserved Area. Not available for customer access.
34
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
8.5.4 Data Flash Interface
8.5.4.1 Accessing the Data Flash
The bq27545-G1 data flash is a non-volatile memory that contains initialization, default, cell status, calibration,
configuration, and user information. The data flash can be accessed in several different ways, depending on
what mode the bq27545-G1 is operating in and what data is being accessed.
Commonly accessed data flash memory locations, frequently read by a system, are conveniently accessed
through specific instructions, already described in Data Commands. These commands are available when the
bq27545-G1 is either in UNSEALED or SEALED modes.
Most data flash locations, however, are only accessible in UNSEALED mode by use of the bq27545-G1
evaluation software or by data flash block transfers. These locations should be optimized and/or fixed during the
development and manufacture processes. They become part of a golden image file and can then be written to
multiple battery packs. Once established, the values generally remain unchanged during end-equipment
operation.
To access data flash locations individually, the block containing the desired data flash location(s) must be
transferred to the command register locations, where they can be read to the system or changed directly. This is
accomplished by sending the set-up command BlockDataControl() (0x61) with data 0x00. Up to 32 bytes of data
can be read directly from the BlockData() (0x40…0x5f), externally altered, then rewritten to the BlockData()
command space. Alternatively, specific locations can be read, altered, and rewritten if their corresponding offsets
are used to index into the BlockData() command space. Finally, the data residing in the command space is
transferred to data flash, once the correct checksum for the whole block is written to BlockDataChecksum()
(0x60).
Occasionally, a data flash CLASS will be larger than the 32-byte block size. In this case, the DataFlashBlock()
command is used to designate which 32-byte block the desired locations reside in. The correct command
address is then given by 0x40 + offset modulo 32. For example, to access Terminate Voltage in the Gas
Gauging class, DataFlashClass() is issued 80 (0x50) to set the class. Because the offset is 67, it must reside in
the third 32-byte block. Hence, DataFlashBlock() is issued 0x02 to set the block offset, and the offset used to
index into the BlockData() memory area is 0x40 + 67 modulo 32 = 0x40 + 16 = 0x40 + 0x03 = 0x43.
Reading and writing subclass data are block operations up to 32 bytes in length. If during a write the data length
exceeds the maximum block size, then the data is ignored.
None of the data written to memory are bounded by the bq27545-G1—the values are not rejected by the fuel
gauge. Writing an incorrect value may result in hardware failure due to firmware program interpretation of the
invalid data. The written data is persistent, so a power-on reset does not resolve the fault.
8.5.4.2 Manufacturer Information Blocks
The bq27545-G1 contains 64 bytes of user programmable data flash storage: Manufacturer Info Block A and
Manufacturer Info Block B, . The method for accessing these memory locations is slightly different, depending
on whether the device is in UNSEALED or SEALED modes.
When in UNSEALED mode and when 0x00 has been written to BlockDataControl(), accessing the Manufacturer
Info Blocks is identical to accessing general data flash locations. First, a DataFlashClass() command is used to
set the subclass, then a DataFlashBlock() command sets the offset for the first data flash address within the
subclass. The BlockData() command codes contain the referenced data flash data. When writing the data flash,
a checksum is expected to be received by BlockDataChecksum(). Only when the checksum is received and
verified is the data actually written to data flash.
As an example, the data flash location for Manufacturer Info Block B is defined as having a subclass = 58 and
an Offset = 32 through 63 (32 byte block). The specification of Class = System Data is not needed to address
Manufacturer Info Block B, but is used instead for grouping purposes when viewing data flash info in the
bq27545-G1 evaluation software.
Copyright © 2012–2018, Texas Instruments Incorporated
35
bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
When in SEALED mode or when 0x01 BlockDataControl() does not contain 0x00, data flash is no longer
available in the manner used in UNSEALED mode. Rather than issuing subclass information, a designated
Manufacturer Information Block is selected with the DataFlashBlock() command. Issuing a 0x01 or 0x02 with this
command causes the corresponding information block (A or B respectively) to be transferred to the command
space 0x40…0x5f for editing or reading by the system. Upon successful writing of checksum information to
BlockDataChecksum(), the modified block is returned to data flash. Note: Manufacturer Info Block A is read-
only when in SEALED mode.
8.5.5 Access Modes
The bq27545-G1 provides three security modes (FULL ACCESS, UNSEALED, and SEALED) that control data
flash access permissions. Data Flash refers to those data flash locations, Table 16, that are accessible to the
user. Manufacture Information refers to the two 32-byte blocks.
Table 16. Data Flash Access
SECURITY MODE
FULL ACCESS
UNSEALED
DATA FLASH
R/W
MANUFACTURER INFORMATION
R/W
R/W
R/W
SEALED
None
R (A); R/W (B)
Although FULL ACCESS and UNSEALED modes appear identical, only FULL ACCESS mode allows the
bq27545-G1 to write access-mode transition keys stored in the Security class.
8.5.6 Sealing and Unsealing Data Flash
The bq27545-G1 implements a key-access scheme to transition between SEALED, UNSEALED, and FULL-
ACCESS modes. Each transition requires that a unique set of two keys be sent to the bq27545-G1 through the
Control() control command. The keys must be sent consecutively, with no other data being written to the
Control() register in between. To avoid conflict, the keys must be different from the codes presented in the CNTL
DATA column of Table 12 subcommands.
When in SEALED mode the [SS] bit of CONTROL_STATUS is set, but when the UNSEAL keys are correctly
received by the bq27545-G1, the [SS] bit is cleared. When the full-access keys are correctly received the
CONTROL_STATUS [FAS] bit is cleared.
Both Unseal Key and Full-Access Key have two words and are stored in data flash. The first word is Key 0 and
the second word is Key 1. The order of the keys sent to bq27545-G1 are Key 1 followed by Key 0. The order of
the bytes for each key entered through the Control() command is the reverse of what is read from the part. For
an example, if the Unseal Key is 0x56781234, key 1 is 0x1234 and key 0 is 0x5678. Then Control() should
supply 0x3412 and 0x7856 to unseal the part. The Unseal Key and the Full-Access Key can only be updated
when in FULL-ACCESS mode.
8.5.7 Data Flash Summary
The following table summarizes the data flash locations, including their default, minimum, and maximum values,
that are available to users.
Table 17. Data Flash Summary
Units
(EVSW
Units)*
Subclass
ID
Data
Type
Class
Subclass
Offset
Name
Min Value
Max Value
Default Value
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
2
2
Safety
Safety
0
2
3
5
7
8
0
2
4
0
OT Chg
OT Chg Time
I2
U1
I2
0
1200
60
550
2
0.1°C
s
0
2
Safety
OT Chg Recovery
OT Dsg
0
1200
1200
60
500
600
2
0.1°C
0.1°C
s
2
Safety
I2
0
0
2
Safety
OT Dsg Time
U1
I2
2
Safety
OT Dsg Recovery
Chg Inhibit Temp Low
Chg Inhibit Temp High
Temp Hys
0
1200
1200
1200
100
550
0
0.1°C
0.1°C
0.1°C
0.1°C
mV
32
32
32
34
Charge Inhibit Cfg
Charge Inhibit Cfg
Charge Inhibit Cfg
Charge
I2
–400
–400
0
I2
450
50
I2
Charging Voltage
I2
0
4600
4200
36
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
Table 17. Data Flash Summary (continued)
Units
(EVSW
Units)*
Subclass
ID
Data
Type
Class
Subclass
Offset
Name
Min Value
Max Value
Default Value
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
Configuration
36
36
36
36
36
36
36
36
36
48
48
48
48
48
48
48
48
48
48
48
48
48
48
49
49
49
49
49
49
49
49
49
49
56
56
56
56
56
56
57
59
59
59
59
59
59
60
64
64
64
66
66
66
66
68
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Charge Termination
Data
0
2
Taper Current
Min Taper Capacity
Taper Voltage
I2
I2
0
1000
1000
1000
60
100
25
mA
mAh
mV
s
0
4
I2
0
100
40
6
Current Taper Window
TCA Set %
U1
I1
0
7
–1
100
99
%
8
TCA Clear %
I1
–1
100
95
%
9
FC Set %
I1
–1
100
–1
%
10
11
0
FC Clear %
I1
–1
100
98
%
DODatEOC Delta T
Rem Cap Alarm
I2
0
1000
700
50
0.1°C
mA
mA
mA
I2
0
100
–10
–500
0
Data
8
Initial Standby
I1
–256
0
Data
9
Initial MaxLoad
I2
–32767
0
Data
17
19
23
25
27
29
40
42
43
44
45
0
Cycle Count
U2
I2
0
65535
32767
32767
32767
0
Data
CC Threshold
100
900
1000
5400
–400
80
mAh
mAh
Data
Design Capacity
Design Energy
I2
0
Data
I2
0
mWh
mA
Data
SOH Load I
I2
–32767
Data
TDD SOH Percent
ISD Current
I1
0
100
%
Data
I2
0
32767
255
10
HourRate
Data
ISD I Filter
U1
U1
U1
S11
U2
U2
U2
U2
I2
0
127
7
Data
Min ISD Time
0
255
Hour
Data
Design Energy Scale
Device Name
0
255
1
Data
x
x
bq27545-G1
150
175
75
—
mAh
mAh
mAh
mAh
mV
s
Discharge
SOC1 Set Threshold
SOC1 Clear Threshold
SOCF Set Threshold
SOCF Clear Threshold
BL Set Volt Threshold
BL Set Volt Time
BL Clear Volt Threshold
BH Set Volt Threshold
BH Volt Time
0
0
65535
65535
65535
65535
16800
60
Discharge
2
Discharge
4
0
Discharge
6
0
100
2500
2
Discharge
9
0
Discharge
11
12
14
16
17
0
U1
I2
0
Discharge
0000
0
16800
16800
60
2600
4500
2
mV
mV
s
Discharge
I2
Discharge
U1
I2
0
Discharge
BH Clear Volt Threshold
Pack Lot Code
0000
0x0
0x0
0x0
0x0
0x0
0x0
0x0
0
16800
0xffff
0xffff
0xffff
0xffff
0xffff
0xffff
0x7fff
1400
1400
32767
32767
32767
32767
65535
0xffff
0xff
4400
0x0
0x0
0x0
0x0
0x0
0x0
0x0
0
mV
—
Manufacturer Data
Manufacturer Data
Manufacturer Data
Manufacturer Data
Manufacturer Data
Manufacturer Data
Integrity Data
Lifetime Data
Lifetime Data
Lifetime Data
Lifetime Data
Lifetime Data
Lifetime Data
Lifetime Temp Samples
Registers
H2
H2
H2
H2
H2
H2
H2
I2
2
PCB Lot Code
—
4
Firmware Version
Hardware Revision
Cell Revision
—
6
—
8
—
10
6
DF Config Version
Static Chem DF Checksum
Lifetime Max Temp
Lifetime Min Temp
Lifetime Max Pack Voltage
Lifetime Min Pack Voltage
Lifetime Max Chg Current
Lifetime Max Dsg Current
LT Flash Cnt
—
0
0.1°C
0.1°C
mV
2
I2
–600
0
500
2800
4200
0
4
I2
6
I2
0
mV
8
I2
–32767
–32767
0
mA
10
0
I2
0
mA
U2
H2
H1
H1
U1
U1
U1
U2
I2
0
0
Pack Configuration
Pack Configuration B
Pack Configuration C
LT Temp Res
0x0
0x0
0x0
0
0x1177
0xa7
0x18
10
Registers
2
Registers
3
0xff
Lifetime Resolution
Lifetime Resolution
Lifetime Resolution
Lifetime Resolution
Power
0
255
Num
Num
Num
Num
mV
1
LT V Res
0
255
25
2
LT Cur Res
0
255
100
60
3
LT Update Time
Flash Update OK Voltage
0
65535
4200
0
0
2800
Copyright © 2012–2018, Texas Instruments Incorporated
37
bq27545-G1
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
Units
Table 17. Data Flash Summary (continued)
Subclass
ID
Data
Type
Class
Subclass
Offset
Name
Min Value
Max Value
Default Value
(EVSW
Units)*
Configuration
Configuration
Configuration
Configuration
System Data
System Data
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
Gas Gauging
OCV Table
68
68
68
68
58
58
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
81
81
81
81
81
81
81
82
82
82
82
82
82
82
82
82
83
88
88
Power
Power
2
11
13
15
0–31
32–63
0
Sleep Current
Hibernate I
I2
U2
U2
U1
H1
H1
U1
U1
U1
U1
U2
I2
0
100
700
10
8
mA
mA
mV
s
0
Power
Hibernate V
2400
3000
255
2550
0
Power
FS Wait
0
Manufacturer Info
Manufacturer Info
IT Cfg
Block A 0–31
0x0
0xff
0x0
0x0
1
—
Block B 0–31
0x0
0xff
—
Load Select
0
255
IT Cfg
1
Load Mode
0
255
0
IT Cfg
21
22
25
67
69
72
76
78
80
82
86
87
89
91
92
93
95
96
102
103
0
Max Res Factor
Min Res Factor
Ra Filter
0
255
15
IT Cfg
0
255
5
IT Cfg
0
1000
3700
4200
65534
9000
14000
9000
14000
15
800
3000
200
500
0
IT Cfg
Terminate Voltage
Term V Delta
2800
mV
mV
IT Cfg
I2
0
IT Cfg
ResRelax Time
User Rate-mA
User Rate-Pwr
Reserve Cap-mAh
Reserve Energy
Max Scale Back Grid
Max DeltaV
U2
I2
0
s
IT Cfg
2000
mA
IT Cfg
I2
3000
0
mW/cW
mA
IT Cfg
I2
0
0
IT Cfg
I2
0
0
mWh/cWh
IT Cfg
U1
U2
U2
U1
U1
U2
U1
U2
U1
I2
0
4
IT Cfg
0
65535
65535
255
200
0
mV
mV
IT Cfg
Min DeltaV
0
IT Cfg
Max Sim Rate
Min Sim Rate
Ra Max Delta
Qmax Max Delta %
DeltaV Max Delta
Fast Scale Start SOC
Charge Hys V Shift
Dsg Current Threshold
Chg Current Threshold
Quit Current
0
1
C/rate
C/rate
mΩ
IT Cfg
0
255
20
IT Cfg
0
65535
100
43
IT Cfg
0
5
mAmpHour
mV
IT Cfg
0
65535
100
10
IT Cfg
0
10
%
IT Cfg
0
2000
2000
2000
1000
8191
255
40
mV
Current Thresholds
Current Thresholds
Current Thresholds
Current Thresholds
Current Thresholds
Current Thresholds
Current Thresholds
State
I2
0
60
mA
2
I2
0
75
mA
4
I2
0
40
mA
6
Dsg Relax Time
Chg Relax Time
Quit Relax Time
Max IR Correct
Qmax Cell 0
U2
U1
U1
U2
I2
0
60
s
8
0
60
s
9
0
63
1
s
10
0
0
1000
32767
65535
0x6
400
1000
0
mV
0
mAh
State
2
Cycle Count
U2
H1
I2
0
0x0
0
State
4
Update Status
V at Chg Term
Avg I Last Run
Avg P Last Run
Delta Voltage
T Rise
0x0
4200
–299
–1131
2
State
5
5000
32767
32767
32767
32767
32767
FFFF
0x0
mV
mA
State
7
I2
–32768
–32768
–32768
0
State
9
I2
mA
State
11
15
17
0
I2
mV
State
I2
20
Num
Num
num
—
State
T Time Constant
Chem ID
I2
0
1000
0128
0xff55
407
OCV Table
R_a0
H2
H2
I2
0
Ra Table
0
Cell0 R_a flag
Cell0 R_a 0–14
0x0
183
2–10
—
Ω
Ra Table
R_a0
2–31
183
Ra Table
Ra Table
89
89
R_a0x
R_a0x
0
xCell0 R_a flag
xCell0 R_a 0–14
H2
I2
0xffff
183
0xffff
183
0xffff
407
2–10
Ω
2–31
Calibration
Calibration
104
104
Data
Data
0
4
CC Gain
CC Delta
F4
F4
1.0e–1
4.0e+1
0.4768
2.9826e+4 1.193046e+
6
567744.56
Calibration
Calibration
Calibration
104
104
104
Data
Data
Data
8
CC Offset
Board Offset
Int Temp Offset
I2
I1
I1
–32768
–128
32767
127
–1200
mA
10
11
0
0
µAmp
–128
127
38
Copyright © 2012–2018, Texas Instruments Incorporated
bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
Table 17. Data Flash Summary (continued)
Units
(EVSW
Units)*
Subclass
ID
Data
Type
Class
Subclass
Offset
Name
Min Value
Max Value
Default Value
Calibration
Calibration
Calibration
Security
104
104
107
112
112
112
112
112
112
Data
Data
12
13
1
Ext Temp Offset
Pack V Offset
Deadband
I1
–128
–128
0
127
0
I1
127
0
Current
Codes
Codes
Codes
Codes
Codes
Codes
U1
H4
H4
H4
H4
H4
H4
255
5
mA
—
—
—
—
—
—
0
Sealed to Unsealed
Unsealed to Full
Authen Key3
0x0
0x0
0x0
0x0
0x0
0x0
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0xffffffff
0x36720414
0xffffffff
Security
4
Security
8
0x01234567
0x89abcdef
0xfedcba98
0x76543210
Security
12
16
20
Authen Key2
Security
Authen Key1
Security
Authen Key0
表 18. Data Flash to EVSW Conversion
Data Flash (DF)
to EVSW
Conversion
Subclass
ID
Data
Type
Data Flash
Default
Data Flash
EVSW
Default
EVSW
Unit
Class
Subclass
Offset
Name
Unit
Gas Gauging
Gas Gauging
Calibration
Calibration
Calibration
Calibration
80
IT Cfg
IT Cfg
Data
Data
Data
Data
78
82
0
User Rate-Pwr
Reserve Energy
CC Gain
I2
I2
0
0
cW/10W
cWh/10cWh
Num
0
mW/cW
mWh/cW
mΩ
DF × 10
DF × 10
80
0
104
104
104
104
F4
F4
I2
0.47095
5.595e5
–1200
0
10.124
10.147
–0.576
0
4.768/DF
4
CC Delta
Num
mΩ
5677445/DF
DF × 0.0048
DF × 0.0075
8
CC Offset
Num
mV
10
Board Offset
I1
Num
µV
8.6 Register Maps
8.6.1 Pack Configuration Register
Some bq27545-G1 pins are configured through the Pack Configuration data flash register, as indicated in 表
19. This register is programmed/read through the methods described in Accessing the Data Flash. The register
is located at Subclass = 64, offset = 0.
表 19. Pack Configuration Bit Definition
bit7
RESCAP
0
bit6
CALEN
0
bit5
INTPOL
0
bit4
INTSEL
1
bit3
RSVD
0
bit2
IWAKE
0
bit1
RSNS1
0
bit0
RSNS0
1
High Byte
Default =
0x11
0x77
Low Byte
Default =
GNDSEL
0
RFACTSTEP
1
SLEEP
1
RMFCC
1
SE_PU
0
SE_POL
1
SE_EN
1
TEMPS
1
RESCAP = No-load rate of compensation is applied to the reserve capacity calculation. True when set.
CALEN = Calibration mode is enabled.
INTPOL = Polarity for Interrupt pin. (See INTERRUPT Mode.)
INTSEL = Interrupt Pin select: 0 = SE pin, 1 = HDQ pin. (See INTERRUPT Mode.)
RSVD = Reserved. Must be 0.
IWAKE/RSNS1/RSNS0 = These bits configure the current wake function (See Wake-Up Comparator).
GNDSEL = The ADC ground select control. The VSS (pins C1, C2) is selected as ground reference when the bit is clear.
Pin A1 is selected when the bit is set.
RFACTSTEP = Enables Ra step up/down to Max/Min Res Factor before disabling Ra updates.
SLEEP = The fuel gauge can enter sleep, if operating conditions allow. True when set. (See SLEEP Mode.)
RM is updated with the value from FCC, on valid charge termination. True when set. (See Detection Charge
Termination.)
RMFCC =
SE_PU = pullup enable for SE pin. True when set (push-pull). (See SHUTDOWN Mode.)
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39
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
SE_POL = Polarity bit for SE pin. SE is active high when set (makes SE high when gauge is ready for shutdown). (See
SHUTDOWN Mode.)
SE_EN = Indicates if set the shutdown feature is enabled. True when set. (See SHUTDOWN Mode.)
TEMPS = Selects external thermistor for Temperature() measurements. True when set. (See Temperature Measurement
and the TS Input.)
8.6.2 Pack Configuration B Register
Some bq27545-G1 pins are configured through the Pack Configuration B data flash register, as indicated in 表
20. This register is programmed/read through the methods described in Accessing the Data Flash. The register
is located at Subclass = 64, offset = 2.
表 20. Pack Configuration B Bit Definition
bit7
bit6
bit5
bit4
bit3
bit2
bit1
bit0
ChgDoD
EoC
SE_TDD
VconsEN
SE_ISD
RSVD
LFPRelax
DoDWT
FConvEn
Default =
1
0
1
0
0
1
1
1
0x67
ChgDoDEoC = Enable DoD at EoC recalculation during charging only. True when set. Default setting is recommended.
SE_TDD = Enable Tab Disconnection Detection. True when set. (See Tab Disconnection Detection.)
VconsEN = Enable voltage consistency check. True when set. Default setting is recommended.
SE_ISD = Enable Internal Short Detection. True when set. (See Internal Short Detection.)
RSVD = Reserved. Must be 0
LFPRelax = Enable LiFePO4 long RELAX mode. True when set.
Enable DoD weighting feature of gauging algorithm. This feature can improve accuracy during RELAX in a flat
DoDWT =
portion of the voltage profile, especially when using LiFePO4 chemistry. True when set.
FConvEn = Enable fast convergence algorithm. Default setting is recommended. (See Fast Resistance Scaling.)
8.6.3 Pack Configuration C Register
Some bq27545-G1 algorithm settings are configured through the Pack Configuration C data flash register, as
indicated in 表 21. This register is programmed/read through the methods described in Accessing the Data Flash.
The register is located at Subclass = 64, offset = 3.
表 21. Pack Configuration C Bit Definition
bit7
bit6
bit5
bit4
bit3
bit2
bit1
bit0
RSVD
RSVD
RelaxRC
JumpOK
SmoothEn
SleepWk
Chg
RSVD
RSVD
RSVD
Default =
0
0
0
1
1
0
0
0
0x18
RSVD = Reserved. Must be 0.
Allow SOC to change due to temperature change during relaxation when SOC smoothing algorithm is enabled.
True when set.
RelaxRCJumpOK =
SmoothEn = Enable SOC smoothing algorithm. True when set. (See StateOfCharge() Smoothing.)
SleepWkChg = Enables compensation for the passed charge missed when waking from SLEEP mode.
40
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The bq27545-G1 measures the cell voltage, temperature, and current to determine battery SOC based on
Impedance Track algorithm (see the Theory and Implementation of Impedance Track Battery Fuel-Gauging
Algorithm Application Note [SLUA450] for more information). The bq27545-G1 monitors charge and discharge
activity by sensing the voltage across a small-value resistor (5 mΩ to 20 mΩ typical.) between the SRP and SRN
pins and in series with the cell. By integrating charge passing through the battery, the battery’s SOC is adjusted
during battery charge or discharge.
9.2 Typical Application
VCC
J6
1
2
R12
Ext Thermistor
RT1
10 kΩ
4.7 k
4
3
2
1
R6
R9
HDQ
VSS
100
100
VCC
C4
.47 µf
TP7
AZ23C5V6-7
J8
J9
D1
VCC
U1
bq27545YZFR
VCC
TS
E3
NC/GPIO
A1
A2
A3
B1
B2
B3
C1
J7
SRP
HDQ
SCL
SRN
TS
E2
E1
1
2
1
BAT
2
REGIN
NC/GPIO
CE
TP9
PACK+
D3
D2
D1
C3
C2
R14
10 k
R15
10 k
C2
C1
VCC
VCC
SE
SDA
VSS
R10
100
R7
0.1 µF
0.1 µF
4
3
2
1
R4
R8
VSS
100
SE
SDA
2
1
100
100
SCL
VSS
PACK+/Load+
PACK–/Load–
Place C1 close to BAT pin
TP5
Vin Max: 4.2 V
Current Max: 3 A
AZ23C5V6-7
Place C2 close to REGIN pin
C3
1 µF
D2
TB2
J10
TP2
CELL +
TP10
PACK–
TB1
Place R1, R3, C5, C6, C7
Close to GG
1
2
R1
R3
CELL +
CELL –
J3
1
ON
100
2
100
CE
3
OFF
TP1
TP6
CELL –
Low-pass filter for coulomb counter input should be placed
as close as possible to gas gauge IC. Connection to sense
resistor must be of Kelvin connection type.
R15
330
U2
MM3511
R17
1 k
U2/Q1A/Q1B
6
2
1
3
5
4
C13
V–
COUT
DS
DOUT
0.1 µF
VDD
VSS
TP5
Q1:A
Q1:B
R2
0.01
SI6926DQ
C14
0.1 µF
SI6926DQ
C15
0.1 µF
R7, R8, and R9 are optional pulldown resistors if pullup resistors are applied.
图 9. Reference Schematic
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
Typical Application (接下页)
9.2.1 Design Requirements
Several key parameters must be updated to align with a given application's battery characteristics. For highest
accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance
and maximum chemical capacity (Qmax) values before sealing and shipping systems to the field. Successful and
accurate configuration of the fuel gauge for a target application can be used as the basis for creating a golden
file that can be written to all gauges, assuming identical pack design and Li-Ion cell origin (chemistry, lot, and so
on). Calibration data is included as part of this golden file to cut down on system production time. If using this
method, TI recommends averaging the voltage and current measurement calibration data from a large sample
size and use these in the golden file. 表 22 shows the items that should be configured to achieve reliable
protection and accurate gauging with minimal initial configuration.
表 22. Key Data Flash Parameters for Configuration
NAME
DEFAULT
UNIT
RECOMMENDED SETTING
Set based on the nominal pack capacity as interpreted from the cell
manufacturer's data sheet. If multiple parallel cells are used, should be set to
N × Cell Capacity.
Design Capacity
1000
mAh
Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy
is divided by this value.
Design Energy Scale
CC Threshold
1
—
900
mAh
Set to 90% of configured Design Capacity.
Should be configured using TI-supplied Battery Management Studio (bqStudio)
software. Default open-circuit voltage and resistance tables are also updated in
conjunction with this step.
Do not attempt to manually update reported Device Chemistry as this does not
change all chemistry information. Always update chemistry using the bqStudio
software tool.
Chem ID
0100
hex
Load Mode
Load Select
1
1
—
—
Set to applicable load model, 0 for constant current or 1 for constant power.
Set to load profile which most closely matches typical system load.
Set to initial configured value for Design Capacity. The gauge will update this
parameter automatically after the optimization cycle and for every regular
Qmax update thereafter.
Qmax Cell 0
1000
mAh
Set to empty point reference of battery based on system needs. Typical is from
3000 mV to 3200 mV.
Terminate Voltage
Ra Max Delta
3200
44
mV
mΩ
Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed.
Set based on nominal charge voltage for the battery in normal conditions
(25°C, and so on). Used as the reference point for offsetting by Taper Voltage
for full charge termination detection.
Charging Voltage
Taper Current
4200
100
100
60
mV
mA
mV
mA
mA
mA
mA
Set to the nominal taper current of the charger + taper current tolerance to
ensure that the gauge will reliably detect charge termination.
Sets the voltage window for qualifying full charge termination. Can be set
tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer
JEITA temperature ranges that use derated charging voltage.
Taper Voltage
Sets threshold for gauge detecting battery discharge. Should be set lower than
minimal system load expected in the application and higher than Quit Current.
Dsg Current Threshold
Chg Current Threshold
Quit Current
Sets the threshold for detecting battery charge. Can be set higher or lower
depending on typical trickle charge current used. Also should be set higher
than Quit Current.
75
Sets threshold for gauge detecting battery relaxation. Can be set higher or
lower depending on typical standby current and exhibited in the end system.
40
Current profile used in capacity simulations at onset of discharge or at all times
if Load Select = 0. Should be set to nominal system load. Is automatically
updated by the gauge every cycle.
Avg I Last Run
–299
Power profile used in capacity simulations at onset of discharge or at all times
if Load Select = 0. Should be set to nominal system power. Is automatically
updated by the gauge every cycle.
Avg P Last Run
Sleep Current
–1131
15
mW
mA
Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in
setting above typical standby currents else entry to SLEEP may be
unintentionally blocked.
42
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bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
Typical Application (接下页)
表 22. Key Data Flash Parameters for Configuration (接下页)
NAME
DEFAULT
UNIT
RECOMMENDED SETTING
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to current.
CC Gain
10
mΩ
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines conversion of coulomb counter measured
sense resistor voltage to passed charge.
CC Delta
CC Offset
10
–1418
0
mΩ
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines native offset of coulomb counter hardware
that should be removed from conversions.
Counts
Counts
Calibrate this parameter using TI-supplied bqStudio software and calibration
procedure in the TRM. Determines native offset of the printed-circuit-board
parasitics that should be removed from conversions.
Board Offset
9.2.2 Detailed Design Procedure
9.2.2.1 BAT Voltage Sense Input
A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high-frequency current pulses (that is, cell phones), but is recommended for use in all applications to
reduce noise on this sensitive high-impedance measurement node.
9.2.2.2 SRP and SRN Current Sense Inputs
The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage
measured across the sense resistor. These components should be placed as close as possible to the coulomb
counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatch-
induced measurement errors.
9.2.2.3 Sense Resistor Selection
Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage and derived current it senses. As such, TI recommends selecting a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 100-ppm drift
sense resistor with a 1-W power rating.
9.2.2.4 TS Temperature Sense Input
Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away
from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the
capacitor provides additional ESD protection because the TS input to system may be accessible in systems that
use removable battery packs. It should be placed as close as possible to the respective input pin for optimal
filtering performance.
9.2.2.5 Thermistor Selection
The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type
(NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting
coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the
default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for
example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest
accuracy temperature measurement performance.
9.2.2.6 REGIN Power Supply Input Filtering
A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection
(PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of
coupling into the internal supply rails of the fuel gauge.
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
9.2.2.7 VCC LDO Output Filtering
A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge
load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage
ripple inside of the fuel gauge.
9.2.3 Application Curves
8.8
2.65
VREGIN = 2.7 V
8.7
2.60
2.55
2.50
2.45
2.40
2.35
VREGIN = 4.5 V
8.6
8.5
8.4
8.3
8.2
8.1
8
-40
-20
0
20
40
60
80
100
0
20
40
60
80
100
œ40
œ20
Temperature (èC)
Temperature (°C)
D002
C001
图 11. High-Frequency Oscillator Frequency vs
图 10. Regulator Output Voltage vs
Temperature
Temperature
34
33.5
33
5
4
3
2
32.5
32
1
0
-1
-2
-3
-4
-5
31.5
31
30.5
30
-40
-20
0
20
40
60
80
100
-30
-20
-10
0
10
20
30
40
50
60
Temperature (èC)
Temperature (èC)
D003
D004
图 12. Low-Frequency Oscillator Frequency vs
图 13. Reported Internal Temperature Measurement vs
Temperature
Temperature
44
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bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
10 Power Supply Recommendations
10.1 Power Supply Decoupling
Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic
capacitors placed as close as possible to the respective pins to optimize ripple rejection and provide a stable and
dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF capacitor at
VCC will suffice for satisfactory device performance.
11 Layout
11.1 Layout Guidelines
11.1.1 Sense Resistor Connections
Kelvin connections at the sense resistor are as critical as those for the battery terminals. The differential traces
should be connected at the inside of the sense resistor pads and not along the high-current trace path to prevent
false increases to measured current that could result when measuring between the sum of the sense resistor and
trace resistance between the tap points. In addition, the routing of these leads from the sense resistor to the
input filter network and finally into the SRP and SRN pins must be as closely matched in length as possible or
else additional measurement offset could occur. It is further recommended to add copper trace or pour-based
"guard rings" around the perimeter of the filter network and coulomb counter inputs to shield these sensitive pins
from radiated EMI into the sense nodes. This prevents differential voltage shifts that could be interpreted as real
current change to the fuel gauge. All of the filter components must be placed as close as possible to the coulomb
counter input pins.
11.1.2 Thermistor Connections
The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as
possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses
periodically during temperature sensing windows.
11.1.3 High-Current and Low-Current Path Separation
注
For best possible noise performance, it is important to separate the low-current and high-
current loops to different areas of the board layout.
The fuel gauge and all support components should be situated on one side of the boards and tap off of the high-
current loop (for measurement purposes) at the sense resistor. Routing the low-current ground around instead of
under high-current traces will further help to improve noise rejection.
版权 © 2012–2018, Texas Instruments Incorporated
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ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
www.ti.com.cn
11.2 Layout Example
PACK+
SCL
Use copper
pours for battery
power path to
minimize IR
losses
R10
R8
R7
SDA
SE
R4
C1
RTHERM
Kelvin connect the
BAT sense line
right at positive
battery terminal
C2
C3
NC
NC
SE
HDQ
SDA
TS
R6
R9
SCL
PACK–
10 mΩ1%
Via connects to Power Ground
Kelvin connect SRP
and SRN
Star ground right at PACK –
for ESD return path
connections right at
Rsense terminals
图 14. Layout Example
46
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bq27545-G1
www.ti.com.cn
ZHCSAB6E –OCTOBER 2012–REVISED MAY 2018
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档
请参阅如下相关文档：
•
•
《bq27545EVM 单节电池 Impedance Track™ 技术评估模块》(SLUU984)
《Impedance Track 电池电量计量算法的理论及实现》(SLUA450)
12.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.3 商标
Impedance Track, Nano-Free, E2E are trademarks of Texas Instruments.
I2C is a trademark of NXP Semiconductors, N.V.
All other trademarks are the property of their respective owners.
12.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
12.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此产品说明书的浏览器版本，请查阅左侧的导航栏。
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47
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ27545YZFR-G1
BQ27545YZFT-G1
ACTIVE
ACTIVE
DSBGA
DSBGA
YZF
YZF
15
15
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
BQ27545
BQ27545
SNAGCU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Oct-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ27545YZFR-G1
BQ27545YZFT-G1
DSBGA
DSBGA
YZF
YZF
15
15
3000
250
180.0
180.0
8.4
8.4
2.1
2.1
2.76
2.76
0.81
0.81
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Oct-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ27545YZFR-G1
BQ27545YZFT-G1
DSBGA
DSBGA
YZF
YZF
15
15
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YZF0015
DSBGA - 0.625 mm max height
SCALE 6.500
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.625 MAX
SEATING PLANE
0.05 C
0.35
0.15
BALL TYP
1 TYP
SYMM
E
D
SYMM
2
TYP
C
B
0.5
TYP
A
1
2
3
0.35
0.25
C A B
15X
0.5 TYP
0.015
4219381/A 02/2017
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
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EXAMPLE BOARD LAYOUT
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
15X ( 0.245)
(0.5) TYP
1
3
2
A
B
SYMM
C
D
E
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
0.05 MIN
(
0.245)
METAL
METAL UNDER
SOLDER MASK
EXPOSED
METAL
EXPOSED
METAL
(
0.245)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4219381/A 02/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZF0015
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
15X ( 0.25)
1
2
3
A
B
(0.5)
TYP
METAL
TYP
SYMM
C
D
E
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4219381/A 02/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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