BQ79654PAPRQ1 [TI]

符合 ASIL-D 标准的汽车类 14 节串联精密电池监控器、平衡器、电流传感器 | PAP | 64 | -40 to 125;


型号：	BQ79654PAPRQ1
厂家：	TEXAS INSTRUMENTS
描述：	符合 ASIL-D 标准的汽车类 14 节串联精密电池监控器、平衡器、电流传感器 \| PAP \| 64 \| -40 to 125 电池监控传感器
文件：	总11页 (文件大小：1575K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BQ79656-Q1

SLUSEI2 – MAY 2021

BQ79656-Q1, BQ79654-Q1, BQ79652-Q1 Functional Safety-Compliant Automotive

16S/14S/12S Battery Monitor, Balancer and Integrated Hardware Protector with

Integrated Current Sense

1 Features

2 Applications

•

Qualified for automotive applications

AEC-Q100 Qualified with the following results:

– Device temperature grade 1: –40°C to +125°C

ambient operating temperature range

– Device HBM ESD classification level 2

– Device CDM ESD classification level C4B

Functional Safety-Compliant

•

Battery Management System (BMS) in hybrid and

electric powertrain systems

Energy storage battery packs with Battery

Management Systems

E-bikes, E-Scooters

3 Description

•

The BQ7965x-Q1 family of devices provides high-

accuracy cell voltage measurements for a minimum

of 6S to a maximum of 12S (BQ79652-Q1),

14S (BQ79654-Q1), or 16S (BQ79656-Q1) battery

modules in less than 200 µs while these devices also

support shunt-resistor current sense measurement.

The integrated front-end filters enable the system to

implement with simple, low voltage raring, differential

RC filters on the cell input channels. The integrated,

post-ADC, low-pass filters enable filtered, DC-like,

voltage measurements. This family of devices also

supports integrated current sensing capabilities with

option to synchronize with cell voltage measurements

for better state of charge (SOC) calculation. The

device supports autonomous internal cell balancing

with temperature monitoring to auto-pause and

resume balancing to avoid an overtemperature

condition.

– Developed for functional safety applications

– Documentation to aid ISO 26262 system design

– Systematic capability up to ASIL D

– Hardware capability up to ASIL D

+/- 1.5mV ADC accuracy

•

Pin-package and software compatible device

family:

– Stackable monitor 16S (BQ79616-Q1,

BQ79656-Q1), 14S (BQ79614-Q1, BQ79654-

Q1), and 12S (BQ79612-Q1, BQ79652-Q1)

– Standalone monitor 48 V system (BQ75614-

Q1)

Supports current-sense measurement

Built-in redundancy path for voltage and

temperature and current diagnostics

Highly accurate cell voltage measurements within

128 µs for all cell channels

•

Integrated post-ADC configurable digital low-pass

filters

Device Information

PART NUMBER ⁽¹⁾

BQ79652-Q1⁽²⁾

BQ79654-Q1⁽²⁾

BQ79656-Q1

PACKAGE

BODY SIZE (NOM)

•

Supports bus bar connection and measurement

Built-in host-controlled hardware reset to emulate

POR-like device reset

Supports internal cell balancing

– Balancing current at 240 mA

HTQFP (64-pin)

10.00 mm × 10.00 mm

•

– Built-in balancing thermal management with

automatic pause and resume control

Isolated differential daisy chain communication

with optional ring architecture

Embedded fault signal and heartbeat through

communication line

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

(2) Product Preview

•

FUSE

Relay

fuse/relay sense

GPIOx

•

5 V LDO output to power external digital isolator

UART/SPI host interface/communication bridge

device BQ79600-Q1

12 V

BQ7961x

OUT

VCC

PMIC

Daisy chain

communication

ISO

GPIOx

•

Built-in SPI master

BQ7965x CVDD

UART

VCC1 VCC2

MCU

Current sense

Simplified System Diagram

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

BQ79656-Q1

SLUSEI2 – MAY 2021

www.ti.com

4 Description (continued)

The inclusion of the isolated, bidirectional, daisy chain ports supports both capacitor- and transformer-based

isolation, allowing the use of the most effective components for centralized or distribution architectures

commonly found in the xEV powertrain system. This device also includes eight GPIOs or auxiliary inputs that can

be used for external thermistor measurements.

Host communication to the BQ7965x-Q1 family of devices can be connected via the device's dedicated UART

interface or through a communication bridge device, BQ79600. Additionally, an isolated, differential daisy-chain

communication interface allows the host to communicate with the entire battery stack over a single interface.

in the event of a communication line break, the daisy-chain communication interface is configurable to a ring

architecture that allows the host to talk to devices at either end of the stack.

Submit Document Feedback

Product Folder Links: BQ79656-Q1

BQ79656-Q1

SLUSEI2 – MAY 2021

www.ti.com

5 Device and Documentation Support

5.1 Device Support

5.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

5.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

5.3 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

5.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

5.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

5.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: BQ79656-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

28-May-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

BQ79656PAPRQ1

ACTIVE

HTQFP

PAP

1000 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 125

BQ79656

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

29-May-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

BQ79656PAPRQ1

HTQFP

PAP

1000

330.0

24.4

13.0

1.5

16.0

24.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

29-May-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

HTQFP PAP 64

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 55.0

BQ79656PAPRQ1

1000

Pack Materials-Page 2

GENERIC PACKAGE VIEW

PAP 64

10 x 10, 0.5 mm pitch

HTQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226442/A

www.ti.com

PACKAGE OUTLINE

PAP0064F

PowerPAD TQFP - 1.2 mm max height

SCALE 1.300

PLASTIC QUAD FLATPACK

10.2

9.8

NOTE 3

PIN 1 ID

10.2

9.8

12.2

TYP

11.8

NOTE 3

0.27

64X

60X 0.5

0.17

0.08

C A B

4X 7.5

SEATING PLANE

1.2 MAX

(0.127)

TYP

SEE DETAIL A

0.25

GAGE PLANE

(1)

8X (R0.091)

NOTE 4

0.15

0.05

0.08 C

0 -7

0.75

0.45

6.5

5.3

DETAIL A

TYPICAL

20X (R0.137)

NOTE 4

4226412/A 11/2020

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs.

4. Strap features may not be present.

5. Reference JEDEC registration MS-026.

www.ti.com

EXAMPLE BOARD LAYOUT

PAP0064F

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(8)

NOTE 8

(6.5)

SYMM

SOLDER MASK

DEFINED PAD

64X (1.5)

(R0.05)

TYP

64X (0.3)

(11.4)

SYMM

(1.1 TYP)

60X (0.5)

(

0.2) TYP

VIA

METAL COVERED

SEE DETAILS

BY SOLDER MASK

(1.1 TYP)

(11.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:6X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4226412/A 11/2020

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,

Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled,

plugged or tented.

10. Size of metal pad may vary due to creepage requirement.

www.ti.com

EXAMPLE STENCIL DESIGN

PAP0064F

PowerPAD TQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(6.5)

BASED ON

0.125 THICK STENCIL

SYMM

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

64X (1.5)

64X (0.3)

(R0.05) TYP

SYMM

(11.4)

60X (0.5)

METAL COVERED

BY SOLDER MASK

(11.4)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:6X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

7.27 X 7.27

6.5 X 6.5 (SHOWN)

5.93 X 5.93

0.125

0.15

0.175

5.49 X 5.49

4226412/A 11/2020

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

www.ti.com

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party

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costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either

on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s

applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

BQ79654PAPRQ1 [TI]

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