BQ27Z561YPHR [TI]
适用于 1 节电池的 Impedance Track™ 集成电路电量计解决方案 | YPH | 12 | -40 to 85;
| 型号： | BQ27Z561YPHR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 1 节电池的 Impedance Track™ 集成电路电量计解决方案 | YPH | 12 | -40 to 85 电池 |
| 文件： | 总27页 (文件大小：1353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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BQ27Z561
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
适用于 1 节锂离子电池组的 BQ27Z561 Impedance Track™ 电池电量监测
计解决方案
1 特性
3 说明
1
•
•
•
支持低至 1mΩ 的电流感应电阻器
德州仪器 (TI) BQ27Z561 Impedance Track™电量监
测计解决方案是一个高度集成的高精度单节电池电量监
测计，具有闪存可编程的定制精简指令集 CPU (RISC)
和锂离子和锂聚合物电池组 SHA-256 认证。单节功能
包括可提高容量的并联电池。
SHA-256 认证响应器，用于提高电池组安全性
两个独立的 ADC
–
–
支持电流和电压同步采样
高精度库伦计数器，输入失调电压误差 < 1µV
（典型值）
BQ27Z561 电量监测计通过兼容 I2C 的接口和 HDQ 单
线制接口进行通信，且包括几个有助于实现准确电量监
测 应用的 关键 特性。通过集成的温度检测功能（内部
和外部选项），可实现系统和电池温度测量。集成的
SHA-256 功能有助于在系统和电池组之间实现安全识
别。通过中断功能，BQ27Z561 器件可在发生充电状
态 (SOC)、电压或温度故障时通知系统。通过低电压
运行，即使在深度放电情况下，系统也能够持续监控电
池的状态。在低活跃度情况下，该器件可设置为低功耗
库伦计数 (CC) 模式，从而在显著降低运行电流的情况
下继续进行库伦计数。
•
•
•
•
•
低电压 (2V) 运行
支持电池组侧电量监测
宽量程电流 应用 （1mA 至 > 5A）
高电平有效或低电平有效中断引脚
节能模式（典型电池组运行范围条件）
–
–
–
典型睡眠模式：低于 11μA
典型深度睡眠模式：低于 9μA
典型关断模式：低于 1.9μA
•
•
内部和外部温度感应功能
适用于高速编程和数据访问的 400kHz I2C 总线通
信接口
器件信息(1)
•
•
用于主机通信的单线制 HDQ
器件型号
BQ27Z561
封装
封装尺寸（标称值）
紧凑型 12 引脚 DSBGA 封装 (YPH)
DSBGA (12)
1.67mm × 2.05mm
2 应用
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
•
•
•
•
智能手机
数码相机与摄像机
平板电脑计算
便携式和可穿戴健康设备以及便携式音频设备
简化原理图
PACK+
Protector
IC
CE
SDA/HDQ
SCL
BAT_SNS
BAT
INT
+
-
PULS
TS
VSS
SRN SRP
PACK-
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSCY0
BQ27Z561
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
www.ti.com.cn
目录
6.18 I2C Timing — 400 kHz ............................................ 7
6.19 HDQ Timing ............................................................ 8
6.20 Typical Characteristics.......................................... 10
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
Applications and Implementation ...................... 14
8.1 Application Information............................................ 15
8.2 Typical Applications ............................................... 15
Power Supply Requirements .............................. 17
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Supply Current .......................................................... 5
6.6 Internal 1.8-V LDO (REG18)..................................... 5
6.7 I/O (CE, PULS, INT).................................................. 5
6.8 Internal Temperature Sensor .................................... 5
6.9 NTC Thermistor Measurement Support.................... 5
6.10 Coulomb Counter (CC) ........................................... 5
6.11 Analog Digital Converter (ADC).............................. 6
6.12 Internal Oscillator Specifications............................. 6
6.13 Voltage Reference1 (REF1).................................... 6
6.14 Voltage Reference2 (REF2).................................... 7
6.15 Flash Memory ......................................................... 7
6.16 I2C I/O ..................................................................... 7
6.17 I2C Timing — 100 kHz ............................................ 7
7
8
9
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 18
11 器件和文档支持 ..................................................... 19
11.1 文档支持................................................................ 19
11.2 接收文档更新通知 ................................................. 19
11.3 社区资源................................................................ 19
11.4 商标....................................................................... 19
11.5 静电放电警告......................................................... 19
11.6 Glossary................................................................ 19
12 机械、封装和可订购信息....................................... 19
4 修订历史记录
Changes from Revision A (June 2018) to Revision B
Page
•
已更改 更改了器件信息 中的封装尺寸 .................................................................................................................................... 1
2
Copyright © 2018–2019, Texas Instruments Incorporated
BQ27Z561
www.ti.com.cn
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
5 Pin Configuration and Functions
1
2
3
D
C
B
A
SRP
BAT
CE
SRN
TS
BAT_SNS
NU
VSS
SCL
INT
PULS
SDA/HDQ
Not to scale
Pin Functions
NUMBER
NAME
I/O
DESCRIPTION
Battery voltage measurement input. Kelvin battery sense connection to BAT_SNS. Connect a
capacitor (1 µF) between BAT and VSS. Place the capacitor close to the gauge.
D2
BAT
CE
P(1)
D3
C2
A1
A2
B1
C3
I
Active high chip enable
BAT_SNS
INT
AI
O
Battery sense
Interrupt for voltage, temperature, and state of charge (programmable active high or low)
Programmable pulse width with active high or low option
Temperature input for ADC
PULS
TS
O
AI
NU
NU
Makes no external connection
Serial clock for I2C interface; requires external pull up when used. It can be left floating if
unused.
Serial data for I2C interface and one-wire interface for HDQ (selectable); requires external pull
up when used. It can be left floating if unused.
B3
A3
D1
SCL
I/O
I/O
I
SDA/HDQ
SRP
Analog input pin connected to the internal coulomb counter peripheral for integrating a small
voltage between SRP (positive side) and SRN
Analog input pin connected to the internal coulomb counter peripheral for integrating a small
voltage between SRP (positive side) and SRN.
C1
B2
SRN
VSS
I
P
Device ground
(1) P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/O = Digital Input/Output, NU = Not Used
Copyright © 2018–2019, Texas Instruments Incorporated
3
BQ27Z561
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
-0.3
–0.3
–40
–40
–65
MAX
UNIT
V
BAT
6
6
INT, PULS, CE
V
Input Voltage
SRP, SRN, BAT_SNS
TS
VBAT + 0.3
V
V
2.1
6
SCL, SDA/HDQ
V
Operating ambient temperature, TA
Operating junction temperature, TJ
Storage temperature, Tstg
85
°C
°C
°C
125
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM) on all pins, per
ANSI/ESDA/JEDEC JS-001(1)
±1500
V(ESD) Electrostatic discharge
V
Charged-device model (CDM) on all pins, per JEDEC
specification JESD22-C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM enables safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM enables safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
MIN
NOM
MAX
UNIT
VBAT
CBAT
Supply voltage
No operating restrictions
2.0
5.5
V
External capacitor from BAT to
VSS
1
0
0
µF
V
VTS
Temperature sense
1.8
VPULS
,
Input and output pins
VBAT
V
VINT, VCE
VSCL
VSDA/HDQ
,
Communication pins
0
VBAT
V
6.4 Thermal Information
Over-operating free-air temperature range (unless otherwise noted)
BQ27Z561
DSBGA (YPH)
(12 PINS)
64.1
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
RθJC(top)
RθJB
59.8
52.7
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
ψJB
28.3
RθJC(bot)
2.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
4
Copyright © 2018–2019, Texas Instruments Incorporated
BQ27Z561
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ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
6.5 Supply Current
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
INORMAL
TEST CONDITIONS
Standard operating Conditions
MIN
TYP
60
11
9
MAX
UNIT
µA
ISLEEP
Sense resistor current below SLEEP mode threshold
Sense resistor current below DEEP SLEEP mode threshold
CE = VIL
µA
IDEEPSLEEP
IOFF
µA
0.5
µA
6.6 Internal 1.8-V LDO (REG18)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
1.6
TYP
MAX
2.0
UNIT
VREG18
VPORth
VPORhy
Regulator output voltage
POR threshold
1.8
V
V
V
Rising Threshold
1.45
1.7
POR hysteresis
0.1
6.7 I/O (CE, PULS, INT)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
VREG18 = 1.8 V
MIN
TYP
MAX
UNIT
V
VIH
VIL
VOL
CI
High-level input voltage
Low-level input voltage low
Output voltage low for INT/PULS
Input capacitance
1.15
VREG18 = 1.8 V
0.50
0.4
V
VREG18 = 1.8 V, IOL = 1 mA
V
5
pF
µA
Ilkg
Input leakage current
1
6.8 Internal Temperature Sensor
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
1.65
0.17
TYP
1.73
0.18
MAX
1.8
UNIT
VTEMPP
VTEMPP – VTEMPN (assured by design)
Internal Temperature sensor
voltage drift
V(TEMP)
mV/°C
0.19
6.9 NTC Thermistor Measurement Support
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RNTRC(PU)
Internal Pullup Resistance
14.4
18
21.6
kΩ
Resistance drift over
temperature
RNTC(DRIFT)
–250
–120
0
PPM/°C
6.10 Coulomb Counter (CC)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V(CC_IN)
Input voltage range
Conversion time
Effective Resolution
–0.1
0.1
t(CC_CONV)
Single conversion
1000
3.8
ms
µV
1 LSB
16-bit, Best fit over input voltage
range
Integral nonlinearity
-22.3
-2.6
5.2
+22.3
LSB
Differential nonlinearity
Offset error
16-bit, No missing codes
16- bit Post-Calibration
1.5
1.3
LSB
LSB
+2.6
0.07
Offset error drift
15-bit + sign, Post Calibration
0.04
LSB/°C
15-bit + sign, Over input voltage
range
Gain Error
-492
131
+492
LSB
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BQ27Z561
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
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Coulomb Counter (CC) (continued)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LSB/°C
MΩ
15-bit + sign, Over input voltage
range
Gain Error drift
4.3
9.8
Effective input resistance
7
6.11 Analog Digital Converter (ADC)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
VFS = VREF2
MIN
–0.2
–0.2
–0.2
-8.4
TYP
MAX
1.0
UNIT
V
VADC_TS_GPIO
VBAT_MODE
Input voltage range
VFS = VREG18 × 2
1.44
5.5
V
Battery Input Voltage
Integral nonlinearity
Differential nonlinearity
V
16-bit, Best fit, -0.1 V to 0.8 × VREF2
16-bit, No missing codes
16-bit Post-Calibration(1), VFS
VREF2
16-bit Post-Calibration(1), VFS
VREF2
+8.4
LSB
LSB
1.5
1.8
=
Offset error
-4.2
+4.2
0.1
LSB
=
Offset error drift
0.02
LSB/°C
Gain Error
16-bit, –0.1 to 0.8 × VFS
16-bit, –0.1 to 0.8 × VFS
-492
8
131
2
+492
4.5
LSB
LSB/°C
MΩ
Gain Error drift
Effective input resistance
Conversion time
t(ADC_CONV)
11.7
15
ms
Effective resolution
14
bits
(1) Factory calibration.
6.12 Internal Oscillator Specifications
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
High Frequency Oscillator (HFO)
fHFO
Operating frequency
16.78
MHz
TA = –20°C to 70°C
–2.5%
–3.5
2.5%
3.5
fHFO
HFO frequency drift
TA = –40°C to 85°C
TA = –40°C to 85°C, oscillator
frequency within +/- 3% of nominal
frequency or a power-on reset
tHFOSTART
HFO Start-up time
4
ms
Low Frequency Oscillator (LFO)
fLFO
Operating frequency
Frequency error
65.536
kHz
fLFO(ERR)
TA = –40°C to 85°C
-2.5%
+2.5%
6.13 Voltage Reference1 (REF1)
Unless otherwise noted, characteristics noted under conditions of TA = –40°C to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VREF1
Internal Reference Voltage(1)
1.195
1.21
1.227
V
Internal Reference Voltage
Drift
VREF1_DRIFT
TA = –40°C to 85°C
-80
+80 PPM/C
(1) Used for CC and LDO
6
Copyright © 2018–2019, Texas Instruments Incorporated
BQ27Z561
www.ti.com.cn
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
6.14 Voltage Reference2 (REF2)
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VREF2
Internal Reference Voltage(1)
1.2
1.21
1.22
V
Internal Reference Voltage
Drift
VREF2_DRIFT
TA = –40°C to 85°C
-20
20 PPM/°C
(1) Used for ADC
6.15 Flash Memory
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Data retention
10
20000
1000
100
Years
Cycles
Cycles
Data Flash
Flash programming write
cycles
Instruction Flash
t(ROWPROG)
t(MASSERASE)
t(PAGEERASE)
IFLASHREAD
IFLASHWRTIE
IFLASHERASE
Row programming time
Mass-erase time
40
40
40
1
µs
ms
ms
mA
mA
mA
TA = –40°C to 85°C
TA = –40°C to 85°C
TA = –40°C to 85°C
TA = –40°C to 85°C
TA = –40°C to 85°C
Page-erase time
Flash Read Current
Flash Write Current
Flash Erase Current
5
15
6.16 I2C I/O
Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER
TEST CONDITIONS
SCL, SDA/HDQ, VREG18 = 1.8 V
VREG18 = 1.8 V
MIN
TYP
MAX
UNIT
VIH
VIL
VOL
CI
High-level input voltage
Low-level input voltage low
Low-level output voltage
Input capacitance
1.26
V
V
0.54
0.36
10
IOL = 1 mA, VREG18 = 1.8 V
V
pF
µA
Ilkg
Input leakage current
1
6.17 I2C Timing — 100 kHz
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
fSCL
Clock Operating Frequency
START Condition Hold Time
Low period of the SCL Clock
SCL duty cycle = 50%
100
kHz
µs
tHD:STA
tLOW
4.0
4.7
µs
High period of the SCL
Clock
tHIGH
4.0
µs
tSU:STA
tHD:DAT
tSU:DAT
tr
Setup repeated START
Data hold time (SDA input)
Data setup time (SDA input)
Clock Rise Time
4.7
0
µs
ns
ns
ns
ns
µs
250
10% to 90%
90% to 10%
1000
300
tf
Clock Fall Time
tSU:STO
Setup time STOP Condition
4.0
4.7
Bus free time STOP to
START
tBUF
µs
6.18 I2C Timing — 400 kHz
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
fSCL
Clock Operating Frequency
START Condition Hold Time
SCL duty cycle = 50%
400
kHz
µs
tHD:STA
0.6
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ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
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I2C Timing — 400 kHz (continued)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
tLOW
tHIGH
Low period of the SCL Clock
1.3
µs
High period of the SCL
Clock
600
ns
tSU:STA
tHD:DAT
tSU:DAT
tr
Setup repeated START
Data hold time (SDA input)
Data setup time (SDA input)
Clock Rise Time
600
0
ns
ns
ns
100
10% to 90%
90% to 10%
300
300
ns
ns
µs
tf
Clock Fall Time
tSU:STO
Setup time STOP Condition
0.6
1.3
Bus free time STOP to
START
tBUF
µs
6.19 HDQ Timing
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
tB
Break Time
190
µs
µs
µs
µs
µs
µs
µs
µs
µs
tBR
Break Recovery Time
Host Write 1 Time
40
0.5
86
tHW1
tHW0
tCYCH
tCYCD
tDW1
tDW0
tRSPS
Host drives HDQ
Host drives HDQ
Device drives HDQ
Device drives HDQ
Device drives HDQ
Device drives HDQ
Device drives HDQ
50
Host Write 0 Time
145
Cycle Time, Host to device
Cycle Time, device to Host
Device Write 1 Time
Device Write 0 Time
Device Response Time
190
190
32
205
250
50
80
145
950
190
Host drives HDQ after device drives
HDQ
tTRND
tRISE
tRST
Host Turn Around Time
250
2.2
µs
µs
s
HDQ Line Rising Time to
Logic 1
1.8
Host drives HDQ low before device
reset
HDQ Reset
SDA
t
BUF
t
t
LOW
t
f
HD;STA
t
r
t
t
SP
t
r
f
SCL
t
t
SU;STA
t
SU;STO
HD;STA
t
HIGH
t
t
SU;DAT
HD;DAT
STOP START
START
REPEATED
START
Figure 1. I2C Timing
8
Copyright © 2018–2019, Texas Instruments Incorporated
BQ27Z561
www.ti.com.cn
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
1.2V
t
t
(R ISE)
(BR )
t
(B)
(b) H D Q line rise tim e
(a) Break and Break R ecovery
t
(D W 1)
t
(H W 1)
t
(D W 0)
(C YC D )
t
(H W 0)
(C YC H )
t
t
(d) Gauge Transm itted Bit
(c) H ost Transm itted Bit
7-bit address
1-bit
R/W
8-bit data
Break
t
(R SPS)
(e) Gauge to Host Response
t
(R ST )
(f) H D Q R eset
a . H D Q Bre a kin g
b . R ise tim e o f H D Q lin e
c. H D Q H o st to fu e l g a u g e co m m u n ica tio n
d . Fu e l g a u g e to H o st co m m u n ica tio n
e . Fu e l g a u g e to H o st re sp o n se fo rm a t
f. H D Q H o st to fu e l g a u g e
Figure 2. HDQ Timing
Copyright © 2018–2019, Texas Instruments Incorporated
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6.20 Typical Characteristics
1.8
1.795
1.79
1.21
1.208
1.206
1.204
1.202
1.2
Min
Nom
Max
1.785
1.78
Min
Nom
Max
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
0
20
40
60
80
100
Temperature (èC)
Temperature (èC)
D001
D002
BAT Min = 2 V
BAT Nom = 3.6 V
BAT Max = 5 V
BAT Min = 2 V
BAT Nom = 3.6 V
BAT Max = 5 V
Figure 3. REF1 Voltage Versus Battery and Temperature
Figure 4. LDO Voltage Versus Battery and Temperature
66
20
15
10
5
Min
Nom
Max
65.8
65.6
65.4
65.2
65
0
Min
Nom
Max
-5
64.8
-10
-60
-40
-20
0
20
40
60
80
100
-60
-40
-20
0
20
40
60
80
100
Temperature (èC)
Temperature (èC)
D003
D004
BAT Min = 2 V
BAT Nom = 3.6 V
BAT Max = 5 V
BAT Min = 2 V
BAT Nom = 3.6 V
BAT Max = 5 V
Figure 5. LFO Frequency Versus Battery and Temperature
Figure 6. ADVC Offset Voltage Versus Battery and
Temperature
7 Detailed Description
7.1 Overview
The BQ27Z561 gas gauge is a fully integrated battery manager that employs flash-based firmware to provide a
complete solution for battery-stack architectures composed of 1-series cells. The BQ27Z561 device interfaces
with a host system via an I2C or HDQ protocol. High-performance, integrated analog peripherals enable support
for a sense resistor down to 1 mΩ, and simultaneous current/voltage data conversion for instant power
calculations. The following sections detail all of the major component blocks included as part of the BQ27Z561
device.
10
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7.2 Functional Block Diagram
BAT_SNS
BAT
VSS
TS
GPIO
Internal
Temp
Sensor
REG18
CE
ADC MUX
REF1
CC
SRP
SRN
ADC
HFO
LFO
REF2
INT
PULS
CC/ADC
Digital
Filter
IO and
Interrupt
Controller
SDA/HDQ
COM
Engine
Test
Interface
Timers
SCL
Data (8bit)
DMAddr (16bit)
bqBMP
CPU
PMAddr
(16 bit)
PMInstr
(8bit)
ROM
12-
kBytes
Program Flash
32-kBytes
Data Flash
4-kBytes
Data SRAM
2-kBytes
Copyright © 2017, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 BQ27Z561 Processor
The BQ27Z561 device uses a custom TI-proprietary processor design that features a Harvard architecture and
operates at frequencies up to 4.2 MHz. Using an adaptive, three-stage instruction pipeline, the BQ27Z561
processor supports variable instruction lengths of 8, 16, or 24 bits.
7.3.2 Battery Parameter Measurements
The BQ27Z561 device measures cell voltage and current simultaneously, and also measures temperature to
calculate the information related to remaining capacity, full charge capacity, state-of-health, and other gauging
parameters.
7.3.2.1 Coulomb Counter (CC)
The first ADC is an integrating analog-to-digital converter designed specifically for tracking charge and discharge
activity, or coulomb counting, of a rechargeable battery. It features a single-channel differential input that
converts the voltage difference across a sense resistor between the SRP and SRN terminals with a resolution of
3.74 µV.
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Feature Description (continued)
7.3.2.2 CC Digital Filter
The CC digital filter generates a 16-bit conversion value from the delta-sigma CC front-end. Its FIR filter uses the
HFO clock output. New conversions are available every 1 s.
7.3.2.3 ADC Multiplexer
The ADC multiplexer provides selectable connections to the external pins BAT, BAT_SNS, TS, the internal
temperature sensor, internal reference voltages, internal 1.8-V regulator, and VSS ground reference input. In
addition, the multiplexer can independently enable the TS input connection to the internal thermistor biasing
circuitry, and enables the user to short the multiplexer inputs for test and calibration purposes.
7.3.2.4 Analog-to-Digital Converter (ADC)
The second ADC is a 16-bit delta-sigma converter designed for general-purpose measurements. The ADC
automatically scales the input voltage range during sampling based on channel selection. The converter
resolution is a function of its full-scale range and number of bits, yielding a 38-µV resolution.
7.3.2.5 Internal Temperature Sensor
An internal temperature sensor is available on the BQ27Z561 device to reduce the cost, power, and size of the
external components necessary to measure temperature. It is available for connection to the ADC using the
multiplexer, and is ideal for quickly determining pack temperature under a variety of operating conditions.
7.3.2.6 External Temperature Sensor Support
The TS input is enabled with an internal 18-kΩ (Typ.) linearization pull-up resistor to support the use of a 10-kΩ
(25°C) NTC external thermistor, such as the Semitec 103AT-2. The NTC thermistor should be connected
between VSS and the individual TS pin. The analog measurement is then taken via the ADC through its input
multiplexer. If a different thermistor type is required, then changes to configurations may be required.
REG18
TS
ADC
NTC
Figure 7. External Thermistor Biasing
7.3.3 Power Supply Control
The BQ27Z561 device uses the BAT pin as its power source. BAT powers the internal voltage sources that
supply references for the device. BAT_SNS is a non-current carrying path and used at the Kelvin reference for
BAT.
12
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Feature Description (continued)
7.3.4 Bus Communication Interface
The BQ27Z561 device has an I2C bus communication interface. Alternatively, the BQ27Z561 can be configured
to communicate through the HDQ pin (shared with SDA).
NOTE
Once the device is switched to the HDQ protocol, it is not reversible.
7.3.5 Low Frequency Oscillator
The BQ27Z561 device includes a low frequency oscillator (LFO) running at 65.536 kHz.
7.3.6 High Frequency Oscillator
The BQ27Z561 includes a high frequency oscillator (HFO) running at 16.78 MHz. It is frequency locked to the
LFO output and scaled down to 8.388 MHz with a 50% duty cycle.
7.3.7 1.8-V Low Dropout Regulator
The BQ27Z561 device contains an integrated capacitor-less 1.8-V LDO (REG18) that provides regulated supply
voltage for the device CPU and internal digital logic.
7.3.8 Internal Voltage References
The BQ27Z561 device provides two internal voltage references. REF1 is used by REG18, oscillators, and CC.
REF2 is used by the ADC.
7.3.9 Gas Gauging
This device uses the Impedance Track™ technology to measure and determine the available charge in battery
cells. See the Theory and Implementation of Impedance Track Battery Fuel-Gauging Algorithm Application
Report (SLUA450) for further details.
7.3.10 Charge Control Features
This device supports charge control features, such as:
•
Reports charging voltage and charging current based on the active temperature range—JEITA temperature
ranges T1, T2, T3, T4, T5, and T6
•
•
Provides more complex charging profiles, including sub-ranges within a standard temperature range
Reports the appropriate charging current required for constant current charging, and the appropriate charging
voltage needed for constant voltage charging to a smart charger, using the bus communication interface
•
•
Selects the chemical state-of-charge of each battery cell using the Impedance Track method
Reports charging faults and indicates charge status via charge and discharge alarms
7.3.11 Authentication
This device supports security with the following features, which can be enabled if desired:
•
•
Authentication by the host using the SHA-256 method
The gas gauge requires SHA-256 authentication before the device can be unsealed or allow full access.
7.4 Device Functional Modes
This device supports four modes, but the current consumption varies, based on firmware control of certain
functions and modes of operation:
•
NORMAL mode: In this mode, the device performs measurements, calculations, protections, and data
updates every 250-ms intervals. Between these intervals, the device is operating in a reduced power stage to
minimize total average current consumption.
•
SLEEP mode: In this mode, the device performs measurements, calculations, and data updates in adjustable
time intervals. Between these intervals, the device is operating in a reduced power stage to minimize total
Copyright © 2018–2019, Texas Instruments Incorporated
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Device Functional Modes (continued)
average current consumption.
•
•
DEEP SLEEP mode: In this mode, the current is reduced slightly while current and voltage are still measured
periodically, with a user-defined time between reads.
OFF mode: The device is completely disabled by pulling CE low. CE disables the internal voltage rail. All non-
volatile memory is unprotected.
7.4.1 Lifetime Logging Features
The device supports data logging of several key parameters for warranty and analysis:
•
•
•
Maximum and minimum cell temperature
Maximum current in CHARGE or DISCHARGE mode
Maximum and minimum cell voltages
7.4.2 Configuration
The device supports accurate data measurements and data logging of several key parameters.
7.4.2.1 Coulomb Counting
The device uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement. The ADC
measures charge/discharge flow of the battery by measuring the voltage across a very small external sense
resistor. The integrating ADC measures a bipolar signal from a range of –100 mV to 100 mV, with a positive
value when V(SRP) – V(SRN), indicating charge current and a negative value indicating discharge current.
The current measurement is performed by measuring the voltage drop across the external sense resistor, which
can be as low as 1 mΩ, and the polarity of the differential voltage determines if the cell is in the CHARGE or
DISCHARGE mode.
7.4.2.2 Cell Voltage Measurements
The BQ27Z561 gas gauge measures the cell voltage at 1-s intervals using the ADC. This measured value is
internally scaled for the ADC and is calibrated to reduce any errors due to offsets. This data is also used for
calculating the impedance of the cell for Impedance Track gas gauging.
7.4.2.3 Auto Calibration
The auto-calibration feature helps to cancel any voltage offset across the SRP and SRN pins for accurate
measurement of the cell voltage, charge/discharge current, and thermistor temperature. The auto-calibration is
performed when there is no communication activity for a minimum of 5 s on the bus lines.
7.4.2.4 Temperature Measurements
This device has an internal sensor for on-die temperature measurements, and the ability to support an external
temperature measurement via the external NTC on the TS pin. These two measurements are individually
enabled and configured.
8 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
14
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8.1 Application Information
The BQ27Z561 gas gauge can be used with a 1-series li-ion/Li Polymer battery pack. To implement and design a
comprehensive set of parameters for a specific battery pack, the user needs Battery Management Studio
(bqStudio), which is a graphical user-interface tool installed on a PC during development. The firmware installed
in the product has default values, which are summarized in the BQ27Z561 Technical Reference Manual
(SLUUBO7). Using the bqStudio tool, these default values can be changed to cater to specific application
requirements during development once the system parameters, such as enable/disable of certain features for
operation, cell configuration, chemistry that best matches the cell used, and more are known. The final flash
image, which is extracted once configuration and testing are complete, will be used for mass production and is
referred to as the "golden image."
8.2 Typical Applications
The following is an example BQ27Z561 application schematic for a single-cell battery pack.
PACK+
Protector
IC
CE
Tie to CPU for
direct control
SDA/HDQ
SCL
BAT_SNS
BAT
INT
+
-
1 µF
PULS
Battery
NU
TS
Thermistor
10 kΩ
VSS
SRN
SRP
0.1 mF
RSRN
100 Ω
RSRP
100 Ω
PACK-
RSENSE
1 mΩ
Figure 8. BQ27Z561 1-Series Cell Typical Implementation
8.2.1 Design Requirements (Default)
Design Parameter
Cell Configuration
Design Capacity
Device Chemistry
Design Voltage
Example
1s1p (1 series with 1 parallel)
5300 mAh
li-ion
4000 mV
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Typical Applications (continued)
Design Parameter
Example
Cell Low Voltage
2500 mV
8.2.2 Detailed Design Procedure
8.2.2.1 Changing Design Parameters
For the firmware settings needed for the design requirements, refer to the BQ27Z561 Technical Reference
Manual (SLUUBO7).
•
To change design capacity, set the data flash value (in mAh) in the Gas Gauging: Design: Design Capacity
register.
•
To set device chemistry, go to the data flash I2C Configuration: Data: Device Chemistry. The bqStudio
software automatically populates the correct chemistry identification. This selection is derived from using the
bqCHEM feature in the tools and choosing the option that matches the device chemistry from the list.
•
•
To set the design voltage, go to Gas Gauging: Design: Design Voltage register.
To set the Cell Low Voltage or clear the Cell Low Voltage, use Settings: Configuration: Init Voltage Low
Set or Clear. This is used to set the cell voltage level that will set (clear) the [VOLT_LO] bit in the Interrupt
Status register.
•
To enable the internal temperature and the external temperature sensors: Set Settings:Configuration:
Temperature Enable: Bit 0 (TSInt) = 1 for the internal sensor; set Bit 1 (TS1) = 1 for the external sensor.
8.2.3 Calibration Process
The calibration of current, voltage, and temperature readings is accessible by writing 0xF081 or 0xF082 to
ManufacturerAccess(). A detailed procedure is included in the BQ27Z561 Technical Reference Manual
(SLUUBO7) in the Calibration section. The description allows for calibration of cell voltage measurement offset,
battery voltage, current calibration, coulomb counter offset, PCB offset, CC gain/capacity gain, and temperature
measurement for both internal and external sensors.
8.2.4 Gauging Data Updates
When a battery pack enabled with the BQ27Z561 gas gauge is cycled, the value of FullChargeCapacity()
updates several times, including the onset of charge or discharge, charge termination, temperature delta,
resistance updates during discharge, and relaxation. Figure 9 shows actual battery voltage, load current, and
FullChargeCapacity() when some of those updates occur during a single application cycle.
Update points from the plot include:
•
•
•
Charge termination at 7900 s
Relaxation at 9900 s
Resistance update at 11500 s
16
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BQ27Z561
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ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
8.2.4.1 Application Curve
Figure 9. Full Charge Capacity Tracking (X-Axis Is Seconds)
9 Power Supply Requirements
The only power supply is the BAT pin, which is connected to the positive terminal of the battery. The input
voltage for the BAT pin will have a minimum of 2 V to a maximum of 5 V.
10 Layout
10.1 Layout Guidelines
•
The quality of the Kelvin connections at the sense resistor is critical. The sense resistor must have a
temperature coefficient no greater than 50 ppm to minimize current measurement drift with temperature.
Choose the value of the sense resistor to correspond to the available overcurrent and short-circuit ranges of
the BQ27Z561 gas gauge. Select the smallest value possible to minimize the negative voltage generated on
the BQ27Z561 VSS node during a short circuit. This pin has an absolute minimum of –0.3 V. Parallel
resistors can be used as long as good Kelvin sensing is ensured. The device is designed to support a 1-mΩ
to 3-mΩ sense resistor.
•
•
•
BAT_SNS should be tied directly to the positive connection of the battery. It should not share a path with the
BAT pin.
In reference to the gas gauge circuit the following features require attention for component placement and
layout: differential low-pass filter and I2C communication.
The BQ27Z561 gas gauge uses an integrating delta-sigma ADC for current measurements. Add a 100-Ω
resistor from the sense resistor to the SRP and SRN inputs of the device. Place a 0.1-μF filter capacitor
Copyright © 2018–2019, Texas Instruments Incorporated
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BQ27Z561
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
www.ti.com.cn
Layout Guidelines (continued)
across the SRP and SRN inputs. If required for a circuit, 0.1-µF filter capacitors can be added for additional
noise filtering for each sense input pin to ground. Place all filter components as close as possible to the
device. Route the traces from the sense resistor in parallel to the filter circuit. Adding a ground plane around
the filter network can provide additional noise immunity.
•
•
The BQ27Z561 has an internal LDO that is internally compensated and does not require an external
decoupling capacitor.
The I2C clock and data pins have integrated high-voltage ESD protection circuits; however, adding a Zener
diode and series resistor provides more robust ESD performance. The I2C clock and data lines have an
internal pull-down. When the gas gauge senses that both lines are low (such as during removal of the pack),
the device performs auto-offset calibration and then goes into SLEEP mode to conserve power.
10.2 Layout Example
No contact to NU
(BAT_SNS trace on
bottom layer)
Tab -
Tab +
PACK +
PACK -
SDA/
HDQ
INT
PULS
VSS
TS
SCL
RSRN
BAT_
SNS
SRN
SRP
NU
CE
RSENSE
BAT
RSRP
Weld
Tab
Weld
Tab
BAT -
BAT +
Battery
BAT_SNS at
Battery terminal
Figure 10. BQ27Z561 Key Trace Board Layout
18
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BQ27Z561
www.ti.com.cn
ZHCSIF7B –MAY 2018–REVISED AUGUST 2019
11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
•
•
《BQ27Z561 技术参考手册》 (SLUUBO7)
《Impedance Track 电池电量监测算法的理论及实现应用报告》(SLUA364)
11.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com. 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品
信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 商标
Impedance Track, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2018–2019, Texas Instruments Incorporated
19
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ27Z561YPHR
BQ27Z561YPHT
ACTIVE
ACTIVE
DSBGA
DSBGA
YPH
YPH
12
12
3000 RoHS & Green
250 RoHS & Green
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
BQ27Z561
BQ27Z561
SAC396
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Mar-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ27Z561YPHR
BQ27Z561YPHT
DSBGA
DSBGA
YPH
YPH
12
12
3000
250
180.0
180.0
8.4
8.4
1.83
1.83
2.2
2.2
0.53
0.53
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Mar-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ27Z561YPHR
BQ27Z561YPHT
DSBGA
DSBGA
YPH
YPH
12
12
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YPH0012
DSBGA - 0.4 mm max height
SCALE 7.000
DIE SIZE BALL GRID ARRAY
A
D
B
E
BALL A1
INDEX AREA
0.4 MAX
C
SEATING PLANE
0.05 C
0.175
0.125
BALL TYP
1 TYP
0.5 TYP
D
C
B
SYMM
1.5
TYP
D: Max = 2.08 mm, Min = 2.02 mm
E: Max = 1.705 mm, Min =1.644 mm
0.5
TYP
A
3
1
2
0.25
0.15
12X
C A
SYMM
0.015
B
4222640/A 12/2015
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YPH0012
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
12X ( 0.23)
3
1
2
A
(0.5) TYP
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MAX
0.05 MIN
(
0.23)
METAL UNDER
SOLDER MASK
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4222640/A 12/2015
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YPH0012
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
(R0.05) TYP
12X ( 0.225)
1
2
3
A
(0.5) TYP
B
SYMM
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4222640/A 12/2015
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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