CC3100MOD_15 [TI]
CC3100MOD SimpleLink⢠Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications;
| 型号： | CC3100MOD_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CC3100MOD SimpleLink⢠Certified Wi-Fi® Network Processor Internet-of-Things Module Solution for MCU Applications |
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CC3100MOD
SWRS161 –DECEMBER 2014
CC3100MOD SimpleLink™ Certified Wi-Fi® Network Processor Internet-of-Things Module
Solution for MCU Applications
1 Module Overview
1.1 Features
1
– RX Sensitivity
• The CC3100MOD is a Wi-Fi Module that Consists
of the CC3100R11MRGC Wi-Fi Network Processor
and Power-Management Subsystems. This Fully
Integrated Module Includes all Required Clocks,
SPI Flash, and Passives.
• Modular FCC, IC, and CE Certifications Save
Customer Effort, Time, and Money
• Wi-Fi CERTIFIED™ Modules, With Ability to
Request Certificate Transfer for Wi-Fi Alliance
Members
•
•
•
–94.7 dBm at 1 DSSS
–87 dBm at 11 CCK
–73 dBm at 54 OFDM
– Application Throughput
•
•
UDP: 16 Mbps
TCP: 13 Mbps
• Host Interface
– Wide Range of Power Supply (2.3 to 3.6 V)
– Interfaces With 8-, 16-, and 32-Bit MCU or
ASICs Over a Serial Peripheral Interface (SPI)
With up to 20-MHz Clock
• Wi-Fi Network Processor Subsystem
– Featuring Wi-Fi Internet-On-a-Chip™
– Dedicated ARM® MCU
– Low Footprint Host Driver: Less than 6KB
– Supports RTOS and No-OS Applications
• Power-Management Subsystem
Completely Offloads Wi-Fi and Internet
Protocols from the External Microcontroller
– Wi-Fi Driver and Multiple Internet Protocols in
ROM
– 802.11 b/g/n Radio, Baseband, and Medium
Access Control (MAC), Wi-Fi Driver, and
Supplicant
– Integrated DC-DC Converter With a Wide-
Supply Voltage:
•
Direct Battery Mode: 2.3 to 3.6 V
– Low-Power Consumption at 3.6 V
•
Hibernate With Real-Time Clock (RTC):
7 μA
Standby: 140 μA
RX Traffic: 54 mA at 54 OFDM
TX Traffic: 223 mA at 54 OFDM
– TCP/IP Stack
•
Industry-Standard BSD Socket Application
Programming Interfaces (APIs)
•
•
•
•
•
8 Simultaneous TCP or UDP Sockets
2 Simultaneous TLS and SSL Sockets
– Integrated Components on Module
– Powerful Crypto Engine for Fast, Secure Wi-Fi
and Internet Connections With 256-Bit AES
Encryption for TLS and SSL Connections
– Station, AP, and Wi-Fi Direct™ Modes
– WPA2 Personal and Enterprise Security
•
•
•
40.0-MHz Crystal With Internal Oscillator
32.768-kHz Crystal (RTC)
8-Mbit SPI Serial Flash RF Filter and
Passive Components
– SimpleLink Connection Manager for
Autonomous and Fast Wi-Fi Connections
– SmartConfig™ Technology, AP Mode, and
WPS2 for Easy and Flexible Wi-Fi Provisioning
– Package and Operating Conditions
•
1.27-mm Pitch, 63-Pin, 20.5-mm ×
17.5-mm LGA Package for Easy Assembly
and Low-Cost PCB Design
– TX Power
•
Operating Temperature Range: –20°C to
70°C
•
•
•
17 dBm at 1 DSSS
17.25 dBm at 11 CCK
13.5 dBm at 54 OFDM
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CC3100MOD
SWRS161 –DECEMBER 2014
www.ti.com
1.2 Applications
•
•
•
•
•
•
•
Internet of Things (IoT)
Cloud Connectivity
Home Automation
Home Appliances
Access Control
•
•
•
•
•
•
Internet Gateway
Industrial Control
Smart Plug and Metering
Wireless Audio
IP Network Sensor Nodes
Wearables
Security Systems
Smart Energy
1.3 Description
Add Wi-Fi to low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications. The
CC3100MOD is FCC, IC, CE, and Wi-Fi CERTIFIED module is part of the new SimpleLink Wi-Fi family
that dramatically simplifies the implementation of Internet connectivity. The CC3100MOD integrates all
protocols for Wi-Fi and Internet, which greatly minimizes host MCU software requirements. With built-in
security protocols, the CC3100MOD solution provides a robust and simple security experience.
Additionally, the CC3100MOD is a complete platform solution including various tools and software, sample
applications, user and programming guides, reference designs and the TI E2E™ support community. The
CC3100MOD is available an LGA package that is easy to lay out with all required components including
serial flash, RF filter, crystal, passive components fully integrated.
The Wi-Fi network processor subsystem features a Wi-Fi Internet-on-a-Chip and contains an additional
dedicated ARM MCU that completely off-loads the host MCU. This subsystem includes an 802.11 b/g/n
radio, baseband, and MAC with a powerful crypto engine for fast, secure Internet connections with 256-bit
encryption. The CC3100MOD module supports Station, Access Point, and Wi-Fi Direct modes. The
module also supports WPA2 personal and enterprise security and WPS 2.0. This subsystem includes
embedded TCP/IP and TLS/SSL stacks, HTTP server, and multiple Internet protocols. The power-
management subsystem includes an integrated DC-DC converter with support for a wide range of supply
voltages. This subsystem enables low-power consumption modes such as hibernate with RTC mode,
which requires approximately 7 μA of current. The CC3100MOD module can connect to any 8-, 16-, or 32-
bit MCU over the SPI or UART Interface. The device driver minimizes the host memory footprint
requirements of less than 7KB of code memory and 700B of RAM memory for a TCP client application.
Table 1-1. Module Information(1)
PART NUMBER
CC3100MODR11MAMOB
PACKAGE
BODY SIZE
MOB (63)
20.5 mm × 17.5 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.
2
Module Overview
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1.4 Functional Block Diagram
Figure 1-1 shows the functional block diagram of the CC3100MOD module.
32-KHz
Crystal
40-MHz
Crystal
Serial
Flash
8Mbit
VCC
CC3100R11MRGC
HOST I/F
RF Filter
Power
Inductors
Caps
Pull-up
resistors
CC3100MOD
Figure 1-1. CC3100MOD Functional Block Diagram
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Module Overview
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RAM
ROM
WiFi Driver
TCP/IP & TLS/SSL
Stacks
ARM Processor
Crypto Engine
MAC Processor
Baseband
SPI
UART
DC2DC
PA
BAT Monitor
Oscillators
Radio
LNA
SWAS031-A
Figure 1-2. CC3100 Hardware Overview
User Application
SimpleLink Driver
SPI or UART Driver
External Microcontroller
Internet Protocols
TLS/SSL
Embedded Internet
Embedded Wi-Fi
TCP/IP
Supplicant
Wi-Fi Driver
Wi-Fi MAC
Wi-Fi Baseband
Wi-Fi Radio
ARM Processor (Wi-Fi Network Processor)
SWAS031-B
Figure 1-3. CC3100 Software Overview
4
Module Overview
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Table of Contents
Module Overview ........................................ 1
1
5.4 Power-Management Subsystem .................... 24
5.5 Low-Power Operating Modes ....................... 24
Applications, Implementation, and Layout ....... 26
6.1 Reference Schematics .............................. 26
6.2 Bill of Materials...................................... 27
6.3 Layout Recommendations .......................... 27
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
Revision History ......................................... 6
Terminal Configuration and Functions.............. 7
3.1 CC3100MOD Pin Diagram ........................... 7
3.2 Pin Attributes ......................................... 8
Specifications ........................................... 10
4.1 Absolute Maximum Ratings......................... 10
4.2 Handling Ratings.................................... 10
4.3 Power-On Hours .................................... 10
4.4 Recommended Operating Conditions............... 10
4.5 Brown-Out and Black-Out ........................... 11
6
2
3
7
Environmental Requirements and
Specifications ........................................... 31
7.1 Temperature......................................... 31
7.2 Handling Environment .............................. 31
7.3 Storage Condition ................................... 31
7.4 Baking Conditions................................... 31
7.5 Soldering and Reflow Condition .................... 31
Product and Documentation Support.............. 33
8.1 Development Support ............................... 33
8.2 Device Nomenclature ............................... 33
8.3 Community Resources.............................. 34
8.4 Trademarks.......................................... 34
8.5 Electrostatic Discharge Caution..................... 34
8.6 Export Control Notice ............................... 34
8.7 Glossary ............................................. 34
4
8
4.6
Electrical Characteristics (3.3 V, 25°C) ............. 12
4.7
Thermal Resistance Characteristics for MOB
Package ............................................. 12
4.8 Reset Requirement ................................. 12
4.9 Current Consumption ............................... 13
4.10 WLAN RF Characteristics ........................... 15
4.11 Timing Characteristics............................... 16
Detailed Description ................................... 22
5.1 Overview ............................................ 22
5.2 Functional Block Diagram........................... 23
5.3 Wi-Fi Network Processor Subsystem ............... 23
9
Mechanical Packaging and Orderable
Information .............................................. 35
9.1 Mechanical Drawing................................. 35
9.2 Package Option ..................................... 36
5
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Table of Contents
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2 Revision History
DATE
REVISION
NOTES
November 2014
*
Initial release.
6
Revision History
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3 Terminal Configuration and Functions
3.1 CC3100MOD Pin Diagram
Figure 3-1 shows the pin diagram for the CC3100MOD.
28
29
30 31
32
33
34
35
36
37
38 39 40
41 42
43
GND
NC
27
26
25
24
23
22
21
20
19
18
17
CC3100MOD
44
45
46
47
48
49
50
51
52
53
54
UART1_nRTS
NC
NC
UART1_TX
UART1_RX
TEST_58
TEST_59
TEST_60
UART1_nCTS
TEST_62
NC
SOP1
SOP2
NC
GND
62
61
58
55
GND
GND
GND
GND
GND
GND
63
RESERVED
NC
60
57
59
RESERVED
NC
56
NC
NC
GND
16
15
14 13
12
11
10
9
8
7
6
5
4
3
2
1
Figure 3-1. CC3100MOD Pin Diagram (Bottom View)
NOTE
Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical
diagram refer to Section 9.
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Terminal Configuration and Functions
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3.2 Pin Attributes
Table 3-1 lists the pin descriptions of the CC3100MOD module.
NOTE
If an external device drives a positive voltage to signal pads when the CC3100MOD is not
powered, DC current is drawn from the other device. If the drive strength of the external
device is adequate, an unintentional wakeup and boot of the CC3100MOD can occur. To
prevent current draw, TI recommends one of the following:
•
•
•
All devices interfaced to the CC3100MOD must be powered from the same power rail as
the CC3100MOD.
Use level-shifters between the CC3100MOD and any external devices fed from other
independent rails.
The nRESET pin of the CC3100MOD must be held low until the VBAT supply to the
device is driven and stable.
Table 3-1. Pin Attributes
MODULE PIN MODULE PIN NAME
NO.
TYPE
MODULE PIN DESCRIPTION
1
2
3
4
5
6
7
8
9
10
GND
-
-
-
I
Ground
GND
Ground
NC
Reserved. Do not connect
Hibernate signal, active low. Refer to Figure 4-8.
Host interface SPI clock
nHIB
HOST_SPI_CLK
HOST_SPI_DIN
HOST_SPI_DOUT
HOST_SPI_nCS
NC
I
I
Host interface SPI data input
Host interface SPI data output
Host interface SPI chip select (active low)
Reserved. Do not connect
O
I
-
-
FORCE_AP
For forced AP mode, pull to high on the board using a 100-kΩ resistor. Otherwise,
pull down to ground using a 100-kΩ resistor.(1)
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
HOSTINTR
NC
O
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Interrupt output
Reserved. Do not connect
Reserved. Do not connect
Reserved. Do not connect
Reserved. Do not connect
Ground
NC
NC
NC
GND
NC
Reserved. Do not connect
Reserved. Do not connect
Reserved. Do not connect
Unused. Do not connect.
Add 100-kΩ external pulldown resistor
Reserved. Do not connect
Add 10k pulldown to ground
Reserved. Do not connect.
Reserved. Do not connect
Reserved. Do not connect
Ground
NC
RESERVED
NC
RESERVED
NC
SOP2
SOP1
NC
NC
GND
GND
NC
Ground
Reserved. Do not connect
Ground. Reference for RF signal
GND
(1) Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin.
Terminal Configuration and Functions
8
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Table 3-1. Pin Attributes (continued)
MODULE PIN MODULE PIN NAME
NO.
TYPE
MODULE PIN DESCRIPTION
31
32
33
34
35
36
37
38
39
40
41
42
43
44
RF_BG
I/O
-
2.4-GHz RF input/output
GND
Ground. Reference for RF signal
Reserved. Do not connect
NC
-
SOP0
-
Reserved. Do not connect.
nRESET
I
Power on reset. Does not require external RC circuit
VBAT_DCDC_ANA
VBAT_DCDC_PA
GND
-
Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
Ground
-
-
VDD_ANA2
VBAT_DCDC_DIG_IO
NC
-
To be left unconnected. Used for prototype samples only.
Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
Reserved. Do not connect
-
-
NC
-
Reserved. Do not connect
GND
-
Ground
UART1_nRTS
O
UART request to send, connect to external test point. Used for on-module flash
reprogramming
45
46
NC
-
Reserved. Do not connect
UART1_TX
O
UART transmit, connect to external test point. Used for on-module flash
reprogramming
47
UART1_RX
I
UART receive, connect to external test point. Used for on-module flash
reprogramming
48
49
50
51
TEST_58
O
I
Connect to external test point
Connect to external test point
Connect to external test point
TEST_59
TEST_60
O
I
UART1_nCTS
UART clear to send, connect to external test point. Used for on-module flash
reprogramming
52
53
54
55
56
57
58
59
60
61
62
63
TEST_62
NC
O
-
Connect to external test point
Reserved. Do not connect
Reserved. Do not connect
Thermal Ground
NC
-
GND
GND
GND
GND
GND
GND
GND
GND
GND
-
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
-
Thermal Ground
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4 Specifications
4.1 Absolute Maximum Ratings
These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured
under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term
reliability of the module.
SYMBOL
CONDITION
MIN
–0.5
–0.5
–0.5
–0.5
–40
TYP
3.3
–
MAX
3.8
UNIT
V
VBAT and VIO
Digital I/O
Respect to GND
Respect to GND
VBAT + 0.5
2.1
V
RF pins
V
Analog pins
Temperature
2.1
V
+85
°C
4.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–40
85
°C
Human body model (HBM), per ANSI/ESDA/JEDEC
JS001(1)
–1.0
1.0
kV
Electrostatic discharge (ESD)
performance:
VESD
Charged device model (CDM),
All pins
–250
250
V
per JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4.3 Power-On Hours
CONDITIONS
POH
17,500
TAmbient up to 85°C, assuming 20% active mode and 80% sleep mode
4.4 Recommended Operating Conditions
Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect
long-term reliability of the module.(1)
SYMBOL
CONDITION(2)
Battery mode
–
MIN
2.3
TYP
3.3
25
MAX
3.6
70
UNIT
V
VBAT and VIO
Operating temperature
Ambient thermal slew
–20
–20
°C
20
°C/minute
(1) Operating temperature is limited by crystal frequency variation.
(2) To ensure WLAN performance, the ripple on the power supply must be less than ±300 mV.
10
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4.5 Brown-Out and Black-Out
The module enters a brown-out condition whenever the input voltage dips below VBROWN (see Figure 4-1 and
Figure 4-2). This condition must be considered during design of the power supply routing, especially if operating
from a battery. High-current operations (such as a TX packet) cause a dip in the supply voltage, potentially
triggering a brown-out. The resistance includes the internal resistance of the battery, contact resistance of the
battery holder (4 contacts for a 2 x AA battery) and the wiring and PCB routing resistance.
Figure 4-1. Brown-Out and Black-Out Levels (1 of 2)
Figure 4-2. Brown-Out and Black-Out Levels (2 of 2)
In the brown-out condition, all sections of the CC3100MOD shut down within the module except for the Hibernate
block (including the 32-kHz RTC clock), which remains on. The current in this state can reach approximately 400
µA.
The black-out condition is equivalent to a hardware reset event in which all states within the module are lost.
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UNIT
4.6 Electrical Characteristics (3.3 V, 25°C)
PARAMETER
TEST
MIN
NOM
MAX
CONDITIONS
CIN
VIH
VIL
IIH
Pin capacitance
4
pF
V
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
0.65 × VDD
–0.5
VDD + 0.5 V
0.35 × VDD
V
5
5
nA
nA
V
IIL
VOH
High-level output voltage
(VDD = 3.0 V)
2.4
VOL
Low-level output voltage
(VDD = 3.0 V)
0.4
V
IOH
IOL
High-level source current, VOH = 2.4
Low-level sink current, VOH = 0.4
6
6
mA
mA
Pin Internal Pullup and Pulldown (25°C)
TEST
CONDITIONS
MIN
5
NOM
MAX
UNIT
µA
PARAMETER
IOH
IOL
VIL
Pullup current, VOH = 2.4
(VDD = 3.0 V)
10
Pulldown current, VOL = 0.4
(VDD = 3.0 V)
nRESET(1)
5
µA
0.6
V
(1) The nRESET pin must be held below 0.6 V for the module to register a reset.
4.7 Thermal Resistance Characteristics for MOB Package
NAME
RΘJC
RΘJB
RΘJA
RΘJMA
PsiJT
DESCRIPTION
°C/W(1) (2)
9.08
AIR FLOW (m/s)(3)
Junction-to-case
0.00
0.00
Junction-to-board
Junction-to-free air
Junction-to-moving air
Junction-to-package top
Junction-to-board
10.34
11.60
5.05
0.00
< 1.00
0.00
9.08
PsiJB
10.19
0.00
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
•
•
•
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
(3) m/s = meters per second.
4.8 Reset Requirement
PARAMETER
SYMBOL
ViH
MIN
TYP
0.65 × VBAT
0.6 V
MAX
UNIT
V
Operation mode level
Shutdown mode level(1)
ViL
0
5
V
Minimum time for nReset low for resetting the
module
ms
Rise/fall times
Tr/Tf
20
µs
(1) The nRESET pin must be held below 0.6 V for the module to register a reset.
12
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4.9 Current Consumption
TA = +25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
TX power level = 0
MIN
TYP
272
188
248
179
223
160
53
MAX
UNIT
1 DSSS
6 OFDM
54 OFDM
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX
mA
1 DSSS
RX(3)
54 OFDM
53
Idle connected(4)
LPDS
0.715
0.140
7
Hibernate
µA
VBAT = 3.3 V
VBAT = 2.3 V
450
620
Peak calibration current(3)(5)
mA
(1) TX power level = 0 implies maximum power. TX power level = 4 implies output power backed off approximately 4 dB.
(2) The CC3100 system is a constant power-source system. The active current numbers scale inversely on the VBAT voltage supplied.
(3) The RX current is measured with a 1-Mbps throughput rate.
(4) DTIM = 1
(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. Calibration is performed sparingly,
typically when coming out of Hibernate and only if temperature has changed by more than 20°C or the time elapsed from prior
calibration is greater than 24 hours.
Note: The area enclosed in the circle represents a significant reduction in current when transitioning from TX power
level 3 to 4. In the case of lower range requirements (13-dbm output power), TI recommends using TX power level 4
to reduce the current.
Figure 4-3. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
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Figure 4-4. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
Figure 4-5. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
14
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4.10 WLAN RF Characteristics
WLAN Receiver Characteristics
TA = +25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz)
PARAMETER
CONDITION (Mbps)
1 DSSS
MIN
TYP
–94.7
–92.6
–87.0
–89.0
–88.0
–85.0
–79.5
–73.0
–69.0
–3.0
MAX
UNITS
2 DSSS
11 CCK
6 OFDM
Sensitivity
(8% PER for 11b rates, 10% PER for
9 OFDM
11g/11n rates)(10% PER)(1)
18 OFDM
36 OFDM
54 OFDM
MCS7 (Mixed Mode)
802.11b
dBm
Maximum input level
(10% PER)
802.11g
–9.0
(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).
4.10.1 WLAN Transmitter Characteristics(1)
TA = +25°C, VBAT = 2.3 to 3.6 V. Parameters measured at module pin on channel 7 (2442 MHz)
PARAMETERS
CONDITIONS
1DSSS
MIN
TYP
MAX
UNIT
dBm
ppm
17
17
2DSSS
11CCK
17.25
16.25
16.25
16
6OFDM
Max RMS Output Power measured at 1 dB
from IEEE spectral mask or EVM
9OFDM
18OFDM
36OFDM
54OFDM
MCS7 (Mixed Mode)
15
13.5
12
Transmit center frequency accuracy
–20
20
(1) Channel-to-channel variation is up to 2 dB. The edge channels (2412 and 2472 MHz) have reduced TX power to meet FCC emission
limits.
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4.11 Timing Characteristics
4.11.1 SPI Host Interface Timings
Host
Launch
CC3100
Capture
CC3100
Launch
Host
Capture
TP
HOST_SPI_CLK
HOST_SPI_DIN
TCLK
Tih
Tis
HOST_SPI_DOUT
Tod
Toh
Figure 4-6. SPI Host Interface Timing(1)
SYMBOL
PARAMETER
MIN
MAX
UNIT
MHz
ns
F
Clock frequency
Clock period
Duty cycle
20
0.35 × VBAT
55%
TCLK
41.6
45%
4
Tis
RX setup time: minimum time in which data is stable before
capture edge
ns
ns
ns
ns
pF
Tih
Tod
Toh
CL
RX hold time: minimum time in which data is stable after
capture edge
4
TX setup propagation time: maximum time from launch edge
until data is stable
16
24
20
TX hold propagation time: minimum time of data stable after
launch edge
Capacitive load on interface
(1) Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge
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4.11.2 Wake-Up Sequence
VBAT and VIO
nRESET
nHIB
Device ready to
serve API calls
STATE
RESET
HW INIT
tT2t
FW INIT
tT3t
tT1t
Figure 4-7. Wake-Up Sequence
Table 4-1. First-Time Power-Up and Reset Removal Timing Requirements (32K XTAL)
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
Depends on application board power supply, decap, and
so on
T1
Supply settling time
3 ms
Hardware wakeup
time
T2
T3
25 ms
1.35 s
32-kHz XTAL settling + firmware initialization time +
radio calibration
Initialization time
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4.11.3 Wakeup from Hibernate
Figure 4-8 shows the timing diagram for wakeup from the hibernate state.
tTHIB_MIN
t
tTWAKEUP_FROM_HIBt
VBAT and VIO
nRESET
nHIB
STATE
ACTIVE
HIBERNATE
HW + FW INIT
ACTIVE
HIBERNATE
Figure 4-8. nHIB Timing Diagram
NOTE
The internal 32.768-kHz crystal oscillator is kept enabled by default when the chip goes to
hibernate in response to nHIB being pulled low.
Table 4-2. nHIB Timing Requirements(1)
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
Thib_min
Minimum hibernate time
Minimum LOW pulse width of nHIB
10 ms
(2)
Twake_from_hib
Hardware wakeup time plus
firmware initialization time
See
.
50 ms
(1) Ensure that the nHIB low duration is not less than the specified width under all conditions, including power-ON, MCU hibernation, and so
forth.
(2) If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.
4.11.4 Interfaces
This section describes the interfaces that are supported by the CC3100 module:
•
•
Host SPI
Host UART
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4.11.4.1 Host SPI Interface Timing
I3
I2
I4
CLK
I6
I7
MISO
MOSI
I9
I8
SWAS032-017
Figure 4-9. Host SPI Interface Timing
Table 4-3. Host SPI Interface Timing Parameters
PARAMETER
NUMBER
PARAMETER(1)
PARAMETER NAME
MIN
MAX
UNIT
I1
F
Clock frequency @ VBAT = 3.3 V
Clock frequency @ VBAT ≤ 2.1 V
Clock period
20
12
MHz
(2)
I2
I3
I4
I5
I6
I7
I8
I9
tclk
50
ns
ns
ns
tLP
tHT
D
Clock low period
25
25
Clock high period
Duty cycle
45%
55%
tIS
RX data setup time
RX data hold time
TX data output delay
TX data hold time
4
4
ns
ns
tIH
tOD
tOH
20
24
ns
(1) The timing parameter has a maximum load of 20 pf at 3.3 V.
(2) Ensure that nCS (active-low signa)l is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge.
4.11.4.2 SPI Host Interface
The device interfaces to an external host using the SPI interface. The CC3100 device can interrupt the
host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can
work up to a speed of 20 MHz.
Figure 4-10 shows the SPI host interface.
CC3100 (slave)
MCU
HOST_SPI_CLK
SPI_CLK
SPI_nCS
SPI_MISO
SPI_MOSI
INTR
HOST_SPI_nCS
HOST_SPI_MISO
HOST_SPI_MOSI
HOST_INTR
nHIB
GPIO
SWAS031-027
Figure 4-10. SPI Host Interface
Table 4-4 lists the SPI host interface pins.
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Table 4-4. SPI Host Interface
Pin Name
HOST_SPI_CLK
HOST_SPI_nCS
HOST_SPI_MOSI
HOST_INTR
Description
Clock (up to 20 MHz) from MCU host to CC3100 device
CS (active low) signal from MCU host to CC3100 device
Data from MCU host to CC3100 device
Interrupt from CC3100 device to MCU host
Data from CC3100 device to MCU host
HOST_SPI_MISO
nHIB
Active-low signal that commands the CC3100 device to enter hibernate mode (lowest power
state)
4.11.4.3 Host UART
The SimpleLink device requires the UART configuration described in Table 4-5.
Table 4-5. SimpleLink UART Configuration
Property
Baud rate
Supported CC3100 Configuration
115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command
Data bits
8 bits
Flow control
Parity
CTS/RTS
None
Stop bits
1
Bit order
LSBit first
Active high
Rising edge or level 1
Little-endian only(1)
Host interrupt polarity
Host interrupt mode
Endianness
(1) The SimpleLink device does not support automatic detection of the host length while using the UART interface.
4.11.4.3.1 5-Wire UART Topology
Figure 4-11 shows the typical 5-wire UART topology comprised of 4 standard UART lines plus one IRQ
line from the device to the host controller to allow efficient low power mode.
RTS
CTS
TX
RTS
CTS
TX
HOST MCU
UART
CC3100 SL
UART
RX
RX
HOST_INTR(IRQ)
HOST_INTR(IRQ)
SWAS031-088
Figure 4-11. Typical 5-Wire UART Topology
This is the typical and recommended UART topology because it offers the maximum communication
reliability and flexibility between the host and the SimpleLink device.
4.11.4.3.2 4-Wire UART Topology
The 4-wire UART topology eliminates the host IRQ line (see Figure 4-12). Using this topology requires
one of the following conditions to be met:
•
•
Host is always awake or active.
Host goes to sleep but the UART module has receiver start-edge detection for auto wakeup and does
not lose data.
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RTS
CTS
TX
RTS
CTS
TX
HOST MCU
UART
CC3100 SL
UART
RX
RX
H_IRQ
H_IRQ
X
SWAS031-089
Figure 4-12. 4-Wire UART Configuration
4.11.4.3.3 3-Wire UART Topology
The 3-wire UART topology requires only the following lines (see Figure 4-13):
•
•
•
RX
TX
CTS
RTS
CTS
TX
RTS
CTS
TX
X
HOST MCU
UART
CC3100 SL
UART
RX
RX
H_IRQ
H_IRQ
X
SWAS031-090
Figure 4-13. 3-Wire UART Topology
Using this topology requires one of the following conditions to be met:
•
•
Host always stays awake or active.
Host goes to sleep but the UART module has receiver start-edge detection for auto wakeup and does
not lose data.
•
Host can always receive any amount of data transmitted by the SimpleLink device because there is no
flow control in this direction.
Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the
following parameters must be carefully considered:
•
•
•
Max baud rate
RX character interrupt latency and low-level driver jitter buffer
Time consumed by the user's application
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5 Detailed Description
5.1 Overview
5.1.1 Module Features
5.1.1.1 WLAN
•
•
•
•
•
802.11b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station
with CCK and OFDM rates in the 2.4-GHz ISM band
Auto-calibrated radio with a single-ended 50-Ω interface enables easy connection to the antenna
without requiring expertise in radio circuit design.
Advanced connection manager with multiple user-configurable profiles stored in an NVMEM allows
automatic fast connection to an access point without user or host intervention.
Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security
accelerators
SmartConfig technology: A 1-step, 1-time process to connect a CC3100MOD-enabled device to the
home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, it is
usable by deeply embedded applications.
•
802.11 transceiver mode: Allows transmitting and receiving of proprietary data through a socket
without adding MAC or PHY headers. This mode provides the option to select the working channel,
rate, and transmitted power. The receiver mode works together with the filtering options.
5.1.1.2 Network Stack
•
Integrated IPv4 TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU,
microprocessor, or ASIC
•
•
Support of eight simultaneous TCP, UDP, or RAW sockets
Built-in network protocols: ARP, ICMP, DHCP client, and DNS client for easy connection to the local
network and the Internet
•
Service discovery: Multicast DNS service discovery lets a client advertise its service without a
centralized server. After connecting to the access point, the CC3100MOD provides critical information,
such as device name, IP, vendor, and port number.
5.1.1.3 Host Interface and Driver
•
•
•
Interfaces over a 4-wire serial peripheral interface (SPI) with any MCU or a processor at a clock speed
of 20 MHz.
Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided
for TI MCUs and is easily ported to any processor or ASIC.
Simple APIs enable easy integration with any single-threaded or multithreaded application.
5.1.1.4 System
•
•
Works from a single preregulated power supply or connects directly to a battery
Ultra-low leakage when disabled (hibernate mode) with a current of less than 7 µA with the RTC
running
•
Integrated clock sources
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5.2 Functional Block Diagram
Figure 5-1 shows the functional block diagram of the CC3100MOD SimpleLink Wi-Fi solution.
VCC
CC3100MOD
nHIB
Network Processor
Module
MCU
SPI/UART
HOST_INTR
Figure 5-1. Functional Block Diagram
5.3 Wi-Fi Network Processor Subsystem
The Wi-Fi network processor subsystem includes a dedicated ARM MCU to completely offload the host
MCU along with an 802.11 b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast,
secure WLAN and Internet connections with 256-bit encryption. The CC3100MOD supports station, AP,
and Wi-Fi Direct modes. The module also supports WPA2 personal and enterprise security and WPS 2.0.
The Wi-Fi network processor includes an embedded IPv4 TCP/IP stack.
Table 5-1 summarizes the NWP features.
Table 5-1. Summary of Features Supported by the NWP Subsystem
ITEM
1
DOMAIN
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
TCP/IP
CATEGORY
Network Stack
Network Stack
Protocols
FEATURE
IPv4
DETAILS
Baseline IPv4 stack
Base protocols
2
TCP/UDP
DHCP
3
Client and server mode
4
Protocols
ARP
Support ARP protocol
5
Protocols
DNS/mDNS
IGMP
DNS Address resolution and local server
Up to IGMPv3 for multicast management
Support multicast DNS for service publishing over IP
Service discovery protocol over IP in local network
6
Protocols
7
Applications
Applications
Applications
Security
mDNS
8
mDNS-SD
9
Web Sever/HTTP Server URL static and dynamic response with template.
10
11
TLS/SSL
TLS/SSL
TLS v1.2 (client/server)/SSL v3.0
Security
For the supported Cipher Suite, go to SimpleLink Wi-Fi
CC3100 SDK.
12
13
TCP/IP
WLAN
Sockets
RAW Sockets
Policies
User-defined encapsulation at WLAN MAC/PHY or IP
layers
Connection
Allows management of connection and reconnection
policy
14
15
WLAN
WLAN
MAC
Promiscuous mode
Initialization time
Filter-based Promiscuous mode frame receiver
Performance
From enable to first connection to open AP less than
50 ms
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Table 5-1. Summary of Features Supported by the NWP Subsystem (continued)
ITEM
16
DOMAIN
WLAN
WLAN
WLAN
WLAN
CATEGORY
Performance
Performance
Provisioning
Provisioning
FEATURE
Throughput
Throughput
WPS2
DETAILS
UDP = 16 Mbps
TCP = 13 Mbps
17
18
Enrollee using push button or PIN method.
19
AP Config
AP mode for initial product configuration (with
configurable Web page and beacon Info element)
20
21
22
WLAN
WLAN
WLAN
Provisioning
Role
SmartConfig
Station
Alternate method for initial product configuration
802.11bgn Station with legacy 802.11 power save
Role
Soft AP
802.11 bg single station with legacy 802.11 power
save
23
24
25
26
27
28
29
30
31
32
33
34
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
WLAN
Role
P2P
P2P operation as GO
P2P operation as CLIENT
WPA2 personal security
WPA2 enterprise security
EAP-TLS
Role
P2P
Security
Security
Security
Security
Security
Security
Security
Security
Security
Security
STA-Personal
STA-Enterprise
STA-Enterprise
STA-Enterprise
STA-Enterprise
STA-Enterprise
STA-Enterprise
STA-Enterprise
STA-Enterprise
AP-Personal
EAP-PEAPv0/TLS
EAP-PEAPv1/TLS
EAP-PEAPv0/MSCHAPv2
EAP-PEAPv1/MSCHAPv2
EAP-TTLS/EAP-TLS
EAP-TTLS/MSCHAPv2
WPA2 personal security
5.4 Power-Management Subsystem
The CC3100 power-management subsystem contains DC-DC converters to accommodate the differing
voltage or current requirements of the system. The module can operate from an input voltage ranging from
2.3 V to 3.6 V and can be directly connected to 2xAA Alkaline batteries.
The CC3100MOD is a fully integrated module based WLAN radio solution used on an embedded system
with a wide-voltage supply range. The internal power management, including DC-DC converters and
LDOs, generates all of the voltages required for the module to operate from a wide variety of input
sources. For maximum flexibility, the module can operate in the modes described in the following sections.
5.4.1 VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the module is powered directly by the battery. All other voltages
required to operate the device are generated internally by the DC-DC converters. This scheme is the most
common mode for the device as it supports wide-voltage operation from 2.3 to 3.6 V.
5.5 Low-Power Operating Modes
This section describes the low-power modes supported by the module to optimize battery life.
5.5.1 Low-Power Deep Sleep
The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered
automatically during periods of inactivity based on internal power optimization algorithms. The module
draws about 7 µA from the supply in this low-power mode. The module can wake up in less than 3 ms
from the internal timer or from any incoming host command. Typical battery drain in this mode is 140 µA.
During LPDS mode, the module retains the software state and certain configuration information. The
operation is transparent to the external host; thus, no additional handshake is required to enter or exit this
sleep mode.
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5.5.2 Hibernate
The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small
section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept
running and the module wakes up once the n_HIB line is asserted by the host driver. The wake-up time is
longer than LPDS mode at about 50 ms.
NOTE
Wake-up time can be extended to 75 ms if a patch is loaded from the serial flash.
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6 Applications, Implementation, and Layout
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
6.1 Reference Schematics
Figure 6-1 shows the reference schematic for the CC3100MOD module.
VCC (2.3 to 3.6V)
U1
Matching circuit shown
below is for the antenna.
The module is matched
internally to 50 Ohm
40
36
37
4
5
6
7
8
11
VBAT_DCDC_DIG_IO
VBAT_DCDC_ANA
VBAT_DCDC_PA
nHIB
SPI_CLK
SPI_DIN
SPI_DOUT
SPI_nCS
IRQ
The electrolytic capacitor
is to be added based on
the battery type, routing
resistance and current
drawn by the CC3100
C3
HOST CONTROL
35
220uF
(optional)
nRESET
L1
3.6nH
E1
33
41
31
25
26
NC
NC
RF_BG
ANT_SEL_1
ANT_SEL_2
2.45GHz Ant
39
C2
1.0pF
NC
46
47
44
51
HOST CONTROL/
FLASH PROGRAM
UART1_TX
UART1_RX
UART1_nRTS
UART1_nCTS
19
20
45
NC
NC
NC
21
22
18
12
29
42
3
RESERVED
17
15
14
13
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
R2
100K
48
49
50
52
TP1
TP2
TP3
TP4
TEST_58
TEST_59
TEST_60
TEST_62
LOGGING
(DEBUG)
2
1
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
30
27
43
38
28
32
63
62
61
60
59
58
57
56
55
16
54
53
10
9
NC
NC
NC
NC
34
24
23
SOP0
SOP1
TCXO_EN/SOP2
R3
10K
CC3100MOD
Figure 6-1. CC3100MOD Module Reference Schematic
26
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6.2 Bill of Materials(1)
PART
REFERENCE
QUANTITY
VALUE
MANUFACTURER
Texas Instruments
Taiyo Yuden
PART NUMBER
CC3100MODR11MAMOB
AH316M245001-T
DESCRIPTION
SimpleLink Wi-Fi MCU
Module
1
1
1
1
U1
CC3100MOD
2.45-GHz Ant
1.0 pF
ANT Bluetooth WLAN
E1
C2
L1
ZigBee® WIMAX
Murata Electronics North
America
CAP CER 1 pF 50 V
NP0 0402
GJM1555C1H1R0BB01D
LQP15MN3N6B02D
Murata Electronics North
America
INDUCTOR 3.6 NH
0.1 NH 0402
3.6 nH
(1) Resistors are not shown here. Any resistor of 5% tolerance can be used.
6.3 Layout Recommendations
6.3.1 RF Section (Placement and Routing)
Figure 6-2. RF Section Layout
Being wireless device, the RF section gets the top priority in terms of layout. It is very important for the RF
section to be laid out correctly to get the optimum performance from the device. A poor layout can cause
low output power, EVM degradation, sensitivity degradation and mask violations.
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6.3.2 Antenna Placement and Routing
The antenna is the element used to convert the guided waves on the PCB traces to the free space
electromagnetic radiation. The placement and layout of the antenna is the key to increased range and
data rates.
The following points need to be observed for the antenna.
SR NO.
GUIDELINES
1
2
Place the antenna on an edge or corner of the PCB
Make sure that no signals are routed across the antenna elements on all the layers of the
PCB
3
4
Most antennas, including the chip antenna used on the booster pack require ground
clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers
as well.
Ensure that there is provision to place matching components for the antenna. These need
to be tuned for best return loss once the complete board is assembled. Any plastics or
casing should also be mounted while tuning the antenna as this can impact the
impedance.
5
6
Ensure that the antenna impedance is 50 Ω as the device is rated to work only with a
50-Ω system.
In case of printed antenna, ensure that the simulation is performed with the solder mask
in consideration.
7
8
9
Ensure that the antenna has a near omni-directional pattern.
The feed point of the antenna is required to be grounded
To use the FCC certification of the Booster pack board, the antenna used should be of
the same gain or lesser. In addition, the Antenna design should be exactly copied
including the Antenna traces.
Table 6-1. Recommended Components
CHOICE
PART NUMBER
MANUFACTURER
NOTES
1
AH316M245001-T
Taiyo Yuden
Can be placed on edge of the
PCB and uses very less PCB
space
2
RFANT5220110A2T
Walsim
Need to place on the corner of
PCB
28
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6.3.3 Transmission Line
The RF signal from the device is routed to the antenna using a CPW-G (Coplanar Waveguide with
ground) structure. This structure offers the maximum isolation across filter gap and the best possible
shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also
provides additional shielding
Figure 6-3. Coplanar Waveguide (Cross Section) with GND and Via Stitching
S
W
Figure 6-4. CPW with GND (Top View)
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The recommended values for the PCB are provided for 4- and 2-layer boards in Table 6-2 and Table 6-3,
respectively.
Table 6-2. Recommended PCB Values for 4-Layer Board (L1-L2 = 10 mils)
PARAMETER
VALUE
UNITS
mils
W
20
18
10
4
S
mils
H
mils
Er (FR-4 substrate)
Table 6-3. Recommended PCB Values for 2-Layer Board (L1-L2 = 40 mils)
PARAMETER
VALUE
35
UNITS
mils
W
S
6
mils
H
40
mils
Er (FR-4 substrate)
3.9
6.3.4 General Layout Recommendation
1. Have a solid ground plane and ground vias under the module for stable system and thermal
dissipation.
2. Do not run signal traces underneath the module on a layer where the module is mounted.
3. RF traces must have 50-Ω impedance
4. RF trace bends must be gradual with a maximum bend of approximately 45 degrees and with trace
mitered.
5. RF traces must not have sharp corners.
6. There must be no traces or ground under the antenna section.
7. RF traces must have via stitching on the ground plane beside the RF trace on both sides.
8. RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge
of the PCB product in consideration of the product enclosure material and proximity.
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7 Environmental Requirements and Specifications
7.1 Temperature
7.1.1 PCB Bending
The PCB bending specification shall maintain planeness at a thickness of less than 0.1 mm.
7.2 Handling Environment
7.2.1 Terminals
The product is mounted with motherboard through land grid array (LGA). To prevent poor soldering, do
not touch the LGA portion by hand.
7.2.2 Falling
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the
product malfunction.
7.3 Storage Condition
7.3.1 Moisture Barrier Bag Before Opened
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH.
The calculated shelf life for the dry-packed product shall be a 12 months from the date the bag is sealed.
7.3.2 Moisture Barrier Bag Open
Humidity indicator cards must be blue, < 30%.
7.4 Baking Conditions
Products require baking before mounting if:
•
•
Humidity indicator cards read > 30%
Temp < 30°C, humidity < 70% RH, over 96 hours
Baking condition: 90°C, 12–24 hours
Baking times: 1 time
7.5 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection
2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method.
3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile
(see Figure 7-1).
5. Temperature profile: Reflow soldering shall be done according to the following temperature profile (see
Figure 7-1).
6. Peak temp: 245°C
Copyright © 2014, Texas Instruments Incorporated
Environmental Requirements and Specifications
Submit Documentation Feedback
31
CC3100MOD
SWRS161 –DECEMBER 2014
www.ti.com
Figure 7-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
32
Environmental Requirements and Specifications
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
CC3100MOD
www.ti.com
SWRS161 –DECEMBER 2014
8 Product and Documentation Support
8.1 Development Support
TI offers an extensive line of development tools, including tools to evaluate the performance of the
processors, generate code, develop algorithm implementations, and fully integrate and debug software
and hardware modules. The tool's support documentation is electronically available within the Code
Composer Studio™ Integrated Development Environment (IDE).
The following products support development of the CC3100MOD applications:
Software Development Tools: Code Composer Studio Integrated Development Environment (IDE):
including Editor C/C++/Assembly Code Generation, and Debug plus additional development tools
Scalable, Real-Time Foundation Software ( DSP/BIOS™), which provides the basic run-time target
software needed to support any CC3100MOD application.
Hardware Development Tools: Extended Development System ( XDS™) Emulator
For a complete listing of development-support tools for the CC3100MOD platform, visit the Texas
Instruments website at www.ti.com. For information on pricing and availability, contact the nearest TI field
sales office or authorized distributor.
8.1.1 Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing
changes, TI recommends that the user has the latest service pack in his or her module for production. To
stay informed, sign up for the SDK Alert Me button on the tools page or www.ti.com/tool/cc3100sdk.
8.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3100MOD and support tools (see Figure 8-1).
X
CC
3 1
0
0
MOD R 1 1M A MOB
R
PREFIX
X = preproduction device
no prefix = production device
PACKAGING
R = tape/reel
T = small reel
DEVICE FAMILY
CC = wireless connectivity
PACKAGE DESIGNATOR
MOB = module
SERIES NUMBER
3 = Wi-Fi Centric
Figure 8-1. CC3100MOD Device Nomenclature
For orderable part numbers of CC3100MOD devices in the MOB package types, see the Package Option
Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.
Copyright © 2014, Texas Instruments Incorporated
Product and Documentation Support
33
Submit Documentation Feedback
CC3100MOD
SWRS161 –DECEMBER 2014
www.ti.com
8.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster
collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,
explore ideas and help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
8.4 Trademarks
SimpleLink, Internet-On-a-Chip, SmartConfig, E2E, Code Composer Studio, DSP/BIOS, XDS are
trademarks of Texas Instruments.
ARM is a registered trademark of ARM Limited.
Wi-Fi CERTIFIED, Wi-Fi Direct are trademarks of Wi-Fi Alliance.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
ZigBee is a registered trademark of ZigBee Alliance.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.6 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data
(as defined by the U.S., EU, and other Export Administration Regulations) including software, or any
controlled product restricted by other applicable national regulations, received from Disclosing party under
this Agreement, or any direct product of such technology, to any destination to which such export or re-
export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from
U.S. Department of Commerce and other competent Government authorities to the extent required by
those laws.
8.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
34
Product and Documentation Support
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
CC3100MOD
www.ti.com
SWRS161 –DECEMBER 2014
9 Mechanical Packaging and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document.
Figure 9-1 shows the CC3100MOD module.
9.1 Mechanical Drawing
Figure 9-1. Mechanical Drawing
Copyright © 2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
35
CC3100MOD
SWRS161 –DECEMBER 2014
www.ti.com
9.2 Package Option
We offer 2 reel size options for flexibility: a 1000-unit reel and a 250-unit reel.
9.2.1 Packaging Information
Package
Drawing
(1)
(2)
(3)
(5)
Orderable Device
Status
Pins
Package Qty
Eco Plan
Lead/Ball Finish
MSL, Peak Temp
Op Temp (°C)
Device Marking(4)
CC3100MODR11MAMOBR
CC3100MODR11MAMOBT
ACTIVE
ACTIVE
MOB
MOB
63
63
1000
250
RoHS Exempt
RoHS Exempt
Ni Au
Ni Au
3, 250°C
3, 250°C
–20 to 70
–20 to 70
CC3100MODR11MAMOB
CC3100MODR11MAMOB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
36
Mechanical Packaging and Orderable Information
Copyright © 2014, Texas Instruments Incorporated
Submit Documentation Feedback
CC3100MOD
www.ti.com
SWRS161 –DECEMBER 2014
9.2.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Width W1
(mm)
44.0
44.0
Package
Drawing
Reel
Diameter (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
CC3100MODR11MAMOBR
CC3100MODR11MAMOBT
MOB
MOB
63
63
1000
250
330.0±2.0
330.0±2.0
17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30
17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30
Q3
Q3
Copyright © 2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
37
CC3100MOD
SWRS161 –DECEMBER 2014
www.ti.com
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Drawing
Pins
63
SPQ
Length (mm)
354.0
Width (mm)
354.0
Height (mm)
CC3100MODR11MAMOBR
CC3100MODR11MAMOBT
MOB
MOB
1000
250
55.0
55.0
63
354.0
354.0
38
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2014
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
CC3100MODR11MAMOBR
CC3100MODR11MAMOBT
ACTIVE
64
64
1000
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-20 to 70
-20 to 70
ACTIVE
250
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Dec-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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Applications
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