BQ756506PAPRQ1 [TI]
符合 ASIL-D 标准的汽车类 6 节串联精密电池监控器、平衡器和集成保护器 | PAP | 64 | -40 to 125;
| 型号： | BQ756506PAPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 符合 ASIL-D 标准的汽车类 6 节串联精密电池监控器、平衡器和集成保护器 | PAP | 64 | -40 to 125 电池 监控 |
| 文件： | 总10页 (文件大小：1317K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BQ756506-Q1
ZHCSQQ9 –JUNE 2022
BQ756506-Q1 4S 或6S 独立式精密汽车电池监控器、平衡器和集成电流检测
1 特性
2 应用
• 符合汽车应用要求
• 具有符合AEC-Q100 标准的下列特性：
• 汽车类12V 锂离子电池系统
• 电动自行车、电动踏板车
– 器件温度等级1：–40°C 至+125°C 环境工作
温度范围
3 说明
BQ756506-Q1 器件可在不到200µs 的时间内提供高达
6S 电池模块的高精度电池电压测量，同时该器件还支
持分流电阻器电流检测测量。借助集成式前端滤波器，
可以在电池输入通道上使用简单、低额定电压的差分
RC 滤波器来实现系统。集成式后 ADC 低通滤波器可
以执行经过滤波、类似于直流电的电压测量。该器件还
支持集成电流检测功能，可选择与电池电压测量同步，
以更好地计算荷电状态 (SOC)。此器件支持自主内部
电池平衡，并通过监测温度来自动暂停和恢复平衡，以
免出现过热条件。
– 器件HBM ESD 分类等级2
– 器件CDM ESD 分类等级C4B
• 符合功能安全标准
– 专为功能安全应用开发
– 可帮助进行ISO 26262 系统设计的文档
– 系统可满足ASIL D 级要求
– 硬件可满足ASIL D 要求
• ±1.5mV ADC 精度
• 兼容引脚/封装和软件的器件系列：
– 可堆叠监控器16S（BQ79616-Q1、BQ79656-
Q1）、14S（BQ79614-Q1、BQ79654-Q1）和
12S（BQ79612-Q1、BQ79652-Q1）
– 独立式监控器48V 系统(BQ75614-Q1)
• 支持电流检测测量
• 支持保险丝和继电器打开和关闭诊断
• 用于电压、温度和电流诊断的内置冗余路径
• 可以在128µs 内对所有电池通道执行高度精确的电
池电压测量
器件信息
器件型号(1)
封装尺寸（标称值）
封装
BQ756506-Q1
10.00mm x 10.00mm
HTQFP（64 引脚）
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
FUSE
Relay
IN
12 V
• 集成式后ADC 可配置数字低通滤波器
• 主机控制的内置硬件复位功能，可模拟类似于POR
的器件复位
Fuse/relay sense
PMIC
OUT
VCC
BAT
GPIOx
BQ756506
VCC2
VCC1
• 支持内部电池平衡
CVDD
MCU
– 240mA 的平衡电流
LEVEL
SHIFTER
UART
– 内置平衡热管理，具有自动暂停和恢复控制功能
• 5V LDO 输出为外部数字隔离器供电
• UART 主机接口
Current sense
Rs
• 内置SPI 控制器
系统简图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSF06
BQ756506-Q1
ZHCSQQ9 –JUNE 2022
www.ti.com.cn
4 说明（续）
此器件还包含八个GPIO 或辅助输入，可执行外部热敏电阻测量。
与BQ756506-Q1 的主机通信可通过器件的专用UART 接口连接。
Copyright © 2022 Texas Instruments Incorporated
2
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Product Folder Links: BQ756506-Q1
BQ756506-Q1
ZHCSQQ9 –JUNE 2022
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5 Device and Documentation Support
5.1 Device Support
5.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
5.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
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BQ756506-Q1
ZHCSQQ9 –JUNE 2022
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
1-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ756506PAPRQ1
ACTIVE
HTQFP
PAP
64
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
BQ756506
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
www.ti.com
PACKAGE OUTLINE
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
10.2
9.8
B
NOTE 3
64
49
PIN 1 ID
1
48
10.2
9.8
12.2
TYP
11.8
NOTE 3
16
33
17
32
A
0.27
64X
60X 0.5
0.17
0.08
C A B
4X 7.5
C
SEATING PLANE
1.2 MAX
(0.127)
TYP
SEE DETAIL A
17
32
0.25
GAGE PLANE
(1)
8X (R0.091)
NOTE 4
33
16
0.15
0.05
0.08 C
0 -7
0.75
0.45
6.5
5.3
DETAIL A
65
A
17
TYPICAL
20X (R0.137)
NOTE 4
1
48
49
64
4226412/A 11/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(8)
NOTE 8
(6.5)
SYMM
SOLDER MASK
49
64
DEFINED PAD
64X (1.5)
(R0.05)
TYP
1
48
64X (0.3)
65
(11.4)
SYMM
(1.1 TYP)
60X (0.5)
33
16
(
0.2) TYP
VIA
METAL COVERED
32
17
SEE DETAILS
BY SOLDER MASK
(1.1 TYP)
(11.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226412/A 11/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(6.5)
BASED ON
0.125 THICK STENCIL
SYMM
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
(R0.05) TYP
SYMM
65
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
32
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
7.27 X 7.27
6.5 X 6.5 (SHOWN)
5.93 X 5.93
0.125
0.15
0.175
5.49 X 5.49
4226412/A 11/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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