BQ79652PAPRQ1 [TI]
符合 ASIL-D 标准的汽车类 12 节串联精密电池监控器、平衡器、电流传感器 | PAP | 64 | -40 to 125;型号: | BQ79652PAPRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 符合 ASIL-D 标准的汽车类 12 节串联精密电池监控器、平衡器、电流传感器 | PAP | 64 | -40 to 125 电池 监控 传感器 |
文件: | 总11页 (文件大小:1575K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BQ79656-Q1
SLUSEI2 – MAY 2021
BQ79656-Q1, BQ79654-Q1, BQ79652-Q1 Functional Safety-Compliant Automotive
16S/14S/12S Battery Monitor, Balancer and Integrated Hardware Protector with
Integrated Current Sense
1 Features
2 Applications
•
•
Qualified for automotive applications
AEC-Q100 Qualified with the following results:
– Device temperature grade 1: –40°C to +125°C
ambient operating temperature range
– Device HBM ESD classification level 2
– Device CDM ESD classification level C4B
Functional Safety-Compliant
•
•
•
Battery Management System (BMS) in hybrid and
electric powertrain systems
Energy storage battery packs with Battery
Management Systems
E-bikes, E-Scooters
3 Description
•
The BQ7965x-Q1 family of devices provides high-
accuracy cell voltage measurements for a minimum
of 6S to a maximum of 12S (BQ79652-Q1),
14S (BQ79654-Q1), or 16S (BQ79656-Q1) battery
modules in less than 200 µs while these devices also
support shunt-resistor current sense measurement.
The integrated front-end filters enable the system to
implement with simple, low voltage raring, differential
RC filters on the cell input channels. The integrated,
post-ADC, low-pass filters enable filtered, DC-like,
voltage measurements. This family of devices also
supports integrated current sensing capabilities with
option to synchronize with cell voltage measurements
for better state of charge (SOC) calculation. The
device supports autonomous internal cell balancing
with temperature monitoring to auto-pause and
resume balancing to avoid an overtemperature
condition.
– Developed for functional safety applications
– Documentation to aid ISO 26262 system design
– Systematic capability up to ASIL D
– Hardware capability up to ASIL D
+/- 1.5mV ADC accuracy
•
•
Pin-package and software compatible device
family:
– Stackable monitor 16S (BQ79616-Q1,
BQ79656-Q1), 14S (BQ79614-Q1, BQ79654-
Q1), and 12S (BQ79612-Q1, BQ79652-Q1)
– Standalone monitor 48 V system (BQ75614-
Q1)
Supports current-sense measurement
Built-in redundancy path for voltage and
temperature and current diagnostics
Highly accurate cell voltage measurements within
128 µs for all cell channels
•
•
•
•
Integrated post-ADC configurable digital low-pass
filters
Device Information
PART NUMBER (1)
BQ79652-Q1(2)
BQ79654-Q1(2)
BQ79656-Q1
PACKAGE
BODY SIZE (NOM)
•
•
Supports bus bar connection and measurement
Built-in host-controlled hardware reset to emulate
POR-like device reset
Supports internal cell balancing
– Balancing current at 240 mA
HTQFP (64-pin)
10.00 mm × 10.00 mm
•
– Built-in balancing thermal management with
automatic pause and resume control
Isolated differential daisy chain communication
with optional ring architecture
Embedded fault signal and heartbeat through
communication line
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) Product Preview
•
•
FUSE
Relay
fuse/relay sense
GPIOx
•
•
5 V LDO output to power external digital isolator
UART/SPI host interface/communication bridge
device BQ79600-Q1
12 V
BQ7961x
OUT
VCC
IN
PMIC
Daisy chain
communication
ISO
GPIOx
•
Built-in SPI master
BQ7965x CVDD
UART
VCC1 VCC2
MCU
Current sense
Rs
Simplified System Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
BQ79656-Q1
SLUSEI2 – MAY 2021
www.ti.com
4 Description (continued)
The inclusion of the isolated, bidirectional, daisy chain ports supports both capacitor- and transformer-based
isolation, allowing the use of the most effective components for centralized or distribution architectures
commonly found in the xEV powertrain system. This device also includes eight GPIOs or auxiliary inputs that can
be used for external thermistor measurements.
Host communication to the BQ7965x-Q1 family of devices can be connected via the device's dedicated UART
interface or through a communication bridge device, BQ79600. Additionally, an isolated, differential daisy-chain
communication interface allows the host to communicate with the entire battery stack over a single interface.
in the event of a communication line break, the daisy-chain communication interface is configurable to a ring
architecture that allows the host to talk to devices at either end of the stack.
Copyright © 2021 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: BQ79656-Q1
BQ79656-Q1
SLUSEI2 – MAY 2021
www.ti.com
5 Device and Documentation Support
5.1 Device Support
5.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
5.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: BQ79656-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
BQ79656PAPRQ1
ACTIVE
HTQFP
PAP
64
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
BQ79656
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ79656PAPRQ1
HTQFP
PAP
64
1000
330.0
24.4
13.0
13.0
1.5
16.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-May-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTQFP PAP 64
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 55.0
BQ79656PAPRQ1
1000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PAP 64
10 x 10, 0.5 mm pitch
HTQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226442/A
www.ti.com
PACKAGE OUTLINE
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
10.2
9.8
B
NOTE 3
64
49
PIN 1 ID
1
48
10.2
9.8
12.2
TYP
11.8
NOTE 3
16
33
17
32
A
0.27
64X
60X 0.5
0.17
0.08
C A B
4X 7.5
C
SEATING PLANE
1.2 MAX
(0.127)
TYP
SEE DETAIL A
17
32
0.25
GAGE PLANE
(1)
8X (R0.091)
NOTE 4
33
16
0.15
0.05
0.08 C
0 -7
0.75
0.45
6.5
5.3
DETAIL A
65
A
17
TYPICAL
20X (R0.137)
NOTE 4
1
48
49
64
4226412/A 11/2020
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs.
4. Strap features may not be present.
5. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(8)
NOTE 8
(6.5)
SYMM
SOLDER MASK
49
64
DEFINED PAD
64X (1.5)
(R0.05)
TYP
1
48
64X (0.3)
65
(11.4)
SYMM
(1.1 TYP)
60X (0.5)
33
16
(
0.2) TYP
VIA
METAL COVERED
32
17
SEE DETAILS
BY SOLDER MASK
(1.1 TYP)
(11.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226412/A 11/2020
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,
plugged or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
TM
PAP0064F
PowerPAD TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(6.5)
BASED ON
0.125 THICK STENCIL
SYMM
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
64
49
64X (1.5)
1
48
64X (0.3)
(R0.05) TYP
SYMM
65
(11.4)
60X (0.5)
33
16
METAL COVERED
BY SOLDER MASK
17
32
(11.4)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:6X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
7.27 X 7.27
6.5 X 6.5 (SHOWN)
5.93 X 5.93
0.125
0.15
0.175
5.49 X 5.49
4226412/A 11/2020
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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Copyright © 2021, Texas Instruments Incorporated
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