CC1125RHMR [TI]
Ultra-High Performance RF Narrowband Transceiver; 超高性能RF窄带收发器
| 型号： | CC1125RHMR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultra-High Performance RF Narrowband Transceiver |
| 文件： | 总36页 (文件大小：1475K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CC1125
Ultra-High Performance RF Narrowband Transceiver
Applications
Power Supply
Social Alarms
o
o
Wide supply voltage range (2.0 V – 3.6 V)
Low current consumption:
Narrowband ultra low power wireless systems with
channel spacing down to 4 kHz
170 / 315 / 433 / 868 / 915 / 920 / 950 MHz ISM/SRD
band systems
Wireless Metering and Wireless Smart Grid (AMR and
AMI)
-
-
-
RX: 2 mA in RX Sniff Mode
RX: 17 mA peak current in low power mode
RX: 26 mA peak current in high
performance mode
IEEE 802.15.4g systems
-
TX: 47 mA at +14 dBm
Home and building automation
Wireless alarm and security systems
Industrial monitoring and control
Wireless healthcare applications
Wireless sensor networks and Active RFID
Private mobile radio
o
Power down: 0.3 μA
Programmable output power up to +16 dBm with
0.4 dB step size
Automatic output power ramping
Configurable data rates: 0 to 200 kbps
Supported modulation formats: 2-FSK, 2-GFSK,
4-FSK, 4-GFSK, MSK, OOK
Regulations
WaveMatch: Advanced digital signal processing for
improved sync detect performance
Suitable for systems targeting compliance with:
RoHS compliant 5x5mm QFN 32 package
Europe
ETSI EN 300 220 cat. 1
ETSI EN 54-25
ETSI EN 300 113 and EN 301 166
FCC CFR47 Part 15, 24, 90, 101
ARIB RCR STD-T30, T-67, T-108
Peripherals and Support Functions
US
Enhanced Wake-On-Radio functionality for automatic
low-power receive polling
Japan
Separate 128-byte RX and TX FIFOs
Key Features
Includes functions for antenna diversity support
Support for re-transmissions
High performance single chip transceiver
o
o
o
Adjacent channel selectivity: 67 dB at 6.25 kHz
offset
Support for auto-acknowledge of received packets
TCXO support and control, also in power modes
Blocking performance: 104 dB at 10 MHz
offset
Automatic Clear Channel Assessment (CCA) for listen-
before-talk (LBT) systems
Excellent receiver sensitivity:
-129 dBm at 300 bps
-123 dBm at 1.2 kbps
-110 dBm at 50 kbps
Built in coding gain support for increased range and
robustness
Digital RSSI measurement
Support for seamless integration with the CC1190 for
increased range giving up to 3 dB improvement in
sensitivity and up to +27 dBm output power
o
Very low phase noise: -115 dBc/Hz at 10 kHz
offset
Suitable for systems targeting ETSI category 1
Temperature sensor
High spectral efficiency (9.6 kbps in 12.5 kHz channel
in compliance with FCC narrowbanding mandate)
Description
The CC1125 is
a fully integrated single-chip radio
transceiver designed for high performance at very low
power and low voltage operation in cost effective wireless
systems. All filters are integrated, removing the need for
costly external SAW and IF filters. The device is mainly
intended for the ISM (Industrial, Scientific and Medical)
and SRD (Short Range Device) frequency bands at 164-
192 MHz, 274-320 MHz, 410-480 MHz and 820-960 MHz.
VDD_GUARD
1
2
3
4
5
6
7
8
24
23
LPF1
LPF0
RESET_N
GPIO3
GPIO2
DVDD
DCPL
SI
22 AVDD_SYNTH1
21 DCPL_VCO
20 LNA_N
The CC1125 provides extensive hardware support for
packet handling, data buffering, burst transmissions, clear
channel assessment, link quality indication and Wake-On-
Radio. The CC1125 main operating parameters can be
controlled via an SPI interface. In a typical system, the
CC1125 will be used together with a microcontroller and
only few external passive components.
CC1125
19 LNA_P
TRX_SW
18
GND
GROUND PAD
SCLK
17 PA
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 1 of 25
CC1125
Table of Contents
1
ELECTRICAL SPECIFICATIONS ....................................................................................................3
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
ABSOLUTE MAX RATINGS ................................................................................................................3
GENERAL CHARACTERISTICS............................................................................................................3
RF CHARACTERISTICS ......................................................................................................................3
REGULATORY STANDARDS ...............................................................................................................4
CURRENT CONSUMPTION, STATIC MODES ........................................................................................5
CURRENT CONSUMPTION, TRANSMIT MODES...................................................................................5
CURRENT CONSUMPTION, RECEIVE MODES......................................................................................6
RECEIVE PARAMETERS .....................................................................................................................7
TRANSMIT PARAMETERS.................................................................................................................13
1.10 PLL PARAMETERS ..........................................................................................................................14
1.11 WAKE-UP AND TIMING ...................................................................................................................15
1.12 HIGH SPEED CRYSTAL OSCILLATOR ...............................................................................................15
1.13 HIGH SPEED CLOCK INPUT (TCXO) ...............................................................................................15
1.14 32 KHZ CLOCK INPUT .....................................................................................................................16
1.15 LOW SPEED RC OSCILLATOR..........................................................................................................16
1.16 I/O AND RESET................................................................................................................................16
1.17 TEMPERATURE SENSOR...................................................................................................................16
2
3
4
TYPICAL PERFORMANCE CURVES............................................................................................17
PIN CONFIGURATION.....................................................................................................................20
BLOCK DIAGRAM ............................................................................................................................21
4.1
4.2
4.3
4.4
4.5
4.6
4.7
FREQUENCY SYNTHESIZER .............................................................................................................21
RECEIVER .......................................................................................................................................21
TRANSMITTER.................................................................................................................................22
RADIO CONTROL AND USER INTERFACE.........................................................................................22
ENHANCED WAKE-ON-RADIO (EWOR) .........................................................................................22
SNIFF MODE....................................................................................................................................22
ANTENNA DIVERSITY .....................................................................................................................23
5
6
TYPICAL APPLICATION CIRCUIT...............................................................................................24
HISTORY .............................................................................................................................................25
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 2 of 25
CC1125
1
Electrical Specifications
All measurements performed on CC1120EM_868_915 rev.1.0.1, CC1120EM_955 rev.1.2.1, CC1120EM_420_470
rev.1.0.1 or CC1120EM_169 rev.1.2 (fxosc = 32 MHz), and CC1125EM_868_915 rev.1.1.0, CC1125EM_420_470 rev.1.1.0,
CC1125EM_169 rev.1.1.0, CC1125EM-Cat1-868 (fxosc = 40 MHz)
1.1
Absolute Max Ratings
Parameter
Min
-0.3
Typ
Max
3.9
Unit
V
Condition
Supply Voltage ("VDD")
Storage Temperature Range
-40
125
260
°C
According to IPC/JEDEC J-STD-
020
Solder Reflow Temperature
°C
ESD
2000
500
V
V
HBM
CDM
ESD
Moisture Sensitivity Level
Input RF level
MSL3
+10
dBm
V
VDD+0.3
max 3.9
Voltage on Any Digital Pin
-0.3
-0.3
Voltage on Analog Pins (including
“DCPL” pins)
2.0
V
1.2
General Characteristics
Parameter
Min
Typ
Max
3.6
85
Unit
Condition
Condition
Voltage Supply Range
Temperature Range
2.0
-40
V
°C
1.3
RF Characteristics
Parameter
Min
Typ
Max
960
480
Unit
MHz
MHz
820
410
Frequency Bands
Please see application note
SWRA398 for more information
274
164
320
192
MHz
MHz
Hz
30
15
6
In 820-960 MHz band
In 410-480 MHz band
In 164-192 MHz band
Packet mode
Frequency Resolution
Hz
Hz
0
0
200
100
kbps
kbps
bps
Datarate
Transparent mode
Datarate Step Size
1e-4
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 3 of 25
CC1125
1.4
Regulatory Standards
Performance Mode
Frequency Band
Suitable for compliance with
ARIB T-108
Comments
ARIB T-96
ETSI EN 300 220 category 1
ETSI EN 54-25
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
FCC PART 101
820 – 960 MHz
FCC PART 24 SUBMASK D
FCC PART 15.247
range extender such as the CC1190
FCC PART 15.249
FCC PART 90 MASK G
FCC PART 90 MASK J
ARIB T-67
ARIB RCR STD-30
High Performance
Mode
ETSI EN 301 166
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
range extender
ETSI EN 300 113
410 – 480 MHz
ETSI EN 300 220 category 1
FCC PART 90 MASK D
FCC PART 90 MASK E
FCC PART 90 MASK G
ETSI EN 300 220 category 1
ETSI EN 301 166
Performance also suitable for systems
targeting maximum allowed output
power in the respective bands, using a
range extender
ETSI EN 300 113
164 – 192 MHz
820 – 960 MHz
FCC PART 90 MASK C
FCC PART 90 MASK D
FCC PART 90 MASK E
ETSI EN 300 220 category 2
FCC PART 15.247
FCC PART 15.249
Low Power Mode
410 – 480 MHz
164 – 192 MHz
ETSI EN 300 220 category 2
ETSI EN 300 220 category 2
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 4 of 25
CC1125
1.5
Current Consumption, Static Modes
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
0.3
Max
Unit
µA
Condition
1
Power Down with Retention
0.5
µA
Low-power RC oscillator running
Crystal oscillator / TCXO disabled
XOFF Mode
IDLE Mode
170
µA
Clock running, system waiting with
no radio activity
1.3
mA
1.6
Current Consumption, Transmit Modes
950 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
37
Max
Unit
mA
mA
Condition
Condition
Condition
TX Current Consumption +10 dBm
TX Current Consumption 0 dBm
26
868/915/920 MHz bands (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
Parameter
Min
Typ
47
Max
Unit
mA
mA
TX Current Consumption +14 dBm
TX Current Consumption +10 dBm
38
434 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
Parameter
Min
Typ
51
Max
Unit
mA
mA
mA
TX Current Consumption +15 dBm
TX Current Consumption +14 dBm
TX Current Consumption +10 dBm
47
36
170 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 40 MHz if nothing else stated
Parameter
Min
Typ
56
Max
Unit
mA
mA
mA
Condition
TX Current Consumption +15 dBm
TX Current Consumption +14 dBm
TX Current Consumption +10 dBm
52
40
Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 5 of 25
CC1125
Parameter
Min
Typ
Max
Unit
Condition
TX Current Consumption +10 dBm
32
mA
1.7
Current Consumption, Receive Modes
High Performance Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
RX Wait for Sync
Using RX Sniff Mode, where the
receiver wakes up at regular
intervals to look for an incoming
packet
1.2 kbps, 4 Byte Preamble
38.4kbps, 4 Byte Preamble
RX Peak Current, fxosc = 40 MHz
433, 868/915/920 MHz bands
170 MHz band
2
mA
mA
13.4
Peak current consumption during
packet reception at the sensitivity
level
26
27
mA
mA
Average Current Consumption
50 kbps, 5 byte preamble, 32 kHz
RC oscillator used as sleep timer
15
uA
Check for Data Packet Every 1 Second
Using Wake on Radio
Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Peak current consumption during
packet reception at the sensitivity
level
RX Peak Current Low power RX mode
1.2 kbps
17
mA
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 6 of 25
CC1125
1.8
Receive Parameters1
General Receive Parameters (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
Parameter
Min
Typ
+10
Max
Unit
Condition
Saturation
dBm
Digital Channel Filter Programmable
Bandwidth
fxosc = 32 MHz
2.8
3.5
200
250
kHz
kHz
dBm
fxosc = 40 MHz
IIP3, Normal Mode
-14
-8
At maximum gain
Using 6 dB gain reduction in front
end
IIP3, High Linearity Mode
dBm
With carrier sense detection enabled
and assuming 4 byte preamble
±12
%
%
Datarate Offset Tolerance
±0.2
With carrier sense detection disabled
Spurious Emissions
Radiated emissions measured
according to ETSI EN 300 220, fc =
869.5 MHz
1 - 13 GHz (VCO leakage at 3.5 GHz)
30 MHz to 1 GHz
-56
dBm
dBm
< -57
Optimum Source Impedance
(Differential / Single Ended RX
Configurations)
868 / 915 / 920 MHz bands
433 MHz band
169 MHz band
60 + j60 / 30+j30
100 + j60 / 50+ j30
140 + j40 / 70 + j20
Ω
Ω
Ω
1 All RX measurements made at the antenna connector, to a bit error rate limit of 1%
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 7 of 25
CC1125
RX performance in 950 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-120
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz2
Sensitivity
50 kbps 2GFSK, DEV=25 kHz,
CHF=100 kHz
-107
-100
dBm
dBm
Note: Sensitivity can be improved if the
TX and RX matching networks are
separated.
200 kbps, DEV=83 kHz (outer
symbols), CHF=200 kHz, 4GFSK3
51
52
73
76
81
43
51
62
65
71
37
44
55
58
64
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
± 12.5 kHz (adjacent channel)
± 25 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
± 2 MHz
± 10 MHz
± 200 kHz (adjacent channel)
± 400 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
50 kbps 2GFSK, 200 kHz channel
separation, 25 kHz deviation, 100 kHz
channel filter
± 2 MHz
(Same modulation format as 802.15.4g
Mandatory Mode)
± 10 MHz
± 200 kHz (adjacent channel)
± 400 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
200 kbps 4GFSK, 83 kHz deviation (outer
symbols), 200 kHz channel filter, zero IF
± 2 MHz
± 10 MHz
2 DEV is short for deviation, CHF is short for Channel Filter Bandwidth
3 BT=0.5 is used in all GFSK measurements
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 8 of 25
CC1125
RX performance in 868/915/920 MHz bands (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
300 bps, DEV=1 kHz CHF=3.8 kHz
fxosc = 40 MHz
-129
dBm
-123
-114
dBm
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz
4.8 kbps OOK
Sensitivity
38.4 kbps, DEV=20 kHz CHF=100
kHz
-110
-110
-103
dBm
dBm
dBm
50 kbps 2GFSK, DEV=25 kHz,
CHF=100 kHz
200 kbps, DEV=83 kHz (outer
symbols), CHF=200 kHz, 4GFSK
62
63
83
87
91
58
58
78
82
86
58
77
106
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
± 6.25 kHz (adjacent channel)
+ 12.5 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
0.3 kbps 2FSK, 6.25 kHz channel
separation, 1 kHz deviation, 3.8 kHz
channel filter
± 2 MHz
fxosc = 40 MHz using TCXO
± 10 MHz
± 12.5 kHz (adjacent channel)
± 25 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
± 2 MHz
fxosc = 40 MHz using TCXO
± 10 MHz
Blocking and Selectivity
± 25 kHz (adjacent channel)
± 1 MHz
1.2 kbps 2FSK, 25 kHz channel
separation, 4 kHz deviation, 16 kHz
channel filter
± 2 MHz
fxosc = 40 MHz using TCXO
101
dB
± 10 MHz
Using external SAW filter for compliance
with ETSI category 1
42
43
62
66
74
43
50
61
65
74
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
+ 100 kHz (adjacent channel)
± 200 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
38.4 kbps 2GFSK, 100 kHz channel
separation, 20 kHz deviation, 100 kHz
channel filter
± 2 MHz
± 10 MHz
± 200 kHz (adjacent channel)
± 400 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
50 kbps 2GFSK, 200 kHz channel
separation, 25 kHz deviation, 100 kHz
channel filter
± 2 MHz
(Same modulation format as 802.15.4g
Mandatory Mode)
± 10 MHz
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 9 of 25
CC1125
Parameter
Min
Typ
36
44
55
59
67
Max
Unit
dB
dB
dB
dB
dB
Condition
± 200 kHz (adjacent channel)
± 400 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
200 kbps 4GFSK, 83 kHz deviation (outer
symbols), 200 kHz channel filter, zero IF
± 2 MHz
± 10 MHz
Image Rejection
1.2 kbps, DEV=4 kHz CHF=10 kHz,
image at -125 kHz
(Image compensation enabled)
fxosc = 40 MHz using TCXO
58
dB
RX performance in 434 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
300 bps, DEV=1 kHz CHF=3.8 kHz
fxosc = 40 MHz
-129
dBm
-123
-109
dBm
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz
Sensitivity
50 kbps 2GFSK, DEV=25 kHz,
CHF=100 kHz
-116
65
66
86
90
95
60
61
80
85
91
47
50
67
71
78
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.2 kbps, DEV=20 kHz CHF=50 kHz
+ 6.25 kHz (adjacent channel)
+ 12.5 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
0.3 kbps 2FSK, 6.25 kHz channel
separation, 1 kHz deviation, 3.8 kHz
channel filter
± 2 MHz
fxosc = 40 MHz using TCXO
± 10 MHz
± 12.5 kHz (adjacent channel)
± 25 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
± 2 MHz
fxosc = 40 MHz using TCXO
± 10 MHz
+ 100 kHz (adjacent channel)
± 200 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
38.4 kbps 2GFSK, 100 kHz channel
separation, 20 kHz deviation, 100 kHz
channel filter
± 2 MHz
± 10 MHz
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 10 of 25
CC1125
RX performance in 170 MHz band (High Performance Mode)
TA = 25°C, VDD = 3.0 V, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
300 bps, DEV=1 kHz CHF=3.8 kHz
fxosc = 40 MHz
-129
dBm
Sensitivity
-123
67
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.2 kbps, DEV=4 kHz CHF=10 kHz
± 6.25 kHz (adjacent channel)
+ 12.5 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
67
0.3 kbps 2FSK, 6.25 kHz channel
separation, 1 kHz deviation, 3.8 kHz
channel filter
88
101
104
63
- 2 MHz
fxosc = 40 MHz using TCXO
± 10 MHz
± 12.5 kHz (adjacent channel)
± 25 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
65
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
82
86
± 2 MHz
fxosc = 40 MHz using TCXO
93
- 10 MHz
Spurious Response Rejection
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
70
66
dB
dB
Image Rejection
1.2 kbps, DEV=4 kHz CHF=10 kHz,
image at -125 kHz
(Image compensation enabled)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 11 of 25
CC1125
RX performance in Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-111
dBm
1.2 kbps, DEV=4 kHz CHF=10 kHz
38.4 kbps, DEV=50 kHz CHF=100
kHz
Sensitivity
-99
-99
dBm
dBm
50 kbps 2GFSK, DEV=25 kHz,
CHF=100 kHz
46
46
73
78
79
43
45
71
74
75
37
43
58
62
64
43
52
60
64
65
+10
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dBm
± 12.5 kHz (adjacent channel)
± 25 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
1.2 kbps 2FSK, 12.5 kHz channel
separation, 4 kHz deviation, 10 kHz
channel filter
± 2 MHz
± 10 MHz
± 50 kHz (adjacent channel)
+ 100 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
1.2 kbps 2FSK, 50 kHz channel
separation, 20 kHz deviation, 50 kHz
channel filter
± 2 MHz
± 10 MHz
+ 100 kHz (adjacent channel)
+ 200 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
38.4 kbps 2GFSK, 100 kHz channel
separation, 20 kHz deviation, 100 kHz
channel filter
± 2 MHz
+ 10 MHz
+ 200 kHz (adjacent channel)
+ 400 kHz (alternate channel)
± 1 MHz
Blocking and Selectivity
50 kbps 2GFSK, 200 kHz channel
separation, 25 kHz deviation, 100 kHz
channel filter
± 2 MHz
(Same modulation format as 802.15.4g
Mandatory Mode)
± 10 MHz
Saturation
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 12 of 25
CC1125
1.9
Transmit Parameters
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
+12
Max
Unit
dBm
dBm
dBm
Condition
At 950 MHz
At 915/920 MHz
+14
+15
At 915/920 MHz with VDD = 3.6 V
+15
+16
dBm
dBm
At 868 MHz
At 868 MHz with VDD = 3.6 V
Max Output Power
+15
+16
dBm
dBm
At 433 MHz
At 433 MHz with VDD = 3.6 V
+15
+16
-11
-40
0.4
dBm
dBm
dBm
dBm
dB
At 170 MHz
At 170 MHz with VDD = 3.6 V
Within fine step size range
Within coarse step size range
Within fine step size range
Min Output Power
Output Power Step Size
4-GFSK 9.6 kbps in 12.5 kHz
channel, measured in 100 Hz
bandwidth at 434 MHz (FCC Part 90
Mask D compliant)
-75
-58
dBc
dBc
Adjacent Channel Power
4-GFSK 9.6 kbps in 12.5 kHz
channel, measured in 8.75 kHz
bandwidth (ETSI 300 220 compliant)
2-GFSK 2.4 kbps in 12.5 kHz
channel, 1.2 kHz deviation
-61
dBc
Spurious Emissions
(Not including harmonics)
Harmonics
< -60
dBm
Transmission at +14 dBm (or
maximum allowed in applicable band
where this is less than +14 dBm)
using TI reference design
2nd Harm, 170 MHz
3rd Harm, 170 MHz
2nd Harm, 433 MHz
3rd Harm, 433 MHz
2nd Harm, 450 MHz
3rd Harm, 450 MHz
2nd Harm, 868 MHz
3rd Harm, 868 MHz
2nd Harm, 915 MHz
3rd Harm, 915 MHz
4th Harm, 915 MHz
2nd Harm, 950 MHz
3rd Harm, 950 MHz
-39
-58
-56
-51
-60
-45
-40
-42
56
52
60
-58
-42
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBm
dBuV/m
dBuV/m
dBuV/m
dBm
Emissions measured according to
ARIB T-96 in 950 MHz band, ETSI
EN 300-220 in 170, 433 and 868
MHz bands and FCC part 15.247 in
450 and 915 MHz band
Fourth harmonic in 915 MHz band
will require extra filtering to meet
FCC requirements if transmitting for
long intervals (>50 ms periods)
dBm
Optimum Load Impedance
35 + j35
55 + j25
80 + j0
Ω
Ω
Ω
868 / 915 / 920 MHz bands
433 MHz band
169 MHz band
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 13 of 25
CC1125
1.10 PLL Parameters
High Performance Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 40 MHz using TCXO if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
-100
-103
-123
-101
-102
-124
-107
-110
-130
-115
-115
-135
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
Phase Noise in 950 MHz Band
fxosc = 32 MHz
Phase Noise in 868/915/920 MHz Bands
Phase Noise in 433 MHz Band
Phase Noise in 170 MHz Band
Low Power Mode
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
-90
Max
Unit
Condition
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
± 10 kHz offset
± 100 kHz offset
± 1 MHz offset
Phase Noise in 950 MHz Band
-92
-124
-95
Phase Noise in 868/915/920 MHz Bands
Phase Noise in 433 MHz Band
-95
-124
-98
-102
-129
-106
-110
-136
Phase Noise in 170 MHz Band
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 14 of 25
CC1125
1.11 Wake-up and Timing
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz, fxosc = 32 MHz if nothing else stated
Parameter
Min
Typ
0.4
166
461
50
Max
Unit
ms
µs
Condition
Powerdown to IDLE
Depends on crystal
Calibration disabled
Calibration enabled
IDLE to RX/TX
µs
RX/TX Turnaround
µs
Calibrate when leaving RX/TX
enabled
296
µs
RX/TX to IDLE time
Calibrate when leaving RX/TX
disabled
0
µs
Frequency Synthesizer Calibration
0.4
ms
When using SCAL strobe
Required for RF front end gain
settling only. Digital demodulation
does not require preamble for
settling
Minimum Required Number of Preamble
Bytes
0.5
bytes
Time From Start RX Until Valid RSSI
4.6
0.3
ms
ms
12.5 kHz channels
Including gain settling (function of channel
bandwidth. Programmable for trade-off
between speed and accuracy)
200 kHz channels
1.12 High Speed Crystal Oscillator
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Note: It is recommended that the
crystal frequency is chosen so that
the RF channel(s) are >1 MHz away
from multiples of XOSC in TX and
XOSC/2 in RX
Crystal Frequency
32
44
MHz
Load Capacitance (CL)
ESR
10
<50
0.4
pF
Ω
Start-up Time
ms
Depends on crystal
1.13 High Speed Clock Input (TCXO)
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
32
Typ
Max
Unit
MHz
V
Condition
Clock Frequency
44
Clock input amplitude (peak-to-peak)
>0.8
Should not exceed supply voltage
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 15 of 25
CC1125
1.14 32 kHz Clock Input
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
kHz
V
Condition
Clock Frequency
32
32 kHz Clock Input Pin Input High Voltage
32 kHz Clock Input Pin Input Low Voltage
0.8×VDD
0.2×VDD
V
1.15 Low Speed RC Oscillator
TA = 25°C, VDD = 3.0 V if nothing else stated.
Parameter
Min
Typ
Max
Unit
Condition
After Calibration (calibrated against
the high speed XOSC)
Frequency
32/40
kHz
Relative to frequency reference (i.e.
32 MHz crystal or TCXO)
Frequency Accuracy After Calibration
Initial Calibration Time
±0.1
1.6
%
ms
1.16 I/O and Reset
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
Typ
Max
Unit
Condition
Logic Input High Voltage
Logic Input Low Voltage
Logic Output High Voltage
Logic Output Low Voltage
Power-on Reset Threshold
0.8×VDD
V
V
V
V
V
0.2×VDD
0.2×VDD
0.8×VDD
At 4 mA output load or less
Voltage on DVDD pin
1.3
1.17 Temperature Sensor
TA = 25°C, VDD = 3.0 V if nothing else stated
Parameter
Min
-40
Typ
Max
Unit
Condition
Temperature Sensor Range
85
°C
Change in sensor output voltage vs
change in temperature
Temperature Coefficient
Typical Output Voltage
VDD Coefficient
2.66
794
mV / °C
mV
Typical sensor output voltage at
TA = 25°C, VDD = 3.0 V
Change in sensor output voltage vs
change in VDD
1.17
mV / V
The CC1125 can be configured to provide a voltage proportional to temperature on GPIO1. Using
the information above, the temperature can be estimated by measuring this voltage. Please refer
to the CC1125 user guide for more information.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 16 of 25
CC1125
2
Typical Performance Curves
TA = 25°C, VDD = 3.0 V, fc = 869.5 MHz if nothing else stated
All measurements performed on CC1120EM_868_915 rev.1.0.1, CC1120EM_955 rev.1.2.1, CC1120EM_420_470
rev.1.0.1 or CC1120EM_169 rev.1.2 (fxosc = 32 MHz), and CC1125EM_868_915 rev.1.1.0, CC1125EM_420_470 rev.1.1.0,
CC1125EM_169 rev.1.1.0, CC1125EM-Cat1-868 (fxosc = 40 MHz)
Note that the "output power vs load impedance" plot was measured at the 50 Ω antenna connector
Sensitivity vs Temperature
Sensitivity vs Voltage
1.2kbps, 4kHz deviation, 10kHz ch. filter bw
1.2kbps, 4kHz deviation, 10kHz ch. filter bw
-120
-121
-122
-123
-124
-125
-120
-121
-122
-123
-124
-40
0
40
Temperature (ºC)
80
2
2.5
3
3.5
Supply Voltage (V)
Sync Word Sensitivity vs Sync Word Detect Threshold
1.2kbps, 4kHz deviation, 10kHz ch. filter bw
RX Current vs Input Level
1.2kbps, 4kHz deviation, 10kHz ch. filter bw
-114
-116
-118
-120
-122
-124
-126
-128
-130
23.2
22.8
22.4
22
21.6
21.2
20.8
3
5
7
9
11
13
15
17
-130
-80
-30
20
Sync Word Detect Threshold
Input Level (dBm)
Selectivity vs offset frequency (25 kHz channel spacing)
1.2 kbps, 4 kHz deviation, 16 kHz ch. filter bw
Wanted channel at 869.3 MHz (-104 dBm)
Selectivity vs offset frequency (25 kHz channel spacing)
1.2 kbps, 4 kHz deviation, 16 kHz ch. filter bw
Wanted channel at 869.3 MHz (-104 dBm)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
860 862
864 866 868 870
872 874 876 878
868.6
868.8
869
869.2
869.4
869.6
869.8
870
Frequency (MHz)
Frequency (MHz)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 17 of 25
CC1125
Automatic Image Cancellation
Wanted channel at 869.3 MHz (-104 dBm),
image at 869.17 MHz
RSSI vs Input Level
1.2kbps, 4kHz deviation, 10kHz ch. filter bw
100
80
60
40
20
0
70
60
50
40
30
20
10
0
iqic enabled
iqic disabled
-20
-40
-150
-100
-50
0
869.05 869.1 869.15 869.2 869.25 869.3 869.35
Frequency (MHz)
Input Level (dBm)
Output Power vs Voltage
Max Setting, 170 MHz
Output Power at 868MHz
vs PA power setting
18
16
14
12
10
8
20
10
0
-10
-20
-30
-40
-50
6
2
2.5
3
3.5
77
73
67
63
57
53
47
43
7F
6F
5F
4F
7B
6B
5B
4B
Supply Voltage (V)
PA power setting
Output Power vs Temperature
Max Setting, 170 MHz, 3.6V
TX Current at 868MHz
vs PA power setting
17
16.5
16
60
50
40
30
20
10
0
15.5
15
-40
0
40
Temperature (ºC)
80
77
73
67
63
57
53
47
43
7F
6F
5F
4F
7B
6B
5B
4B
PA power setting
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 18 of 25
CC1125
GPIO Output High Voltage vs Current Being Sourced
GPIO Output Low Voltage vs Current Being Sinked
3.1
2.9
2.7
2.5
2.3
2.1
1.9
1.7
1.5
1400
1200
1000
800
600
400
200
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Current (mA)
Current (mA)
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 19 of 25
CC1125
3
Pin Configuration
The CC1125 pin-out is shown in the table below.
Pin #
Pin name
Type / direction
Description
1
VDD_GUARD
RESET_N
GPIO3
Power
2.0 - 3.6 V VDD
2
Digital Input
Digital Input/Output
Digital Input/Output
Power
Asynchronous, active-low digital reset
General purpose IO
3
4
GPIO2
General purpose IO
5
DVDD
2.0 - 3.6 VDD to internal digital regulator
Digital regulator output to external decoupling capacitor
Serial data in
6
DCPL
Power
7
SI
Digital Input
Digital Input
Digital Input/Output
Digital Input/Output
Digital Input
Power
8
SCLK
Serial data clock
9
SO(GPIO1)
GPIO0
Serial data out (General purpose IO)
General purpose IO
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CSn
Active-low chip-select
DVDD
2.0 - 3.6 V VDD
AVDD_IF
RBIAS
Power
2.0 - 3.6 V VDD
Analog
External high precision R
2.0 - 3.6 V VDD
AVDD_RF
N.C.
Power
Not Connected
PA
Analog
Analog
Analog
Analog
Power
Power
Analog
Analog
Single-ended TX output
TX/RX switch
TRX_SW
LNA_P
LNA_N
DCPL_VCO
AVDD_SYNTH1
LPF0
Differential RX input
Differential RX input
Pin for external decoupling of VCO supply regulator
2.0 - 3.6 V VDD
External loopfilter components
External loopfilter components
2.0 - 3.6 V VDD
LPF1
AVDD_PFD_CHP Power
DCPL_PFD_CHP Power
Pin for external decoupling of PFD and CHP regulator
2.0 - 3.6 V VDD
AVDD_SYNTH2
AVDD_XOSC
DCPL_XOSC
XOSC_Q1
Power
Power
Power
Analog
2.0 - 3.6 V VDD
Pin for external decoupling of XOSC supply regulator
Crystal oscillator pin 1 (must be grounded if a TCXO or other
external clock connected to EXT_XOSC is used)
31
32
-
XOSC_Q2
EXT_XOSC
GND
Analog
Crystal oscillator pin 2 (must be left floating if a TCXO or other
external clock connected to EXT_XOSC is used)
Digital Input
Ground Pad
Pin for external XOSC input (must be grounded if a regular
XOSC connected to XOSC_Q1 and XOSC_Q2 is used)
The ground pad must be connected to a solid ground plane
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 20 of 25
CC1125
4
Block Diagram
A system block diagram of CC1125 is shown Figure 4.1.
CC112X
MARC
SPI
CSn (chip select)
Ultra low power 32kHz
auto-calibrated RC oscillator
4k byte
ROM
Main Radio Control Unit
Ultra low power 16 bit
MCU
(optional 32kHz
clock intput)
Serial configuration
and data interface
Power on reset
SI (serial input)
Interrupt and
IO handler
System bus
SO (serial output)
SCLK (serial clock)
(optional GPIO0-3)
256 byte
FIFO RAM
buffer
eWOR
Enhanced ultra low power
Wake On Radio timer
Packet handler
and FIFO control
Battery sensor /
temp sensor
Configuration and
status registers
RF and DSP frontend
Output power ramping and OOK / ASK modulation
(optional autodetected
external XOSC / TCXO)
I
14dBm high
efficiency PA
XOSC_Q1
XOSC_Q2
PA
Fully integrated Fractional-N
Frequency Synthesizer
Data interface with
signal chain access
XOSC
Q
90dB dynamic
range ADC
ifamp
ifamp
LNA_P
LNA_N
(optional bit clock)
Highly flexible FSK / OOK
demodulator
High linearity
LNA
(optional low jitter serial
data output for legacy
protocols)
90dB dynamic
range ADC
AGC
Automatic Gain Control, 60dB VGA range
RSSI measurements and carrier sense detection
(optional GPIO for
antenna diversity)
Figure 4.1 : System Block Diagram
4.1
Frequency Synthesizer
At the heart of CC1125 there is a fully integrated, fractional-N, ultra high performance frequency
synthesizer. The frequency synthesizer is designed for excellent phase noise performance,
providing very high selectivity and blocking performance. The system is designed to comply with
the most stringent regulatory spectral masks at maximum transmit power.
Either a crystal can be connected to XOSC_Q1 and XOSC_Q2, or a TCXO can be connected to
the EXT_XOSC input. The oscillator generates the reference frequency for the synthesizer, as
well as clocks for the ADC and the digital part. To reduce system cost, CC1125 has high accuracy
frequency estimation and compensation registers to measure and compensate for crystal
inaccuracies, enabling the use of lower cost crystals. If a TCXO is used, the CC1125 will
automatically turn the TCXO on and off when needed to support low power modes and Wake-On-
Radio operation.
4.2
Receiver
CC1125 features a highly flexible receiver. The received RF signal is amplified by the low-noise
amplifier (LNA) and down-converted in quadrature (I and Q) to the intermediate frequency (IF). At
IF, the I/Q signals are digitized by the high dynamic range ADCs.
An advanced Automatic Gain Control (AGC) unit adjusts the front end gain, and enables the
CC1125 to receive both strong and weak signals, even in the presence of strong interferers. High
attenuation channel and data filtering enable reception with strong neighbor channel interferers.
The I/Q signal is converted to a phase / magnitude signal to support both FSK and OOK
modulation schemes.
A sophisticated pattern recognition algorithm locks onto the synchronization word without need for
preamble settling bytes. Receiver settling time is therefore reduced to the settling time of the
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 21 of 25
CC1125
AGC, typically 4 bits. The advanced pattern recognition also greatly reduces the problem of false
sync triggering on noise, further reducing power consumption and improving sensitivity and
reliability. The pattern recognition logic can also be used as a high performance preamble
detector to reliably detect a valid preamble in the channel.
A novel I/Q compensation algorithm removes any problem of I/Q mismatch and hence avoids time
consuming and costly I/Q / image calibration steps in production or in the field.
4.3
Transmitter
The CC1125 transmitter is based on direct synthesis of the RF frequency (in-loop modulation). To
achieve effective spectrum usage, CC1125 has extensive data filtering and shaping in TX to support
high throughput data communication in narrowband channels. The modulator also controls power
ramping to remove issues such as spectral splattering when driving external high power RF
amplifiers.
4.4
Radio Control and User Interface
The CC1125 digital control system is built around MARC (Main Radio Control) implemented using
an internal high performance 16 bit ultra low power processor. MARC handles power modes,
radio sequencing and protocol timing.
A 4-wire SPI serial interface is used for configuration and data buffer access. The digital
baseband includes support for channel configuration, packet handling, and data buffering. The
host MCU can stay in power down until a valid RF packet has been received, and then burst read
the data, greatly reducing the power consumption and computing power required from the host
MCU.
The CC1125 radio control and user interface is based on the widely used CC1101 transceiver to
enable easy SW transition between the two platforms. The command strobes and the main radio
states are the same for the two platforms.
For legacy formats CC1125 also has support for two serial modes. In synchronous serial mode
CC1125 performs bit synchronization and provides the MCU with a bit clock with associated data. In
transparent mode CC1125 outputs the digital baseband signal using a digital interpolation filter to
eliminate jitter introduced by digital filtering and demodulation.
4.5
Enhanced Wake-On-Radio (eWOR)
eWOR, using a flexible integrated sleep timer, enables automatic receiver polling with no
intervention from the MCU. The CC1125 will enter RX, listen and return to sleep if a valid RF packet
is not received. The sleep interval and duty cycle can be configured to make a trade-off between
network latency and power consumption. Incoming messages are time-stamped to simplify timer
re-synchronization.
The eWOR timer runs off an ultra low power 32 kHz RC oscillator. To improve timing accuracy,
the RC oscillator can be automatically calibrated to the RF crystal in configurable intervals.
4.6
Sniff Mode
The CC1125 supports very quick start up times, and requires very few preamble bits. Sniff Mode
uses this to dramatically reduce the current consumption while the receiver is waiting for data.
Since the CC1125 is able to wake up and settle much faster than the length of most preambles, it is
not required to be in RX continuously while waiting for a packet to arrive. Instead, the enhanced
wake-on-radio feature can be used to put the device into sleep periodically. By setting an
appropriate sleep time, the CC1125 will be able to wake up and receive the packet when it arrives
with no performance loss. This removes the need for accurate timing synchronization between
transmitter and receiver, and allows the user to trade off current consumption between the
transmitter and receiver.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 22 of 25
CC1125
4.7
Antenna Diversity
Antenna diversity can increase performance in a multi-path environment. An external antenna
switch is required. The switch can be automatically controlled by CC1125 using one of the GPIO
pins (also support for differential output control signal typically used in RF switches).
If antenna diversity is enabled, the GPIO will alternate between states until a valid RF input signal
is detected. An optional acknowledge packet can be transmitted without changing GPIO state.
An incoming RF signal can be validated by received signal strength, by using the automatic
preamble detector, or a combination of the two. Using the preamble detector will make a more
robust system and avoid the need to set a defined signal strength threshold, as this threshold will
set the sensitivity limit of the system.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 23 of 25
CC1125
5
Typical Application Circuit
Very few external components are required for the operation of CC1125. A typical application circuit
is shown below. Note that it does not show how the board layout should be done, which will
greatly influence the RF performance of CC1125.
This section is meant as an introduction only. Note that decoupling capacitors for power pins are
not shown in the figure below.
Optional Voltage Regulator
for supply noise isolation
Optional
ext_vdd
in
vdd
TPS799xxout
40 MHz
crystal
XOSC/
TCXO
(optional control pin
from CC1125)
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
VDD_GUARD
RESET_N
GPIO3
GPIO2
DVDD
LPF1
LPF0
vdd
vdd
AVDD_SYNTH1
DCPL_VCO
LNA_N
vdd
CC1125
DCPL
LNA_P
SI
TRX_SW
PA
SCLK
MCU connection
SPI interface and
optional gpio pins
Figure 5.1 : Typical Application Circuit
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 24 of 25
CC1125
6
History
Revision
Date
Description / Changes
SWRS120B
March 2013
Added ARIB T-108 to list of regulations
Added ETSI EN 301 166 to list of regulations
Added optimum source / load impedance
Added missing unit "dBm" in output power section
Added temperature sensor data
Clarified how the typical performance curves have been measured
Corrected wrong deviation for 38.4 kbps sensitivity (was 50 kHz, corrected to 20 kHz)
Pin CS_N renamed to CSn to comply with naming convention used in the user guide
Updated typical frequency of low frequency RCOSC to show that it scales with the
reference it is calibrated against (i.e. the high speed XOSC)
Updated modulation format information in image rejection sections
Stated which ETSI EN 300 220 receiver category that is suitable for low power mode
Clarified under max ratings that I/O voltages should not exceed device supply voltage by
more than 0.3 V
Various minor spelling errors corrected
Initial release
SWRS120
March 2012
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty. Production processing does
not necessarily include testing of all parameters.
SWRS120B – REVISED MARCH 2013
Page 25 of 25
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2013
PACKAGING INFORMATION
Orderable Device
CC1125RHBR
CC1125RHBT
CC1125RHMR
CC1125RHMT
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
QFN
QFN
QFN
QFN
RHB
32
32
32
32
3000
Green (RoHS CU NIPDAUAG Level-3-260C-168 HR
& no Sb/Br)
CC1125
ACTIVE
NRND
NRND
RHB
RHM
RHM
250
3000
250
Green (RoHS CU NIPDAUAG Level-3-260C-168 HR
& no Sb/Br)
-40 to 85
CC1125
CC1125
CC1125
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2013
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CC1125RHBR
CC1125RHBT
CC1125RHMR
QFN
QFN
QFN
RHB
RHB
RHM
32
32
32
3000
250
330.0
180.0
330.0
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
5.3
1.5
1.5
1.5
8.0
8.0
8.0
12.0
12.0
12.0
Q2
Q2
Q2
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-May-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CC1125RHBR
CC1125RHBT
CC1125RHMR
QFN
QFN
QFN
RHB
RHB
RHM
32
32
32
3000
250
338.1
210.0
338.1
338.1
185.0
338.1
20.6
35.0
20.6
3000
Pack Materials-Page 2
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