BQ500412RGZR [TI]

Low System Cost, Wireless Power Controller for WPC TX A6; 低系统成本，无线电源控制器，用于WPC TX A6


型号：	BQ500412RGZR
厂家：	TEXAS INSTRUMENTS
描述：	Low System Cost, Wireless Power Controller for WPC TX A6 低系统成本，无线电源控制器，用于WPC TX A6 控制器 PC 无线
文件：	总28页 (文件大小：922K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

bq500412

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SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

Low System Cost, Wireless Power Controller for WPC TX A6

Check for Samples: bq500412

FEATURES

DESCRIPTION

The bq500412 is a Qi-certified value solution that

integrates all functions required to control wireless

•

Proven, Qi-Certified WPC1.1 Solution for

Transmit-Side Application (suitable for 1, 2 or

3 coil configurations)

power delivery to

a single WPC1.1 compliant

receiver. It is WPC1.1 compliant and designed for 12-

V systems, or 5-V systems with an optional boost

converter, as a wireless power consortium type A6

free positioning transmitter. The bq500412 pings the

surrounding environment for WPC compliant devices

to be powered, safely engages the device, receives

packet communication from the powered device and

manages the power transfer according to WPC1.1

specification. To maximize flexibility in wireless power

control applications, Dynamic Power Limiting™ (DPL)

is featured on the bq500412 when used with an

optional boost converter from a 5-V input. Dynamic

Power Limiting™ enhances user experience by

seamlessly optimizing the usage of power available

from limited input supplies. The bq500412 supports

both Foreign Object Detection (FOD) and enhanced

Parasitic Metal Object Detection (PMOD) for legacy

product by continuously monitoring the efficiency of

the established power transfer, protecting from power

lost due to metal objects misplaced in the wireless

power transfer field. Should an abnormal operating

condition develop during power transfer, the

bq500412 handles it and provides indicator outputs.

Comprehensive status and fault monitoring features

enable a low cost yet robust, Qi-certified wireless

power system design.

•

Lowest Device Count for Full WPC1.1 12-V A6

Solution (single driver stage for all coils)

New Standby Scheme Reduces Standby and

Sleep Power Without Need for Extra

Supervisor Circuit

•

Improved FOD Calibration Scheme Simplifies

Certification and Increases Accuracy at Higher

Power (customer configurable)

Dynamic Power Limiting™ for USB and

Limited Power Source Operation When Used

With 5-V Input

•

Digital Demodulation Removes Need for

External Filter Circuitry

10 Configurable LED modes Indicate Charging

State and Fault Status

APPLICATIONS

•

Wireless Power Consortium (WPC1.1)

Compliant Wireless Chargers For:

–

Qi-Certified Smart Phones and Other

Handhelds

–

Car and Other Vehicle Accessories

The bq500412 is available in a 48-pin, 7-mm x 7-mm

QFN package.

•

See www.ti.com/wirelesspower for More

Information on TI's Wireless Charging

Solutions

System Diagram and Efficiency Versus System Output Power

12 V Input

3.3 VDC

Regulator

Current

Sense

WPC A6 Coil

Assembly

Half-

Bridge

Stage

BQ500412

COMM

Signal

Coil Select

0.5

1.5

2.5

3.5

4.5

Power (W)

C001

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Dynamic Power Limiting is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

bq500412

SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION⁽¹⁾

OPERATING

TEMPERATURE

RANGE, T_A

TOP SIDE

MARKING

ORDERABLE PART NUMBER

PIN COUNT

SUPPLY

PACKAGE

BQ500412RGZR

BQ500412RGZT

48 pin

Reel of 2500

Reel of 250

QFN

BQ500412

-40°C to 110°C

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

VALUE

UNIT

MIN

–0.3

–40

MAX

3.6

Voltage applied at V33D to GND

Voltage applied at V33A to GND

3.6

(2)

Voltage applied to any pin

3.6

Storage temperature,T_STG

150

°C

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages referenced to GND.

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RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN TYP MAX UNIT

Supply voltage during operation, V33D, V33A

Operating free-air temperature range

Junction temperature

3.0

3.3

3.6

110

T_A

T_J

–40

°C

THERMAL INFORMATION

bq500412

RGZ

48 PINS

28.4

THERMAL METRIC⁽¹⁾

UNITS

θ_JA

Junction-to-ambient thermal resistance⁽²⁾

Junction-to-case (top) thermal resistance⁽³⁾

Junction-to-board thermal resistance⁽⁴⁾

Junction-to-top characterization parameter⁽⁵⁾

Junction-to-board characterization parameter⁽⁶⁾

Junction-to-case (bottom) thermal resistance⁽⁷⁾

θ_JCtop

θ_JB

14.2

5.4

°C/W

ψ_JT

0.2

ψ_JB

5.3

θ_JCbot

1.4

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

(6) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Spacer

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ELECTRICAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENT

I_V33A

V33A = 3.3 V

I_V33D

Supply current

V33D = 3.3 V

I_TOTAL

V33D = V33A = 3.3 V

INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS

V33

3.3-V linear regulator

Emitter of NPN transistor

3.25

3.3

3.6

4.6

V33FB

I_V33FB

Beta

3.3-V linear regulator feedback

Series pass base drive

Series NPN pass device

V_IN= 12 V; current into V33FB pin

EXTERNALLY SUPPLIED 3.3 V POWER

V33D

V33A

Digital 3.3-V power

Analog 3.3-V power

T_A= 25°C

3.6

V33 slew rate between 2.3 V and 2.9 V,

V33A = V33D

V33Slew

V33 slew rate

0.25

V/ms

DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_B-

V_bias

COMM+ Bias Voltage

1.0

COMM+,

COMM-

Modulation voltage digital resolution

R_EA

Input impedance

Ground reference

0.5

–5

1.5

MΩ

I_OFFSET

Input offset current

1-kΩ source impedance

µA

ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR, SNOOZE_CAP, PWR_UP

V_{ADDR_OPEN}

V_{ADDR_SHORT}

V_{ADC_RANGE}

INL

Voltage indicating open pin

Voltage indicating pin shorted to GND

Measurement range for voltage monitoring

ADC integral nonlinearity

LED_MODE open

2.37

LED_MODE shorted to ground

ALL ANALOG INPUTS

0.36

2.5

-2.5

2.5

MΩ

R_IN

Input impedance

Ground reference

C_IN

Input capacitance

DIGITAL INPUTS/OUTPUTS

DGND1

+ 0.25

V_OL

V_OH

Low-level output voltage

I_OL= 6 mA , V33D = 3 V

I_OH= -6 mA , V33D = 3 V

V33D

- 0.6V

High-level output voltage

V_IH

High-level input voltage

Low-level input voltage

Output high source current

Output low sink current

V33D = 3V

2.1

3.6

1.4

V_IL

V33D = 3.5 V

I_OH(MAX)

I_OL(MAX)

SYSTEM PERFORMANCE

V_RESET

t_RESET

f_SW

Voltage where device comes out of reset

V33D Pin

2.4

Pulse width needed for reset

Switching Frequency

RESET pin

µs

112

205

kHz

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DEVICE INFORMATION

Functional Block Diagram

PMOD

LED_A

LED_B

SLEEP

bq500412

LED Control /

Low Power

Interface

COMM_A+ 37

COMM_A- 38

COMM_B+ 39

COMM_B- 40

22 FOD_CAL

25 LED_C

18 SNOOZE

13 FOD

Digital

Demodulation

12 PWM-A

15 COIL_1

16 COIL_2

17 COIL_3

Controller

PWM

COIL_PEAK

V_SENSE 45

I_SENSE 42

12-bit

ADC

23 BUZ_AC

24 BUZ_DC

Buzzer

Control

T_SENSE

LOSS_THR 43

LED_MODE 44

POR

11 DATA

10 CLK

I²C

SNOOZE_CAP

RESET

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RGZ Package

(Top View)

48 47 46 45 44 43 42 41 40 39 38 37

COIL_PEAK

T_SENSE

GND

BPCAP

V33A

SNOOZE_CAP

PWR_UP

V33D

GND

RESET

PMOD

bq500412

LED_A

LED_B

SLEEP

CLK

RESERVED

LED_C

DATA

PWM_A

13 14 15 16 17 18 19 20 21 22 23 24

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SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

PIN FUNCTIONS

NAME

I/O

DESCRIPTION

NO.

COIL_PEAK

Connected to peak detect circuit. Protects from coil overvoltage event.

Sensor Input. Device shuts down when below 1 V for longer than 150ms. If not used, keep

above 1 V by connecting to the 3.3-V supply.

T_SENSE

SNOOZE_CAP

PWR_UP

RESET

PMOD

Connected to interval timing capacitor

First power-up indicator

Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.

Select for PMOD threshold

LED_A

Connect to an LED via 470-Ω resistor for status indication. Typically GREEN

Connect to an LED via 470-Ω resistor for status indication. Typically RED

Force SLEEP (5 sec low power)

LED_B

SLEEP

CLK

I/O

10-kΩ pull-up resistor to 3.3-V supply. Please contact field for GUI application assitance.

DATA

PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching

deadtimes must be externally generated.

PWM_A

FOD

Select for FOD threshold

RESERVED

COIL_1

Reserved. Leave open.

Select first coil

COIL_2

Select second coil

COIL_3

Select third coil

SNOOZE

RESERVED

SNOOZE_CHG

FOD_CAL

BUZ_AC

Force SNOOZE (500ms low power)

Reserved, leave this pin open.

Reserved, connect to GND.

Charge the snooze cap

Select for FOD calibration resistor

AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.

DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be

connected to an LED via 470-Ω resistor.

BUZ_DC

LED_C

I/O

Connect to an LED via 470-Ω resistor for status indication. Typically YELLOW

Reserved, connect to GND.

RESERVED

GND

Reserved, leave this pin open.

Reserved, connect to GND.

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PIN FUNCTIONS (continued)

NAME

I/O

DESCRIPTION

NO.

GND

—

GND.

Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as

possible.

V33D

—

Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor

and additional bypass capacitors

V33A

BPCAP

GND

—

Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.

GND.

COMM_A+

COMM_A-

COMM_B+

COMM_B-

RESERVED

Digital demodulation non-inverting input A, connect parallel to input B+.

Digital demodulation inverting input A, connect parallel to input B-.

Digital demodulation non-inverting input B, connect parallel to input A+.

Digital demodulation inverting input B, connect parallel to input A-.

Reserved, leave this pin open.

Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and

A=50 gain current sense amplifier.

I_SENSE

LOSS_THR

LED_MODE

Input to program FOD/PMOD thresholds and FOD_CAL correction.

Input to select from four LED modes.

Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to

minimize quiescent current.

V_SENSE

V_IN

System input voltage, used for DPL. Use 76.8-kΩ to 10-kΩ divider to minimize quiescent

current.

GND

—

GND.

ADCREF

EPAD

External Reference Voltage Input. Connect this input to GND.

Flood with copper GND plane and stitch vias to PCB internal GND plane.

—

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Principles of Operation

Fundamentals

The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary

coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the

secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The

receiver coil and electronics are typically built into a portable device, such as a cell-phone.

When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is

driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power

can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various

familiar closed-loop control schemes.

Wireless Power Consortium (WPC)

The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC

standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard

defines the physical parameters and the communication protocol to be used in wireless power. For more

information, go to www.wirelesspowerconsortium.com.

Power Transfer

Power transfer depends on coil coupling. Coupling is dependent on the distance between coils, alignment, coil

dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.

Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.

The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5

mm (as defined within the WPC Specification) to account for housing and interface surfaces.

Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the

coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to

contain the fields to avoid coupling to other adjacent system components.

Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the

transmitter coils and capacitance are specified and the resonant frequency point is fixed. Power transfer is

regulated by changing the operating frequency between 120 kHz to 205 kHz. The higher the frequency, the

further from resonance and the lower the power. Duty cycle remains constant at 50% throughout the power band

and is reduced only once 205 kHz is reached.

The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils

to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system

efficiency.

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Communication

Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to

send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to

increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),

sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual

message and a checksum, as defined by the WPC standard.

The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in

the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side

electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500412

features internal digital demodulation circuitry.

The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the

resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting

change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two

operating points at the same frequency. Figure 2 shows the capacitive modulation approach, where a capacitor

is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.

Rectifier

Receiver

Capacitor

Amax

Receiver Coil

Modulation

Resitor

Operating state at logic “0”

Operating state at logic “1”

A(0)

A(1)

Comm

Fsw

F, kHz

Figure 1. Receiver Resistive Modulation Circuit

Rectifier

Receiver

Capacitor

Receiver Coil

Amax

Modulation

Capacitors

Operating state at logic “ 0”

Operating state at logic “ 1”

A(0)

A(1)

Comm

Fsw

F, kHz

Fo(1) < Fo(0)

Figure 2. Receiver Capacitive Modulation Circuit

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Application Information

Coils and Matching Capacitors

The coil and matching capacitor selection for the transmitter has been established by WPC standard. These

values are fixed and cannot be changed on the transmitter side.

An up to date list of available and compatible A6 transmitter coils can be found here (Texas Instruments

Literature Number SLUA649):

Capacitor selection is critical to proper system operation. The total capacitance value of 147nF is required in the

center coil of the resonant tank. This capacitance is not a standard value and therefore several must be

combined in parallel. It is recommended to use 100nF + 47nF, as these are very commonly available.

NOTE

A total capacitance value of 147nF/100 V/C0G is required in the center coil and

133nF/100V/C0G in the side coils of the resonant tank to achieve the desired resonance

frequency.

The capacitors chosen must be rated for 100 V operation. Use quality C0G type dielectric capacitors from

reputable vendors such as KEMET, MURATA or TDK.

Dynamic Power Limiting™

With an optional 5-V to 12-V boost converter, a 5-V input can enable a 12-V WPC A6 transmitter. The Dynamic

Power Limiting™ (DPL) feature allows operation from a 5-V supply with limited current capability (such as a USB

port). When the 5-V input voltage is observed drooping, the output power is dynamically limited to reduce the

load and provides margin relative to the supply’s capability.

Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is

active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control

Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the transmitter in DPL

mode will respond to this CEP via the normal WPC control loop.

NOTE

The power limit indication depends on the LED_MODE selected.

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Option Select Pins

Several pins on the bq500412 are allocated to programming the FOD and PMOD Loss Threshold and the LED

mode of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting

voltage measured in order to identify the value of the attached programming resistor. FOD, PMOD and

FOD_CAL pin values are enabled and read sequentially from the same LOSS_THR bias current. The values of

the operating parameters set by these pins are determined using Table 2. For LED_MODE, the selected bin

determines the LED behavior based on Table 1; for the LOSS_THR, the selected bin sets a threshold used for

parasitic metal object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD)

section). Table 1.

bq500412

LED_MODE

Resistors

to set

options

LOSS_THR

To 12-bit ADC

FOD

PMOD FOD_CAL

Figure 3. Option Select Pin Programming

LED Indication Modes

The bq500412 can directly drive up to three (3) LED outputs (pin 7, pin 8 and pin 25) through a simple current

limit resistor (typically 470 Ω), based on the mode selected. The current limit resistors can be individually

adjusted to tune or match the brightness of the LEDs. Do not exceed the maximum output current rating of the

device. The resistor in Figure 3 connected to pin 44 and GND selects the desired LED indication scheme in

Table 1.

•

LED modes permit the use of one to three indicator LED's. Amber in the 2-LED mode is obtained by turning

on both the green and red.

LEDs can be turned on solid or configured to blink either slow (approx. 1.6s period) or fast (approx. 400ms

period).

Except in modes 2 and 9, the charge complete state is only maintained for 5 seconds after which it reverts to

idle. This permits the processor to sleep in order to reduce standby power consumption. In other modes,

external logic, such as a flip-flop, may be implemented to maintain the charge complete indication if desired.

•

LED modes 5 and 8 will display a sequence of red-amber-green, for 0.5 seconds when the device is first

powered up.

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Table 1. LED Modes

OPERATIONAL STATES

LED

CONTROL

OPTION

LED

SELECTION

RESISTOR

DYNAMIC

CHARGE

DESCRIPTION

LED

POWER

STANDBY

FAULT

POWER

LIMITING™

FOD Warning

TRANSFER

COMPLETE

LED1, green

LED2, red

< 36.5 kΩ

42.2 kΩ

48.7 kΩ

56.2 kΩ

64.9 kΩ

75 kΩ

Reserved, do not use

Choice number 1

Choice number 2

Choice number 3

Choice number 4

Choice number 5

Choice number 6

Choice number 7

Choice number 8

Choice number 9

Choice number 10

LED3, amber

LED1, green

LED2, red

Off

Blink slow

Off

Blink slow

Off

Blink slow

Blink fast

LED3, amber

LED1, green

LED2, red

Blink slow

Off

Blink slow

Off

Blink slow

Blink fast

LED3, amber

LED1, green

LED2, red

Off

Blink fast

LED3, amber

LED1, green

LED2, red

Off

Blink slow

Blink fast

LED3, amber

LED1, green

LED2, red

Off

LED3, amber

LED1, green

LED2, red

Off

Blink slow

Off

Blink slow

Off

86.6 kΩ

100 kΩ

115 kΩ

133 kΩ

154 kΩ

Off

Blink fast

LED3, amber

LED1, green

LED2, red

Off

Blink Slow

Off

Blink slow

Off

LED3, amber

LED1, green

LED2, red

Off

Blink slow

Blink fast

Off

Blink slow

Off

Blink slow

LED3, amber

LED1, green

LED2, red

Off

Blink slow

Off

Blink slow

Off

Blink slow

Blink fast

LED3, amber

LED1, green

LED2, red

Off

Blink fast

Blink slow

Off

LED3, amber

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Parasitic Metal Object Detect (PMOD), Foreign Object Detection (FOD) and FOD Calibration

The bq500412 supports improved FOD (WPC1.1) and enhanced PMOD (WPC 1.0) features. Continuously

monitoring input power, known losses, and the value of power reported by the RX device being charged, the

bq500412 can estimate how much power is unaccounted for and presumed lost due to metal objects placed in

the wireless power transfer path. If this unexpected loss exceeds the threshold set by the FOD or PMOD

resistors, a fault is indicated and power transfer is halted. Whether the FOD or the PMOD algorithm is used is

determined by the ID packet of the receiver being charged.

As the default, both PMOD and FOD resistors should set a threshold of 400 mW (selected by 56.2-kΩ resistors

from FOD (pin 13) and PMOD(pin 6) to LOSS_THR (pin43)). 400 mW has been empirically determined using

standard WPC FOD test objects (disc, ring and foil). Some tuning might be required as every system will be

slightly different. The ultimate goal of the FOD feature is safety; to protect misplaced metal objects from

becoming hot. Reducing the loss threshold and making the system too sensitive will lead to false trips and a bad

user experience. Find the balance which best suits the application.

If the application requires disabling one function or the other (or both), it is possible by leaving the respective

FOD/PMOD pin open. For example, to selectively disable the PMOD function, PMOD (pin16) should be left open.

NOTE

Disabling FOD results in a TX solution that is not WPC compliant.

Resistors of 1% tolerance should be used for a reliable selection of the desired threshold.

The FOD and PMOD resistors (pin 13 and pin 6) program the permitted power loss for the FOD and PMOD

algorithms respectively. The FOD_CAL resistor (pin 22), can be used to compensate for any load dependent

effect on the power loss. Using a calibrated test receiver with no foreign objects present, the FOD_CAL resistor

should be selected such that the calculated loss across the load range is substantially constant (within ~100

mW). After correcting for the load dependence, the FOD and PMOD thresholds should be re-set above the

resulting average by approximately 400 mW in order for the transmitter to satisfy the WPC requirements on

tolerated heating.

Please contact TI for more information about setting appropriate FOD, PMOD, and FOD_CAL resistor values for

your design.

Table 2. Option Select Bins

LOSS THRESHOLD

BIN NUMBER

RESISTANCE (kΩ)

(mW)

<36.5

42.2

48.7

56.2

64.9

75.0

86.6

100

250

300

350

400

450

500

550

600

115

650

133

700

154

750

800

178

205

850

>237

Feature Disabled

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SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

Shut Down via External Thermal Sensor or Trigger

Typical applications of the bq500412 will not require additional thermal protection. This shutdown feature is

provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V

threshold on pin 2. Voltage below 1.0 V on pin 2 for longer than 150ms causes the device to shutdown.

The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is

straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are

connected to the bq500412 device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the

system shuts down and a fault is indicated (depending on LED mode chosen).

To implement this feature follow these steps:

1) Consult the NTC datasheet and find the resistence vs temperature curve.

2) Determine the actual temperature where the NTC will be placed by using a thermal probe.

3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.

4) Use the following formula to determine the upper leg resistor (R_Setpoint):

R _Setpoint = 2.3´R _NTC

(1)

The system will restore normal operation after approximately five minutes or if the receiver is removed. If the

feature is not used, this pin must be pulled high.

NOTE

Pin 2 must always be terminated, else erratic behavior may result.

3V3_VCC

Optional

Temperature

R_Setpoint

Sensor

T_SENSE

AGND

Figure 4. Negative Temperature Coefficient (NTC) Application

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Fault Handling and Indication

The following table provides approximate durations for the time before a retry is attempted for End Power

Transfer (EPT) packets and fault events. Precise timing may be affected by external components, or may be

shortened by receiver removal. The LED mode selected determines how the LED indicates the condition or fault.

DURATION

(before retry)

CONDITION

HANDLING

EPT-00

EPT-01

Immediate

Unknown

Charge complete

Internal fault

temperature

voltage

5 seconds

EPT-02

5 seconds

EPT-03

5 minutes

EPT-04

Immediate Over

5 seconds

EPT-05

current

EPT-06

failure

EPT-07

Not applicable

Immediate

Reconfiguration

No response

EPT-08

OC (over current)

NTC (external sensor)

1 minute

5 minutes

10 seconds LED only,

2 seconds LED +

buzzer

PMOD/FOD warning

PMOD/FOD

12 seconds

5 minutes

Power Transfer Start Signal

The bq500412 features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms

duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400

ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized

indication scheme. If not used, these pins can be left open.

Power-On Reset

The bq500412 has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles

the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.

External Reset, RESET Pin

The bq500412 can be forced into a reset state by an external circuit connected to the RESET pin. A logic low

voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 V_CCwith a 10-kΩ

pull-up resistor.

Low Power Mode, SNOOZE

During standby, when nothing is on the transmitter pad, the bq500412 pings the surrounding environment at

fixed intervals. The ping interval can be adjusted; the component values selected for the SNOOZE circuit

determine this interval between pings. Time for SNOOZE is set by an RC time constant controlling the Enable of

a 3.3V LDO. The LDO will remove 3.3V from the bq500412 to reduce power. The choice of the ping interval

effects two quantities: the idle efficiency of the system, and the time required to detect the presence of a receiver

when it is placed on the pad. A trade off should be made which balances low power (longest ping interval) with

good user experience (quick detection through short ping interval) while still meeting the WPC requirement for

detection within 0.5 seconds. Typical RC time constant values for the SNOOZE circuit are 392k ohms and 4.7uF.

The value can be adjusted to increase or decrease the ping interval.

The system power consumption is approximately 300 mW during an active ping of all three coils, which lasts

approximately 210 ms, and 40 mW for the balance of the cycle. A weighted average can thus be used to

estimate the overall system’s idle consumption:

If T_ping is the interval between pings in ms, P_idle in mW is approximately:

(40 x (T_ping – 210) + 300 x 210)/T_ping

(2)

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SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

Trickle Charge and CS100

The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.

Upon receipt of the charge complete message, the bq500412 will change the LED indication. The exact

indication depends on the LED_MODE chosen.

In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode

to top off the battery. There are several information packets in the WPC specification related to the levels of

battery charge (Charge Status). The bq500412 uses these commands to enable top-off charging. The bq500412

changes the LED indication to reflect charge complete when a Charge Status message is 100% received, but

unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The mobile device can

use a CS100 packet to enable trickle charge mode.

If the reported charge status drops below 90% normal, charging indication will be resumed.

Current Monitoring Requirements

The bq500412 is WPC1.1 ready. In order to enable the FOD or PMOD features, current monitoring circuitry must

be provided in the application design.

For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current

shunt amplifier should have a gain of 50, such as the INA199A1. For FOD accuracy, the current sense resistor

must be a quality component with 1% tolerance, at least 1/4-Watt rating, and a temperature stability of ±200

PPM. Proper current sensing techniques in the application hardware should also be observed.

If WPC compliance is not required current monitoring can be omitted. Connect the I_SENSE pin (pin 42) to GND.

All Unused Pins

All unused pins can be left open unless otherwise indicated. Pin 4 can be tied to GND and flooded with copper to

improve ground shielding. Please refer to the pin definition table for further explanations.

Design Checklist for WPC1.1 Compliance with the bq500412

•

Coil and capacitor selection matches the A6 specification.

Total 147-nF center and 133-nF side coil resonant capacitor requirement is met.

Precision current sense amp used, such as the INA199A1. This is required for accurate FOD operation.

Current shunt resistor 1% and <200 PPM. This is required for accurate FOD operation.

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APPLICATION INFORMATION

Overview

The application block diagram for the transmitter with reduced standby power is shown in Figure 5. Below are

some notes on parts selection.

CAUTION

Please check the bq500412 product page for the most up-to-date application

schematic and list of materials package before starting a new design.

12V Input

INA199A1

TPS54231

Current Shunt

Buck Reg

Monitor

Cap/Tank/FET x3

Bq500410

bq500412

WPC Qi Controller

CSD97376

PowerBlock

Tank /Coil

Assembly

PWM

LED

SN3157

Analog Switch

FEEDBACK

Figure 5. bq500412 System Diagram

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SLUSBO2A –NOVEMBER 2013–REVISED DECEMBER 2013

Input Regulator

The bq500412 requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down from

the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with

respect to cost versus efficiency. A buck regulator will offer higher efficiency and although slightly higher cost,it is

typically the better choice.

Power Train

The bq500412 drives three half bridges and only one of these bridges is activated at a time.

PCB Layout

A good PCB layout is critical to proper system operation and due care should be taken. There are many

references on proper PCB layout techniques.

Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be

achieved. A proven and recommended approach to the layer stack-up has been:

•

Layer 1, component placement and as much ground plane as possible.

Layer 2, clean ground.

Layer 3, finish routing.

Layer 4, clean ground.

Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also

provides a noise free voltage reference plane for device operation.

Keep as much copper as possible. Make sure the bq500412 GND pins and the power pad have a continuous

flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also

acts as a heat sink for the bq500412. A good GND reference is necessary for proper bq500412 operation, such

as analog-digital conversion, clock stability and best overall EMI performance.

Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.

Having several tie points defeats the purpose of separating the grounds.

The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce

stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as

differential routing and shielding, but the COMM signal lines do not need to be impedance matched.

Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To

create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, full-

bridge components should be pulled together as tight as possible. See the bq500412EVM-550, bqTESLA

Wireless Power TX EVM User's Guide (Texas Instruments Literature Number SLVU536) for layout examples.

References

1. Building a Wireless Power Transmitter, Application Report, (Texas Instruments Literature Number, SLUA635)

2. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com

3. An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, (Johns Bill, Texas

Instruments)

4. Integrated Wireless Power Supply Receiver, Qi (Wireless Power Consortium), BQ51013 Datasheet, (Texas

Instruments Literature Number, SLUSAY6)

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REVISION HISTORY

Changes from Original (November, 2013) to Revision A

Page

•

Changed marketing status from Product Preview to Production Data. ................................................................................ 1

Changed System Diagram drawing. ..................................................................................................................................... 1

Changed COMM+ Bias Voltage from 1.5 V to 1.0 V. ........................................................................................................... 4

Changed Block Diagram. ...................................................................................................................................................... 5

Changed pinout drawing with updated pin names. ............................................................................................................... 6

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PACKAGE OPTION ADDENDUM

www.ti.com

17-Dec-2013

PACKAGING INFORMATION

Orderable Device

BQ500412RGZR

BQ500412RGZT

Status Package Type Package Pins Package

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 110

Device Marking

Samples

Drawing

Qty

(1)

(2)

(6)

(3)

(4/5)

ACTIVE

VQFN

RGZ

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

BQ500412

ACTIVE

RGZ

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 110

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

⁽⁶⁾Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

17-Dec-2013

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Dec-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

BQ500412RGZR

BQ500412RGZT

VQFN

RGZ

2500

250

330.0

180.0

16.4

7.3

1.5

12.0

16.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Dec-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

BQ500412RGZR

BQ500412RGZT

VQFN

RGZ

2500

250

367.0

210.0

367.0

185.0

38.0

35.0

Pack Materials-Page 2

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