BQ79731-Q1 [TI]
汽车电池接线盒电压监测器、电流传感器和隔离阻抗传感器;
| 型号： | BQ79731-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车电池接线盒电压监测器、电流传感器和隔离阻抗传感器 电池 传感器 |
| 文件： | 总13页 (文件大小：2654K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BQ79731-Q1
ZHCSRE8 –DECEMBER 2022
BQ79731-Q1 具有电压、电流和绝缘电阻监测功能、适用于EV/BMS 高压汽车
类应用的UIR 传感器
1 特性
2 应用
• 符合AEC-Q100 标准，–40°C 至+125°C
• 以功能安全合规型为目标
• 全电动、插电式混合动力和混合动力汽车
3 说明
– 可提供用于ISO 26262 系统设计的文档
– 系统可满足ASIL D 等级要求
– 硬件可满足ASIL D 等级要求
• 17 个单端电压通道
该器件可用于测量电池系统中的高电压分压节点。它可
以测量保险丝和接触器两端的电压，并检查电池接线盒
(BJB) 系统中的隔离电压。该器件具有两条支持低侧分
流电阻器的集成式电流检测 (BQ79731-Q1) 路径。库
仑计数 (BQ79731-Q1) 功能可用于进行精确的 SOC 计
算。有 15 个 GPIO/辅助输入可用于高压测量、热敏电
阻测量和驱动继电器。有 4 个 SW 输出可用于驱动测
量路径中的 MOSFET 开关管。该器件可用作 SPI 集线
器并与多达 8 个独立的 SPI 器件/组进行连接。可以使
用 HW 引脚自主实现过流保护响应，以便在危险的过
流事件中提供快速保护。隔离式双向菊花链端口支持基
于电容器和变压器的隔离。该器件还可以通过 SPI 与
MCU 通信。
– 高压电池包、链路、电荷测量精度< 0.2%
– 电池包和电池VI 同步至64uS
• 2 个独立的电流检测ADC (BQ79731-Q1)
– ±0.05% 增益误差漂移
– 输入范围= ±275mV
• 2 个过流检测比较器(BQ79731-Q1)
– ±1% 精度
– 可选择的双向阈值
– 可编程OC
• 集成库仑计数(BQ79731-Q1)
• 15 个具有IO、I2C、SPI、ADC 和温度检测功能的
GPIO 输入
• 专用MOSFET 开关驱动引脚
• 智能SPI 控制器HUB
器件信息
器件型号
封装(1)
封装尺寸（标称值）
7mm × 7mm
BQ79731-Q1
BQ79735-Q1(2)
HTQFP（48 引脚）
HTQFP（48 引脚）
7mm × 7mm
– 支持多个SPI 外围器件
– 用于触发接触器驱动器和热熔丝驱动器的HW
引脚
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 预发布
• 与电池监测器（如18 节串联，BQ79718）兼容的
可堆叠和寄存器映射
precharge
6
BJB/BDU
DC fast
R
HV Separator
(PYROFUSE)
PACK+
VFUSE
LINK+
CHARGE+
HALL SENSOR
Charging
Port
Fuse
Driver
4
1
3
5
:
Contactor
Control
---------------
Relay Driver
Over Current
Fault
1
PACK MEASUREMENT
2
7
8
5
6
INSULATION MONITORING
LINK MEASUREMENT
:
:
3
4
CHARGE MEASUREMENT
EEPROM
HALL SENSOR
BQ79731
VFUSE MEASUREMENT
HV
:
LOAD
INSULATION
RESISTANCE
Current
Sense
UART / SPI
:
:
Chassis
Gnd
Digital
Isolator
2
:
To MCU
7
8
:
Rsense
LINK-
PACK-
CHARGE-
简化版系统图
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSF55
BQ79731-Q1
ZHCSRE8 –DECEMBER 2022
www.ti.com.cn
4 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
4.1 Device Support
4.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
4.2 Documentation Support
4.2.1 Related Documentation
4.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
4.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.6 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
4.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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5.1 Package Option Addendum
Packaging Information
Orderable
Device
Package
Drawing
Lead/Ball
Finish(6)
MSL Peak
Temp(3)
Device
Status(1)
Package Type
Pins
Package Qty
Eco Plan(2)
Op Temp (°C)
Marking(4) (5)
PBQ79731PHP
TQ1
HTQFP
HTQFP
PHP
48
NiPdAu
MSL-3-260C-16 -40 to 125C
8 HR
PBQ79731A0
PRE _PROD
250
RoHS & Green
PBQ79735PHP
TQ1
PHP
48
250
RoHS & Green NiPdAu
MSL-3-260C-16 -40 to 125C
8 HR
PREVIEW
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material).
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on
information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI
has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming
materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2023 Texas Instruments Incorporated
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5.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
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Height (mm)
Device
Package Type
Package Drawing Pins
SPQ
Length (mm) Width (mm)
5.3 Tray Information
Max
Configurati Unit Array
Temp.
Package Package
Type Name
CL
(mm)
Device
Pins
SPQ
L (mm)
W (mm) K0 (mm) P1 (mm)
CW (mm)
on
Matrix
(Deg C)
5.4 Tube Information
Package
Type
L
W
(mm)
T
B
(mm)
Device
Package Name
Pins
SPQ
(mm)
(mm)
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5.5 Mechanical Data
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PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
PBQ79731PHPTQ1
ACTIVE
HTQFP
PHP
48
250
TBD
Call TI
Call TI
-40 to 125
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
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保。
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