CC3135 [TI]
SimpleLink™ 32 位 Arm Cortex-M3 双频带 Wi-Fi® 无线网络处理器;型号: | CC3135 |
厂家: | TEXAS INSTRUMENTS |
描述: | SimpleLink™ 32 位 Arm Cortex-M3 双频带 Wi-Fi® 无线网络处理器 无线 |
文件: | 总84页 (文件大小:2827K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CC3135
ZHCSJU5B –FEBRUARY 2019 –REVISED MAY 2021
适用于MCU 应用的CC3135 SimpleLink™ Wi-Fi® 双频带网络处理器解决方案
– 峰值:72Mbps
• 电源管理子系统
1 特性
• 集成式双频带Wi-Fi® 和互联网协议
• 802.11a/b/g/n:2.4GHz 和5GHz
• FIPS 140-2 1 级认证
– 集成式直流/直流转换器支持宽电源电压范围:
• VBAT 宽电压模式:2.1 V 至3.6 V
• VIO 始终与VBAT 关联
• 一组丰富的IoT 安全特性,可帮助开发人员保护数
据
• 低功耗模式适用于电池供电应用
• 与2.4GHz 无线电共存
• 工业温度:–40°C 至+85°C
• 可转让的Wi-Fi 联盟®认证
• Wi-Fi 网络处理器子系统:
– 高级低功耗模式:
• 关断:1µA,休眠:4µA
• 低功耗深度睡眠(LPDS):120µA
• 空闲连接(MCU 处于LPDS 状态):710µA
• RX 流量(MCU 处于活动模式):53 mA
• TX 流量(MCU 处于活动模式):223 mA
• Wi-Fi TX 功率:
– 2.4 GHz:1 DSSS 时为18.0dBm
– 5 GHz:6 OFDM 时为18.1dBm
• Wi-Fi RX 灵敏度:
– 2.4 GHz:1 DSSS 时为-96dBm
– 5 GHz:6 OFDM 时为-92dBm
• 时钟源:
– 具有内部振荡器的40.0MHz 晶体
– 32.768kHz 晶体或外部RTC
• RGK 封装
– Wi-Fi 内核:
• 802.11a/b/g/n 2.4GHz 和5GHz
• 模式:
– 接入点(AP)
– 基站(STA)
– Wi-Fi Direct®(仅在2.4GHz 受支持)
• 安全性:
– WEP
– WPA™/ WPA2™ PSK
– WPA2 企业
– 64 引脚9mm × 9mm 极薄四方扁平无引线
(VQFN) 封装,0.5mm 间距
• 器件支持SimpleLink™ MCU 平台开发人员生态系
统
– WPA3™ 个人版
– WPA3™ 企业版
– 互联网和应用协议:
• HTTP 服务器、mDNS、DNS-SD 和DHCP
• IPv4 和IPv6 TCP/IP 堆栈
2 应用
• 16 BSD 套接字(完全安全的TLS v1.2 和
SSL 3.0)
– 内置的电源管理子系统:
• 对于物联网应用,例如:
– 楼宇和住宅自动化:
• HVAC 系统和恒温器
• 视频监控、可视门铃和低功耗摄像头
• 楼宇安全系统和电子锁
– 电器
• 可配置的低功耗配置文件(始终、间歇性、
标签)
• 高级低功耗模式
• 集成式直流/直流稳压器
• 多层安全特性:
– 独立执行环境
– 资产跟踪
– 工厂自动化
– 医疗和保健
– 电网基础设施
– 网络安全
– 设备身份和密钥
– 硬件加速器加密引擎(AES、DES、SHA/MD5
和CRC)
– 应用级安全(加密、身份验证、访问控制)
– 初始安全编程
– 软件篡改检测
– 安全引导
– 证书注册请求(CSR)
– 每个设备具有唯一密钥对
• 应用吞吐量:
– UDP:16Mbps,TCP:13Mbps
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SWAS037
CC3135
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3 说明
通过 CC3135 器件(德州仪器 (TI) 推出的一款双频带无线网络处理器)将任何微控制器 (MCU) 连接到物联网
(IoT)。CC3135 Wi-Fi® Internet-on-a chip™ 器件包含一个专用于 Wi-Fi® 和互联网协议的 Arm® Cortex®-M3
MCU,可减少主机 MCU 中的联网活动。该子系统包括双频带 802.11a/b/g/n 无线电、基带以及具有强大加密引擎
的MAC,采用256 位加密以实现快速、安全的互联网连接,并使用内置电源管理以实现出色的低功耗性能。
Wi-Fi CERTIFIED® CC3135 器件通过集成的Wi-Fi Alliance® IoT 低功耗特性,极大地简化了低功耗功能的实施。
这一代引进了可进一步简化物联网连接的新功能。主要新特性包括:
• 802.11a (5GHz) 支持
• 与BLE/2.4GHz 无线电共存
• 天线选择
• 安全性更强,经过FIPS 140-2 1 级认证和其他认证。有关特定器件型号的具体FIPS 认证状态,请参考
https://csrc.nist.gov/publications/fips。
• 可同时打开多达16 个安全套接字
• 证书注册请求(CSR)
• 在线证书状态协议(OCSP)
• 针对具有低功耗功能以及其他功能的IoT 应用经过Wi-Fi Alliance® 认证
• 降低模板包传输负载的无主机模式
• 改善了快速扫描
CC3135 器件随附一个占用空间小的用户友好型主机驱动程序,可简化网络应用的集成和开发。主机驱动程序可
轻松移植到大多数平台和操作系统 (OS)。此驱动程序占用的内存很小,可在具有任何时钟速度的 8 位、16 位或
32 位微控制器上运行(无需使用高性能时钟或实时时钟)。
CC3135 器件是SimpleLink™ MCU 平台的一部分,该平台是一个通用、简单易用的开发环境,基于一个单核软件
开发套件 (SDK)、丰富的工具集、参考设计和 E2E™ 社区而构建,支持 Wi-Fi®、低功耗 Bluetooth®、Sub-1GHz
器件和主机MCU。有关更多信息,请访问www.ti.com/simplelink。
器件信息(1)
器件型号
CC3135RNMRGKR
封装
封装尺寸
VQFN (64)
9.00mm x 9.00mm(标称值)
(1) 如需更多信息,请参阅机械、封装和可订购信息部分。
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4 功能方框图
图4-1 显示了CC3135 器件的功能方框图。
SPI
Flash
VCC
40 MHz
XTAL
32.768 kHz
XTAL
(2.1 to 3.6V)
Dual band Ant.
SSPI
A_TX
A_RX
Wi-Fi
RF Switch
5 GHz
BPF
SOP0
SOP1
Diplexer /
SPDT RF
Switch
32 kHz
RF_BG
CC3135
MCU
nHIB
Wi-Fi / BLE
RF Switch
2.4 GHz BPF
HOST_INTR
BLE
DEVICE
SPI/UART
HM_IOs
Dual band Ant.
COEX_IO
Output GPIOs
注意:双信器用于信号天线解决方案。使用天线选择功能(双天线)时,需要在双信器后应用1 个SPDT 开关和2 条GPIO 线路。
图4-1. 功能方框图
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图4-2 显示了CC3135 硬件概览。
External MCU
SimpleLink Driver APIs
SPI or UART Driver
SPI /
UART
Wi-Fi Network Processor
Host Interface
1 x SPI
1 x UART
Network Processor
Wi-Fi Driver
TCP/IP Stack
POWER
Management
Application
Protocols
Oscillators
RAM
ROM
(ARM CortexTM
)
DC2DC
RTC
Synthesizer
图4-2. CC3135 硬件概览
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图4-3 显示了CC3135 嵌入式软件概览。
Customer Application
in external MCU
BSD Socket
SimpleLink Driver APIs
NetApp
Wi-Fi
Host Interface
Network
Apps
WLAN
Security &
Management
TCP/IP Stack
WLAN MAC & PHY
图4-3. CC3135 软件概览
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Table of Contents
8.16 Thermal Resistance Characteristics for RGK
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 2
4 功能方框图.........................................................................3
5 Revision History.............................................................. 6
6 Device Comparison.........................................................7
6.1 Related Products........................................................ 8
7 Terminal Configuration and Functions..........................9
7.1 Pin Diagram................................................................ 9
7.2 Pin Attributes.............................................................10
7.3 Signal Descriptions................................................... 14
7.4 Connections for Unused Pins................................... 16
8 Specifications................................................................ 17
8.1 Absolute Maximum Ratings...................................... 17
8.2 ESD Ratings............................................................. 17
8.3 Power-On Hours (POH)............................................17
8.4 Recommended Operating Conditions.......................18
8.5 Current Consumption Summary: 2.4 GHz RF
Band............................................................................18
8.6 Current Consumption Summary: 5 GHz RF Band....19
8.7 TX Power Control for 2.4 GHz Band.........................19
8.8 TX Power Control for 5 GHz..................................... 21
8.9 Brownout and Blackout Conditions...........................22
8.10 Electrical Characteristics for DIO Pins....................23
8.11 Electrical Characteristics for Pin Internal Pullup
and Pulldown...............................................................25
8.12 WLAN Receiver Characteristics..............................25
8.13 WLAN Transmitter Characteristics..........................26
8.14 WLAN Transmitter Out-of-Band Emissions.............27
8.15 BLE/2.4 GHz Radio Coexistence and WLAN
Package...................................................................... 28
8.17 Timing and Switching Characteristics..................... 29
8.18 External Interfaces..................................................39
9 Detailed Description......................................................43
9.1 Overview...................................................................43
9.2 Device Features........................................................43
9.3 FIPS 140-2 Level 1 Certification............................... 48
9.4 Power-Management Subsystem...............................48
9.5 Low-Power Operating Modes................................... 49
9.6 Memory.....................................................................50
9.7 Restoring Factory Default Configuration...................51
9.8 Hostless Mode.......................................................... 52
10 Applications, Implementation, and Layout............... 53
10.1 Application Information........................................... 53
10.2 PCB Layout Guidelines...........................................64
11 Device and Documentation Support..........................68
11.1 第三方产品免责声明................................................68
11.2 Tools and Software .............................................. 68
11.3 Firmware Updates...................................................69
11.4 Device Nomenclature..............................................70
11.5 Documentation Support ...................................... 71
11.6 支持资源..................................................................72
11.7 Trademarks............................................................. 72
11.8 静电放电警告...........................................................73
11.9 Export Control Notice..............................................73
11.10 术语表................................................................... 73
12 Mechanical, Packaging, and Orderable
Information.................................................................... 74
12.1 Packaging Information............................................ 74
12.2 Package Option Addendum....................................74
Coexistence Requirements......................................... 28
5 Revision History
Changes from May 5, 2020 to May 13, 2021 (from Revision A (May 2020) to Revision B (May
2021))
Page
• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1
• 向节1 中的Wi-Fi 核心安全性添加了“WPA3™ 企业版“...................................................................................1
• Added 节8.18.3, Host UART ...........................................................................................................................41
• Added WPA3 to list of supported features in 节9.1 .........................................................................................43
• Added footnote to 节9.1 ..................................................................................................................................43
• Added "WPA3™ personal and enterprise security" to 节9.1 ........................................................................... 43
• Added WPA3 Personal to list of Wi-Fi security features in 节9.2.1 .................................................................43
• Added "WPA3 Enterprise" to 节9.2.1. .............................................................................................................43
• Added WPA3 personal to list of Wi-Fi security features in 表9-1 ....................................................................44
• Added footnote to 表9-1 ..................................................................................................................................44
• Added "WPA3 enterprise" to "Wi-Fi security" in 表9-1. ...................................................................................44
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6 Device Comparison
表6-1 lists the features supported across different CC3x35 devices.
表6-1. Comparison of Device Features
DEVICE
FEATURE
CC3135
Network processor
CC3235S
Wireless microcontroller
802.11a/b/g/n
CC3235SF
Wireless microcontroller
802.11a/b/g/n
Classification
Standard
802.11a/b/g/n
IPv4, IPv6
TCP/IP stack
Sockets
IPv4, IPv6
IPv4, IPv6
16
16
16
Package
9-mm × 9-mm VQFN
9-mm × 9-mm VQFN
9-mm × 9-mm VQFN
ON-CHIP APPLICATION MEMORY
Flash
RAM
1MB
—
—
—
256KB
256KB
RF FEATURES
Frequency
2.4 GHz, 5 GHz
Yes
2.4 GHz, 5 GHz
Yes
2.4 GHz, 5 GHz
Yes
Coexistence with BLE Radio
SECURITY FEATURES
Unique device identity
Unique device identity
Unique device identity
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Additional networking security
Certificate signing request (CSR)
Unique per-device key pair
Certificate signing request (CSR)
Unique per-device key pair
Certificate signing request (CSR)
Unique per-device key pair
Hardware acceleration
Secure boot
Hardware crypto engines
Hardware crypto engines
Yes
Hardware crypto engines
Yes
—
File system security
File system security
Secure key storage
Secure key storage
Enhanced application level security
FIPS 140-2 Level 1 Certification(1)
Software tamper detection
Cloning protection
Initial secure programming
Software tamper detection
Cloning protection
Initial secure programming
—
Yes
Yes
Yes
(1) For exact status of FIPS certification for a specific part number, please refer to https://csrc.nist.gov/publications/fips.
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6.1 Related Products
For information about other devices in this family of products or related products see the links below.
The SimpleLink™
MCU Portfolio
This portfolio offers a single development environment that delivers flexible hardware,
software, and tool options for customers developing wired and wireless applications. With
100 percent code reuse across host MCUs, Wi-Fi®, Bluetooth® low energy, Sub-1 GHz
devices and more, choose the MCU or connectivity standard that fits your design. A one-
time investment with the SimpleLink™ software development kit (SDK) allows you to
reuse often, opening the door to create unlimited applications.
SimpleLink™ Wi-Fi® This device platform offers several Internet-on-a chip™ solutions, which address the need
Family
of battery-operated, security-enabled products. Texas Instruments offers a single-chip
wireless microcontroller and a wireless network processor that can be paired with any
MCU, allowing developers to design new Wi-Fi® products or upgrade existing products
with Wi-Fi® capabilities.
MSP432™ Host
MCU
features the Arm® Cortex®-M4 processor offering ample processing capability with
floating point unit and memory footprint for advanced processing algorithm,
communication protocols as well as application needs, while incorporating a 14-bit 1-
msps ADC14 that provides a flexible and low-power analog with best-in-class
performance to enable developers to add differentiated sensing and measurement
capabilities to their Wi-Fi applications. For more information, visit www.ti.com/product/
MSP432P401R.
Reference Designs TI Designs Reference Design Library is a robust reference design library spanning
for CC3135 Device analog, embedded processor and connectivity. Created by TI experts to help you jump
start your system design, all TI Designs include schematic or block diagrams, BOMs and
design files to speed your time to market. Search and download designs at ti.com/
tidesigns.
The SimpleLink™
The SDK contains drivers, sample applications for Wi-Fi features and Internet, and
Wi-Fi® SDK Plug-in documentation required to use the CC3135 solution.
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7 Terminal Configuration and Functions
7.1 Pin Diagram
图7-1 shows pin assignments for the 64-pin VQFN package.
48
47
46 45 44 43
42
41
40
39
38
37
36
35 34 33
VDD_RAM
UART1_nRTS
RTC_XTAL_P
RTC_XTAL_N
DIO30
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
nRESET
RF_BG
GND
GND
A_TX
VIN_IO2
A_RX
UART1_TX
VDD_DIG2
UART1_RX
TEST_58
NC
LDO_IN2
VDD_PLL
WLAN_XTAL_P
WLAN_XTAL_N
SOP2/TCXO_EN
DIO29
TEST_59
TEST_60
UART1_nCTS
TEST_62
RESERVED
DIO28
DIO8
DIO9
DIO24
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16
图7-1. Top View Pin Assignment for 64-Pin VQFN
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7.2 Pin Attributes
表7-1 describes the CC3135 pins.
Note
Digital IOs on the CC3135 device refer to hostless mode, BLE/2.4 GHz coexistence, and antenna select IOs, not general-purpose IOs.
If an external device drives a positive voltage to signal pads when the CC3135 device is not powered, DC current is drawn from the other
device. If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3135 device can occur. To prevent
current draw, TI recommends one of the following:
• All devices interfaced to the CC3135 device must be powered from the same power rail as the CC3135 device.
• Use level shifters between the CC3135 device and any external devices fed from other independent rails.
• The nRESET pin of the CC3135 device must be held low until the VBAT supply to the device is driven and stable.
表7-1. Pin Description and Attributes
DIGITAL I/O
STATE AT
RESET AND
HIBERNATE
BLE COEX
PIN
1
DEFAULT FUNCTION
I/O TYPE(1)
DESCRIPTION
PAD_
CONFIG
HOSTLESS
MODE
CC_COEX_
OUT
CC_COEX_
IN
DIO10
nHIB
10
11
Y
Y
Y
I/O
I
Digital input or output
–
Hibernate signal input to the NWP subsystem (active
low). This is connected to the MCU GPIO. If the
GPIO from the MCU can float while the MCU enters
low power, consider adding a pullup resistor on the
board to avoid floating.
2
-
-
-
Hi-Z
3
4
DIO12
12
13
14
15
16
17
-
Y
Y
Y
Y
Y
Y
O
Digital input or output
–
DIO13
Digital input or output
–
–
5
HOST_SPI_CLK
HOST_SPI_MOSI
HOST_SPI_MISO
HOST_SPI_nCS
VDD_DIG1
-
-
-
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
I
Host interface SPI clock
6
-
-
-
I
Host interface SPI data input
Host interface SPI data output
Host interface SPI chip select (active low)
Digital core supply (1.2 V)
7
-
-
-
O
8
-
-
-
I
9
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Power
10
11
12
13
14
VIN_IO1
-
Power
I/O supply
FLASH_SPI_CLK
FLASH_SPI_MOSI
FLASH _SPI_MISO
FLASH _SPI_CS
-
O
O
I
Serial Flash interface: SPI clock
Serial Flash interface: SPI data out
Serial Flash interface: SPI data in (active high)
Serial Flash interface: SPI chip select (active low)
-
-
-
O
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表7-1. Pin Description and Attributes (continued)
DIGITAL I/O
STATE AT
RESET AND
HIBERNATE
BLE COEX
PIN
DEFAULT FUNCTION
I/O TYPE(1)
DESCRIPTION
PAD_
CONFIG
HOSTLESS
MODE
CC_COEX_
OUT
CC_COEX_
IN
15
16
17
18
19
20
HOST_INTR
DIO23
22
23
24
40
28
29
-
-
-
Hi-Z
Hi-Z
Hi-Z
O
Interrupt output (active high)
Digital input or output
Y
Y
Y
-
Y
Y
Y
-
Y
Y
Y
-
DIO24
Digital input or output
DIO28
Digital input or output
–
–
–
Reserved
DIO29
Hi-Z
Hi-Z
Connect a 100-kΩpulldown resistor to ground.
Digital input or output
Y
Y
Y
Controls restore to default mode. Enable signal for
external TCXO. Add a 10-kΩpulldown resistor to
ground.
21
SOP2/TCXO_EN(2)
25
Y(3)
Y
-
Hi-Z
O
22
23
24
25
26
27
28
29
30
31
WLAN_XTAL_N
WLAN_XTAL_P
VDD_PLL
LDO_IN2
NC
-
-
-
-
-
-
-
-
-
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Analog
Analog
Power
Power
Connect the WLAN 40-MHz crystal here.
Connect the WLAN 40-MHz crystal here.
Internal PLL power supply (1.4 V nominal)
Input to internal LDO
No Connect
–
–
–
RF
A_RX
5 GHz RF RX
A_TX
RF
5 GHz RF TX
–
GND
Power
Power
RF
GND
–
GND
GND
–
RF_BG
Hi-Z
2.4 GHz RF TX, RX
RESET input for the device. Active low input. Use
RC circuit (100 kΩ|| 0.01 µF) for power on reset
(POR).
32
33
34
nRESET
VDD_PA_IN
SOP1
-
-
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Hi-Z
Hi-Z
Hi-Z
I
Power
Power supply for the RF power amplifier (PA)
SOP[2:0] used for factory restore. Add 100-kΩ
pulldown to ground. See 节9.7. SOP1 used for 5
GHz switch control
–
–
SOP[2:0] used for factory restore. Add 100-kΩ
pulldown to ground. See 节9.7. SOP0 used for
5GHz switch control
35
SOP0
-
N/A
N/A
N/A
Hi-Z
36
37
LDO_IN1
-
-
N/A
N/A
N/A
N/A
N/A
N/A
Hi-Z
Hi-Z
Power
Power
Input to internal LDO
Power supply for the DC/DC converter for analog
section
VIN_DCDC_ANA
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表7-1. Pin Description and Attributes (continued)
DIGITAL I/O
STATE AT
RESET AND
HIBERNATE
BLE COEX
PIN
DEFAULT FUNCTION
I/O TYPE(1)
DESCRIPTION
PAD_
CONFIG
HOSTLESS
MODE
CC_COEX_
OUT
CC_COEX_
IN
38
39
40
41
DCDC_ANA_SW
VIN_DCDC_PA
-
-
-
-
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Power
Power
Power
Power
Analog DC/DC converter switch output
PA DC/DC converter input supply
DCDC_PA_SW_P
DCDC_PA_SW_N
PA DC/DC converter switch output +ve
PA DC/DC converter switch output –ve
PA DC/DC converter output. Connect the output
capacitor for DC/DC here.
42
DCDC_PA_OUT
-
N/A
N/A
N/A
Hi-Z
Power
43
44
45
46
47
48
49
50
DCDC_DIG_SW
VIN_DCDC_DIG
DIO31
-
-
N/A
N/A
Y
N/A
N/A
Y
N/A
N/A
Y
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Power
Power
Digital DC/DC converter switch output
Power supply input for the digital DC/DC converter
Network Scripter I/O
31
-
–
DCDC_ANA2_SW_N
VDD_ANA2
N/A
N/A
N/A
N/A
-
N/A
N/A
N/A
N/A
-
N/A
N/A
N/A
N/A
-
Power
Power
Power
Power
O
Analog2 DC/DC converter switch output –ve
Analog2 power supply input
-
VDD_ANA1
-
Analog1 power supply input
VDD_RAM
-
Power supply for the internal RAM
UART host interface (active low)
UART1_nRTS
0
32.768-kHz XTAL_P or external CMOS level clock
input
51
52
RTC_XTAL_P
RTC_XTAL_N
-
N/A
Y
N/A
Y
N/A
Y
Hi-Z
Hi-Z
Analog
Analog
32.768-kHz XTAL_N or 100-kΩexternal pullup for
external clock
32
30
53
54
DIO30
Y
Y
Y
Hi-Z
Hi-Z
Network Scripter I/O
–
VIN_IO2
N/A
N/A
N/A
Power
I/O power supply. Same as battery voltage.
UART host interface. Connect to test point on
prototype for Flash programming.
55
56
57
UART1_TX
VDD_DIG2
UART1_RX
1
-
-
N/A
-
-
-
Hi-Z
Hi-Z
Hi-Z
O
Power
I
Digital power supply (1.2 V)
UART host interface; connect to test point on
prototype for Flash programming.
2
-
-
58
59
60
61
62
63
TEST_58
TEST_60
TEST_60
UART1_nCTS
TEST_62
DIO8
3
4
5
6
7
8
Y
Y
Y
-
Y
Y
Y
-
Y
Y
Y
-
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
O
O
O
I
Test signal; connect to an external test point.
Test signal; connect to an external test point.
Test signal; connect to an external test point.
UART host interface (active low)
-
-
-
O
Test signal; connect to an external test point.
Digital input or output
Y
Y
Y
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表7-1. Pin Description and Attributes (continued)
DIGITAL I/O
STATE AT
RESET AND
HIBERNATE
BLE COEX
PIN
DEFAULT FUNCTION
I/O TYPE(1)
DESCRIPTION
PAD_
CONFIG
HOSTLESS
MODE
CC_COEX_
OUT
CC_COEX_
IN
64
65
DIO9
GND
9
-
Y
Y
Y
Hi-Z
Digital input or output
–
N/A
N/A
N/A
Power
Ground tab used as thermal and electrical ground
–
(1) I = input
O = output
RF = radio frequency
I/O = bidirectional
(2) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an output on power up and driven logic high. During
hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
(3) Output Only
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7.3 Signal Descriptions
表7-2. Signal Descriptions
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
DIO10
DESCRIPTION
1
3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
DIO12
DIO13
DIO23
DIO24
DIO28
DIO29
DIO25
DIO31
DIO32
DIO30
DIO3
4
O
16
O
17
O
18(1)
O
20
O
21
O
Antenna
selection
Antenna selection control
45(1)
52(1)
53(1)
58
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
DIO4
59
O
DIO5
60
O
DIO8
63
O
DIO9
64
O
DIO10
DIO12
DIO13
DIO23
DIO24
DIO28
DIO29
DIO25
DIO31
DIO32
DIO30
DIO3
1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
3
4
16
17
18(1)
20
BLE/2.4 GHz
Radio
coexistence
21
Coexistence inputs and outputs
45(1)
52(1)
53(1)
58
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
—
DIO4
59
DIO5
60
DIO8
63
DIO9
64
WLAN_XTAL_N
WLAN_XTAL_P
22
40-MHz crystal; pull down if external TCXO is used
40-MHz crystal or TCXO clock input
23
—
Connect 32.768-kHz crystal or force external CMOS
level clock
Clock
RTC_XTAL_P
RTC_XTAL_N
51
52
—
—
—
—
Connect 32.768-kHz crystal or connect 100-kΩresistor
to supply voltage
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表7-2. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
SIGNAL NAME
DIO10
DESCRIPTION
1
3
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
DIO12
DIO13
4
DIO23
16
17
18(1)
20
21
45(1)
52(1)
53(1)
58
59
60
63
64
9
DIO24
DIO28
DIO29
DIO25
Hostless Mode
Hostless mode inputs and outputs
DIO31
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
DIO32
DIO30
DIO3
DIO4
DIO5
DIO8
DIO9
VDD_DIG1
VIN_IO1
VDD_PLL
LDO_IN2
VDD_PA_IN
LDO_IN1
Internal digital core voltage
10
24
25
33
36
Device supply voltage (VBAT
Internal analog voltage
)
—
—
—
—
Internal analog RF supply from analog DC/DC output
Internal PA supply voltage from PA DC/DC output
Internal analog RF supply from analog DC/DC output
—
—
—
—
—
—
Analog DC/DC input (connected to device input supply
[VBAT])
VIN_DCDC_ANA
DCDC_ANA_SW
VIN_DCDC_PA
37
38
39
—
—
—
—
—
—
Internal analog DC/DC switching node
PA DC/DC input (connected to device input supply
[VBAT])
DCDC_PA_SW_P
DCDC_PA_SW_N
DCDC_PA_OUT
DCDC_DIG_SW
40
41
42
43
Internal PA DC/DC switching node
Internal PA DC/DC switching node
Internal PA buck converter output
Internal digital DC/DC switching node
—
—
—
—
—
—
—
—
Power
Digital DC/DC input (connected to device input supply
[VBAT])
VIN_DCDC_DIG
44
—
—
DCDC_ANA2_SW_P
DCDC_ANA2_SW_N
VDD_ANA2
45
46
47
48
49
54
56
5
Analog to DC/DC converter +ve switching node
Internal analog to DC/DC converter –ve switching node
Internal analog to DC/DC output
—
—
—
—
—
—
—
—
—
—
—
I
VDD_ANA1
Internal analog supply fed by ANA2 DC/DC output
Internal SRAM LDO output
VDD_RAM
—
VIN_IO2
Device supply voltage (VBAT
Internal digital core voltage
Host SPI clock input
Data from Host
)
—
VDD_DIG2
—
HOST_SPI_CLK
HOST_SPI_MOSI
HOST_SPI_MISO
HOST_SPI_nCS
I/O
I/O
I/O
I/O
6
I
HOST SPI
8
O
I
Data to Host
7
Device select (active low)
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表7-2. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
DESCRIPTION
FLASH_SPI_CLK
FLASH_SPI_DOUT
FLASH_SPI_DIN
FLASH_SPI_CS
UART1_nRTS
UART1_TX
11
12
O
O
I
O
O
I
Clock to SPI serial flash (fixed default)
Data to SPI serial flash (fixed default)
Data from SPI serial flash (fixed default)
FLASH SPI
13
14
O
I/O
I/O
I/O
I/O
O
I
O
O
I
Device select to SPI serial flash (fixed default)
UART1 request-to-send (active low)
UART TX data
50
55
UART
UART1_RX
57
O
I
UART RX data
UART1_nCTS
SOP2
61
UART1 clear-to-send (active low)
Sense-on-power 2
21(2)
I
Sense-On-Power SOP1
SOP0
34
I
Configuration sense-on-power 1
Configuration sense-on-power 0
Global master device reset (active low)
35
I
I
Reset
nHIB
nRESET
32
I
I
Hibernate signal input to the NWP subsystem (active
low)
nHIB
2
I
I
A_RX
27
28
31
58
59
60
62
I
O
I/O
O
I
I
O
I/O
O
I
WLAN analog A-band receive
WLAN analog A-band transmit
WLAN analog RF 802.11 b/g bands
Test Signal
RF
A_TX
RF_BG
TEST_58
TEST_59
TEST_60
TEST_62
Test Signal
Test Port
O
O
O
O
Test Signal
Test Signal
(1) LPDS retention unavailable.
(2) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
7.4 Connections for Unused Pins
All unused pin should be configured as stated in 表7-3.
表7-3. Connections for Unused Pins
PIN
NUMBER
FUNCTION
SIGNAL DESCRIPTION
ACCEPTABLE PRACTICE
PREFERRED PRACTICE
Wake up I/O source should not be
floating during hibernate.
All the I/O pins will float while in
Hibernate and Reset states. Ensure
pullup and pulldown resistors are
available on board to maintain the
state of the I/O.
DIO
Digital input or output
Leave unused DIOs as NC
No Connect
SOP
NC
26
Unused pin, leave as NC.
Unused pin, leave as NC
69.8K Pull down resistor
on SOP0 and SOP1 used
as switch control pins,
Configuration sense-on-
power
Ensure pulldown resistors are
available on unused SOP pins
100K pull down on SOP2
Reset
RESET input for the device
RTC_XTAL_N
Never leave the reset pin floating
When using an external oscillator,
add a 100-kΩpullup resistor to VIO
Clock
When using an external oscillator,
connect to ground if unused
WLAN_XTAL_N
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8 Specifications
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over
process and voltage, unless otherwise indicated.
8.1 Absolute Maximum Ratings
All measurements are referenced at the device pins unless otherwise indicated. All specifications are over process and
overvoltage unless otherwise indicated.
Over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
MAX UNIT
VBAT and VIO
Pins: 37, 39, 44
Pins: 10, 54
3.8
V
V
–0.5
Supply voltage
VBAT and VIO should be tied
together
VIO –VBAT (differential)
Digital inputs
RF pins
VIO + 0.5
V
V
–0.5
–0.5
–0.5
–40
–55
2.1
2.1
85
Analog pins, Crystal
Pins: 22, 23, 51, 52
V
Operating temperature, TA
Storage temperature, Tstg
°C
°C
125
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
8.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
VESD
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Power-On Hours (POH)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's
standard terms and conditions for TI semiconductor products.
POWER-ON HOURS [POH]
OPERATING CONDITION
(hours)
TA up to 85°C(1)
87,600
(1) The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device
can be in any other state.
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8.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
2.1(4)
–20
TYP
MAX
3.6
UNIT
VBAT, VIO
(shorted to VBAT
Direct battery
connection(3)
Supply voltage
Pins: 10, 37, 39, 44, 54
3.3
V
)
Ambient thermal slew
20 °C/minute
(1) Operating temperature is limited by crystal frequency variation.
(2) When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect
feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the
transmission.
(3) To ensure WLAN performance, ripple on the supply must be less than ±300 mV.
(4) The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is also
2.1 V, and care must be taken when operating at the minimum specified voltage.
8.5 Current Consumption Summary: 2.4 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
MIN
TYP
272
188
248
179
223
160
53
MAX UNIT
1 DSSS
6 OFDM
54 OFDM
TX
mA
1 DSSS
RX(3)
mA
54 OFDM
53
Idle connected(4)
LPDS
690
115
4
µA
µA
µA
µA
Hibernate
Shutdown
1
VBAT = 3.6 V
VBAT = 3.3 V
VBAT = 2.1 V
420
450
670
Peak calibration current(5) (3)
mA
(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off
approximately 4 dB.
(2) The CC3135 system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) The RX current is measured with a 1-Mbps throughput rate.
(4) DTIM = 1
(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is
performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.
There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further
details, see CC31XX CC32XX SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
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8.6 Current Consumption Summary: 5 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
MIN
TYP
318
293
61
MAX
UNIT
6 OFDM
54 OFDM
54 OFDM
TX
mA
RX(3)
mA
µA
µA
µA
µA
Idle connected(4)
690
115
4
LPDS
Hibernate
Shutdown
1
VBAT = 3.6 V
VBAT = 3.3 V
VBAT = 2.7 V
VBAT = 2.1 V
290
310
310
400
Peak calibration current(5) (3)
mA
(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off
approximately 4 dB.
(2) The CC3135 system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) The RX current is measured with a 1-Mbps throughput rate.
(4) DTIM = 1
(5) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is
performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.
There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further
details, see CC31XX, CC32XX SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
8.7 TX Power Control for 2.4 GHz Band
The CC3135 has several options for modifying the output power of the device when required. For the 2.4 GHz
band it is possible to lower the overall output power at a global level using the global TX power level setting. In
1
2
addition, the 2.4 GHz band allows the user to enter additional back-offs , per channel, region and modulation
rates , via Image creator (see the UniFlash CC31xx, CC32xx SimpleLink™ Wi-Fi® and Internet-on-a chip™
3
Solution ImageCreator and Programming Tool User's Guide for more details).
图 8-1, 图 8-2, and 图 8-3 show TX power and IBAT versus TX power level settings for the CC3135 device at
modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively.
1
The back-off range is between -6 dB to +6 dB in 0.25 dB increments.
FCC/ISED, ETSI (Europe), and Japan are supported.
Back-off rates are grouped into 11b rates, high modulation rates (MCS7, 54 OFDM and 48 OFDM), and lower modulation rates (all
2
3
other rates).
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In 图 8-1, the area enclosed in the circle represents a significant reduction in current during transition from TX
power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI recommends using
TX power level 4 to reduce the current.
1 DSSS
19.00
17.00
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
Color by
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
6 OFDM
19.00
17.00
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
Color by
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
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54 OFDM
19.00
17.00
280.00
Color by
264.40
249.00
233.30
218.00
202.00
186.70
171.00
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
8.8 TX Power Control for 5 GHz
5 GHz power control is done via Image Creator where the maximum transmit power is provided 4. Within Image
Creator power control is possible per channel, region 5, and modulation rates 6. In addition, it is possible to enter
an additional back-off 7factor per channel and modulation rate for further margin to regulatory requirements.
8
Finally, it is also possible to set the TX and RX trace losses to the antenna per band . The peak antenna
gain 9can also be provided, thus allowing further control. For a full description of options and capabilities see the
UniFlash CC31xx, CC32xx SimpleLink ™ Wi-Fi® and Internet-on-a chip ™ Solution ImageCreator and
Programming Tool User's Guide.
4
The maximum transmit power range is 18 dBm to 0.125 dBm in 0.125 dBm decrements.
FCC/ISED, ETSI (Europe), and Japan are supported.
Rates are grouped into high modulation rates (MCS7, 54 OFDM and 48 OFDM) and lower modulation rates (all other rates).
The back-off range is 0 dBm to 18 dBm in 0.125 dBm increments, with the maximum back-off not exceed that of the maximum transmit
5
6
7
power.
8
The range of losses if from 0 dBm to 7.75 dBm in 0.125 dBm increments.
The antenna gain has a range of -2 dBi to 5.75 dBi in 0.125 dBi increments.
9
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8.9 Brownout and Blackout Conditions
The device enters a brownout condition when the input voltage drops below Vbrownout (see 图 8-4 and 图 8-5).
This condition must be considered during design of the power supply routing, especially when operating from a
battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to
networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance
includes the internal resistance of the battery, the contact resistance of the battery holder (four contacts for 2×
AA batteries), and the wiring and PCB routing resistance.
Note
When the device is in HIBERNATE state, brownout is not detected. Only blackout is in effect during
HIBERNATE state.
Supply
Voltage
Vbrownout
Vblackout
Chip in
Hibernate
Chip in
Hibernate
Chip in
Hibernate
Brownout
Brownout
is disabled
Brownout
is disabled
Brownout
is disabled
0 V
Time
1
2
3
4
5
6
7
8
9
Software
Enters
Hibernate
Chip Software Chip
Exits Enters Exits
Hibernate Hibernate Hibernate
Software
Enters
Hibernate
Chip Gets Chip Exits
Fully Reset Blackout Reset
In Blakcout & Boots
图8-4. Brownout and Blackout Levels (1 of 2)
Supply
Voltage
Vbrownout
Vblackout
SLEEP
ACTIVE
LPDS
SLEEP
ACTIVE
LPDS
SLEEP
ACTIVE
LPDS
Brownout
0 V
Time
1
2
3
4
5
6
7
图8-5. Brownout and Blackout Levels (2 of 2)
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In the brownout condition, all sections of the device (including the 32-kHz RTC) shut down except for the
Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout
condition is equivalent to a hardware reset event in which all states within the device are lost.
表8-1 lists the brownout and blackout voltage levels.
表8-1. Brownout and Blackout Voltage Levels
CONDITION
VOLTAGE LEVEL
UNIT
V
Vbrownout
Vblackout
2.1
1.67
V
8.10 Electrical Characteristics for DIO Pins
表8-2. Electrical Characteristics: DIO Pins Except 52 and 53
TA = 25°C, VBAT = 2.1 V to 3.3 V.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
CIN
VIH
VIL
IIH
Pin capacitance
4
pF
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
0.65 × VDD
VDD + 0.5 V
0.35 × VDD
V
V
–0.5
5
5
nA
nA
IIL
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.8
VDD × 0.7
VDD × 0.7
VDD × 0.75
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOH
High-level output voltage
V
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤VDD < 2.4 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.2
VDD × 0.2
VDD × 0.2
VDD × 0.25
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOL
Low-level output voltage
V
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤VDD < 2.4 V
2-mA drive
High-level
2
4
6
2
4
6
IOH
source
current
4-mA drive
6-mA drive
2-mA drive
4-mA drive
6-mA drive
mA
mA
Low-level
IOL
sink current
(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk
of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
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表8-3. Electrical Characteristics: DIO Pins 52 and 53
TA = 25°C, VBAT = 2.1 V to 3.6 V.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
pF
V
CIN
VIH
VIL
IIH
Pin capacitance
7
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
0.65 × VDD
VDD + 0.5 V
0.35 × VDD
V
–0.5
50
50
nA
nA
IIL
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.8
VDD × 0.7
VDD × 0.7
VDD × 0.75
IL = 4 mA; configured I/O
drive strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOH
High-level output voltage
V
IL = 6 mA; configured I/O
drive strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.1 V ≤VDD < 2.4 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.2
VDD × 0.2
VDD × 0.2
VDD × 0.25
IL = 4 mA; configured I/O
drive strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOL
Low-level output voltage
V
IL = 6 mA; configured I/O
drive strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.1 V ≤VDD < 2.4 V
2-mA
drive
1.5
2.5
3.5
1.5
2.5
3.5
High-level
4-mA
IOH
source current,
drive
mA
VOH = 2.4
6-mA
drive
2-mA
drive
Low-level sink
current
4-mA
drive
IOL
mA
V
6-mA
drive
VIL
nRESET
0.6
(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk
of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
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8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
TA = 25°C, VBAT = 3.0 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IOH
IOL
Pullup current, VOH = 2.4 (VDD = 3.0 V)
5
10
µA
Pulldown current, VOL = 0.4 (VDD = 3.0
V)
5
µA
8.12 WLAN Receiver Characteristics
表8-4. WLAN Receiver Characteristics: 2.4 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz).
PARAMETER
TEST CONDITIONS (Mbps)
MIN
TYP
–96.0
–94.0
–88.0
–90.5
–90.0
–86.5
–80.5
–74.5
–71.5
–4.0
MAX
UNIT
1 DSSS
2 DSSS
11 CCK
6 OFDM
Sensitivity
(8% PER for 11b rates, 10% PER for 11g/11n
9 OFDM
dBm
rates)(1)
18 OFDM
36 OFDM
54 OFDM
MCS7 (GF)(2)
802.11b
Maximum input level
(10% PER)
dBm
802.11g
–10.0
(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).
(2) Sensitivity for mixed mode is 1-dB worse.
表8-5. WLAN Receiver Characteristics: 5 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157.
PARAMETER
TEST CONDITIONS (Mbps)
MIN
TYP
-92.0
-91.0
-88.0
-81.5
-75.0
-71.0
-20
MAX
UNIT
dBm
dBm
6 OFDM
9 OFDM
18 OFDM
Sensitivity
(10% PER for 11g/11n rates)
36 OFDM
54 OFDM
MCS7 (GF)(1)
Maximum input level
802.11a
(1) Sensitivity for mixed mode is 1-dB worse.
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8.13 WLAN Transmitter Characteristics
表8-6. WLAN Transmitter Characteristics: 2.4 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin on channel 6 (2437 MHz).(1) (2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Operating frequency range(3) (4)
2412
2472
MHz
1 DSSS
2 DSSS
11 CCK
18.0
18.0
18.3
17.3
17.3
17.0
16.0
14.5
13.0
6 OFDM
9 OFDM
18 OFDM
36 OFDM
54 OFDM
MCS7
Maximum RMS output power measured at 1
dB from IEEE spectral mask or EVM
dBm
ppm
Transmit center frequency accuracy
25
–25
(1) The OFDM and MCS7 edge channels (2412 and 2462 MHz) have reduced TX power to meet FCC emission limits.
(2) Power of 802.11b rates are reduced to meet ETSI requirements in Europe.
(3) Channels 1 (2142 MHz) through 11 (2462 MHz) are supported for FCC.
(4) Channels 1 (2142 MHz) through 13 (2472MHz) are supported for Europe and Japan. Note that channel 14 is not supported for Japan.
表8-7. WLAN Transmitter Characteristics: 5 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V.(1) Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157.(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Operating frequency range(3) (4) (5)
5180
5825
MHz
6 OFDM
9 OFDM
18 OFDM
36 OFDM
54 OFDM
MCS7
18.1
18.1
18.1
16.6
15.0
14.0
Maximum RMS output power measured at 1
dB from IEEE spectral mask or EVM
dBm
Transmit center frequency accuracy
-20
20
ppm
(1) Transmit power will be reduced by 1.5dB for VBAT < 2.8V
(2) FCC, Europe, and Japan channel power limits per modulation rates can be found in the Uniflash with Image Creator User Guide.
(3) FCC band covers U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3 20-MHz BW modulations.
(4) Europe bands 1, 2 and 3, 20-MHz BW modulations are supported.
(5) For Japan, W52, W53 and W56, 20-MHz BW modulations are supported.
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8.14 WLAN Transmitter Out-of-Band Emissions
Both the 2.4 GHz and the 5 GHz RF paths require an external band-pass filter to meet the various emission
standards, including FCC. 表 8-8 and 表 8-9 presents the minimum attenuation requirements for the 2.4 GHz
and 5 GHz band-pass filter, respectively. TI recommends using the same filter, switch, diplexer, and so on, used
in the reference design to ease the process of certification.
表8-8. WLAN 2.4 GHz Filter Requirements
PARAMETER
FREQUENCY (MHz)
2412 to 2484
2412 to 2484
804 to 828
MIN
TYP
MAX
UNIT
dB
Return loss
Insertion loss(1)
10
1
42
23
49
52
30
27
42
44
30
50
1.5
dB
30
20
30
40
20
20
20
35
20
1608 to 1656
3216 to 3312
4020 to 4140
4824 to 4968
5628 to 5796
6432 to 6624
7200 to 7500
7500 to 10000
2412 to 2484
Bandpass
Attenuation
dB
Reference impendence
Filter type
Ω
(1) Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
表8-9. WLAN 5 GHz Filter Requirements
PARAMETER
FREQUENCY (MHz)
5150 to 5925
5150 to 5925
600 to 2700
MIN
TYP
MAX
UNIT
dB
Return loss
10
Insertion loss(1)
1
42
31
27
28
27
37
50
2
dB
41
27
20
20
20
25
2950 to 3850
4400 to 4600
6600 to 6900
7000 to 7775
10300 to 11850
5150 to 5925
Bandpass
Attenuation
dB
Reference impendence
Filter type
Ω
(1) Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
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8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
For proper BLE/2.4 GHz radio coexistence, the following requirements needs to met:
表8-10. COEX Isolation Requirement
PARAMETER
Band
MIN
20(1)
20(2)
TYP
MAX
UNIT
Single antenna
Port-to-port isolation
dB
Dual antenna Configuration
(1) WLAN/BLE switch used must provide a minimum of 20 dB isolation between ports.
(2) For dual antenna configuration antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB.
8.16 Thermal Resistance Characteristics for RGK Package
THERMAL METRICS(1)
°C/W(2) (3)
6.3
AIR FLOW (m/s)(4)
0.0051
0.0051
0.0051
0.765
Junction-to-case
RΘJC
RΘJB
RΘJA
Junction-to-board
Junction-to-free air
2.4
23
14.6
12.4
10.8
0.2
Junction-to-moving air
1.275
RΘJMA
2.55
0.0051
0.765
0.2
PsiJT
Junction-to-package top
0.3
1.275
0.1
2.55
2.3
0.0051
0.765
2.3
PsiJB
Junction-to-board
2.2
1.275
2.4
2.55
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
•
•
•
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70°C is assumed.
(4) m/s = meters per second.
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8.17 Timing and Switching Characteristics
8.17.1 Power Supply Sequencing
For proper operation of the CC3135 device, perform the recommended power-up sequencing as follows:
1. Tie the following pins together on the board:
• VBAT (pins 37, 39, and 44)
• VIO (pins 54 and 10)
2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100 K
||, 0.01 µF, RC = 1 ms).
3. For an external RTC, ensure that the clock is stable before RESET is deasserted (high).
For timing diagrams, see 节8.17.3.
8.17.2 Device Reset
When a device restart is required, the user may issue a negative pulse to the nRESET pin. The user must follow
one of the following alternatives to ensure the reset is properly applied:
• A negative reset pulse (on pin 32) of at least 200-ms duration
• If the 200-ms pulse duration cannot be ensured, a pulldown resistor of 2 MΩmust be connected to pin 52
(RTC_XTAL_N). If implemented, a shorter pulse of at least 100 µs can be used.
To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset. When a
reset is required, it is preferable to use the software reset instead of an external trigger.
8.17.3 Reset Timing
8.17.3.1 nRESET (32-kHz Crystal)
图8-6 shows the reset timing diagram for the 32-kHz crystal first-time power-up and reset removal.
T2
T1
T3
VBAT
VIO
nRESET
nHIB
Device Ready to
serve API calls
POWER
OFF
RESET
HW INIT
FW INIT
STATE
32-kHz
XTAL
图8-6. First-Time Power-Up and Reset Removal Timing Diagram (32-kHz Crystal)
表8-11 describes the timing requirements for the 32-kHz crystal first-time power-up and reset removal.
表8-11. First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
ms
ms
s
nReset timing after VBAT and VIO supply are
stable
T1
T2
T3
nReset time
1
Hardware wake-up time
Initialization time
25
32-kHz crystal settling plus firmware
initialization time plus radio calibration
1.35
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8.17.3.2 nRESET (External 32-kHz Crystal)
图8-7 shows the reset timing diagram for the external 32-kHz crystal first-time power-up and reset removal.
T1
T2
T3
VBAT
VIO
nRESET
nHIB
POWER
OFF
Device Ready to
serve API calls
STATE
RESET
HW INIT
FW INIT
32-kHz
RTC CLK
图8-7. First-Time Power-Up and Reset Removal Timing Diagram (External 32-kHz Crystal)
表8-12 describes the timing requirements for the external first-time power-up and reset removal.
表8-12. First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Crystal)
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
nReset timing after VBAT and VIO supply are
stable
T1
T2
T3
nReset time
1
ms
Hardware wake-up time
Initialization time
25
ms
Firmware initialization time plus radio
calibration
250
ms
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8.17.4 Wakeup From HIBERNATE Mode
Note
The 32.768-kHz crystal is kept enabled by default when the chip goes into HIBERNATE mode in
response to nHIB being pulled low.
图8-8 shows the timing diagram for wakeup from HIBERNATE mode.
T
T
wake_from_hib
hib_min
VBAT
VIO
nRESET
nHIB
ACTIVE
HIBERNATE
HW WAKEUP+FW INIT
ACTIVE
HIBERNATE
32-kHz
XTAL/CXO
图8-8. nHIB Timing Diagram
表8-13 describes the timing requirements for nHIB.
表8-13. nHIB Timing Requirements
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
Thib_min
Minimum hibernate time
Minimum pulse width of nHIB being low(1)
10
ms
Hardware wakeup time plus
firmware initialization time
Twake_from_hib
See(2)
50
ms
(1) Ensure that the nHIB pulse width is kept above the minimum requirement under all conditions (such as power up, MCU reset, and so
on).
(2) If temperature changes by more than 20°C, initialization time from HIB can increase by 200 ms due to radio calibration.
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8.17.5 Clock Specifications
The CC3135 device requires two separate clocks for its operation:
• A slow clock running at 32.768 kHz is used for the RTC.
• A fast clock running at 40 MHz is used by the device for the internal processor and the WLAN subsystem.
The device features internal oscillators that enable the use of less-expensive crystals rather than dedicated
TCXOs for these clocks. The RTC can also be fed externally to provide reuse of an existing clock on the system
and to reduce overall cost.
8.17.5.1 Slow Clock Using Internal Oscillator
The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow clock
frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between RTC_XTAL_P
(pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance to meet the ppm requirement.
图8-9 shows the crystal connections for the slow clock.
51
RTC_XTAL_P
10 pF
GND
32.768 kHz
52
RTC_XTAL_N
10 pF
GND
Copyright © 2017, Texas Instruments Incorporated
图8-9. RTC Crystal Connections
表8-14 lists the RTC crystal requirements.
表8-14. RTC Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
kHz
ppm
kΩ
Frequency
32.768
Frequency accuracy
Crystal ESR
Initial plus temperature plus aging
32.768 kHz
±150
70
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8.17.5.2 Slow Clock Using an External Clock
When an RTC oscillator is present in the system, the CC3135 device can accept this clock directly as an input.
The clock is fed on the RTC_XTAL_P line, and the RTC_XTAL_N line is held to VIO. The clock must be a CMOS-
level clock compatible with VIO fed to the device.
图8-10 shows the external RTC input connection.
32.768 kHz
RTC_XTAL_P
Host system
VIO
100 KΩ
RTC_XTAL_N
Copyright © 2017, Texas Instruments Incorporated
图8-10. External RTC Input
表8-15 lists the external RTC digital clock requirements.
表8-15. External RTC Digital Clock Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
32768
Hz
Frequency accuracy
(Initial plus temperature plus aging)
±150
50%
ppm
ns
Input transition time tr, tf
(10% to 90%)
tr, tf
100
Frequency input duty cycle
20%
80%
VIO
Vih
Vil
0.65 × VIO
V
Slow clock input voltage limits
Square wave, DC coupled
0
1
0.35 × VIO
Vpeak
MΩ
pF
Input impedance Resistance
Capacitance
5
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8.17.5.3 Fast Clock (Fref) Using an External Crystal
The CC3135 device also incorporates an internal crystal oscillator to support a crystal-based fast clock. The
crystal is fed directly between WLAN_XTAL_P (pin 23) and WLAN_XTAL_N (pin 22) with suitable loading
capacitors.
图8-11 shows the crystal connections for the fast clock.
23
WLAN_XTAL_P
6.2 pF
GND
40 MHz
22
WLAN_XTAL_N
6.2 pF
GND
SWAS031-030
NOTE: The crystal capacitance must be tuned to ensure that the PPM requirement is met. See CC31xx & CC32xx Frequency Tuning
for information on frequency tuning.
图8-11. Fast Clock Crystal Connections
表8-16 lists the WLAN fast-clock crystal requirements.
表8-16. WLAN Fast-Clock Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
ppm
Ω
Frequency
40
Frequency accuracy
Crystal ESR
Initial plus temperature plus aging
40 MHz
±20
60
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8.17.5.4 Fast Clock (Fref) Using an External Oscillator
The CC3135 device can accept an external TCXO/XO for the 40-MHz clock. In this mode of operation, the clock
is connected to WLAN_XTAL_P (pin 23). WLAN_XTAL_N (pin 22) is connected to GND. The external TCXO/XO
can be enabled by TCXO_EN (pin 21) from the device to optimize the power consumption of the system.
If the TCXO does not have an enable input, an external LDO with an enable function can be used. Using the
LDO improves noise on the TCXO power supply.
图8-12 shows the connection.
Vcc
XO (40 MHz)
EN
CC3135R
TCXO_EN
82 pF
WLAN_XTAL_P
OUT
WLAN_XTAL_N
图8-12. External TCXO Input
表8-17 lists the external Fref clock requirements.
表8-17. External Fref Clock Requirements (–40°C to +85°C)
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
40.00
MHz
Frequency accuracy
(Initial plus temperature plus aging)
±20
55%
1.2
ppm
Frequency input duty cycle
Clock voltage limits
45%
0.7
50%
Sine or clipped sine wave,
AC coupled
Vpp
Vpp
at 1 kHz
–125
–138.5
–143
Phase noise at 40 MHz
at 10 kHz
at 100 kHz
dBc/Hz
Resistance
Input impedance
12
kΩ
Capacitance
7
pF
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8.17.6 Interfaces
This section describes the interfaces that are supported by the CC3135 device:
• Host SPI
• Flash SPI
• Digital IO
8.17.6.1 Host SPI Interface Timing
图8-13 shows the Host SPI interface timing diagram.
T2
CLK
T6
T7
MISO
MOSI
T9
T8
图8-13. Host SPI Interface Timing
表8-18 lists the Host SPI interface timing parameters.
表8-18. Host SPI Interface Timing Parameters
PARAMETER
NUMBER
DESCRIPTION
MIN
MAX
UNIT
Clock frequency at VBAT = 3.3 V
Clock frequency at VBAT ≤2.1 V
Clock period
20
12
T1
F(1)
MHz
(1) (2)
(1)
T2
T3
T4
T5
T6
T7
T8
T9
tclk
tLP
tHT
50
ns
ns
ns
Clock low period
25
25
(1)
Clock high period
D(1)
Duty cycle
45%
55%
(1)
tIS
tIH
RX data setup time
RX data hold time
TX data output delay
TX data hold time
4
4
ns
ns
ns
ns
(1)
(1)
(1)
tOD
tOH
20
24
(1) The timing parameter has a maximum load of 20 pF at 3.3 V.
(2) Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. nCS can be deasserted 10 ns after the clock edge.
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8.17.6.2 Flash SPI Interface Timing
图8-14 shows the Flash SPI interface timing diagram.
T2
CLK
T6
T7
MISO
MOSI
T9
T8
图8-14. Flash SPI Interface Timing
表8-19 lists the Flash SPI interface timing parameters.
表8-19. Flash SPI Interface Timing Parameters
PARAMETER
NUMBER
DESCRIPTION
MIN
MAX
UNIT
T1
T2
T3
T4
T5
T6
T7
T8
T9
F
Clock frequency
Clock period
20
MHz
ns
tclk
tLP
tHT
D
50
Clock low period
Clock high period
Duty cycle
25
25
ns
ns
45%
55%
tIS
RX data setup time
RX data hold time
TX data output delay
TX data hold time
1
2
ns
ns
ns
ns
tIH
tOD
tOH
8.5
8
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8.17.6.3 DIO Interface Timing
Note
Digital IOs on CC3135 refers to antenna select, hostless mode, and BLE/2.4 GHz coexistence IOs not
general purpose IOs
图8-15 shows the DIO timing diagram.
VDD
80%
20%
tDIOR
tDIOF
SWAS037
图8-15. DIO Timing Diagram
8.17.6.3.1 DIO Output Transition Time Parameters (Vsupply = 3.3 V)
表8-20 lists the DIO output transition times for Vsupply = 3.3 V.
表8-20. DIO Output Transition Times (Vsupply = 3.3 V)(1)
tr
tf
DRIVE
STRENGTH (mA)
DRIVE STRENGTH
CONTROL BITS
UNIT
ns
MIN
NOM
MAX
MIN
NOM
MAX
2MA_EN=1
4MA_EN=0
2MA_EN=0
4MA_EN=1
2MA_EN=1
4MA_EN=1
2(2)
4(2)
6
8.0
9.3
10.7
8.2
9.5
11.0
6.6
3.2
7.1
3.5
7.6
3.7
4.7
2.3
5.2
2.6
5.8
2.9
ns
ns
(1) Vsupply = 3.3 V, T = 25°C, total pin load = 30 pF
(2) The 2-mA and 4-mA drive strength does not apply to the COEX I/O pins. Pins configured as COEX lines are invariably driven at 6 mA.
8.17.6.3.2 DIO Input Transition Time Parameters
表8-21 lists the input transition time parameters.
表8-21. DIO Input Transition Time Parameters
PARAMETERS
MIN
1
MAX
UNIT
ns
tr
tf
3
3
Input transition time (tr, tf), 10% to 90%
1
ns
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8.18 External Interfaces
8.18.1 SPI Flash Interface
The external serial Flash stores the user profiles and firmware patch updates. The CC3135 device acts as a
master in this case; the SPI serial Flash acts as the slave device. This interface can work up to a speed of 20
MHz.
图8-16 shows the SPI Flash interface.
CC3135R (master)
Serial flash
FLASH_SPI_CLK
SPI_CLK
SPI_CS
FLASH_SPI_CS
FLASH_SPI_MISO
FLASH_SPI_MOSI
SPI_MISO
SPI_MOSI
图8-16. SPI Flash Interface
表8-22 lists the SPI Flash interface pins.
表8-22. SPI Flash Interface
PIN NAME
DESCRIPTION
FLASH_SPI_CLK
FLASH_SPI_CS
FLASH_SPI_MISO
FLASH_SPI_MOSI
Clock (up to 20 MHz) CC3135 device to serial Flash
CS signal from CC3135 device to serial Flash
Data from serial Flash to CC3135 device
Data from CC3135 device to serial Flash
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8.18.2 SPI Host Interface
The device interfaces to an external host using the SPI interface. The CC3135 device can interrupt the host
using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a
speed of 20 MHz.
图8-17 shows the SPI host interface.
CC3135R (slave)
MCU
HOST_SPI_CLK
SPI_CLK
SPI_nCS
SPI_MISO
SPI_MOSI
INTR
HOST_SPI_nCS
HOST_SPI_MISO
HOST_SPI_MOSI
HOST_INTR
nHIB
GPIO
图8-17. SPI Host Interface
表8-23 lists the SPI host interface pins.
表8-23. SPI Host Interface
PIN NAME
DESCRIPTION
HOST_SPI_CLK
HOST_SPI_nCS
HOST_SPI_MOSI
HOST_INTR
Clock (up to 20 MHz) from MCU host to CC3135 device
CS (active low) signal from MCU host to CC3135 device
Data from MCU host to CC3135 device
Interrupt from CC3135 device to MCU host
HOST_SPI_MISO
nHIB
Data from CC3135 device to MCU host
Active-low signal that commands the CC3135 device to enter hibernate mode (lowest power state)
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8.18.3 Host UART Interface
The SimpleLink device requires the UART configuration described in 表8-24.
表8-24. SimpleLink™ UART Configuration
PROPERTY
Baud rate
SUPPORTED CC3135 CONFIGURATION
115200 bps, no auto-baud rate detection, can be changed by the host up to 3 Mbps using a special command
Data bits
8 bits
Flow control
Parity
CTS/RTS
None
Stop bits
1
Bit order
LSBit first
Active high
Rising edge or level 1
Little-endian only(1)
Host interrupt polarity
Host interrupt mode
Endianness
(1) The SimpleLink device does not support automatic detection of the host length while using the UART interface.
8.18.3.1 5-Wire UART Topology
图 8-18 shows the typical 5-wire UART topology comprised of four standard UART lines plus one IRQ line from
the device to the host controller to allow efficient low-power mode.
This topology is recommended because the configuration offers the maximum communication reliability and
flexibility between the host and the SimpleLink device.
nRTS
nCTS
TX
nRTS
nCTS
TX
HOST MCU
UART
CC3135R SL
UART
RX
RX
HOST_INTR(IRQ)
HOST_INTR(IRQ)
图8-18. 5-Wire UART Topology
8.18.3.2 4-Wire UART Topology
The 4-wire UART topology eliminates the host IRQ line (see 图 8-19). Using this topology requires meeting one
of the following conditions:
• The host is always awake or active.
• The host goes to sleep, but the UART module has receiver start-edge detection for auto wakeup and does
not lose data.
nRTS
nCTS
TX
nRTS
nCTS
TX
HOST MCU
UART
CC3135R SL
UART
RX
RX
H_IRQ
H_IRQ
X
图8-19. 4-Wire UART Configuration
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8.18.3.3 3-Wire UART Topology
The 3-wire UART topology requires only the following lines (see 图8-20):
• RX
• TX
• CTS
nRTS
nCTS
TX
nRTS
X
nCTS
TX
HOST MCU
UART
CC3135R SL
UART
RX
RX
H_IRQ
H_IRQ
X
图8-20. 3-Wire UART Topology
Using this topology requires meeting one of the following conditions:
• The host always stays awake or active.
• The host goes to sleep but the UART module has receiver start-edge detection for auto-wake-up and does
not lose data.
• The host can always receive any amount of data transmitted by the SimpleLink™ device because there is no
flow control in this direction.
Because there is no full flow control, the host cannot stop the SimpleLink™ device to send its data; thus, the
following parameters must be carefully considered:
• Maximum baud rate
• RX character interrupt latency and low-level driver jitter buffer
• Time consumed by the user's application
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9 Detailed Description
9.1 Overview
Connect any microcontroller (MCU) to the Internet of Things (IoT) with the CC3135 device, a dual-band wireless
network processor from Texas Instruments™. The CC3135 Wi-Fi® Internet-on-a chip™ device contains an Arm®
Cortex®-M3 MCU dedicated to wi-fi and internet protocols, in order to offload networking activities from the host
MCU. The subsystem includes a dual band 802.11a/b/g/n radio, baseband, and MAC with a powerful crypto
engine for fast, secure Internet connections with 256-bit encryption and built in power management for best in
class low power performance. The CC3135 device supports station, AP, and Wi-Fi Direct® modes. The device
also supports WPA2™ personal and enterprise security, WPS 2.0, and WPA3™ personal and enterprise
security 10. The Wi-Fi network processor includes an embedded IPv6 and IPv4 TCP/IP stack.
9.2 Device Features
9.2.1 WLAN
The WLAN features are as follows:
• 802.11a/b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station, AP,
Wi-Fi Direct® client, and group owner with CCK and OFDM rates in the 2.4 GHz ISM band (channels 1
through 13), and the 5 GHz 20-MHz BW U-NII bands (U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3).
Note
802.11n is supported only in Wi-Fi® station and Wi-Fi Direct®.
• The automatically calibrated radio with a single-ended 50-Ωinterface enables easy connection to the
antenna without requiring expertise in radio circuit design.
• Advanced connection manager with multiple user-configurable profiles stored in serial flash allows automatic
fast connection to an access point without user or host intervention.
• Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security
accelerators, including: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x), and WPA3 Personal and WPA3
Enterprise.
• Smart provisioning options deeply integrated within the device providing a comprehensive end-to-end
solution. With elaborate events notification to the host, enabling the application to control the provisioning
decision flow. The wide variety of Wi-Fi provisioning methods include:
– Access Point with HTTP server
– WPS - Wi-Fi Protected Setup, supporting both push button and pin code options.
– SmartConfig™ Technology: TI proprietary, easy to use, one-step, one-time process used to connect a
CC3135-enabled device to the home wireless network.
• 802.11 transceiver mode allows transmitting and receiving of proprietary data through a socket The 802.11
transceiver mode provides the option to select the working channel, rate, and transmitted power. The receiver
mode works with the filtering options.
• Antenna selection for best connection
• BLE/2.4 GHz radio coexistence mechanism to avoid interference
10
Supported from Service Pack v4.5.0.11-3.1.0.5-3.1.0.25. Limited to STA mode only.
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9.2.2 Network Stack
The Network Stack features are as follows:
• Integrated IPv4, IPv6 TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU,
microprocessor, or ASIC
Note
Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.
• Support of 16 simultaneous TCP, UDP, RAW, SSL\TLS sockets
• Built-in network protocols:
– Static IP, LLA, DHCPv4, DHCPv6 with DAD and stateless autoconfiguration
– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND
– DNS client for easy connection to the local network and the Internet
• Built-in network applications and utilities:
– HTTP/HTTPS
• Web page content stored on serial flash
• RESTful APIs for setting and configuring application content
• Dynamic user callbacks
– Service discovery: Multicast DNS service discovery lets a client advertise its service without a centralized
server. After connecting to the access point, the CC3135 device provides critical information, such as
device name, IP, vendor, and port number.
– DHCP server
– Ping
表9-1 describes the NWP features.
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表9-1. NWP Features
Feature
Description
802.11a/b/g/n station
Wi-Fi standards
802.11a/b/g AP supporting up to four stations
Wi-Fi Direct client and group owner
2.4 GHz ISM and 5 GHz U-NII Channels
20 MHz
Wi-Fi channels
Channel Bandwidth
Wi-Fi security
Wi-Fi provisioning
IP protocols
WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x), WPA3 personal and enterprise (1)
SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP web server
IPv4/IPv6
IP addressing
Cross layer
Static IP, LLA, DHCPv4, DHCPv6 with DAD
ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP
UDP, TCP
Transport
SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2
RAW
Ping
HTTP/HTTPS web server
Network applications and
utilities
mDNS
DNS-SD
DHCP server
Host interface
Security
UART/SPI
Device identity
Trusted root-certificate catalog
TI root-of-trust public key
Power management
Other
Enhanced power policy management uses 802.11 power save and deep-sleep power modes
Transceiver
Programmable RX filters with event-trigger mechanism
Rx Metrics for tracking the surrounding RF environment
(1) Supported from Service Pack v4.5.0.11-3.1.0.5-3.1.0.25. Limited to STA mode only.
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9.2.3 Security
The SimpleLink Wi-Fi CC3135 Internet-on-a chip device enhances the security capabilities available for
development of IoT devices, while completely offloading these activities from the MCU to the networking
subsystem. The security capabilities include the following key features:
Code and Data Security:
• Secured network information: Network passwords and certificates are encrypted
• Secured and authenticated service pack: SP is signed based on TI certificate
Wi-Fi and Internet Security:
• Personal and enterprise Wi-Fi security
– Personal standards
• AES (WPA2-PSK)
• TKIP (WPA-PSK)
• WEP
– Enterprise standards
• EAP Fast
• EAP PEAPv0 MSCHAPv2
• EAP PEAPv0 TLS
• EAP PEAPv1 TLS EAP LS
• EAP TTLS TLS
• EAP TTLS MSCHAPv2
• Secure HTTP server (HTTPS)
• The Trusted root-certificate catalog verifies that the CA used by the application is trusted and known secure
content delivery
• The TI root-of-trust public key is a hardware-based mechanism that allows authenticating TI as the genuine
origin of a given content using asymmetric keys
• Secure content delivery allows file transfer to the system in a secure way on any unsecured tunnel
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• Secure sockets
– Protocol versions: SSL v3/TLS 1.0/TLS 1.1/TLS 1.2
– On-chip powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES
encryption for TLS and SSL connections
– Ciphers suites
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
– Server authentication
– Client authentication
– Domain name verification
– Socket upgrade to secure socket –STARTTLS
9.2.4 Host Interface and Driver
• Interfaces over a 4-wire serial peripheral interface (SPI) with any MCU or a processor at a clock speed of 20
MHz.
• Interfaces over UART with any MCU with a baud rate up to 3 Mbps. A low footprint driver is provided for TI
MCUs and is easily ported to any processor or ASIC.
• Simple APIs enable easy integration with any single-threaded or multithreaded application.
9.2.5 System
• Works from a single preregulated power supply or connects directly to a battery
• Ultra-low leakage when disabled (hibernate mode) with a current of less than 4 µA with the RTC running
• Integrated clock sources
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9.3 FIPS 140-2 Level 1 Certification
The Federal Information Processing Standard (FIPS) Publication 140-2 is a U.S. government computer security
standard. It is commonly referred to as FIPS 140-2 and is used to accredit the design and implementation of
cryptographic modules. A cryptographic module within a security system is necessary to maintain the
confidentiality and integrity of the information protected by the device.
The security engines of the CC3135 device is FIPS validated for FIPS 140-2 level 1 certification 11. This
certification involves testing the device for all areas related to the secure design and implementation of the
cryptographic modules and covers topics such as: cryptographic specifications, ports and interfaces, a finite
state model for the cryptographic module, the operational environment of the module, and how cryptographic
keys are managed.
9.4 Power-Management Subsystem
The CC3135 power-management subsystem contains DC/DC converters to accommodate the different voltage
or current requirements of the system.
• Digital DC/DC (Pin 44): Input: VBAT wide voltage (2.1 to 3.6 V)
• ANA1 DC/DC (Pin 38): Input: VBAT wide voltage (2.1 to 3.6 V)
• PA DC/DC (Pin 39): Input: VBAT wide voltage (2.1 to 3.6 V)
The CC3135 device is a single-chip WLAN radio solution used on an embedded system with a wide-voltage
supply range. The internal power management, including DC/DC converters and LDOs, generates all of the
voltages required for the device to operate from a wide variety of input sources. For maximum flexibility, the
device can operate in the modes described in 节9.4.1.
9.4.1 VBAT Wide-Voltage Connection
In the wide-voltage battery connection, the device is powered directly by the battery or preregulated 3.3-V
supply. All other voltages required to operate the device are generated internally by the DC/DC converters. This
scheme supports wide-voltage operation from 2.1 to 3.6 V and is thus the most common mode for the device.
11
For exact status of FIPS certification for a specific part number, please refer to https://csrc.nist.gov/publications/fips.
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9.5 Low-Power Operating Modes
This section describes the low-power modes supported by the device to optimize battery life.
9.5.1 Low-Power Deep Sleep
The low-power deep-sleep (LPDS) mode is an energy-efficient and transparent sleep mode that is entered
automatically during periods of inactivity based on internal power optimization algorithms. The device can wake
up in less than 3 ms from the internal timer or from any incoming host command. Typical battery drain in this
mode is 115 µA. During LPDS mode, the device retains the software state and certain configuration information.
The operation is transparent to the external host; thus, no additional handshake is required to enter or exit LPDS
mode. Advanced features of long sleep interval and IoT low power for extending LPDS time for up to 22 seconds
while maintaining Wi-Fi connection is also supported
9.5.2 Hibernate
The hibernate mode is the lowest power mode in which all of the digital logic is power-gated. Only a small
section of the logic powered directly by the main input supply is retained. The RTC is kept running and the
device wakes up once the nHIB line is asserted by the host driver. The wake-up time is longer than LPDS mode
at approximately 50 ms. The typical battery drain in this mode is 4.5 µA.
Note
Wake-up time can be extended depending on the service-pack size.
9.5.3 Shutdown
The shutdown mode is the lowest power-mode system-wise. All device logics are off, including the real-time
clock (RTC). The wake-up time in this mode is longer than hibernate at approximately 1.1 s. The typical battery
drain in this mode is 1 µA.
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9.6 Memory
9.6.1 External Memory Requirements
The CC3135 device maintains a proprietary file system on the sFLASH. The CC3135 file system stores the
service pack file, system files, configuration files, certificate files, web page files, and user files. By using a
format command through the API, users can provide the total size allocated for the file system. The starting
address of the file system cannot be set and is always at the beginning of the sFLASH. The applications
microcontroller must access the sFLASH memory area allocated to the file system directly through the CC3135
file system. The applications microcontroller must not access the sFLASH memory area directly.
The file system manages the allocation of sFLASH blocks for stored files according to download order, which
means that the location of a specific file is not fixed in all systems. Files are stored on sFLASH using human-
readable filenames rather than file IDs. The file system API works using plain text, and file encryption and
decryption is invisible to the user. Encrypted files can be accessed only through the file system.
All file types can have a maximum of 100 supported files in the file system. All files are stored in 4-KB blocks and
thus use a minimum of 4KB of Flash space. Fail-safe files require twice the original size and use a minimum of
8KB. Encrypted files are counted as fail-safe in terms of space. The maximum file size is 1MB.
表9-2 lists the minimum required memory consumption under the following assumptions:
• System files in use consume 64 blocks (256KB).
• Vendor files are not taken into account.
• Gang image:
– Storage for the gang image is rounded up to 32 blocks (meaning 128-KB resolution).
– Gang image size depends on the actual content size of all components. Additionally, the image should be
128-KB aligned so unaligned memory is considered lost. Service pack, system files, and the 128-KB
aligned memory are assumed to occupy 256KB.
• All calculations consider that the restore-to-default is enabled.
表9-2. Recommended Flash Size
ITEM
File system allocation table
System and configuration files
Service Pack
CC3135 [KB]
20
256
264
Gang image size
256
Total
796
Minimal Flash size
Recommended Flash size
8MBit
16MBit
Note
The maximum supported serial flash size is 32MB (256Mb) (see Using Serial Flash on CC3135/
CC3235 SimpleLink™ Wi-Fi® and Internet-of-Things Devices).
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9.7 Restoring Factory Default Configuration
The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory
image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on
the sFLASH in a secure manner and cannot be accessed from the host processor. The following restore modes
are supported:
• None –no factory restore settings
• Enable restore of factory default parameters
• Enable restore of factory image and factory default parameters
The restore process is performed by pulling or forcing SOP[2:0] = 110 pins and toggling the nRESET pin from
low to high.
The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The
restore process typically takes about 8 seconds, depending on the attributes of the serial Flash vendor.
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9.8 Hostless Mode
The SimpleLink™ Wi-Fi® CC3135 device incorporates a scripting ability that enables offloading of simple tasks
from the host processor. Using simple and conditional scripts, repetitive tasks can be handled internally, which
allows the host processor to remain in a low-power state. In some cases where the scripter is being used to send
packets, it reduces code footprint and memory consumption. The if-this-then-that style conditioning can include
anything from GPIO toggling to transmitting packets.
The conditional scripting abilities can be divided into conditions and actions. The conditions define when to
trigger actions. Only one action can be defined per condition, but multiple instances of the same condition may
be used, so in effect multiple actions can be defined for a single condition. In total, 16 condition and action pairs
can be defined. The conditions can be simple, or complex using sub-conditions (using a combinatorial AND
condition between them). The actions are divided into two types, those that can occur during runtime and those
that can occur only during the initialization phase.
The following actions can only be performed when triggered by the pre-initialization condition:
• Set roles AP, station, P2P, and Tag modes
• Delete all stored profiles
• Set connection policy
• Hardware GPIO indication allows an I/O to be driven directly from the WLAN core hardware to indicate
internal signaling
The following actions may be activated during runtime:
• Send transceiver packet
• Send UDP packet
• Send TCP packet
• Increment counter increments one of the user counters by 1
• Set counter allows setting a specific value to a counter
• Timer control
• Set GPIO allows GPIO output from the device using the internal networking core
• Enter Hibernate state
Note
Consider the following limitations:
• Timing cannot be ensured when using the network scripter because some variable latency will
apply depending on the utilization of the networking core.
• The scripter is limited to 16 pairs of conditions and reactions.
• Both timers and counters are limited to 8 instances each. Timers are limited to a resolution of 1
second. Counters are 32 bits wide.
• Packet length is limited to the size of one packet and the number of possible packet tokens is
limited to 8.
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10 Applications, Implementation, and Layout
Note
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
10.1 Application Information
10.1.1 BLE/2.4 GHz Radio Coexistence
The CC3135 device is designed to support BLE/2.4 GHz radio coexistence. Because WLAN is inherently more
tolerant to time-domain disturbances, the coexistence mechanism gives priority to the Bluetooth® low energy
entity over the WLAN. Bluetooth® low energy operates in the 2.4 GHz band, therefore the coexistence
mechanism does not affect the 5 GHz band. The CC3135 device can operate normally on the 5 GHz band, while
the Bluetooth® low energy works on the 2.4 GHz band without mutual interference.
The following coexistence modes can be configured by the user:
• Off mode or intrinsic mode
– No BLE/2.4 GHz radio coexistence, or no synchronization between WLAN and Bluetooth® low energy—in
case Bluetooth® low energy exists in this mode, collisions can randomly occur.
• Time Division Multiplexing (TDM, Single Antenna)
– 2.4 GHz Wi-Fi band (see 图10-1)
In this mode, the two entities share the antenna through an RF switch using two GPIOs (one input and
one output from the WLAN perspective).
– 5 GHz Wi-Fi band (see 图10-2)
In this mode, the WLAN operates on the 5 GHz band and Bluetooth® low energy operates on the 2.4 GHz
band. A 2.4- or 5 GHz diplexer is required for sharing the single antenna.
• Time Division Multiplexing (TDM, Dual Antenna)
– 2.4 GHz Wi-Fi Band (see 图10-3)
In this mode, the two entities have separate antennas. No RF switch is required and only a single GPIO
(one input from the WLAN perspective).
– 5 GHz Wi-Fi band (see 图10-4)
In this mode, the WLAN operates on the 5 GHz band and Bluetooth® low energy operates on the 2.4 GHz
band. No diplexer is required for the dual-antenna solution.
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BLE / 2.4 GHz Ant.
SPDT RF SWITCH
RF_BG
RF
WLAN
CC3135
BLE
CCxxxx
CC_COEX_SW_OUT
Coex IO
CC_COEX_BLE_IN
图10-1. 2.4 GHz, Single-Antenna Coexistence Mode Block Diagram
图 10-2 shows the single antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. The SOP lines control the 5 GHz switch. The
Coex switch is controlled by a GPIO signal from the BLE device and a GPIO signal from the CC3135 device.
A_TX
5 GHz SPDT RF
SWITCH
Dual band Ant.
A_RX
SOP0
5 GHz
BPF
SOP1
WLAN
CC3135
RF_BG
2.4 / 5 GHz
Diplexer
CC_COEX_SW_OUT
Coex SPDT RF
SWITCH
2.4 GHz
BPF
BLE
CCxxxx
RF
CC_COEX_BLE_IN
Coex IO
图10-2. Single Antenna Coexistence Solution with 5 GHz Wi-Fi®
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图 10-3 shows the dual antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. Note in this implementation no Coex switch
is required and only a single GPIO from the BLE device to the CC3135 device is required.
2.4 GHz Ant.
BLE Ant.
RF_BG
RF
WLAN
CC3135
BLE
CCxxxx
Coex IO
CC_COEX_BLE_IN
图10-3. Dual-Antenna Coexistence Mode Block Diagram
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图 10-4 shows the dual antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. In this case, the 2.4 GHz and 5 GHz Wi-Fi
share an antenna and the BLE has it's own dedicated antenna. The SOP lines control the 5 GHz switch. Note in
this implementation no Coex switch is required and only a single GPIO from the BLE device to the CC3135
device is required.
A_TX
Dual Band Ant.
5 GHz SPDT RF
SWITCH
A_RX
5 GHz
BPF
SOP0
SOP1
WLAN
CC3135
2.4 / 5 GHz
Diplexer
RF_BG
2.4 GHz
BPF
CC_COEX_SW_OUT
BLE
CCxxxx
Coex IO
CC_COEX_BLE_IN
RF
BLE Ant.
图10-4. Dual Antenna Coexistence Solution with 5 GHz Wi-Fi®
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10.1.2 Antenna Selection
The CC3135 device is designed to also support antenna selection and is controlled from Image Creator. When
enabled, there are 3 options possible options:
• ANT 1: When selected, the GPIOs that are defined for antenna selection with set the RF path for antenna 1.
• ANT 2: When selected, the GPIOs that are defined for antenna selection will set the RF path for antenna 2.
• Autoselect: When selected, during a scan and prior to connecting to an AP, CC3135 device will determine the
best RF path and select the appropriate antenna 12 13. The result is the saved as port of the profile.
图10-5 shows the implementation of a complete Bluetooth® low energy and WLAN coexistence network with the
WLAN operating on either a 2.4- or a 5 GHz band with antenna selection. The SOP lines control the 5 GHz
switch. The Coex switch is controlled by a GPIO signal from the BLE device and a GPIO signal from the CC3135
device. The Antenna switch is controlled by 2 GPIO lines from the CC3135 device.
A_TX
Dual Band Ant. 1
5 GHz SPDT RF
SWITCH
A_RX
5 GHz
BPF
SOP0
SOP1
WLAN
CC3135
2.4 / 5 GHz
Diplexer
Antenna Selection
SPDT RF Switch
RF_BG
2.4 GHz
BPF
CC_COEX_SW_OUT
Coex SPDT RF
SWITCH
Dual Band Ant. 2
BLE
CCxxxx
CC_COEX_BLE_IN
ANT_SEL_1 ANT_SEL_2
Coex IO
RF
图10-5. Antenna Selection Solution with Coexistence Solution and 5 GHz Wi-Fi®
12
13
When selecting Autoselect via the API, a reset is required in order for the CC3135 device to determine the best antenna for use.
Refer to the UniFlash CC31xx, CC32xx SimpleLink™ Wi-Fi® and Internet-on-a chip™ Solution ImageCreator and Programming Tool
User's Guide for more information.
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图 10-6 shows the antenna selection implementation for Wi-Fi®, with BLE operating on it's own antenna. The
SOP lines control the 5 GHz switch. Note in this implementation no Coex switch is required and only a single
GPIO from the BLE device to the CC3135 device is required. The Antenna switch is controlled by 2 GPIO lines
from the CC3135 device.
A_TX
5 GHz SPDT RF
SWITCH
Dual Band Ant. 1
A_RX
5 GHz
BPF
SOP0
SOP1
WLAN
CC3135
2.4 / 5 GHz
Diplexer
Antenna Selection
SPDT RF Switch
RF_BG
2.4 GHz
BPF
CC_COEX_SW_OUT
CC_COEX_BLE_IN
BLE
CCxxxx
RF
Dual Band Ant. 2
Coex IO
ANT_SEL_1
ANT_SEL_2
BLE Ant.
图10-6. Coexistence Solution with Wi-Fi Antenna Selection and Dedicated BLE Antenna
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10.1.3 Typical Application
图 10-7 shows the schematic of the engine area for the CC3135 device in the wide-voltage mode of operation, with the corresponding bill of materials
show in 表 10-1. 图 10-8 provides the schematic for the RF implementation with and without BLE/2.4 GHz coexistence, with the corresponding bill of
materials shown in 表10-2. For a full operation reference design, see the CC3135 SimpleLink™ WI-Fi® BoosterPack™ Design Files.
Optional:
Consider adding extra decoupling
capacitorsif the battery cannot source
the peakcurrents.
RF_BG
VBAT_CC
VBAT_CC
VBAT_CC
See Figure 7.8 For
RF Configuration Options
A_RX
A_TX
C1
100µF
C2
100µF
VBAT_CC
R1
GND
GND
U1
10k
8
VCC
C4
0.6pF
C5
4.7uF
C6
4.7uF
C7
0.5pF
C3
4.7uF
C8
0.1µF
C9
0.1µF
1
6
5
2
3
7
CS
SCLK
C10
0.1µF
U2
VIN_IO1
VIN_IO2
SI/SIO0
SO/SIO1
WP/SIO2
RESET/SIO3
GND
GND
GND
GND
GND
100k
R2
GND
GND
VBAT_CC
10
54
44
39
37
31
27
28
RF_BG
A_RX
A_TX
4
GND
GND
VIN_DCDC_DIG
VIN_DCDC_PA
VIN_DCDC_ANA
MX25R1635FM1IL0
SFL_CLK
SFL_CS
SFL_MISO
SFL_MOSI
11
14
13
12
FLASH_SPI_CLK
FLASH_SPI_CS
R3 R4
100k 100k
GND
R5
100k
R6
100k
VDD_ANA
L1
2.2uH
38
48
36
25
DCDC_ANA_SW
VDD_ANA1
LDO_IN1
FLASH_SPI_MISO
FLASH_SPI_MOSI
C11
10uF
C12
0.1µF
CC_UART1_CTS
CC_UART1_RTS
CC_UART1_TX
CC_UART1_RX
GND GND
61
50
55
57
LDO_IN2
UART1_nCTS
UART1_nRTS
UART1_TX
CC_UART1_CTS
CC_UART1_RTS
CC_UART1_TX
CC_UART1_RX
C13
0.2pF
C14
0.1uF
C15
0.6pF
L2
1uH
Flash Programming /
Host Control
40
41
42
33
DCDC_PA_SW_P
DCDC_PA_SW_N
DCDC_PA_OUT
VDD_PA_IN
UART1_RX
GND
GND
VDD_PA
L3
CC_WLRS232_TX
CC_WLRS232_RX
CC_WL_UART_TX
CC_NWP_UART_TX
TP1
TP2
TP3
TP4
58
59
60
62
TEST_58
TEST_59
TEST_60
TEST_62
R7
100k
GND
GND
GND
2.2uH
R7 is needed only if
UARTis usedas the
host interface
43
9
DCDC_DIG_SW
VDD_DIG1
VDD_DIG2
VDD_DIG
C16
22uF
C17
22uF
C18
1µF
56
1
DIO10
DIO12
DIO13
DIO23
DIO24
DIO28
DIO29
DIO31
DIO30
DIO8
P1_DIO_10
P3_DIO_12
P4_DIO_13
P16_DIO_23
P17_DIO_24
P18_DIO_28
P20_DIO_29
P45_DIO_31
P53_DIO_30
P63_DIO_8
P64_DIO_9
C19
10uF
C20
0.1µF
C21
0.1µF
GND
47
49
24
3
VDD_ANA2
VDD_RAM
VDD_PLL
VBAT_CC
4
GND
GND
GND
16
17
18
20
45
53
63
64
C22
0.1µF
C23
0.1uF
GND
GND
GND
35
34
21
SOP0
SOP1
SOP2/TCXO_EN
C24
10uF
GND
GND
32
52
51
23
22
nRESET
DIO9
CC_SPI_CLK
CC_SPI_CS
CC_SPI_DOUT
CC_SPI_DIN
CC_IRQ
5
RTC_XTAL_N
RTC_XTAL_P
WLAN_XTAL_P
WLAN_XTAL_N
HOST_SPI_CLK
HOST_SPI_nCS
HOST_SPI_MISO
HOST_SPI_MOSI
HOST_INTR
CC_SPI_CLK
CC_SPI_CS
CC_SPI_DOUT
CC_SPI_DIN
CC_IRQ
GND
HOST INTERFACE
8
VBAT_CC
7
6
(Ensure that nHIBline does
not float at anytime.)
C25
0.6pF
15
2
CC_nHIB
nHIB
CC_nHIB
VBAT_CC
19
Reserved
GND
R8
270
R9
69.8k
R10
69.8k
R11
100k
R12
100k
R13
100k
R14
100k
29
30
65
Y1
GND
GND
GND
2
1
26
46
NC
NC
SOP0
SOP1
CC_nRESET
SOP2
32.768kHz
C26
0.01µF
CC3135RNM2RGKR
C27
10pF
C28
10pF
GND
GND
GND
GND
GND
C29
6.2pF
C30
6.2pF
Y2
40MHz
GND
J1
J2
J3
R15
100k
R16
69.8k
R17
69.8k
GND
GND
GND
GND
GND
GND
图10-7. CC3135 Engine Area
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表10-1. Bill of Materials for CC3135 Engine Area
Quantity
Designator
Value
Manufacturer
Part Number
Description
CAP, CERM, 100 µF, 10 V,
2
3
3
1
6
1
3
1
2
2
1
2
C1, C2
100 µF
4.7 µF
0.6 pF
0.5 pF
0.1 µF
Taiyo Yuden
LMK325ABJ107MMHT
+/- 20%, X5R, AEC-Q200 Grade 3, 1210
CAP, CERM, 4.7 uF, 6.3 V,
+/- 20%, X6S, 0402
C3, C5, C6
C4, C15, C25
C7
Taiyo Yuden
MuRata
JMK105BC6475MV-F
GJM0335C1ER60BB01D
GJM0335C1ER50BB01D
CL05B104KO5NNNC
0402B103K500CT
CAP, CERM, 0.6pF, 25 V,
+/- 16%, C0G/NP0, 0201
CAP, CERM, 0.5 pF, 25 V,
+/- 20%, C0G/NP0, 0201
Murata
C8, C9, C10, C12, C21,
C22
CAP, CERM, 0.1 µF, 16 V,
+/- 10%, X7R, 0402
Walsin
CAP, CERM, 0.01 µF, 50 V,
+/- 10%, X7R, 0402
C26
0.01 µF
10 µF
0.2 pF
0.1 µF
22 µF
1 µF
Walsin
CAP, CERM, 10 uF, 10 V,
+/- 20%, X6S, 0603
C11, C19, C24
C13
Taiyo Yuden
MuRata
LMK107BC6106MA-T
GJM0335C1ER20BB01D
CL03A104KP3NNNC
GRM188C80G226ME15J
CL05A105MP5NNNC
0402N100J500CT
CAP, CERM, 0.2pF, 25 V,
+/- 50%, C0G/NP0, 0201
CAP, CERM, 0.1 uF, 10 V,
+/- 10%, X5R, 0201
C14, C23
C16, C17
C18
Samsung Electro-Mechanics
MuRata
CAP, CERM, 22 uF, 4 V,
+/- 20%, X6S, 0603
CAP, CERM, 1 µF, 10 V,
+/- 20%, X5R, 0402
Walsin
CAP, CERM, 10 pF, 50 V,
+/- 5%, C0G/NP0, 0402
C27, C28
10 pF
6.2 pF
Walsin
CAP, CERM, 6.2 pF, 50 V,
+/- 4%, C0G/NP0, 0402
2
3
2
C29, C30
J1, J2, J3
L1, L3
Walsin
0402N6R2C500CT
61300311121
Wurth Elektronik
MuRata
Header, 2.54 mm, 3x1, Gold, TH
Inductor, Multilayer, Ferrite, 2.2 uH, 1.2 A, 0.11
ohm, SMD
2.2 µH
1 µH
LQM2MPN2R2NG0
Inductor, Multilayer, Ferrite, 1 uH, 1.6 A, 0.055
ohm, SMD
1
L2
MuRata
LQM2HPN1R0MG0L
CRCW040210K0JNED
CRCW0402100KJNED
RES, 10 k, 5%, 0.063 W, AEC-Q200 Grade 0,
0402
1
R1
Vishay-Dale
Vishay-Dale
R2, R3, R4, R5, R6, R7,
R11, R13, R14, R15
RES, 100 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
10
100k
RES, 270, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
1
1
R8
270
Vishay-Dale
CRCW0402270RJNED
RC0201JR-07100KL
R12
100k
Yageo America
RES, 100 k, 5%, 0.05 W, 0201
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表10-1. Bill of Materials for CC3135 Engine Area (continued)
Quantity
Designator
Value
Manufacturer
Part Number
Description
RES, 69.8 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402
4
R9, R10, R16, R17
69.8k
Vishay-Dale
CRCW040269K8FKED
Ultra low power, 32M-bit
1
1
U1
U2
Macronix International Co., LTD MX25R3235FM1IL0
[x 1/x 2/x 4] CMOS MXSMIO (serial multi I/O)
Flash memory, SOP-8
SimpleLink Wi-Fi, Dual-Band Network Processor,
RGK0064B
(VQFN-64)
Texas Instruments
CC3135RNMRGKR
1
1
Y1
Y2
Abracon Corporation
TXC Corporation
ABS07-32.768KHZ-9-T
8Y40072002
Crystal, 32.768 kHz, 9PF, SMD
Crystal, 40 MHz, 8 pF, SMD
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Fine tuning of DC blocking capacitor
values for C31, C32, and C33 may be
required for optimal performance.
U3
C31
1
3
2
6
4
5
RF1
VC1
VC2
RFC
RF_BLE
C32
68pF
RF2
C33
68pF
GND
R18
100k
C34
100pF
R19
100k
C35
100pF
68pF
RTC6608OSP
Circuit configuration for BLE/2.4-GHz
COEX only. Iff eature is not being used
GND these components are not required.
GND
GND
GND
GND
A DC blocking capacitor is required. If
the antenna match contains a series
capacitor, this is sufficient to meet the
requirement and thus C36 is not
required.
E1
FL1
Antenna match. Pi
network might be
required depending on
type of antenna.
1
3
IN
OUT
RF_BG
2
4
GND
GND
U4
C36
C37
1
5
LBP
CP
DEA202450BT-1294C1-H
8.2pF
2.2pF
3
2
4
6
HBP
GND
GND
GND
L4
3.9nH
GND
DPX165950DT-8148A1
U5
2
FL2
IN
C38
C39
GND
5
4
6
1
3
2
GND
RF2
RF1
RFC
VC2
VC1
OUT
GND
C40
1.6pF
1.9pF
3
1
A_RX
A_TX
GND
GND
GND
C41
4.7pF
L5
2.7nH
DEA165538BT-2236B1-H
4.7pF
GND
RTC6608OSP
GND
GND
SOP0
SOP1
C42
100pF
C43
100pF
GND
GND
图10-8. CC3135 RF Schematic Implementation With and Without Coexistence
Note
The Following guidelines are recommended for implementation of the RF design:
• Ensure an RF path is designed with an impedance of 50 Ω
• Tuning of the antenna impedance πmatching network is recommended after manufacturing of the PCB to account for PCB parasitics
• πor L matching and tuning may be required between cascaded passive components on the RF path
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表10-2. Bill of Materials For CC3135 RF Section
Quantity
Designator
Value
Manufacturer
Part Number
Description
3
C31(1), C32(1), C33(1)
68 pF
Murata
Yageo
Walsin
GRM0335C1H680JA1D
CAP, CERM, 68 pF, 50 V, +/- 5%, C0G/NP0, 0201
CAP, CERM, 100 pF, 25 V, +/- 5%, C0G/NP0,
0201
4
1
1
1
1
C34(1), C35(1), C42, C43
100 pF
8.2 pF
2.2 pF
1.6 pF
1.9 pF
4.7 pF
CC0201JRNPO8BN101
0402N8R2C500CT
C36
C37
C38
C39
CAP, CERM, 8.2 pF, 50 V, +/- 3%, C0G/NP0, 0402
CAP, CERM, 2.2 pF, 50 V, +/- 4.5%, C0G/NP0,
0402
MuRata
MuRata
MuRata
GJM1555C1H2R2BB01D
GRM0335C1H1R6BA01D
GJM1555C1H1R9WB01D
CAP, CERM, 1.6 pF, 50 V, +/- 7%, C0G/NP0, 0201
CAP, CERM, 1.9 pF, 50 V, +/- 2.6%, C0G/NP0,
0402
2
1
C40, C41
E1
MuRata
GRM0335C1H4R7BA01D
M830520
CAP, CERM, 4.7 pF, 50 V, +/- 3%, C0G/NP0, 0201
WLAN ANTENNA 802.11, SMD
Ethertronics
Multilayer Chip Band Pass Filter For 2.4GHz W-
LAN/Bluetooth, SMD
1
1
1
FL1
FL2
L4
TDK
DEA202450BT-1294C1-H
DEA165538BT-2236B1-H
LQG15HS3N9S02D
Multilayer Band Pass Filter For 5GHz W-LAN/LTE-
U
TDK
Inductor, Multilayer, Air Core,
3.9 nH, 0.75 A, 0.14 ohm, SMD
3.9 nH
2.7 nH
100k
MuRata
Inductor, Multilayer, Air Core,
2.7 nH, 0.9 A, 0.07 ohm, AEC-Q200 Grade 1,
SMD
1
L5
MuRata
LQG15WH2N7C02D
RES, 100 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
2
2
1
R18(1), R19(1)
U3(1), U5
U4
Vishay-Dale
Richwave
TDK
CRCW0402100KJNED
RTC6608OSP
0.03 GHz-6 GHz SPDT Switch
Multilayer Diplexer for 2.4 GHz
W-LAN & Bluetooth / 5 GHz W-LAN
DPX165950DT-8148A1
(1) If the BLE/2.4 GHz Coexistence features is not used, these components are not required.
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10.2 PCB Layout Guidelines
This section details the PCB guidelines to speed up the PCB design using the CC3135 VQFN device. Follow
these guidelines ensures that the design will minimize the risk with regulatory certifications including FCC, ETSI,
and CE. For more information, see CC3135 and CC3235 SimpleLink™ Wi-Fi® and IoT Solution Layout
Guidelines.
10.2.1 General PCB Guidelines
Use the following PCB guidelines:
• Verify the recommended PCB stackup in the PCB design guidelines, as well as the recommended layers for
signals and ground.
• Ensure that the VQFN PCB footprint follows the information in .
• Ensure that the VQFN PCB GND and solder paste follow the recommendations provided in CC3135 and
CC3235 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines.
• Decoupling capacitors must be as close as possible to the VQFN device.
10.2.2 Power Layout and Routing
Three critical DC/DC converters must be considered for the CC3135 device.
• Analog DC/DC converter
• PA DC/DC converter
• Digital DC/DC converter
Each converter requires an external inductor and capacitor that must be laid out with care. DC current loops are
formed when laying out the power components.
10.2.2.1 Design Considerations
The following design guidelines must be followed when laying out the CC3135 device:
• Ground returns of the input decoupling capacitors (C12, C14, and C21) should be routed on Layer 2 using
thick traces to isolate the RF ground from the noisy supply ground. This step is also required to meet the
IEEE spectral mask specifications.
• Maintain the thickness of power traces to be greater than 12 mils. Take special consideration for power
amplifier supply lines (pin 33, 40, 41, and 42), and all input supply pins (pin 37, 39, and 44).
• Ensure the shortest grounding loop for the PLL supply decoupling capacitor (pin 24).
• Place all decoupling capacitors as close to the respective pins as possible.
• Power budget—the CC3135 device can consume up to 450 mA for 3.3 V, 670 mA for 2.1 V, for
24 ms during the calibration cycle.
• Ensure the power supply is designed to source this current without any issues. The complete calibration (TX
and RX) can take up to 17 mJ of energy from the battery over a time of 24 ms.
• The CC3135 device contains many high-current input pins. Ensure the trace feeding these pins can handle
the following currents:
– VIN_DCDC_PA input (pin 39) maximum 1 A
– VIN_DCDC_ANA input (pin 37) maximum 600 mA
– VIN_DCDC_DIG input (pin 44) maximum 500 mA
– DCDC_PA_SW_P (pin 40) and DCDC_PA_SW_N (pin 41) switching nodes maximum 1 A
– DCDC_PA_OUT output node (pin 42) maximum 1 A
– DCDC_ANA_SW switching node (pin 38) maximum 600 mA
– DCDC_DIG_SW switching node (pin 43) maximum 500 mA
– VDD_PA_IN supply (pin 33) maximum 500 mA
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图10-9 shows the ground routing for the input decoupling capacitors.
图10-9. Ground Routing for Input Decoupling Capacitors
Note
The ground returns for the input capacitors are routed on layer two to reduce the EMI and improve the
spectral mask. This routing must be strictly followed because it is critical for the overall performance of
the device.
Pin 37
Ground
Traces
Pin 37
Pin 37
图10-10. Ground Returns for Input Capacitors
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10.2.3 Clock Interface Guidelines
The following guidelines are for the slow clock:
• The 32.768-kHz crystal must be placed close to the VQFN package.
• Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within
±150 ppm.
• The ground plane on layer two is solid below the trace lanes, and there is ground around these traces on the
top layer.
The following guidelines are for the fast clock:
• The 40-MHz crystal must be placed close to the VQFN package.
• Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within
±10 ppm at room temperature. The total frequency across parts, temperature, and with aging must be ±20
ppm to meet the WLAN specification.
• To avoid noise degradation, ensure that no high-frequency lines are routed close to the routing of the crystal
pins.
• Ensure that crystal tuning capacitors are close to the crystal pads.
• Both traces (XTAL_N and XTAL_P) should be as close as possible to parallel and approximately the same
length.
• The ground plane on layer two is solid below the trace lines, and there should be ground around these traces
on the top layer.
• For frequency tuning, see CC31xx & CC32xx Frequency Tuning.
10.2.4 Digital Input and Output Guidelines
The following guidelines are for the digital I/Os:
• Route SPI and UART lines away from any RF traces.
• Keep the length of the high-speed lines as short as possible to avoid transmission line effects.
• Keep the line lower than 1/10 of the rise time of the signal to ignore transmission line effects (required if the
traces cannot be kept short). Place the resistor at the source end closer to the device that is driving the
signal.
• Add a series-terminating resistor for each high-speed line (for example, SPI_CLK or SPI_DATA) to match the
driver impedance to the line. Typical terminating-resistor values range from 27 to 36 Ωfor a 50-Ωline
impedance.
• Route high-speed lines with a continuous ground reference plane below it to offer good impedance
throughout. This routing also helps shield the trace against EMI.
• Avoid stubs on high-speed lines to minimize the reflections. If the line must be routed to multiple locations,
use a separate line driver for each line.
• If the lines are longer compared to the rise time, add series-terminating resistors near the driver for each
high-speed line to match the driver impedance to the line. Typical terminating-resistor values range from 27 to
36 Ωfor a 50-Ωline impedance.
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10.2.5 RF Interface Guidelines
The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna
design guides (including placement of the antenna). Also see CC3135 and CC3235 SimpleLink™ Wi-Fi® and IoT
Solution Layout Guidelines for general antenna guidelines.
• Ensure that the antenna is matched for 50-Ω. A π-matching network is recommended. Ensure that the π
pad is available for tuning the matching network after PCB manufacture.
• A DC blocking capacitor is required before the antenna. If the antenna matching network contains a series
capacitor, this is sufficient to meet the requirement.
• Ensure that the area underneath the BPFs pads have a solid plane on layer 2 and that the minimum filter
requirements are met.
• Ensure that the area underneath the RF switch pads have a solid plane on layer 2 and that the minimum
switch isolation requirements are met.
• Ensure that the area underneath the diplexer pads have a solid plane on layer 2 and that the minimum
diplexer requirements are met.
• Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
• The RF trace bends must be made with gradual curves. Avoid 90-degree bends.
• The RF traces must not have sharp corners.
• There must be no traces or ground under the antenna section.
• The RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• For optimal antenna performance, ensure adequate ground plane around the antenna on all layers.
• Ensure RF connectors for conducted testing are isolated from the top layer ground using vias.
• Maintain a controlled pad to trace shapes using filleted edges if necessary to avoid mismatch.
• Diplexers, switches, BPF, and other elements on the RF route should be isolated from the top layer ground
using vias.
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11 Device and Documentation Support
11.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
11.2 Tools and Software
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed in this section.
For the most up-to-date list of development tools and software, see the CC3135 Tools & Software product page.
Users can also click the "Alert Me" button on the top right corner of the CC3135 Tools & Software page to stay
informed about updates related to the CC3135 device.
Development Tools
SimpleLink™ Wi-Fi®
Starter Pro
CC3235x.
The supported devices are: CC3100, CC3200, CC3120R, CC3220x, CC3135, and
The SimpleLink™ Wi-Fi® Starter Pro mobile App is a new mobile application for
SimpleLink™ provisioning. The app goes along with the embedded provisioning library
and example that runs on the device side (see SimpleLink™ Wi-Fi® SDK plugin and TI
SimpleLink™ CC32XX Software Development Kit (SDK)). The new provisioning release
is a TI recommendation for Wi-Fi provisioning using SimpleLink™ Wi-Fi® products. The
provisioning release implements advanced AP mode and SmartConfig™ technology
provisioning with feedback and fallback options to ensure successful process has been
accomplished. Customers can use both embedded library and the mobile library for
integration to their end products.
SimpleLink™ Wi-Fi®
SDK plugin
The CC3135 device is supported.
The CC3135 SDK contains drivers, many sample applications for Wi-Fi® features and
internet, and documentation needed to use the CC3135 Internet-on-a chip™ solution.
This SDK can be used with TI’s MSP432P401R LaunchPad™, or SimpleLink™
Studio, a PC tool that allows MCU development with the CC3135 device. You can also
use the SDK as example code for any platform. All sample applications in the SDK are
supported on TI’s MSP432P401R ultra-low power MCUs with Code Composer Studio
™ IDE and TI RTOS. In addition, many of the applications support IAR.
SimpleLink™ Studio
for CC31xx
The CC31xx device is supported.
SimpleLink™ Studio for CC31xx is a Windows®-based software tool used to aid in the
development of embedded networking applications and software for microcontrollers.
Using SimpleLink™ Studio for CC31xx, embedded software developers can develop
and test applications using any desktop IDE, such as Visual Studio or Eclipse, and
connect their applications to the cloud using the CC31xx BoosterPack™ Plug-in
Module. The application can then be easily ported to any microcontroller. With the
SimpleLink™ Wi-Fi® CC31xx solution, customers now have the flexibility to add Wi-Fi®
to any microcontroller (MCU). This Internet-on-a-chip solution contains all you need to
easily create IoT solutions: security, quick connection, cloud support, and more. For
more information on CC31xx devices, visit SimpleLink™ Wi-Fi® solutions.
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SimpleLink™ Wi-Fi®
Radio Testing Tool
The supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135 and
CC3235x.
The SimpleLink™ Wi-Fi® Radio Testing Tool is a Windows-based software tool for RF
evaluation and testing of SimpleLink™ Wi-Fi® CC3x20 and CC3x35 designs during
development and certification. The tool enables low-level radio testing capabilities by
manually setting the radio into transmit or receive modes. Using the tool requires
familiarity and knowledge of radio circuit theory and radio test methods.
Created for the internet-of-things (IoT), the SimpleLink™ Wi-Fi® CC31xx and CC32xx
family of devices include on-chip Wi-Fi®, Internet, and robust security protocols with no
prior Wi-Fi® experience needed for faster development. For more information on these
devices, visit SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.
UniFlash Standalone
Flash Tool for TI
Microcontrollers
CCS UniFlash is a standalone tool used to program on-chip flash memory on TI MCUs
and on-board flash memory for Sitara™ processors. UniFlash has a GUI, command
line, and scripting interface. CCS UniFlash is available free of charge.
(MCU), Sitara™
Processors and
SimpleLink™ Devices
TI Designs and Reference Designs
The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded
processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs
include schematic or block diagrams, BOMs, and design files to speed your time to market.
11.3 Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes,
TI recommends that the user has the latest service pack in their module for production.
To stay informed, click the SDK “Alert me” button the top right corner of the product page, or visit SimpleLink
™ Wi-Fi® SDK plugin.
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11.4 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3135 device and support tools (see 图11-1).
X
CC
3
1
3
5
R
xx
xxx
x
PREFIX
X = Preproduction device
Null = Production device
PACKAGING
R = Large Reel
DEVICE FAMILY
CC = Wireless Connectivity
PACKAGE
RGK = 9 mm × 9 mm VQFN
SERIES NUMBER
3 = Wi-Fi Centric
MEMORY SIZE
NM = No Memory
MCU / HOST
1 = No MCU
2 = MCU
DEVICE VARIANTS
R = Default
DEVICE GENERATION
0 = Gen 1
2 = Gen 2
3 = Gen 3
FREQUENCY BAND
0 = 2.4 GHz only
5 = 2.4 GHz and 5 GHz supported
图11-1. CC3135 Device Nomenclature
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11.5 Documentation Support
To receive notification of documentation updates—including silicon errata—go to the product folder for your
device on ti.com (CC3135). In the upper right corner, click the "Alert me" button. This registers you to receive a
weekly digest of product information that has changed (if any). For change details, check the revision history of
any revised document. The current documentation that describes the processor, related peripherals, and other
technical collateral follows.
The following documents provide support for the CC3135 device.
Application Reports
CC3135 and CC3235 SimpleLink ™ CC3135 and CC3235 SimpleLink Wi-Fi Embedded Programming User
Wi-Fi® Embedded Programming User Guide
Guide
SimpleLink™ CC3135, CC3235 Wi-Fi® This application report describes the best practices for power
Internet-on-a chip™ Networking Sub- management and extended battery life for embedded low-power Wi-Fi
System Power Management
devices such as the SimpleLink Wi-Fi Internet-on-a chip solution from
Texas Instruments.
SimpleLink™ CC31xx, CC32xx Wi-Fi® The SimpleLink Wi-Fi CC31xx and CC32xx Internet-on-a chip family of
Internet-on-a chip™ Solution Built-In devices from Texas Instruments offer a wide range of built-in security
Security Features
features to help developers address a variety of security needs, which
is achieved without any processing burden on the main microcontroller
(MCU). This document describes these security-related features and
provides recommendations for leveraging each in the context of
practical system implementation.
SimpleLink™ CC3135, CC3235 Wi-Fi® This document describes the OTA library for the SimpleLink Wi-Fi
and Internet-of-Things Over-the-Air CC3x35 family of devices from Texas Instruments and explains how to
Update
prepare a new cloud-ready update to be downloaded by the OTA
library.
SimpleLink™ CC3135, CC3235 Wi-Fi® This guide describes the provisioning process, which provides the
Internet-on-a chip™ Solution Device SimpleLink Wi-Fi device with the information (network name, password,
Provisioning
and so forth) needed to connect to a wireless network.
Transfer of TI's Wi-Fi® Alliance This document explains how to employ the Wi-Fi® Alliance (WFA)
Certifications to Products Based on derivative certification transfer policy to transfer a WFA certification,
SimpleLink™
already obtained by Texas Instruments, to a system you have
developed.
Using Serial Flash on SimpleLink™ This application note is divided into two parts. The first part provides
CC3135 and CC3235 Wi-Fi® and important guidelines and best- practice design techniques to consider
Internet-of-Things Devices
when choosing and embedding a serial Flash paired with the CC3135
and CC3235 (CC3x35) devices. The second part describes the file
system, along with guidelines and considerations for system designers
working with the CC3x35 devices.
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User's Guides
SimpleLink ™
Internet-of-Things CC31xx and knowledge for working with the networking subsystem of the SimpleLink Wi-Fi
Wi-Fi® and This document provides software (SW) programmers with all of the required
CC32xx Network Processor
devices. This guide provides basic guidelines for writing robust, optimized
networking host applications, and describes the capabilities of the networking
subsystem. The guide contains some example code snapshots, to give users
an idea of how to work with the host driver. More comprehensive code
examples can be found in the formal software development kit (SDK). This
guide does not provide a detailed description of the host driver APIs.
SimpleLink™ Wi-Fi® CC3135 This document provides the design guidelines of the 4-layer PCB used for the
and CC3235 and IoT Solution CC3135 and CC3235 SimpleLink Wi-Fi family of devices from Texas
Layout Guidelines
Instruments. The CC3135 and CC3235 devices are easy to lay out and are
available in quad flat no-leads (QFNS) packages. When designing the board,
follow the suggestions in this document to optimize performance of the board.
SimpleLink™ Wi-Fi® CC3135 The SimpleLink Wi-Fi CC3135 wireless network processor from Texas
BoosterPack ™ Development Instruments™ provides users the flexibility to add Wi-Fi to any MCU. This
Kit (BOOSTXL-CC3135)
user's guide explains the various configurations of the CC3135 BoosterPack™
Plug-In Module.
SimpleLink ™
Wi-Fi® and The Radio Tool serves as a control panel for direct access to the radio, and can
Internet-on-a chip™ CC3135 be used for both the radio frequency (RF) evaluation and for certification
and CC3235 Solution Radio purposes. This guide describes how to have the tool work seamlessly on Texas
Tool
Instruments evaluation platforms such as the BoosterPack plus FTDI emulation
board for CC3235 devices, and the LaunchPad for CC3235 devices.
SimpleLink™ Wi-Fi® CC3135
and CC3235 Provisioning for
Mobile Applications
This guide describes TI’s SimpleLink Wi-Fi provisioning solution for mobile
applications, specifically on the usage of the Android™ and IOS® building
blocks for UI requirements, networking, and provisioning APIs required for
building the mobile application.
More Literature
CC3x35 SimpleLink™ Wi-Fi® Hardware Design Checklist
CC3135 SimpleLink™ WI-Fi® BoosterPack™ Design Files
11.6 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.7 Trademarks
WPA3™, WPA™, WPA2™, are trademarks of Wi-Fi Alliance.
SimpleLink™, Internet-on-a chip™, Texas Instruments™, SmartConfig™, LaunchPad™, Code Composer Studio™,
BoosterPack™, Sitara™, and TI E2E™ are trademarks of Texas Instruments.
Android™ is a trademark of Google LLC.
Wi-Fi®, Wi-Fi 联盟®, and Wi-Fi Direct® are registered trademarks of Wi-Fi Alliance.
Arm® and Cortex® are registered trademarks of Arm Limited.
Windows® is a registered trademark of Microsoft Inc.
IOS® is a registered trademark of Cisco.
所有商标均为其各自所有者的财产。
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11.8 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.9 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as
defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled
product restricted by other applicable national regulations, received from disclosing party under nondisclosure
obligations (if any), or any direct product of such technology, to any destination to which such export or re-export
is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.
Department of Commerce and other competent Government authorities to the extent required by those laws.
11.10 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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12 Mechanical, Packaging, and Orderable Information
12.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12.2 Package Option Addendum
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CC3135
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ZHCSJU5B –FEBRUARY 2019 –REVISED MAY 2021
12.2.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Orderable Device
Status (1)
Pins
Eco Plan (2) Lead/Ball Finish(3)
MSL Peak Temp (4)
Op Temp (°C)
Device Marking(5) (6)
Green (RoHS CU NIPDAU | CU
CC3135RNMRGKR
ACTIVE
VQFN
RGK
64
2500
Level-3-260C-168 HR
-40 to 85
CC3135RNM
& no Sb/Br)
NIPDAUAG
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material)
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
(6) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain
information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2022 Texas Instruments Incorporated
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Product Folder Links: CC3135
CC3135
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ZHCSJU5B –FEBRUARY 2019 –REVISED MAY 2021
12.2.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
CC3135RNMRGKR
VQFN
RGK
64
2500
330.0
16.4
9.3
9.3
1.1
1.1 12.0
16.0
Q2
Copyright © 2022 Texas Instruments Incorporated
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CC3135
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ZHCSJU5B –FEBRUARY 2019 –REVISED MAY 2021
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
VQFN
Package Drawing Pins
RGK 64
SPQ
Length (mm) Width (mm)
367.0 367.0
Height (mm)
CC3135RNMRGKR
2500
38.0
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Product Folder Links: CC3135
重要声明和免责声明
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务,TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
CC3135RNMRGKR
ACTIVE
VQFN
RGK
64
2500 RoHS & Green NIPDAU | NIPDAUAG Level-3-260C-168 HR
-40 to 85
CC3135R
NM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
RGK0064B
VQFN - 1 mm max height
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
9.1
8.9
A
B
PIN 1 INDEX AREA
9.1
8.9
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
2X 7.5
6.3 0.1
SYMM
(0.2) TYP
17
32
16
33
EXPOSED
THERMAL PAD
SYMM
65
2X 7.5
0.30
64X
1
48
60X 0.5
PIN 1 ID
0.18
64
49
0.1
C A B
0.5
0.3
0.05
64X
4222201/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
6.3)
SEE SOLDER MASK
DETAIL
SYMM
64X (0.6)
64
49
64X (0.24)
1
48
60X (0.5)
8X (1.1)
(R0.05) TYP
18X (1.2)
(0.6) TYP
SYMM
65
(8.8)
(
0.2) TYP
VIA
16
33
17
32
(0.6) TYP
18X (1.2)
8X
(1.1)
(8.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222201/B 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
64
(1.2) TYP
49
64X (0.6)
64X (0.24)
1
48
60X (0.5)
(R0.05) TYP
(1.2) TYP
65
SYMM
(8.8)
16
33
METAL
TYP
17
32
SYMM
(8.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 65
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4222201/B 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022,德州仪器 (TI) 公司
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