CAXC4T774QRSVRQ1 [TI]

具有三态输出和独立方向控制输入汽车类的 4 位双电源总线收发器 | RSV | 16 | -40 to 125;


型号：	CAXC4T774QRSVRQ1
厂家：	TEXAS INSTRUMENTS
描述：	具有三态输出和独立方向控制输入汽车类的 4 位双电源总线收发器 \| RSV \| 16 \| -40 to 125 总线收发器
文件：	总38页 (文件大小：2428K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

SN74AXC4T774-Q1 具有独立方向、可配置电压转换和三态输出的汽车类4 位

双电源总线收发器

SN74AXC4T774-Q1 器件旨在实现数据总线之间的异

步通信。根据方向控制输入 (DIRx) 的逻辑电平，该器

1 特性

• 符合面向汽车应用的AEC-Q100 标准

• 完全可配置的双轨设计，实现各个端口在0.65V 至

3.6V 的电源电压范围内运行

• 工作温度范围为–40°C 至+125°C

• 独立方向控制引脚，支持可配置升降转换

• 无干扰电源定序

• 从1.8V 转换到3.3V 时，支持高达310Mbps 的转

换速率

• VCC 隔离特性：

– 如果任何一个V_CC输入低于100mV，则所有

I/O 输出均禁用且处于高阻抗状态

• I_off支持局部断电模式运行

• 兼容AVC 系列电平转换器

• 闩锁性能超出100mA，符合JESD 78 II 类规范的

要求

件将数据从 A 总线传输至 B 总线，或者将数据从 B 总

线传输至 A 总线。输出使能输入 (OE) 用于禁用输出，

从而有效隔离总线。 SN74AXC4T774-Q1 器件旨在使

控制引脚（DIRx 和OE）以VCCA 为基准。

为了确保电平转换器I/O 在上电或断电期间处于高阻抗

状态，OE 引脚应通过上拉电阻器连接至V_CCA。

该器件完全符合使用 Ioff 电流的部分断电应用的规范要

求。当器件断电时，Ioff 保护电路可确保不从输入、输

出或偏置到特定电压的组合I/O 获取多余电流，也不向

其提供多余电流。

V_CC隔离特性能确保当 V_CCA或 V_CCB低于 100mV

时，可通过禁用 I/O 端口的输出来将其设为高阻抗状

态。

无干扰电源时序使电源轨能以任何顺序打开或关断，从

而提供强大的电源时序性能。

• ESD 保护性能超过JEDEC JS-001 规范要求

– 8000V 人体放电模型

– 1000V 充电器件模型

器件信息

封装⁽¹⁾

封装尺寸（标称值）

器件型号

2 应用

SN74AXC4T774QPWRQ1

TSSOP (16) 5.00mm × 4.40mm

• 信息娱乐系统音响主机

• ADAS 融合

• ADAS 前置摄像头

SN74AXC4T774QBQBRQ1 WQFN (16)

SN74AXC4T774QRSVRQ1 UQFN (16)

2.50mm × 3.50mm

2.60mm x 1.80mm

• 混合动力汽车/电动汽车电池管理

• 远程信息处理控制单元

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

3 说明

One of Four Transceivers

V_CCA

V_CCB

SN74AXC4T774-Q1 是一款使用两个独立可配置电源

轨的四位同相总线收发器。 VCCA 和 VCCB 电源电压

低至 0.65V 时，该器件可正常工作。A 端口用于跟踪

VCCA，该端口可支持 0.65V 至 3.6V 范围内的任何电

源电压。B 端口用于跟踪 VCCB，该端口也可支持

0.65V 至 3.6V 范围内的任何电源电压。此外，

SN74AXC4T774-Q1 还与单电源系统兼容。

DIRx

功能模块图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SCES918

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

Table of Contents

7.1 Load Circuit and Voltage Waveforms........................16

8 Detailed Description......................................................18

8.1 Overview...................................................................18

8.2 Functional Block Diagram.........................................18

8.3 Feature Description...................................................18

8.4 Device Functional Modes..........................................19

9 Application and Implementation..................................20

9.1 Application Information............................................. 20

9.2 Typical Application.................................................... 20

10 Power Supply Recommendations..............................22

11 Layout...........................................................................22

11.1 Layout Guidelines................................................... 22

11.2 Layout Example...................................................... 22

12 Device and Documentation Support..........................23

12.1 Documentation Support.......................................... 23

12.2 接收文档更新通知................................................... 23

12.3 支持资源..................................................................23

12.4 Trademarks.............................................................23

12.5 静电放电警告.......................................................... 23

12.6 术语表..................................................................... 23

13 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................5

6.4 Thermal Information....................................................5

6.5 Electrical Characteristics.............................................6

6.6 Switching Characteristics, V_CCA= 0.7 ± 0.05 V.......... 7

6.7 Switching Characteristics, V_CCA= 0.8 ± 0.04 V.......... 7

6.8 Switching Characteristics, V_CCA= 0.9 ± 0.045 V........ 8

6.9 Switching Characteristics, V_CCA= 1.2 ± 0.1 V............ 9

6.10 Switching Characteristics, V_CCA= 1.5 ± 0.1 V.......... 9

6.11 Switching Characteristics, V_CCA= 1.8 ± 0.15 V...... 10

6.12 Switching Characteristics, V_CCA= 2.5 ± 0.2 V........ 11

6.13 Switching Characteristics, V_CCA= 3.3 ± 0.3 V........ 11

6.14 Operating Characteristics: T_A= 25°C..................... 13

6.15 Typical Characteristics............................................15

7 Parameter Measurement Information..........................16

Information.................................................................... 23

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision C (July 2020) to Revision D (March 2021)

Page

• 将BQB (WQFN) 封装选项的状态从预发布更改为生产。..................................................................................1

Changes from Revision B (June 2020) to Revision C (July 2020)

Page

• 向器件信息表添加了BQB (WQFN) 封装选项....................................................................................................1

• 更新了整个文档的表、图和交叉参考的编号格式................................................................................................ 1

Changes from Revision A (April 2020) to Revision B (June 2020)

Page

• RSV 器件状态从“预发布”更改为“正在供货”...............................................................................................1

Changes from Revision * (February 2020) to Revision A (April 2020)

Page

• 将器件状态从“预告信息”更改为“量产数据”................................................................................................ 1

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

5 Pin Configuration and Functions

DIR1

DIR2

V_CCA

V_CCB

DIR2

15 V_CCB

14 B1

13 B2

12 B3

11 B4

10 GND

Thermal

Pad

DIR3

DIR4

GND

图5-2. BQB Package 16-Pin WQFN Transparent

图5-1. PW Package 16-Pin TSSOP Top View

Top View

16 15 14 13

¹¹B2

图5-3. RSV Package 16-Pin UQFN Transparent Top View

Pin Functions

NAME

NO.

TYPE

DESCRIPTION

RSV

BQB

I/O

Input/output A1. Referenced to V_CCA

Input/output A2. Referenced to V_CCA

Input/output A3. Referenced to V_CCA

Input/output A4. Referenced to V_CCA

Input/output B1. Referenced to V_CCB

Input/output B2. Referenced to V_CCB

Input/output B3. Referenced to V_CCB

Input/output B4. Referenced to V_CCB

Direction-control input for port 1. Referenced to

V_CCA

DIR1

DIR2

DIR3

DIR4

Direction-control input for port 2. Referenced to

V_CCA

Direction-control input for port 3. Referenced to

V_CCA

Direction-control input for port 4. Referenced to

V_CCA

Tri-state output enable. Pull OE high to place all

outputs in tri-state mode. Referenced to V_CCA

GND

V_CCA

Ground

—

A-port power supply voltage. 0.65 V ≤V_CCA

3.6 V

≤

B-port power supply voltage. 0.65 V ≤V_CCB

V_CCB

—

3.6 V

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.5

–50

MAX UNIT

V_CCASupply voltage A

V_CCBSupply voltage B

4.2

I/O Ports (A Port)

I/O Ports (B Port)

Control Inputs

A Port

4.2

V_I

Input Voltage⁽²⁾

4.2

V_O

Voltage applied to any output in the high-impedance or power-off state⁽²⁾

Voltage applied to any output in the high or low state^{(2) (3)}

B Port

4.2

A Port

V_CCA+ 0.2

V_CCB+ 0.2

B Port

I_IK

I_OK

I_O

Input clamp current

V_I< 0

Output clamp current

V_O< 0

–50

Continuous output current

Continuous current through V_CCor GND

Junction Temperature

50 mA

100 mA

150 °C

–50

–100

T_j

T_stg

Storage temperature

–65

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The output positive-voltage rating may be exceeded up to 4.2 V maximum if the output current rating is observed.

6.2 ESD Ratings

VALUE

±8000

±1000

UNIT

Human body model (HBM), per AEC Q100-002⁽¹⁾

Charged device model (CDM), per AEC Q100-011

V_(ESD)

Electrostatic discharge

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)^{(1) (2)}

MIN

0.65

MAX UNIT

V_CCA

V_CCB

Supply voltage A

Supply voltage B

3.6

0.65

V_CCI= 0.65 V - 0.75 V

V_CCI= 0.76 V - 1 V

V_CCI= 1.1 V - 1.95 V

V_CCI= 2.3 V - 2.7 V

V_CCI= 3 V - 3.6 V

V_CCIx 0.70

V_CCIx 0.65

1.6

Data Inputs

V_IH

High-level input voltage

V_CCA= 0.65 V - 0.75 V

V_CCA= 0.76 V - 1 V

V_CCA= 1.1 V - 1.95 V

V_CCA= 2.3 V - 2.7 V

V_CCA= 3 V - 3.6 V

V_CCI= 0.65 V - 0.75 V

V_CCI= 0.76 V - 1 V

V_CCI= 1.1 V - 1.95 V

V_CCI= 2.3 V - 2.7 V

V_CCI= 3 V - 3.6 V

V_CCAx 0.70

V_CCAx 0.65

1.6

Control Inputs(DIRx,

OE), Referenced to V_CCA

V_CCIx 0.30

V_CCIx 0.35

0.7

Data Inputs

0.8

V_IL

Low-level input voltage

V_CCA= 0.65 V - 0.75 V

V_CCA= 0.76 V - 1 V

V_CCA= 1.1 V - 1.95 V

V_CCA= 2.3 V - 2.7 V

V_CCA= 3 V - 3.6 V

V_CCAx 0.30

V_CCAx 0.35

0.7

Control Inputs(DIRx,

OE), Referenced to V_CCA

0.8

V_I

Input voltage⁽¹⁾

Output voltage

3.6

Active State

Tri-State

V_CCO

V_O

3.6

Δt/

Input transition rise and fall time

Operating free-air temperature

10 ns/V

125 °C

Δv⁽²⁾

T_A

–40

(1) V_CCIis the V_CCassociated with the input port.V_CCOis the V_CCassociated with the output port.

(2) All unused inputs of the device must be held at V_CCor GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, SCBA004.

6.4 Thermal Information

SN74AXC4T774-Q1

THERMAL METRIC⁽¹⁾

PW (TSSOP) RSV (UQFN) BQB (WQFN)

UNIT

16 PINS

118.2

48.6

64.5

7.3

16 PINS

130.8

69.1

59.9

3.9

16 PINS

73.7

70.9

43.5

4.9

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

Y_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

Y_JB

63.9

58.3

43.5

21.2

R_θJC(bottom)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted) ^{(1) (2) (4)}

Operating free-air temperature (T_A)

–40°C to 85°C –40°C to 125°C

PARAMETER

TEST CONDITIONS

V_CCA

V_CCB

UNIT

MIN

TYP

MAX

MIN

TYP

MAX

V_CCO

–0.1

V_CCO

–0.1

0.7 V - 3.6 V

I_OH= –100 µA

0.65 V

0.76 V

0.85 V

1.1 V

0.65 V

0.76 V

0.85 V

1.1 V

0.55

0.58

0.65

0.85

1.05

1.2

0.55

0.58

0.65

0.85

1.05

1.2

I_OH= –50 µA

I_OH= –200 µA

I_OH= –500 µA

High-level output

voltage

V_OH

V_I= V_IH

I_OH= –3 mA

I_OH= –6 mA

I_OH= –8 mA

I_OH= –9 mA

I_OH= –12 mA

I_OL= 100 µA

I_OL= 50 µA

I_OL= 200 µA

I_OL= 500 µA

I_OL= 3 mA

1.4 V

1.65 V

2.3 V

1.65 V

2.3 V

1.75

2.3

1.75

2.3

3 V

0.7 V - 3.6 V

0.65 V

0.76 V

0.85 V

1.1 V

0.7 V - 3.6 V

0.65 V

0.76 V

0.85 V

1.1 V

0.1

0.18

0.2

0.18

0.2

Low-level output

voltage

V_OL

V_I= V_IL

0.25

0.35

0.45

0.55

0.7

0.25

0.35

0.45

0.55

0.7

I_OL= 6 mA

1.4 V

I_OL= 8 mA

1.65 V

2.3 V

1.65 V

2.3 V

I_OL= 9 mA

I_OL= 12 mA

3 V

Control inputs (DIRx, OE):V_I=

V_CCAor GND

0.65 V- 3.6 V

0.5

µA

–0.5

–4

–1

–8

Input leakage

current

I_I

Data Inputs (Ax, Bx),V_I= V_CCI

or GND

A Port: V_Ior V_O= 0 V - 3.6 V 0 V

0 V - 3.6 V

0 V

–4

–8

Partial power

down current

I_off

µA

B Port: V_Ior V_O= 0 V - 3.6 V 0 V - 3.6 V

Tri-state output A or B Port, V_I= V_CCIor GND,

I_OZ

3.6 V

–4

–8

current ⁽³⁾

V_O= V_CCOor GND, OE = V_IH

0.65 V- 3.6 V

0 V

0.65 V- 3.6 V

3.6 V

V_CCAsupply

current

V_I= V_CCI

I_O= 0

I_CCA

µA

–2

–12

or GND

3.6 V

0 V

0.65 V- 3.6 V

0 V

0.65 V- 3.6 V

3.6 V

V_CCBsupply

current

V_I= V_CCI

I_O= 0

I_CCB

or GND

3.6 V

0 V

–2

–12

I_CCA

I_CCB

Combined

supply current

V_I= V_CCI

I_O= 0

0.65 V- 3.6 V

3.3 V

0.65 V- 3.6 V

3.3 V

µA

or GND

Control Input

Capacitance

C_i

V_I= 3.3 V or GND

4.5

6.5

4.5

6.5

Data I/O

Capacitance

OE = V_CCA, V_O= 1.65V DC +1

MHz -16 dBm sine wave

C_io

3.3 V

(1) V_CCIis the V_CCassociated with the input port.

(2) V_CCOis the V_CCassociated with the output port.

(3) For I/O ports, the parameter I_OZincludes the input leakage current.

(4) All typical data is taken at 25°C.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.6 Switching Characteristics, V_CCA= 0.7 ± 0.05 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B–Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions

UNIT

0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

0.5

172

205

189

287

309

0.5

120

141

205

161

287

219

0.5

221

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

109

205

145

287

177

205

102

287

133

205

102

287

132

205

113

287

165

205

176

287

418

t_disDisable time

287

127

t_enEnable time

6.7 Switching Characteristics, V_CCA= 0.8 ± 0.04 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

141

120

114

156

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

114

131

114

116

114

t_disDisable time

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

161

258

0.5

161

174

0.5

161

137

0.5

161

0.5

161

0.5

161

0.5

161

0.5

161

106

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

t_enEnable time

6.8 Switching Characteristics, V_CCA= 0.9 ± 0.045 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

109

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

t_disDisable time

138

112

t_enEnable time

203

140

110

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.9 Switching Characteristics, V_CCA= 1.2 ± 0.1 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

t_disDisable time

123

124

t_enEnable time

124

6.10 Switching Characteristics, V_CCA= 1.5 ± 0.1 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

)

PARAMETER

FROM

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

t_disDisable time

120

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

t_enEnable time

6.11 Switching Characteristics, V_CCA= 1.8 ± 0.15 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

)

PARAMETER

FROM

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

t_disDisable time

117

119

t_enEnable time

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.12 Switching Characteristics, V_CCA= 2.5 ± 0.2 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Conditions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

t_disDisable time

115

117

t_enEnable time

6.13 Switching Characteristics, V_CCA= 3.3 ± 0.3 V

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

Test Condtions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V 1.5 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX

)

PARAMETER

FROM

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

Propagation

delay

t_pd

221

t_disDisable time

115

117

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

See Figure 5 and Table 1 for test circuit and loading. See Figure 6, Figure 7, and Figure 8 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

PARAMETER

FROM

Test Condtions 0.7 ± 0.05 V 0.8 ± 0.04 V 0.9 ± 0.045 V 1.2 ± 0.1 V

MIN MAX MIN MAX MIN MAX MIN MAX

1.5 ± 0.1 V

MIN MAX

1.8 ± 0.15 V

MIN MAX

2.5 ± 0.2 V

MIN MAX

3.3 ± 0.3 V

MIN MAX

UNIT

0.5

–40°C to 85°C

–40°C to 125°C

–40°C to 85°C

–40°C to 125°C

t_enEnable time

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.14 Operating Characteristics: T_A= 25°C

PARAMETER

TEST CONDITIONS

V_CCA

0.7 V

V_CCB

0.7 V

MIN

TYP

2.4

MAX UNIT

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

2.3

2.2

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (A to B: outputs f = 1 MHz

2.2

enabled)

t_rise= t_fall= 1 ns

2.2

2.4

3.0

1.5

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (A to B: outputs f = 1 MHz

1.5

disabled)

t_rise= t_fall= 1 ns

1.5

1.6

2.0

C_pdA

13.4

15.0

14.0

20.7

29.6

40.2

65.8

91.7

1.3

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (B to A: outputs f = 1 MHz

enabled)

t_rise= t_fall= 1 ns

1.1

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (B to A: outputs f = 1 MHz

1.0

disabled)

t_rise= t_fall= 1 ns

1.0

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

MAX UNIT

PARAMETER

TEST CONDITIONS

V_CCA

0.7 V

V_CCB

0.7 V

MIN

TYP

13.4

13.8

14.9

20.6

29.6

40.3

66.2

92.5

1.3

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

0.7 V

0.8 V

0.9 V

1.2 V

1.5 V

1.8 V

2.5 V

3.3 V

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (A to B: outputs f = 1 MHz

enabled)

t_rise= t_fall= 1 ns

1.2

1.1

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (A to B: outputs f = 1 MHz

disabled)

1.1

t_rise= t_fall= 1 ns

1.1

C_pdB

2.5

2.4

2.3

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (B to A: outputs f = 1 MHz

enabled)

2.2

2.3

t_rise= t_fall= 1 ns

2.3

2.5

3.0

1.6

1.5

Power Dissipation Capacitance C_L= 0, R_L= Open

per transceiver (B to A: outputs f = 1 MHz

disabled)

1.5

t_rise= t_fall= 1 ns

1.5

1.6

2.0

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

6.15 Typical Characteristics

3.4

3.2

1.25

1.2

V_CC= 1.8V

V_CC= 2.5V

V_CC= 3.3V

1.15

1.1

1.05

2.8

2.6

2.4

2.2

0.95

0.9

0.85

0.8

0.75

0.7

1.8

1.6

1.4

0.65

0.6

V_CC= 0.7V

V_CC= 1.2V

0.55

0.5

1.5

2.5

I_OH(mA)

3.5

4.5

I_OH(mA)

D001

图6-2. Typical (T_A=25°C) Output High Voltage (V_OH

)

图6-1. Typical (T_A=25°C) Output High Voltage (V_OH

vs Source Current (I_OH

)

vs Source Current (I_OH

)

700

650

600

550

500

450

400

350

300

250

200

150

100

220

200

180

160

140

120

100

V_CC= 1.8V

V_CC= 2.5V

V_CC= 3.3V

V_CC= 0.7V

V_CC= 1.2V

-50

I_OL(mA)

0.5

1.5

2.5

I_OL(mA)

3.5

4.5

D001

图6-3. Typical (T_A=25°C) Output High Voltage (V_OL) 图6-4. Typical (T_A=25°C) Output High Voltage (V_OL

)

vs Sink Current (I_OL

)

vs Sink Current (I_OL)

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

7 Parameter Measurement Information

7.1 Load Circuit and Voltage Waveforms

Unless otherwise noted, all input pulses are supplied by generators having the following characteristics:

• f = 1 MHz

• Z_O= 50 Ω

• dv/dt ≤1 ns/V

Measurement Point

2 x V_CCO

Open

GND

R_L

Output Pin

Under Test

(1)

C_L

R_L

A. C_Lincludes probe and jig capacitance.

图7-1. Load Circuit

表7-1. Load Circuit Conditions

Parameter

V_CCO

R_L

C_L

S₁

V_TP

N/A

Δt/

Δv

Input transition rise or fall rate

15 pF

Open

0.65 V –3.6 V

1.1 V –3.6 V

1 MΩ

2 kΩ

20 kΩ

t_pd

Propagation (delay) time

0.65 V –0.95

15 pF

2 × V_CCO

0.3 V

0.15 V

0.1 V

3 V –3.6 V

1.65 V –2.7 V

1.1 V –1.6 V

2 kΩ

t_en, t_disEnable time, disable time

0.65 V –0.95

15 pF

2 × V_CCO

0.1 V

20 kΩ

15 pF

GND

0.3 V

0.15 V

0.1 V

3 V –3.6 V

1.65 V –2.7 V

1.1 V –1.6 V

2 kΩ

t_en, t_disEnable time, disable time

0.65 V –0.95

15 pF

GND

0.1 V

20 kΩ

(1)

V_CCI

(1)

V_CCI

Input A, B

100 kHz

V_CCI/ 2

Input A, B

500 ps/V œ 10 ns/V

0 V

V_OH

0 V

V_OH

(2)

t_pd

(2)

Output B, A

Ensure Monotonic

Rising and Falling Edge

(2)

V_OL

Output B, A

V_CCI/ 2

(2)

V_OL

1. V_CCIis the supply pin associated with the input port.

2. V_OHand V_OLare typical output voltage levels that occur

with specified R_L, C_L, and S₁

1. V_CCIis the supply pin associated with the input port.

2. V_OHand V_OLare typical output voltage levels that occur

with specified R_L, C_L, and S₁

图7-3. Input Transition Rise or Fall Rate

图7-2. Propagation Delay

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

V_CCA

V_CCA/ 2

GND

t_dis

t_en

(3)

V_CCO

Output⁽¹⁾

V_CCO/ 2

V_OL+ V_TP

(4)

V_OL

(4)

V_OH

V_OH- V_TP

Output⁽²⁾

V_CCO/ 2

GND

A. Output waveform on the condition that input is driven to a valid Logic Low.

B. Output waveform on the condition that input is driven to a valid Logic High.

C. V_CCOis the supply pin associated with the output port.

D. V_OHand V_OLare typical output voltage levels with specified R_L, C_L, and S₁.

图7-4. Enable Time And Disable Time

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

8 Detailed Description

8.1 Overview

The SN74AXC4T774-Q1 is a 4-bit, dual-supply noninverting bidirectional voltage level translation device. Ax pins

and control pins (DIRx and OE) are reference to V_CCAlogic levels, and Bx pins are referenced to V_CCBlogic

levels. The A port is able to accept I/O voltages ranging from 0.65 V to 3.6 V, while the B port can accept I/O

voltages from 0.65 V to 3.6 V. A high on DIR allows data transmission from A to B and a low on DIR allows data

transmission from B to A when OE is set to low. When OE is set to high, both Ax and Bx pins are in the high-

impedance state. See 节8.4 for a summary of the operation of the control logic.

8.2 Functional Block Diagram

One of Four Transceivers

V_CCA

V_CCB

DIRx

8.3 Feature Description

8.3.1 Standard CMOS Inputs

Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input

capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum

input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the

Electrical Characteristics, using ohm's law (R = V ÷ I).

Signals applied to the inputs need to have fast edge rates, as defined by Δt/Δv in Recommended Operating

Conditions to avoid excessive current consumption and oscillations. If a slow or noisy input signal is required, a

device with a Schmitt-trigger input should be used to condition the input signal prior to the standard CMOS input.

8.3.2 Balanced High-Drive CMOS Push-Pull Outputs

A balanced output allows the device to sink and source similar currents. The high drive capability of this device

creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.

Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without

being damaged. The electrical and thermal limits defined in the Absolute Maximum Ratings must be followed at

all times.

8.3.3 Partial Power Down (I_off)

The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting

current backflow into the device. The maximum leakage into or out of any input or output pin on the device is

specified by I_offin the Electrical Characteristics.

8.3.4 V_CCIsolation

The inputs and outputs for this device enter a high-impedance state when either supply is <100 mV.

8.3.5 Over-voltage Tolerant Inputs

Input signals to this device can be driven above the supply voltage so long as they remain below the maximum

input voltage value specified in the Recommended Operating Conditions.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

8.3.6 Glitch-free Power Supply Sequencing

Either supply rail may be powered on or off in any order without producing a glitch on the I/Os (that is, where the

output erroneously transitions to VCC when it should be held low). Glitches of this nature can be misinterpreted

by a peripheral as a valid data bit, which could trigger a false device reset of the peripheral, a false device

configuration of the peripheral, or even a false data initialization by the peripheral. For more information

regarding the power up glitch performance of the AXC family of level translators, see the Glitch Free Power

Sequencing With AXC Level Translators application report

8.3.7 Negative Clamping Diodes

The inputs and outputs to this device have negative clamping diodes as depicted in 图8-1.

CAUTION

Voltages beyond the values specified in the Absolute Maximum Ratings table can cause damage to

the device. The input negative-voltage and output voltage ratings may be exceeded if the input and

output clamp-current ratings are observed.

V_CC

Device

Input

Output

Logic

GND

-I_IK

-I_OK

图8-1. Electrical Placement of Clamping Diodes for Each Input and Output

8.3.8 Fully Configurable Dual-Rail Design

The V_CCAand V_CCBpins can be supplied at any voltage from 0.65 V to 3.6 V, making the device suitable for

translating between any of the voltage nodes (0.7 V, 0.8 V, 0.9 V, 1.2 V, 1.8 V, 2.5 V, and 3.3 V).

8.3.9 Supports High-Speed Translation

The SN74AXC4T774-Q1 device can support high data-rate applications. The translated signal data rate can be

up to 310 Mbps when the signal is translated from 1.8 V to 3.3 V.

8.4 Device Functional Modes

表8-1. Function Table

(Each Transceiver)

Port Status

CONTROL INPUTS^{(1) (2)}

OE DIR

OPERATION

A PORT

B PORT

Input (Hi-Z)

Output (Enabled)

Input (Hi-Z)

B data to A bus

A data to B bus

Isolation

Output (Enabled)

Input (Hi-Z)

(1) Input circuits of the data I/Os are always active.

(2) Pins configured as inputs should not be left floating.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 Application Information

The SN74AXC4T774-Q1 device can be used in level-translation applications for interfacing devices or systems

operating at different interface voltages with one another. The SN74AXC4T774-Q1 device is ideal for use in

applications where a push-pull driver is connected to the data I/Os. The max data rate can be up to 310 Mbps

when device translates a signal from 1.8 V to 3.3 V.

One example application is shown in 图 9-1, where the SN74AXC4T774-Q1 device is used to translate a low

voltage SPI signal from an SoC to a higher voltage signal to properly drive the inputs of a GPS module, and vice

versa.

9.2 Typical Application

Pullup Resistors keep device disabled

during power up. OE inputs may also

be tied to GND to keep device enabled

0.7 V

3.3 V

0.1 µF

V_CCA

V_CCB

DIR1

DIR3

DIR2

DIR4

GPS

Module

GPIO1

SN74AXC4T774-Q1

SoC

CLK

SDI

SDO

CLK

SDO

SDI

GND

图9-1. Serial Peripheral Interface (SPI) Application

9.2.1 Design Requirements

For this design example, use the parameters listed in 表9-1.

表9-1. Design Parameters

DESIGN PARAMETERS

EXAMPLE VALUES

Input voltage range

0.65 V to 3.6 V

Output voltage range

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

9.2.2 Detailed Design Procedure

To begin the design process, determine the following:

• Input voltage range

– Use the supply voltage of the device that is driving the SN74AXC4T774-Q1 device to determine the input

voltage range. For a valid logic-high, the value must exceed the high-level input voltage (V_IH) of the input

port. For a valid logic low the value must be less than the low-level input voltage (V_IL) of the input port.

• Output voltage range

– Use the supply voltage of the device that the SN74AXC4T774-Q1 device is driving to determine the output

voltage range.

9.2.3 Application Curve

图9-2. Up Translation at 2.5 MHz (0.7 V to 3.3 V)

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

10 Power Supply Recommendations

Always apply a ground reference to the GND pins first. This device is designed for glitch free power sequencing

without any supply sequencing requirements such as ramp order or ramp rate.

This device was designed with various power supply sequencing methods in mind to help prevent unintended

triggering of downstream devices. For more information regarding the power up glitch performance of the AXC

family of level translators, see the Glitch Free Power Sequencing With AXC Level Translators application report

11 Layout

11.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

• Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF

capacitor is recommended, but transient performance can be improved by having both 1 µF and 0.1 µF

capacitors in parallel as bypass capacitors.

• The high drive capability of this device creates fast edges into light loads so routing and load conditions

should be considered to prevent ringing.

11.2 Layout Example

Legend

Via to V_CCA

Via to V_CCB

Via to GND

Copper Traces

SN74AXC4T774RSV

0.1µF

16 15 14 13

CLK from SoC

CLK to Module

MOSI to Module

MISO from Module

SS to Module

^{MOSI from SoC}A2

MISO to SoC

^{SS from SoC}A4

图11-1. Layout Example

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

SN74AXC4T774-Q1

ZHCSKT5D –FEBRUARY 2020 –REVISED MARCH 2021

www.ti.com.cn

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

Texas Instruments, Implications of Slow or Floating CMOS Inputs application report

Texas Instruments, Power Sequencing for AXC Family of Devices application report

Texas Instruments, SN74AXC4T774 Evaluation Module Tool Folder

12.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

12.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

12.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

12.5 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

12.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: SN74AXC4T774-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Apr-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

CAXC4T774QBQBRQ1

CAXC4T774QRSVRQ1

SN74AXC4T774QPWRQ1

ACTIVE

WQFN

UQFN

BQB

RSV

3000 RoHS & Green

2000 RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

4T774Q

NIPDAUAG

NIPDAU

25ZR

TSSOP

4T774Q

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

1-Apr-2021

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF SN74AXC4T774-Q1 :

Catalog : SN74AXC4T774

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Jun-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

CAXC4T774QBQBRQ1

CAXC4T774QRSVRQ1

WQFN

UQFN

BQB

RSV

3000

2000

180.0

178.0

330.0

12.4

13.5

12.4

2.8

2.1

6.9

3.8

2.9

5.6

1.2

0.75

1.6

4.0

8.0

12.0

SN74AXC4T774QPWRQ1 TSSOP

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Jun-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CAXC4T774QBQBRQ1

CAXC4T774QRSVRQ1

SN74AXC4T774QPWRQ1

WQFN

UQFN

BQB

RSV

3000

2000

210.0

189.0

356.0

185.0

356.0

35.0

36.0

35.0

TSSOP

Pack Materials-Page 2

PACKAGE OUTLINE

RSV0016A

UQFN - 0.55 mm max height

ULTRA THIN QUAD FLATPACK - NO LEAD

1.85

1.75

PIN 1 INDEX AREA

2.65

2.55

0.55

0.45

SEATING PLANE

0.05 C

0.05

0.00

2X 1.2

SYMM

℄

(0.13) TYP

0.45

0.35

15X

SYMM

℄

2X 1.2

12X 0.4

0.25

16X

0.15

0.07

0.05

C A B

0.55

0.45

PIN 1 ID

(45° X 0.1)

4220314/C 02/2020

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

RSV0016A

UQFN - 0.55 mm max height

ULTRA THIN QUAD FLATPACK - NO LEAD

SYMM

℄

(0.7)

SEE SOLDER MASK

DETAIL

16X (0.2)

SYMM

℄

12X (0.4)

(2.4)

(R0.05) TYP

15X (0.6)

(1.6)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 25X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

METAL EDGE

EXPOSED METAL

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4220314/C 02/2020

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

RSV0016A

UQFN - 0.55 mm max height

ULTRA THIN QUAD FLATPACK - NO LEAD

(0.7)

16X (0.2)

SYMM

℄

12X (0.4)

(2.4)

(R0.05) TYP

15X (0.6)

SYMM

℄

(1.6)

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 25X

4220314/C 02/2020

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

PACKAGE OUTLINE

PW0016A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

SEATING

PLANE

6.6

6.2

TYP

0.1 C

PIN 1 INDEX AREA

14X 0.65

5.1

4.9

4.55

NOTE 3

0.30

16X

4.5

4.3

NOTE 4

1.2 MAX

0.19

0.1

C A B

(0.15) TYP

SEE DETAIL A

0.25

GAGE PLANE

0.15

0.05

0.75

0.50

0 -8

DETAIL A

TYPICAL

4220204/A 02/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-153.

www.ti.com

EXAMPLE BOARD LAYOUT

PW0016A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

SYMM

16X (1.5)

(R0.05) TYP

16X (0.45)

SYMM

14X (0.65)

(5.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

EXPOSED METAL

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

NON-SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

15.000

(PREFERRED)

SOLDER MASK DETAILS

4220204/A 02/2017

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

PW0016A

TSSOP - 1.2 mm max height

SMALL OUTLINE PACKAGE

16X (1.5)

SYMM

(R0.05) TYP

16X (0.45)

SYMM

14X (0.65)

(5.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE: 10X

4220204/A 02/2017

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

GENERIC PACKAGE VIEW

BQB 16

2.5 x 3.5, 0.5 mm pitch

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226161/A

www.ti.com

PACKAGE OUTLINE

WQFN - 0.8 mm max height

PLASTIC QUAD FLAT PACK-NO LEAD

BQB0016A

2.6

2.4

3.6

3.4

PIN 1 INDEX AREA

0.8

0.7

SEATING PLANE

0.08 C

1.1

0.9

0.05

0.00

(0.2) TYP

2X 0.5

10X 0.5

SYMM

2.5

2.1

1.9

0.30

0.18

16X

0.5

0.3

PIN 1 ID

(OPTIONAL)

SYMM

16X

0.1

C A B

0.05

4224640/A 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

WQFN - 0.8 mm max height

BQB0016A

PLASTIC QUAD FLAT PACK-NO LEAD

(2.3)

(1)

2X (0.5)

10X (0.5)

SYMM

(2.5)

(2)

(3.3)

(0.75)

16X (0.24)

16X (0.6)

(Ø0.2) VIA

TYP

SYMM

(R0.05) TYP

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

0.07 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

0.07 MIN

ALL AROUND

METAL

EXPOSED METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

EXPOSED METAL

NON-SOLDER MASK

SOLDER MASK

DEFINED

(PREFERRED)

4224640/A 11/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

WQFN - 0.8 mm max height

BQB0016A

PLASTIC QUAD FLAT PACK-NO LEAD

(2.3)

(0.95)

2X (0.5)

10X (0.5)

SYMM

(2.5)

(1.79) (3.3)

16X (0.24)

16X (0.6)

EXPOSED METAL

SYMM

(R0.05) TYP

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

85% PRINTED COVERAGE BY AREA

SCALE: 20X

4224640/A 11/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

CAXC4T774QRSVRQ1 [TI]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E