BQ500110RGZT [TI]
Qi Compliant Wireless Power Transmitter Manager; 戚符合无线电源发送器管理器型号: | BQ500110RGZT |
厂家: | TEXAS INSTRUMENTS |
描述: | Qi Compliant Wireless Power Transmitter Manager |
文件: | 总25页 (文件大小:642K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
Qi Compliant Wireless Power Transmitter Manager
Check for Samples: bq500110
1
FEATURES
APPLICATIONS
•
•
•
Intelligent Control of the Power Transfer
between Base Station and Mobile Device
•
WPC 1.0 Compliant Wireless Chargers for:
–
–
–
–
Mobile and Smart Phones
MP3 Players
Conforms to Version 1.0 of the Wireless Power
Consortium (WPC) Transmitter Specifications
Global Positioning Devices
Digital Cameras
Demodulates and Decodes WPC Complaint
Message Packets from the Power Receiving
Device Over the Same Wireless Link that
Transfers Electrical Power
•
Other Wireless Power Base Stations and
Transmitters in:
–
–
Cars and Other Vehicles
•
Implements Closed-Loop Power Transfer PID
Control by Varying Frequency of the Voltage
on the Transmitting Coil
Hermetically Sealed Devices, Tools and
Appliances
–
–
Furniture Built-in Wireless Chargers
Toy Power Supplies and Chargers
•
•
Parasitic Metal Object Detection (PMOD)
Operating Modes Status Indicators
–
–
–
–
Standby
Power Transfer
Charge Complete
Fault
•
Overload and Over Temperature Protection
DESCRIPTION
The bq500110 is the industry’s first wireless power dedicated digital controller that integrates most of the logic
functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging
base station. The bq500110 is an intelligent device that periodically pings the surrounding environment for
available devices to be powered; monitors all communication from the mobile device being wirelessly powered;
adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500110 also
manages fault conditions associated with power transfer and controls the operating modes status indicator. The
bq500110 is also the first wireless power controller with parasitic metal object detection that in real time analyzes
efficiency of the established power transfer and protects itself and the power receiver from excessive power loss
and heat associated with parasitic metal objects placed in the power transfer path.
The bq500110 comes in the area saving 48-pin, 7mm x 7mm QFN package and operates over temperature
range from –40°C to 110°C.
ORDERING INFORMATION(1)
OPERATING
TEMPERATURE
RANGE, TA
TOP SIDE
MARKING
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
bq500110RGZR
bq500110RGZT
48 pin
48 pin
Reel of 2500
Reel of 250
QFN
QFN
bq500110
bq500110
-40°C to 110°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
–40
MAX
3.8
Voltage applied at V33D to DGND
Voltage applied at V33A to AGND
V
V
3.8
(2)
Voltage applied to any pin
3.8
V
Storage temperature,TSTG
150
°C
(1) Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
Supply voltage during operation, V33D, V33A
3.0
3.3
3.6
125
125
V
(1)
TA
TJ
Operating free-air temperature range
–40
°C
°C
(1)
Junction temperature
(1) When operating continuously, the bq500110's typical power consumption causes a 15°C temperature rise from ambient.
2
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN NOM
MAX
UNIT
SUPPLY CURRENT
IV33A
IV33D
V33A = 3.3 V
V33D = 3.3 V
8
15
55
42
Supply current
mA
V33D = 3.3 V while storing configuration
parameters in flash memory
IV33D
53
65
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
Emitter of NPN transistor
3.25
40
3.3
4
3.6
4.6
V
V33FB
IV33FB
Beta
3.3-V linear regulator feedback
Series pass base drive
Series NPN pass device
VIN = 12 V; current into V33FB pin
10
mA
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
V33A
Digital 3.3-V power
Analog 3.3-V power
TA = 25°C
TA = 25°C
3
3
3.6
3.6
V
V
V33 slew rate between 2.3V and 2.9V,
V33A = V33D
V33Slew
V33 slew rate
0.25
V/ms
MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B
VCM
Common mode voltage each pin
Modulation voltage digital resolution
Input Impedance
–0.15
1.631
V
EAP-EAN
REA
1
mV
MΩ
µA
Ground reference
0.5
1.5
3
5
IOFFSET
Input offset current
1 kΩ source impedance
–5
ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR
VADDR_OPEN
VADDR_SHORT
VADC_RANGE
INL
Voltage indicating open pin
Voltage indicating pin shorted to GND
Measurement range for voltage monitoring
ADC integral nonlinearity
Input leakage current
LED_MODE, PMOD_THR open
2.37
V
V
LED_MODE, PMOD_THR shorted to ground
Inputs: V_IN, I_IN, TEMP_IN, I_COIL
0.36
2.5
0
V
-2.5
2.5
mV
nA
MΩ
pF
Ilkg
3V applied to pin
Ground reference
100
RIN
Input impedance
8
CIN
Input capacitance
10
DIGITAL INPUTS/OUTPUTS
DGND
1 +0.25
VOL
VOH
Low-level output voltage
IOL = 6 mA (1), V33D = 3 V
IOH = -6 mA (2), V33D = 3 V
V
V
V33D
-0.6V
High-level output voltage
VIH
High-level input voltage
Low-level input voltage
Output high source current
Output low sink current
V33D = 3V
2.1
3.6
1.4
4
V
V
VIL
V33D = 3.5 V
IOH(MAX)
IOL(MAX)
mA
mA
4
SYSTEM PERFORMANCE
VRESET
tRESET
FSW
Voltage where device comes out of reset
V33D Pin
2.3
2
2.4
V
µs
Pulse width needed for reset
RESET pin
Switching Frequency
110
205
0.6
kHz
tdetect
Time to detect presence of device requesting power
Retention of configuration parameters
sec
tretention
TJ = 25°C
100
20
Years
K cycles
(3)(4)
Write_Cycles Number of nonvolatile erase/write cycles
TJ = 25°C
(1) The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.
(2) The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.
(3) With default device calibration. PMBus calibration can be used to improve the regulation tolerance.
(4) Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay must be
accounted for when calculating the system dynamic response. Includes EADC conversion time.
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
DEVICE INFORMATION
Functional Block Diagram
16
17
25
26
LED2/SS
bq500110
LED /
Supervisor
Control
LED1/SCLK
LP_KILL/MOSI
LED3/MISO
9
12
13
8
DRV_SEL
Digital
High Res
PWM
PWM-A
DRIVE_EN/PWM-B
COILDIS
6
COMM-1
7
COMM-2
23
WD
Flash memory
with ECC
3
PWR
ARM-7 core
3
Internal
3.3V & 1.8V
Regulator
GND
35
BPCAP
48
EXTREF
24
21
22
18
Rsvd (lrClk)
SCI_TX
DEBUG
JTAG
SCI_RX
DIAG_DISABLE
44
LED_MODE
Osc
43
31
30
29
28
27
12-bit
ADC
260
PMOD_THRESH
TEMP_IN
IIN
TRST
TMS
TDI
3
POR/BOR
watchdog
46
4
VIN
TDO
TCK
ksps
42
I_COIL
20
19
11
10
PMB_CTRL
PMB_ALERT
PMB_SDA
PMB_SCI
PMBUS
Internal Temp
Sense
4
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
48-PIN QFN PACKAGE
(TOP VIEW)
36
AGND1
1
AIN5
35 BPCap
2
3
AIN6
34
V33A
TEMP_IN
33 V33D
4
5
V_IN
RESET
32
DGND
31
6
TRST
COMM 1
bq500110
TMS
TDI
30
29
28
27
26
25
7
COMM 2
8
COIL_DIS
DRV_SEL
PMB_SCI
PMB_SDA
COIL_PWM
TDO
9
10
11
12
TCK
LED 3/ MISO/NO_SUP
MOSI
PIN FUNCTIONS
PIN
I/O
DESCRIPTION
NO.
NAME
1
2
AIN5
AIN6
I
I
Connect this pin to GND
Connect this pin to GND
Thermal protection Input
Input-voltage ADC Input
Device reset
3
TEMP_IN
V_IN
I
4
I
5
RESET
I
6
COMM1
COMM2
COIL_DIS
DRV_SEL
PMB_SCI
PMB_SDA
COIL_PWM
DRV_EN
LOGO1
I
Primary communication channel
Alternate communication channel
Coil disable
7
I
8
I
9
I
Gate Driver mode select
10
11
12
13
14
15
16
I/O
I/O
O
O
O
O
O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
PWM Output
PWM Enable Output
Optional Logic Output. Leave this pin floating.
DC Buzzer Output
BUZ_DC
LED2 / SS
LED Drive Output 2 / Slave Select output
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
PIN FUNCTIONS (continued)
PIN
NAME
I/O
DESCRIPTION
NO.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
LED1 / SCLK
DIAG_DIS
PMB_ALERT
PMB_CTRL
SCI-TX
SCI-RX
WDO
O
I/O
I/O
I/O
I/O
I/O
O
LED Drive Output 1 / Serial Clock Output
Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic.
Optional Programming I/O. Connect to GND.
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
Optional Programming I/O. Leave floating.
Optional Programming I/O. Leave floating.
External Watchdog Output
BUZ_AC
MOSI
O
AC Buzzer Output
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
—
—
—
—
I
Master Out Slave In
LED3/MISO/NO_SUP
TCK
LED Drive Output 3 / Master In Slave Out / Select stand alone operation (no supervisor)
Optional Programming I/O. Leave floating.
Optional Programming I/O. Leave floating.
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.
Optional programming I/O. Pull to GND via 10kΩ resistor.
Digital GND
TDO
TDI
TMS
TRST
DGND
V33D
Digital Core 3.3V Supply
V33A
Analog 3.3V Supply
BPCAP
AGND
1.8V Bypass Capacitor Connect Pin
Analog GND
AN1
Reserved Analog Input. Connect this pin to GND.
Reserved Analog Input. Connect this pin to GND.
Reserved Analog Input. Connect this pin to GND.
Reserved Analog Input. Connect this pin to GND.
3.3V Linear-Regulator Feedback Input. Leave this pin floating.
Coil Current Input
AN2
I
AN3
I
AN4
I
V33FB
I
I_COIL
PMOD_THR
LED_MODE
AIN7
I
I
Input to Program Parasitic Metal Object Detection Threshold
Input to Select LED Mode
I
I
Reserved Analog Input. Connect this pin to GND.
Transmitter Input Current
I_IN
I
AGN2
—
I
Analog GND 2.
EXTREF
External Reference Voltage Input. Connect this Input to GND.
6
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
TYPICAL CHARACTERISTICS
SPACER
EFFICIENCY
vs
RECTIFIER LOADING
vs
RECEIVER LOAD CURRENT
OUTPUT POWER
2.5
2
80
75
70
65
60
55
Bin 5;
R51 = 75 kW
1.5
1
Bin 2;
R51 = 48.7 kW
Bin 1;
R51 = 42.2 kW
0.5
0
Bin 0;
R51 = 0 kW
50
100
300
500
700
900
1100
0
1
2
3
4
5
6
R
- Load Current - mA
P
- Output Power - W
L
O
Figure 1.
Figure 2.
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
FUNCTIONAL OVERVIEW
The typical Wireless Power Transfer System consists of the primary and the secondary coils that are positioned
against each other in the way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite
shields as parts of their structure to even further maximize field coupling. The primary coil is exited with the
switching waveform of the transmitter power driver that gets its power from AC-DC wall adapter. The secondary
coil is connected to the rectifier that can either directly interface the battery or can have an electronic charger or
post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the
system. The system being in resonance facilitates better energy transfer compared to the inductive transfer.
Power transfer in the resonant system can also be easier controlled with the variable frequency control approach.
The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control
modulation circuit to pass coded information from the secondary side to the primary side. The coded information
is organized into information packets that have Preamble bytes, Header bytes, message bytes and the
Checksum bytes. Per WPC standard information packets can be related to Identification, Configuration, Control
Error, Rectified Power, Charge Status and End of Power Transfer. For detailed information on WPC standard
visit Wireless Power Consortium web site at http://www.wirelesspowerconsortium.com/.
There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from
the secondary side to the primary side. With resistive modulation approach shown in Figure 3, the
communication resistor periodically loads the rectifier output changing system Q factor and as a result value of
the voltage on the primary side coil. With capacitive modulation approach shown in Figure 4 a pair of
communication capacitors are periodically connected to the receiver coil network. These extra capacitance
application changes slightly the resonance frequency of the system and its response on the current operating
frequency, which in turn leads to coil voltage variation on the primary side.
With both modulation techniques primary side coil voltage variations are detected with demodulation circuit and
further interpreted in bq500110 to restore the content of the information packets and adjust controls to the
transmitter schematic.
Rectifier
Receiver
Capacitor
Amax
Receiver Coil
Modulation
Resitor
Operating state at logic “0”
Operating state at logic “1”
A(0)
A(1)
Modulation
Fsw
F, kHz
a)
b)
Figure 3. Resistive Modulation Circuit
8
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
Rectifier
Receiver
Capacitor
Receiver Coil
Amax
Modulation
Capacitors
Operating state at logic “ 0”
A(0)
Operating state at logic “ 1”
A(1)
Modulation
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 4. Capacitive Modulation Circuit
The bq500110 is the industry's first wireless power dedicated transmitter controller that simplifies integration of
wireless power technology in consumer electronics, such as digital cameras, smart phones, MP3 players and
global positioning systems, along with infrastructure applications such as furniture and cars.
The bq500110 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter
functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object
detection, protection against transmitter coil over-current, over temperature protection of the transmitter top
surface, and indication of the transmitter states of operation.
The bq500110 digital inputs receive and interpret signals from the analog demodulator circuit that provides first
stage of demodulation for digital commands sent by the WPC compliant Receiver. Based on the received
commands the controller provides control signals to the transmitter coil half-bridge power-driver. The controller
analog inputs monitor input DC voltage, Input Current, the Coil Current and the Thermal Protection input. These
analog inputs support monitoring and protective functions of the controller.
The bq500110 directly controls two LEDs to indicate the controller standby, power transfer, PMOD warning,
PMOD-stop and system fault states.
Option Select Pins
Two pins in bq500110 are allocated to program the LED mode and the PMOD mode of the device. At power–up,
a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured in order to
identify the value of the attached programming resistor. The values of the operating parameters set by these pins
are determined using Option Select Bins. For LED_MODE the selected bin determines the LED behavior based
on LED Modes; for the PMOD_THR the selected bin sets a threshold used for parasitic metal object detection
(see Metal Object Detection (MOD) section).
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
V33
bq500110
LED_MODE
MOD_THRESH
10 mA
I
BIAS
Resistors
to set
To 12 -bit ADC
options
Figure 5. Option Programming
Table 1. Option Select Bins
PMD
THRESHOLD
(mW)
RESISTANCE
LED OPTION
(kΩ)
BIN NUMBER
0
1
GND
42.2
48.7
56.2
64.9
75.0
86.6
100
0
1
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
OFF
2
2
3
3
4
4
5
5
6
6
7
7
8
115
8
9
133
9
10
11
12
13
154
10
11
12
13
178
205
open
LED Modes
The bq500110 can directly control up to three LED outputs. They are driven based on one of twelve selectable
modes. Using the resistor of the 44 pin to GND select one of the desired LED Indication scheme presented in
Table 2.
10
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
Table 2. LED Modes
Operational States
Fault
Blink
Period
(ON time
+ OFF
time) (ms)
Operating
Blink
Period
(ON time
+ OFF
time) (ms)
PLD Blink
Period
(ON time
+ OFF
Initialization
Delay
(holds LED
state at Init)
LED
Control
Option
Recommended
LED
Uses Operating Blink Rate
Power
PLD Blink
Uses Fault Blink Rate
Supervisory
Register
Diag
LED
On
Diag
LED
Off
I/O
Remarks
Initialization
Colors
PLD
Dev
Sys
NVM
Fault
Standby
Charged
time) (ms)
Xfer
Fault
Fault
Fault
26
16
17
n/a
LED1
LED2
LED3
n/a
Red
ON
ON
ON
x
ON
ON
ON
x
OFF
Blink
ON
x
OFF
ON
ON
x
ON
OFF
ON
x
ON
OFF
ON
x
ON
OFF
ON
x
ON
OFF
ON
x
ON
ON
ON
x
OFF
OFF
ON
x
Reserved for
support of
"legacy"
hardware,
uses NVM to
define LED
activity.
Green
Red (Pilot)
Pilot (Blue)
0
200
200
2000
1000
NOTE: Uses
active HIGH
LED drive!
17
16
26
n/a
LED1
LED2
LED3
n/a
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Reserved for
future
custom
implementati
ons, LED
activity
x
x
x
x
x
x
x
x
x
x
x
x
1
x
x
x
x
Pilot (Blue)
ON
ON
ON
ON
ON
ON
ON
ON
ON
ON
defined by
NVM.
17
16
26
n/a
LED1
LED2
LED3
n/a
Green
not used
not used
Pilot (Blue)
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
Simplest,
generic
single LED
indication
scheme that
signals
Power Xfer
and End of
Charge.
2
200
200
2000
0
Optional Pilot
Power
indicator is of
any color
other than
Green
17
16
26
n/a
LED1
LED2
LED3
n/a
Red
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
ON
ON
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
Blink
Blink
OFF
ON
ON
ON
OFF
OFF
OFF
ON
Simplest,
generic dual
LED
indication
scheme that
signals
Green
not used
Pilot (Blue)
OFF
ON
OFF
ON
OFF
ON
Power Xfer
and End of
Charge.
3
200
200
N/A
0
Optional Pilot
Power
indicator is of
any color
other than
Green and
Red.
17
16
26
n/a
LED1
LED2
LED3
n/a
Red
ON
ON
ON
ON
OFF
Blink
OFF
ON
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
OFF
OFF
ON
ON
ON
OFF
OFF
OFF
ON
Green
4
200
200
2000
0
not used
Pilot (Blue)
OFF
ON
OFF
ON
OFF
ON
OFF
ON
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
Table 2. LED Modes (continued)
17
16
26
n/a
17
16
26
n/a
17
LED1
LED2
LED3
n/a
Red
not used
not used
Pilot (Blue)
Red
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
Blink
OFF
OFF
ON
OFF
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
5
6
200
200
200
200
2000
2000
0
0
LED1
LED2
LED3
n/a
OFF
OFF
OFF
ON
OFF
OFF
OFF
ON
OFF
Blink
OFF
ON
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
Green
ON
not used
Pilot (Blue)
Red
OFF
ON
OFF
ON
Blink(1)
OFF
OFF
ON
(1) PLD Blinks
Operational
Blink.
LED1
OFF
OFF
ON
OFF
Blink
Blink
Blink
ON
OFF
16
26
n/a
17
LED2
LED3
n/a
Green
not used
Pilot (Blue)
Red
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
ON
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
ON
7
8
400
400
2000
2000
2000
2000
0
0
Blink(1)
OFF
OFF
ON
(1) PLD Blinks
Operational
Blink.
LED1
OFF
OFF
OFF
OFF
Blink
Blink
Blink
ON
OFF
16
26
n/a
17
16
26
n/a
17
16
26
n/a
17
16
26
n/a
17
LED2
LED3
n/a
Green
not used
Pilot (Blue)
Red
OFF
OFF
ON
OFF
OFF
ON
Blink
OFF
ON
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
ON
LED1
LED2
LED3
n/a
ON
ON
OFF
Blink
OFF
ON
OFF
ON
ON
ON
ON
ON
ON
OFF
OFF
OFF
ON
Green
ON
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
ON
9
200
200
200
200
200
200
2000
2000
2000
1000
1000
1000
not used
Pilot (Blue)
Red
OFF
ON
OFF
ON
OFF
ON
OFF
ON
LED1
LED2
LED3
n/a
ON
OFF
OFF
OFF
ON
Blink
OFF
OFF
ON
OFF
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
not used
not used
Pilot (Blue)
Red
OFF
OFF
ON
OFF
OFF
ON
10
11
LED1
LED2
LED3
n/a
ON
OFF
OFF
OFF
ON
OFF
Blink
OFF
ON
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
Blink
OFF
OFF
ON
ON
OFF
OFF
OFF
ON
Green
OFF
OFF
ON
ON
not used
Pilot (Blue)
Red
OFF
ON
OFF
ON
Blink(1)
OFF
OFF
ON
LED1
OFF
OFF
ON
OFF
Blink
Blink
Blink
ON
OFF
(1) PLD Blinks
Operational
Blink.
16
26
n/a
17
LED2
LED3
n/a
Green
not used
Pilot (Blue)
Red
ON
OFF
ON
OFF
OFF
ON
ON
OFF
ON
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
ON
12
13
400
400
2000
2000
2000
2000
1000
1000
Blink(1)
OFF
OFF
ON
LED1
OFF
OFF
OFF
OFF
Blink
Blink
Blink
ON
OFF
(1) PLD Blinks
Operational
Blink.
16
26
LED2
LED3
n/a
Green
not used
Pilot (Blue)
ON
OFF
ON
OFF
OFF
ON
Blink
OFF
ON
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
OFF
OFF
ON
ON
OFF
ON
OFF
OFF
ON
n/a
12
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
Thermal Protection
The bq500110 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the
most thermally challenged area, which usually is the center of the transmitting coil, and connected between VCC
and the dedicated pin 3. The threshold on the pin 3 is set 1.25V. The NTC resistor and the resistor from the pin 3
to GND create temperature sensitive divider. User has full flexibility choosing the NTC resistor and the value of
the resistor from the pin 3 to GND to set the desired temperature when the system shuts down.
RTEMP_IN = 0.6097 x RNTC(TMAX
)
(1)
The system will attempt to restore normal operation after approximately five minutes being in the suspended
mode due to tripping the over-temperature threshold, or if the receiver is removed.
Audible Notification on Initiation of Power Transfer
The bq500110 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 15
outputs a high logic signal for 0.5s which is suitable to activate DC type buzzers with built in tone generation,
other types of sound generators, or custom indication systems. Pin 24 outputs a 0.2s, 4000Hz square wave
signal suitable for inexpensive AC type ceramic buzzers.
Gate Driver Modes
The inner PID (proportional-integral-derivative) loop feeds the variable frequency driver, which produces a digital
signal of 50% duty cycle with variable frequency. In operation, the inner PID loop calculates the necessary
frequency, which is then generated by the variable frequency driver. The variable frequency is then fed into a
MOSFET power train that excites the serial resonance transmitter coil.
The bq500110 can operate with several types of MOSFET gate drivers to accommodate various power train
topologies. The DRV_SEL input, pin 9, selects between two modes of drive. When pin 9 is pulled to GND, the
DRV_EN output, pin 13, will be driven high while the COIL_PWM output sends a square waveform to the gate
driver. The most typical and suggested solution is to use a synchronous buck driver like the TPS28225 that
drives n-channel upper and lower power MOSFETs with a safe dead-time.
An alternative solution that may utilize a combination of p-channel and n-channel MOSFETs can be used when
input DRV_SEL input, pin 9, is pulled high to VCC. In this case the outputs COIL_PWM and DRV_EN, both output
the square waveforms to discrete gate drivers. The dead-time is provided by pulse duration difference between
the two waveforms.
Coil Disable Signal
As the part of the WPC 1.0 compliance communication protocol, the bq500110 has the coil damping control
signal that is provided on the output COIL_DIS, pin 8. The damping signal activates the MOSFET that loads the
output of the half-bridge with the 100Ω resistor.
Power-On Reset
The bq500110 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup
sequence. At the end of the startup sequence, the device begins normal operation.
External Reset
The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up
resistor to 3.3V is recommended.
Non-Volatile Memory Error Correction Coding
The device uses Error Correcting Code (ECC) to improve data integrity and provide high reliability storage of
Data Flash contents. ECC uses dedicated hardware to generate extra check bits for the user data as it is written
into the Flash memory. This adds an additional six bits to each 32-bit memory word stored into the Flash array.
These extra check bits, along with the hardware ECC algorithm, allow for any single bit error to be detected and
corrected when the Data Flash is read. Note that the Data Flash configuration has been factory programmed and
is not generally available for customization.
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s) :bq500110
bq500110
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
www.ti.com
Parasitic Metal Object Detection (PMOD)
As a safety feature, the bq500110 can be configured to detect presence of a parasitic metal object placed in the
vicinity of the magnetic field. The BQ500100 uses the Rectified Power Packet information and the measured
transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected the
device will lit the red LED to warn about this undesirable condition, If during a twenty second warning time the
parasitic metal object was not removed , the controller will disable power transfer. After being in halt for five
minutes bq500110 will attempt normal operation. If the object that caused excessive power dissipation is still
present, the sequence will be repeated over and over again. If the metal object is removed during this twenty
second warning time, the normal operation will be restored momentarily.
To facilitate parasitic loss function, the bq500110 monitors the input voltage and the input current supplied to the
coil power drive circuit.
The PMOD_THR pin is used to set the threshold at which the MOD is activated. The MOD operation can be
disabled by selecting the highest bin( leaving the pin is left floating).
The threshold is set by Equation 2:
Threshold = 1400 mW + Bin_Number x 100 mW
(2)
Note: The WPC Specification V1.0 does not define the requirements and thresholds for MOD feature, thus metal
object detection may perform differently with different products. Therefore make your own decision when setting
the threshold. In most desktop wireless charger applications setting the PMOD threshold to 1.5W shown to give
good results in stopping power transfer and preventing small metal objects like coins, pharmaceutical wraps, etc.
getting hot when placed in the path of wireless power transfer. Figure 1 depicts PMOD performance measured
on bq500110 EVM. .
APPLICATION INFORMATION
Typical application diagrams for the WPC 1.0 compliant transmitter are shown on the following pages.
14
Submit Documentation Feedback
Copyright © 2010–2011, Texas Instruments Incorporated
Product Folder Link(s) :bq500110
V 3 3 A
V 3 3 D
3 4
3 3
P P A D
D G N D
3 2
4 9
N D G 1 A
N D G 2 A
3 6
4 7
5 0 V
1 u 0 F .
C 1
4
7
8
B T
V D
P A D
G N
D
D
bq500110
www.ti.com
SLUSAE0A –NOVEMBER 2010–REVISED APRIL 2011
Changes from Original (November 2010) to Revision A
Page
•
Updated the data sheet for product release ......................................................................................................................... 1
Copyright © 2010–2011, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Link(s) :bq500110
PACKAGE OPTION ADDENDUM
www.ti.com
1-Apr-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
BQ500110RGZR
BQ500110RGZT
ACTIVE
ACTIVE
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Mar-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ500110RGZR
BQ500110RGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
330.0
180.0
16.4
16.4
7.3
7.3
7.3
7.3
1.5
1.5
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Mar-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ500110RGZR
BQ500110RGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
346.0
190.5
346.0
212.7
33.0
31.8
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Medical
Security
Logic
Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
RFID
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
相关型号:
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明