CC3135MODRNMMOBR [TI]

SimpleLink™ 32 位 Arm Cortex-M3 双频带 Wi-Fi® 无线网络处理器模块 | MOB | 63 | -40 to 85;


型号：	CC3135MODRNMMOBR
厂家：	TEXAS INSTRUMENTS
描述：	SimpleLink™ 32 位 Arm Cortex-M3 双频带 Wi-Fi® 无线网络处理器模块 \| MOB \| 63 \| -40 to 85 无线电信电信集成电路
文件：	总69页 (文件大小：2530K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CC3135MOD

ZHCSK48D –FEBRUARY 2019 –REVISED MAY 2021

SimpleLink™ Wi-Fi CC3135MOD 双频带网络处理器模块

– 设备身份和密钥

– 硬件加速器加密引擎（AES、DES、SHA/MD5

和CRC）

– 文件系统安全（加密、身份验证、访问控制）

– 初始安全编程

– 软件篡改检测

1 特性

• 完全集成式绿色/RoHS 模块包括所有必需的时钟、

串行外设接口(SPI) 闪存和无源器件

• 集成式Wi-Fi^®和互联网协议

• 802.11a/b/g/n：2.4GHz 和5GHz

• 经FCC、IC/ISED、ETSI/CE 和MIC 认证

• 经FIPS 140-2 1 级验证的内部IC

• 一组丰富的IoT 安全特性，可帮助开发人员保护数

据

– 安全引导

– 证书注册请求(CSR)

– 每个设备具有唯一密钥对

• 恢复机制- 能够恢复到出厂默认设置

• 电源管理子系统：

• 低功耗模式适用于电池供电应用

• 与2.4GHz 无线电共存

– 集成式直流/直流转换器支持宽电源电压范围：

• 工业温度：–40°C 至+85°C

• Wi-Fi 网络处理器子系统：

• 单电源电压，VBAT：2.3V 至3.6V

– 高级低功耗模式：

– Wi-Fi 内核：

• 关断：1µA，休眠：5.5µA

• 低功耗深度睡眠(LPDS)：115µA

• 空闲连接（MCU 处于LPDS 状态）：710µA

• RX 流量（MCU 处于活动模式）：53 mA

• TX 流量（MCU 处于活动模式）：223 mA

• Wi-Fi TX 功率

• 802.11 a/b/g/n 2.4GHz 和5GHz

• 模式：

– 接入点(AP)

– 基站(STA)

– Wi-Fi Direct^®（仅在2.4GHz 受支持）

• 安全性：

– 2.4 GHz：1 DSSS 时为16dBm

– 5 GHz：6 OFDM 时为15.1dBm

• Wi-Fi RX 灵敏度

– WEP

– WPA^™/ WPA2^™PSK

– 2.4 GHz：1 DSSS 时为-94.5dBm

– 5 GHz：6 OFDM 时为-89dBm

• 模块上的其他集成组件

– WPA2 企业

– WPA3^™个人版

– WPA3^™企业版

– 互联网和应用协议：

– 具有内部振荡器的40.0MHz 晶体

– 32.768kHz 晶体(RTC)

– 32 兆位SPI 串行闪存

• HTTP 服务器、mDNS、DNS-SD 和DHCP

• IPv4 和IPv6 TCP/IP 堆栈

– 射频滤波器、双工器和无源组件

• QFM 封装

• 16 BSD 套接字（完全安全的TLS v1.2 和

SSL 3.0）

– 1.27mm 间距、63 引脚、20.5mm × 17.5mm

QFM 封装，便于实现轻松组装和低成本PCB 设

计

– 内置的电源管理子系统：

• 可配置的低功耗配置（始终开启、间歇性连

接、标签）

• 高级低功耗模式

• 模块支持SimpleLink 开发人员生态系统

• 集成式直流/直流稳压器

• 应用吞吐量

– UDP：16Mbps

– TCP：13Mbps

• 多层安全特性：

– 独立执行环境

– 网络安全

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SWRS225

CC3135MOD

ZHCSK48D –FEBRUARY 2019 –REVISED MAY 2021

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– 楼宇和住宅自动化：

• HVAC 系统和恒温器

2 应用

• 对于物联网应用，例如：

– 医疗和保健

• 视频监控、可视门铃和低功耗摄像头

• 楼宇安全系统和电子锁

– 电器

– 资产跟踪

– 工厂自动化

– 电网基础设施

• 多参数患者监护仪

• 心电图(ECG)

• 电子病床和床控制器

• 远程保健系统

3 说明

CC3135MOD 是 FCC、IC/ISED、ETSI/CE、MIC 和 Wi-Fi CERTIFIED^™模块，可显著简化互联网连接的实施过

程。这个双频带 Wi-Fi^®网络处理器模块可以添加到任何低成本、低功耗的微处理器单元 (MCU) 中；它集成了所

有Wi-Fi^®和互联网协议，可大大降低主机MCU 软件要求。

这个基于ROM 的子系统包括一个802.11 a/b/g/n 双频带2.4GHz 和5GHz 无线电、基带和带有强大硬件加密引擎

的MAC。借助内置安全协议，CC3135MOD 解决方案可提供强大且简单的安全体验。CC3135MOD 采用 LGA 封

装，易于布置所有必需组件，包括串行闪存、射频滤波器、双工器、晶体和全集成无源组件。

这一代引进了可进一步简化物联网连接的新功能。CC3135MOD 的主要新特性包括：

• 802.11 a/b/g/n：2.4GHz 和5GHz 支持

• 2.4GHz 与低功耗Bluetooth^®无线电共存

• 天线分集

• 经FIPS 140-2 1 级验证的内部IC 增强了安全性：认证

• 可同时打开多达16 个安全套接字

• 唯一设备标识符能够生成证书注册请求(CSR)

• 在线证书状态协议(OCSP)

• Wi-Fi Alliance^®认证，具备物联网低功耗能力

• 降低模板包传输负载的无主机模式

• 改善了快速扫描

CC3135MOD 器件系列是 SimpleLink^™MCU 平台的一部分，该平台是一个常见、易用的开发环境，基于一个单

核软件开发套件 (SDK)，具有丰富的工具集和参考设计。E2E™ 社区支持 Wi-Fi^®、低功耗 Bluetooth 、

Sub-1GHz 器件和主机MCU。有关更多信息，请访问www.ti.com/SimpleLink。

表3-1. 模块信息⁽¹⁾

封装

器件型号

CC3135MODRNMMOBR

封装尺寸

QFM (63)

20.5mm × 17.5mm

(1) 如需更多信息，请参阅节13。

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4 功能方框图

图4-1 显示了CC3135MOD 模块的功能方框图。

CC3135

40 MHz

RF_ABG

32.768 kHz

BGN

UART

SPI

WRF_BGN

5 GHz

SPDT

nReset

HiB

Aband

WRF_A

2.3 V to 3.6 V

VBAT

32-Mbit

SFlash

External SPI

Programming

图4-1. CC3135MOD 模块功能方框图

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图4-2 显示了CC3135 硬件概览。

External MCU

Wi-Fi Network Processor

Host Interface

Hardware

1x SPI

1x UART

NETWORK PROCESSOR

POWER

MANAGEMENT

Application

Protocols

Wi-Fi Driver

TCP/IP Stack

Oscillators

DC-DC

RTC

Dual Band

Wi-Fi

RAM

ROM

ARM Cortex

Synthesizer

图4-2. CC3135 硬件概览

图4-3 显示了CC3135 嵌入式软件概览。

Customer Application

NetApp

BSD Socket

Wi-Fi

SimpleLink Driver APIs

Host Interface

Network Apps

WLAN Security

and Management

TCP/IP Stack

WLAN MAC and PHY

图4-3. CC3135 嵌入式软件概览

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Table of Contents

9.2 Module Features.......................................................33

9.3 Power-Management Subsystem...............................37

9.4 Low-Power Operating Modes................................... 37

9.5 Restoring Factory Default Configuration...................38

9.6 Hostless Mode.......................................................... 38

9.7 Device Certification and Qualification....................... 39

9.8 Module Markings.......................................................41

9.9 End Product Labeling................................................42

9.10 Manual Information to the End User....................... 42

10 Applications, Implementation, and Layout............... 43

10.1 Application Information........................................... 43

10.2 PCB Layout Guidelines...........................................47

11 Environmental Requirements and SMT

Specifications................................................................53

11.1 Temperature............................................................53

11.2 Handling Environment.............................................53

11.3 Storage Condition................................................... 53

11.4 PCB Assembly Guide..............................................53

11.5 Baking Conditions................................................... 54

11.6 Soldering and Reflow Condition..............................55

12 Device and Documentation Support..........................56

12.1 Device Nomenclature..............................................56

12.2 Development Tools and Software........................... 56

12.3 Firmware Updates...................................................58

12.4 Documentation Support.......................................... 58

12.5 Trademarks.............................................................59

12.6 静电放电警告.......................................................... 59

12.7 Export Control Notice..............................................59

12.8 术语表..................................................................... 60

13 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 2

3 说明................................................................................... 2

4 功能方框图.........................................................................3

5 Revision History.............................................................. 6

6 Device Comparison.........................................................7

6.1 Related Products........................................................ 8

7 Terminal Configuration and Functions..........................9

7.1 CC3135MOD Pin Diagram..........................................9

7.2 Pin Attributes.............................................................10

7.3 Signal Descriptions................................................... 14

7.4 Connections for Unused Pins................................... 16

8 Specifications................................................................ 17

8.1 Absolute Maximum Ratings...................................... 17

8.2 ESD Ratings............................................................. 17

8.3 Recommended Operating Conditions.......................17

8.4 Current Consumption Summary: 2.4 GHz RF

Band............................................................................18

8.5 Current Consumption Summary: 5 GHz RF Band....18

8.6 TX Power Control for 2.4 GHz Band.........................19

8.7 TX Power Control for 5 GHz Band............................21

8.8 Brownout and Blackout Conditions...........................22

8.9 Electrical Characteristics for DIO Pins......................23

8.10 WLAN Receiver Characteristics..............................24

8.11 WLAN Transmitter Characteristics..........................25

8.12 BLE and WLAN Coexistence Requirements...........26

8.13 Reset Requirement.................................................26

8.14 Thermal Resistance Characteristics for MOB

Package...................................................................... 26

8.15 Timing and Switching Characteristics..................... 27

8.16 External Interfaces..................................................29

9 Detailed Description......................................................33

9.1 Overview...................................................................33

Information.................................................................... 61

13.1 Mechanical, Land, and Solder Paste Drawings...... 61

13.2 Package Option Addendum....................................61

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5 Revision History

Changes from September 28, 2020 to May 13, 2021 (from Revision C (September 2020) to

Revision D (May 2021))

Page

• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1

• 在节1 特性中添加了“WPA3^™企业版”.......................................................................................................... 1

• Added "WPA3 personal" to list of supported features in 节9.1 ....................................................................... 33

• Added footnote to 节9.1 ..................................................................................................................................33

• Added "WPA3 personal and enterprise security" to 节9.1 .............................................................................. 33

• Added "WPA3 Personal" to list of on-chip security accelerators in 节9.2.1 .................................................... 33

• Added "WPA3 Enterprise" to list of on-chip security accelerators in 节9.2.1 ..................................................33

• Added "WPA3 personal" to list of Wi-Fi security features in 表9-1 ................................................................. 34

• Added footnote to 节9.2.2 ...............................................................................................................................34

• Added "WPA3 personal and enterprise" to 表9-1 ........................................................................................... 34

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6 Device Comparison

表6-1 shows the features supported across different CC3x35 modules.

表6-1. Device Features Comparison

DEVICE

FEATURE

CC3135MOD

CC3235MODS

CC3235S

CC3235MODSF

CC3235SF

Onboard Chip

Onboard ANT

sFlash

CC3135

32-Mbit

Regulatory Certification

Wi-Fi Alliance^®Certification

Input Voltage

FCC, IC/ISED, ETSI/CE, MIC

Yes

FCC, IC/ISED, ETSI/CE, MIC

Yes

FCC, IC/ISED, ETSI/CE, MIC

Yes

2.3 V to 3.6 V

17.5 mm × 20.5 mm LGA

–40° to 85°C

Wi-Fi Network Processor

802.11 a/b/g/n

2.4 GHz, 5 GHz

IPv4, IPv6

2.3 V to 3.6 V

17.5 mm × 20.5 mm LGA

–40° to 85°C

Wireless Microcontroller

802.11 a/b/g/n

2.4 GHz, 5 GHz

IPv4, IPv6

2.3 V to 3.6 V

17.5 mm × 20.5 mm LGA

–40° to 85°C

Wireless Microcontroller

802.11 a/b/g/n

2.4 GHz, 5 GHz

IPv4, IPv6

Package

Operating Temperature Range

Classification

Standard

Frequency

TCP / IP Stack

Secured sockets

Integrated MCU

On-Chip Memory

RAM

Arm^®Cortex^®-M4 at 80 MHz

256KB

1MB

Flash

Peripherals and Interfaces

Universal Asynchronous Receiver

and Transmitter (UART)

Serial Port Interface (SPI)

Multi-Channel Audio Serial Port

(McASP)- I2S or PCM

2-ch

Inter-Integrated Circuit (I²C)

Analog to Digital Converter (ADC) -

4-ch, 12-bit

Parallel Interface (8-bit PI)

General Purposes Timers

Multimedia Card (MMC / SD)

Security Features

Unique Device Identity

Additional Networking Security

Trusted Root-Certificate Catalog Trusted Root-Certificate Catalog Trusted Root-Certificate Catalog

TI Root-of-Trust Public key

Hardware Crypto Engines

Yes

TI Root-of-Trust Public key

Hardware Crypto Engines

Yes

Hardware Acceleration

Secure Boot

Hardware Crypto Engines

File system security

Secure key storage

Software tamper detection

Cloning protection

Secure key storage

Software tamper detection

Cloning protection

Enhanced Application Level

Security

Initial secure programming

FIPS 140-2 Level 1 Certification Yes

Yes

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6.1 Related Products

For information about other devices in this family of products or related products see the links below.

The SimpleLink™ Offers a single development environment that delivers flexible hardware, software, and

MCU Portfolio

tool options for customers developing wired and wireless applications. With 100% code

reuse across host MCUs, Wi-Fi, Bluetooth low energy, Sub-1 GHz devices and more,

choose the MCU or connectivity standard that fits your design. A one-time investment with

the SimpleLink software development kit (SDK) allows you to reuse often, opening the

door to create unlimited applications. For more information, visit www.ti.com/simplelink.

SimpleLink™ Wi- Offers several Internet-on-a chip solutions, which address the need of battery operated,

Fi^®Family

security enabled products. Texas Instruments offers a single chip wireless microcontroller

and a wireless network processor which can be paired with any MCU, to allow developers

to design new Wi-Fi products, or upgrade existing products with Wi-Fi capabilities. For

more information, visit www.ti.com/simplelinkwifi.

MSP432™ Host

MCU

The MSP432P401R MCU features the Arm^®Cortex^®-M4 processor offering ample

processing capability with floating point unit and memory footprint for advanced

processing algorithm, communication protocols as well as application needs, while

incorporating a 14-bit 1-msps ADC14 that provides a flexible and low-power analog with

best-in-class performance to enable developers to add differentiated sensing and

measurement capabilities to their Wi-Fi applications. For more information, visit

www.ti.com/product/MSP432P401R.

Reference Designs The TI Designs Reference Design Library is a robust reference design library spanning

for CC3135 and

CC3235 Modules

analog, embedded processor, and connectivity. Created by TI experts to help you jump

start your system design, all TI Designs include schematic or block diagrams, BOMs, and

design files to speed your time to market. Search and download designs at www.ti.com/

tidesigns.

CC3135 SDK Plug The CC3135 SDK Plug In contains drivers, many sample applications for Wi-Fi features

and Internet, and documentation needed to use the CC3135 solution. Learn more at

http://www.ti.com/tool/simplelink-sdk-wifi-plugin.

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7 Terminal Configuration and Functions

7.1 CC3135MOD Pin Diagram

图7-1 shows the pin diagram for the CC3135MOD module.

GND

FLASH_SPI_CLK

FLASH_SPI_nCS_IN

FLASH_SPI_MISO

GND

RF_ABG

GND

CC3135MOD

DIO23

HOST_INTR

DIO13

SOP0

DIO14

nRESET

VBAT_RESET

HOST_SPI_nCS

HOST_SPI_DOUT

HOST_SPI_DIN

VBAT1

GND

HOST_SPI_CLK

nHIB

VBAT2

DIO10

DIO30

GND

图7-1 shows the approximate location of pins on the module.

图7-1. CC3135MOD Pin Diagram Bottom View

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7.2 Pin Attributes

表7-1 describes the CC3135MOD pins.

Note

Digital IOs on the CC3135MOD refer to hostless mode, BLE/2.4 GHz coexistence, and antenna select IOs, not general-purpose IOs.

If an external device drives a positive voltage to signal pads when the CC3135MOD is not powered, DC current is drawn from the other device.

If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3135MOD device can occur. To prevent

current draw, TI recommends one of the following:

• All devices interfaced to the CC3135MOD must be powered from the same power rail as the CC3135MOD device.

• Use level shifters between the CC3135MOD and any external devices fed from other independent rails.

• The nRESET pin of the CC3135MOD device must be held low until the V_BATsupply to the device is driven and stable.

表7-1. Pin Description and Attributes

DIGITAL I/O

STATE AT

BLE COEX

CC3135 DEVICE

PIN NO.

DEFAULT FUNCTION

RESET AND

HIBERNATE

I/O TYPE⁽¹⁾

DESCRIPTION

HOSTLESS

MODE

CC_COEX_

OUT

N/A

GND

N/A

Power

I/O

GND

–

DIO10

Digital input or output

Hibernate signal input to the NWP subsystem

(active low). This is connected to the MCU GPIO.

If the GPIO from the MCU can float while the

MCU enters low power, consider adding a pullup

resistor on the board to avoid floating.

nHIB

Hi-Z

HOST_SPI_CLK

HOST_SPI_MOSI

HOST_SPI_MISO

HOST_SPI_nCS

DIO12

Hi-Z

Host interface SPI clock

Host interface SPI data input

Host interface SPI data output

Host interface SPI chip select (active low)

Digital input or output

–

DIO13

Digital input or output

–

HOST_INTR

DIO23

Hi-Z

Interrupt output (active high)

Digital input or output

N/A

FLASH _SPI_MISO

External Serial Flash Programming: SPI data in

External Serial Flash Programming: SPI chip

select (active low)

FLASH _SPI_CS

N/A

Hi-Z

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表7-1. Pin Description and Attributes (continued)

DIGITAL I/O

STATE AT

RESET AND

HIBERNATE

BLE COEX

CC3135 DEVICE

PIN NO.

DEFAULT FUNCTION

I/O TYPE⁽¹⁾

DESCRIPTION

HOSTLESS

MODE

CC_COEX_

OUT

N/A

FLASH_SPI_CLK

GND

N/A

Hi-Z

Power

External Serial Flash Programming: SPI clock

Ground

–

FLASH_SPI_MOSI

DIO24

Hi-Z

External Serial Flash Programming: SPI data out

Digital input or output

DIO28

Digital input or output

–

N/A

No Connect

Reserved

DIO29

Hi-Z

No Connect

Digital input or output

Y⁽²⁾

Hi-Z

A 100 kΩpull down resistor is internally tied to

this SOP pin.

SOP2

A 100 kΩpull down resistor is internally tied to

this SOP pin. SOP[2:0] used for factory restore.

See 节9.5.

SOP1

N/A

Hi-Z

–

GND

RF_ABG

GND

N/A

Power

GND

–

GND

–

GND

–

GND

–

GND

–

Hi-Z

27, 28, 31

2.4 GHz & 5 GHz RF TX, RX

Power

–

GND

–

No Connect

A 100 kΩpull down resistor is internally tied to

this SOP pin. SOP[2:0] used for factory restore.

See 节9.5.

SOP0

N/A

Hi-Z

–

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表7-1. Pin Description and Attributes (continued)

DIGITAL I/O

STATE AT

RESET AND

HIBERNATE

BLE COEX

CC3135 DEVICE

PIN NO.

DEFAULT FUNCTION

I/O TYPE⁽¹⁾

DESCRIPTION

HOSTLESS

MODE

CC_COEX_

OUT

nRESET

N/A

Hi-Z

There is an internal 100 kΩpull-up resistor

option from the nRESET pin to VBAT_RESET.

Note: VBAT_RESET is not connected to VBAT1

or VBAT2 within the module. The following

connection schemes are recommended:

•

Connect nRESET to a GPIO from the host

only if nRESET will be in a defined state

under all operating conditions. Leave

VBAT_RESET unconnected to save power.

If nRESET cannot be in a defined state under

all operating conditions, connect

VBAT_RESET

N/A

Hi-Z

•

VBAT_RESET to the main module power

supply (VBAT1 and VBAT2). Due to the

internal pull-up resistor, a leakage current of

3.3 V / 100 kΩis expected.

Power supply for the module, must be connected

to battery (2.3 V to 3.6 V)

VBAT1

N/A

Hi-Z

GND

N/A

Power

GND

–

No Connect

–

Power supply for the module, must be connected

to battery (2.3 V to 3.6 V)

VBAT2

N/A

Hi-Z

10, 44, 54

DIO30

N/A

No Connect

–

N/A

Hi-Z

Network Scripter I/O

GND

Power

GND

–

UART1_nRTS

Hi-Z

UART interface to host (request to send)

No Connect

N/A

–

UART1_TX

UART1_RX

TEST_58

TEST_59

TEST_60

UART1_nCTS

Hi-Z

UART interface to host (transmit)

UART interface to host (receive)

Test signal; connect to an external test point.

UART interface to host (clear to send)

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表7-1. Pin Description and Attributes (continued)

DIGITAL I/O

STATE AT

RESET AND

HIBERNATE

BLE COEX

CC3135 DEVICE

PIN NO.

DEFAULT FUNCTION

I/O TYPE⁽¹⁾

DESCRIPTION

HOSTLESS

MODE

CC_COEX_

OUT

TEST_62

DIO8

Hi-Z

Test signal; connect to an external test point.

Digital input or output

DIO9

Digital input or output

–

(1) I = input, O = output, RF = radio frequency, I/O = bidirectional

(2) Output Only

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7.3 Signal Descriptions

表7-2. Signal Descriptions

NO.

TYPE

SIGNAL

DIRECTION

FUNCTION

SIGNAL NAME

DIO10

DESCRIPTION

I/O

DIO12

DIO13

DIO23

DIO24

DIO28

DIO29

DIO25

DIO30

DIO3

19⁽¹⁾

42⁽¹⁾

Antenna

selection

Antenna selection control

I/O

DIO4

DIO5

DIO8

DIO9

DIO10

DIO12

DIO13

DIO23

DIO24

DIO28

DIO29

DIO30

DIO3

I/O

19⁽¹⁾

42⁽¹⁾

BLE/2.4 GHz

Radio

Coexistence inputs and outputs

coexistence⁽²⁾

DIO4

DIO5

DIO8

DIO9

DIO10

DIO12

DIO13

DIO23

DIO24

DIO28

DIO29

DIO25

DIO30

DIO3

19⁽¹⁾

42⁽¹⁾

Hostless Mode

Hostless mode inputs and outputs

I/O

DIO4

DIO5

DIO8

DIO9

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FUNCTION

表7-2. Signal Descriptions (continued)

NO.

TYPE

SIGNAL

DIRECTION

SIGNAL NAME

DESCRIPTION

HOST_SPI_CLK

HOST_SPI_MOSI

HOST_SPI_MISO

HOST_SPI_nCS

FLASH_SPI_DIN

I/O

Host SPI clock input

Data from Host

HOST SPI

FLASH SPI

UART

Data to Host

Device select (active low)

External serial Flash interface: SPI data in

External serial Flash interface: SPI chip select (active

low)

FLASH_SPI_CS

FLASH_SPI_CLK

FLASH_SPI_MOSI

UART1_nRTS

UART1_TX

23⁽³⁾

I/O

External serial Flash interface: SPI clock

External serial Flash interface: SPI dta out

UART1 request-to-send (active low)

UART TX data

UART1_RX

UART RX data

UART1_nCTS

SOP2

UART1 clear-to-send (active low)

Sense-on-power 2

Sense-On-Power SOP1

SOP0

Configuration sense-on-power 1

Configuration sense-on-power 0

Power supply for the module

VBAT1

Power

VBAT2

Hibernate signal input to the NWP subsystem (active

low)

nHIB

RF_ABG

TEST_58

TEST_59

TEST_60

TEST_62

I/O

WLAN analog RF 802.11 a/b/g/n bands

Test Signal

Test Port

(1) LPDS retention unavailable.

(2) The CC3135MOD modules are compatible with TI BLE modules using an external RF switch.

(3) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an

output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode

to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.

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7.4 Connections for Unused Pins

All unused pins must be left as no connect (NC) pins. 表7-3 provides a list of NC pins.

表7-3. Connections for Unused Pins

FUNCTION

SIGNAL DESCRIPTION

PIN NUMBER

ACCEPTABLE PRACTICE

Wake up I/O source should not be floating

during hibernate. All the I/O pins will float

3, 9, 10, 12, 18, while in Hibernate and Reset states. Ensure

19, 22, 42, 53, 54 pullup and pulldown resistors are available on

board to maintain the state of the I/O. Leave

unused GPIOs as NC

DIO

Digital input or output

20, 21, 33, 39,

Unused pin, leave as NC.

41, 45

No Connect

SOP

Leave as NC (Modules contain internal 100

kΩpull down resistors on the SOP lines). An

external 10 kΩpull up resistor is required for

Configuration sense-on-power

23, 24, 34

factory restore. See 节9.5.

There is an internal 100 kΩpull-up resistor

option from the nRESET pin to VBAT_RESET.

Note: VBAT_RESET is not connected to

VBAT1 or VBAT2 within the module. The

following connection schemes are

recommended:

•

Connect nRESET to a GPIO from the host

only if nRESET will be in a defined state

under all operating conditions. Leave

VBAT_RESET unconnected to save

power.

Reset

RESET input for the device

35, 36

•

If nRESET cannot be in a defined state

under all operating conditions, connect

VBAT_RESET to the main module power

supply (VBAT1 and VBAT2). Due to the

internal pull-up resistor, a leakage current

of 3.3 V / 100 kΩis expected.

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8 Specifications

All measurements are references of the module pins, unless otherwise indicated. All specifications are over

process and voltage, unless otherwise indicated.

8.1 Absolute Maximum Ratings

These specifications indicate levels where permanent damage to the module can occur. Functional operation is not ensured

under these conditions. Operation at absolute maximum conditions for extended periods can adversely affect long-term

reliability of the module ^{(1) (2)}

MIN

–0.5

–40

MAX UNIT

V_BAT

3.8

Digital I/O

V_BAT+ 0.5

RF pin

2.1

Analog pins

Operating temperature, T_A

Storage temperature, T_stg

°C

(3)

Junction temperature, T_j

120

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to V_SS, unless otherwise noted.

(3) Junction temperature is for the CC3135RNMARGK device that is contained within the module.

8.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS001⁽¹⁾

±2000

Electrostatic discharge (ESD)

performance

V_ESD

Charged device model (CDM),

All pins

±500

per JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

Function operation is not ensured outside this limit, and operation outside this limit for extended periods can adversely affect

long-term reliability of the module^{(1) (2) (3)}

MIN

2.3

TYP

3.3

MAX

3.6

UNIT

V_BAT

Operating temperature

Ambient thermal slew

°C

–40

–20

°C/minute

(1) When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect

feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the

transmission.

(2) To ensure WLAN performance, ripple on the 2.3-V to 3.6-V supply must be less than ±300 mV.

(3) The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is 2.1 V,

and care must be taken when operating at the minimum specified voltage.

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8.4 Current Consumption Summary: 2.4 GHz RF Band

T_A= 25°C, V_BAT= 3.6 V

PARAMETER

TEST CONDITIONS^{(1) (2)}

TX power level = 0

TX power level = 4

TX power level = 0

TX power level = 4

TX power level = 0

TX power level = 4

MIN

TYP

272

188

248

179

223

160

MAX UNIT

1 DSSS

6 OFDM

54 OFDM

1 DSSS

RX⁽³⁾

54 OFDM

Idle connected⁽⁴⁾

LPDS

690

115

5.5

µA

Hibernate

Shutdown

V_BAT= 3.6 V

V_BAT= 3.3 V

V_BAT= 2.3 V

420

450

610

Peak calibration current^{(5) (3)}

(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off

approximately 4 dB.

(2) The CC3135MOD system is a constant power-source system. The active current numbers scale based on the V_BATvoltage supplied.

(3) The RX current is measured with a 1-Mbps throughput rate.

(4) DTIM = 1

(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is

performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.

There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further

details, see CC31XX CC32XX SimpleLink™ Wi-Fi^®and IoT Network Processor Programmer's Guide.

8.5 Current Consumption Summary: 5 GHz RF Band

T_A= 25°C, V_BAT= 3.6 V

PARAMETER

TEST CONDITIONS^{(1) (2)}

6 OFDM

MIN

TYP

318

293

MAX

UNIT

54 OFDM

RX⁽³⁾

54 OFDM

µA

Idle connected⁽⁴⁾

690

115

5.5

LPDS

Hibernate

Shutdown

V_BAT= 3.6 V

V_BAT= 3.3 V

V_BAT= 2.7 V

V_BAT= 2.3 V

290

310

365

Peak calibration current^{(5) (3)}

(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off

approximately 4 dB.

(2) The CC3135MOD system is a constant power-source system. The active current numbers scale based on the V_BATvoltage supplied.

(3) The RX current is measured with a 1-Mbps throughput rate.

(4) DTIM = 1

(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is

performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.

There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further

details, see CC31XX, CC32XX SimpleLink™ Wi-Fi^®and IoT Network Processor Programmer's Guide.

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8.6 TX Power Control for 2.4 GHz Band

The CC3135MOD has several options for modifying the output power of the device when required. For the 2.4

GHz band it is possible to lower the overall output power at a global level using the global TX power level setting.

In addition, the 2.4 GHz band allows the user to enter additional back-offs ¹, per channel, region ²and modulation

rates ^{3 4}, via Image creator (see the UniFlash CC31xx, CC32xx SimpleLink™ Wi-Fi^®and Internet-on-a chip™

Solution ImageCreator and Programming Tool User's Guide for more details).

图 8-1, 图 8-2, and 图 8-3 show TX Power and IBAT versus TX power level settings for modulations of 1 DSSS,

6 OFDM, and 54 OFDM, respectively.⁴

In 图 8-1, the area enclosed in the circle represents a significant reduction in current during transition from TX

power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI recommends using

TX power level 4 to reduce the current.

图8-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)

The back-off range is between -6 dB to +6 dB in 0.25 dB increments.

FCC, IC/ISED, ETSI/CE (Europe), and MIC (Japan) are supported.

Back-off rates are grouped into 11b rates, high modulation rates (MCS7, 54 OFDM and 48 OFDM), and lower modulation rates (all

other rates).

Please note that there will be a delta between the CC3235MODx module and CC3235x IC's TX power levels.

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图8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)

图8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)

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8.7 TX Power Control for 5 GHz Band

5 GHz power control is done via Image Creator where the maximum transmit power is provided ⁵. Within Image

Creator, power control is possible per channel, region ⁶, and modulation rates ⁷. In addition, it is possible to enter

an additional back-off ⁸factor per channel and modulation rate for further margin to regulatory requirements.

Finally, it is also possible to set the TX and RX trace losses to the antenna per band . The peak antenna

gain ¹⁰can also be provided, thus allowing further control. For a full description of options and capabilities see

the UniFlash CC31xx, CC32xx SimpleLink™ Wi-Fi^®and Internet-on-a chip™ Solution ImageCreator and

Programming Tool User's Guide.

The maximum transmit power range is 18 dBm to 0.125 dBm in 0.125 dBm decrements.

FCC, IC/ISED, ETSI/CE, and MIC are supported.

Rates are grouped into high modulation rates (MCS7, 54 OFDM and 48 OFDM) and lower modulation rates (all other rates).

The back-off range is 0 dBm to 18 dBm in 0.125 dBm increments, with the maximum back-off not exceed that of the maximum transmit

power.

The range of losses if from 0 dBm to 7.75 dBm in 0.125 dBm increments.

The antenna gain has a range of -2 dBi to 5.75 dBi in 0.125 dBi increments.

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8.8 Brownout and Blackout Conditions

The device enters a brownout condition when the input voltage dips below V_BROWNOUT(see 图 8-4 and 图 8-5).

This condition must be considered during design of the power supply routing, especially if operating from a

battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to

networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance

includes the internal resistance of the battery, contact resistance of the battery holder (four contacts for a 2× AA

battery), and the wiring and PCB routing resistance.

Note

When the device is in the Hibernate state, brownout is not detected; only blackout is in effect during

the Hibernate state.

图8-4. Brownout and Blackout Levels (1 of 2)

图8-5. Brownout and Blackout Levels (2 of 2)

In the brownout condition, all sections of the CC3135MOD (including the 32-kHz RTC) shut down except for the

Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout

condition is equivalent to a hardware reset event in which all states within the device are lost.

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表8-1 lists the brownout and blackout voltage levels.

表8-1. Brownout and Blackout Voltage Levels

CONDITION

V_brownout

VOLTAGE LEVEL

UNIT

2.1

V_blackout

1.67

8.9 Electrical Characteristics for DIO Pins

T_A= 25°C, V_BAT= 3.3 V

PARAMETER

TEST CONDITIONS⁽¹⁾

MIN

NOM

MAX

UNIT

C_IN

V_IH

V_IL

I_IH

Pin capacitance

High-level input voltage

Low-level input voltage

High-level input current

Low-level input current

0.65 × V_DD

V_DD+ 0.5 V

0.35 × V_DD

–0.5

I_IL

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.4 V ≤V_DD< 3.6 V

V_DD× 0.8

V_DD× 0.7

V_DD× 0.75

IL = 4 mA; configured I/O drive

strength = 4 mA;

2.4 V ≤V_DD< 3.6 V

V_OH

High-level output voltage

IL = 8 mA; configured I/O drive

strength = 8 mA;

2.4 V ≤V_DD< 3.6 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.3 V ≤V_DD< 2.4 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.4 V ≤V_DD< 3.6 V

V_DD× 0.2

V_DD× 0.25

IL = 4 mA; configured I/O drive

strength = 4 mA;

2.4 V ≤V_DD< 3.6 V

V_OL

Low-level output voltage

IL = 8 mA; configured I/O drive

strength = 8 mA;

2.4 V ≤V_DD< 3.6 V

IL = 2 mA; configured I/O drive

strength = 2 mA;

2.3 V ≤V_DD< 2.4 V

2-mA drive

High-level

source current

I_OH

4-mA drive

6-mA drive

2-mA drive

Low-level sink

4-mA drive

current

I_OL

6-mA drive

V_IL

nRESET⁽²⁾

0.6

(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk

of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength

setting is 6 mA.

(2) The nRESET pin must be held below 0.6 V for the device to register a reset.

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8.10 WLAN Receiver Characteristics

表8-2. WLAN Receiver Characteristics: 2.4 GHz Band

T_A= 25°C, V_BAT= 2.3 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz).

PARAMETER

TEST CONDITIONS (Mbps)

MIN

TYP

–94.5

–92.5

–86.5

–89

MAX

UNIT

1 DSSS

2 DSSS

11 CCK

6 OFDM

Sensitivity

(8% PER for 11b rates, 10% PER for 11g/11n

9 OFDM

dBm

–88.5

–85

rates)⁽¹⁾

18 OFDM

36 OFDM

54 OFDM

MCS7 (GF)⁽²⁾

802.11b

–79

–73

–70

–2.5

–8.5

Maximum input level

(10% PER)

dBm

802.11g

(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).

(2) Sensitivity for mixed mode is 1-dB worse.

表8-3. WLAN Receiver Characteristics: 5 GHz Band

T_A= 25°C, V_BAT= 2.3 V to 3.6 V.

PARAMETER

TEST CONDITIONS (Mbps)

6 OFDM

MIN

TYP

-89

MAX

UNIT

dBm

9 OFDM

-88

18 OFDM

-85

Sensitivity

(10% PER for 11g/11n rates)

36 OFDM

-78.5

-72

54 OFDM

MCS7 (GF)⁽¹⁾

-68

Maximum input level

802.11a

-17

(1) Sensitivity for mixed mode is 1-dB worse.

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8.11 WLAN Transmitter Characteristics

表8-4. WLAN Transmitter Characteristics: 2.4 GHz Band

T_A= 25°C, V_BAT= 2.3 V to 3.6 V.⁽¹⁾Parameters measured at SoC pin on channel 6 (2437 MHz).^{(2) (3)}

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Operating frequency range^{(4) (5)}

2412

2472

MHz

1 DSSS

2 DSSS

11 CCK

16.3

15.3

6 OFDM

9 OFDM

18 OFDM

36 OFDM

54 OFDM

MCS7

Maximum RMS output power measured at 1

dB from IEEE spectral mask or EVM

dBm

ppm

12.5

Transmit center frequency accuracy

–25

(1) Transmit power will be reduced by 1.5dB for V_BAT< 2.8V

(2) The 11g/n low rates on edge channels (2412 and 2462 MHz) have reduced TX power to meet FCC emission limits.

(3) Power of 802.11b rates are reduced to meet ETSI requirements in Europe.

(4) Channels 1 (2142 MHz) through 11 (2462 MHz) are supported for FCC.

(5) Channels 1 (2142 MHz) through 13 (2472MHz) are supported for Europe and Japan. Note that channel 14 is not supported for Japan.

表8-5. WLAN Transmitter Characteristics: 5 GHz Band

T_A= 25°C, V_BAT= 2.3 V to 3.6 V.⁽¹⁾Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157 .^{(2) (3)}

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Operating frequency range^{(4) (5) (6)}

5180

5825

MHz

6 OFDM

9 OFDM

18 OFDM

36 OFDM

54 OFDM

MCS7

15.1

13.6

Maximum RMS output power measured at 1

dB from IEEE spectral mask or EVM

dBm

Transmit center frequency accuracy

-20

ppm

(1) Transmit power will be reduced by 1.5dB for V_BAT< 2.8V

(2) FCC channels 36, 60, 64, 100, and 140, where harmonics/sub-harmonics of fall in the FCC restricted band, have reduced output

power to meet the FCC RSE requirement.

(3) The edge channels (100 and 140) have reduced TX power to meet FCC emissions limits.

(4) FCC band covers U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3 20-MHz BW modulations.

(5) Europe bands 1, 2 and 3, 20-MHz BW modulations are supported.

(6) For Japan, W52, W53 and W56, 20-MHz BW modulations are supported.

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8.12 BLE and WLAN Coexistence Requirements

For proper BLE and WLAN 2.4 GHz radio coexistence, the following requirements must be met.

表8-6. BLE/WLAN Coex⁽¹⁾Isolation Requirement

PARAMETER

Band

MIN

TYP

MAX

UNIT

Port-to-port isolation

Dual antenna configuration⁽²⁾

20⁽³⁾

(1) The CC3135MOD modules are compatible with TI BLE modules using an external RF switch.

(2) A single antenna configuration is possible using the CC3x35 devices.

(3) For dual antenna configuration antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB.

8.13 Reset Requirement

PARAMETER

Operation mode level

MIN

TYP

0.65 × V_BAT

0.6

MAX UNIT

V_IH

V_IL

Shutdown mode level⁽¹⁾

Minimum time for nReset low for resetting the module

Rise and fall times

µs

T_rand T_f

(1) The nRESET pin must be held below 0.6 V for the module to register a reset.

8.14 Thermal Resistance Characteristics for MOB Package

NO.

PARAMETE DESCRIPTION

°C/W^{(1) (2)}

AIR FLOW (m/s)⁽³⁾

11.4

8.0

N/A

Junction-to-case

Junction-to-board

Junction-to-free air

RΘ_JC

RΘ_JB

19.1

14.7

13.4

12.5

5.4

RΘ_JA

Junction-to-moving air

Junction-to-free air

Junction-to-package top

Junction-to-free air

Junction-to-board

5.8

Ψ_JT

6.1

T10

T11

T12

T13

T14

6.5

6.8

6.6

Ψ_JB

6.6

6.5

(1) °C/W = degrees Celsius per watt.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ_JC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/

JEDEC standards:

•

JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70°C is assumed.

(3) m/s = meters per second.

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8.15 Timing and Switching Characteristics

8.15.1 Power-Up Sequencing

For proper start-up of the CC3135MOD module, perform the recommended power-up sequencing as follows:

1. Tie V_BAT1(pin 37) and V_BAT2(pin 40) together on the board.

2. Hold the nRESET pin low while the supplies are ramping up.

图8-6 shows the reset timing diagram for the first-time power-up and reset removal.

VBAT

nRESET

nHIB

Device ready to

serve API calls

POWER

OFF

RESET

HW INIT

FW INIT

STATE

32-kHz

XTAL

图8-6. First-Time Power-Up and Reset Removal Timing Diagram

表8-7 describes the timing requirements for the first-time power-up and reset removal.

表8-7. First-Time Power-Up and Reset Removal Timing Requirements

ITEM

NAME

DESCRIPTION

MIN

TYP

MAX

UNIT

nReset timing after VBAT supplies

are stable

nReset time

Hardware wake-up time

Initialization time

Internal 32-kHz XTAL settling plus

firmware initialization time plus

radio calibration

1.35

8.15.2 Power-Down Sequencing

For proper power down of the CC3135MOD module, ensure that the nRESET (pin 35) and nHIB (pin 4) pins

have remained in a known state for a minimum of 200 ms before removing power from the module.

8.15.3 Device Reset

When a device restart is required, the user may issue a negative pulse on either the nHIB pin (pin 4) or on the

nRESET pin (pin 35), keeping the other pulled high, depending on the configuration of the platform. If the

nRESET pin is used, the user must insure the following:

• A high-to-low reset pulse (on pin 35) of at least 200-ms duration

To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset.

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8.15.4 Wakeup From HIBERNATE Mode Timing

图8-7 shows the timing diagram for wakeup from HIBERNATE mode.

wake_from_hib

hib_min

VBAT

nRESET

nHIB

ACTIVE

HIBERNATE

HW WAKEUP+FW INIT

ACTIVE

HIBERNATE

32-kHz

XTAL/CXO

图8-7. nHIB Timing Diagram

Note

The internal 32.768-kHz XTAL is kept enabled by default when the chip goes into HIBERNATE mode

in response to nHIB being pulled low.

表8-8 describes the timing requirements for nHIB.

表8-8. nHIB Timing Requirements

ITEM

NAME

DESCRIPTION

MIN

TYP MAX

UNIT

T_{hib_min}

Minimum hibernate time

Minimum pulse width of nHIB being low⁽¹⁾

Hardware wakeup time plus

firmware initialization time

T_{wake_from_hib}

See⁽²⁾

(1) If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.

(2) Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so

on).

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8.16 External Interfaces

This section describes the external interfaces supported by the CC3135MOD module, as follows:

• SPI Host

• Host UART

• External Flash

8.16.1 SPI Host Interface

The device interfaces to an external host using the SPI. The CC3135MOD module can interrupt the host using

the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a

speed of 20 MHz.

图8-8 shows the SPI host interface.

MCU

CC3135MOD (slave)

HOST_SPI_CLK

SPI_CLK

HOST_SPI_nCS

HOST_SPI_MISO

HOST_SPI_MOSI

SPI_nCS

SPI_MISO

SPI_MOSI

INTR

HOST_INTR

nHIB

GPIO

图8-8. SPI Host Interface

表8-9 lists the SPI host interface pins.

表8-9. SPI Host Interface

PIN NAME

DESCRIPTION

HOST_SPI_CLK

HOST_SPI_nCS

HOST_SPI_MOSI

HOST_INTR

Clock (up to 20 MHz) from MCU host to CC3135MOD module

CS (active low) signal from MCU host to CC3135MOD module

Data from MCU host to CC3135MOD module

Interrupt from CC3135MOD module to MCU host

HOST_SPI_MISO

nHIB

Data from CC3135MOD module to MCU host

Active-low signal that commands the CC3135MOD module to enter hibernate mode (lowest power state)

图8-9 shows the host SPI timing diagram.

CLK

MISO

MOSI

图8-9. Host SPI Timing

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表8-10 lists the host SPI timing parameters.

表8-10. Host SPI Timing Parameters

PARAMETER

NUMBER

DESCRIPTION

MIN

MAX

UNIT

Clock frequency at V_BAT= 3.3 V

Clock frequency at V_BAT= 2.3 V

Clock period

MHz

t_clk

t_LP

t_HT

Clock low period

Clock high period

Duty cycle

45%

55%

t_IS

RX data setup time

RX data hold time

TX data output delay

TX data hold time

t_IH

t_OD

t_OH

8.16.2 Host UART Interface

The SimpleLink device requires the UART configuration described in 表8-11.

表8-11. SimpleLink™ UART Configuration

PROPERTY

SUPPORTED CC3135 CONFIGURATION

Baud rate

115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command

Data bits

8 bits

Flow control

Parity

CTS/RTS

None

Stop bits

Bit order

Least significant bit (LSB) first

Active high

Host interrupt polarity

Host interrupt mode

Endianness

Rising edge or level 1

Little-endian only⁽¹⁾

(1) The SimpleLink device does not support automatic detection of the host length while using the UART interface.

8.16.2.1 5-Wire UART Topology

图 8-10 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from

the device to the host controller to allow efficient low power mode.

图 8-10 shows the typical and recommended UART topology because it offers the maximum communication

reliability and flexibility between the host and the SimpleLink device.

nRTS

nCTS

nRTS

nCTS

HOST MCU

UART

CC3135MOD

UART

HOST_INTR(IRQ)

图8-10. Typical 5-Wire UART Topology

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8.16.2.2 4-Wire UART Topology

The 4-wire UART topology eliminates the host IRQ line (see 图 8-11). Using this topology requires one of the

following conditions to be met:

• Host is always awake or active.

• Host goes to sleep, but the UART module has receiver start-edge detection for automatic wake up and does

not lose data.

nRTS

nCTS

nRTS

nCTS

HOST MCU

UART

CC3135MOD

UART

HOST_INTR(IRQ)

图8-11. 4-Wire UART Configuration

8.16.2.3 3-Wire UART Topology

The 3-wire UART topology requires only the following lines (see 图8-12).

• RX

• TX

• nCTS

nRTS

nCTS

nRTS

nCTS

HOST MCU

UART

CC3135MOD

UART

HOST_INTR(IRQ)

图8-12. 3-Wire UART Topology

Using 3-wire topology requires one of the following conditions to be met:

• Host always stays awake or active.

• Host goes to sleep, but the UART module has receiver start-edge detection for auto wake up and does not

lose data.

• Host can always receive any amount of data transmitted by the SimpleLink device because there is no flow

control in this direction.

Because there is no full flow control, the host cannot stop the SimpleLink device to send its data; thus, the

following parameters must be carefully considered:

• Maximum baud rate

• RX character interrupt latency and low-level driver jitter buffer

• Time consumed by the user's application

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8.16.3 External Flash Interface

The CC3135MOD module includes the Macronix 32-Mbit Serial Flash. The Serial Flash can be programmed

directly via the external Flash interface (pins 13, 14, 15, and 17). Note that during normal operation, the external

Flash interface should remain unconnected.

For timing details, see the MX25R3235F data sheet.

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9 Detailed Description

9.1 Overview

The CC3135MOD dual-band Wi-Fi module contains a dedicated Arm^®MCU that offloads many of the

networking activities from the host MCU. Including an 802.11 a/b/g/n radio, baseband, and MAC with a powerful

crypto engine for a fast, secure WLAN and Internet connections with 256-bit encryption. The CC3135MOD

module supports station, AP, and Wi-Fi Direct modes. The device also supports WPA2 personal and enterprise

security, WPS 2.0, and WPA3 personal and enterprise security ¹¹. The Wi-Fi network processor includes an

embedded IPv6 and IPv4 TPC/IP stack.

9.2 Module Features

9.2.1 WLAN

The WLAN features are as follows:

• 802.11 a/b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station, AP,

and Wi-Fi Direct client and group owner with CCK and OFDM rates in the 2.4 GHz ISM band, channels 1 to

13, and 5 GHz U-NII band.

Note

802.11n is supported only in Wi-Fi station, Wi-Fi direct, and P2P client modes.

• Autocalibrated radio with a single-ended 50-Ωinterface enables easy connection to the antenna without

requiring expertise in radio circuit design.

• Advanced connection manager with multiple user-configurable profiles stored in a serial Flash allows

automatic, fast connection to an access point without user or host intervention.

• Supports all common Wi-Fi security modes for personal and enterprise networks, with on-chip security

accelerators, including WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x), WPA3 Personal and WPA3

Enterprise.

• Smart provisioning options deeply integrated within the device provide a comprehensive end-to-end solution.

Elaborate events notification to the host enable the application to control the provisioning decision flow. The

wide variety of Wi-Fi provisioning methods include:

– Access Point using HTTPS

– SmartConfig Technology: a 1-step, 1-time process to connect a CC3135MOD-enabled module to the

home wireless network, removing dependency on the I/O capabilities of the host MCU; thus, the device is

usable by deeply embedded applications.

• 802.11 transceiver mode transmits and receives proprietary data through a socket without adding MAC or

PHY headers, and provides the option to select the working channel, rate, and transmitted power. The

receiver mode works together with the filtering options.

Supported from Service Pack v4.5.0.11-3.1.0.5-3.1.0.25. Limited to STA mode only.

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9.2.2 Network Stack

The network stack features are as follows:

• Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU,

microprocessor, or ASIC

Note

Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.

• Support of 16 simultaneous TCP, UDP, RAW, SSL\TLS sockets

• Built-in network protocols:

– Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and Stateless auto configuration

– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND

– DNS client for easy connection to the local network and the Internet

• Built-in network application and utilities:

– HTTP/HTTPS

• Web page content stored on serial Flash

• RESTful APIs for setting\configuring application content

• Dynamic user callbacks

• Service discovery: Multicast DNS service discovery allows a client to advertise its service without a

centralized server. After connecting to the access point, the CC3135 device provides critical information, such

as device name, IP, vendor, and port number.

• DHCP server

• Ping

表9-1 summarizes the NWP features.

表9-1. NWP Features

Feature

Description

802.11a/b/g/n station

Wi-Fi standards

802.11a/b/g AP supporting up to four stations

Wi-Fi Direct client and group owner

2.4 GHz ISM and 5 GHz U-NII Channels

20 MHz

Wi-Fi channels

Channel Bandwidth

Wi-Fi security

Wi-Fi provisioning

IP protocols

WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x), WPA3 personal and enterprise ⁽¹⁾

SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP web server

IPv4/IPv6

IP addressing

Cross layer

Static IP, LLA, DHCPv4, DHCPv6 with DAD

ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP

UDP, TCP

Transport

SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2

RAW

Ping

HTTP/HTTPS web server

mDNS

Network applications and

utilities

DNS-SD

DHCP server

UART/SPI

Host interface

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表9-1. NWP Features (continued)

Feature

Description

Device identity

Security

Trusted root-certificate catalog

TI root-of-trust public key

Power management

Other

Enhanced power policy management uses 802.11 power save and deep-sleep power modes

Transceiver

Programmable RX filters with event-trigger mechanism

Rx Metrics for tracking the surrounding RF environment

(1) Supported from Service Pack v4.5.0.11-3.1.0.5-3.1.0.25. Limited to STA mode only.

9.2.2.1 Security

The SimpleLink Wi-Fi CC3135MOD internet-on-a chip module enhances the security capabilities available for

development of IoT devices, while completely offloading these activities from the MCU to the networking

subsystem. The security capabilities include the following key features:

Wi-Fi and Internet security

• Personal and enterprise Wi-Fi security

– Personal standards

• AES (WPA2-PSK)

• TKIP (WPA-PSK)

• WEP

• Enterprise standards

– EAP Fast

– EAP PEAPv0 MSCHAPv2

– EAP PEAPv0 TLS

– EAP PEAPv1 TLS EAP LS

– EAP TTLS TLS

– EAP TTLS MSCHAPv2

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• Secure sockets

– Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2

– On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES

encryption for TLS and SSL connections

– Ciphers suites

• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA

• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA

• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA

• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384

• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256

• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256

• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256

– Server authentication

– Client authentication

– Domain name verification

– Socket upgrade to secure socket –STARTTLS

• Secure HTTP server (HTTPS)

• The trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure

content delivery.

• The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine

origin of a given content using asymmetric keys.

• Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel.

• Code and data security

– Secured network information: Network passwords and certificates are encrypted

– Secured and authenticated service pack: SP is signed based on TI certificate

9.2.3 FIPS 140-2 Level 1 Certification

The Federal Information Processing Standard (FIPS) Publication 140-2 is a U.S. government computer security

standard. It is commonly referred to as FIPS 140-2, and is used to accredit the design and implementation of

cryptographic functions, for example within a chip. A cryptographic function within a chip security system is

necessary to maintain the confidentiality and integrity of the information that is being processed.

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The security functions of the CC3135 chip which is inside the CC3135MOD module, are FIPS certified to FIPS

140-2 level 1. This certification covers topics such as: cryptographic specifications, ports and interfaces, a finite

state model for the cryptographic functions, the operational environment of the function, and how cryptographic

keys are managed. The certification provides the assurance that the implementation meets FIPS 140-2 level 1

standards.

9.2.4 Host Interface and Driver

• Interfaces over a 4-wire SPI with any MCU or a processor at a clock speed of 20 MHz

• Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI

MCUs and is easily ported to any processor or ASIC.

• Simple APIs enable easy integration with any single-threaded or multithreaded application.

9.2.5 System

• Connects directly to a battery

• Ultra-low leakage when disabled (hibernate mode) with a current of less than 5.5 µA with the RTC running

and 1 µA when in shutdown mode.

• Integrated clock sources

9.3 Power-Management Subsystem

The CC3135MOD power-management subsystem contains DC-DC converters to accommodate the differing

voltage or current requirements of the system.

The CC3135MOD is a fully integrated module-based WLAN radio solution used on an embedded system with a

wide-voltage supply range. The internal power management, including DC-DC converters and LDOs, generates

all of the voltages required for the module to operate from a wide variety of input sources. For maximum

flexibility, the module can operate in the modes described in the following sections.

9.3.1 V_BATWide-Voltage Connection

In the wide-voltage battery connection, the module can be directly connected to two AA alkaline batteries. All

other voltages required to operate the device are generated internally by the DC-DC converters. This scheme is

the most common mode for the device because it supports wide-voltage operation from 2.3 to 3.6 V.

9.4 Low-Power Operating Modes

This section describes the low-power modes supported by the module to optimize battery life.

9.4.1 Low-Power Deep Sleep

The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered

automatically during periods of inactivity based on internal power optimization algorithms. The module can wake

up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this

mode is 135 µA. During LPDS mode, the module retains the software state and certain configuration information.

The operation is transparent to the external host; thus, no additional handshake is required to enter or exit this

sleep mode.

9.4.2 Hibernate

The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small

section of the logic powered directly by the main input supply is retained. The real-time clock (RTC) is kept

running and the module wakes up when the n_HIB line is asserted by the host driver. The typical battery drain in

this mode is 5.5 µA. The wake-up time is longer than LPDS mode at about 50 ms.

9.4.3 Shutdown

Shutdown mode is the lowest power-mode system-wise. All device logics are off, including the realtime clock

(RTC). The typical battery drain in this mode is 1 µA. The wake-up time in this mode is longer than hibernate at

approximately 1.1 seconds.

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9.5 Restoring Factory Default Configuration

The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory

image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on

the sFLASH in a secure manner and cannot be accessed from the host processor. The following restore modes

are supported:

• None—no factory restore settings

• Enable restore of factory default parameters

• Enable restore of factory image and factory default parameters

The restore process is performed by pulling or forcing SOP[2:0] = 011 pins and toggling the nRESET pin from

low to high.

The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The

restore process typically takes about 8 seconds, depending on the attributes of the serial Flash vendor.

9.6 Hostless Mode

The SimpleLink™ Wi-Fi^®CC3135MOD device incorporates a scripting ability that enables offloading of simple

tasks from the host processor. Using simple and conditional scripts, repetitive tasks can be handled internally,

which allows the host processor to remain in a low-power state. In some cases where the scripter is being used

to send packets, it reduces code footprint and memory consumption. The if-this-then-that style conditioning can

include anything from GPIO toggling to transmitting packets.

The conditional scripting abilities can be divided into conditions and actions. The conditions define when to

trigger actions. Only one action can be defined per condition, but multiple instances of the same condition may

be used, so in effect multiple actions can be defined for a single condition. In total, 16 condition and action pairs

can be defined. The conditions can be simple, or complex using sub-conditions (using a combinatorial AND

condition between them). The actions are divided into two types, those that can occur during runtime and those

that can occur only during the initialization phase.

The following actions can only be performed when triggered by the pre-initialization condition:

• Set roles AP, station, P2P, and Tag modes

• Delete all stored profiles

• Set connection policy

• Hardware GPIO indication allows an I/O to be driven directly from the WLAN core hardware to indicate

internal signaling

The following actions may be activated during runtime:

• Send transceiver packet

• Send UDP packet

• Send TCP packet

• Increment counter increments one of the user counters by 1

• Set counter allows setting a specific value to a counter

• Timer control

• Set GPIO allows GPIO output from the device using the internal networking core

• Enter Hibernate state

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Note

Consider the following limitations:

• Timing cannot be ensured when using the network scripter because some variable latency will

apply depending on the utilization of the networking core.

• The scripter is limited to 16 pairs of conditions and reactions.

• Both timers and counters are limited to 8 instances each. Timers are limited to a resolution of 1

second. Counters are 32 bits wide.

• Packet length is limited to the size of one packet and the number of possible packet tokens is

limited to 8.

9.7 Device Certification and Qualification

The TI CC3135MOD module is certified for FCC, IC/ISED, ETSI/CE, and MIC. Moreover, the module is also Wi-

Fi certified with the ability to request a certificate transfer for Wi-Fi alliance members. TI customers that build

products based on the TI CC3135MOD can save in testing cost and time per product family.

The CC3135MOD module is certified to the standards listed in 表9-2 (with IDs where applicable).

表9-2. CC3135MOD List of Certifications

REGULATORY BODY

FCC (USA)

SPECIFICATION

ID (IF APPLICABLE)

Part 15C + MPE FCC RF Exposure

RSS-102 (MPE) and RSS-247 (Wi-Fi)

EN300328 v2.2.1 (2.4 GHz Wi-Fi)

EN301893 v2.1.1 (5GHz Wi-Fi)

EN62311:2008 (MPE)

Z64-CC3135MOD

IC/ISED (Canada)

451I-CC3135MOD

—

ETSI/CE (Europe)

EN301489-1 v2.2.1 (EMC General)

EN301489-17 v3.2.0 (EMC Wi-Fi)

EN60950-1:2006/A11:2009/A1:2010/

A12:2011/A2:2013

MIC (Japan)

Article 49-20 of ORRE

201-190034

9.7.1 FCC Certification and Statement

CAUTION

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

The CC3135MOD modules from TI are certified for the FCC as a single-modular transmitter. The modules are

FCC-certified radio modules that carries a modular grant.

You are cautioned that changes or modifications not expressly approved by the party responsible for compliance

could void the user’s authority to operate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference.

• This device must accept any interference received, including interference that may cause undesired

operation of the device.

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9.7.2 IC/ISED Certification Statement

CAUTION

IC RF Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment.

This equipment should be installed and operated with a minimum distance of 20 cm between the

radiator and your body.

Déclaration d'exposition aux radiations:

Cut équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un

environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de 20 cm

de distance entre la source de rayonnement et votre corps.

The TI CC3135MOD modules are certified for IC as a single-modular transmitter. The TI CC3135MOD modules

meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC

regarding certified modules in authorized equipment.

This device complies with Industry Canada license-exempt RSS standards.

Operation is subject to the following two conditions:

• This device may not cause interference.

• This device must accept any interference, including interference that may cause undesired operation of the

device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence.

L'exploitation est autorisée aux deus conditions suivantes:

• L'appareil ne doit pas produire de brouillage.

• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage ests

susceptible d'en compromettre lu fonctionnement.

9.7.3 ETSI/CE Certification

The CC3135MOD module is CE certified with certifications to the appropriate EU radio and EMC directives

summarized in the Declaration of Conformity and evidenced by the CE mark. The modules are tested against

the new Radio Equipment Directive (RE-D).

The full text of the EU declarations of conformity is available at:

• CC3135MODRNMMOB EC Declaration of Conformity (DoC)

9.7.4 Japan MIC Certification

The CC3135MOD is MIC certified against article 49-20 and the relevant articles of the Ordinance Regulating

Radio Equipment.

Operation is subject to the following condition:

• The host system does not contain a wireless wide area network (WWAN) device.

This device operates in the W52 and W53 bands and is for indoor use only (except communication to high power

radio).

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9.8 Module Markings

图9-1 shows the SimpleLink™ CC3135 module markings.

表9-3 lists the SimpleLink™ CC3135 module markings.

图9-1. SimpleLink™ CC3135 Module Markings

表9-3. Marking Descriptions

DESCRIPTION

MARKING

CC3135MODRNMMOB

Model

LTC (Lot Trace Code):

•

Y = Year

YMWLLLC

M = Month

WLLLC = Reserved for internal use

Z64-CC3135MOD

451I-CC3135MOD

FCC ID: single modular FCC grant ID

IC: single modular IC grant ID

MIC compliance mark

R 201-190034

MIC ID: modular MIC grant ID

CE compliance mark

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9.9 End Product Labeling

This module is designed to comply with the FCC single modular FCC grant, FCC ID: Z64-CC3135MOD. The

host system using this module must display a visible label indicating the following text:

Contains FCC ID: Z64-CC3135MOD

This module is designed to comply with the IC single modular IC grant, IC: 451I-CC3135MOD. The host system

using this module must display a visible label indicating the following text:

Contains IC: 451I-CC3135MOD

This module is designed to comply with the JP statement, 201-190034. The host system using this module must

display a visible label indicating the following text:

Contains transmitter module with certificate number: 201-190034.

9.10 Manual Information to the End User

The OEM integrator must be aware not to provide information to the end user regarding how to install or remove

this RF module in the user’s manual of the end product which integrates this module.

The end user manual must include all required regulatory information/warning as shown in this manual.

For more information, refer to the CC3135MOD OEM Integrator's Guide.

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10 Applications, Implementation, and Layout

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes. Customers should validate and test their design

implementation to confirm system functionality.

10.1 Application Information

10.1.1 BLE/2.4 GHz Radio Coexistence

The CC3135MOD device is designed to support BLE/2.4 GHz radio coexistence. Because WLAN is inherently

more tolerant to time-domain disturbances, the coexistence mechanism gives priority to the Bluetooth^®low

energy entity over the WLAN. Bluetooth^®low energy operates in the 2.4 GHz band, therefore the coexistence

mechanism does not affect the 5 GHz band. The CC3135MOD device can operate normally on the 5 GHz band,

while the Bluetooth^®low energy works on the 2.4 GHz band without mutual interference.

The following coexistence modes can be configured by the user:

• Off mode or intrinsic mode

– No BLE/2.4 GHz radio coexistence, or no synchronization between WLAN and Bluetooth^®low energy—in

case Bluetooth^®low energy exists in this mode, collisions can randomly occur.

• Time Division Multiplexing (TDM, Dual Antenna)

– Dual-band Wi-Fi (see 图10-1)

In this mode, the WLAN can operate on either a 2.4 or 5 GHz band and Bluetooth^®low energy operates

on the 2.4 GHz band.

图 10-1 shows the dual antenna implementation of a complete Bluetooth^®low energy and WLAN coexistence

network with the WLAN operating on either a 2.4- or a 5 GHz band. Note in this implementation no Coex switch

is required and only a single GPIO from the BLE device to the CC3135 device is required.

Dual-band Antenna

BLE Ant.

RF_ABG

WLAN

CC3135MOD

BLE

CCxxxx

Coex IO

CC_COEX_BLE_IN

图10-1. Dual-Antenna Coexistence Mode Block Diagram

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10.1.2 Antenna Selection

The CC3135MOD device is designed to also support antenna selection and is controlled from Image Creator.

When enabled, there are 3 options possible options:

• ANT 1: When selected, the GPIOs that are defined for antenna selection with set the RF path for antenna 1.

• ANT 2: When selected, the GPIOs that are defined for antenna selection will set the RF path for antenna 2.

• Autoselect: When selected, during a scan and prior to connecting to an AP, CC3135MOD device will

determine the best RF path and select the appropriate antenna ^{12 13}. The result is the saved as port of the

profile.

图 10-2 shows the antenna selection implementation for Wi-Fi, with BLE operating on it's own antenna. Note in

this implementation, only a single GPIO from the BLE device to the CC3135MOD device is required. The

Antenna switch ¹⁴is controlled by 2 GPIO lines from the CC3135MOD device. 表 7-2 lists which GPIOs can be

used for Antenna Selection.

Dual Band Ant. 1

Antenna Selection

SPDT RF Switch

RF_ABG

ANT_SEL_1

Dual Band Ant. 2

ANT_SEL_2

WLAN

CC3135MOD

BLE Ant.

BLE

CCxxxx

CC_COEX_BLE_IN

Coex IO

图10-2. Coexistence Solution with Wi-Fi Antenna Selection and dedicated BLE antenna

When selecting Autoselect via the API, a reset is required in order for the CC3135MOD device to determine the best antenna for use.

Refer to the Uniflash with Image Creator User Guidefor more information.

The recommended Antenna switch is the Richwave RTC6608OSP.

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10.1.3 Typical Application

图10-3 shows the typical application schematic using the CC3135MOD module.

Optional:

Consider adding extra decoupling

capacitors if the battery cannot source

the peak currents.

VBAT_CC

100uF

0.1uF

GND

CC1

0.1uF

GND

VBAT1

VBAT2

HIB

CC_nHIB

HOST INTERFACE

(Ensure that nHIB line

does not ﬂoat at any time.)

HOST_SPI_CLK

HOST_SPI_DIN

HOST_SPI_DOUT

HOST_SPI_CS

HOST_INTR

CC_SPI_CLK

CC_SPI_DIN

CC_SPI_DOUT

CC_SPI_CS

CC_IRQ

GND

SEE TABLE 4-1 FOR

VBAT_RESET and nRESET

CONNECTION OPTIONS

VBAT_CC

VBAT_RESET

RESET

10k

SOP[2:0] USED TO CONFIGURE

BOOT MODES (TABLE 5-5)

UART1_TX

UART1_RX

CC_UART1_TX

CC_UART1_RX

UART1_RTS

SOP0

SOP1

SOP2

HOST CONTROL

UART1_RTS

UART1_CTS

FLASH_SPI_CLK

FLASH_SPI_MOSI

FLASH_SPI_MISO

FLASH_SPI_CS_IN

RF_ABG

EXTERNAL

PROGRAMMING

Matching circuit shown below is for

RS232_TX

RS232_RX

UART_TX

UART_RX

the antenna. The module is matched

internally to 50 Ω. Final solution

may require antenna matching

optimization with a pi-network.

TEST_58

TEST_59

TEST_60

TEST_62

DIO10

DIO12

DIO13

DIO23

DIO24

DIO28

DIO29

GND

RF_ABG

3nH

3.3pF

DIO30

DIO8

DIO9

GND

GNDGND

RESERVED

CC3135MODRNMMOBR

GND

This is the reference schematic and not an actual board design. For a full operational reference design, see the CC3135MOD Hardware Design Files.

图10-3. CC3135MOD Module Reference Schematic

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Note

The following guidelines are recommended for implementation of the RF design:

• Ensure an RF path is designed with an impedance of 50 Ω

• Tuning of the antenna impedance πmatching network is recommended after manufacturing of the PCB to account for PCB parasitics

• πor L matching and tuning may be required between cascaded passive components on the RF path

表10-1 lists the bill of materials for a typical application using the CC3135MOD module shown in 图10-3.

表10-1. Bill of Materials

QTY

PART REFERENCE

VALUE

0.1 uF

3.3 pF

MANUFACTURER

PART NUMBER

DESCRIPTION

C1, C2

Murata

GRM155R61A104KA01D

GJM1555C1H3R3BB01

Capacitor, ceramic, 0.1 uF, 10 V, ±10%, X5R, 0402

Murata

Capacitor, ceramic, 3.3 pF, 50 V, ±0.1pF, C0G/NP0,

0402

C4, C5

100 uF

Murata

LMK325ABJ107MMHT

Capacitor, ceramic, 100 uF, 10 V, ±20%, X5R, AEC-

Q200 Grade 3, 1210

2.4 GHz, 5 GHz Ant

3 nH

Ethertronics

Murata

M830520

Antenna Bluetooth WLAN Zigbee®

LQG15HS3N0S02D

Inductor, Unshielded, Multilayer, 3nH, 0.8 A, 0.125

Ω, SMD

10k

Vishay-Dale

CRCW040210K0JNED

CC3135MODRNMMOBR

RES, 10 k, 5%, 0.063 W, AEC-Q200 Grade 0, 0402

CC1

CC3135MOD

Texas Instruments

SimpleLink™ Certified Wi-Fi® Dual-Band Network

Processor Internet-of-Things Module Solution for

MCU Applications, MOB0063A

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10.1.4 Power Supply Decoupling and Bulk Capacitors

Depending upon routing resistors and battery type, TI recommends adding two 100-µF ceramic capacitors to

help provide the peak current drawn by the CC3135MOD module.

Note

The module enters a brown-out condition whenever the input voltage dips below V_BROWN(see 图 8-4

and 图8-5). This condition must be considered during design of the power supply routing specifically if

operating from a battery. For more details on brown-out consideration, see 节8.8.

10.1.5 Reset

The module features an internal RC circuit to reset the device during power ON. The nRESET pin must be held

below 0.6 V for at least 5 ms for the device to successfully reset.

10.1.6 Unused Pins

All unused pins can be left unconnected without the concern of having leakage current.

10.2 PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC3135MOD Module. The

integrator of the CC3135MOD module must comply with the PCB layout recommendations described in the

following subsections to preserve/minimize the risk with regulatory certifications for FCC, IC/ISED, ETSI/CE, and

MIC. Moreover, TI recommends customers follow the guidelines described in this section to achieve similar

performance to that obtained with the TI reference design.

10.2.1 General Layout Recommendations

Ensure that the following general layout recommendations are followed:

• Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

• Do not run signal traces underneath the module on a layer where the module is mounted.

• RF traces must have 50-Ωimpedance.

• RF trace bends must be made with gradual curves, and 90 degree bends must be avoided.

• RF traces must not have sharp corners.

• There must be no traces or ground under the antenna section.

• RF traces must have via stitching on the ground plane beside the RF trace on both sides.

• RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge of the

PCB product in consideration of the product enclosure material and proximity.

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10.2.2 RF Layout Recommendations

The RF section of this wireless device gets top priority in terms of layout. It is very important for the RF section to

be laid out correctly to ensure optimum performance from the device. A poor layout can cause low-output power,

EVM degradation, sensitivity degradation, and mask violations.

图10-4 shows the RF placement and routing of the CC3135MOD module.

图10-4. RF Section Layout

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For optimal RF performance, ensure the copper cut out on the top layer under the RF-BG pin, (pin 31), is as

shown in 图10-5.

图10-5. Top Layer Copper Pull Back on RF Pads

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10.2.3 Antenna Placement and Routing

The antenna is the element used to convert the guided waves on the PCB traces to the free space

electromagnetic radiation. The placement and layout of the antenna are the keys to increased range and data

rates. 表10-2 provides a summary of the recommended antennas to use with the CC3135MOD module.

表10-2. Antenna Guidelines

SR NO.

GUIDELINES

Place the antenna on an edge or corner of the PCB.

Ensure that no signals are routed across the antenna elements on all the layers of the

PCB.

Most antennas, including the chip antenna used on the booster pack, require ground

clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers

as well.

Ensure that there is provision to place matching components for the antenna. These

must be tuned for best return loss when the complete board is assembled. Any plastics

or casing must also be mounted while tuning the antenna because this can impact the

impedance.

Ensure that the antenna impedance is 50 Ωbecause the device is rated to work only

with a 50-Ωsystem.

In case of printed antenna, ensure that the simulation is performed with the solder mask

in consideration.

Ensure that the antenna has a near omni-directional pattern.

The feed point of the antenna is required to be grounded. Refer to the specific antenna

data sheets for the recommendations.

表10-3 lists the recommended antennas to use with the CC3135MOD module. Other antennas may be available

for use with the CC3135MOD module. Please see the CC3135MOD OEM Integrator's Guide for the full list of

supported antennas.

表10-3. Recommended Components

CHOICE

PART NUMBER

MANUFACTURER

NOTES

Can be placed at the edge of the PCB using the

least amount of PCB area.

M830520

Ethertronics

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10.2.4 Transmission Line Considerations

The RF signal from the device is routed to the antenna using a Coplanar Waveguide with ground (CPW-G)

structure. CPW-G structure offers the maximum amount of isolation and the best possible shielding to the RF

lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional

shielding.

图10-6 shows a cross section of the coplanar waveguide with the critical dimensions.

图10-7 shows the top view of the coplanar waveguide with GND and via stitching.

图10-6. Coplanar Waveguide (Cross Section)

图10-7. CPW With GND and Via Stitching (Top View)

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The recommended values for the PCB are provided for 2-layer boards in 表10-4 and 4-layer boards in 表10-5.

表10-4. Recommended PCB Values for 2-Layer

Board (L1 to L2 = 42.1 mils)

PARAMETER

VALUE

UNIT

mils

F/m

5.5

42.1

4.2

Er (FR-4 substrate)

表10-5. Recommended PCB Values for 4-Layer

Board (L1 to L2 = 16 mils)

PARAMETER

VALUE

UNITS

mils

Er (FR-4 substrate)

4.5

F/m

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11 Environmental Requirements and SMT Specifications

11.1 Temperature

11.1.1 PCB Bending

The PCB follows IPC-A-600J for PCB twist and warpage < 0.75% or 7.5 mil per inch.

11.2 Handling Environment

11.2.1 Terminals

The product is mounted with motherboard through land-grid array (LGA). To prevent poor soldering, do not touch

the LGA portion by hand.

11.2.2 Falling

The mounted components will be damaged if the product falls or is dropped. Such damage may cause the

product to malfunction.

11.3 Storage Condition

11.3.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The

calculated shelf life for the dry-packed product will be 24 months from the date the bag is sealed.

11.3.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, < 30%.

11.4 PCB Assembly Guide

The wireless MCU modules are packaged in a substrate base Leadless Quad Flatpack (QFM) package.

Components were mounted onto the substrate with standard SMT process with the additional of a metal lid

covering the top of the module. The module are designed with pull back leads for easy PCB layout and board

mounting.

11.4.1 PCB Land Pattern & Thermal Vias

We recommended a solder mask defined land pattern to provide a consistent soldering pad dimension in order

to obtain better solder balancing and solder joint reliability. PCB land pattern are 1:1 to module soldering pad

dimension. Thermal vias on PCB connected to other metal plane are for thermal dissipation purpose. It is critical

to have sufficient thermal vias to avoid device thermal shutdown. Recommended vias size are 0.2mm and

position not directly under solder paste to avoid solder dripping into the vias.

11.4.2 SMT Assembly Recommendations

The module surface mount assembly operations include:

• Screen printing the solder paste on the PCB

• Monitor the solder paste volume (uniformity)

• Package placement using standard SMT placement equipment

• X-ray pre-reflow check - paste bridging

• Reflow

• X-ray post-reflow check - solder bridging and voids

11.4.3 PCB Surface Finish Requirements

A uniform PCB plating thickness is key for high assembly yield. For an electroless nickel immersion gold finish,

the gold thickness should range from 0.05 μm to 0.20 μm to avoid solder joint embrittlement. Using a PCB with

Organic Solderability Preservative (OSP) coating finish is also recommended as an alternative to Ni-Au.

11.4.4 Solder Stencil

Solder paste deposition using a stencil-printing process involves the transfer of the solder paste through pre-

defined apertures with the application of pressure. Stencil parameters such as aperture area ratio and the

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fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of

package is highly recommended to improve board assembly yields.

11.4.5 Package Placement

Packages can be placed using standard pick and place equipment with an accuracy of ±0.05 mm. Component

pick and place systems are composed of a vision system that recognizes and positions the component and a

mechanical system that physically performs the pick and place operation. Two commonly used types of vision

systems are:

• A vision system that locates a package silhouette

• A vision system that locates individual pads on the interconnect pattern

The second type renders more accurate placements but tends to be more expensive and time consuming. Both

methods are acceptable since the parts align due to a self-centering features fo the solder joint during solder

reflow. It is recommended to release the package to 1 to 2 mils into the solder paste or with minimum force to

avoid causing any possible damage to the thinner packages.

11.4.6 Solder Joint Inspection

After surface mount assembly, transmission X-ray should be used for sample monitoring of the solder

attachment process. This identifies defects such as solder bridging, shorts, opens, and voids. It is also

recommended to use side view inspection in addition to X-rays to determine if there are "Hour Glass" shaped

solder and package tilting existing. The "Hour Glass" solder shape is not a reliable joint. 90° mirror projection can

be used for side view inspection.

11.4.7 Rework and Replacement

TI recommends removal of modules by rework station applying a profile similar to the mounting process. Using a

heat gun can sometimes cause damage to the module by overheating.

11.4.8 Solder Joint Voiding

TI recommends to control solder joint voiding to be less than 30% (per IPC-7093). Solder joint voids could be

reduced by baking of components and PCB, minimized solder paste exposure duration, and reflow profile

optimization.

11.5 Baking Conditions

Products require baking before mounting if:

• Humidity indicator cards read > 30%

• Temp < 30°C, humidity < 70% RH, over 96 hours

Baking condition: 90°C, 12–24 hours

Baking times: 1 time

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11.6 Soldering and Reflow Condition

• Heating method: Conventional convection or IR convection

• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or

equivalent method

• Solder paste composition: SAC305

• Allowable reflow soldering times: 2 times based on the reflow soldering profile (see 图11-1)

• Temperature profile: Reflow soldering will be done according to the temperature profile (see

图11-1)

• Peak temp: 260°C

图11-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component (at Solder Joint)

表11-1. Temperature Profile

Profile Elements

Convection or IR⁽¹⁾

Peak temperature range

235 to 240°C typical (260°C maximum)

Pre-heat / soaking (150 to 200°C)

Time above melting point

Time with 5°C to peak

Ramp up

60 to 120 seconds

60 to 90 seconds

30 seconds maximum

< 3°C / second

Ramp down

< -6°C / second

(1) For details, refer to the solder paste manufacturer's recommendation.

Note

TI does not recommend the use of conformal coating or similar material on the SimpleLink™ module.

This coating can lead to localized stress on the WCSP solder connections inside the module and

impact the device reliability. Use caution during the module assembly process to the final PCB to

avoid the presence of foreign material inside the module.

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12 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,

generate code, and develop solutions are listed in this section.

12.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the

CC3135MOD and support tools (see 图12-1).

3135 MOD

MOB

PACKAGING

R = tape/reel

PREFIX

X = preproduction device

no prefix = production device

DEVICE FAMILY

CC = wireless connectivity

PACKAGE DESIGNATOR

MOB = LGA

NM = No Memory

SERIES NUMBER

3 = Wi-Fi^®centric

R = ROM

MOD = module

图12-1. CC3135MOD Module Nomenclature

For orderable part numbers of CC3135MOD modules in the MOB package types, see the Package Option

Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

12.2 Development Tools and Software

For the most up-to-date list of development tools and software, visit the CC3135MOD tools and software page.

You can also click on the Alert me button in the top-right corner of the page to stay informed about updates

related to the CC3135MOD.

SimpleLink™ Wi-Fi^®

Starter Pro

The supported devices are: CC3100, CC3200, CC3120R, CC3220x, CC3135 and

CC3235x. The SimpleLink Wi-Fi Starter Pro mobile App is a new mobile application for

SimpleLink provisioning. The app goes along with the embedded provisioning library

and example that runs on the device side (see SimpleLink™ Wi-Fi^®CC3135 SDK

plugin) and TI SimpleLink™ Wi-Fi^®CC3235 Software Development Kit (SDK). The new

provisioning release is a TI recommendation for Wi-Fi provisioning using SimpleLink

Wi-Fi products. The provisioning release implements advanced AP mode and

SmartConfig technology provisioning with feedback and fallback options to ensure

successful process has been accomplished. Customers can use both embedded library

and the mobile library for integration to their end products.

SimpleLink™ Wi-Fi^®

CC3135 SDK Plugin

The CC3135 SDK contains drivers, many sample applications for Wi-Fi features and

internet, and documentation needed to use the CC3135 Internet-on-a chip solution.

This SDK can be used with TI’s MSP432P401R LaunchPad^™, or SimpleLink Studio,

a PC tool that allows MCU development with the CC3135. You can also use the SDK

as example code for any platform. All sample applications in the SDK are supported on

TI’s MSP432P401R ultra-low-power MCUs with Code Composer Studio^™IDE and TI

RTOS. In addition, many of the applications support IAR.

SimpleLink™ Studio

for CC31xx

SimpleLink™ Studio for CC31xx is a Windows®-based software tool used to aid in the

development of embedded networking applications and software for microcontrollers.

Using SimpleLink Studio for CC31xx, embedded software developers can develop and

test applications using any desktop IDE, such as Visual Studio or Eclipse, and connect

their applications to the cloud using the CC31xx BoosterPack^™. The application can

then be easily ported to any microcontroller. With the SimpleLink Wi-Fi CC31xx

solution, customers now have the flexibility to add Wi-Fi to any microcontroller (MCU).

This Internet-on-a chip solution contains all you need to easily create IoT solutions –

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security, quick connection, cloud support and more. For more information on CC31xx

devices, visit http://www.ti.com/simplelinkwifi.

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SimpleLink™ Wi-Fi^®

Radio Testing Tool

The supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135, and

CC3235x. The SimpleLink Wi-Fi Radio Testing Tool is a Windows-based software tool

for RF evaluation and testing of SimpleLink Wi-Fi CC3x20 and CC3x35 designs during

development and certification. The tool enables low-level radio testing capabilities by

manually setting the radio into transmit or receive modes. Using the tool requires

familiarity and knowledge of radio circuit theory and radio test methods. Created for the

internet-of-things (IoT), the SimpleLink Wi-Fi CC31xx and CC32xx family of devices

include on-chip Wi-Fi, Internet, and robust security protocols with no prior Wi-Fi

experience needed for faster development. For more information on these devices, visit

SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.

Uniflash Standalone

Flash Tool for TI

Microcontrollers

(MCU), Sitara

CCS Uniflash is a standalone tool used to program on-chip flash memory on TI MCUs

and on-board flash memory for Sitara processors. Uniflash has a GUI, command line,

and scripting interface. CCS Uniflash is available free of charge.

Processors and

SimpleLink™ Devices

12.3 Firmware Updates

TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes,

TI recommends that users have the latest service pack in their module for production.

To stay informed, sign up with the SDK Alert me button in the top-right corner of the product page or visit here.

12.4 Documentation Support

To receive notification of documentation updates — including silicon errata — go to the CC3135MOD product

folder on ti.com, and click the Alert me button in the upper-right corner. This registers you to receive a weekly

digest of updated product information (if any). For change details, check the revision history of any revised

document. The current documentation which describes the processor, related peripherals, and other technical

collateral follows. The following documents provide support for the CC3135MOD module.

Application Reports

Transfer of TI's Wi-Fi^®Alliance

Certifications to Products Based on derivative certification transfer policy to transfer a WFA certification,

SimpleLink™ already obtained by Texas Instruments, to a system you have developed.

This document explains how to employ the Wi-Fi® Alliance (WFA)

SimpleLink™ CC31xx/CC32xx Wi- The SimpleLink Wi-Fi CC31xx and CC32xx Internet-on-a chip^™family of

Fi^®Internet-on-a chip™ Solution

Built-In Security Features

devices from Texas Instruments offers a wide range of built-in security

features to help developers address a variety of security needs, which is

achieved without any processing burden on the main microcontroller

(MCU). This document describes these security-related features and

provides recommendations for leveraging each in the context of practical

system implementation.

Using Serial Flash on SimpleLink™ This application note is divided into two parts. The first part provides

CC3135/CC3235 Wi-Fi^®and

Internet-of-Things Devices

important guidelines and best- practice design techniques to consider

when choosing and embedding a serial flash paired with the CC3135 and

CC3235 devices. The second part describes the file system, along with

guidelines and considerations for system designers working with the

CC3x20 devices.

SimpleLink™ CC3135/CC3235

Over-the-Air Programming

This document describes the OTA library for the SimpleLink™ Wi-Fi^®

CC3x35 family of devices from Texas Instruments and explains how to

prepare a new cloud-ready update to be downloaded by the OTA library.

SimpleLink™ CC3x35 Wi-Fi^®

Internet-on-a chip™ Solution

Device Provisioning

This guide describes the provisioning process, which provides the

SimpleLink Wi-Fi device with the information (network name, password,

and so forth) needed to connect to a wireless network.

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SimpleLink™ CC31xx/CC32xx Wi- This application report describes the best practices for power management

Fi^®Internet-on-a chip™ Networking and extended battery life for embedded low-power Wi-Fi devices such as

Sub-System Power Management

the SimpleLink Wi-Fi Internet-on-a chip™ solution from Texas Instruments.

User's Guides

CC3135 and CC3235 SimpleLink™

Wi-Fi^®Embedded Programming

User Guide

UniFlash SimpleLink™ CC31xx/

32xx Wi-Fi^®and IoC™ Solution

ImageCreator and Pro

This document describes the installation, operation, and usage of the

SimpleLink ImageCreator tool as part of the UniFlash.

SimpleLink™ Wi-Fi^®and Internet-of- This document provides software (SW) programmers with all of the

Things CC31xx and CC32xx

Network Processor

required knowledge for working with the networking subsystem of the

SimpleLink Wi-Fi devices. This guide provides basic guidelines for writing

robust, optimized networking host applications, and describes the

capabilities of the networking subsystem. The guide contains some

example code snapshots, to give users an idea of how to work with the

host driver. More comprehensive code examples can be found in the

formal software development kit (SDK). This guide does not provide a

detailed description of the host driver APIs.

SimpleLink™ Wi-Fi^®CC3135 and

CC3235 Provisioning for Mobile

Applications

This guide describes TI’s SimpleLink Wi-Fi provisioning solution for

mobile applications, specifically on the usage of the Android^™and IOS^®

building blocks for UI requirements, networking, and provisioning APIs

required for building the mobile application.

SimpleLink™ Wi-Fi^®and Internet-

on-a chip™ CC3135 and CC3235

Solution Radio Tool

The Radio Tool serves as a control panel for direct access to the radio,

and can be used for both the radio frequency (RF) evaluation and for

certification purposes. This guide describes how to have the tool work

seamlessly on Texas Instruments evaluation platforms such as the

BoosterPack™ plus FTDI emulation board for CC3235 devices, and the

LaunchPad™ for CC3235 devices.

12.5 Trademarks

WPA3^™, WPA^™, WPA2^™, Wi-Fi CERTIFIED^™are trademarks of Wi-Fi Alliance.

SimpleLink^™, LaunchPad^™, Code Composer Studio^™, BoosterPack^™, and Internet-on-a chip^™are trademarks

of Texas Instruments.

Android^™is a trademark of Google LLC.

Wi-Fi Direct^®, Wi-Fi^®, and Wi-Fi Alliance^®are registered trademarks of Wi-Fi Alliance.

Bluetooth^®is a registered trademark of Bluetooth SIG Inc.

Arm^®and Cortex^®are registered trademarks of Arm Limited.

IOS^®is a registered trademark of Cisco.

所有商标均为其各自所有者的财产。

12.6 静电放电警告

静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理

和安装程序，可能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参

数更改都可能会导致器件与其发布的规格不相符。

12.7 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as

defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled

product restricted by other applicable national regulations, received from disclosing party under nondisclosure

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obligations (if any), or any direct product of such technology, to any destination to which such export or re-export

is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.

Department of Commerce and other competent Government authorities to the extent required by those laws.

12.8 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

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13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document.

13.1 Mechanical, Land, and Solder Paste Drawings

Note

The total height of the module is 2.4 mm.

The weight of the module is 1.8g typical.

Note

1. All dimensions are in mm.

2. Solder mask should be the same or 5% larger than the dimension of the pad

3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the

solder paste 20% smaller than the pad.

13.2 Package Option Addendum

The CC3135MOD is only offered in a 750-unit reel.

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13.2.1 Packaging Information

Package

Type

Package

Qty

Lead/Ball

Finish

Orderable Device

Status ⁽¹⁾

Package Drawing

Pins

Eco Plan ⁽²⁾

MSL, Peak Temp ⁽³⁾Op Temp (°C)

3, 260°C

Device Marking^{(4) (5)}

CC3135MODRNMMOB

Green (RoHS

and no Sb/Br)

CC3135MODRNMMOBR

ACTIVE

QFM

MOB

750

ENIG

–40 to 85

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

space

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest

availability information and additional product content details.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified

lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used

between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%

by weight in homogeneous material)

space

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

space

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device

space

(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by

third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable

steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain

information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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13.2.2 Tape and Reel Information

Surface resistance

Vendor No.

Spec

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13.2.2.1 Tape Specifications

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重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OUTLINE

MOB0063A

QFM - 2.4 mm max height

SCALE 0.650

QUAD FLAT MODULE

17.75

17.25

PIN 1 INDEX

AREA

20.75

20.25

2X (0.45)

2X (0.38)

2.40

2.03

0.1

0.88

0.72

2X 12.7

20X 1.27

(0.3) TYP

30X 1.27

(0.32)

PADS 1,16,28 & 43

(0.3)

TYP

0.05

1.5

19.05

6X 3

54X 0.81 0.08

0.15

0.05

C A B

44 43

PIN 1 ID

(45 X1)

1.5

6X 3

4221462/D 06/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

MOB0063A

QFM - 2.4 mm max height

QUAD FLAT MODULE

PKG

SEE DETAIL

54X ( 0.81)

(

8.1)

9X ( 2)

0.05 MIN TYP

(45 X 1)

(

0.2) TYP

VIA

METAL UNDER

SOLDER MASK

OPENING

PKG

6X (3)

(1.5)

2X (19.1)

(0.65)

TYP

(1.5)

(0.65)

TYP

6X (3)

(1.27) TYP

(R0.05)

ALL PADS

2X (16.1)

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:6X

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SIGNAL PADS DETAIL

4221462/D 06/2019

NOTES: (continued)

3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

MOB0063A

QFM - 2.4 mm max height

QUAD FLAT MODULE

PKG

54X ( 0.81)

(R0.05)

TYP

SOLDER MASK

EDGE, TYP

SOLDER MASK EDGE

SEE DETAILS

PKG

(3) TYP

2X (19.1)

(1.5) TYP

(3) TYP

(1.27) TYP

2X (16.1)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PADS PRINTED SOLDER COVERAGE BY AREA

PAD 55: 77.5 %, PADS 56 - 63: 79%

SCALE:6X

(1.54)

(0.55) TYP

(0.45)

(

0.89) TYP

2X ( 0.89)

(0.55 TYP)

METAL

TYP

(R0.05) TYP

(R0.05)

TYP

PADS 56 - 63 DETAIL

PAD 55 DETAIL

SCALE:10X

4221462/D 06/2019

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

CC3135MODRNMMOBR [TI]

相关型号：

CC3135RNMRGKR

CC3200

CC3200MOD

CC3200MODR1M2AMOBR

CC3200MODR1M2AMOBT

CC3200MOD_15

CC3200R1M1RGCR

CC3200R1M2RGC

CC3200R1M2RGCR

CC3200_15

CC3220

CC3220MOD