BQ500211A [TI]

5-V, WPC1.1 Compliant Wireless Power Transmitter Manager; 5 -V ， WPC1.1符合无线电源发送器管理器


型号：	BQ500211A
厂家：	TEXAS INSTRUMENTS
描述：	5-V, WPC1.1 Compliant Wireless Power Transmitter Manager 5 -V ， WPC1.1符合无线电源发送器管理器 PC 无线
文件：	总27页 (文件大小：1010K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

bq500211A

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SLUSBB1 – DECEMBER 2012

5-V, WPC1.1 Compliant Wireless Power Transmitter Manager

Check for Samples: bq500211A

FEATURES

DESCRIPTION

The bq500211A is

a second generation digital

•

Intelligent Control of Wireless Power Transfer

wireless power controller that integrates all functions

required to control wireless power transfer to a single

WPC compliant receiver. It is WPC1.1 compliant and

designed for 5-V systems as either a WPC type A5

transmitter with a magnetic positioning guide or as a

WPC type A11 transmitter without the magnetic

guide. The bq500211A pings the surrounding

environment for WPC compliant devices to be

powered, safely engages the device, receives packet

communication from the powered device and

manages the power transfer. To maximize flexibility in

wireless power applications, Dynamic Power

Limiting™ (DPL) is featured on the bq500211A. DPL

enhances user experience by seamlessly optimizing

the usage of power available from limited input

supplies. The bq500211A supports both Foreign

Object Detection (FOD) and Parasitic Metal Object

Detection (PMOD) by continuously monitoring the

efficiency of the established power transfer,

protecting from power lost due to metal objects

misplaced in the wireless power transfer bath. Should

any abnormal condition develop during power

transfer, the bq500211A handles it and provides

indicator outputs. Comprehensive status and fault

monitoring features enable a robust system design.

5-V Operation Conforms to Wireless Power

Consortium (WPC) Type A5 and Type A11

Transmitter Specifications

•

WPC1.1 Compliant, Including Foreign Object

Detection (FOD)

Enhanced Parasitic Metal Detection (PMOD)

Assures Safety

Dynamic Power Limiting™ for USB and

Limited Source Operation

•

Digital Demodulation Reduces Components

LED Indication of Charging State and Fault

Status

APPLICATIONS

•

WPC 1.1 Compliant Wireless Chargers For:

–

Qi-Certified Smart Phones and other

Handhelds

–

Hermetically Sealed Devices and Tools

Cars and Other Vehicles

Tabletop Charge Surfaces

•

See www.ti.com/wirelesspower for More

Information on TI's Wireless Charging

Solutions

The bq500211A is available in a 48-pin, 7 mm x 7

mm QFN package and operates over a temperature

range from –40°C to 110°C.

Functional Diagram and Efficiency Versus System Output Power

Transmitter

Receiver

Power

Stage

Voltage

Conditioning

AC-DC

Rectification

Load

Communication

BQ500211 A

Controller

Feedback

bq51013

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

Output Power (W)

G000

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Dynamic Power Limiting is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

bq500211A

SLUSBB1 – DECEMBER 2012

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION⁽¹⁾

OPERATING

TEMPERATURE

RANGE, T_A

TOP SIDE

MARKING

ORDERABLE PART NUMBER

PIN COUNT

SUPPLY

PACKAGE

bq500211ARGZR

bq500211ARGZT

48 pin

Reel of 2500

Reel of 250

QFN

bq500211A

-40°C to 110°C

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

–0.3

–40

MAX

3.6

Voltage applied at V33D to GND

Voltage applied at V33A to GND

3.6

(2)

Voltage applied to any pin

3.6

Storage temperature,T_STG

150

°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages referenced to GND.

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SLUSBB1 – DECEMBER 2012

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN TYP MAX UNIT

Supply voltage during operation, V33D, V33A

Operating free-air temperature range

Junction temperature

3.0

3.3

3.6

110

T_A

T_J

–40

°C

THERMAL INFORMATION

bq500211A

RGZ

48 PINS

28.4

THERMAL METRIC⁽¹⁾

UNITS

θ_JA

Junction-to-ambient thermal resistance⁽²⁾

Junction-to-case (top) thermal resistance⁽³⁾

Junction-to-board thermal resistance⁽⁴⁾

Junction-to-top characterization parameter⁽⁵⁾

Junction-to-board characterization parameter⁽⁶⁾

Junction-to-case (bottom) thermal resistance⁽⁷⁾

θ_JCtop

θ_JB

14.2

5.4

°C/W

ψ_JT

0.2

ψ_JB

5.3

θ_JCbot

1.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

(6) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

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ELECTRICAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENT

I_V33A

V33A = 3.3 V

I_V33D

Supply current

V33D = 3.3 V

I_TOTAL

V33D = V33A = 3.3 V

INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS

V33

3.3-V linear regulator

Emitter of NPN transistor

3.25

3.3

3.6

4.6

V33FB

I_V33FB

Beta

3.3-V linear regulator feedback

Series pass base drive

Series NPN pass device

V_IN= 12 V; current into V33FB pin

EXTERNALLY SUPPLIED 3.3 V POWER

V33D

V33A

Digital 3.3-V power

Analog 3.3-V power

T_A= 25°C

3.6

V33 slew rate between 2.3 V and 2.9 V,

V33A = V33D

V33Slew

V33 slew rate

0.25

V/ms

DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_B-

V_CM

Common mode voltage each pin

–0.15

1.631

COMM+,

COMM-

Modulation voltage digital resolution

R_EA

Input impedance

Ground reference

0.5

–5

1.5

MΩ

I_OFFSET

Input offset current

1-kΩ source impedance

µA

ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE

V_{ADDR_OPEN}

V_{ADDR_SHORT}

V_{ADC_RANGE}

INL

Voltage indicating open pin

Voltage indicating pin shorted to GND

Measurement range for voltage monitoring

ADC integral nonlinearity

Input leakage current

LED_MODE open

2.37

LED_MODE shorted to ground

ALL ANALOG INPUTS

0.36

2.5

-2.5

2.5

I_lkg

3 V applied to pin

Ground reference

100

R_IN

Input impedance

MΩ

C_IN

Input capacitance

DIGITAL INPUTS/OUTPUTS

DGND1

+ 0.25

V_OL

V_OH

Low-level output voltage

I_OL= 6 mA , V33D = 3 V

I_OH= -6 mA , V33D = 3 V

V33D

- 0.6V

High-level output voltage

V_IH

High-level input voltage

Low-level input voltage

Output high source current

Output low sink current

V33D = 3V

2.1

3.6

1.4

V_IL

V33D = 3.5 V

I_OH(MAX)

I_OL(MAX)

SYSTEM PERFORMANCE

V_RESET

t_RESET

f_SW

Voltage where device comes out of reset

V33D Pin

2.3

2.4

Pulse width needed for reset

Switching Frequency

RESET pin

µs

112

205

0.5

kHz

Time to detect presence of device requesting

power

t_detect

t_retention

Retention of configuration parameters

T_J= 25°C

100

Years

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SLUSBB1 – DECEMBER 2012

DEVICE INFORMATION

Functional Block Diagram

MSP430_RST/LED_A

bq500211A

LED Control /

Low Power

MSP430_MISO/LED_B

MSP430_TEST

Supervisor

Interface

COMM_A+ 37

COMM_A- 38

COMM_B+ 39

COMM_B- 40

14 MSP430_SYNC

18 MSP430_CLK

Digital

Demodulation

25 MSP430_MOSI/LPWR_EN

26 MSP430_TDO/PROG

12 DPWM-A

13 DPWM-B

Controller

PWM

V_Sense 46

I_Sense 42

23 BUZ_AC

24 BUZ_DC

12-bit

ADC

Buzzer

Control

T_Sense

LoPWR

Low

Power

Control

LED_MODE 44

11 PMB_DATA

10 PMB_CLK

I²C

TEMP_INT

SLEEP RESET

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RGZ Package

(Top View)

48 47 46 45 44 43 42 41 40 39 38 37

AIN5

T_SENSE

AIN3

GND

BPCAP

V33A

LoPWR

RESET

SLEEP

V33D

GND

RESERVED

bq500211A

MSP_RST/LED_A

MSP_MISO/LED_B

MSP_TEST

RESERVED

PMB_CLK

PMB_DATA

MSP_TDO/PROG

MSP_MOSI/LPWR_EN

DPWM_A

13 14 15 16 17 18 19 20 21 22 23 24

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SLUSBB1 – DECEMBER 2012

PIN FUNCTIONS

NAME

I/O

DESCRIPTION

NO.

This pin can be either connected to GND or left open. Connecting to GND can improve

layout grounding.

AIN3

This pin can be either connected to GND or left open. Connecting to GND can improve

layout grounding.

AIN5

AIN7

This pin can be either connected to GND or left open. Connecting to GND can improve

layout grounding.

BPCAP

—

Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.

AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.

BUZ_AC

DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be

connected to an LED via 470-Ω resistor.

BUZ_DC

COMM_A+

COMM_A-

COMM_B+

COMM_B-

DOUT_RX

DOUT_TX

DOUT_2B

Digital demodulation non-inverting input A, connect parallel to input B+.

Digital demodulation inverting input A, connect parallel to input B-.

Digital demodulation non-inverting input B, connect parallel to input A+.

Digital demodulation inverting input B, connect parallel to input A-.

Leave this pin open.

Optional Logic Output 2B. Leave this pin open.

PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching

deadtimes must be externally generated.

DPWM_A

PWM Output B, controls other half of the full bridge in a phase-shifted full bridge. Switching

deadtimes must be externally generated.

DPWM_B

EPAD

Flood with copper GND plane and stitch vias to PCB internal GND plane.

FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It

controls the FOD threshold resistor read at startup.

FOD

GND

—

GND.

Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and

A=50 gain current sense amplifier.

I_SENSE

LED_MODE

LoPWR

Input to select from 4 LED modes.

Dynamic Power Limiting™ (DPL) control pin. To set power mode to 500 mA, pull to GND.

For full-power operation pull to 3.3-V supply.

LOSS_THR

MSP_CLK

Input to program foreign and parasitic metal object detection threshold

Used for boot loading the MSP430 low power supervisor. If MSP430 is not used, leave this

pin floating.

I/O

MSP – TMS, SPI-MISO, LED-B -- If external MSP430 is not used, connect to an LED via

470-Ω resistor for status indication.

MSP_MISO/LED_B

MSP_RST/LED_A

MSP – Reset, LED-A -- If external MSP430 is not used, connect to an LED via 470-Ω

resistor for status indication.

MSP_SYNC

I/O

MSP SPI_SYNC, if external MSP430 is not used, leave this pin open.

MSP-TDO, MSP430 programmed indication.

MSP_TDO/PROG

MSP_TEST

MSP – Test, If external MSP430 is not used, leave this pin open.

Low standby power supervisor enable. If low power is not needed, connect this to GND.

MSP_MOSI/LPWR_EN

I/O

PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It

controls the PMOD threshold resistor read at startup.

PMOD

PMB_CLK

I/O

10-kΩ pull-up resistor to 3.3-V supply.

PMB_DATA

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PIN FUNCTIONS (continued)

I/O

DESCRIPTION

NO.

NAME

RESERVED

Reserved, leave this pin open.

RESERVED

RESET

Reserved, connect to GND.

External Reference Voltage Input. Connect this input to GND.

Reserved, leave this pin open.

I/O

Reserved, leave this pin open.

Reserved, connect 10-kΩ pull-down resistor to GND.

Reserved, leave this pin open.

Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.

Low-power mode output. Starts low-power ping cycle.

SLEEP

Sensor Input. Device shuts down when below 1 V. If not used, keep above 1 V by

connecting to the 3.3-V supply.

T_SENSE

V_SENSE

V33A

Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to

minimize quiescent current.

—

Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor

and additional bypass capacitors

Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as

possible.

V33D

Typical Characteristics Curves

CSD17308Q2

CSD16301Q2

1.7

1.9

2.1

2.3

2.5

2.7

2.9

3.1

3.3

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9

Output Current (A)

Input Voltage (V)

G000

Figure 1. bq500211A Supply Current vs. VCC Voltage

Figure 2. System Efficiency Using Alternate MOSFETs

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Principles of Operation

Fundamentals

The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary

coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the

secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The

receiver coil and electronics are typically built into a portable device, such as a cell-phone.

When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is

driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power

can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various

familiar closed-loop control schemes.

Wireless Power Consortium (WPC)

The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC

standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard

defines the physical parameters and the communication protocol to be used in wireless power. For more

information, go to www.wirelesspowerconsortium.com.

Power Transfer

Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil

dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.

Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.

The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5

mm (as defined within the WPC Specification) to account for housing and interface surfaces.

Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the

coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to

contain the fields to avoid coupling to other adjacent system components.

Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the

transmitter coils and capacitance are specified and the resonant frequency point is fixed at 100 kHz. Power

transfer is regulated by changing the operating frequency between 112 kHz to 205 kHz. The higher the

frequency, the further from resonance and the lower the power. Duty cycle remains constant at 50% throughout

the power band and is reduced only once 205 kHz is reached.

The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils

to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system

efficiency.

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Communication

Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to

send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to

increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),

sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual

message and a checksum, as defined by the WPC standard.

The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in

the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side

electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500211A

features internal digital demodulation circuitry.

The modulated impedance network on the receiver can either be resistive or capacitive. Figure 3 shows the

resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting

change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two

operating points at the same frequency. Figure 4 shows the capacitive modulation approach, where a capacitor

is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.

Rectifier

Receiver

Capacitor

Amax

Receiver Coil

Modulation

Resitor

Operating state at logic “0”

Operating state at logic “1”

A(0)

A(1)

Comm

Fsw

F, kHz

Figure 3. Receiver Resistive Modulation Circuit

Rectifier

Receiver

Capacitor

Receiver Coil

Amax

Modulation

Capacitors

Operating state at logic “ 0”

Operating state at logic “ 1”

A(0)

A(1)

Comm

Fsw

F, kHz

Fo(1) < Fo(0)

Figure 4. Receiver Capacitive Modulation Circuit

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Application Information

Coils and Matching Capacitors

The coil and matching capacitor selection for the transmitter has been established by WPC standard. This is

fixed and cannot be changed on the transmitter side.

An up to date list of available and compatible A5 and A11 transmitter coils can be found here (Texas Instruments

Literature Number SLUA649):

Capacitor selection is critical to proper system operation. A total capacitance value of 400 nF is required in the

resonant tank. This is the WPC system compatibility requirement, not a guideline, and must be followed.

NOTE

A total capacitance value of 400 nF/50 V (C0G dielectric type or equivalent) is required in

the resonant tank to achieve a 100-kHz resonance frequency.

The capacitors chosen must be rated for at least 50 V and must be of high quality C0G dielectric or equivalent.

These are typically available in a 5% tolerance. The use of X7R types or below is not recommended if WPC

compliance is required because critical WPC certification testing, such as the minimum modulation requirement,

might fail.

A 400-nF capacitor is not a standard value and therefore several must be combined in parallel. The designer can

combine a (4 nF x 100 nF) or a (180 nF + 220 nF) along with other combinations depending on market

availability. All capacitors must be of high quality C0G type or equivalent and not mixed with lesser dielectric

types.

Dynamic Power Limiting™

Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability (such as a

USB port). There are two modes of operation selected via an input pin. In the dynamic mode, when the input

voltage is observed drooping, the output power is limited to reduce the load and provides margin relative to the

supply’s capability. The second mode, or constant current mode, is designed specifically for operation from a

500-mA capable USB port, it restricts the output such that the input current remains below the 500-mA limit.

NOTE

Pin 4 must always be terminated, else erratic behavior may result.

Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is

active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control

Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the WPTX in DPL mode

will respond to this CEP via the normal WPC control loop.

NOTE

Depending on LED_MODE selected, the power limit indication may be either solid amber

(green + red) or solid red.

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Option Select Pin

Two pins (pin 43 and pin 44) on the bq500211A are allocated to program the Loss Threshold and the LED mode

of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting

voltage measured in order to identify the value of the attached programming resistor. The values of the operating

parameters set by these pins are determined using Table 2. For LED_MODE, the selected bin determines the

LED behavior based on Table 1; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal

object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section). Table 1.

bq500411A

LED_MODE

Resistors

LOSS_THR

to set

To 12-bit ADC

options

Figure 5. Option Select Pin Programming

LED Indication Modes

The bq500211A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor

(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune

or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.

The resistor in Figure 5 connected to pin 44 and GND selects the desired LED indication scheme in Table 1.

Table 1. LED Modes

Operational States

LED

DYNAMIC

POWER

LIMITING™

CONTROL

OPTION

SELECTION

RESISTOR

DESCRIPTION

LED

POWER

TRANSFER

CHARGE

COMPLETE

STANDBY

FAULT

LED1, green

LED2, red

LED1, green

LED2, red

LED1, green

LED2, red

LED1, green

LED2, red

LED1, green

LED2, red

< 36.5 kΩ

42.2 kΩ

48.7 kΩ

56.2 kΩ

Reserved, do not use

Off

Blink slow

Off

Blink slow

Off

Choice number 1

Choice number 2

Choice number 3

Off

Blink slow

Off

Blink slow

Off

64.9 kΩ

> 75 kΩ

Choice number 4

Blink slow

Reserved, all LED off

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Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)

The bq500211A is WPC1.1 compliant and supports both enhanced PMOD and the new FOD features by

continuously monitoring the input voltage and current to calculate input power. Combining input power, known

losses, and the value of power reported by the RX device being charged, the bq500211A can estimate how

much power is unaccounted for and presumed lost due to metal objects placed in the wireless power transfer

path. If this unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power

transfer is halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the

receiver being charged.

PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0

Specification. The user has the flexibility to adjust the LOSS_THR resistor to suit the application. Should issues

with compliance or interoperability arise, the PMOD feature can be selectively disabled as explained below.

The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore

more accurate. Where the WPC1.0 specification merely requires the Rectified Power packet, the WPC1.1

specification additionally uses the Received Power packet which more accurately tracks power used by the

receiver.

As the default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting

point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). That value has been

empirically determined using standard WPC disc, ring and foil FOD test objects. Some tuning might be required

in the final system as every system will be different. This tuning is best done by trial and error, use the set

resistor values given in the table to increase or decrease the loss threshold and retry the system with the

standard test objects. The ultimate goal of the FOD feature is safety, to protect misplaced metal objects from

becoming hot. Reducing the loss threshold and making the system too sensitive will lead to false trips and a bad

user experience. Find the balance which best suits the application.

If the application requires disabling one or the other or setting separate PMOD and FOD thresholds, a setting

resistor of appropriate value can be connected directly from the LOSS_THR (pin43) to the FOD (pin16) or PMOD

(pin17) pins, as needed. These pins are then read at power up and the correct respective values are set. To

selectively disable PMOD, for example, only the chosen FOD resistor value would be connected between

LOSS_THR (pin43) and FOD (pin 16) and PMOD (pin17) would left open.

Resistors of 1% tolerance must be used for proper detection of the desired bin.

Table 2. Option Select Bins

LOSS THRESHOLD

BIN NUMBER

RESISTANCE (kΩ)

(mW)

<36.5

42.2

48.7

56.2

64.9

75.0

86.6

100

250

300

350

400

450

500

550

600

115

650

133

700

154

750

800

178

205

850

>237

Feature Disabled

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Shut Down via External Thermal Sensor or Trigger

Typical applications of the bq500211A will not require additional thermal protection. This shutdown feature is

provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V

threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shutdown.

The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is

straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are

connected to the bq500211A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the

system shuts down and a fault is indicated (depending on LED mode chosen).

To implement this feature follow these steps:

1) Consult the NTC datasheet and find the resistence vs temperature curve.

2) Determine the actual temperature where the NTC will be placed by using a thermal probe.

3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.

4) Use the following formula to determine the upper leg resistor (R_Setpoint):

R _Setpoint = 2.3´R _NTC

(1)

The system will restore normal operation after approximately five minutes or if the receiver is removed. If the

feature is not used, this pin must be pulled high.

NOTE

Pin 2 must always be terminated, else erratic behavior may result.

3V3_VCC

Optional

Temperature

R_Setpoint

Sensor

T_SENSE

AGND

Figure 6. Negative Temperature Coefficient (NTC) Application

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Fault Handling and Indication

The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long

the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the

condition or fault.

DURATION

CONDITION

HANDLING

(before retry)

Immediate

5 seconds

Infinite

EPT-00

EPT-01

Unknown

Charge complete

Internal fault

EPT-02

EPT-03

5 minutes

Immediate

Infinite

Over temperature

Over voltage

EPT-04

EPT-05

Over current

EPT-06

Battery failure

Reconfiguration

No response

EPT-07

Not applicable

Immediate

1 minute

EPT-08

OVP (over voltage)

OC (over current)

NTC (external sensor)

5 minutes

10 seconds LED only,

2 seconds LED +

buzzer

PMOD/FOD warning

PMOD/FOD

12 seconds

5 minutes

Power Transfer Start Signal

The bq500211A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms

duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400

ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized

indication scheme. If not used, these pins can be left open.

Power-On Reset

The bq500211A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles

the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.

External Reset, RESET Pin

The bq500211A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low

voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 V_CCwith a 10-kΩ

pull-up resistor.

Trickle Charge and CS100

The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.

Upon receipt of the charge complete message, the bq500211A will change the LED indication to solid green LED

output and halt power transfer for 5 seconds.

In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode

to top off the battery. There are several information packets in the WPC specification related to the levels of

battery charge (Charge Status). The bq500211A uses these commands to enable top-off charging. The

bq500211A changes the LED indication to reflect charge complete when a Charge Status message is 100%

received, but unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The

mobile device can use a CS100 packet to enable trickle charge mode.

If the reported charge status drops below 90% normal, charging indication will be resumed.

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Current Monitoring Requirements

The bq500211A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be

provided in the design.

Current monitoring is optional however, it is used for the foreign metal protection features and over current

protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.

Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This

would enable a forward migration path to future WPC1.1 compatibility.

For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current

shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature

stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.

Over-Current Protection

The bq500211A has an integrated current protection feature which monitors the input current reported by the

current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power

transfer is halted for one minute.

If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE

input pin to the bq500410A (pin 42) should be grounded.

NOTE

Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor

circuit or by connecting to ground.

MSP430G2001 Low Power Supervisor

This is an optional low-power feature. By adding the MSP430G2001, the entire bq500211A is periodically shut

down to conserve power, yet all relevant states are recalled and all running LED status indicators remain on.

MSP430 Low Power Supervisor Details

Since the bq500211A needs an external low-power mode to significantly reduce power consumption, one way of

positively achieving that goal is to remove its supply and completely shut it down. In doing so, however, the

bq500211A goes through a reset and any data in memory would be lost. Important information regarding charge

state, fault condition and operating mode would be cleared. The MSP430G2001 maintains the LED indication

and stores previous charge state during the bq500211A reset period.

The LEDs indicators are now driven by the MSP430G2001, do not exceed the pin output current drive limit.

Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected

making it possible to achieve Energy Star rating.

The user does not need to program the MSP430G2001, an off-the-shelf part and any of the available packages

can be used as long as the connections are correct. The required MSP430G2001 firmware is embedded in the

bq500211A and is boot loaded at first power up, similar to a field update. The MSP430G2001 code cannot be

modified by the user.

NOTE

The user cannot program the MSP430G2001 in this system.

All Unused Pins

All unused pins can be left open unless otherwise indicated. Pins 1, 3, 45 can be tied to GND and flooded with

copper to improve ground shielding. Please refer to the pin definition table for further explanations.

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APPLICATION INFORMATION

Overview

The application schematic for the transmitter with reduced standby power is shown in Figure 7.

CAUTION

Please check the bq500211A product page for the most up-to-date application

schematic and list of materials package before starting a new design.

Input Regulator

The bq500211A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down

from the 5-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with

respect to cost or efficiency.

For highest efficiency use a low-cost buck regulator, TPS62237, which on account of a 3-MHz switching

frequency, can use a 0805 size chip inductor. This results in a very attractive combination, high performance,

small size, ease of use and low cost.

Power Train

The bq500211A drives a phase-shifted full bridge. This is essentially twin half bridges and the choice of driver

devices is quite simple, a pair of TPS28225 synchronous MOSFET drivers are used with four CSD17308Q2

NexFETs. Other combinations work and system performance with regards to efficiency and EMI emissions vary.

Any alternate MOSFETs chosen must be fully saturated at 5-V gate drive and be sure to pay attention whether or

not to use gate resistors; some tuning might be required.

Low Power Supervisor

Power reduction is achieved by periodically disabling the bq500211A while LED and housekeeping control

functions are continued by U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is

present in the circuit (which is set by a pull-up resistor on bq500211A pin 25), the bq500211A at first power-up

boots the MSP430G2001 with the necessary firmware and the two chips operate in tandem. During standby

operation, the bq500211A periodically issues a SLEEP command, Q12 pulls the RESET pin low, therefore

reducing its power consumption. Meanwhile, the MSP430G2001 maintains the LED indication and stores

previous charge state during this bq500211A reset period. This bq500211A reset period is set by the RC time

constant network of R26, C22 (see Figure 7). WPC compliance mandates receive detection within 500 ms, the

power transmitter controller, bq500211A, awakes every 400 ms to produce an analog ping and check if a valid

device is present. Increasing this time constant, therefore is not advised; shortening could result in faster

detection time with some decrease in efficiency.

Disabling Low Power Supervisor Mode

For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for the application

schematic.

NOTE

Current sense shunt and amplifier circuitry are optional. The circuitry is needed to enable

Foreign Object Detection (FOD) and a forward migration path to WPC1.1 compliance.

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PCB Layout

A good PCB layout is critical to proper system operation and due care should be taken. There are many

references on proper PCB layout techniques.

Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be

achieved. A proven and recommended approach to the layer stack-up has been:

•

Layer 1, component placement and as much ground plane as possible.

Layer 2, clean ground.

Layer 3, finish routing.

Layer 4, clean ground.

Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also

provides a noise free voltage reference plane for device operation.

Keep as much copper as possible. Make sure the bq500211A GND pins and the power pad have a continuous

flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also

acts as a heat sink for the bq500211A. A good GND reference is necessary for proper bq500211A operation,

such as analog-digital conversion, clock stability and best overall EMI performance.

Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.

Having several tie points defeats the purpose of separating the grounds.

The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce

stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as

differential routing and shielding, but the COMM signal lines do not need to be impedance matched.

Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To

create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, full-

bridge components should be pulled together as tight as possible. See the bq500211AEVM-045, bqTESLA

Wireless Power TX EVM User's Guide (Texas Instruments Literature Number SLVU536) for layout examples.

References

Building a Wireless Power Transmitter, SLUA635

Technology, Wireless Power Consortium. http://www.wirelesspowerconsortium.com/

An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill.

BQ500210 Datasheet

BQ51013 Datasheet

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Typical Application Diagram

Z U B

D A P E

D N G

9 4

2 3

6 3

7 4

A 3 3 V

D 3 3 V

4 3

3 3

N I

C T N

Figure 7. bq500211A Typical Low-Standby Power Application Diagram

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D A P E

D N G

9 4

2 3

6 3

7 4

A 3 3 V

D 3 3 V

4 3

3 3

N I

Figure 8. bq500211A Typical Low-Cost Application Diagram

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PACKAGE OPTION ADDENDUM

www.ti.com

21-Dec-2012

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Samples

Drawing

(1)

(2)

(3)

(Requires Login)

BQ500211ARGZR

ACTIVE

VQFN

RGZ

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

BQ500211ARGZT

ACTIVE

RGZ

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jan-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

BQ500211ARGZR

BQ500211ARGZT

VQFN

RGZ

2500

250

330.0

180.0

16.4

7.3

1.5

12.0

16.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jan-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

BQ500211ARGZR

BQ500211ARGZT

VQFN

RGZ

2500

250

367.0

210.0

367.0

185.0

38.0

35.0

Pack Materials-Page 2

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