CC2538NF53RTQR [TI]

具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU | RTQ | 56 | -40 to 125;


型号：	CC2538NF53RTQR
厂家：	TEXAS INSTRUMENTS
描述：	具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU \| RTQ \| 56 \| -40 to 125 无线电信电信集成电路闪存
文件：	总34页 (文件大小：1806K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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CC2538

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

CC2538 适用于 2.4GHz IEEE 802.15.4、6LoWPAN 和 ZigBee^®应用

的强大无线微控制器片上系统

1 器件概述

1.1 特性

• 微控制器

• 外设

– µDMA

– 强大的 ARM^®Cortex^®-M3，具有代码预提取功能

– 高达 32MHz 的时钟速度

– 4 个通用定时器

（每个定时器为 32 位或 2 x 16 位）

– 32 位 32kHz 睡眠定时器

– 512KB、256KB 或 128KB 系统内可编程闪存

– 支持片上无线升级 (OTA)

– 具有 8 通道和可配置分辨率的 12 位模数转换器

– 支持双 Zigbee 应用配置

– 高达 32KB 的 RAM（其中 16kB 在所有功率模式

下具有保持功能）

(ADC)

– 电池监视器和温度传感器

– USB 2.0 全速器件 (12Mbps)

– 2 个串行外设接口 (SPI)

– 2 个异步收发器 (UART)

– I2C

– cJTAG 和 JTAG 调试

• 射频 (RF)

– 2.4GHz IEEE 802.15.4 兼容 RF 收发器

– -97dBm 的出色接收器灵敏度

– 在 44dB 的 ACR 干扰情况下可靠耐用

– 高达 7dBm 的可编程输出功率

• 安全硬件加速

– 32 个通用 I/O 引脚

(28 × 4mA，4 × 20mA)

– 安全装置定时器

• 布局布线

– 面向未来的 AES-128/256，安全散列算法

(SHA)2 硬件加密引擎

– 8mm × 8mm QFN56 封装

– 可在高达 125°C 的工业温度下运行的

耐用器件

– 可选 - 用于安全密钥交换的 ECC-128/256，RSA

硬件加速引擎

– 极少的外部组件

– 异步网络只需一个单晶振

• 开发工具

– 用于实现底层 MAC 功能性的无线命令选通处理

器和数据包操作处理器

• 低功率

– 有源模式 RX（CPU 闲置）：20mA

– 0dBm 时的有源模式 TX（CPU 闲置）：24mA

– 功率模式 1（4μs 唤醒时间，32KB RAM 保持，

完全寄存器保持）：0.6mA

– 功率模式 2（休眠定时器运行，16KB RAM 保

持，配置寄存器保持）：1.3μA

– CC2538 开发套件

– 经美国联邦通信委员会 (FCC) 和欧洲电信标准协

会 (ETSI) 规则认证的参考设计

– 为 Contiki/6LoWPAN、智能电网、照明和

Zigbee 家庭自动化提供完整软件支持，其中包括

示例应用和参考设计

– Code Composer Studio™

– IAR Embedded Workbench^®用于 ARM

– SmartRF™Studio

– 功率模式 3（外部中断，16KB RAM 保持，配置

寄存器保持）：0.4μA

– 宽电源电压范围（2V 至 3.6V）

– SmartRF 闪存编程器

1.2 应用

•

智能电网和家庭局域网

家庭和楼宇自动化

智能照明系统

•

无线传感器网络

物联网

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SWRS096

CC2538

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

www.ti.com.cn

1.3 说明

CC2538xFnn 是适用于高性能 ZigBee 应用的理想无线微控制器片上系统 (SoC)。该器件包含基于 ARM

Cortex M3 的强大的 MCU 系统，具有高达 32KB 的片上 RAM 和高达 512KB 的片上闪存以及可靠的 IEEE

802.15.4 射频功能。这使得该器件能够处理涉及安全性、要求严格的应用程序以及无线下载的复杂网络协

议栈。32 个通用输入和输出 (GPIO) 以及串行外设接口可实现到电路板其它部分的简单连接。强大的硬件安

全加速器可在 CPU 处理应用任务的同时实现快速且高效的认证和加密。具有保持功能的多个低功耗模式可

实现从休眠状态快速唤醒并且显著降低执行周期任务时的能耗。为了实现顺利平稳开发，CC2538xFnn 包括

一个强大的调试系统和一个综合性驱动器库。为了减少应用闪存封装尺寸，CC2538xFnn ROM 包含一个实

用功能库和一个串行引导加载器。CC2538 与 TI 免费提供的稳健且全面的 Z-Stack 软件解决方案搭配使

用，可提供市场上功能最强大、最稳定的 ZigBee 解决方案。

器件信息⁽¹⁾

封装

器件型号

封装尺寸

CC2538RTQ

(1) 更多信息请参见节 8，机械封装和可订购产品信息。

RTQ (56)

8.00mm x 8.00mm

器件概述

CC2538

www.ti.com.cn

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

1.4 功能方框图

JTAG

SWO

NVIC

MPU

ARM

Cortex^TMœ M3

128KB/256KB/512KB Flash

32 MHz

16KB Retention SRAM

16KB Standard SRAM

4KB ROM

cJTAG/JTAG

ICEPick

2 UARTS

2 SSI/SPI

Systick Timer

Timer/PWM/CCP

4x (32 bit or 2x16 bit)

USB Full-Speed

Watchdog Timer

32 GPIO

Device

I2C

32-ch DMA

AES-128/256

SHA-256

32-MHz XTAL

and 16-MHz RC Oscillator

ECC

RSA-2048

32-kHz XTAL

and 32-kHz RC Oscillator

32-bit Sleep Timer

Packet-Handling

Processor

Command-Strobe

Processor

LDO Regulator

Power-on Reset and Brown-

Out Detection

MAC Timer

RF Chain

Low-Power

Comparator

Demod

8-ch 12-bit ADC

Modulator

With Temp Sensor

图 1-1. CC2538 方框图

器件概述

CC2538

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

www.ti.com.cn

内容

器件概述.................................................... 1

1.1 特性 ................................................... 1

1.2 应用 ................................................... 1

1.3 说明 ................................................... 2

1.4 功能方框图............................................ 3

修订历史记录............................................... 5

Device Comparison ..................................... 6

Terminal Configuration and Functions.............. 7

4.1 Signal Descriptions ................................... 7

Specifications ............................................ 9

5.1 Absolute Maximum Ratings .......................... 9

5.2 ESD Ratings.......................................... 9

5.3 Recommended Operating Conditions ................ 9

5.4 Electrical Characteristics............................ 10

5.5 General Characteristics ............................. 11

5.6 RF Receive Section................................. 12

5.7 RF Transmit Section ................................ 13

5.8 32-MHz Crystal Oscillator ........................... 14

5.9 32.768-kHz Crystal Oscillator ....................... 14

5.10 32-kHz RC Oscillator................................ 14

5.11 16-MHz RC Oscillator ............................... 15

5.12 RSSI/CCA Characteristics .......................... 15

5.13 FREQEST Characteristics .......................... 15

5.14 Frequency Synthesizer Characteristics ............. 15

5.15 Analog Temperature Sensor ........................ 15

5.16 ADC Characteristics................................. 16

5.17 Control Input AC Characteristics.................... 17

5.18 DC Characteristics .................................. 17

5.19 USB Interface DC Characteristics .................. 17

5.20 Thermal Resistance Characteristics for RTQ

Package ............................................. 18

Applications, Implementation, and Layout........ 19

6.1 Input, Output Matching.............................. 20

6.2 Crystal ............................................... 20

6.3

On-Chip 1.8-V Voltage-Regulator Decoupling ...... 21

Power-Supply Decoupling and Filtering............. 21

6.4

6.5 References .......................................... 21

器件和文档支持 .......................................... 22

7.1 器件支持 ............................................ 22

7.2 文档支持............................................. 23

7.3 其他信息............................................. 23

7.4 商标.................................................. 24

7.5 静电放电警告 ........................................ 24

7.6 出口管制提示 ........................................ 24

7.7 Glossary ............................................. 24

机械、封装和可订购信息 ............................... 25

8.1 封装信息............................................. 25

内容

CC2538

www.ti.com.cn

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

2 修订历史记录

Changes from Revision C (February 2015) to Revision D

Page

•

Changed Figure 6-1 CC2538xFnn Application Circuit ......................................................................... 19

Changes from Revision B (September 2014) to Revision C

Page

•

已更改 “ZigBee Smart Energy 1.x 和 ZigBee Light Link”至智能电网和照明 .................................................. 1

已添加 “8 通道”至“12 位 ADC” ...................................................................................................... 3

Added ESD Ratings table. .......................................................................................................... 9

修订历史记录

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CC2538

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

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3 Device Comparison

Table 3-1. CC2538 Family of Devices Available

DEVICE

FLASH (KB)

512

RAM (KB)

SECURITY HW AES/SHA SECURITY HW ECC/RSA

CC2538SF53

CC2538SF23

CC2538NF53

CC2538NF23

CC2538NF11

Yes

256

512

256

128

Device Comparison

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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

4 Terminal Configuration and Functions

DGND_USB

USB_P

USB_N

DVDD_USB

PB0

42 R_BIAS

AVDD

40 AVDD

39 AVDD

RF_N

PC7

37 RF_P

36 AVDD

PC6

PC5

XOSC32M_Q2

PC4

34 XOSC32M_Q1

33 AVDD

DVDD 10

PC3 11

PC2 12

PC1 13

PC0 14

32 DCOUPL2

31 PD5

30 PD4

29 PD3

P0142-01

Connect the exposed ground pad to a solid ground plane, as this is the ground connection for the chip.

Figure 4-1. 56-Pin RTQ Package (Top View)

4.1 Signal Descriptions

Table 4-1. Signal Descriptions

NAME

NUMBER

PIN TYPE

DESCRIPTION

2-V–3.6-V analog power-supply connection

1.8-V regulated digital-supply decoupling capacitor

AVDD

33, 36, 39, 40, 41 Power (analog)

AVDD_GUARD

DCOUPL1

Power (analog)

Power (digital)

1.8-V regulated digital-supply decoupling capacitor. Short this pin to

pin 56.

DCOUPL2

Power (digital)

DGND_USB

DVDD

Ground (USB pads)

Power (digital)

Power (USB pads)

Digital I/O

USB ground

10, 15, 24, 55

2-V–3.6-V digital power-supply connection

3.3-V USB power-supply connection

JTAG TCK

DVDD_USB

JTAG_TCK

JTAG_TMS

PA0

Digital I/O

JTAG TMS

Digital/analog I/O

GPIO port A pin 0. ROM bootloader UART RXD

GPIO port A pin 1. ROM bootloader UART TXD

GPIO port A pin 2. ROM bootloader SSI CLK

PA1

PA2

Terminal Configuration and Functions

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Table 4-1. Signal Descriptions (continued)

NAME

NUMBER

PIN TYPE

Digital/analog I/O

Digital I/O

DESCRIPTION

GPIO port A pin 3. ROM bootloader SSI SEL

GPIO port A pin 4. ROM bootloader SSI RXD

GPIO port A pin 5. ROM bootloader SSI TXD

GPIO port A pin 6

PA3

PA4

PA5

PA6

PA7

PB0

PB1

PB2

PB3

PB4

PB5

PB6

PB7

PC0

PC1

PC2

PC3

PC4

PC5

PC6

PC7

PD0

PD1

PD2

PD3

PD4

PD5

GPIO port A pin 7

GPIO port B pin 0

Digital I/O

GPIO port B pin 1

Digital I/O

GPIO port B pin 2

Digital I/O

GPIO port B pin 3

Digital I/O

GPIO port B pin 4

Digital I/O

GPIO port B pin 5

Digital I/O

GPIO port B pin 6, TDI (JTAG)

GPIO port B pin 7, TDO (JTAG)

Digital I/O

GPIO port C pin 0, 20 mA output capability, no pull-up or pull-down

GPIO port C pin 1, 20 mA output capability, no pull-up or pull-down

GPIO port C pin 2, 20 mA output capability, no pull-up or pull-down

GPIO port C pin 3, 20 mA output capability, no pull-up or pull-down

GPIO port C pin 4

Digital I/O

GPIO port C pin 5

Digital I/O

GPIO port C pin 6

Digital I/O

GPIO port C pin 7

Digital I/O

GPIO port D pin 0

Digital I/O

GPIO port D pin 1

Digital I/O

GPIO port D pin 2

Digital I/O

GPIO port D pin 3

Digital I/O

GPIO port D pin 4

Digital I/O

GPIO port D pin 5

PD6/XOSC32K_Q1

PD7/XOSC32K_Q2

R_BIAS

Digital/analog I/O

Analog I/O

GPIO port D pin 6 / 32-kHz crystal oscillator pin 1

GPIO port D pin 7 / 32-kHz crystal oscillator pin 1

External precision bias resistor for reference current

Reset, active-low

RESET_N

Digital input

Negative RF input signal to LNA during RX

Negative RF output signal from PA during TX

RF_N

RF_P

RF I/O

Positive RF input signal to LNA during RX

Positive RF output signal from PA during TX

USB_P

USB I/O

USB differential data plus (D+)

USB_N

USB I/O

USB differential data minus (D–)

XOSC32M_Q1

XOSC32M_Q2

Analog I/O

32-MHz crystal oscillator pin 1 or external-clock input

32-MHz crystal oscillator pin 2

Terminal Configuration and Functions

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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

5 Specifications

5.1 Absolute Maximum Ratings^(1)(2)(3)

over operating free-air temperature range (unless otherwise noted)

MIN

–0.3

MAX

UNIT

Supply voltage

Voltage on any digital pin

Input RF level

T_stg

All supply pins must have the same voltage

3.9

V_DD+ 0.3, ≤ 3.9

dBm

°C

Storage temperature range

–40

125

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to V_SS, unless otherwise noted.

(3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS001⁽¹⁾

±1

Electrostatic discharge (ESD)

performance:

V_ESD

Charged device model (CDM),

All pins

±500

per JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX UNIT

Operating ambient temperature range, T_A

–40

125

3.6

°C

(1)

Operating supply voltage

(1) The CC2538 contains a power on reset (POR) module and a brown out detector (BOD) that prevent the device from operating under

unsafe supply voltage conditions. In the two lowest power modes, PM2 and PM3, the POR is active but the BOD is powered down,

which gives a limited voltage supervision.

If the supply voltage is lowered to below 1.4 V during PM2/PM3, at temperatures of 70°C or higher, and then brought back up to good

operating voltage before active mode is re-entered, registers and RAM contents that are saved in PM2, PM3 may become altered.

Hence, care should be taken in the design of the system power supply to ensure that this does not occur. The voltage can be

periodically supervised accurately by entering active mode, as a BOD reset is triggered if the supply voltage is below approximately

1.7 V.

Specifications

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5.4 Electrical Characteristics

Measured on TI's CC2538 EM reference design with T_A= 25°C, V_DD= 3 V, and 8-MHz system clock, unless otherwise noted.

Boldface limits apply over the entire operating range, T_A= –40°C to 125°C, V_DD= 2 V to 3.6 V, and f_c= 2394 MHz to

2507 MHz.

PARAMETER

TEST CONDITIONS

MIN

TYP MAX UNIT

Digital regulator on. 16-MHz RCOSC running. No radio,

crystals, or peripherals active.

CPU running at 16-MHz with flash access

32-MHz XOSC running. No radio or peripherals active.

CPU running at 32-MHz with flash access,.

32-MHz XOSC running, radio in RX mode, –50-dBm input

power, no peripherals active, CPU idle

32-MHz XOSC running, radio in RX mode at –100-dBm input

power (waiting for signal), no peripherals active, CPU idle

27 mA

32-MHz XOSC running, radio in TX mode, 0-dBm output

power, no peripherals active, CPU idle

I_core

Core current consumption

32-MHz XOSC running, radio in TX mode, 7-dBm output

power, no peripherals active, CPU idle

Power mode 1. Digital regulator on; 16-MHz RCOSC and

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD

and sleep timer active; RAM and register retention

0.6

Power mode 2. Digital regulator off; 16-MHz RCOSC and

32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and

sleep timer active; RAM and register retention

1.3

0.4

µA

Power mode 3. Digital regulator off; no clocks; POR active;

RAM and register retention

Peripheral Current Consumption (Adds to core current I_corefor each peripheral unit activated)

General-purpose timer

Timer running, 32-MHz XOSC used

120

300

0.1

0.7

0.9

3.8

1.2

µA

SPI

I2C

µA

UART

Sleep timer

USB

I_peri

Including 32.753-kHz RCOSC

48-MHz clock running, USB enabled

When converting

ADC

Erase

Flash

Burst-write peak current

Specifications

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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

5.5 General Characteristics

Measured on TI's CC2538 EM reference design with T_A= 25 °C and V_DD= 3 V, unless otherwise noted.

PARAMETER

Wake-Up and Timing

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Digital regulator on, 16-MHz RCOSC and 32-MHz crystal

oscillator off. Start-up of 16-MHz RCOSC

Power mode 1 → active

µs

Digital regulator off, 16-MHz RCOSC and 32-MHz crystal

oscillator off. Start-up of regulator and 16-MHz RCOSC

Power mode 2 or 3 → active

136

0.5

Initially running on 16-MHz RCOSC, with 32-MHz XOSC off

With 32-MHz XOSC initially on

µs

Active → TX or RX

192

RX/TX and TX/RX turnaround

USB PLL start-up time

Radio Part

With 32-MHz XOSC initially on

Programmable in 1-MHz steps, 5 MHz between channels

for compliance with

RF frequency range

2394

2507

MHz

(1)

Radio baud rate

Radio chip rate

Flash Memory

Flash erase cycles

Flash page size

As defined by

250

kbps

(1)

As defined by

MChip/s

20 k Cycles

(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless

Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

Specifications

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5.6 RF Receive Section

Measured on TI's CC2538 EM reference design with T_A= 25°C, V_DD= 3 V, and f_c= 2440 MHz, unless otherwise noted.

Bold limits apply over the entire operating range, T_A= –40°C to 125°C, V_DD= 2 V to 3.6 V, and f_c= 2394 MHz to 2507 MHz.

PARAMETER

TEST CONDITIONS

MIN TYP MAX

UNIT

PER = 1%, as specified by ⁽¹⁾, normal operating conditions

(25 °C, 3 V, 2440 MHz)

–97

–92

dBm

⁽¹⁾requires –85 dBm

Receiver sensitivity

PER = 1%, as specified by ⁽¹⁾, entire operating conditions

–88

dBm

⁽¹⁾requires –85 dBm

(1)

PER = 1%, as specified by

Saturation (maximum input level)

⁽¹⁾requires –20 dBm

Wanted signal –82 dBm, adjacent modulated channel at

Adjacent-channel rejection,

5-MHz channel spacing

(1)

5 MHz, PER = 1%, as specified by

⁽¹⁾requires 0 dB

Wanted signal –82 dBm, adjacent modulated channel at

Adjacent-channel rejection,

–5-MHz channel spacing

(1)

–5 MHz, PER = 1%, as specified by

⁽¹⁾requires 0 dB

Wanted signal –82 dBm, adjacent modulated channel at

Alternate-channel rejection,

10-MHz channel spacing

(1)

10 MHz, PER = 1%, as specified by

⁽¹⁾requires 30 dB

Wanted signal –82 dBm, adjacent modulated channel at

Alternate-channel rejection,

–10-MHz channel spacing

(1)

–10 MHz, PER = 1%, as specified by

⁽¹⁾requires 30 dB

Channel rejection

Wanted signal at –82 dBm. Undesired signal is an IEEE

802.15.4 modulated channel, stepped through all channels

from 2405 to 2480 MHz. Signal level for PER = 1%.

≥ 20 MHzXXXXX

≤ –20 MHzXXXXX

Blocking/desensitization

5 MHz from band edgeXXXXX Wanted signal 3 dB above the sensitivity level, CW jammer,

10 MHz from band edgeXXXXX PER = 1%. Measured according to EN 300 440 class 2.

20 MHz from band edgeXXXXX

50 MHz from band edgeXXXXX

–5 MHz from band edgeXXXXX

–10 MHz from band edgeXXXXX

–20 MHz from band edgeXXXXX

–50 MHz from band edgeXXXXX

–35

–34

–37

–32

–37

–38

–35

–34

dBm

Spurious emission. Only largest spurious

emission stated within each band.

Conducted measurement with a 50-Ω single-ended load.

Suitable for systems targeting compliance with EN 300 328,

EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66.

dBm

30 MHz–1000 MHzXXXXX

1 GHz–12.75 GHzXXXXX

–80

Frequency error tolerance⁽²⁾

Symbol rate error tolerance⁽³⁾

⁽¹⁾requires minimum 80 ppm

±150

ppm

±1000

(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless

Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

(2) Difference between center frequency of the received RF signal and local oscillator frequency

(3) Difference between incoming symbol rate and the internally generated symbol rate

Specifications

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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

5.7 RF Transmit Section

Measured on TI's CC2538 EM reference design with T_A= 25°C, V_DD= 3 V and f_c= 2440 MHz, unless otherwise noted.

Boldface limits apply over the entire operating range, T_A= –40°C to 125°C, V_DD= 2 V to 3.6 V, and f_c= 2394 MHz to 2507

MHz.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Delivered to a single-ended 50-Ω load through a balun using

maximum-recommended output-power setting

⁽¹⁾requires minimum –3 dBm

Nominal output power

dBm

Programmable output-power

range

Maximum recommended output power setting⁽²⁾

Measured according to stated regulations.

Spurious emissions

25–1000 MHz (outside restricted bands)

–56

–58

–60

–54

–51

–42

25–1000 MHz (within FCC restricted bands)

25–1000 MHz (within ETSI restricted bands)

1800–1900 MHz (ETSI restricted band)

Only largest spurious emission

stated within each band.

dBm

5150–5300 MHz (ETSI restricted band)

1–12.75 GHz (except restricted bands)

At 2483.5 MHz and above (FCC restricted band), f_c= 2480 MHz⁽³⁾

Measured as defined by ⁽¹⁾using maximum-recommended output-

Error vector magnitude (EVM) power setting

⁽¹⁾requires maximum 35%.

Optimum load impedance

Differential impedance on the RF pins

66 + j64

Ω

(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless

Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

(2) TI's CC2538 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15, and

ARIB STD-T-66.

(3) To improve margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz, use a lower output-power

setting or less than 100% duty cycle.

Specifications

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5.8 32-MHz Crystal Oscillator

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

Crystal frequency

TEST CONDITIONS

MIN

TYP

MAX UNIT

MHz

Crystal frequency accuracy

requirement⁽¹⁾

–40

40 ppm

ESR

C₀

Equivalent series resistance

Crystal shunt capacitance

Crystal load capacitance

Start-up time

1.9

Ω

C_L

0.3

The crystal oscillator must be in power down for a

guard time before using it again. This requirement

is valid for all modes of operation. The need for

power-down guard time can vary with crystal type

and load.

Power-down guard time

(1) Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and

Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

5.9 32.768-kHz Crystal Oscillator

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

Crystal frequency

TEST CONDITIONS

MIN

TYP MAX UNIT

32.768

kHz

Crystal frequency accuracy

requirement⁽¹⁾

–40

ppm

ESR

C₀

Equivalent series resistance

Crystal shunt capacitance

Crystal load capacitance

Start-up time

0.9

130

Ω

C_L

0.4

(1) Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and

Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

5.10 32-kHz RC Oscillator

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

Calibrated frequency⁽¹⁾

TEST CONDITIONS

MIN

TYP

32.753

±0.2%

0.4

MAX UNIT

kHz

Frequency accuracy after calibration

Temperature coefficient⁽²⁾

Supply-voltage coefficient⁽³⁾

Calibration time⁽⁴⁾

%/ °C

%/V

(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.

(2) Frequency drift when temperature changes after calibration

(3) Frequency drift when supply voltage changes after calibration

(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator

is performed while SLEEPCMD.OSC32K_CALDIS is 0.

Specifications

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5.11 16-MHz RC Oscillator

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

Frequency⁽¹⁾

TEST CONDITIONS

MIN

TYP

MAX

UNIT

MHz

Uncalibrated frequency accuracy

Calibrated frequency accuracy

Start-up time

±18%

±0.6%

±1%

µs

Initial calibration time⁽²⁾

(1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz xtal frequency divided by 2.

(2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator

is performed while SLEEPCMD.OSC_PD is set to 0.

5.12 RSSI/CCA Characteristics

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

RSSI range

100

Absolute uncalibrated RSSI/CCA

accuracy

±4

RSSI/CCA offset⁽¹⁾

Step size (LSB value)

(1) Real RSSI = Register value – offset

5.13 FREQEST Characteristics

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

FREQEST range

TEST CONDITIONS

MIN

TYP

±250

±10

MAX

UNIT

kHz

FREQEST accuracy

FREQEST offset⁽¹⁾

Step size (LSB value)

7.8

(1) Real FREQEST = Register value – offset

5.14 Frequency Synthesizer Characteristics

Measured on TI's CC2538 EM reference design with T_A= 25°C, V_DD= 3 V and f_c= 2440 MHz, unless otherwise noted.

PARAMETER

TEST CONDITIONS

At ±1-MHz offset from carrier

MIN

TYP

–111

–119

–126

MAX

UNIT

Phase noise, unmodulated carrier

At ±2-MHz offset from carrier

At ±5-MHz offset from carrier

dBc/Hz

5.15 Analog Temperature Sensor

Measured on TI's CC2538 EM reference design with T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

1422

4.2

MAX

UNIT

12-bit ADC

/1°C

Output at 25°C

Temperature coefficient

Voltage coefficient

/0.1 V

°C

Measured using integrated ADC, using

internal band-gap voltage reference and

maximum resolution

Initial accuracy without calibration

±10

Accuracy using 1-point calibration (entire

temperature range)

±5

°C

Current consumption when enabled (ADC

current not included)

0.3

Specifications

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5.16 ADC Characteristics

T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

V_DDis voltage on AVDD5 pin

MIN

TYP MAX

UNIT

Input voltage

V_DD

External reference voltage

External reference voltage differential

Input resistance, signal

V_DDis voltage on AVDD5 pin

Using 4-MHz clock speed

197

2.97

5.7

kΩ

Full-scale signal⁽¹⁾

Peak-to-peak, defines 0 dBFS

Single-ended input, 7-bit setting

Single-ended input, 9-bit setting

Single-ended input, 10-bit setting

Single-ended input, 12-bit setting

Differential input, 7-bit setting

7.5

9.3

10.8

6.5

ENOB⁽¹⁾

Effective number of bits

Bits

Differential input, 9-bit setting

8.3

Differential input, 10-bit setting

Differential input, 12-bit setting

7-bit setting, both single and differential

Single-ended input, 12-bit setting, –6 dBFS

Differential input, 12-bit setting, –6 dBFS

Single-ended input, 12-bit setting

Differential input, 12-bit setting

Single-ended input, 12-bit setting, –6 dBFS

Differential input, 12-bit setting, –6 dBFS

10.0

11.5

0–20

–75.2

–86.6

70.2

79.3

78.8

88.9

Useful power bandwidth

Total harmonic distortion

kHz

THD⁽¹⁾

Signal to nonharmonic ratio⁽¹⁾

Differential input, 12-bit setting, 1-kHz sine (0

dBFS), limited by ADC resolution

CMRR

Common-mode rejection ratio

Crosstalk

>84

Single-ended input, 12-bit setting, 1-kHz sine (0

dBFS), limited by ADC resolution

< –84

Offset

Midscale

–3

0.68%

0.05

0.9

Gain error

12-bit setting, mean

DNL⁽¹⁾

INL⁽¹⁾

Differential nonlinearity

Integral nonlinearity

LSB

12-bit setting, maximum

12-bit setting, mean

4.6

12-bit setting, maximum

Single-ended input, 7-bit setting

Single-ended input, 9-bit setting

Single-ended input, 10-bit setting

Single-ended input, 12-bit setting

Differential input, 7-bit setting

Differential input, 9-bit setting

Differential input, 10-bit setting

Differential input, 12-bit setting

7-bit setting

13.3

35.4

46.8

57.5

66.6

40.7

51.6

61.8

70.8

SINAD⁽¹⁾

(–THD+N)

Signal-to-noise-and-distortion

9-bit setting

Conversion time

µs

10-bit setting

12-bit setting

132

1.2

Current consumption

Internal reference voltage

Internal reference VDD coefficient

1.19

mV/V

(1) Measured with 300-Hz sine-wave input and VDD as reference

16 Specifications

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ADC Characteristics (continued)

T_A= 25°C and V_DD= 3 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP MAX

UNIT

Internal reference temperature

coefficient

0.4

mV/10 °C

5.17 Control Input AC Characteristics

T_A= –40°C to 125°C, V_DD= 2 V to 3.6 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN TYP

MAX UNIT

The undivided system clock is 32 MHz when crystal oscillator is used.

The undivided system clock is 16 MHz when calibrated 16-MHz RC

oscillator is used.

System clock, f_SYSCLK

t_SYSCLK= 1/f_SYSCLK

MHz

See item 1, Figure 5-1. This is the shortest pulse that is recognized

as a complete reset pin request.

RESET_N low duration⁽¹⁾

Interrupt pulse duration

µs

See item 2, Figure 5-1.This is the shortest pulse that is recognized as

an interrupt request.

(1) Shorter pulses may be recognized, but might not lead to a complete reset of all modules within the chip.

RESET_N

Px.n

T0299-01

Figure 5-1. Control Input AC Characteristics

5.18 DC Characteristics

T_A= 25°C, VDD = 3 V, drive strength set to high with CC_TESTCTRL.SC = 1, unless otherwise noted.

PARAMETER

Logic-0 input voltage

TEST CONDITIONS

MIN

TYP

MAX

UNIT

0.5

Logic-1 input voltage

2.5

–300

Logic-0 input current

Input equals 0 V

300

kΩ

Logic-1 input current

Input equals V_DD

I/O-pin pullup and pulldown resistors

Logic-0 output voltage, 4-mA pins

Logic-1 output voltage, 4-mA pins

Logic-0 output voltage, 20-mA pins

Logic-1 output voltage, 20-mA pins

Output load 4 mA

Output load 20 mA

0.5

2.4

5.19 USB Interface DC Characteristics

T_A= 25°C, V_DD= 3 V to 3.6 V, unless otherwise noted.

PARAMETER

TEST CONDITIONS

VDD 3.6 V, 4-mA load

MIN

TYP

MAX

UNIT

USB pad voltage output, high

USB pad voltage output, low

3.4

0.2

Specifications

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5.20 Thermal Resistance Characteristics for RTQ Package

NAME

Rθ_JC-top

Rθ_JB

DESCRIPTION

°C/W^{(1) (2)}

8.9

AIR FLOW (m/s)⁽³⁾

Junction-to-case (top)

Junction-to-board

0.00

3.1

Rθ_JA

Junction-to-free air

Junction-to-package top

Junction-to-board (bottom)

25.0

3.1

Psi_JT

Psi_JB-bottom

0.4

(1) °C/W = degrees Celsius per watt.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ_JC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(3) m/s = meters per second.

Specifications

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6 Applications, Implementation, and Layout

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

Few external components are required for the operation of the CC2538xFnn. Figure 6-1 is a typical

application circuit. For a complete USB reference design, see the CC2538xFnn product page on

www.ti.com. Table 6-1 lists typical values and descriptions of external components. The USB_P and

USB_N pins require series resistors R21 and R31 for impedance matching, and the D+ line must have a

pullup resistor, R32. The series resistors should match the 90-Ω ±15% characteristic impedance of the

USB bus. Notice that the pullup resistor and DVDD_USB require connection to a voltage source between

3 V and 3.6 V (typically 3.3 V). To accomplish this, it is recommend to connect the D+ pull-up to a port/pin

that does not have an internal pullup (that is, PC0..3), instead of connecting it directly to a 3.3 V supply

(that is, software control of D+ pullup recommended).

Optional 32 kHz crystal

C451

2.0 V-3.6 V power supply

3.3 V power supply

C561

C441

Antenna

(50 Ω)

R421

R_BIAS 42

AVDD 41

1 DGND_USB

2 USB_P

R31

R21

D+

D-

C382

C381

C371

AVDD 40

3 USB_N

L374

L381

C372

3.3 nH

AVDD 39

4 DVDD_USB

5 PB0

L373

2 nH

RF_N 38

R32

C31

C21

RF_P 37

6 PC7

7 PC6

8 PC5

9 PC4

C373

AVDD 36

1.2 pF

CC2538

DIE ATTACH PAD:

XOSC32M_Q2 35

XOSC32M_Q1 34

L372

AVDD 33

DCOUPL2 32

PD5 31

10 VDD

11 PC3

12 PC2

13 PC1

14 PC0

PD4 30

PD3 29

C321

XTAL

C341

C351

C281

Power supply decoupling capacitors are not shown

Digital I/O not connected

R281

RESET_N

Figure 6-1. CC2538xFnn Application Circuit

Applications, Implementation, and Layout

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Table 6-1. Overview of External Components (Excluding Supply Decoupling

Capacitors)

Component

C21

Description

Value

47 pF

12 pF

18 pF

1 pF

USB D– decoupling

USB D+ decoupling

C31

C341

C351

C371

C381

C382

C372

C441

C451

C561

C321

C281

L372

L381

R21

32-MHz xtal-loading capacitor

Part of the RF matching network

32-kHz xtal-loading capacitor

1 pF

22 pF

1 µF

32-kHz xtal-loading capacitor

Decoupling capacitor for the internal digital regulator

Filter capacitor for reset line

1 µF

1 nF

Part of the RF matching network

USB D– series resistor

2 nH

33 Ω

R31

USB D+ series resistor

33 Ω

R32

USB D+ pullup resistor to signal full-speed device presence

Filter resistor for reset line

1.5 kΩ

2.2 Ω

56 kΩ

R281

R421

Resistor used for internal biasing

6.1 Input, Output Matching

When using an unbalanced antenna such as a monopole, use a balun to optimize performance. One can

implement the balun using low-cost, discrete inductors and capacitors. The recommended balun shown in

Figure 6-1 consists of L372, C372, C382 and L381.

If a balanced antenna such as a folded dipole is used, omit the balun.

6.2 Crystal

The 32-MHz crystal oscillator uses an external 32-MHz crystal, XTAL1, with two loading capacitors (C341

and C351). See the 32-MHz Crystal Oscillator section for details. Calculate the load capacitance across

the 32-MHz crystal by Equation 1.

C_L=

+ C_parasitic

C₃₄₁C₃₅₁

(1)

XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C441 and C451) used for the

32.768-kHz crystal oscillator. Use the 32.768-kHz crystal oscillator in applications where both low sleep-

current consumption and accurate wake-up times are needed. Calculate the load capacitance across the

32.768-kHz crystal by Equation 2.

C_L=

+ C_parasitic

C₄₄₁C₄₅₁

(2)

Use a series resistor, if necessary, to comply with the ESR requirement.

Applications, Implementation, and Layout

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6.3 On-Chip 1.8-V Voltage-Regulator Decoupling

The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires decoupling

capacitors (C561, C321) and an external connection between them for stable operation.

6.4 Power-Supply Decoupling and Filtering

Optimum performance requires proper power-supply decoupling. The placement and size of the

decoupling capacitors and the power supply filtering are important to achieve the best performance in an

application. TI provides a recommended compact reference design for the user to follow.

6.5 References

1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY)

Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)

http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf

2. CC2538xFnn User's Guide

3. Universal Serial Bus Revision 2.0 Specification

http://www.usb.org/developers/docs/usb_20_052709.zip

Applications, Implementation, and Layout

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7 器件和文档支持

7.1 器件支持

7.1.1 开发支持

TI 提供大量的开发工具，其中包括评估处理器性能、生成代码、开发算法工具、以及完全集成和调试软件及

硬件模块的工具。工具的电子支持文档可从 Code Composer Studio™ 集成开发环境 (IDE) 中获得。

下列产品支持 CC2538 器件的开发需求：

软件开发工具：Code Composer Studio™ 集成开发环境 (IDE)：其中包括支持任意 CC2538 器件应用所需

的以下工具：编辑器、C/C++/汇编代码生成工具、调试工具以及能够提供基本运行时目标软件的可扩展实时

基础软件 (DSP/BIOS™)。

硬件开发工具：扩展开发系统 (XDS™) 仿真器

有关 CC2538 平台开发支持工具的完整列表，请访问德州仪器 (TI) 网站 www.ti.com.cn。有关定价和购买信

息，请联系最近的 TI 销售办事处或授权分销商。

7.1.2 器件命名规则

为了指出产品开发周期所处的阶段，TI 为所有微处理器 (MPU) 和支持工具的产品型号分配了前缀。每个器

件都具有以下三个前缀中的一个：X、P 或无（无前缀）（例如，CC2538）。

器件开发进化流程：

试验器件不一定代表最终器件的电气规范标准并且不可使用生产组装流程。

原型器件不一定是最终芯片模型并且不一定符合最终电气标准规范。

完全合格的芯片模型的生产版本。

无

支持工具开发进化流程：

X 和 P 器件在供货时附带如下免责声明：

“开发的产品用于内部评估用途。”

生产器件已进行完全特性化，并且器件的质量和可靠性已经完全论证。TI 的标准保修证书适用。

预测显示原型器件（X 或者 P）的故障率大于标准生产器件。由于它们的预计的最终使用故障率仍未定义，

德州仪器 (TI) 建议不要将这些器件用于任何生产系统。只有合格的生产器件将被使用。

TI 器件的命名规则也包括一个带有器件系列名称的后缀。这个后缀表示封装类型（例如，RTQ）和温度范围

（例如，“空白”是默认的商业级温度范围）。

要获得

RTQ

封装类型的

CC2538

器件订购部件号，请参见本文档的“封装选项附录”（TI

网站

www.ti.com），或者联系您的 TI 销售代表。

器件和文档支持

提交文档反馈意见

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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

7.2 文档支持

以下文档介绍了 CC2538 处理器。在 www.ti.com.cn 内提供这些文档的副本。

SWRZ045 CC2538 适用于 2.4GHz IEEE 802.15.4、6LoWPAN 和 ZigBee 应用的 SoC 勘误

SWRA467 基于 CC2538 开发支持 Zigbee 的低成本智能能量计

SWRA456 支持 Z-Stack 的 CC2538 终端设备功耗测量和优化

SWRA447 使用 CC2592 前端与 CC2538

SWRA437 CC2538 + CC1200 评估模块

SWRA443 使用 GCC/GDB 与 CC2538

SWRU325 CC2538 外设驱动程序库用户指南

SWRU319 用于 2.4GHz IEEE 802.15.4 和 ZigBee/ZigBee IP 应用的 CC2538 SoC 用户指南

SWRU333 CC2538 ROM 用户指南

7.2.1 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术

规范和标准且不一定反映 TI 的观点；请见 TI 的使用条款。

TI E2E™ 在线社区 TI 工程师对工程师 (E2E) 社区。此社区的创建目的是为了促进工程师之间协作。在

e2e.ti.com 中，您可以咨询问题、共享知识、探索思路，在同领域工程师的帮助下解决问题。

德州仪器 (TI) 嵌入式处理器维基网站德州仪器 (TI) 嵌入式处理器维基网站。此网站的建立是为了帮助开发

人员从德州仪器 (TI) 的嵌入式处理器入门并且也为了促进与这些器件相关的硬件和软件的总体

知识的创新和增长。

7.3 其他信息

德州仪器 (TI) 为工业和消费类应用中所使用的专有应用和标准无线应用提供各种经济实用的低功耗射频选

择。其中包括适用于 1GHz 以下频段和 2.4GHz 频段的射频收发器、射频发送器、射频前端和片上系统以及

各种软件解决方案。

此外，德州仪器 (TI) 还提供广泛的相关支持，例如开发工具、技术文档、参考设计、应用专业技术、客户支

持、第三方服务以及大学计划。

低功耗射频 E2E 在线社区设有技术支持论坛并提供视频和博客，您有机会在此与全球同领域工程师交流互

动。

凭借丰富的供选产品解决方案、可实现的最终应用以及广泛的技术支持，德州仪器 (TI) 能够为您提供最全面

的低功耗射频产品组合。

7.3.1 德州仪器 (TI) 低功耗射频网站

德州仪器 (TI) 的低功耗射频网站提供所有最新产品、应用和设计笔记、FAQ 部分、新闻资讯以及活动更

新。请访问 www.ti.com.cn/lprf。

器件和文档支持

提交文档反馈意见

产品主页链接: CC2538

CC2538

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

www.ti.com.cn

7.3.2 低功耗射频在线社区

•

论坛、视频和博客

射频设计帮助

E2E 交流互动

访问：www.ti.com/lprf-forum 立即体验。

7.3.3 德州仪器 (TI) 低功耗射频开发者网络

德州仪器 (TI) 建立了一个大型低功耗射频开发合作伙伴网络，帮助客户加快应用开发。此网络中包括推荐的

公司、射频顾问和独立设计工作室，他们可提供一系列硬件模块产品和设计服务，其中包括：

•

射频电路、低功耗射频和 ZigBee 设计服务

低功耗射频和 ZigBee 模块解决方案以及开发工具

射频认证服务和射频电路制造

如果需要有关模块、工程服务或开发工具的帮助：

请搜索低功耗射频开发者网络查找适合的合作伙伴。www.ti.com.cn/lprfnetwork

7.3.4 低功耗射频电子新闻简报

通过低功耗射频电子新闻简报，您能够了解到最新的产品、新闻稿、开发者相关新闻以及关于德州仪器 (TI)

低功耗射频产品其它新闻和活动。低功耗射频电子新闻简报文章包含可获取更多在线信息的链接。

访问：www.ti.com.cn/lprfnewsletter 立即注册

7.4 商标

Code Composer Studio, SmartRF, E2E are trademarks of Texas Instruments.

Cortex is a registered trademark of ARM Limited.

ARM is a registered trademark of ARM Physical IP, Inc.

IAR Embedded Workbench is a registered trademark of IAR Systems AB.

ZigBee is a registered trademark of ZigBee Alliance.

7.5 静电放电警告

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可

能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可

能会导致器件与其发布的规格不相符。

7.6 出口管制提示

接收方同意：如果美国或其他适用法律限制或禁止将通过非披露义务的披露方获得的任何产品或技术数据

（其中包括软件）（见美国、欧盟和其他出口管理条例之定义）、或者其他适用国家条例限制的任何受管制

产品或此项技术的任何直接产品出口或再出口至任何目的地，那么在没有事先获得美国商务部和其他相关政

府机构授权的情况下，接收方不得在知情的情况下，以直接或间接的方式将其出口。

7.7 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

器件和文档支持

提交文档反馈意见

产品主页链接: CC2538

CC2538

www.ti.com.cn

ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015

8 机械、封装和可订购信息

8.1 封装信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知

且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。

机械、封装和可订购信息

提交文档反馈意见

产品主页链接: CC2538

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

CC2538NF11RTQR

CC2538NF11RTQT

CC2538NF23RTQR

CC2538NF23RTQT

CC2538NF53RTQR

CC2538NF53RTQT

CC2538SF23RTQR

CC2538SF23RTQT

CC2538SF53RTQR

CC2538SF53RTQT

ACTIVE

QFN

RTQ

2000 RoHS & Green

250 RoHS & Green

2000 RoHS & Green

250 RoHS & Green

2000 RoHS & Green

250 RoHS & Green

2000 RoHS & Green

250 RoHS & Green

2000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-3-260C-168 HR

-40 to 125

CC2538NF11

NIPDAU

CC2538NF11

CC2538NF23

CC2538NF53

CC2538SF23

CC2538SF53

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

25-Nov-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

CC2538NF11RTQR

CC2538NF23RTQR

CC2538NF53RTQR

CC2538SF23RTQR

CC2538SF53RTQR

QFN

RTQ

2000

330.0

16.4

8.3

2.25

12.0

16.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

25-Nov-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CC2538NF11RTQR

CC2538NF23RTQR

CC2538NF53RTQR

CC2538SF23RTQR

CC2538SF53RTQR

QFN

RTQ

2000

350.0

43.0

Pack Materials-Page 2

GENERIC PACKAGE VIEW

RTQ 56

8 x 8, 0.5 mm pitch

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224653/A

www.ti.com

PACKAGE OUTLINE

RTQ0056C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

8.15

7.85

PIN 1 INDEX AREA

8.15

7.85

1.0

0.8

SEATING PLANE

0.08 C

0.05

0.00

2X 6.5

SYMM

(0.2) TYP

EXPOSED

THERMAL PAD

SYMM

2X 6.5

6.6 0.1

52X 0.5

PIN 1 ID

0.30

0.18

56X

0.5

0.3

0.1

C A B

56X

0.05

4224872/A 03/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

RTQ0056C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(3.05) TYP

SEE SOLDER MASK

DETAIL

(0.62) TYP

(1.24)

TYP

56X (0.6)

56X (0.24)

52X (0.5)

(3.05) TYP

(1.24) TYP

(R0.05) TYP

SYMM

(7.8)

(0.62) TYP

(

6.6)

0.2) TYP

VIA

SYMM

(7.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 10X

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

METAL EDGE

EXPOSED METAL

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4224872/A 03/2019

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

RTQ0056C

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(1.24) TYP

56X (0.6)

56X (0.24)

52X (0.5)

(R0.05) TYP

(1.24) TYP

(7.8)

SYMM

25X ( 1.04)

SYMM

(7.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 10X

EXPOSED PAD 57

62% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

4224872/A 03/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

CC2538NF53RTQR [TI]

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