CC2538SF23RTQT [TI]
具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU | RTQ | 56 | -40 to 125;型号: | CC2538SF23RTQT |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU | RTQ | 56 | -40 to 125 无线 电信 电信集成电路 闪存 |
文件: | 总34页 (文件大小:1806K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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CC2538
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
CC2538 适用于 2.4GHz IEEE 802.15.4、6LoWPAN 和 ZigBee®应用
的强大无线微控制器片上系统
1 器件概述
1.1 特性
1
• 微控制器
• 外设
– µDMA
– 强大的 ARM® Cortex®-M3,具有代码预提取功能
– 高达 32MHz 的时钟速度
– 4 个通用定时器
(每个定时器为 32 位或 2 x 16 位)
– 32 位 32kHz 睡眠定时器
– 512KB、256KB 或 128KB 系统内可编程闪存
– 支持片上无线升级 (OTA)
– 具有 8 通道和可配置分辨率的 12 位模数转换器
– 支持双 Zigbee 应用配置
– 高达 32KB 的 RAM(其中 16kB 在所有功率模式
下具有保持功能)
(ADC)
– 电池监视器和温度传感器
– USB 2.0 全速器件 (12Mbps)
– 2 个串行外设接口 (SPI)
– 2 个异步收发器 (UART)
– I2C
– cJTAG 和 JTAG 调试
• 射频 (RF)
– 2.4GHz IEEE 802.15.4 兼容 RF 收发器
– -97dBm 的出色接收器灵敏度
– 在 44dB 的 ACR 干扰情况下可靠耐用
– 高达 7dBm 的可编程输出功率
• 安全硬件加速
– 32 个通用 I/O 引脚
(28 × 4mA,4 × 20mA)
– 安全装置定时器
• 布局布线
– 面向未来的 AES-128/256,安全散列算法
(SHA)2 硬件加密引擎
– 8mm × 8mm QFN56 封装
– 可在高达 125°C 的工业温度下运行的
耐用器件
– 可选 - 用于安全密钥交换的 ECC-128/256,RSA
硬件加速引擎
– 极少的外部组件
– 异步网络只需一个单晶振
• 开发工具
– 用于实现底层 MAC 功能性的无线命令选通处理
器和数据包操作处理器
• 低功率
– 有源模式 RX(CPU 闲置):20mA
– 0dBm 时的有源模式 TX(CPU 闲置):24mA
– 功率模式 1(4μs 唤醒时间,32KB RAM 保持,
完全寄存器保持):0.6mA
– 功率模式 2(休眠定时器运行,16KB RAM 保
持,配置寄存器保持):1.3μA
– CC2538 开发套件
– 经美国联邦通信委员会 (FCC) 和欧洲电信标准协
会 (ETSI) 规则认证的参考设计
– 为 Contiki/6LoWPAN、智能电网、照明和
Zigbee 家庭自动化提供完整软件支持,其中包括
示例 应用 和参考设计
– Code Composer Studio™
– IAR Embedded Workbench®用于 ARM
– SmartRF™Studio
– 功率模式 3(外部中断,16KB RAM 保持,配置
寄存器保持):0.4μA
– 宽电源电压范围(2V 至 3.6V)
– SmartRF 闪存编程器
1.2 应用
•
•
•
智能电网和家庭局域网
家庭和楼宇自动化
智能照明系统
•
•
无线传感器网络
物联网
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SWRS096
CC2538
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
www.ti.com.cn
1.3 说明
CC2538xFnn 是适用于高性能 ZigBee 应用的理想无线微控制器片上系统 (SoC)。该器件包含基于 ARM
Cortex M3 的强大的 MCU 系统,具有高达 32KB 的片上 RAM 和高达 512KB 的片上闪存以及可靠的 IEEE
802.15.4 射频功能。这使得该器件能够处理涉及安全性、要求严格的 应用程序以及无线下载的复杂网络协
议栈。32 个通用输入和输出 (GPIO) 以及串行外设接口可实现到电路板其它部分的简单连接。强大的硬件安
全加速器可在 CPU 处理应用任务的同时实现快速且高效的认证和加密。具有保持功能的多个低功耗模式可
实现从休眠状态快速唤醒并且显著降低执行周期任务时的能耗。为了实现顺利平稳开发,CC2538xFnn 包括
一个强大的调试系统和一个综合性驱动器库。为了减少应用闪存封装尺寸,CC2538xFnn ROM 包含一个实
用功能库和一个串行引导加载器。CC2538 与 TI 免费提供的稳健且全面的 Z-Stack 软件解决方案搭配使
用,可提供市场上功能最强大、最稳定的 ZigBee 解决方案。
器件信息(1)
封装
器件型号
封装尺寸
CC2538RTQ
(1) 更多信息请参见 节 8,机械封装和可订购产品信息。
RTQ (56)
8.00mm x 8.00mm
2
器件概述
版权 © 2012–2015, Texas Instruments Incorporated
CC2538
www.ti.com.cn
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
1.4 功能方框图
JTAG
SWO
NVIC
MPU
ARM
CortexTMœ M3
128KB/256KB/512KB Flash
32 MHz
16KB Retention SRAM
16KB Standard SRAM
4KB ROM
cJTAG/JTAG
ICEPick
2 UARTS
2 SSI/SPI
Systick Timer
Timer/PWM/CCP
4x (32 bit or 2x16 bit)
USB Full-Speed
Watchdog Timer
32 GPIO
Device
I2C
32-ch DMA
AES-128/256
SHA-256
32-MHz XTAL
and 16-MHz RC Oscillator
ECC
RSA-2048
32-kHz XTAL
and 32-kHz RC Oscillator
32-bit Sleep Timer
Packet-Handling
Processor
Command-Strobe
Processor
LDO Regulator
Power-on Reset and Brown-
Out Detection
MAC Timer
RF Chain
Low-Power
Comparator
Demod
8-ch 12-bit ADC
Modulator
With Temp Sensor
图 1-1. CC2538 方框图
版权 © 2012–2015, Texas Instruments Incorporated
器件概述
3
CC2538
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
www.ti.com.cn
内容
1
器件概述.................................................... 1
1.1 特性 ................................................... 1
1.2 应用 ................................................... 1
1.3 说明 ................................................... 2
1.4 功能方框图............................................ 3
修订历史记录............................................... 5
Device Comparison ..................................... 6
Terminal Configuration and Functions.............. 7
4.1 Signal Descriptions ................................... 7
Specifications ............................................ 9
5.1 Absolute Maximum Ratings .......................... 9
5.2 ESD Ratings.......................................... 9
5.3 Recommended Operating Conditions ................ 9
5.4 Electrical Characteristics............................ 10
5.5 General Characteristics ............................. 11
5.6 RF Receive Section................................. 12
5.7 RF Transmit Section ................................ 13
5.8 32-MHz Crystal Oscillator ........................... 14
5.9 32.768-kHz Crystal Oscillator ....................... 14
5.10 32-kHz RC Oscillator................................ 14
5.11 16-MHz RC Oscillator ............................... 15
5.12 RSSI/CCA Characteristics .......................... 15
5.13 FREQEST Characteristics .......................... 15
5.14 Frequency Synthesizer Characteristics ............. 15
5.15 Analog Temperature Sensor ........................ 15
5.16 ADC Characteristics................................. 16
5.17 Control Input AC Characteristics.................... 17
5.18 DC Characteristics .................................. 17
2
3
4
5.19 USB Interface DC Characteristics .................. 17
5.20 Thermal Resistance Characteristics for RTQ
Package ............................................. 18
6
7
Applications, Implementation, and Layout........ 19
6.1 Input, Output Matching.............................. 20
6.2 Crystal ............................................... 20
5
6.3
On-Chip 1.8-V Voltage-Regulator Decoupling ...... 21
Power-Supply Decoupling and Filtering............. 21
6.4
6.5 References .......................................... 21
器件和文档支持 .......................................... 22
7.1 器件支持 ............................................ 22
7.2 文档支持............................................. 23
7.3 其他信息............................................. 23
7.4 商标.................................................. 24
7.5 静电放电警告 ........................................ 24
7.6 出口管制提示 ........................................ 24
7.7 Glossary ............................................. 24
机械、封装和可订购信息 ............................... 25
8.1 封装信息............................................. 25
8
4
内容
版权 © 2012–2015, Texas Instruments Incorporated
CC2538
www.ti.com.cn
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
2 修订历史记录
Changes from Revision C (February 2015) to Revision D
Page
•
Changed Figure 6-1 CC2538xFnn Application Circuit ......................................................................... 19
Changes from Revision B (September 2014) to Revision C
Page
•
•
•
已更改 “ZigBee Smart Energy 1.x 和 ZigBee Light Link”至智能电网和照明 .................................................. 1
已添加 “8 通道”至“12 位 ADC” ...................................................................................................... 3
Added ESD Ratings table. .......................................................................................................... 9
Copyright © 2012–2015, Texas Instruments Incorporated
修订历史记录
5
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CC2538
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
www.ti.com.cn
3 Device Comparison
Table 3-1. CC2538 Family of Devices Available
DEVICE
FLASH (KB)
512
RAM (KB)
SECURITY HW AES/SHA SECURITY HW ECC/RSA
CC2538SF53
CC2538SF23
CC2538NF53
CC2538NF23
CC2538NF11
32
32
32
32
16
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
256
512
256
No
128
No
6
Device Comparison
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CC2538
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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
4 Terminal Configuration and Functions
DGND_USB
USB_P
USB_N
DVDD_USB
PB0
1
2
3
4
5
6
7
8
9
42 R_BIAS
41
AVDD
40 AVDD
39 AVDD
38
RF_N
PC7
37 RF_P
36 AVDD
PC6
PC5
35
XOSC32M_Q2
PC4
34 XOSC32M_Q1
33 AVDD
DVDD 10
PC3 11
PC2 12
PC1 13
PC0 14
32 DCOUPL2
31 PD5
30 PD4
29 PD3
P0142-01
Connect the exposed ground pad to a solid ground plane, as this is the ground connection for the chip.
Figure 4-1. 56-Pin RTQ Package (Top View)
4.1 Signal Descriptions
Table 4-1. Signal Descriptions
NAME
NUMBER
PIN TYPE
DESCRIPTION
2-V–3.6-V analog power-supply connection
2-V–3.6-V analog power-supply connection
1.8-V regulated digital-supply decoupling capacitor
AVDD
33, 36, 39, 40, 41 Power (analog)
AVDD_GUARD
DCOUPL1
43
56
Power (analog)
Power (digital)
1.8-V regulated digital-supply decoupling capacitor. Short this pin to
pin 56.
DCOUPL2
32
Power (digital)
DGND_USB
DVDD
1
Ground (USB pads)
Power (digital)
Power (USB pads)
Digital I/O
USB ground
10, 15, 24, 55
2-V–3.6-V digital power-supply connection
3.3-V USB power-supply connection
JTAG TCK
DVDD_USB
JTAG_TCK
JTAG_TMS
PA0
4
47
46
16
17
18
Digital I/O
JTAG TMS
Digital/analog I/O
Digital/analog I/O
Digital/analog I/O
GPIO port A pin 0. ROM bootloader UART RXD
GPIO port A pin 1. ROM bootloader UART TXD
GPIO port A pin 2. ROM bootloader SSI CLK
PA1
PA2
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Terminal Configuration and Functions
7
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Table 4-1. Signal Descriptions (continued)
NAME
NUMBER
19
20
21
22
23
5
PIN TYPE
Digital/analog I/O
Digital/analog I/O
Digital/analog I/O
Digital/analog I/O
Digital/analog I/O
Digital I/O
DESCRIPTION
GPIO port A pin 3. ROM bootloader SSI SEL
GPIO port A pin 4. ROM bootloader SSI RXD
GPIO port A pin 5. ROM bootloader SSI TXD
GPIO port A pin 6
PA3
PA4
PA5
PA6
PA7
PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PD0
PD1
PD2
PD3
PD4
PD5
GPIO port A pin 7
GPIO port B pin 0
54
53
52
51
50
49
48
14
13
12
11
9
Digital I/O
GPIO port B pin 1
Digital I/O
GPIO port B pin 2
Digital I/O
GPIO port B pin 3
Digital I/O
GPIO port B pin 4
Digital I/O
GPIO port B pin 5
Digital I/O
GPIO port B pin 6, TDI (JTAG)
GPIO port B pin 7, TDO (JTAG)
Digital I/O
Digital I/O
GPIO port C pin 0, 20 mA output capability, no pull-up or pull-down
GPIO port C pin 1, 20 mA output capability, no pull-up or pull-down
GPIO port C pin 2, 20 mA output capability, no pull-up or pull-down
GPIO port C pin 3, 20 mA output capability, no pull-up or pull-down
GPIO port C pin 4
Digital I/O
Digital I/O
Digital I/O
Digital I/O
8
Digital I/O
GPIO port C pin 5
7
Digital I/O
GPIO port C pin 6
6
Digital I/O
GPIO port C pin 7
25
26
27
29
30
31
44
45
42
28
Digital I/O
GPIO port D pin 0
Digital I/O
GPIO port D pin 1
Digital I/O
GPIO port D pin 2
Digital I/O
GPIO port D pin 3
Digital I/O
GPIO port D pin 4
Digital I/O
GPIO port D pin 5
PD6/XOSC32K_Q1
PD7/XOSC32K_Q2
R_BIAS
Digital/analog I/O
Digital/analog I/O
Analog I/O
GPIO port D pin 6 / 32-kHz crystal oscillator pin 1
GPIO port D pin 7 / 32-kHz crystal oscillator pin 1
External precision bias resistor for reference current
Reset, active-low
RESET_N
Digital input
Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RF_N
RF_P
38
37
RF I/O
RF I/O
Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
USB_P
2
3
USB I/O
USB differential data plus (D+)
USB_N
USB I/O
USB differential data minus (D–)
XOSC32M_Q1
XOSC32M_Q2
34
35
Analog I/O
Analog I/O
32-MHz crystal oscillator pin 1 or external-clock input
32-MHz crystal oscillator pin 2
8
Terminal Configuration and Functions
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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
5 Specifications
5.1 Absolute Maximum Ratings(1)(2)(3)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
MAX
UNIT
V
Supply voltage
Voltage on any digital pin
Input RF level
Tstg
All supply pins must have the same voltage
3.9
VDD + 0.3, ≤ 3.9
V
10
dBm
°C
Storage temperature range
–40
125
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
(3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS001(1)
±1
kV
Electrostatic discharge (ESD)
performance:
VESD
Charged device model (CDM),
All pins
±500
V
per JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
Operating ambient temperature range, TA
–40
2
125
3.6
°C
V
(1)
Operating supply voltage
(1) The CC2538 contains a power on reset (POR) module and a brown out detector (BOD) that prevent the device from operating under
unsafe supply voltage conditions. In the two lowest power modes, PM2 and PM3, the POR is active but the BOD is powered down,
which gives a limited voltage supervision.
If the supply voltage is lowered to below 1.4 V during PM2/PM3, at temperatures of 70°C or higher, and then brought back up to good
operating voltage before active mode is re-entered, registers and RAM contents that are saved in PM2, PM3 may become altered.
Hence, care should be taken in the design of the system power supply to ensure that this does not occur. The voltage can be
periodically supervised accurately by entering active mode, as a BOD reset is triggered if the supply voltage is below approximately
1.7 V.
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Specifications
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5.4 Electrical Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and 8-MHz system clock, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to
2507 MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
Digital regulator on. 16-MHz RCOSC running. No radio,
crystals, or peripherals active.
7
mA
CPU running at 16-MHz with flash access
32-MHz XOSC running. No radio or peripherals active.
CPU running at 32-MHz with flash access,.
13
20
24
24
34
mA
mA
32-MHz XOSC running, radio in RX mode, –50-dBm input
power, no peripherals active, CPU idle
32-MHz XOSC running, radio in RX mode at –100-dBm input
power (waiting for signal), no peripherals active, CPU idle
27 mA
mA
32-MHz XOSC running, radio in TX mode, 0-dBm output
power, no peripherals active, CPU idle
Icore
Core current consumption
32-MHz XOSC running, radio in TX mode, 7-dBm output
power, no peripherals active, CPU idle
mA
Power mode 1. Digital regulator on; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, BOD
and sleep timer active; RAM and register retention
0.6
mA
Power mode 2. Digital regulator off; 16-MHz RCOSC and
32-MHz crystal oscillator off; 32.768-kHz XOSC, POR, and
sleep timer active; RAM and register retention
1.3
0.4
2
1
µA
µA
Power mode 3. Digital regulator off; no clocks; POR active;
RAM and register retention
Peripheral Current Consumption (Adds to core current Icore for each peripheral unit activated)
General-purpose timer
Timer running, 32-MHz XOSC used
120
300
0.1
0.7
0.9
3.8
1.2
12
µA
µA
SPI
I2C
mA
mA
µA
UART
Sleep timer
USB
Iperi
Including 32.753-kHz RCOSC
48-MHz clock running, USB enabled
When converting
mA
mA
mA
mA
ADC
Erase
Flash
Burst-write peak current
8
10
Specifications
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ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
5.5 General Characteristics
Measured on TI's CC2538 EM reference design with TA = 25 °C and VDD = 3 V, unless otherwise noted.
PARAMETER
Wake-Up and Timing
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Digital regulator on, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of 16-MHz RCOSC
Power mode 1 → active
4
µs
µs
Digital regulator off, 16-MHz RCOSC and 32-MHz crystal
oscillator off. Start-up of regulator and 16-MHz RCOSC
Power mode 2 or 3 → active
136
0.5
Initially running on 16-MHz RCOSC, with 32-MHz XOSC off
With 32-MHz XOSC initially on
ms
µs
µs
µs
Active → TX or RX
192
192
RX/TX and TX/RX turnaround
USB PLL start-up time
Radio Part
With 32-MHz XOSC initially on
32
Programmable in 1-MHz steps, 5 MHz between channels
for compliance with
RF frequency range
2394
2507
MHz
(1)
(1)
Radio baud rate
Radio chip rate
Flash Memory
Flash erase cycles
Flash page size
As defined by
250
2
kbps
(1)
As defined by
MChip/s
20 k Cycles
KB
2
(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
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Specifications
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5.6 RF Receive Section
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V, and fc = 2440 MHz, unless otherwise noted.
Bold limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507 MHz.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
PER = 1%, as specified by (1), normal operating conditions
(25 °C, 3 V, 2440 MHz)
–97
–92
dBm
(1) requires –85 dBm
Receiver sensitivity
PER = 1%, as specified by (1), entire operating conditions
–88
dBm
dBm
(1) requires –85 dBm
(1)
PER = 1%, as specified by
Saturation (maximum input level)
10
44
(1) requires –20 dBm
Wanted signal –82 dBm, adjacent modulated channel at
Adjacent-channel rejection,
5-MHz channel spacing
(1)
5 MHz, PER = 1%, as specified by
.
dB
dB
dB
dB
(1) requires 0 dB
Wanted signal –82 dBm, adjacent modulated channel at
Adjacent-channel rejection,
–5-MHz channel spacing
(1)
–5 MHz, PER = 1%, as specified by
.
44
52
52
(1) requires 0 dB
Wanted signal –82 dBm, adjacent modulated channel at
Alternate-channel rejection,
10-MHz channel spacing
(1)
10 MHz, PER = 1%, as specified by
(1) requires 30 dB
Wanted signal –82 dBm, adjacent modulated channel at
Alternate-channel rejection,
–10-MHz channel spacing
(1)
–10 MHz, PER = 1%, as specified by
(1) requires 30 dB
Channel rejection
Wanted signal at –82 dBm. Undesired signal is an IEEE
802.15.4 modulated channel, stepped through all channels
from 2405 to 2480 MHz. Signal level for PER = 1%.
dB
≥ 20 MHzXXXXX
≤ –20 MHzXXXXX
51
51
Blocking/desensitization
5 MHz from band edgeXXXXX Wanted signal 3 dB above the sensitivity level, CW jammer,
10 MHz from band edgeXXXXX PER = 1%. Measured according to EN 300 440 class 2.
20 MHz from band edgeXXXXX
50 MHz from band edgeXXXXX
–5 MHz from band edgeXXXXX
–10 MHz from band edgeXXXXX
–20 MHz from band edgeXXXXX
–50 MHz from band edgeXXXXX
–35
–34
–37
–32
–37
–38
–35
–34
dBm
Spurious emission. Only largest spurious
emission stated within each band.
Conducted measurement with a 50-Ω single-ended load.
Suitable for systems targeting compliance with EN 300 328,
EN 300 440, FCC CFR47 Part 15, and ARIB STD-T-66.
dBm
30 MHz–1000 MHzXXXXX
1 GHz–12.75 GHzXXXXX
–80
–80
Frequency error tolerance(2)
Symbol rate error tolerance(3)
(1) requires minimum 80 ppm
(1) requires minimum 80 ppm
±150
ppm
ppm
±1000
(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
(2) Difference between center frequency of the received RF signal and local oscillator frequency
(3) Difference between incoming symbol rate and the internally generated symbol rate
12
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5.7 RF Transmit Section
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
Boldface limits apply over the entire operating range, TA = –40°C to 125°C, VDD = 2 V to 3.6 V, and fc = 2394 MHz to 2507
MHz.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Delivered to a single-ended 50-Ω load through a balun using
maximum-recommended output-power setting
(1) requires minimum –3 dBm
Nominal output power
7
dBm
Programmable output-power
range
30
dB
Maximum recommended output power setting(2)
Measured according to stated regulations.
Spurious emissions
25–1000 MHz (outside restricted bands)
–56
–58
–58
–60
–54
–51
–42
25–1000 MHz (within FCC restricted bands)
25–1000 MHz (within ETSI restricted bands)
1800–1900 MHz (ETSI restricted band)
Only largest spurious emission
stated within each band.
dBm
5150–5300 MHz (ETSI restricted band)
1–12.75 GHz (except restricted bands)
At 2483.5 MHz and above (FCC restricted band), fc= 2480 MHz(3)
Measured as defined by (1) using maximum-recommended output-
Error vector magnitude (EVM) power setting
3%
(1) requires maximum 35%.
Optimum load impedance
Differential impedance on the RF pins
66 + j64
Ω
(1) IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless
Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
(2) TI's CC2538 EM reference design is suitable for systems targeting compliance with EN 300 328, EN 300 440, FCC CFR47 Part 15, and
ARIB STD-T-66.
(3) To improve margins for passing FCC requirements at 2483.5 MHz and above when transmitting at 2480 MHz, use a lower output-power
setting or less than 100% duty cycle.
Copyright © 2012–2015, Texas Instruments Incorporated
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5.8 32-MHz Crystal Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Crystal frequency
TEST CONDITIONS
MIN
TYP
MAX UNIT
32
MHz
Crystal frequency accuracy
requirement(1)
–40
40 ppm
ESR
C0
Equivalent series resistance
Crystal shunt capacitance
Crystal load capacitance
Start-up time
6
1
16
1.9
13
60
7
Ω
pF
pF
ms
CL
10
16
0.3
The crystal oscillator must be in power down for a
guard time before using it again. This requirement
is valid for all modes of operation. The need for
power-down guard time can vary with crystal type
and load.
Power-down guard time
3
ms
(1) Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
5.9 32.768-kHz Crystal Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Crystal frequency
TEST CONDITIONS
MIN
TYP MAX UNIT
32.768
kHz
Crystal frequency accuracy
requirement(1)
–40
40
ppm
ESR
C0
Equivalent series resistance
Crystal shunt capacitance
Crystal load capacitance
Start-up time
40
0.9
12
130
2
Ω
pF
pF
s
CL
16
0.4
(1) Including aging and temperature dependency, as specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and
Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
5.10 32-kHz RC Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Calibrated frequency(1)
TEST CONDITIONS
MIN
TYP
32.753
±0.2%
0.4
MAX UNIT
kHz
Frequency accuracy after calibration
Temperature coefficient(2)
Supply-voltage coefficient(3)
Calibration time(4)
%/ °C
%/V
ms
3
2
(1) The calibrated 32-kHz RC oscillator frequency is the 32-MHz XTAL frequency divided by 977.
(2) Frequency drift when temperature changes after calibration
(3) Frequency drift when supply voltage changes after calibration
(4) When the 32-kHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC32K_CALDIS is 0.
14
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5.11 16-MHz RC Oscillator
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
Frequency(1)
TEST CONDITIONS
MIN
TYP
16
MAX
UNIT
MHz
Uncalibrated frequency accuracy
Calibrated frequency accuracy
Start-up time
±18%
±0.6%
±1%
10
µs
µs
Initial calibration time(2)
50
(1) The calibrated 16-MHz RC oscillator frequency is the 32-MHz xtal frequency divided by 2.
(2) When the 16-MHz RC oscillator is enabled, it is calibrated when a switch from the 16-MHz RC oscillator to the 32-MHz crystal oscillator
is performed while SLEEPCMD.OSC_PD is set to 0.
5.12 RSSI/CCA Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RSSI range
100
dB
Absolute uncalibrated RSSI/CCA
accuracy
±4
dB
RSSI/CCA offset(1)
73
1
dB
dB
Step size (LSB value)
(1) Real RSSI = Register value – offset
5.13 FREQEST Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
FREQEST range
TEST CONDITIONS
MIN
TYP
±250
±10
15
MAX
UNIT
kHz
kHz
kHz
kHz
FREQEST accuracy
FREQEST offset(1)
Step size (LSB value)
7.8
(1) Real FREQEST = Register value – offset
5.14 Frequency Synthesizer Characteristics
Measured on TI's CC2538 EM reference design with TA = 25°C, VDD = 3 V and fc = 2440 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
At ±1-MHz offset from carrier
MIN
TYP
–111
–119
–126
MAX
UNIT
Phase noise, unmodulated carrier
At ±2-MHz offset from carrier
At ±5-MHz offset from carrier
dBc/Hz
5.15 Analog Temperature Sensor
Measured on TI's CC2538 EM reference design with TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
1422
4.2
MAX
UNIT
12-bit ADC
/1°C
Output at 25°C
Temperature coefficient
Voltage coefficient
1
/0.1 V
°C
Measured using integrated ADC, using
internal band-gap voltage reference and
maximum resolution
Initial accuracy without calibration
±10
Accuracy using 1-point calibration (entire
temperature range)
±5
°C
Current consumption when enabled (ADC
current not included)
0.3
mA
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5.16 ADC Characteristics
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
VDD is voltage on AVDD5 pin
MIN
0
TYP MAX
UNIT
V
Input voltage
VDD
VDD
VDD
External reference voltage
External reference voltage differential
Input resistance, signal
VDD is voltage on AVDD5 pin
0
V
VDD is voltage on AVDD5 pin
0
V
Using 4-MHz clock speed
197
2.97
5.7
kΩ
V
Full-scale signal(1)
Peak-to-peak, defines 0 dBFS
Single-ended input, 7-bit setting
Single-ended input, 9-bit setting
Single-ended input, 10-bit setting
Single-ended input, 12-bit setting
Differential input, 7-bit setting
7.5
9.3
10.8
6.5
ENOB(1)
Effective number of bits
Bits
Differential input, 9-bit setting
8.3
Differential input, 10-bit setting
Differential input, 12-bit setting
7-bit setting, both single and differential
Single-ended input, 12-bit setting, –6 dBFS
Differential input, 12-bit setting, –6 dBFS
Single-ended input, 12-bit setting
Differential input, 12-bit setting
Single-ended input, 12-bit setting, –6 dBFS
Differential input, 12-bit setting, –6 dBFS
10.0
11.5
0–20
–75.2
–86.6
70.2
79.3
78.8
88.9
Useful power bandwidth
Total harmonic distortion
kHz
dB
THD(1)
Signal to nonharmonic ratio(1)
dB
dB
Differential input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
CMRR
Common-mode rejection ratio
Crosstalk
>84
Single-ended input, 12-bit setting, 1-kHz sine (0
dBFS), limited by ADC resolution
< –84
dB
Offset
Midscale
–3
0.68%
0.05
0.9
mV
Gain error
12-bit setting, mean
DNL(1)
INL(1)
Differential nonlinearity
Integral nonlinearity
LSB
LSB
12-bit setting, maximum
12-bit setting, mean
4.6
12-bit setting, maximum
Single-ended input, 7-bit setting
Single-ended input, 9-bit setting
Single-ended input, 10-bit setting
Single-ended input, 12-bit setting
Differential input, 7-bit setting
Differential input, 9-bit setting
Differential input, 10-bit setting
Differential input, 12-bit setting
7-bit setting
13.3
35.4
46.8
57.5
66.6
40.7
51.6
61.8
70.8
20
SINAD(1)
(–THD+N)
Signal-to-noise-and-distortion
dB
9-bit setting
36
Conversion time
µs
10-bit setting
68
12-bit setting
132
1.2
Current consumption
mA
V
Internal reference voltage
Internal reference VDD coefficient
1.19
2
mV/V
(1) Measured with 300-Hz sine-wave input and VDD as reference
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ADC Characteristics (continued)
TA = 25°C and VDD = 3 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Internal reference temperature
coefficient
0.4
mV/10 °C
5.17 Control Input AC Characteristics
TA = –40°C to 125°C, VDD = 2 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN TYP
MAX UNIT
The undivided system clock is 32 MHz when crystal oscillator is used.
The undivided system clock is 16 MHz when calibrated 16-MHz RC
oscillator is used.
System clock, fSYSCLK
tSYSCLK = 1/fSYSCLK
16
32
MHz
See item 1, Figure 5-1. This is the shortest pulse that is recognized
as a complete reset pin request.
RESET_N low duration(1)
Interrupt pulse duration
1
µs
ns
See item 2, Figure 5-1.This is the shortest pulse that is recognized as
an interrupt request.
20
(1) Shorter pulses may be recognized, but might not lead to a complete reset of all modules within the chip.
RESET_N
1
2
Px.n
T0299-01
Figure 5-1. Control Input AC Characteristics
5.18 DC Characteristics
TA = 25°C, VDD = 3 V, drive strength set to high with CC_TESTCTRL.SC = 1, unless otherwise noted.
PARAMETER
Logic-0 input voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
0.5
Logic-1 input voltage
2.5
–300
–300
V
Logic-0 input current
Input equals 0 V
300
300
nA
nA
kΩ
V
Logic-1 input current
Input equals VDD
I/O-pin pullup and pulldown resistors
Logic-0 output voltage, 4-mA pins
Logic-1 output voltage, 4-mA pins
Logic-0 output voltage, 20-mA pins
Logic-1 output voltage, 20-mA pins
20
Output load 4 mA
Output load 4 mA
Output load 20 mA
Output load 20 mA
0.5
0.5
2.4
2.4
V
V
V
5.19 USB Interface DC Characteristics
TA = 25°C, VDD = 3 V to 3.6 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
VDD 3.6 V, 4-mA load
VDD 3.6 V, 4-mA load
MIN
TYP
MAX
UNIT
V
USB pad voltage output, high
USB pad voltage output, low
3.4
0.2
V
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5.20 Thermal Resistance Characteristics for RTQ Package
NAME
RθJC-top
RθJB
DESCRIPTION
°C/W(1) (2)
8.9
AIR FLOW (m/s)(3)
Junction-to-case (top)
Junction-to-board
0.00
0.00
0.00
0.00
0.00
3.1
RθJA
Junction-to-free air
Junction-to-package top
Junction-to-board (bottom)
25.0
3.1
PsiJT
PsiJB-bottom
0.4
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RθJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
•
•
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(3) m/s = meters per second.
18
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6 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
Few external components are required for the operation of the CC2538xFnn. Figure 6-1 is a typical
application circuit. For a complete USB reference design, see the CC2538xFnn product page on
www.ti.com. Table 6-1 lists typical values and descriptions of external components. The USB_P and
USB_N pins require series resistors R21 and R31 for impedance matching, and the D+ line must have a
pullup resistor, R32. The series resistors should match the 90-Ω ±15% characteristic impedance of the
USB bus. Notice that the pullup resistor and DVDD_USB require connection to a voltage source between
3 V and 3.6 V (typically 3.3 V). To accomplish this, it is recommend to connect the D+ pull-up to a port/pin
that does not have an internal pullup (that is, PC0..3), instead of connecting it directly to a 3.3 V supply
(that is, software control of D+ pullup recommended).
Optional 32 kHz crystal
C451
2.0 V-3.6 V power supply
3.3 V power supply
C561
C441
Antenna
(50 Ω)
R421
R_BIAS 42
AVDD 41
1 DGND_USB
2 USB_P
R31
R21
D+
D-
C382
C381
C371
AVDD 40
3 USB_N
L374
L381
C372
3.3 nH
AVDD 39
4 DVDD_USB
5 PB0
L373
2 nH
RF_N 38
R32
C31
C21
RF_P 37
6 PC7
7 PC6
8 PC5
9 PC4
C373
AVDD 36
1.2 pF
CC2538
DIE ATTACH PAD:
XOSC32M_Q2 35
XOSC32M_Q1 34
L372
AVDD 33
DCOUPL2 32
PD5 31
10 VDD
11 PC3
12 PC2
13 PC1
14 PC0
PD4 30
PD3 29
C321
XTAL
C341
C351
C281
Power supply decoupling capacitors are not shown
Digital I/O not connected
R281
RESET_N
Figure 6-1. CC2538xFnn Application Circuit
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Table 6-1. Overview of External Components (Excluding Supply Decoupling
Capacitors)
Component
C21
Description
Value
47 pF
47 pF
12 pF
12 pF
18 pF
18 pF
1 pF
USB D– decoupling
USB D+ decoupling
C31
C341
C351
C371
C381
C382
C372
C441
C451
C561
C321
C281
L372
L381
R21
32-MHz xtal-loading capacitor
32-MHz xtal-loading capacitor
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
Part of the RF matching network
32-kHz xtal-loading capacitor
1 pF
22 pF
22 pF
1 µF
32-kHz xtal-loading capacitor
Decoupling capacitor for the internal digital regulator
Decoupling capacitor for the internal digital regulator
Filter capacitor for reset line
1 µF
1 nF
Part of the RF matching network
Part of the RF matching network
USB D– series resistor
2 nH
2 nH
33 Ω
R31
USB D+ series resistor
33 Ω
R32
USB D+ pullup resistor to signal full-speed device presence
Filter resistor for reset line
1.5 kΩ
2.2 Ω
56 kΩ
R281
R421
Resistor used for internal biasing
6.1 Input, Output Matching
When using an unbalanced antenna such as a monopole, use a balun to optimize performance. One can
implement the balun using low-cost, discrete inductors and capacitors. The recommended balun shown in
Figure 6-1 consists of L372, C372, C382 and L381.
If a balanced antenna such as a folded dipole is used, omit the balun.
6.2 Crystal
The 32-MHz crystal oscillator uses an external 32-MHz crystal, XTAL1, with two loading capacitors (C341
and C351). See the 32-MHz Crystal Oscillator section for details. Calculate the load capacitance across
the 32-MHz crystal by Equation 1.
1
CL =
+ Cparasitic
1
1
+
C341 C351
(1)
XTAL2 is an optional 32.768-kHz crystal, with two loading capacitors (C441 and C451) used for the
32.768-kHz crystal oscillator. Use the 32.768-kHz crystal oscillator in applications where both low sleep-
current consumption and accurate wake-up times are needed. Calculate the load capacitance across the
32.768-kHz crystal by Equation 2.
1
CL =
+ Cparasitic
1
1
+
C441 C451
(2)
Use a series resistor, if necessary, to comply with the ESR requirement.
20
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6.3 On-Chip 1.8-V Voltage-Regulator Decoupling
The 1.8-V on-chip voltage regulator supplies the 1.8-V digital logic. This regulator requires decoupling
capacitors (C561, C321) and an external connection between them for stable operation.
6.4 Power-Supply Decoupling and Filtering
Optimum performance requires proper power-supply decoupling. The placement and size of the
decoupling capacitors and the power supply filtering are important to achieve the best performance in an
application. TI provides a recommended compact reference design for the user to follow.
6.5 References
1. IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY)
Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf
2. CC2538xFnn User's Guide
3. Universal Serial Bus Revision 2.0 Specification
http://www.usb.org/developers/docs/usb_20_052709.zip
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Applications, Implementation, and Layout
21
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7 器件和文档支持
7.1 器件支持
7.1.1 开发支持
TI 提供大量的开发工具,其中包括评估处理器性能、生成代码、开发算法工具、以及完全集成和调试软件及
硬件模块的工具。工具的电子支持文档可从 Code Composer Studio™ 集成开发环境 (IDE) 中获得。
下列产品支持 CC2538 器件的 开发需求:
软件开发工具:Code Composer Studio™ 集成开发环境 (IDE):其中包括支持任意 CC2538 器件应用所需
的以下工具:编辑器、C/C++/汇编代码生成工具、调试工具以及能够提供基本运行时目标软件的可扩展实时
基础软件 (DSP/BIOS™)。
硬件开发工具:扩展开发系统 (XDS™) 仿真器
有关 CC2538 平台开发支持工具的完整列表,请访问德州仪器 (TI) 网站 www.ti.com.cn。有关定价和购买信
息,请联系最近的 TI 销售办事处或授权分销商。
7.1.2 器件命名规则
为了指出产品开发周期所处的阶段,TI 为所有微处理器 (MPU) 和支持工具的产品型号分配了前缀。每个器
件都具有以下三个前缀中的一个:X、P 或无(无前缀)(例如,CC2538)。
器件开发进化流程:
X
试验器件不一定代表最终器件的电气规范标准并且不可使用生产组装流程。
原型器件不一定是最终芯片模型并且不一定符合最终电气标准规范。
完全合格的芯片模型的生产版本。
P
无
支持工具开发进化流程:
X 和 P 器件在供货时附带如下免责声明:
“开发的产品用于内部评估用途。”
生产器件已进行完全特性化,并且器件的质量和可靠性已经完全论证。TI 的标准保修证书适用。
预测显示原型器件(X 或者 P)的故障率大于标准生产器件。由于它们的预计的最终使用故障率仍未定义,
德州仪器 (TI) 建议不要将这些器件用于任何生产系统。只有合格的生产器件将被使用。
TI 器件的命名规则也包括一个带有器件系列名称的后缀。这个后缀表示封装类型(例如,RTQ)和温度范围
(例如,“空白”是默认的商业级温度范围)。
要获得
RTQ
封装类型的
CC2538
器件订购部件号,请参见本文档的“封装选项附录”(TI
网站
www.ti.com),或者联系您的 TI 销售代表。
22
器件和文档支持
版权 © 2012–2015, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: CC2538
CC2538
www.ti.com.cn
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
7.2 文档支持
以下文档介绍了 CC2538 处理器。在 www.ti.com.cn 内提供这些文档的副本。
SWRZ045 CC2538 适用于 2.4GHz IEEE 802.15.4、6LoWPAN 和 ZigBee 应用的 SoC 勘误
SWRA467 基于 CC2538 开发支持 Zigbee 的低成本智能能量计
SWRA456 支持 Z-Stack 的 CC2538 终端设备功耗测量和优化
SWRA447 使用 CC2592 前端与 CC2538
SWRA437 CC2538 + CC1200 评估模块
SWRA443 使用 GCC/GDB 与 CC2538
SWRU325 CC2538 外设驱动程序库用户指南
SWRU319 用于 2.4GHz IEEE 802.15.4 和 ZigBee/ZigBee IP 应用的 CC2538 SoC 用户指南
SWRU333 CC2538 ROM 用户指南
7.2.1 社区资源
下列链接提供到 TI 社区资源的连接。 链接的内容由各个分销商“按照原样”提供。 这些内容并不构成 TI 技术
规范和标准且不一定反映 TI 的观点;请见 TI 的使用条款。
TI E2E™ 在线社区 TI 工程师对工程师 (E2E) 社区。 此社区的创建目的是为了促进工程师之间协作。 在
e2e.ti.com 中,您可以咨询问题、共享知识、探索思路,在同领域工程师的帮助下解决问题。
德州仪器 (TI) 嵌入式处理器维基网站 德州仪器 (TI) 嵌入式处理器维基网站。 此网站的建立是为了帮助开发
人员从德州仪器 (TI) 的嵌入式处理器入门并且也为了促进与这些器件相关的硬件和软件的总体
知识的创新和增长。
7.3 其他信息
德州仪器 (TI) 为工业和消费类应用中所使用的专有应用和标准无线 应用 提供各种经济实用的低功耗射频 选
择。其中包括适用于 1GHz 以下频段和 2.4GHz 频段的射频收发器、射频发送器、射频前端和片上系统以及
各种软件解决方案。
此外,德州仪器 (TI) 还提供广泛的相关支持,例如开发工具、技术文档、参考设计、应用专业技术、客户支
持、第三方服务以及大学计划。
低功耗射频 E2E 在线社区设有技术支持论坛并提供视频和博客,您有机会在此与全球同领域工程师交流互
动。
凭借丰富的供选产品解决方案、可实现的最终应用以及广泛的技术支持,德州仪器 (TI) 能够为您提供最全面
的低功耗射频产品组合。
7.3.1 德州仪器 (TI) 低功耗射频网站
德州仪器 (TI) 的低功耗射频网站提供所有最新产品、应用和设计笔记、FAQ 部分、新闻资讯以及活动更
新。请访问 www.ti.com.cn/lprf。
版权 © 2012–2015, Texas Instruments Incorporated
器件和文档支持
23
提交文档反馈意见
产品主页链接: CC2538
CC2538
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
www.ti.com.cn
7.3.2 低功耗射频在线社区
•
•
•
论坛、视频和博客
射频设计帮助
E2E 交流互动
访问:www.ti.com/lprf-forum 立即体验。
7.3.3 德州仪器 (TI) 低功耗射频开发者网络
德州仪器 (TI) 建立了一个大型低功耗射频开发合作伙伴网络,帮助客户加快应用开发。此网络中包括推荐的
公司、射频顾问和独立设计工作室,他们可提供一系列硬件模块产品和设计服务,其中包括:
•
•
•
射频电路、低功耗射频和 ZigBee 设计服务
低功耗射频和 ZigBee 模块解决方案以及开发工具
射频认证服务和射频电路制造
如果需要有关模块、工程服务或开发工具的帮助:
请搜索低功耗射频开发者网络查找适合的合作伙伴。www.ti.com.cn/lprfnetwork
7.3.4 低功耗射频电子新闻简报
通过低功耗射频电子新闻简报,您能够了解到最新的产品、新闻稿、开发者相关新闻以及关于德州仪器 (TI)
低功耗射频产品其它新闻和活动。低功耗射频电子新闻简报文章包含可获取更多在线信息的链接。
访问:www.ti.com.cn/lprfnewsletter 立即注册
7.4 商标
Code Composer Studio, SmartRF, E2E are trademarks of Texas Instruments.
Cortex is a registered trademark of ARM Limited.
ARM is a registered trademark of ARM Physical IP, Inc.
IAR Embedded Workbench is a registered trademark of IAR Systems AB.
ZigBee is a registered trademark of ZigBee Alliance.
7.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
7.6 出口管制提示
接收方同意:如果美国或其他适用法律限制或禁止将通过非披露义务的披露方获得的任何产品或技术数据
(其中包括软件)(见美国、欧盟和其他出口管理条例之定义)、或者其他适用国家条例限制的任何受管制
产品或此项技术的任何直接产品出口或再出口至任何目的地,那么在没有事先获得美国商务部和其他相关政
府机构授权的情况下,接收方不得在知情的情况下,以直接或间接的方式将其出口。
7.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
24
器件和文档支持
版权 © 2012–2015, Texas Instruments Incorporated
提交文档反馈意见
产品主页链接: CC2538
CC2538
www.ti.com.cn
ZHCSAU4D –DECEMBER 2012–REVISED APRIL 2015
8 机械、封装和可订购信息
8.1 封装信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知
且不对本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2012–2015, Texas Instruments Incorporated
机械、封装和可订购信息
25
提交文档反馈意见
产品主页链接: CC2538
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
CC2538NF11RTQR
CC2538NF11RTQT
CC2538NF23RTQR
CC2538NF23RTQT
CC2538NF53RTQR
CC2538NF53RTQT
CC2538SF23RTQR
CC2538SF23RTQT
CC2538SF53RTQR
CC2538SF53RTQT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
QFN
QFN
QFN
QFN
QFN
QFN
QFN
QFN
QFN
QFN
RTQ
RTQ
RTQ
RTQ
RTQ
RTQ
RTQ
RTQ
RTQ
RTQ
56
56
56
56
56
56
56
56
56
56
2000 RoHS & Green
250 RoHS & Green
2000 RoHS & Green
250 RoHS & Green
2000 RoHS & Green
250 RoHS & Green
2000 RoHS & Green
250 RoHS & Green
2000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
CC2538NF11
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
CC2538NF11
CC2538NF23
CC2538NF23
CC2538NF53
CC2538NF53
CC2538SF23
CC2538SF23
CC2538SF53
CC2538SF53
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Nov-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CC2538NF11RTQR
CC2538NF23RTQR
CC2538NF53RTQR
CC2538SF23RTQR
CC2538SF53RTQR
QFN
QFN
QFN
QFN
QFN
RTQ
RTQ
RTQ
RTQ
RTQ
56
56
56
56
56
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
16.4
16.4
8.3
8.3
8.3
8.3
8.3
8.3
8.3
8.3
8.3
8.3
2.25
2.25
2.25
2.25
2.25
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
Q2
Q2
Q2
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Nov-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CC2538NF11RTQR
CC2538NF23RTQR
CC2538NF53RTQR
CC2538SF23RTQR
CC2538SF53RTQR
QFN
QFN
QFN
QFN
QFN
RTQ
RTQ
RTQ
RTQ
RTQ
56
56
56
56
56
2000
2000
2000
2000
2000
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
350.0
43.0
43.0
43.0
43.0
43.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RTQ 56
8 x 8, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224653/A
www.ti.com
PACKAGE OUTLINE
RTQ0056C
VQFN - 1 mm max height
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
8.15
7.85
A
B
PIN 1 INDEX AREA
8.15
7.85
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
2X 6.5
SYMM
(0.2) TYP
EXPOSED
THERMAL PAD
28
15
14
29
SYMM
57
2X 6.5
6.6 0.1
1
42
52X 0.5
PIN 1 ID
0.30
0.18
56
43
56X
0.5
0.3
0.1
C A B
56X
0.05
4224872/A 03/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RTQ0056C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.05) TYP
SEE SOLDER MASK
DETAIL
(0.62) TYP
(1.24)
TYP
56X (0.6)
56X (0.24)
56
43
1
42
52X (0.5)
(3.05) TYP
(1.24) TYP
(R0.05) TYP
57
SYMM
(7.8)
(0.62) TYP
(
6.6)
0.2) TYP
VIA
14
29
28
15
SYMM
(7.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224872/A 03/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RTQ0056C
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.24) TYP
43
56X (0.6)
56X (0.24)
56
1
42
52X (0.5)
(R0.05) TYP
(1.24) TYP
(7.8)
57
SYMM
25X ( 1.04)
14
29
15
28
SYMM
(7.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 57
62% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4224872/A 03/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器 (TI) 公司
相关型号:
CC2538SF53RTQR
具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU | RTQ | 56 | -40 to 125
TI
CC2538SF53RTQT
具有 512kB 闪存和 32kB RAM 的 32 位 Arm Cortex-M3 Zigbee 和 6LoWPAN、IEEE 802.15.4 无线 MCU | RTQ | 56 | -40 to 125
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