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BQ500210 [TI]

Qi Compliant Wireless Power Transmitter Manager; 戚符合无线电源发送器管理器
BQ500210
型号： BQ500210
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

Qi Compliant Wireless Power Transmitter Manager
戚符合无线电源发送器管理器

无线
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中文：  中文翻译
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bq500210  
www.ti.com  
SLUSAL8 –JUNE 2011  
Qi Compliant Wireless Power Transmitter Manager  
Check for Samples: bq500210  
1
FEATURES  
APPLICATIONS  
•
Intelligent Control of the Power Transfer  
between Base Station and Mobile Device  
Conforms to the Wireless Power Consortium  
(WPC) Wireless Power Transfer 1.0.2  
Specification  
Digital Demodulation Significantly Simplifies  
Solution Over bq500110  
Improved Parasitic Metal Object Detection  
(PMOD) Promotes Safety During Wireless  
Power Transfer  
•
WPC 1.0.2 Compliant Wireless Chargers for:  
–
–
–
–
Mobile and Smart Phones  
MP3 Players  
Global Positioning Devices  
Digital Cameras  
•
•
•
•
Other Wireless Power Transmitters in:  
–
–
Cars and Other Vehicles  
Hermetically Sealed Devices, Tools, and  
Appliances  
–
–
Furniture Built-In Wireless Chargers  
Toy Power Supplies and Chargers  
•
•
Enhanced Charge Status Indicator  
Operating Modes Status Indicators  
•
See www.ti.com/wirelesspower for More  
Information on TI's Wireless Charging  
Solutions  
–
–
–
–
Standby  
Power Transfer (visual and audio)  
Charge Complete  
Fault  
•
Over Temperature Protection  
DESCRIPTION  
The bq500210 is a second generation Wireless Power dedicated digital controller that integrates the logic  
functions required to control Wireless Power Transfer in a single channel WPC compliant contactless charging  
base station. The bq500210 is an intelligent device that periodically pings the surrounding environment for  
available devices to be powered, monitors all communication from the device being wirelessly powered, and  
adjusts power applied to the transmitter coil per feedback received from the powered device. The bq500210 also  
manages the fault conditions associated with the power transfer and controls the operating modes status  
indicator. The bq500210 supports improved Parasitic Metal Object Detection (PMOD). The controller in real time  
analyzes the efficiency of the established power transfer using Rectified Power Packets and protects itself and  
the power receiver from excessive power loss and heat associated with parasitic metal objects placed in the  
power transfer path.  
The bq500210 is available in an area saving 48-pin, 7mm x 7mm QFN package and operates over a temperature  
range from –40°C to 110°C.  
Power  
Power  
Stage  
Voltage  
AC-DC  
Rectification  
Load  
Conditioning  
Communication  
Controller  
bq500210  
bq51013  
Transmitter  
Receiver  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  
bq500210  
SLUSAL8 –JUNE 2011  
www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
OPERATING  
TEMPERATURE  
RANGE, TA  
TOP SIDE  
MARKING  
ORDERABLE PART NUMBER  
PIN COUNT  
SUPPLY  
PACKAGE  
bq500210RGZR  
bq500210RGZT  
48 pin  
48 pin  
Reel of 2500  
Reel of 250  
QFN  
QFN  
bq500210  
bq500210  
-40°C to 110°C  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
MIN  
–0.3  
–0.3  
–0.3  
–40  
MAX  
3.8  
Voltage applied at V33D to DGND  
Voltage applied at V33A to AGND  
V
V
3.8  
(2)  
Voltage applied to any pin  
3.8  
V
Storage temperature,TSTG  
150  
°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages referenced to GND.  
THERMAL INFORMATION  
bq500210  
THERMAL METRIC(1)  
RGZ  
48 PINS  
28.4  
13.9  
5.3  
UNITS  
θJA  
Junction-to-ambient thermal resistance(2)  
(3)  
θJC(top)  
θJB  
Junction-to-case(top) thermal resistance  
(4)  
Junction-to-board thermal resistance  
°C/W  
(5)  
ψJT  
Junction-to-top characterization parameter  
0.2  
(6)  
ψJB  
Junction-to-board characterization parameter  
5.2  
(7)  
θJC(bottom)  
Junction-to-case(bottom) thermal resistance  
1.4  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific  
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
2
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RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN NOM MAX UNIT  
V
Supply voltage during operation, V33D, V33A  
Operating free-air temperature range  
Junction temperature  
3.0  
3.3  
3.6  
125  
125  
V
TA  
TJ  
–40  
°C  
°C  
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ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
NOM  
MAX  
UNIT  
SUPPLY CURRENT  
IV33A  
IV33D  
V33A = 3.3 V  
V33D = 3.3 V  
8
15  
55  
42  
Supply current  
mA  
V33D = 3.3 V while storing configuration  
parameters in flash memory  
IV33D  
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS  
53  
65  
V33  
3.3-V linear regulator  
Emitter of NPN transistor  
3.25  
40  
3.3  
4
3.6  
4.6  
V
V33FB  
IV33FB  
Beta  
3.3-V linear regulator feedback  
Series pass base drive  
Series NPN pass device  
VIN = 12 V; current into V33FB pin  
10  
mA  
EXTERNALLY SUPPLIED 3.3 V POWER  
V33D  
V33A  
Digital 3.3-V power  
Analog 3.3-V power  
TA = 25°C  
TA = 25°C  
3
3
3.6  
3.6  
V
V
V33 slew rate between 2.3V and 2.9V,  
V33A = V33D  
V33Slew  
V33 slew rate  
0.25  
V/ms  
MODULATION AMPLIFIER INPUTS EAP-A, EAN-A, EAP-B, EAN-B  
VCM  
Common mode voltage each pin  
Modulation voltage digital resolution  
Input Impedance  
–0.15  
1.631  
V
EAP-EAN  
REA  
1
mV  
MΩ  
µA  
Ground reference  
0.5  
1.5  
3
5
IOFFSET  
Input offset current  
1 kΩ source impedance  
–5  
ANALOG INPUTS V_IN, I_IN, TEMP_IN, I_COIL, LED_MODE, PMOD_THR  
VADDR_OPEN  
VADDR_SHORT  
VADC_RANGE  
INL  
Voltage indicating open pin  
Voltage indicating pin shorted to GND  
Measurement range for voltage monitoring  
ADC integral nonlinearity  
Input leakage current  
LED_MODE, PMOD_THR open  
2.37  
V
V
LED_MODE, PMOD_THR shorted to ground  
Inputs: V_IN, I_IN, TEMP_IN, I_COIL  
0.36  
2.5  
0
V
-2.5  
2.5  
mV  
nA  
MΩ  
pF  
Ilkg  
3V applied to pin  
Ground reference  
100  
RIN  
Input impedance  
8
CIN  
Input capacitance  
10  
DIGITAL INPUTS/OUTPUTS  
DGND1  
+ 0.25  
VOL  
VOH  
Low-level output voltage  
IOL = 6 mA (1), V33D = 3 V  
IOH = -6 mA (2), V33D = 3 V  
V
V
V33D  
- 0.6V  
High-level output voltage  
VIH  
High-level input voltage  
Low-level input voltage  
Output high source current  
Output low sink current  
V33D = 3V  
2.1  
3.6  
1.4  
4
V
V
VIL  
V33D = 3.5 V  
IOH(MAX)  
IOL(MAX)  
mA  
mA  
4
SYSTEM PERFORMANCE  
VRESET  
tRESET  
FSW  
Voltage where device comes out of reset  
V33D Pin  
2.3  
2
2.4  
V
Pulse width needed for reset  
Switching Frequency  
RESET pin  
µs  
110  
205  
0.6  
kHz  
Time to detect presence of device requesting  
power  
tdetect  
sec  
tretention  
Retention of configuration parameters  
Number of nonvolatile erase/write cycles  
TJ = 25°C  
TJ = 25°C  
100  
20  
Years  
Write_Cycles  
K cycles  
(1) The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.  
(2) The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.  
4
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DEVICE INFORMATION  
Functional Block Diagram  
LED Control /  
Low Power  
Supervisor  
Interface  
bq500210  
MSP430 CNTL  
LED DRIVE  
COMM_A+  
COMM_A-  
COMM_B+  
PWM-A  
Digital  
Demodulation  
PWM  
PWM-B (EN)  
COMM_B-  
mController  
BUZ_AC  
BUZ_DC  
Buzzer  
Control  
V_IN  
I_OUT  
TRST  
TMS  
TDI  
12-bit  
ADC  
TEMP_EXT  
JTAG  
TDO  
TCK  
I2C  
(PMBUS)  
PMB_DATA  
PMB_CLK  
Low Power  
Control  
TEMP_INT  
SLEEP RESET  
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48-PIN QFN PACKAGE  
(TOP VIEW)  
36  
AGND  
1
AIN5  
35  
34  
BPCAP  
V33A  
2
3
T_SENSE  
AIN3  
33  
32  
31  
30  
V33D  
4
5
AIN8  
RESET  
SLEEP  
DGND  
6
JTAG _TRSTN  
JTAG _TMS  
bq500210  
7
MSP_RST/LED_A  
MSP_MISO/LED_B  
MSP_TEST  
29 JTAG _TDI  
8
JTAG _TDO  
28  
9
27  
10  
11  
12  
PMB _CLK  
JTAG _TCK  
26  
PMB _DATA  
MSP_TDO/PROG  
MSP_MOSI/LPWR_EN  
25  
DPWM _A  
PIN FUNCTIONS  
PIN  
I/O  
DESCRIPTION  
NO.  
1
NAME  
AIN5  
I
I
Connect this pin to GND  
2
T_SENSE  
AIN3  
Thermal Sensor Input  
Connect this pin to GND  
Connect this pin to GND  
Device reset  
3
I
4
AIN8  
I
5
RESET  
I
6
SLEEP  
O
I
Low-power mode start logic output  
MSP – Reset, LED-A  
MSP – TMS, SPI-MISO, LED-B  
MSP – Test  
7
MSP_RST/LED_A  
MSP_MISO/LED_B  
MSP_TEST  
PMB_CLK  
PMB_DATA  
DPWM_A  
DPMB_B  
8
I
9
I
10  
11  
12  
13  
14  
15  
16  
I/O  
I/O  
O
O
O
O
O
PMBus Clock  
PMBus Data  
PWM Output A  
PWM Output B  
MSP_SYNC  
DOUT_2B  
DOUT_4A  
MSP SPI_SYNC  
Optional Logic Output 2B. Leave this pin floating.  
Optional Logic Output 4A. Leave this pin floating.  
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PIN FUNCTIONS (continued)  
PIN  
NAME  
I/O  
DESCRIPTION  
NO.  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
DOUT_4B  
MSP_TCK/CLK  
PMB_ALERT  
PMB_CTRL  
DOUT_TX  
DRV_CFG  
BUZ_AC  
O
I/O  
O
I
Optional Logic Output 4B. Leave this pin floating.  
Disable Diagnostic Output. Leave this pin floating to inhibit diagnostic.  
PMBus Interface  
PMBus Interface  
I
Leave this pin floating  
I
Pull this input to V33D  
O
O
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
—
—
—
—
—
I
AC Buzzer Output  
BUZ_DC  
DC Buzzer Output  
MSP_MOSI/LPWR_EN  
MSP_TDO/PROG  
JTAG_TCK  
JTAG_TDO  
JTAG_TDI  
JATG_TMS  
JTAG_TRSTN  
DGND  
MSP-TDI, SPI-MOSI, Low Power Enable  
MSP-TDO, Programmed Indicator  
JTAG Interface  
JTAG Interface  
JTAG Interface  
JTAG Interface  
JTAG Interface  
Digital GND  
V33D  
Digital Core 3.3V Supply  
V33A  
Analog 3.3V Supply  
BPCAP  
Bypass Capacitor Connect Pin  
Analog GND  
AGND  
COMM_A+  
COMM_A-  
COMM_B+  
COMM_B-  
V33FB  
Digital demodulation noninverting input A  
Digital demodulation inverting input A  
Digital demodulation noninverting input B  
Digital demodulation inverting input B  
3.3V Linear-Regulator Feedback Input. Leave this pin floating.  
Transmitter Input Current  
I
I
I
I
I_IN  
I
PMOD_THR  
LED_MODE  
AIN7  
I
Input to Program Metal Object Detection Threshold  
Input to Select LED Mode  
I
I
Reserved Analog Input. Connect this pin to GND.  
Transmitter Input Voltage  
V_IN  
I
AGND  
—
I
Analog GND  
REFIN  
External Reference Voltage Input. Connect this Input to AGND.  
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TYPICAL CHARACTERISTICS  
SPACER  
EFFICIENCY  
vs  
PMOD THRESHOLD  
vs  
RECEIVER LOAD CURRENT  
OUTPUT POWER  
80  
75  
70  
65  
60  
55  
50  
1.4  
1.2  
1
R
= 75 kW  
PMOD  
R
= 64.9 kW  
PMOD  
R
= 56.2 kW  
PMOD  
0.8  
0.6  
0.4  
R
= 48.7 kW  
PMOD  
R
= 0 kW  
PMOD  
R
= 42.2 kW  
PMOD  
0.2  
0
100  
300  
500  
700  
900  
1100  
0
1
2
3
4
5
6
R
- Load Current - mA  
L
P
- Output Power - W  
O
Figure 1.  
Figure 2.  
8
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FUNCTIONAL OVERVIEW  
The typical Wireless Power Transfer System consists of primary and secondary coils that are positioned against  
each other in a way to maximize mutual coupling of their electromagnetic fields. Both coils have ferrite shields as  
part of their structures to even further maximize field coupling. The primary coil is excited with the switching  
waveform of the transmitter power driver that gets its power from an AC-DC wall adapter. The secondary coil is  
connected to the rectifier that can either directly interface the battery or can have an electronic charger or  
post-regulator connected to its output. The capacitors in series with the coils are tuned to create resonance in the  
system. The system being in resonance facilitates better energy transfer compared to inductive transfer. Power  
transfer in the resonant system can also be easily controlled with the variable frequency control approach. To  
limit operating frequency variation the bq500210 uses both frequency and PWM methods to control power  
transfer. When the operating frequency approaches a 205kHz limit and the receiver still commands lower power,  
the bq500210 will reduce the PWM cycle in discrete steps to maintain the output in regulation.  
The rectifier output voltage is monitored by the secondary side microcontroller that generates signals to control  
the modulation circuit to pass coded information from the secondary side to the primary side. The coded  
information is organized into information packets that have Preamble bytes, Header bytes, message bytes and  
Checksum bytes. Per the WPC specification, information packets can be related to Identification, Configuration,  
Control Error, Rectified Power, Charge Status, and End of Power Transfer information. For detailed information  
on  
the  
WPC  
specification,  
visit  
the  
Wireless  
Power  
Consortium  
website  
at  
http://www.wirelesspowerconsortium.com/.  
There are two ways the coupled electromagnetic field can be manipulated to achieve information transfer from  
the secondary side to the primary side. With the resistive modulation approach shown in Figure 3, the  
communication resistor periodically loads the rectifier output changing system Q factor, and as a result the value  
of the voltage on the primary side coil. With the capacitive modulation approach shown in Figure 4, a pair of  
communication capacitors are periodically connected to the receiver coil network. These extra capacitance  
application changes slightly the resonance frequency of the system and its response on the current operating  
frequency, which in turn leads to coil voltage variation on the primary side.  
With both modulation techniques primary side coil waveform variations are detected with a Digital Demodulation  
algorithm in the bq500210 to restore the content of the information packets and adjust controls to the transmitter.  
Rectifier  
Receiver  
Capacitor  
Amax  
Receiver Coil  
Modulation  
Resitor  
Operating state at logic “0”  
Operating state at logic “1”  
A(0)  
A(1)  
Comm  
Fsw  
F, kHz  
a)  
b)  
Figure 3. Resistive Modulation Circuit  
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Rectifier  
Receiver  
Capacitor  
Receiver Coil  
Amax  
Modulation  
Capacitors  
Operating state at logic “ 0”  
A(0)  
A(1)  
Operating state at logic “ 1”  
Comm  
Fsw  
F, kHz  
Fo(1) < Fo(0)  
a)  
b)  
Figure 4. Capacitive Modulation Circuit  
The bq500210 is a second generation wireless power dedicated transmitter controller that simplifies integration of  
wireless power technology into consumer electronics, such as digital cameras, smart phones, MP3 players, and  
global positioning systems, along with infrastructure applications such as furniture and cars.  
The bq500210 is a specialized digital power microcontroller that controls WPC A1, single coil, transmitter  
functions such as analog ping, digital ping, variable frequency output power control, parasitic metal object  
detection, over temperature protection of the transmitter top surface, and indication of the transmitter operating  
states.  
The bq500210 digital demodulation inputs receive scaled down voltages from the transmitter resonant  
components. The digital demodulation algorithm is a combination of several digital signal processing techniques  
that decodes information packets sent by the power receiving device and provides necessary changes to power  
drive signals facilitating closed loop regulation. The controller analog inputs monitor input DC voltage, input  
current, and the thermal protection input. These analog inputs support monitoring and protective functions of the  
controller.  
The bq500210 controls two LEDs to indicate transmitter operating and fault states. Having the LEDs connected  
directly to the controller simplifies the transmitter electrical schematic and provides a cost effective solution.  
Option Select Pins  
Two pins (43, 44) in the bq500210 are allocated to program the PMOD mode and the LED mode of the device.  
At power-up, a bias current is applied to pins LED_MODE and PMOD_THR and the resulting voltage measured  
in order to identify the value of the attached programming resistor. The values of the operating parameters set by  
these pins are determined using Option Select Bins. For LED_MODE, the selected bin determines the LED  
behavior based on LED Modes; for the PMOD_THR, the selected bin sets a threshold used for parasitic metal  
object detection (see Metal Object Detection (PMOD) section).  
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V33  
bq500210  
LED_MODE  
PMOD_THR  
10 mA  
I
BIAS  
Resistors  
to set  
To 12 -bit ADC  
options  
Figure 5. Option Programming  
Table 1. Option Select Bins  
PMOD  
THRESHOLD  
(mW)(1)  
RESISTANCE  
LED OPTION  
(kΩ)  
BIN NUMBER  
0
1
GND  
42.2  
48.7  
56.2  
64.9  
75.0  
86.6  
100  
0
1
500  
600  
2
2
700  
3
3
800  
4
4
900  
5
5
1000  
1100  
1200  
1300  
1400  
1500  
1600  
1700  
OFF  
6
6
7
7
8
115  
8
9
133  
9
10  
11  
12  
13  
154  
10  
11  
12  
13  
178  
205  
open  
(1) Threshold numbers are approximate. See Figure 2.  
LED Modes  
The bq500210 can directly control two LED outputs (pins 7 and 8). They are driven based on one of the  
selectable modes. The resistor connected between pin 44 and GND selects one of the desired LED indication  
schemes presented in Table 2.  
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Table 2. LED Modes  
Operational States  
LED  
Control  
Option  
LED  
Selection  
Resistor  
Support  
CS–100  
Support  
CS–90  
Support  
CS–6Min  
Description  
LED  
Power  
Transfer  
Charge  
Complete  
PMOD  
Warning  
Standby  
Fault  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
LED1, Green  
LED2, Red  
–
–
–
–
–
0
1
<36.5 kΩ  
42.2 kΩ  
48.7 kΩ  
56.2 kΩ  
64.9 kΩ  
75 kΩ  
Reserved for test  
–
–
YES  
NO  
NO  
YES  
NO  
NO  
NO  
YES  
NO  
NO  
–
–
YES  
NO  
NO  
NO  
YES  
NO  
NO  
NO  
YES  
NO  
–
–
–
–
–
–
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
ON  
–
BLINK SLOW  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
–
OFF  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
OFF  
ON  
–
OFF  
Generic+ CS100 + CS90 + CS6min  
Generic  
YES  
NO  
YES  
YES  
YES  
NO  
YES  
YES  
YES  
YES  
–
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
2
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
3
Generic + CS100  
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
4
Generic + CS100 + CS90  
Generic+ CS100 + CS6min  
Suggested  
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
5
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
6
86.6 kΩ  
100 kΩ  
115 kΩ  
133 kΩ  
154 kΩ  
178 kΩ  
205 kΩ  
>237 kΩ  
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
7
Suggested + CS100  
Suggested + CS100 + CS90  
Suggested+ CS100 + CS6min  
Suggested+ CS100 + CS90 + CS6min  
Reserved  
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
8
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
9
OFF  
BLINK FAST  
BLINK SLOW  
OFF  
10  
11  
12  
13  
OFF  
BLINK FAST  
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Reserved  
–
–
–
–
–
–
–
–
–
Reserved  
–
–
–
–
–
–
12  
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Thermal Protection  
The bq500210 can provide thermal protection to the transmitter. An external NTC resistor can be placed in the  
most thermally challenged area, which usually is the center of the transmitting coil, and connected between the  
dedicated pin 2 and GND. The threshold on pin 2 is set to 1.00V. The NTC resistor and the resistor from pin 2 to  
VCC create a temperature sensitive divider. The user has full flexibility choosing the NTC resistor and the value of  
the resistor from pin 2 to VCC to set the desired temperature when the system shuts down.  
RTEMP_IN = 2.3 x RNTC(TMAX  
)
(1)  
The system will attempt to restore normal operation after approximately five minutes of being in the suspended  
mode due to tripping the over-temperature threshold, or if the receiver is removed. The bq500210 has a built-in  
thermal sensor that prevents the die temperature from exceeding 135°C. This sensor has ~10°C hysteresis.  
Audible Notification on Power Transfer Begin  
The bq500210 is capable of activating two types of buzzers to indicate that power transfer has begun. Pin 24  
outputs a high logic signal for 0.4s that is suitable to activate DC type buzzers with built in tone generators, or  
other types of sound generators, or custom indication systems. Pin 23 outputs for 0.4 seconds a 4 kHz square  
wave signal suitable for inexpensive AC type ceramic buzzers.  
Power-On Reset  
The bq500210 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the  
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup  
sequence. At the end of the startup sequence, the device begins normal operation.  
External Reset  
The device can be forced into a reset state by an external circuit connected to the RESET pin. A logic low  
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up  
resistor connected to 3.3V is recommended.  
Parasitic Metal Object Detection (PMOD)  
As a safety feature, the bq500210 can be configured to detect the presence of a parasitic metal object placed in  
the vicinity of the magnetic field. The bq500100 uses the Rectified Power Packet information and the measured  
transmitter input-power to calculate parasitic losses in the system. When an excessive power loss is detected,  
the device will blink the red LED to warn about this undesirable condition. If during a twenty second warning time  
the parasitic metal object is not removed, the controller will disable power transfer. After being in halt for five  
minutes, the bq500210 will attempt normal operation. If the object that caused excessive power dissipation is still  
present, the sequence will be repeated over and over again. If the metal object is removed during this twenty  
second warning time, then normal operation will be restored promptly.  
To facilitate the parasitic loss function, the bq500210 monitors the input voltage and the input current supplied to  
the power drive circuit.  
The PMOD_THR pin is used to set the threshold at which the PMOD is activated. The highest bin, the pin is left  
floating, disables the PMOD feature.  
Note: The WPC Specification V1.0 does not define the requirements and thresholds for the PMOD feature.  
Hence, metal object detection may perform differently with different products. Therefore, the threshold setting is  
determined by the user. In most desktop wireless charger applications, a PMOD threshold setting of 0.8W has  
shown to provide acceptable results in stopping power transfer and preventing small metal objects like coins,  
pharmaceutical wraps, etc. from becoming dangerously hot when placed in the path of the wireless power  
transfer. Figure 2 depicts PMOD performance measured on a bq500210 EVM with a bq51013 EVM. The  
parasitic metal loss is emulated by loading the output of the rectifier in the bq51013 EVM.  
ADVANCED CHARGE INDICATION SCHEMES  
The WPC specification provides an End of Power Transfer message (EPT–01) to indicate charge complete.  
Upon receipt of the charge complete message, the bq500210 will change the LED indication as defined by the  
LED_MODE pin (normally solid green LED output), and halt power transfer for 5 minutes.  
In some battery charging applications there is a benefit to continue the charging process in trickle charge mode  
Copyright © 2011, Texas Instruments Incorporated  
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to top off the battery. There are several information packets in the WPC specification related to the levels of  
battery charge – Charge Status. The bq500210 uses these commands in association with some of the LED  
modes described in Table 2 to enable the top-off charging pattern. When CS100 LED mode is enabled, the  
bq500210 will change the LED indication to reflect charge complete when a Charge Status = 100% message is  
received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The  
mobile device can use a CS100 packet to enable trickle charge mode.  
Note that all options related to CS100 have an effect on the LEDs only; they do not have any impact on actual  
power transfer which continues uninterrupted.  
Two more optional modes are available which can be used to change the LED mode back to indicate charging  
after the CS100 has forced the charge complete output:  
•
If CS90 is enabled, a Charge Status message indicating less than 90% charge will force the LED output to  
indicate charging (typically a slow blinking green LED).  
•
When CS6MIN is enabled, and if the bq500210 does not detect another CS100 packet for six minutes, it will  
assume the receiver charge has dropped significantly and will turn on charging status indication.  
APPLICATION INFORMATION  
The application diagram for the transmitter with reduced standby power consumption is shown in Figure 6.  
The standard application diagram for the transmitter is shown in Figure 7.  
Power reduction is achieved by periodically turning off the bq500210 and delegating LED control functions to  
U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is present in the circuit  
(indicated by a pull-up resistor on pin 25), the bq500210 at first power-up boots the MSP430 with the necessary  
code and the two chips operate in tandem. When the bq500210 issues SLEEP command, Q12 pulls the  
TLV70033 ENA pin low, therefore removing power from the bq500210, and the MSP430 maintains the LED  
indication states. The timeout the bq500210 is inhibited is set by the network of R25, C38. Per WPC  
specifications the bq500210 awakes every 0.4s to produce an analog ping and check if there is a device to be  
powered.  
14  
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bq500210  
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SLUSAL8 –JUNE 2011  
3V3_VCC  
VIN  
C21  
0.01uF  
50V  
VIN  
R33  
1R  
Buck Regulator  
VIN  
VCC  
3V3_VCC  
U5  
L1  
330uH  
VIN BOOT  
U2  
R9  
1K0  
1
6
3
ENA is no-connect!  
C23  
0.1uF  
50V  
4
R7  
20m  
ENA  
SS  
PH  
IN  
OUT  
+
-
AGND  
I_SENSE  
U3  
2
5
DC Jack  
19 Vin  
VSEN  
EN  
INA199A2  
C6  
10uF  
50V  
C25  
0.1uF  
50V  
C17  
0.1uF  
50V  
D1  
MBR0540  
C2  
47uF  
6.3V  
C32  
0.1uF  
50V  
R36  
GND COMP  
TPS54231  
GND N/C  
TLV70033  
C8  
0.1uF  
50V  
R1  
309K  
10K0  
R32 1R  
Q3  
BC847CL  
R5  
470R  
AGND  
R37  
AGND  
AGND  
AGND  
AGND  
AGND  
AGND  
AGND  
AGND  
76K8  
R3  
10R  
C15  
47nF  
100V  
C27  
22uF  
25V  
COIL  
6
1
UGATE  
VDD  
Q1  
CSD17313Q2  
C37  
2700pF  
50V  
C28  
0.01uF  
50V  
C29  
0.22uF  
50V  
3
7
4
2
8
5
R4  
PWM  
EN/PG  
GND  
BOOT  
PH  
GREEN  
3K01  
U6  
DPWM-1A  
D2  
LED-0603  
GND  
LGATE  
R25  
280K  
C9  
0.1uF  
50V  
C18  
4.7nF  
50V  
C13  
47nF  
100V  
TPS28225D  
C16  
0.1uF  
50V  
AGND  
AGND  
AGND  
R13  
Q2  
CSD17313Q2  
190K  
R34  
0R  
Q12  
C38  
4.7uF  
10V  
3V3_VCC  
BSS138  
GND  
GND  
GND  
SLEEP  
Power Train  
GND  
R6  
R18  
10K0  
200K  
R14  
AGND  
23K2  
R35  
10R  
3V3_VCC  
3V3_VCC  
3V3_ADC  
COMM+  
COMM-  
D3  
C43  
4.7uF  
10V  
C5  
4.7uF  
10V  
BAT54SW  
R21  
22R  
R30  
10K  
C14  
33pF  
50V  
R31  
10R  
R26  
10K0  
C1  
1.0uF  
16V  
C3  
1.0uF  
16V  
C20  
1.0uF  
16V  
AGND  
AGND  
AGND  
AGND  
AGND  
35  
VCC  
3V3_VCC  
R24  
10R  
41  
48  
V33FB  
REFIN  
BPCAP  
TRST#  
TMS  
TDI  
31  
30  
29  
28  
27  
TRST  
TMS  
TDI  
TDO  
TCK  
5
C11  
C10  
4.7uF  
RESET  
U1  
BQ500210  
TDO  
TCK  
R19  
10K0  
10V  
R16  
10K0  
R12  
4
3
2
1
AIN8  
AIN3  
0.01uF  
50V  
10K0  
NTC Temp Sensor  
20  
19  
11  
10  
PMB_CTRL  
PMB_ALRT  
PMB_DATA  
PMB_CLK  
T_SENSE  
AIN5  
MSP_RST  
MSP_MISO  
MSP_TEST  
MSP_CLK  
R2  
10R  
C24  
4.7nF  
50V  
46  
45  
42  
V_IN  
AIN7  
I_IN  
VIN  
12  
13  
14  
15  
16  
17  
DPWM-1A  
DPWM_A  
DPWM_B  
R10  
15K4  
I_SENSE  
C4  
4.7nF  
50V  
R17  
MSP_SYNC  
DOUT_2B  
DOUT_4A  
DOUT_4B  
MSP_SYNC  
U4  
SLEEP  
MSP_RST  
6
7
8
9
R11  
2K0  
SLEEP  
MSP_RST/LED_A  
10K0  
1
2
3
4
5
6
7
14  
VCC  
P1.0  
P1.1  
P1.2  
P1.3  
GND  
13  
12  
11  
10  
9
MSP_MISO  
MSP_TEST  
MSP_MISO/LED_B  
MSP_TEST  
XIN  
3V3_VCC  
MSP_SYNC  
MSP_MOSI  
MSP_RDY  
AGND  
XOUT  
AGND  
TEST  
RST  
MSP_CLK  
18  
21  
22  
MSP_TCK/CLK  
DOUT_TX  
DRV_CFG  
AGND  
26  
25  
24  
23  
MSP_TDO/PROG  
MSP_MOSI/LPWR_EN  
BUZ_DC  
P1.4  
P1.5  
P1.7  
P1.6  
MSP_RDY  
8
MSP_MOSI  
C12  
1.0uF  
16V  
COMM+  
37  
38  
39  
40  
MSP430G2001  
COMM_A+  
COMM_A-  
COMM_B+  
COMM_B-  
BUZ_AC  
44  
43  
LED_MODE  
PMOD_THR  
COMM-  
R20  
10K0  
AGND  
Low Power Supervisor  
AGND  
R8  
R23  
42K2  
R22  
10K0  
R15  
100K  
R28  
R27  
NoPop  
470R  
470R  
AGND  
D5  
AGND AGND  
AGND  
AGND  
AGND  
AGND  
Figure 6. Typical Application Diagram for Wireless Power Transmitter with Reduced Standby Power  
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3V3_VCC  
VIN  
C21  
0.01uF  
50V  
R33  
1R  
VIN  
VIN  
R9  
1K0  
Buck Regulator  
C26  
3V3_VCC3V3_ADC  
1
3
+
C23  
0.1uF  
50V  
4
R7  
20m  
AGND  
6
0.1uF  
50V  
U5  
I_SENSE  
U3  
5
-
R21  
22R  
L1  
330uH  
VIN BOOT  
INA199A2  
C17  
0.1uF  
50V  
ENA is no-connect!  
R36  
2
ENA  
PH  
309K  
R32 1R  
DC Jack  
19 Vin  
SSVSEN  
C6  
10uF  
50V  
Q3  
BC847CL  
C25  
0.1uF  
50V  
D1  
MBR0540  
AGND  
C2C7  
47uF  
6.3V  
C32  
0.1uF  
50V  
C8  
0.01uF  
50V  
GND COMP  
TPS54231  
4.7uF  
10V  
R1  
R3  
10R  
C15C27  
47nF  
100V  
10K0  
COIL  
22uF  
25V  
6
1
UGATE  
R5  
VDD  
Q1  
CSD17308Q3  
R37  
AGND  
AGNDAGND  
AGNDAGNDAGNDAGNDAGND  
470R  
C29  
0.22uF  
50V  
3
2
BOOT  
76K8  
PWM  
U6  
DPWM-1A  
78  
45  
EN/PGPH  
GND  
C37  
C28  
0.01uF  
50V  
GNDLGATE  
R4  
2700pF  
50V  
GREEN  
3K16  
C9  
0.1uF  
50V  
C18  
4.7nF  
50V  
C13  
47nF  
100V  
TPS28225D  
C16  
0.1uF  
50V  
D2  
LED-0603  
R13  
Q2  
CSD17308Q3  
190K  
R34  
0R  
3V3_VCC  
AGND  
AGND  
AGND  
3V3_VCC  
GNDGND  
GND  
Power Train  
R19  
10K0  
GND  
NTC Temp Sensor  
3V3_VCC  
R6  
3V3_VCC  
3V3_ADC  
200K  
R14  
C43  
4.7uF  
10V  
C5  
4.7uF  
10V  
23K2  
C24  
4.7nF  
50V  
R35  
10R  
COMM+  
D3  
R25  
BAT54SW  
280K  
R30  
10K  
C14  
33pF  
50V  
C1  
1.0uF  
16V  
C3  
1.0uF  
16V  
C20  
1.0uF  
16V  
R31  
10R  
AGND  
AGND  
41  
48  
AGND  
COMM-  
35  
V33FB  
BPCAP  
TRST  
TMS  
TDI  
C38  
4.7uF  
10V  
31  
30  
29  
28  
27  
ADC_REF  
AGND  
AGND  
AGND  
5
RESET  
U1  
TDO  
TCK  
4
3
2
1
AD_8  
AD_3  
20  
19  
11  
10  
PMB_CTRL  
PMB_ALERT  
PMB_DATA  
PMB_CLK  
T_SENSE  
AD_5  
AGND  
R2  
10R  
46  
45  
42  
V_IN  
AD_7  
VIN  
12  
13  
14  
15  
16  
17  
DPWM-1A  
DPWM_1A  
DPWM_1B  
MSP_SYNC  
DOUT_2B  
DOUT_4A  
DOUT_4B  
R10  
15K4  
I_SENSE  
I_SENSE  
C4  
4.7nF  
50V  
R17  
6
7
8
9
R11  
2K0  
SLEEP  
10K0  
MSP_RST  
MSP_MISO  
MSP_TEST  
3V3_VCC  
AGND  
18  
21  
22  
MSP_CLK  
DOUT_TX  
BRD_MODE  
AGND  
26  
25  
24  
23  
MSP_RDY  
MSP_MOSI  
BUZ_DC  
COMM+  
37  
38  
39  
40  
COMM_A+  
COMM_A-  
COMM_B+  
COMM_B-  
BUZ_AC  
44  
43  
LED_MODE  
PMOD_THR  
COMM-  
R20  
10K0  
AGND  
R23  
R22  
R28  
R27  
42K2  
100K  
470R  
470R  
D5  
AGND AGND  
AGND AGND  
AGND  
AGND  
Figure 7. Typical Application Diagram for Wireless Power Transmitter  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
2-Jul-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
BQ500210RGZR  
BQ500210RGZT  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Jun-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
BQ500210RGZR  
BQ500210RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
330.0  
180.0  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
1.5  
1.5  
12.0  
12.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Jun-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
BQ500210RGZR  
BQ500210RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
346.0  
190.5  
346.0  
212.7  
33.0  
31.8  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Medical  
Security  
Logic  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
Power Mgmt  
power.ti.com  
Transportation and  
Automotive  
www.ti.com/automotive  
Microcontrollers  
RFID  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2011, Texas Instruments Incorporated  

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