BQ500110RGZT [TI]

Qi Compliant Wireless Power Transmitter Manager; 戚符合无线电源发送器管理器
BQ500110RGZT
型号: BQ500110RGZT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Qi Compliant Wireless Power Transmitter Manager
戚符合无线电源发送器管理器

无线
文件: 总25页 (文件大小:642K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
Qi Compliant Wireless Power Transmitter Manager  
Check for Samples: bq500110  
1
FEATURES  
APPLICATIONS  
Intelligent Control of the Power Transfer  
between Base Station and Mobile Device  
WPC 1.0 Compliant Wireless Chargers for:  
Mobile and Smart Phones  
MP3 Players  
Conforms to Version 1.0 of the Wireless Power  
Consortium (WPC) Transmitter Specifications  
Global Positioning Devices  
Digital Cameras  
Demodulates and Decodes WPC Complaint  
Message Packets from the Power Receiving  
Device Over the Same Wireless Link that  
Transfers Electrical Power  
Other Wireless Power Base Stations and  
Transmitters in:  
Cars and Other Vehicles  
Implements Closed-Loop Power Transfer PID  
Control by Varying Frequency of the Voltage  
on the Transmitting Coil  
Hermetically Sealed Devices, Tools and  
Appliances  
Furniture Built-in Wireless Chargers  
Toy Power Supplies and Chargers  
Parasitic Metal Object Detection (PMOD)  
Operating Modes Status Indicators  
Standby  
Power Transfer  
Charge Complete  
Fault  
Overload and Over Temperature Protection  
DESCRIPTION  
The bq500110 is the industrys first wireless power dedicated digital controller that integrates most of the logic  
functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging  
base station. The bq500110 is an intelligent device that periodically pings the surrounding environment for  
available devices to be powered; monitors all communication from the mobile device being wirelessly powered;  
adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500110 also  
manages fault conditions associated with power transfer and controls the operating modes status indicator. The  
bq500110 is also the first wireless power controller with parasitic metal object detection that in real time analyzes  
efficiency of the established power transfer and protects itself and the power receiver from excessive power loss  
and heat associated with parasitic metal objects placed in the power transfer path.  
The bq500110 comes in the area saving 48-pin, 7mm x 7mm QFN package and operates over temperature  
range from 40°C to 110°C.  
ORDERING INFORMATION(1)  
OPERATING  
TEMPERATURE  
RANGE, TA  
TOP SIDE  
MARKING  
ORDERABLE PART NUMBER  
PIN COUNT  
SUPPLY  
PACKAGE  
bq500110RGZR  
bq500110RGZT  
48 pin  
48 pin  
Reel of 2500  
Reel of 250  
QFN  
QFN  
bq500110  
bq500110  
-40°C to 110°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 20102011, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
MIN  
0.3  
0.3  
0.3  
40  
MAX  
3.8  
Voltage applied at V33D to DGND  
Voltage applied at V33A to AGND  
V
V
3.8  
(2)  
Voltage applied to any pin  
3.8  
V
Storage temperature,TSTG  
150  
°C  
(1) Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages referenced to GND.  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN NOM MAX UNIT  
V
Supply voltage during operation, V33D, V33A  
3.0  
3.3  
3.6  
125  
125  
V
(1)  
TA  
TJ  
Operating free-air temperature range  
40  
°C  
°C  
(1)  
Junction temperature  
(1) When operating continuously, the bq500110's typical power consumption causes a 15°C temperature rise from ambient.  
2
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN NOM  
MAX  
UNIT  
SUPPLY CURRENT  
IV33A  
IV33D  
V33A = 3.3 V  
V33D = 3.3 V  
8
15  
55  
42  
Supply current  
mA  
V33D = 3.3 V while storing configuration  
parameters in flash memory  
IV33D  
53  
65  
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS  
V33  
3.3-V linear regulator  
Emitter of NPN transistor  
3.25  
40  
3.3  
4
3.6  
4.6  
V
V33FB  
IV33FB  
Beta  
3.3-V linear regulator feedback  
Series pass base drive  
Series NPN pass device  
VIN = 12 V; current into V33FB pin  
10  
mA  
EXTERNALLY SUPPLIED 3.3 V POWER  
V33D  
V33A  
Digital 3.3-V power  
Analog 3.3-V power  
TA = 25°C  
TA = 25°C  
3
3
3.6  
3.6  
V
V
V33 slew rate between 2.3V and 2.9V,  
V33A = V33D  
V33Slew  
V33 slew rate  
0.25  
V/ms  
MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B  
VCM  
Common mode voltage each pin  
Modulation voltage digital resolution  
Input Impedance  
0.15  
1.631  
V
EAP-EAN  
REA  
1
mV  
MΩ  
µA  
Ground reference  
0.5  
1.5  
3
5
IOFFSET  
Input offset current  
1 ksource impedance  
5  
ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR  
VADDR_OPEN  
VADDR_SHORT  
VADC_RANGE  
INL  
Voltage indicating open pin  
Voltage indicating pin shorted to GND  
Measurement range for voltage monitoring  
ADC integral nonlinearity  
Input leakage current  
LED_MODE, PMOD_THR open  
2.37  
V
V
LED_MODE, PMOD_THR shorted to ground  
Inputs: V_IN, I_IN, TEMP_IN, I_COIL  
0.36  
2.5  
0
V
-2.5  
2.5  
mV  
nA  
MΩ  
pF  
Ilkg  
3V applied to pin  
Ground reference  
100  
RIN  
Input impedance  
8
CIN  
Input capacitance  
10  
DIGITAL INPUTS/OUTPUTS  
DGND  
1 +0.25  
VOL  
VOH  
Low-level output voltage  
IOL = 6 mA (1), V33D = 3 V  
IOH = -6 mA (2), V33D = 3 V  
V
V
V33D  
-0.6V  
High-level output voltage  
VIH  
High-level input voltage  
Low-level input voltage  
Output high source current  
Output low sink current  
V33D = 3V  
2.1  
3.6  
1.4  
4
V
V
VIL  
V33D = 3.5 V  
IOH(MAX)  
IOL(MAX)  
mA  
mA  
4
SYSTEM PERFORMANCE  
VRESET  
tRESET  
FSW  
Voltage where device comes out of reset  
V33D Pin  
2.3  
2
2.4  
V
µs  
Pulse width needed for reset  
RESET pin  
Switching Frequency  
110  
205  
0.6  
kHz  
tdetect  
Time to detect presence of device requesting power  
Retention of configuration parameters  
sec  
tretention  
TJ = 25°C  
100  
20  
Years  
K cycles  
(3)(4)  
Write_Cycles Number of nonvolatile erase/write cycles  
TJ = 25°C  
(1) The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.  
(2) The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.  
(3) With default device calibration. PMBus calibration can be used to improve the regulation tolerance.  
(4) Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay must be  
accounted for when calculating the system dynamic response. Includes EADC conversion time.  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s) :bq500110  
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
DEVICE INFORMATION  
Functional Block Diagram  
16  
17  
25  
26  
LED2/SS  
bq500110  
LED /  
Supervisor  
Control  
LED1/SCLK  
LP_KILL/MOSI  
LED3/MISO  
9
12  
13  
8
DRV_SEL  
Digital  
High Res  
PWM  
PWM-A  
DRIVE_EN/PWM-B  
COILDIS  
6
COMM-1  
7
COMM-2  
23  
WD  
Flash memory  
with ECC  
3
PWR  
ARM-7 core  
3
Internal  
3.3V & 1.8V  
Regulator  
GND  
35  
BPCAP  
48  
EXTREF  
24  
21  
22  
18  
Rsvd (lrClk)  
SCI_TX  
DEBUG  
JTAG  
SCI_RX  
DIAG_DISABLE  
44  
LED_MODE  
Osc  
43  
31  
30  
29  
28  
27  
12-bit  
ADC  
260  
PMOD_THRESH  
TEMP_IN  
IIN  
TRST  
TMS  
TDI  
3
POR/BOR  
watchdog  
46  
4
VIN  
TDO  
TCK  
ksps  
42  
I_COIL  
20  
19  
11  
10  
PMB_CTRL  
PMB_ALERT  
PMB_SDA  
PMB_SCI  
PMBUS  
Internal Temp  
Sense  
4
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
48-PIN QFN PACKAGE  
(TOP VIEW)  
36  
AGND1  
1
AIN5  
35 BPCap  
2
3
AIN6  
34  
V33A  
TEMP_IN  
33 V33D  
4
5
V_IN  
RESET  
32  
DGND  
31  
6
TRST  
COMM 1  
bq500110  
TMS  
TDI  
30  
29  
28  
27  
26  
25  
7
COMM 2  
8
COIL_DIS  
DRV_SEL  
PMB_SCI  
PMB_SDA  
COIL_PWM  
TDO  
9
10  
11  
12  
TCK  
LED 3/ MISO/NO_SUP  
MOSI  
PIN FUNCTIONS  
PIN  
I/O  
DESCRIPTION  
NO.  
NAME  
1
2
AIN5  
AIN6  
I
I
Connect this pin to GND  
Connect this pin to GND  
Thermal protection Input  
Input-voltage ADC Input  
Device reset  
3
TEMP_IN  
V_IN  
I
4
I
5
RESET  
I
6
COMM1  
COMM2  
COIL_DIS  
DRV_SEL  
PMB_SCI  
PMB_SDA  
COIL_PWM  
DRV_EN  
LOGO1  
I
Primary communication channel  
Alternate communication channel  
Coil disable  
7
I
8
I
9
I
Gate Driver mode select  
10  
11  
12  
13  
14  
15  
16  
I/O  
I/O  
O
O
O
O
O
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.  
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.  
PWM Output  
PWM Enable Output  
Optional Logic Output. Leave this pin floating.  
DC Buzzer Output  
BUZ_DC  
LED2 / SS  
LED Drive Output 2 / Slave Select output  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s) :bq500110  
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
PIN FUNCTIONS (continued)  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
LED1 / SCLK  
DIAG_DIS  
PMB_ALERT  
PMB_CTRL  
SCI-TX  
SCI-RX  
WDO  
O
I/O  
I/O  
I/O  
I/O  
I/O  
O
LED Drive Output 1 / Serial Clock Output  
Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic.  
Optional Programming I/O. Connect to GND.  
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.  
Optional Programming I/O. Leave floating.  
Optional Programming I/O. Leave floating.  
External Watchdog Output  
BUZ_AC  
MOSI  
O
AC Buzzer Output  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
Master Out Slave In  
LED3/MISO/NO_SUP  
TCK  
LED Drive Output 3 / Master In Slave Out / Select stand alone operation (no supervisor)  
Optional Programming I/O. Leave floating.  
Optional Programming I/O. Leave floating.  
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.  
Optional programming I/O. Pull up to VCC via 5.1kΩ resistor.  
Optional programming I/O. Pull to GND via 10kΩ resistor.  
Digital GND  
TDO  
TDI  
TMS  
TRST  
DGND  
V33D  
Digital Core 3.3V Supply  
V33A  
Analog 3.3V Supply  
BPCAP  
AGND  
1.8V Bypass Capacitor Connect Pin  
Analog GND  
AN1  
Reserved Analog Input. Connect this pin to GND.  
Reserved Analog Input. Connect this pin to GND.  
Reserved Analog Input. Connect this pin to GND.  
Reserved Analog Input. Connect this pin to GND.  
3.3V Linear-Regulator Feedback Input. Leave this pin floating.  
Coil Current Input  
AN2  
I
AN3  
I
AN4  
I
V33FB  
I
I_COIL  
PMOD_THR  
LED_MODE  
AIN7  
I
I
Input to Program Parasitic Metal Object Detection Threshold  
Input to Select LED Mode  
I
I
Reserved Analog Input. Connect this pin to GND.  
Transmitter Input Current  
I_IN  
I
AGN2  
I
Analog GND 2.  
EXTREF  
External Reference Voltage Input. Connect this Input to GND.  
6
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
TYPICAL CHARACTERISTICS  
SPACER  
EFFICIENCY  
vs  
RECTIFIER LOADING  
vs  
RECEIVER LOAD CURRENT  
OUTPUT POWER  
2.5  
2
80  
75  
70  
65  
60  
55  
Bin 5;  
R51 = 75 kW  
1.5  
1
Bin 2;  
R51 = 48.7 kW  
Bin 1;  
R51 = 42.2 kW  
0.5  
0
Bin 0;  
R51 = 0 kW  
50  
100  
300  
500  
700  
900  
1100  
0
1
2
3
4
5
6
R
- Load Current - mA  
P
- Output Power - W  
L
O
Figure 1.  
Figure 2.  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s) :bq500110  
 
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
FUNCTIONAL OVERVIEW  
The typical Wireless Power Transfer System consists of the primary and the secondary coils that are positioned  
against each other in the way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite  
shields as parts of their structure to even further maximize field coupling. The primary coil is exited with the  
switching waveform of the transmitter power driver that gets its power from AC-DC wall adapter. The secondary  
coil is connected to the rectifier that can either directly interface the battery or can have an electronic charger or  
post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the  
system. The system being in resonance facilitates better energy transfer compared to the inductive transfer.  
Power transfer in the resonant system can also be easier controlled with the variable frequency control approach.  
The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control  
modulation circuit to pass coded information from the secondary side to the primary side. The coded information  
is organized into information packets that have Preamble bytes, Header bytes, message bytes and the  
Checksum bytes. Per WPC standard information packets can be related to Identification, Configuration, Control  
Error, Rectified Power, Charge Status and End of Power Transfer. For detailed information on WPC standard  
visit Wireless Power Consortium web site at http://www.wirelesspowerconsortium.com/.  
There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from  
the secondary side to the primary side. With resistive modulation approach shown in Figure 3, the  
communication resistor periodically loads the rectifier output changing system Q factor and as a result value of  
the voltage on the primary side coil. With capacitive modulation approach shown in Figure 4 a pair of  
communication capacitors are periodically connected to the receiver coil network. These extra capacitance  
application changes slightly the resonance frequency of the system and its response on the current operating  
frequency, which in turn leads to coil voltage variation on the primary side.  
With both modulation techniques primary side coil voltage variations are detected with demodulation circuit and  
further interpreted in bq500110 to restore the content of the information packets and adjust controls to the  
transmitter schematic.  
Rectifier  
Receiver  
Capacitor  
Amax  
Receiver Coil  
Modulation  
Resitor  
Operating state at logic “0”  
Operating state at logic “1”  
A(0)  
A(1)  
Modulation  
Fsw  
F, kHz  
a)  
b)  
Figure 3. Resistive Modulation Circuit  
8
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
 
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
Rectifier  
Receiver  
Capacitor  
Receiver Coil  
Amax  
Modulation  
Capacitors  
Operating state at logic “ 0”  
A(0)  
Operating state at logic “ 1”  
A(1)  
Modulation  
Fsw  
F, kHz  
Fo(1) < Fo(0)  
a)  
b)  
Figure 4. Capacitive Modulation Circuit  
The bq500110 is the industry's first wireless power dedicated transmitter controller that simplifies integration of  
wireless power technology in consumer electronics, such as digital cameras, smart phones, MP3 players and  
global positioning systems, along with infrastructure applications such as furniture and cars.  
The bq500110 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter  
functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object  
detection, protection against transmitter coil over-current, over temperature protection of the transmitter top  
surface, and indication of the transmitter states of operation.  
The bq500110 digital inputs receive and interpret signals from the analog demodulator circuit that provides first  
stage of demodulation for digital commands sent by the WPC compliant Receiver. Based on the received  
commands the controller provides control signals to the transmitter coil half-bridge power-driver. The controller  
analog inputs monitor input DC voltage, Input Current, the Coil Current and the Thermal Protection input. These  
analog inputs support monitoring and protective functions of the controller.  
The bq500110 directly controls two LEDs to indicate the controller standby, power transfer, PMOD warning,  
PMOD-stop and system fault states.  
Option Select Pins  
Two pins in bq500110 are allocated to program the LED mode and the PMOD mode of the device. At powerup,  
a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured in order to  
identify the value of the attached programming resistor. The values of the operating parameters set by these pins  
are determined using Option Select Bins. For LED_MODE the selected bin determines the LED behavior based  
on LED Modes; for the PMOD_THR the selected bin sets a threshold used for parasitic metal object detection  
(see Metal Object Detection (MOD) section).  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s) :bq500110  
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
V33  
bq500110  
LED_MODE  
MOD_THRESH  
10 mA  
I
BIAS  
Resistors  
to set  
To 12 -bit ADC  
options  
Figure 5. Option Programming  
Table 1. Option Select Bins  
PMD  
THRESHOLD  
(mW)  
RESISTANCE  
LED OPTION  
(kΩ)  
BIN NUMBER  
0
1
GND  
42.2  
48.7  
56.2  
64.9  
75.0  
86.6  
100  
0
1
1400  
1500  
1600  
1700  
1800  
1900  
2000  
2100  
2200  
2300  
2400  
2500  
2600  
OFF  
2
2
3
3
4
4
5
5
6
6
7
7
8
115  
8
9
133  
9
10  
11  
12  
13  
154  
10  
11  
12  
13  
178  
205  
open  
LED Modes  
The bq500110 can directly control up to three LED outputs. They are driven based on one of twelve selectable  
modes. Using the resistor of the 44 pin to GND select one of the desired LED Indication scheme presented in  
Table 2.  
10  
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
Table 2. LED Modes  
Operational States  
Fault  
Blink  
Period  
(ON time  
+ OFF  
time) (ms)  
Operating  
Blink  
Period  
(ON time  
+ OFF  
time) (ms)  
PLD Blink  
Period  
(ON time  
+ OFF  
Initialization  
Delay  
(holds LED  
state at Init)  
LED  
Control  
Option  
Recommended  
LED  
Uses Operating Blink Rate  
Power  
PLD Blink  
Uses Fault Blink Rate  
Supervisory  
Register  
Diag  
LED  
On  
Diag  
LED  
Off  
I/O  
Remarks  
Initialization  
Colors  
PLD  
Dev  
Sys  
NVM  
Fault  
Standby  
Charged  
time) (ms)  
Xfer  
Fault  
Fault  
Fault  
26  
16  
17  
n/a  
LED1  
LED2  
LED3  
n/a  
Red  
ON  
ON  
ON  
x
ON  
ON  
ON  
x
OFF  
Blink  
ON  
x
OFF  
ON  
ON  
x
ON  
OFF  
ON  
x
ON  
OFF  
ON  
x
ON  
OFF  
ON  
x
ON  
OFF  
ON  
x
ON  
ON  
ON  
x
OFF  
OFF  
ON  
x
Reserved for  
support of  
"legacy"  
hardware,  
uses NVM to  
define LED  
activity.  
Green  
Red (Pilot)  
Pilot (Blue)  
0
200  
200  
2000  
1000  
NOTE: Uses  
active HIGH  
LED drive!  
17  
16  
26  
n/a  
LED1  
LED2  
LED3  
n/a  
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Reserved for  
future  
custom  
implementati  
ons, LED  
activity  
x
x
x
x
x
x
x
x
x
x
x
x
1
x
x
x
x
Pilot (Blue)  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
defined by  
NVM.  
17  
16  
26  
n/a  
LED1  
LED2  
LED3  
n/a  
Green  
not used  
not used  
Pilot (Blue)  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
Simplest,  
generic  
single LED  
indication  
scheme that  
signals  
Power Xfer  
and End of  
Charge.  
2
200  
200  
2000  
0
Optional Pilot  
Power  
indicator is of  
any color  
other than  
Green  
17  
16  
26  
n/a  
LED1  
LED2  
LED3  
n/a  
Red  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
ON  
ON  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
Blink  
Blink  
OFF  
ON  
ON  
ON  
OFF  
OFF  
OFF  
ON  
Simplest,  
generic dual  
LED  
indication  
scheme that  
signals  
Green  
not used  
Pilot (Blue)  
OFF  
ON  
OFF  
ON  
OFF  
ON  
Power Xfer  
and End of  
Charge.  
3
200  
200  
N/A  
0
Optional Pilot  
Power  
indicator is of  
any color  
other than  
Green and  
Red.  
17  
16  
26  
n/a  
LED1  
LED2  
LED3  
n/a  
Red  
ON  
ON  
ON  
ON  
OFF  
Blink  
OFF  
ON  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
ON  
OFF  
OFF  
OFF  
ON  
Green  
4
200  
200  
2000  
0
not used  
Pilot (Blue)  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s) :bq500110  
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
Table 2. LED Modes (continued)  
17  
16  
26  
n/a  
17  
16  
26  
n/a  
17  
LED1  
LED2  
LED3  
n/a  
Red  
not used  
not used  
Pilot (Blue)  
Red  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
5
6
200  
200  
200  
200  
2000  
2000  
0
0
LED1  
LED2  
LED3  
n/a  
OFF  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
OFF  
Blink  
OFF  
ON  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
OFF  
ON  
Green  
ON  
not used  
Pilot (Blue)  
Red  
OFF  
ON  
OFF  
ON  
Blink(1)  
OFF  
OFF  
ON  
(1) PLD Blinks  
Operational  
Blink.  
LED1  
OFF  
OFF  
ON  
OFF  
Blink  
Blink  
Blink  
ON  
OFF  
16  
26  
n/a  
17  
LED2  
LED3  
n/a  
Green  
not used  
Pilot (Blue)  
Red  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
7
8
400  
400  
2000  
2000  
2000  
2000  
0
0
Blink(1)  
OFF  
OFF  
ON  
(1) PLD Blinks  
Operational  
Blink.  
LED1  
OFF  
OFF  
OFF  
OFF  
Blink  
Blink  
Blink  
ON  
OFF  
16  
26  
n/a  
17  
16  
26  
n/a  
17  
16  
26  
n/a  
17  
16  
26  
n/a  
17  
LED2  
LED3  
n/a  
Green  
not used  
Pilot (Blue)  
Red  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
Blink  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
LED1  
LED2  
LED3  
n/a  
ON  
ON  
OFF  
Blink  
OFF  
ON  
OFF  
ON  
ON  
ON  
ON  
ON  
ON  
OFF  
OFF  
OFF  
ON  
Green  
ON  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
9
200  
200  
200  
200  
200  
200  
2000  
2000  
2000  
1000  
1000  
1000  
not used  
Pilot (Blue)  
Red  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
LED1  
LED2  
LED3  
n/a  
ON  
OFF  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
OFF  
ON  
not used  
not used  
Pilot (Blue)  
Red  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
10  
11  
LED1  
LED2  
LED3  
n/a  
ON  
OFF  
OFF  
OFF  
ON  
OFF  
Blink  
OFF  
ON  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
Blink  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
OFF  
ON  
Green  
OFF  
OFF  
ON  
ON  
not used  
Pilot (Blue)  
Red  
OFF  
ON  
OFF  
ON  
Blink(1)  
OFF  
OFF  
ON  
LED1  
OFF  
OFF  
ON  
OFF  
Blink  
Blink  
Blink  
ON  
OFF  
(1) PLD Blinks  
Operational  
Blink.  
16  
26  
n/a  
17  
LED2  
LED3  
n/a  
Green  
not used  
Pilot (Blue)  
Red  
ON  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
12  
13  
400  
400  
2000  
2000  
2000  
2000  
1000  
1000  
Blink(1)  
OFF  
OFF  
ON  
LED1  
OFF  
OFF  
OFF  
OFF  
Blink  
Blink  
Blink  
ON  
OFF  
(1) PLD Blinks  
Operational  
Blink.  
16  
26  
LED2  
LED3  
n/a  
Green  
not used  
Pilot (Blue)  
ON  
OFF  
ON  
OFF  
OFF  
ON  
Blink  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
OFF  
OFF  
ON  
n/a  
12  
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
Thermal Protection  
The bq500110 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the  
most thermally challenged area, which usually is the center of the transmitting coil, and connected between VCC  
and the dedicated pin 3. The threshold on the pin 3 is set 1.25V. The NTC resistor and the resistor from the pin 3  
to GND create temperature sensitive divider. User has full flexibility choosing the NTC resistor and the value of  
the resistor from the pin 3 to GND to set the desired temperature when the system shuts down.  
RTEMP_IN = 0.6097 x RNTC(TMAX  
)
(1)  
The system will attempt to restore normal operation after approximately five minutes being in the suspended  
mode due to tripping the over-temperature threshold, or if the receiver is removed.  
Audible Notification on Initiation of Power Transfer  
The bq500110 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 15  
outputs a high logic signal for 0.5s which is suitable to activate DC type buzzers with built in tone generation,  
other types of sound generators, or custom indication systems. Pin 24 outputs a 0.2s, 4000Hz square wave  
signal suitable for inexpensive AC type ceramic buzzers.  
Gate Driver Modes  
The inner PID (proportional-integral-derivative) loop feeds the variable frequency driver, which produces a digital  
signal of 50% duty cycle with variable frequency. In operation, the inner PID loop calculates the necessary  
frequency, which is then generated by the variable frequency driver. The variable frequency is then fed into a  
MOSFET power train that excites the serial resonance transmitter coil.  
The bq500110 can operate with several types of MOSFET gate drivers to accommodate various power train  
topologies. The DRV_SEL input, pin 9, selects between two modes of drive. When pin 9 is pulled to GND, the  
DRV_EN output, pin 13, will be driven high while the COIL_PWM output sends a square waveform to the gate  
driver. The most typical and suggested solution is to use a synchronous buck driver like the TPS28225 that  
drives n-channel upper and lower power MOSFETs with a safe dead-time.  
An alternative solution that may utilize a combination of p-channel and n-channel MOSFETs can be used when  
input DRV_SEL input, pin 9, is pulled high to VCC. In this case the outputs COIL_PWM and DRV_EN, both output  
the square waveforms to discrete gate drivers. The dead-time is provided by pulse duration difference between  
the two waveforms.  
Coil Disable Signal  
As the part of the WPC 1.0 compliance communication protocol, the bq500110 has the coil damping control  
signal that is provided on the output COIL_DIS, pin 8. The damping signal activates the MOSFET that loads the  
output of the half-bridge with the 100Ω resistor.  
Power-On Reset  
The bq500110 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the  
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup  
sequence. At the end of the startup sequence, the device begins normal operation.  
External Reset  
The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low  
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up  
resistor to 3.3V is recommended.  
Non-Volatile Memory Error Correction Coding  
The device uses Error Correcting Code (ECC) to improve data integrity and provide high reliability storage of  
Data Flash contents. ECC uses dedicated hardware to generate extra check bits for the user data as it is written  
into the Flash memory. This adds an additional six bits to each 32-bit memory word stored into the Flash array.  
These extra check bits, along with the hardware ECC algorithm, allow for any single bit error to be detected and  
corrected when the Data Flash is read. Note that the Data Flash configuration has been factory programmed and  
is not generally available for customization.  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Link(s) :bq500110  
bq500110  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
www.ti.com  
Parasitic Metal Object Detection (PMOD)  
As a safety feature, the bq500110 can be configured to detect presence of a parasitic metal object placed in the  
vicinity of the magnetic field. The BQ500100 uses the Rectified Power Packet information and the measured  
transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected the  
device will lit the red LED to warn about this undesirable condition, If during a twenty second warning time the  
parasitic metal object was not removed , the controller will disable power transfer. After being in halt for five  
minutes bq500110 will attempt normal operation. If the object that caused excessive power dissipation is still  
present, the sequence will be repeated over and over again. If the metal object is removed during this twenty  
second warning time, the normal operation will be restored momentarily.  
To facilitate parasitic loss function, the bq500110 monitors the input voltage and the input current supplied to the  
coil power drive circuit.  
The PMOD_THR pin is used to set the threshold at which the MOD is activated. The MOD operation can be  
disabled by selecting the highest bin( leaving the pin is left floating).  
The threshold is set by Equation 2:  
Threshold = 1400 mW + Bin_Number x 100 mW  
(2)  
Note: The WPC Specification V1.0 does not define the requirements and thresholds for MOD feature, thus metal  
object detection may perform differently with different products. Therefore make your own decision when setting  
the threshold. In most desktop wireless charger applications setting the PMOD threshold to 1.5W shown to give  
good results in stopping power transfer and preventing small metal objects like coins, pharmaceutical wraps, etc.  
getting hot when placed in the path of wireless power transfer. Figure 1 depicts PMOD performance measured  
on bq500110 EVM. .  
APPLICATION INFORMATION  
Typical application diagrams for the WPC 1.0 compliant transmitter are shown on the following pages.  
14  
Submit Documentation Feedback  
Copyright © 20102011, Texas Instruments Incorporated  
Product Folder Link(s) :bq500110  
 
V 3 3 A  
V 3 3 D  
3 4  
3 3  
P P A D  
D G N D  
3 2  
4 9  
N D G 1 A  
N D G 2 A  
3 6  
4 7  
5 0 V  
1 u 0 F .  
C 1  
4
7
8
B T  
V D  
P A D  
G N  
D
D
bq500110  
www.ti.com  
SLUSAE0A NOVEMBER 2010REVISED APRIL 2011  
Changes from Original (November 2010) to Revision A  
Page  
Updated the data sheet for product release ......................................................................................................................... 1  
Copyright © 20102011, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Link(s) :bq500110  
PACKAGE OPTION ADDENDUM  
www.ti.com  
1-Apr-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
BQ500110RGZR  
BQ500110RGZT  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Mar-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ500110RGZR  
BQ500110RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
330.0  
180.0  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
1.5  
1.5  
12.0  
12.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
31-Mar-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ500110RGZR  
BQ500110RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
346.0  
190.5  
346.0  
212.7  
33.0  
31.8  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
Logic  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
Power Mgmt  
power.ti.com  
Transportation and  
Automotive  
www.ti.com/automotive  
Microcontrollers  
RFID  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2011, Texas Instruments Incorporated  

相关型号:

SI9130DB

5- and 3.3-V Step-Down Synchronous Converters

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135LG-T1-E3

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9135_11

SMBus Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9136_11

Multi-Output Power-Supply Controller

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130CG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130LG-T1-E3

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9130_11

Pin-Programmable Dual Controller - Portable PCs

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137DB

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9137LG

Multi-Output, Sequence Selectable Power-Supply Controller for Mobile Applications

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY

SI9122E

500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification Drivers

Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY