CC3235S [TI]
具有 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU;型号: | CC3235S |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU 无线 |
文件: | 总106页 (文件大小:3709K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CC3235S, CC3235SF
ZHCSJC1D –APRIL 2019 –REVISED MAY 2021
CC3235S 和CC3235SF SimpleLink™ Wi-Fi® 双频带单芯片解决方案
• 多层安全特性:
– 独立执行环境
1 特性
• 多核心架构,片上系统(SoC)
• 802.11 a/b/g/n:2.4GHz 和5GHz
• FIPS 140-2 1 级认证
• 多层安全特性可帮助开发人员保护身份信息、数据
和软件IP
– 网络安全
– 设备身份和密钥
– 硬件加速器加密引擎(AES、DES、SHA/MD5
和CRC)
– 应用级安全(加密、身份验证、访问控制)
– 初始安全编程
– 软件篡改检测
• 低功耗模式,适用于电池供电应用
• 与2.4GHz 无线电共存
– 安全引导
• 工业温度:–40°C 至+85°C
• 获得Wi-Fi Alliance® 的Wi-Fi CERTIFIED®
• 应用微控制器子系统:
– 证书注册请求(CSR)
– 每个设备具有唯一密钥对
• 应用吞吐量:
– UDP:16Mbps,TCP:13Mbps
– 峰值:72Mbps
• 电源管理子系统:
– ®运行频率为80MHz 的Arm® Cortex®-M4 内核
– 用户专用存储器
• 256KB RAM
• 可选的1MB 可执行闪存
– 多种外设和计时器
– 集成式直流/直流转换器支持宽电源电压范围:
• VBAT 宽电压模式:2.1 V 至3.6 V
• VIO 始终与VBAT 关联
– 27 个带灵活多路复用选项的I/O 引脚
• UART、I2S、I2C、SPI、SD、ADC,
8 位并行接口
– 高级低功耗模式:
• 关断:1µA,休眠:4.5µA
• 计时器和PWM
• Wi-Fi 网络处理器子系统:
– Wi-Fi® 内核:
• 低功耗深度睡眠(LPDS):120µA
• 空闲连接(MCU 处于LPDS 状态):710µA
• RX 流量(MCU 处于活动模式):59 mA
• TX 流量(MCU 处于活动模式):223 mA
• Wi-Fi TX 功率:
• 802.11 a/b/g/n 2.4GHz 和5GHz
• 模式:
– 接入点(AP)
– 2.4 GHz:1 DSSS 时为18.0dBm
– 5 GHz:6 OFDM 时为18.1dBm
• Wi-Fi RX 灵敏度:
– 2.4 GHz:1 DSSS 时为-96dBm
– 5 GHz:6 OFDM 时为-92dBm
• 时钟源:
– 基站(STA)
– Wi-Fi Direct®(仅在2.4GHz 受支持)
• 安全性:
– WEP
– WPA™/ WPA2™ PSK
– WPA2 企业
– WPA3™ 个人版
– WPA3™ 企业版
– 互联网和应用协议:
– 具有内部振荡器的40.0MHz 晶体
– 32.768kHz 晶体或外部RTC
• RGK 封装
– 64 引脚9mm × 9mm 极薄四方扁平无引线
(VQFN) 封装,0.5mm 间距
• 器件支持SimpleLink™ MCU 平台开发人员生态系
统
• HTTP 服务器、mDNS、DNS-SD 和DHCP
• IPv4 和IPv6 TCP/IP 堆栈
• 16 BSD 套接字(完全安全的TLS v1.2 和
SSL 3.0)
– 内置的电源管理子系统:
• 可配置的低功耗配置(始终、间歇性、标
签)
• 高级低功耗模式
• 集成式直流/直流稳压器
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SWRS215
CC3235S, CC3235SF
ZHCSJC1D –APRIL 2019 –REVISED MAY 2021
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– 电器
2 应用
– 资产跟踪
– 工厂自动化
– 医疗和保健
– 电网基础设施
• 对于物联网应用,例如:
– 楼宇和住宅自动化:
• HVAC 系统和恒温器
• 视频监控、可视门铃和低功耗摄像头
• 楼宇安全系统和电子锁
3 说明
双频带无线MCU CC3235x 器件有两种型号:CC3235S 和C3235SF。
• CC3235S 包括256KB RAM、IoT 网络安全性、器件身份和密钥以及MCU 级安全特性,例如文件系统加密、
用户IP(MCU 图像)加密、安全启动和调试安全性。
• CC3235SF 基于CC3235S 而构建,除了256KB RAM 以外,还集成了一个用户专用的1MB 可执行闪存。
使用 Wi-Fi CERTIFIED™ 无线微控制器 (MCU) 简化您的 IoT 设计。SimpleLink™ Wi-Fi® CC3235x 器件系列是一
种双频带片上系统(SoC) 解决方案,将两个处理器集成在一个芯片上,包括:
• 应用处理器:Arm® Cortex®-M4 MCU,具有用户专用的256KB RAM 和可选的1MB 可执行闪存
• 用以运行所有Wi-Fi 和互联网逻辑层的网络处理器此基于ROM 的子系统完全减轻了主机MCU 的负载,包括
一个802.11 a/b/g/n 双频带2.4GHz 和5GHz 无线电、基带和带有强大硬件加密引擎的MAC
这些器件引入了可进一步简化物联网连接的新功能。主要新特性包括:
• 802.11a (5GHz) 支持
• 与BLE/2.4GHz 无线电共存
• 天线选择
• 经过FIPS 140-2 1 级认证和其他认证,安全性更强1
• 可同时打开多达16 个安全套接字
• 证书注册请求(CSR)
• 在线证书状态协议(OCSP)
• 经过Wi-Fi® Alliance 认证的IoT 省电特性(例如DMS、代理ARP 等)
• 降低模板包传输负载的无主机模式
• 改善了快速扫描
CC3235x 器件系列是 SimpleLink™ MCU 平台的一部分,该平台是一个常见、易用的开发环境,基于一个单核软
件开发套件 (SDK),具有丰富的工具集和参考设计。E2E™ 社区支持 Wi-Fi®、低功耗 Bluetooth®、Sub-1GHz 器
件和主机MCU。关于更多信息,请访问www.ti.com.cn/simplelink 或www.ti.com.cn/simplelinkwifi。
器件信息(1)
封装尺寸(标称值)
器件型号
CC3235SM2RGKR
封装
VQFN (64)
VQFN (64)
9.00mm x 9.00mm
9.00mm x 9.00mm
CC3235SF12RGKR
(1) 有关所有可选封装,请参阅节12。
1
关于特定器件型号的具体FIPS 认证状态,请参考https://csrc.nist.gov/publications/fips。
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4 功能方框图
图4-1 显示了CC3235x SimpleLink™ Wi-Fi® 解决方案的功能方框图。
SPI
Flash
SPI
Peripheral
I2C
Peripheral
Dual band Ant.
SSPI
I2C
GSPI
VCC Wide voltage
(2.1 to 3.6V)
A_TX
A_RX
Wi-Fi RF
Switch
5 GHz
BPF
SOP0
SOP1
Diplexer /
SPDT RF
Switch
32.768 kHz
XTAL
RF_BG
CC3235x
Wi-Fi / BLE
RF Switch
2.4 GHz
BPF
BLE
DEVICE
40 MHz
XTAL
COEX_IO
Dual band Ant.
Output GPIOs
GPIO/
PWM
Parallel
Port
I2S
Miscellaneous
Peripherals
Camera
sensor
Audio
codec
注意:双信器用于信号天线解决方案。使用天线选择功能(双天线)时,需要在双信器后应用1 个SPDT 开关和2 条GPIO 线路。
图4-1. 功能方框图
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图4-2 为CC3235x 器件的硬件概览。
CC32xx Single-Chip Wireless MCU
1MB Flash (Optional)
Arm® Cortex®- M4
Processor
80 MHz
256KB RAM
ROM
1× SPI
2× UART
1× I2C
DMA
1× I2S/PCM
1× SD/MMC
Timers
GPIOs
COEX I/Os
8-Bit Camera
4× ADC
Antenna Selection
Network Processor
Power
Management
Application
Protocols
Wi-Fi® Driver
TCP/IP Stack
Oscillators
DC/DC
RTC
(Arm® Cortex®
Processor)
RAM
ROM
Synthesizer
图4-2. CC3235x 硬件概览
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图4-3 为CC3235x 器件中的嵌入式软件概览。
Customer Application
NetApp
BSD Socket
Wi-Fi®
SimpleLink™ MCU Driver APIs
Host Interface
Network Apps
WLAN Security
and Management
TCP/IP Stack
WLAN MAC and PHY
图4-3. CC3235x 嵌入式软件概览
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Table of Contents
8.16 Thermal Resistance Characteristics for RGK
1 特性................................................................................... 1
2 应用................................................................................... 2
3 说明................................................................................... 2
4 功能方框图.........................................................................3
5 Revision History.............................................................. 6
6 Device Comparison.........................................................7
6.1 Related Products........................................................ 8
7 Terminal Configuration and Functions..........................9
7.1 Pin Diagram................................................................ 9
7.2 Pin Attributes.............................................................10
7.3 Signal Descriptions................................................... 18
7.4 Pin Multiplexing.........................................................26
7.5 Drive Strength and Reset States for Analog and
Package...................................................................... 43
8.17 Timing and Switching Characteristics..................... 43
9 Detailed Description......................................................61
9.1 Overview...................................................................61
9.2 Arm® Cortex®-M4 Processor Core Subsystem.........61
9.3 Wi-Fi® Network Processor Subsystem..................... 61
9.4 Security.....................................................................64
9.5 FIPS 140-2 Level 1 Certification............................... 66
9.6 Power-Management Subsystem...............................66
9.7 Low-Power Operating Mode..................................... 66
9.8 Memory.....................................................................68
9.9 Restoring Factory Default Configuration...................71
9.10 Boot Modes.............................................................71
9.11 Hostless Mode........................................................ 72
10 Applications, Implementation, and Layout............... 74
10.1 Application Information........................................... 74
10.2 PCB Layout Guidelines...........................................86
11 Device and Documentation Support..........................90
11.1 第三方产品免责声明................................................90
11.2 Tools and Software..................................................90
11.3 Firmware Updates...................................................91
11.4 Device Nomenclature..............................................91
11.5 Documentation Support.......................................... 92
11.6 Related Links.......................................................... 94
11.7 支持资源..................................................................94
11.8 Trademarks............................................................. 94
11.9 静电放电警告...........................................................94
11.10 Export Control Notice............................................94
11.11 术语表....................................................................94
12 Mechanical, Packaging, and Orderable
Digital Multiplexed Pins............................................... 28
7.6 Pad State After Application of Power to Device,
Before Reset Release................................................. 28
7.7 Connections for Unused Pins................................... 29
8 Specifications................................................................ 30
8.1 Absolute Maximum Ratings...................................... 30
8.2 ESD Ratings............................................................. 30
8.3 Power-On Hours (POH)............................................30
8.4 Recommended Operating Conditions.......................30
8.5 Current Consumption Summary (CC3235S)............ 31
8.6 Current Consumption Summary (CC3235SF).......... 33
8.7 TX Power Control for 2.4 GHz Band.........................34
8.8 TX Power Control for 5 GHz..................................... 36
8.9 Brownout and Blackout Conditions...........................37
8.10 Electrical Characteristics for GPIO Pins................. 38
8.11 Electrical Characteristics for Pin Internal Pullup
and Pulldown...............................................................40
8.12 WLAN Receiver Characteristics..............................40
8.13 WLAN Transmitter Characteristics..........................41
8.14 WLAN Transmitter Out-of-Band Emissions.............42
8.15 BLE/2.4 GHz Radio Coexistence and WLAN
Information.................................................................... 95
12.1 Packaging Information............................................ 95
Coexistence Requirements......................................... 43
5 Revision History
Changes from May 5, 2020 to May 13, 2021 (from Revision C (May 2020) to Revision D (May
2021))
Page
• 在节1 中新增了“WPA3 企业版”.................................................................................................................... 1
• 更新了整个文档中的表格、图和交叉参考的编号格式.........................................................................................1
• Added "WPA3 personal and enterprise" to 节9.3 ............................................................................................61
• Changed footnote in 节9.3 ..............................................................................................................................61
• Added WPA3 Enterprise to 节9.3.1 .................................................................................................................62
• Added WPA3 enterprise to Wi-Fi security Feature in 表9-1 ............................................................................62
• Changed tablenote for 表9-1 .......................................................................................................................... 62
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6 Device Comparison
表6-1 lists the features supported across different CC3x35 devices.
表6-1. Comparison of Device Features
DEVICE
FEATURE
CC3135
Network processor
CC3235S
Wireless microcontroller
802.11a/b/g/n
CC3235SF
Wireless microcontroller
802.11a/b/g/n
Classification
Standard
802.11a/b/g/n
IPv4, IPv6
TCP/IP stack
Sockets
IPv4, IPv6
IPv4, IPv6
16
16
16
Package
9-mm × 9-mm VQFN
9-mm × 9-mm VQFN
9-mm × 9-mm VQFN
ON-CHIP APPLICATION MEMORY
Flash
1MB
—
—
—
RAM
256KB
256KB
RF FEATURES
Frequency
2.4 GHz, 5 GHz
Yes
2.4 GHz, 5 GHz
Yes
2.4 GHz, 5 GHz
Yes
Coexistence with BLE Radio
SECURITY FEATURES
Unique device identity
Unique device identity
Unique device identity
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Trusted root-certificate catalog
TI Root-of-trust public key
Online certificate status protocol
(OCSP)
Additional networking security
Certificate signing request (CSR)
Unique per-device key pair
Certificate signing request (CSR)
Unique per-device key pair
Certificate signing request (CSR)
Unique per-device key pair
Hardware acceleration
Secure boot
Hardware crypto engines
Hardware crypto engines
Yes
Hardware crypto engines
Yes
—
File system security
File system security
Secure key storage
Secure key storage
Enhanced application level security
FIPS 140-2 Level 1 Certification(1)
Software tamper detection
Cloning protection
Initial secure programming
Software tamper detection
Cloning protection
Initial secure programming
—
Yes
Yes
Yes
(1) For exact status of FIPS certification for a specific part number, please refer to https://csrc.nist.gov/publications/fips.
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6.1 Related Products
For information about other devices in this family of products or related products, see the links that follow.
The SimpleLink™ MCU This portfolio offers a single development environment that delivers flexible hardware,
Portfolio
software, and tool options for customers developing wired and wireless applications.
With 100 percent code reuse across host MCUs, Wi-Fi®, Bluetooth® low energy, Sub-1
GHz devices and more, choose the MCU or connectivity standard that fits your design.
A one-time investment with the SimpleLink™ software development kit (SDK) allows
you to reuse often, opening the door to create unlimited applications.
SimpleLink™ Wi-Fi®
Family
This device platform offers several Internet-on-a chip™ solutions, which address the
need of battery-operated, security-enabled products. Texas Instruments offers a single-
chip wireless microcontroller and a wireless network processor that can be paired with
any MCU, allowing developers to design new Wi-Fi® products or upgrade existing
products with Wi-Fi® capabilities.
BoosterPack™ Plug-in Extend the functionality of the TI LaunchPad™ Development Kit with the BoosterPack™
Module
Plug-in Module. The application-specific BoosterPack Plug-in Module allows you to
explore a broad range of applications, including capacitive touch, wireless sensing,
LED Lighting control, and more. Stack multiple BoosterPack Plug-in Modules onto a
single LaunchPad Development Kit to further enhance the functionality of your design.
Reference Designs for The TI Designs Reference Design Library is a robust reference design library spanning
CC3200, CC3220 and analog, embedded processor and connectivity. Created by TI experts to help you jump
CC3235 Devices
start your system design, all TI Designs include schematic or block diagrams, BOMs
and design files to speed your time to market.
The SimpleLink™ Wi- The SDK contains drivers for the CC3235 programmable MCU, sample applications,
Fi® SDK
and documentation required to start development with CC3235x solutions.
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7 Terminal Configuration and Functions
7.1 Pin Diagram
图7-1 shows pin assignments for the 64-pin VQFN package.
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
nRESET
RF_BG
GND
32
31
30
29
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
VDD_RAM
GPIO0
RTC_XTAL_P
GND
A_TX
A_RX
RTC_XTAL_N
GPIO30
28
27
VIN_IO2
26
25
24
23
22
21
20
19
18
17
NC
GPIO1
LDO_IN2
VDD_DIG2
GPIO2
GPIO3
VDD_PLL
WLAN_XTAL_P
WLAN_XTAL_N
SOP2
GPIO4
GPIO5
TMS
GPIO6
GPIO7
GPIO8
GPIO9
TCK
GPIO28
TDO
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
NC = No internal connection
图7-1. Top View Pin Assignment for 64-Pin VQFN
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7.2 Pin Attributes
The device makes extensive use of pin multiplexing to accommodate the large number of peripheral functions in
the smallest possible package. To achieve this configuration, pin multiplexing is controlled using a combination of
hardware configuration (at device reset) and register control.
Note
TI highly recommends using the Pin Mux Tool to obtain the desired pinout. In addition refer to the user
guide within the SimpleLink™ CC32XX Software Development Kit (SDK)
The board and software designers are responsible for the proper pin multiplexing configuration. Hardware does
not ensure that the proper pin multiplexing options are selected for the peripherals or interface mode used.
表 7-1 and 表 7-2 list the pin descriptions and attributes. 表 7-3 lists the signal descriptions. 表 7-4 presents an
overall view of pin multiplexing. All pin multiplexing options are configurable using the pin mux registers.
The following special considerations apply:
• All I/Os support drive strengths of 2, 4, and 6 mA. The drive strength is individually configurable for each pin.
• All I/Os support 10-µA pullup and pulldown resistors.
• The VIO and VBAT supply must be tied together at all times.
• By default, all I/Os float in the Hibernate state. However, the default state can be changed by software.
• All digital I/Os are nonfail-safe.
Note
If an external device drives a positive voltage to the signal pads and the CC3235x device is not
powered, DC is drawn from the other device. If the drive strength of the external device is adequate,
an unintentional wakeup and boot of the CC3235x device can occur. To prevent current draw, TI
recommends any one of the following conditions:
• All devices interfaced to the CC3235x device must be powered from the same power rail as the
chip.
• Use level shifters between the device and any external devices fed from other independent rails.
• The nRESET pin of the CC3235x device must be held low until the VBAT supply to the device is
driven and stable.
• All GPIO pins default to high impedance unless programmed by the MCU. The bootloader sets the
TDI, TDO, TCK, TMS, and Flash_SPI pins to mode 1. All the other pins are left in the Hi-Z state.
The ADC inputs are tolerant up to 1.8 V (see 表 8-30 for more details about the usable range of the
ADC). On the other hand, the digital pads can tolerate up to 3.6 V. Hence, take care to prevent
accidental damage to the ADC inputs. TI recommends first disabling the output buffers of the digital
I/Os corresponding to the desired ADC channel (that is, converted to Hi-Z state), and thereafter
disabling the respective pass switches (S7 [Pin 57], S8 [Pin 58], S9 [Pin 59], and S10 [Pin 60]). For
more information, see 节7.5.
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表7-1. Pin Descriptions
PINS
NAME
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
TYPE
DESCRIPTION
NO.
1
2
3
4
5
6
7
8
9
GPIO10
GPIO11
I/O
I/O
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
Internal digital core voltage
No
Yes
No
No
No
No
No
No
No
No
No
N/A
No
No
No
No
No
No
No
No
N/A
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
I/O
I/O
Yes
No
I/O
I/O
No
I/O
No
I/O
Yes
N/A
VDD_DIG1
Power
I/O power supply (same as
battery voltage)
10
11
12
13
14
15
16
VIN_IO1
Power
N/A
N/A
N/A
N/A
N/A
No
N/A
N/A
N/A
N/A
N/A
No
N/A
N/A
N/A
N/A
N/A
No
FLASH_SPI_CLK
FLASH_SPI_DOUT
FLASH_SPI_DIN
FLASH_SPI_CS
GPIO22
O
O
Serial flash interface: SPI clock
Serial flash interface: SPI data
out
I
Serial flash interface: SPI data in
Serial flash interface: SPI chip
select
O
I/O
I/O
General-purpose input or output
JTAG interface: data input
Muxed with
JTAG TDI
TDI
No
No
Muxed with
JTAG TDO
17
18
TDO
I/O
I/O
JTAG interface: data output
Yes
No
No
No
GPIO28
General-purpose input or output
No
Muxed with
JTAG/
SWD-TCK
19
TCK
TMS
I/O
I/O
JTAG / SWD interface: clock
No
No
No
No
Muxed with
JTAG/
SWD-TMSC
JTAG / SWD interface: mode
select or SWDIO
20
21(1)
22
SOP2
O
Configuration sense-on-power
40-MHz XTAL
No
No
No
WLAN_XTAL_N
Analog
N/A
N/A
N/A
40-MHz XTAL or TCXO clock
input
23
24
25
WLAN_XTAL_P
VDD_PLL
Analog
Power
Power
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Internal analog voltage
Analog RF supply from analog
DCDC output
LDO_IN2
26
27
28
29
30
31
NC
No Connect
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
—
RF
A_RX
A_TX
GND
GND
RF_BG
RF A band: 5 GHz A_RX
RF A band: 5 GHz A_TX
Ground
RF
GND
GND
RF
Ground
RF BG band: 2.4 GHz TX, RX
Master chip reset input. Active
low input.
32
33
34
nRESET
VDD_PA_IN
SOP1
I
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
RF power amplifier (PA) input
from PA DC-DC output
Power
O
Configuration sense-on-power
and 5 GHz switch control
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表7-1. Pin Descriptions (continued)
PINS
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
TYPE
DESCRIPTION
NO.
35
NAME
Configuration sense-on-power
and 5 GHz switch control
SOP0
O
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Analog RF supply from analog
DCDC output
36
37
38
39
40
LDO_IN1
Power
Power
Power
Power
Power
Analog DC-DC supply input
(same as battery voltage)
VIN_DCDC_ANA
DCDC_ANA_SW
VIN_DCDC_PA
DCDC_PA_SW_P
Analog DC/DC converter
switching node
PA DC/DC converter input supply
(same as battery voltage)
PA DC/DC converter +ve
switching node
PA DC/DC converter –ve
switching node
41
42
43
DCDC_PA_SW_N
DCDC_PA_OUT
DCDC_DIG_SW
Power
Power
Power
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
PA DC/DC converter output.
Digital DC/DC converter switching
node
Digital DC/DC converter supply
input (same as battery voltage)
44
45
VIN_DCDC_DIG
Power
I/O
N/A
No
N/A
N/A
No
Analog2 DCDC converter +ve
switching node
User configuration
not required (2)
DCDC_ANA2_SW_P
Analog2 DC-DC converter -ve
switching node
46
47
48
49
50
DCDC_ANA2_SW_N
VDD_ANA2
VDD_ANA1
VDD_RAM
Power
Power
Power
Analog
I/O
N/A
N/A
N/A
N/A
No
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
No
Analog2 DC-DC output
Analog1 power supply fed by
ANA2 DC-DC output
SRAM LDO output
User configuration
not required (2)
GPIO0
General-purpose input or output
32.768-kHz XTAL_P or external
CMOS level clock input
51
52
53
RTC_XTAL_P
RTC_XTAL_N
GPIO30
Analog
Analog
I/O
N/A
N/A
No
N/A
N/A
No
User configuration
not required (2) (3)
32.768-kHz XTAL_N
User configuration
not required (2)
General-purpose input or output
No
54
55
56
VIN_IO2
GPIO1
Analog
I/O
Chip supply voltage (VBAT)
General-purpose input or output
Internal digital core voltage
N/A
No
N/A
No
N/A
No
VDD_DIG2
Analog
N/A
N/A
N/A
Analog input (1.5V max) or
general-purpose input or output
57
58
59
60
GPIO2
GPIO3
GPIO4
GPIO5
I/O
I/O
I/O
I/O
Wake-up source
See (4)
See (4)
See (4)
See (4)
No
No
No
No
Analog input (1.5V max) or
general-purpose input or output
No
Wake-up source
No
Analog input (1.5V max) or
general-purpose input or output
Analog input (1.5V max) or
general-purpose input or output
61
62
63
64
GPIO6
GPIO7
GPIO8
GPIO9
I/O
I/O
I/O
I/O
General-purpose input or output
General-purpose input or output
General-purpose input or output
General-purpose input or output
No
No
No
No
No
No
No
No
No
No
No
No
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表7-1. Pin Descriptions (continued)
PINS
NAME
SELECT AS
WAKEUP
SOURCE
CONFIGURE
ADDITIONAL
ANALOG MUX
MUXED
WITH JTAG
TYPE
DESCRIPTION
NO.
Thermal pad and electrical
ground
GND_TAB
N/A
N/A
N/A
—
(1) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
(2) Device firmware automatically enables the digital path during ROM boot.
(3) To use the digital functions, RTC_XTAL_N must be pulled high to the supply voltage using a 100-kΩresistor.
(4) Requires user configuration to enable the analog switch of the ADC channel (the switch is off by default.) The digital I/O is always
connected and must be made Hi-Z before enabling the ADC switch.
表7-2. Pin Attributes
PAD STATES
Hib(4)
PIN
NO.
SIGNAL
TYPE(2)
PIN MUX
ENCODING
SIGNAL
DIRECTION
SIGNAL NAME(1)
LPDS(3)
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
nRESET = 0
GPIO10 (PN)
I2C_SCL
0
1
I/O
I/O (open drain)
GT_PWM06
UART1_TX
SDCARD_CLK
GT_CCP01
GPIO11 (PN)
I2C_SDA
3
O
Hi-Z, Pull,
Drive
1
2
3
I/O
I/O
I/O
Hi-Z
7
O
6
O
0
12
0
I
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
0
I/O
1
I/O (open drain)
GT_PWM07
pXCLK(XVCLK)
SDCARD_CMD
UART1_RX
GT_CCP02
MCAFSX
3
O
4
O
Hi-Z, Pull,
Drive
Hi-Z
6
I/O (open drain)
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
7
I
12
13
0
I
O
GPIO12 (PN)
McACLK
I/O
3
O
pVS(VSYNC)
I2C_SCL
4
I
Hi-Z, Pull,
Drive
Hi-Z
5
I/O (open drain)
UART0_TX
GT_CCP03
GPIO13 (PN)
I2C_SDA
7
O
12
0
I
Hi-Z, Pull, Drive
I/O
5
I/O (open drain)
Hi-Z, Pull,
Drive
4
5
pHS(HSYNC)
UART0_RX
GT_CCP04
GPIO14 (PN)
I2C_SCL
I/O
I/O
4
I
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z
Hi-Z
7
I
12
0
I
I/O
5
I/O (open drain)
Hi-Z, Pull,
Drive
GSPI_CLK
7
I/O
pDATA8(CAM_D4)
GT_CCP05
4
I
I
12
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nRESET = 0
表7-2. Pin Attributes (continued)
PAD STATES
Hib(4)
PIN
NO.
SIGNAL
PIN MUX
SIGNAL
SIGNAL NAME(1)
TYPE(2)
ENCODING
DIRECTION
LPDS(3)
GPIO15 (PN)
I2C_SDA
0
5
I/O
I/O (open drain)
GSPI_MISO
7
I/O
I
Hi-Z, Pull,
Drive
6
I/O
Hi-Z, Pull, Drive
Hi-Z
pDATA9(CAM_D5)
GT_CCP06
4
13
8
I
SDCARD_ DATA0
GPIO16 (PN)
GSPI_MOSI
I/O
I/O
I/O
I
0
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
7
pDATA10(CAM_D6)
UART1_TX
4
Hi-Z, Pull,
Drive
7
8
I/O
I/O
Hi-Z
Hi-Z
5
O
GT_CCP07
13
8
I
Hi-Z, Pull, Drive
0
SDCARD_CLK
GPIO17 (PN)
UART1_RX
O
0
I/O
I
5
Hi-Z, Pull,
Drive
GSPI_CS
7
I/O
I
Hi-Z, Pull, Drive
pDATA11 (CAM_D7)
SDCARD_ CMD
VDD_DIG1 (PN)
VIN_IO1
4
8
I/O
N/A
N/A
9
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
—
—
10
Hi-Z, Pull,
Drive(5)
Hi-Z, Pull,
Drive
11
12
13
14
FLASH_SPI_CLK
FLASH_SPI_DOUT
FLASH_SPI_DIN
FLASH_SPI_CS
O
O
I
N/A
N/A
N/A
N/A
O
O
I
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z, Pull,
Drive(5)
Hi-Z, Pull,
Drive
Hi-Z, Pull,
Drive(5)
Hi-Z
Hi-Z, Pull,
Drive
O
O
1
GPIO22 (PN)
McAFSX
0
7
5
1
0
2
9
1
0
5
2
9
4
6
I/O
Hi-Z, Pull,
Drive
15
16
I/O
I/O
O
Hi-Z, Pull, Drive
Hi-Z
Hi-Z
GT_CCP04
TDI (PN)
I
I
Hi-Z, Pull, Drive
GPIO23
I/O
Hi-Z, Pull,
Drive
UART1_TX
I2C_SCL
TDO (PN)
GPIO24
O
1
I/O (open drain)
Hi-Z, Pull, Drive
O
I/O
Driven high
in SWD;
driven low in
4-wire JTAG
PWM0
O
17
UART1_RX
I2C_SDA
GT_CCP06
McAFSX
I/O
I
Hi-Z, Pull, Drive
Hi-Z
I/O (open drain)
I
O
Hi-Z, Pull,
Drive
18
19
GPIO28 (PN)
I/O
I/O
0
I/O
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z
Hi-Z
TCK (PN)
1
8
I
Hi-Z, Pull,
Drive
GT_PWM03
O
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PIN
表7-2. Pin Attributes (continued)
PAD STATES
SIGNAL
TYPE(2)
PIN MUX
SIGNAL
SIGNAL NAME(1)
LPDS(3)
Hib(4)
nRESET = 0
NO.
ENCODING
DIRECTION
TMS (PN)
GPIO29
1
0
I/O
I/O
O
Hi-Z, Pull,
Drive
20
I/O
Hi-Z, Pull, Drive
Hi-Z
GPIO25
0
Hi-Z, Pull, Drive
GT_PWM02
9
O
Hi-Z, Pull, Drive
21(6) McAFSX
O
2
O
Hi-Z, Pull, Drive
Driven low
Hi-Z
TCXO_EN
N/A
See (7)
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
0
O
0
Hi-Z, Pull, Drive
N/A
SOP2 (PN)
I
22
23
24
25
26
27
28
29
30
31
32
33
WLAN_XTAL_N
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
I/O
I
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
—
—
—
—
—
—
—
—
—
—
—
—
WLAN_XTAL_P
VDD_PLL
N/A
N/A
LDO_IN2
N/A
NC
N/A
A_RX
N/A
A_TX
N/A
GND
N/A
GND
N/A
RF_BG
N/A
nRESET
N/A
VDD_PA_IN
SOP1 (PN)
A_SC1
N/A
N/A
34(8)
35(8)
I/O
I/O
N/A
SOP0 (PN)
A_SC2
N/A
N/A
36
37
38
39
40
41
42
43
44
LDO_IN1
N/A
—
—
—
—
—
—
—
—
—
VIN_DCDC_ANA
DCDC_ANA_SW
VIN_DCDC_PA
DCDC_PA_SW_P
DCDC_PA_SW_N
DCDC_PA_OUT
DCDC_DIG_SW
VIN_DCDC_DIG
GPIO31
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
UART0_RX
McAFSX
9
12
O
I/O
Hi-Z
Hi-Z
Hi-Z
UART1_RX
McAXR0
2
I
45(9)
6
I/O
I/O
GSPI_CLK
7
DCDC_ANA2_SW_P
(PN)
See (10)
N/A
N/A
N/A
N/A
—
46
47
48
49
DCDC_ANA2_SW_N
VDD_ANA2
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
—
—
—
—
VDD_ANA1
VDD_RAM
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nRESET = 0
表7-2. Pin Attributes (continued)
PAD STATES
Hib(4)
PIN
NO.
SIGNAL
PIN MUX
SIGNAL
SIGNAL NAME(1)
TYPE(2)
ENCODING
DIRECTION
LPDS(3)
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
GPIO0 (PN)
UART0_CTS
McAXR1
0
I/O
I
12
6
I/O
I
GT_CCP00
GSPI_CS
7
Hi-Z, Pull,
Drive
50
I/O
Hi-Z
9
I/O
O
O
I/O
N/A
N/A
O
O
O
O
O
I/O
O
O
O
I
UART1_RTS
UART0_RTS
McAXR0
10
3
1
4
Hi-Z, Pull, Drive
N/A
51
RTC_XTAL_P
RTC_XTAL_N (PN)
GPIO32
N/A
N/A
N/A
—
N/A
N/A
0
McACLK
2
Hi-Z, Pull, Drive
Hi-Z, Pull,
Drive
52(11)
O
Hi-Z
McAXR0
4
UART0_RTS
GSPI_MOSI
GPIO30 (PN)
UART0_TX
McACLK
6
1
8
Hi-Z, Pull, Drive
Hi-Z, Pull, Drive
1
0
9
2
Hi-Z, Pull,
Drive
53
I/O
Hi-Z
McAFSX
3
Hi-Z, Pull, Drive
GT_CCP05
GSPI_MISO
VIN_IO2
4
7
I/O
N/A
I/O
O
I
54
55
56
N/A
N/A
N/A
N/A
Hi-Z
N/A
Hi-Z
—
GPIO1 (PN)
UART0_TX
pCLK (PIXCLK)
UART1_TX
GT_CCP01
VDD_DIG2
ADC_CH0
0
Hi-Z, Pull, Drive
3
1
Hi-Z, Pull,
Drive
I/O
4
Hi-Z, Pull, Drive
6
O
I
1
Hi-Z, Pull, Drive
N/A
7
N/A
N/A
I
N/A
—
See (10)
GPIO2 (PN)
0
I/O
I
Analog input
(up to 1.5 V)
or digital I/O
Hi-Z, Pull,
Drive
57(12) UART0_RX
3
Hi-Z, Pull, Drive
UART1_RX
6
I
GT_CCP02
7
I
ADC_CH1
See (10)
I
Hi-Z, Pull, Drive
Analog input
(up to 1.5 V)
or digital I/O
GPIO3 (PN)
58(12)
0
I/O
O
I
Hi-Z, Pull,
Drive
Hi-Z
Hi-Z
UART1_TX
6
1
pDATA7 (CAM_D3)
4
Hi-Z, Pull, Drive
ADC_CH2
See (10)
I
Analog input
(up to 1.5 V)
or digital I/O
GPIO4 (PN)
0
6
4
I/O
I
Hi-Z, Pull,
Drive
59(12)
Hi-Z, Pull, Drive
UART1_RX
pDATA6 (CAM_D2)
I
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PIN
表7-2. Pin Attributes (continued)
PAD STATES
SIGNAL
TYPE(2)
PIN MUX
SIGNAL
SIGNAL NAME(1)
LPDS(3)
Hib(4)
nRESET = 0
NO.
ENCODING
DIRECTION
ADC_CH3
See (10)
I
I/O
I
GPIO5 (PN)
0
4
Analog input
(up to 1.5 V)
or digital I/O
Hi-Z, Pull,
Drive
60(12) pDATA5 (CAM_D1)
Hi-Z, Pull, Drive
Hi-Z
McAXR1
6
I/O
I
GT_CCP05
7
GPIO6 (PN)
0
I/O
O
I
Hi-Z, Pull, Drive
1
UART0_RTS
5
pDATA4 (CAM_D0)
4
Hi-Z, Pull,
Drive
61
I/O
Hi-Z
UART1_CTS
3
I
Hi-Z, Pull, Drive
UART0_CTS
GT_CCP06
GPIO7 (PN)
McACLKX
6
I
7
I
0
I/O
O
O
O
O
I/O
I
Hi-Z, Pull, Drive
1
13
3
Hi-Z, Pull,
Drive
62
63
64
UART1_RTS
UART0_RTS
UART0_TX
GPIO8 (PN)
SDCARD_IRQ
McAFSX
I/O
I/O
Hi-Z
Hi-Z
10
11
0
6
Hi-Z, Pull,
Drive
Hi-Z, Pull, Drive
7
O
I
GT_CCP06
GPIO9 (PN)
GT_PWM05
SDCARD_DATA0
McAXR0
12
0
I/O
O
I/O
I/O
I
3
Hi-Z, Pull,
Drive
I/O
6
Hi-Z, Pull, Drive
N/A
Hi-Z
N/A
7
GT_CCP00
12
N/A
GND_TAB
N/A
N/A
—
(1) Signals names with (PN) denote the default pin name.
(2) Signal Types: I = Input, O = Output, I/O = Input or Output.
(3) LPDS state: Unused I/Os are in a Hi-Z state. Software may program the I/Os to be input with pull or drive (regardless of active pin
configuration), according to the need.
(4) Hibernate mode: The I/Os are in a Hi-Z state. Software may program the I/Os to be input with pull or drive (regardless of active pin
configuration), according to the need.
(5) To minimize leakage in some serial flash vendors during LPDS, TI recommends that the user application always enables internal weak
pulldown resistors on the FLASH_SPI_DIN, FLASH_SPI_DOUT, and FLASH_SPI_CLK pins.
(6) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
(7) This pin is one of three that must have a passive pullup or pulldown resistor onboard to configure the device hardware power-up mode.
For this reason, the pin must be output only when used for digital functions.
(8) This pin has dual functions: as a SOP (device operation mode) input pin during boot up, and as the 5 GHz switch control (output) pin
on power up
(9) Pin 45 is used by an internal DC/DC (ANA2_DCDC). For CC3235S device, pin 45 can be used as GPIO_31 if a supply is provided on
pin 47.
(10) For details on proper use, see 节7.5.
(11) Pin 52 is used by the RTC crystal oscillator. These devices use automatic configuration sensing. Therefore, some board-level
configuration is required to use pin 52 as a digital pad. Pin 52 is used for RTC crystal in most applications. However, in some
applications a 32.768-kHz square-wave clock might always be available onboard. When a 32.768-kHz square-wave clock is available,
the crystal can be removed to free pin 52 for digital functions. The external clock must then be applied at pin 51. For the chip to
automatically detect this configuration, a 100-kΩpullup resistor must be connected between pin 52 and the supply line. To prevent
false detection, TI recommends using pin 52 for output-only functions.
(12) This pin is shared by the ADC inputs and digital I/O pad cells.
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7.3 Signal Descriptions
表7-3. Signal Descriptions
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
ADC_CH0
DESCRIPTION
57
58
59
60
1
I/O
I/O
I/O
I
I
ADC channel 0 input (maximum of 1.5 V)
ADC channel 1 input (maximum of 1.5 V)
ADC channel 2 input (maximum of 1.5 V)
ADC channel 3 input (maximum of 1.5 V)
ADC_CH1
ADC_CH2
ADC_CH3
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO22
GPIO28
GPIO25
GPIO31
GPIO0
I
ADC
I
I
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
2
3
4
5
6
7
8
15
18(1)
21
45(1) (2)
50
52(1)
53(1)
58
59
60
61
63
64
Antenna
selection
Antenna selection control
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GPIO32
GPIO30
GPIO3
GPIO4
GPIO5
GPIO6
GPIO8
GPIO9
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FUNCTION
表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
SIGNAL NAME
GPIO10
DESCRIPTION
1
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I/O
O
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO22
GPIO28
GPIO25
GPIO31
GPIO0
3
I/O
I/O
I/O
I/O
I/O
O
4
5
6
7
8
15
18(1)
21
45(1) (2)
50
52(1)
53(1)
58
59
60
61
63
64
22
23
I/O
I/O
O
BLE/2.4 GHz
radio
coexistence
Coexistence inputs and outputs
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
—
I/O
I/O
I/O
I/O
O
GPIO32
GPIO30
GPIO3
GPIO4
O
GPIO5
I/O
I/O
I/O
I/O
—
GPIO6
GPIO8
GPIO9
WLAN_XTAL_N
WLAN_XTAL_P
40-MHz crystal; pull down if external TCXO is used
40-MHz crystal or TCXO clock input
—
—
Connect 32.768-kHz crystal or force external CMOS
level clock
Clock
RTC_XTAL_P
RTC_XTAL_N
51
52
—
—
—
—
Connect 32.768-kHz crystal or connect 100-kΩresistor
to supply voltage
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表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
HM_IO
DESCRIPTION
1
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I/O
O
3
I/O
I/O
I/O
I/O
I/O
O
4
5
6
7
8
15
18(1)
21
45(1) (2)
50
52(1)
53(1)
58
59
60
61
63
64
16
17
19
20
1
I/O
I/O
O
Hostless mode
Hostless mode inputs and outputs
I/O
I/O
I/O
I/O
O
I/O
I/O
I/O
I/O
O
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
TDI
JTAG TDI. Reset default pinout.
TDO
TCK
TMS
O
JTAG TDO. Reset default pinout.
JTAG/SWD TCK. Reset default pinout.
JTAG/SWD TMS. Reset default pinout.
JTAG / SWD
I
I/O
3
I2C_SCL
I2C_SDA
I/O
I/O
I/O (open drain) I2C clock data
5
16
2
I2C
4
I/O (open drain) I2C data
6
17
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FUNCTION
表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
SIGNAL NAME
GT_PWM06
DESCRIPTION
1
1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
I
Pulse-width modulated O/P
GT_CCP01
GT_PWM07
GT_CCP02
GT_CCP03
Timer capture port
2
O
I
Pulse-width modulated O/P
2
3
I
4
I
GT_CCP04
GT_CCP05
15
5
I
I
Timer capture ports
6
I
17
61
63
7
I
GT_CCP06
I
Timers
I
GT_CCP07
PWM0
I
17
19
21
50
64
53
55
57
60
64
O
O
O
I
GT_PWM03
GT_PWM02
Pulse-width modulated outputs
Timer capture ports
I/O
I/O
I/O
I/O
I/O
I
GT_CCP00
I
GT_CCP05
GT_CCP01
GT_CCP02
GT_CCP05
GT_PWM05
I
I
I
I
Timer capture port Input
I/O
O
Pulse-width modulated output
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表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
GPIO10
DESCRIPTION
1
2
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO22
GPIO23
GPIO24
GPIO28
GPIO29
GPIO25
GPIO31
GPIO0
3
4
5
6
7
8
15
16
17
18
20
21
45(2)
50
52
53
55
57
58
59
60
61
62
63
64
2
GPIO
General-purpose inputs or outputs
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
GPIO32
GPIO30
GPIO1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
15
17
21
45(2)
53
63
3
MCAFSX
I/O
O
I2S audio port frame sync
I/O
O
O
O
McASP
McACLK
McAXR1
52
53
50
60
45(2)
50
I2S audio port clock outputs
I2S or PCM
I/O
I/O
I
O
I/O
I/O
I/O
I/O
I2S audio port data 1 (RX/TX)
I2S audio port data 1 (RX and TX)
I/O
I/O
I2S audio port data 0 (RX and TX)
I2S audio port data (only output mode is supported on
pin 52)
McAXR0
52
O
O
64
62
I/O
I/O
I/O
O
I2S audio port data (RX and TX)
I2S audio port clock
McACLKX
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FUNCTION
表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
SIGNAL NAME
DESCRIPTION
1
7
SDCARD_CLK
I/O
O
SD card clock data
2
I/O
I/O
I/O (open drain)
I/O
SDCARD_CMD
SD card command line
SD card data
Multimedia card
(MMC or SD)
8
6
SDCARD_DATA0
I/O
I/O
64
63
2
SDCARD_IRQ
pXCLK (XVCLK)
pVS (VSYNC)
pHS (HSYNC)
pDATA8 (CAM_D4)
pDATA9 (CAM_D5)
pDATA10 (CAM_D6)
pDATA11 (CAM_D7)
pCLK (PIXCLK)
pDATA7 (CAM_D3)
pDATA6 (CAM_D2)
pDATA5 (CAM_D1)
pDATA4 (CAM_D0)
VDD_DIG1
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
I
O
I
Interrupt from SD card(3)
Free clock to parallel camera
Parallel camera vertical sync
Parallel camera horizontal sync
Parallel camera data bit 4
Parallel camera data bit 5
Parallel camera data bit 6
Parallel camera data bit 7
Pixel clock from parallel camera sensor
Parallel camera data bit 3
Parallel camera data bit 2
Parallel camera data bit 1
Parallel camera data bit 0
Internal digital core voltage
3
4
I
5
I
6
I
7
I
Parallel interface
(8-bit π)
8
I
55
58
59
60
61
9
I
I
I
I
I/O
—
I
—
—
—
—
—
—
VIN_IO1
10
24
25
33
36
Device supply voltage (VBAT
Internal analog voltage
)
—
VDD_PLL
—
LDO_IN2
Internal analog RF supply from analog DC/DC output
Internal PA supply voltage from PA DC/DC output
Internal analog RF supply from analog DC/DC output
—
VDD_PA_IN
—
LDO_IN1
—
Analog DC/DC input (connected to device input supply
[VBAT])
VIN_DCDC_ANA
DCDC_ANA_SW
VIN_DCDC_PA
37
38
39
—
—
—
—
—
—
Internal analog DC/DC switching node
PA DC/DC input (connected to device input supply
[VBAT])
DCDC_PA_SW_P
DCDC_PA_SW_N
DCDC_PA_OUT
DCDC_DIG_SW
40
41
42
43
Internal PA DC/DC switching node
Internal PA DC/DC switching node
Internal PA buck converter output
Internal digital DC/DC switching node
—
—
—
—
—
—
—
—
Power
Digital DC/DC input (connected to device input supply
[VBAT])
VIN_DCDC_DIG
44
—
—
DCDC_ANA2_SW_P
DCDC_ANA2_SW_N
VDD_ANA2
45(2)
46
Analog to DC/DC converter +ve switching node
Internal analog to DC/DC converter –ve switching node
Internal analog to DC/DC output
—
—
—
—
47
—
—
—
—
—
I
—
—
—
—
—
I
VDD_ANA1
48
Internal analog supply fed by ANA2 DC/DC output
Internal SRAM LDO output
VDD_RAM
49
VIN_IO2
54
Device supply voltage (VBAT
Internal digital core voltage
)
VDD_DIG2
56
Reset
nRESET
32
Global master device reset (active low)
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表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
FUNCTION
SIGNAL NAME
A_RX
DESCRIPTION
WLAN analog A-band receive
27
28
31
5
I
I
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
I
RF
A_TX
O
WLAN analog A-band transmit
RF_BG
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
WLAN analog RF 802.11 b/g bands
GSPI_CLK
GSPI_MISO
GSPI_CS
General SPI clock
45(2)
6
General SPI MISO
General SPI device select
General SPI MOSI
53
8
SPI
50
7
GSPI_MOSI
52
11
12
13
14
1
FLASH_SPI_CLK
FLASH_SPI_DOUT
FLASH_SPI_DIN
FLASH_SPI_CS
O
Clock to SPI serial flash (fixed default)
Data to SPI serial flash (fixed default)
Data from SPI serial flash (fixed default)
O
FLASH SPI
I
O
O
O
O
O
O
O
I
Device select to SPI serial flash (fixed default)
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
7
UART TX data
UART1_TX
16
55
58
2
UART1 TX data
8
I
UART RX data
17
45(2)
57
59
50
62
61
3
I
UART1_RX
I
I
UART1 RX data
I
O
O
I
UART1_RTS
UART1_CTS
UART1 request-to-send (active low)
UART1 clear-to-send (active low)
UART
O
O
O
O
I
53
55
62
4
UART0_TX
UART0 TX data
UART0 RX data
UART0_RX
45(2)
57
50
61
50
52
61
62
I
I
UART0 RX data
UART0_CTS
I/O
I
UART0 clear-to-send input (active low)
I/O
O
O
O
O
O
UART0_RTS
UART0 request-to-send (active low)
I/O
I/O
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FUNCTION
表7-3. Signal Descriptions (continued)
PIN
NO.
PIN
TYPE
SIGNAL
DIRECTION
SIGNAL NAME
SOP2
DESCRIPTION
21(4)
O
I
I
I
I
Sense-on-power 2
Sense-On-Power SOP1
SOP0
34
Configuration sense-on-power 1
Configuration sense-on-power 0
35
I
(1) LPDS retention unavailable.
(2) Pin 45 is used by an internal DC/DC (ANA2_DCDC). For CC3235S device, pin 45 can be used as GPIO_31 if a supply is provided on
pin 47.
(3) Future support.
(4) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an
output on power up and driven logic high. During hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode
to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
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7.4 Pin Multiplexing
表7-4. Pin Multiplexing
ANALOG OR SPECIAL FUNCTION
Digital Function (XXX Field Encoding)(1)
Register
Address
Register
Name
BLE COEX
Pin
Hostless
Mode
JTAG
0
1
2
3
4
5
6
7
8
9
10
11
12
13
CC_COEX CC_COEX
_SW_OUT _BLE_IN
0x4402
E0C8
GPIO_PAD_
CONFIG_10
I2C_
SCL
GT_
PWM06
SDCARD_ UART1_
CLK TX
GT_
CCP01
1
2
Y
Y(2)
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
GPIO16
GPIO17
GPIO22
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E0CC
GPIO_PAD_
CONFIG_11
I2C_
SDA
GT_
PWM07
pXCLK
(XVCLK)
SDCARD_ UART1_
GT_
CCP02
MCAFSX
—
Y
Y
Y
Y
Y
CMD
RX
0x4402
E0D0
GPIO_PAD_
CONFIG_12
pVS
(VSYNC)
I2C_
SCL
UART0_
TX
GT_
CCP03
3
McACLK
—
—
—
—
—
—
—
—
—
—
—
0x4402
E0D4
GPIO_PAD_
CONFIG_13
pHS
(HSYNC)
I2C_
SDA
UART0_
RX
GT_
CCP04
4
Y
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E0D8
GPIO_PAD_
CONFIG_14
pDATA8
(CAM_D4)
I2C_
SCL
GSPI_
CLK
GT_
CCP05
5
Y
0x4402
E0DC
GPIO_PAD_
CONFIG_15
pDATA9
(CAM_D5)
I2C_
SDA
GSPI_
MISO
SDCARD_
DATA0
GT_
CCP06
6
Y
—
—
—
—
0x4402
E0E0
GPIO_PAD_
CONFIG_16
pDATA10 UART1_
(CAM_D6)
GSPI_
MOSI
SDCARD_
CLK
GT_
CCP07
7
Y
TX
0x4402
E0E4
GPIO_PAD_
CONFIG_17
pDATA11
(CAM_D7)
UART1_
RX
GSPI_
CS
SDCARD_
CMD
8
Y(2)
Y
—
—
—
0x4402
E0F8
GPIO_PAD_
CONFIG_22
GT_
CCP04
15
Y
McAFSX
—
—
—
—
Muxed
with
JTAG
0x4402
E0FC
GPIO_PAD_
CONFIG_23
UART1_
TX
I2C_
SCL
16
GPIO23
TDI
—
—
—
—
—
—
—
—
—
—
—
Muxed
with
JTAG
TDO
0x4402
E100
GPIO_PAD_
CONFIG_24
UART1_
RX
GT_
CCP06
I2C_
SDA
17
18
GPIO24
GPIO28
TDO
PWM0
McAFSX
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E140
GPIO_PAD_
CONFIG_40
Y(3)
Y(3)
Y(3)
—
—
—
—
—
—
—
—
—
—
Muxed
with
JTAG
or
SWD
and
TCK
0x4402
E110
GPIO_PAD_
CONFIG_28
GT_
PWM03
19
TCK
TMS
—
—
—
—
—
—
—
—
—
—
—
—
Muxed
with
JTAG
or
SWD
and
TMSC
0x4402
E114
GPIO_PAD_
CONFIG_29
20
GPIO29
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E104
GPIO_PAD_
CONFIG_25
GT_
PWM02
21(4)
Y(2)
Y
Y
Y
GPIO25
GPIO31
McAFSX
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E11C
GPIO_PAD_
CONFIG_31
45(3)
UART1_
RX
GSPI_
CLK
UART0_
RX
Y
McAXR0
McAFSX
(5)
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表7-4. Pin Multiplexing (continued)
ANALOG OR SPECIAL FUNCTION
Digital Function (XXX Field Encoding)(1)
Register
Address
Register
Name
BLE COEX
Hostless
Mode
Pin
JTAG
0
1
2
3
4
5
6
7
8
9
10
11
12
13
CC_COEX CC_COEX
_SW_OUT _BLE_IN
0x4402
E0A0
GPIO_PAD_
CONFIG_0
UART0_
RTS
GT_
CCP00
GSPI_
CS
UART1_
RTS
UART0_
CTS
50
52
53
55
57
58
59
60
61
62
63
64
Y
Y
Y
GPIO0
GPIO32
GPIO30
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
McAXR0
McAXR0
McAXR1
—
—
-—
—
—
—
—
—
—
—
—
-—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E120
GPIO_PAD_
CONFIG_32
UART0_
RTS
GSPI_
MOSI
Y(3)
Y(3)
Y(3)
Y(3)
Y(3)
Y(3)
McACLK
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E118
GPIO_PAD_
CONFIG_30
GT_
CCP05
GSPI_
MISO
UART0_
TX
McACLK McAFSX
UART0_
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E0A4
GPIO_PAD_
CONFIG_1
pCLK
(PIXCLK)
UART1_
TX
GT_
CCP01
—
—
—
—
Y
—
—
—
—
Y
—
—
—
—
—
—
—
—
—
—
—
TX
0x4402
E0A8
GPIO_PAD_
CONFIG_2
UART0_
RX
UART1_
RX
GT_
CCP02
—
—
—
0x4402
E0AC
GPIO_PAD_
CONFIG_3
pDATA7
(CAM_D3)
UART1_
TX
Y(2)
Y(2)
Y
—
—
—
—
—
—
—
—
—
—
—
—
—
0x4402
E0B0
GPIO_PAD_
CONFIG_4
pDATA6
(CAM_D2)
UART1_
RX
Y
—
—
0x4402
E0B4
GPIO_PAD_
CONFIG_5
pDATA5
(CAM_D1)
GT_
CCP05
Y
McAXR1
0x4402
E0B8
GPIO_PAD_
CONFIG_6
UART1_
CTS
pDATA4
(CAM_D0)
UART0_
RTS
UART0_
CTS
GT_
CCP06
Y
Y
Y
—
0x4402
E0BC
GPIO_PAD_
CONFIG_7
UART1_
RTS
UART0_ UART0_
RTS
McACLKX
—
Y
—
Y
—
Y
—
—
—
—
—
—
—
—
TX
0x4402
E0C0
GPIO_PAD_
CONFIG_8
SDCARD_
IRQ
GT_
CCP06
McAFSX
McAXR0
—
—
—
—
—
0x4402
E0C4
GPIO_PAD_
CONFIG_9
GT_
PWM05
SDCARD_
DATA0
GT_
CCP00
Y
Y
Y
—
—
(1) Pin mux encodings with (RD) denote the default encoding after reset release.
(2) Output Only
(3) LPDS retention unavailable.
(4) This pin has dual functions: as a SOP[2] (device operation mode), and as an external TCXO enable. As a TXCO enable, the pin is an output on power up and driven logic high. During
hibernate low-power mode, the pin is in a Hi-Z state but is pulled down for SOP mode to disable TCXO. Because of the SOP functionality, the pin must be used as an output only.
(5) Pin 45 is used by an internal DC/DC (ANA2_DCDC). For CC3235S device, pin 45 can be used as GPIO_31 if a supply is provided on pin 47.
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7.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
表 7-5 describes the use, drive strength, and default state of analog and digital multiplexed pins at first-time
power up and reset (nRESET pulled low).
表7-5. Drive Strength and Reset States for Analog and Digital Multiplexed Pins
State After Configuration of Analog
Switches (ACTIVE, LPDS, and HIB Effective Drive
Maximum
Board-Level Configuration and
Use
Default State at First Power Up
or Forced Reset
Pin
Power Modes)
Strength (mA)
VDD_ANA2 (pin 47) must be
shorted to the input supply rail.
Otherwise, the pin is driven by the is also isolated.
ANA2 DC/DC.
Analog is isolated. The digital I/O cell Determined by the I/O state, as are
45
50
52
4
other digital I/Os.
Analog is isolated. The digital I/O cell Determined by the I/O state, as are
is also isolated. other digital I/Os.
Generic I/O
4
4
The pin must have an external
pullup of 100 kΩto the supply rail
and must be used in output signals
only.
Analog is isolated. The digital I/O cell Determined by the I/O state, as are
is also isolated. other digital I/Os.
Analog is isolated. The digital I/O cell Determined by the I/O state, as are
is also isolated. other digital I/Os.
53
57
58
59
60
Generic I/O
4
4
4
4
4
Analog signal (1.8-V absolute,
1.46-V full scale)
ADC is isolated. The digital I/O cell is Determined by the I/O state, as are
also isolated. other digital I/Os.
Analog signal (1.8-V absolute,
1.46-V full scale)
ADC is isolated. The digital I/O cell is Determined by the I/O state, as are
also isolated. other digital I/Os.
Analog signal (1.8-V absolute,
1.46-V full scale)
ADC is isolated. The digital I/O cell is Determined by the I/O state, as are
also isolated. other digital I/Os.
Analog signal (1.8-V absolute,
1.46-V full scale)
ADC is isolated. The digital I/O cell is Determined by the I/O state, as are
also isolated. other digital I/Os.
7.6 Pad State After Application of Power to Device, Before Reset Release
When a stable power is applied to the CC3235x device for the first time or when supply voltage is restored to the
proper value following a period with supply voltage less than 1.5 V, the level of each digital pad is undefined in
the period starting from the release of nRESET and until DIG_DCDC powers up. This period is less than
approximately 10 ms. During this period, pads can be internally pulled weakly in either direction. If a certain set
of pins is required to have a definite value during this pre-reset period, an appropriate pullup or pulldown resistor
must be used at the board level. The recommended value of this external pull is 2.7 kΩ.
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7.7 Connections for Unused Pins
All unused pin should be configured as stated in 表7-6.
表7-6. Connections for Unused Pins
PIN
NUMBER
FUNCTION
SIGNAL DESCRIPTION
ACCEPTABLE PRACTICE
PREFERRED PRACTICE
Wake up I/O source should not be
floating during hibernate.
All the I/O pins will float while in
Hibernate and Reset states. Ensure
pullup and pulldown resistors are
available on board to maintain the
state of the I/O.
General-purpose input or
output
GPIO
Leave unused GPIOs as NC
No Connect
SOP
NC
26
Unused pin, leave as NC.
Unused pin, leave as NC
69.8K Pull down resistor
on SOP0 and SOP1 used
as switch control pins,
Configuration sense-on-
power
Ensure pulldown resistors are
available on unused SOP pins
100K pull down on SOP2
Reset
RESET input for the device
RTC_XTAL_N
Never leave the reset pin floating
When using an external oscillator,
add a 100-kΩpullup resistor to VIO
Clock
JTAG
When using an external oscillator,
connect to ground if unused
WLAN_XTAL_N
JTAG interface
Leave as NC if unused
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8 Specifications
All measurements are referenced at the device pins, unless otherwise indicated. All specifications are over
process and voltage, unless otherwise indicated.
8.1 Absolute Maximum Ratings
All measurements are referenced at the device pins unless otherwise indicated. All specifications are over process and
overvoltage unless otherwise indicated.
Over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
MAX UNIT
VBAT and VIO
Pins: 37, 39, 44
Pins: 10, 54
3.8
V
V
–0.5
Supply voltage
VBAT and VIO should be tied
together
VIO –VBAT (differential)
Digital inputs
RF pins
VIO + 0.5
V
V
–0.5
–0.5
–0.5
–40
–55
2.1
2.1
85
Analog pins, Crystal
Pins: 22, 23, 51, 52
V
Operating temperature, TA
Storage temperature, Tstg
°C
°C
125
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to VSS, unless otherwise noted.
8.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2)
VESD
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Power-On Hours (POH)
This information is provided solely for your convenience and does not extend or modify the warranty provided under TI's
standard terms and conditions for TI semiconductor products.
POWER-ON HOURS [POH]
OPERATING CONDITION
(hours)
TA up to 85°C(1)
87,600
(1) The TX duty cycle (power amplifier ON time) is assumed to be 10% of the device POH. Of the remaining 90% of the time, the device
can be in any other state.
8.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1) (2)
MIN
2.1(4)
–20
TYP
MAX
UNIT
VBAT, VIO
(shorted to VBAT
Direct battery
connection(3)
Supply voltage
Pins: 10, 37, 39, 44, 54
3.3
3.6
V
)
Ambient thermal slew
20 °C/minute
(1) Operating temperature is limited by crystal frequency variation.
(2) When operating at an ambient temperature of over 75°C, the transmit duty cycle must remain below 50% to avoid the auto-protect
feature of the power amplifier. If the auto-protect feature triggers, the device takes a maximum of 60 seconds to restart the
transmission.
(3) To ensure WLAN performance, ripple on the supply must be less than ±300 mV.
(4) The minimum voltage specified includes the ripple on the supply voltage and all other transient dips. The brownout condition is also
2.1 V, and care must be taken when operating at the minimum specified voltage.
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8.5 Current Consumption Summary (CC3235S)
表8-1. Current Consumption Summary (CC3235S) 2.4 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
TX power level = 0
MIN
TYP(3)
272
190
248
182
223
160
59
MAX UNIT
1 DSSS
6 OFDM
54 OFDM
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX
RX
NWP ACTIVE
MCU ACTIVE
mA
1 DSSS
54 OFDM
59
NWP idle connected(4)
15.3
269
187
245
179
220
157
56
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
1 DSSS
6 OFDM
54 OFDM
TX
NWP ACTIVE
MCU SLEEP
mA
1 DSSS
RX
54 OFDM
56
NWP idle connected(4)
12.2
266
184
242
176
217
154
53
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
1 DSSS
6 OFDM
54 OFDM
TX
NWP ACTIVE
mA
MCU LPDS
1 DSSS
RX
54 OFDM
53
120 µA at 64KB
135 µA at 256KB
NWP LPDS(5)
135
µA
NWP idle connected(4)
MCU SHUTDOWN MCU shutdown
MCU HIBERNATE MCU hibernate
710
1
µA
µA
4.5
420
450
670
VBAT = 3.6 V
VBAT = 3.3 V
VBAT = 2.1 V
Peak calibration current(6)
mA
(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off
approximately 4 dB.
(2) The CC3235x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5:1.
(4) DTIM = 1
(5) LPDS current does not include the external serial flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3235x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is
performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.
There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further
details, see CC31xx, CC32xx SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
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表8-2. Current Consumption Summary (CC3235S) 5 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
6 OFDM
MIN
TYP(3)
318
293
67
MAX UNIT
TX
RX
NWP ACTIVE
54 OFDM
MCU ACTIVE
mA
54 OFDM
NWP idle connected(4)
15.3
315
290
64
6 OFDM
54 OFDM
54 OFDM
TX
NWP ACTIVE
MCU SLEEP
MCU LPDS
mA
RX
NWP idle connected(4)
TX
RX
12.2
312
287
61
6 OFDM
54 OFDM
54 OFDM
NWP ACTIVE
NWP LPDS(5)
mA
µA
120 µA at 64KB
135 µA at 256KB
135
NWP idle connected(4)
710
1
MCU SHUTDOWN MCU shutdown
MCU HIBERNATE MCU hibernate
µA
µA
4.5
290
310
310
400
VBAT = 3.6 V
VBAT = 3.3 V
VBAT = 2.7 V
VBAT = 2.1 V
Peak calibration current(6)
mA
(1) Measurements taken at maximum TX power
(2) The CC3235x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5:1.
(4) DTIM = 1
(5) LPDS current does not include the external serial flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3235x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a time of 24 ms. In default mode, calibration is
performed sparingly, and typically occurs when re-enabling the NWP and when the temperature has changed by more than 20°C.
There are two additional calibration modes that may be used to reduced or completely eliminate the calibration event. For further
details, see CC31xx, CC32xx SimpleLink™ Wi-Fi® and IoT Network Processor Programmer's Guide.
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8.6 Current Consumption Summary (CC3235SF)
表8-3. Current Consumption Summary (CC3235SF) 2.4 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
TX power level = 0
MIN
TYP(3)
286
202
255
192
232
174
74
MAX UNIT
1 DSSS
6 OFDM
54 OFDM
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX
RX
NWP ACTIVE
MCU ACTIVE
mA
1 DSSS
54 OFDM
74
NWP idle connected(4)
25.2
282
198
251
188
228
170
70
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
1 DSSS
6 OFDM
54 OFDM
TX
NWP ACTIVE
MCU SLEEP
mA
1 DSSS
RX
54 OFDM
70
NWP idle connected(4)
21.2
266
184
242
176
217
154
53
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
TX power level = 0
TX power level = 4
1 DSSS
6 OFDM
54 OFDM
TX
NWP active
mA
MCU LPDS
1 DSSS
RX
54 OFDM
53
120 µA at 64KB
135 µA at 256KB
NWP LPDS(5)
135
710
1
µA
NWP idle connected(4)
MCU shutdown
MCU
SHUTDOWN
µA
µA
MCU
HIBERNATE
MCU hibernate
4.5
VBAT = 3.6 V
VBAT = 3.3 V
VBAT = 2.1 V
420
450
670
Peak calibration current(6)
mA
(1) TX power level = 0 implies maximum power (see 图8-1, 图8-2, and 图8-3). TX power level = 4 implies output power backed off
approximately 4 dB.
(2) The CC3235x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5:1.
(4) DTIM = 1
(5) LPDS current does not include the external serial flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3235x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
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(6) The complete calibration can take up to 17 mJ of energy from the battery over a period of 24 ms. Calibration is performed sparingly,
typically when coming out of HIBERNATE and only if temperature has changed by more than 20°C. The calibration event can be
controlled by a configuration file in the serial flash.
表8-4. Current Consumption Summary (CC3235SF) 5 GHz RF Band
TA = 25°C, VBAT = 3.6 V
PARAMETER
TEST CONDITIONS(1) (2)
6 OFDM
MIN TYP(3) MAX UNIT
329
TX
RX
NWP ACTIVE
54 OFDM
54 OFDM
306
mA
80
MCU ACTIVE
MCU SLEEP
NWP idle connected(4)
25.2
325
6 OFDM
54 OFDM
54 OFDM
TX
NWP ACTIVE
302
mA
76
RX
NWP idle connected(4)
21.2
312
6 OFDM
54 OFDM
54 OFDM
TX
RX
NWP active
289
63
mA
µA
MCU LPDS
120 µA at 64KB
135 µA at 256KB
NWP LPDS(5)
135
710
1
NWP idle connected(4)
MCU shutdown
MCU
SHUTDOWN
µA
µA
MCU
HIBERNATE
MCU hibernate
4.5
VBAT = 3.6 V
290
310
310
400
VBAT = 3.3 V
VBAT = 2.7 V
VBAT = 2.1 V
mA
Peak calibration current(6)
(1) Measurements taken at maximum TX power
(2) The CC3235x system is a constant power-source system. The active current numbers scale based on the VBAT voltage supplied.
(3) Typical numbers assume a VSWR of 1.5:1.
(4) DTIM = 1
(5) LPDS current does not include the external serial flash. The LPDS number of reported is with retention of 256KB of MCU SRAM. The
CC3235x device can be configured to retain 0KB, 64KB, 128KB, 192KB, or 256KB of SRAM in LPDS. Each 64-KB block of MCU
retained SRAM increases LPDS current by 4 µA.
(6) The complete calibration can take up to 17 mJ of energy from the battery over a period of 24 ms. Calibration is performed sparingly,
typically when coming out of HIBERNATE and only if temperature has changed by more than 20°C. The calibration event can be
controlled by a configuration file in the serial flash.
8.7 TX Power Control for 2.4 GHz Band
The CC3235x has several options for modifying the output power of the device when required. For the 2.4 GHz
band it is possible to lower the overall output power at a global level using the global TX power level setting. In
2
3
addition, the 2.4 GHz band allows the user to enter additional back-offs , per channel, region and modulation
rates 4, via Image creator (see the Uniflash with Image Creator User Guide for more details).
图 8-1, 图 8-2, and 图 8-3 show TX power and IBAT versus TX power level settings for the CC3235S device at
modulations of 1 DSSS, 6 OFDM, and 54 OFDM, respectively. For the CC3235SF device, the IBAT current has
2
The back-off range is between -6 dB to +6 dB in 0.25dB increments.
FCC/ISED, ETSI (Europe), and Japan are supported.
Back-off rates are grouped into 11b rates, high modulation rates (MCS7, 54 OFDM and 48 OFDM), and lower modulation rates (all
3
4
other rates).
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an increase of approximately 10 mA to 15 mA depending on the transmitted rate. The TX power level will remain
the same.
In 图 8-1, the area enclosed in the circle represents a significant reduction in current during transition from TX
power level 3 to level 4. In the case of lower range requirements (14-dBm output power), TI recommends using
TX power level 4 to reduce the current.
1 DSSS
19.00
17.00
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
Color by
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-1. TX Power and IBAT vs TX Power Level Settings (1 DSSS)
6 OFDM
19.00
17.00
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
Color by
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-2. TX Power and IBAT vs TX Power Level Settings (6 OFDM)
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54 OFDM
19.00
17.00
280.00
264.40
249.00
233.30
218.00
202.00
186.70
171.00
Color by
TX Power (dBm)
15.00
13.00
IBAT (VBAT @ 3.6 V)
11.00
9.00
7.00
5.00
3.00
1.00
155.60
140.00
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
TX power level setting
图8-3. TX Power and IBAT vs TX Power Level Settings (54 OFDM)
8.8 TX Power Control for 5 GHz
5 GHz power control is done via Image Creator where the maximum transmit power is provided 5. Within Image
Creator power control is possible per channel, region 6, and modulation rates 7. In addition, it is possible to enter
an additional back-off 8factor per channel and modulation rate for further margin to regulatory requirements.
9
Finally, it is also possible to set the TX and RX trace losses to the antenna per band . The peak antenna
gain 10can also be provided, thus allowing further control. For a full description of options and capabilities see
Uniflash with Image Creator User Guide.
5
The maximum transmit power range is 18dBm to 0.125dBm in 0.125dBm decrements.
FCC/ISED, ETSI (Europe), and Japan are supported.
Rates are grouped into high modulation rates (MCS7, 54 OFDM and 48 OFDM) and lower modulation rates (all other rates).
The back-off range is 0 dBm to 18 dBm in 0.125 dBm increments, with the maximum back-off not exceed that of the maximum transmit
6
7
8
power.
9
The range of losses if from 0 dBm to 7.75 dBm in 0.125 dBm increments.
The antenna gain has a range of -2 dBi to 5.75 dBi in 0.125 dBi increments.
10
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8.9 Brownout and Blackout Conditions
The device enters a brownout condition when the input voltage drops below Vbrownout (see 图 8-4 and 图 8-5).
This condition must be considered during design of the power supply routing, especially when operating from a
battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to
networking) can cause a drop in the supply voltage, potentially triggering a brownout condition. The resistance
includes the internal resistance of the battery, the contact resistance of the battery holder (four contacts for 2×
AA batteries), and the wiring and PCB routing resistance.
Note
When the device is in HIBERNATE state, brownout is not detected. Only blackout is in effect during
HIBERNATE state.
图8-4. Brownout and Blackout Levels (1 of 2)
图8-5. Brownout and Blackout Levels (2 of 2)
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In the brownout condition, all sections of the device (including the 32-kHz RTC) shut down except for the
Hibernate module, which remains on. The current in this state can reach approximately 400 µA. The blackout
condition is equivalent to a hardware reset event in which all states within the device are lost.
表8-5 lists the brownout and blackout voltage levels.
表8-5. Brownout and Blackout Voltage Levels
CONDITION
VOLTAGE LEVEL
UNIT
V
Vbrownout
Vblackout
2.1
1.67
V
8.10 Electrical Characteristics for GPIO Pins
表8-6. Electrical Characteristics: GPIO Pins Except 50, 52, and 53
TA = 25°C, VBAT = 2.1 V to 3.3 V.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
CIN
VIH
VIL
IIH
Pin capacitance
4
pF
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
0.65 × VDD
VDD + 0.5 V
0.35 × VDD
V
V
–0.5
5
5
nA
nA
IIL
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.8
VDD × 0.7
VDD × 0.7
VDD × 0.75
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOH
High-level output voltage
V
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤VDD < 2.4 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.2
VDD × 0.2
VDD × 0.2
VDD × 0.25
IL = 4 mA; configured I/O drive
strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOL
Low-level output voltage
V
IL = 6 mA; configured I/O drive
strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O drive
strength = 2 mA;
2.1 V ≤VDD < 2.4 V
2-mA drive
High-level
2
4
6
2
4
6
IOH
source
current
4-mA drive
6-mA drive
2-mA drive
4-mA drive
6-mA drive
mA
mA
Low-level
IOL
sink current
(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk
of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
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表8-7. Electrical Characteristics: GPIO Pins 50, 52, and 53
TA = 25°C, VBAT = 2.1 V to 3.6 V.(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
pF
V
CIN
VIH
VIL
IIH
Pin capacitance
7
High-level input voltage
Low-level input voltage
High-level input current
Low-level input current
0.65 × VDD
VDD + 0.5 V
0.35 × VDD
V
–0.5
50
50
nA
nA
IIL
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.8
VDD × 0.7
VDD × 0.7
VDD × 0.75
IL = 4 mA; configured I/O
drive strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOH
High-level output voltage
V
IL = 6 mA; configured I/O
drive strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.1 V ≤VDD < 2.4 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.4 V ≤VDD < 3.6 V
VDD × 0.2
VDD × 0.2
VDD × 0.2
VDD × 0.25
IL = 4 mA; configured I/O
drive strength = 4 mA;
2.4 V ≤VDD < 3.6 V
VOL
Low-level output voltage
V
IL = 6 mA; configured I/O
drive strength = 6 mA;
2.4 V ≤VDD < 3.6 V
IL = 2 mA; configured I/O
drive strength = 2 mA;
2.1 V ≤VDD < 2.4 V
2-mA
drive
1.5
2.5
3.5
1.5
2.5
3.5
High-level
4-mA
IOH
source current,
drive
mA
VOH = 2.4
6-mA
drive
2-mA
drive
Low-level sink
current
4-mA
drive
IOL
mA
V
6-mA
drive
VIL
nRESET
0.6
(1) TI recommends using the lowest possible drive strength that is adequate for the applications. This recommendation minimizes the risk
of interference to the WLAN radio and reduces any potential degradation of RF sensitivity and performance. The default drive strength
setting is 6 mA.
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8.11 Electrical Characteristics for Pin Internal Pullup and Pulldown
TA = 25°C, VBAT = 3.0 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IOH
IOL
Pullup current, VOH = 2.4 (VDD = 3.0 V)
5
10
µA
Pulldown current, VOL = 0.4 (VDD = 3.0
V)
5
µA
8.12 WLAN Receiver Characteristics
表8-8. WLAN Receiver Characteristics: 2.4 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters are measured at the SoC pin on channel 6 (2437 MHz).
PARAMETER
TEST CONDITIONS (Mbps)
MIN
TYP
–96.0
–94.0
–88.0
–90.5
–90.0
–86.5
–80.5
–74.5
–71.5
–4.0
MAX
UNIT
1 DSSS
2 DSSS
11 CCK
6 OFDM
Sensitivity
(8% PER for 11b rates, 10% PER for 11g/11n
9 OFDM
dBm
rates)(1)
18 OFDM
36 OFDM
54 OFDM
MCS7 (GF)(2)
802.11b
Maximum input level
(10% PER)
dBm
802.11g
–10.0
(1) Sensitivity is 1-dB worse on channel 13 (2472 MHz).
(2) Sensitivity for mixed mode is 1-dB worse.
表8-9. WLAN Receiver Characteristics: 5 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157.
PARAMETER
TEST CONDITIONS (Mbps)
MIN
TYP
-92.0
-91.0
-88.0
-81.5
-75.0
-71.0
-20
MAX
UNIT
dBm
dBm
6 OFDM
9 OFDM
18 OFDM
Sensitivity
(10% PER for 11g/11n rates)
36 OFDM
54 OFDM
MCS7 (GF)(1)
Maximum input level
802.11a
(1) Sensitivity for mixed mode is 1-dB worse.
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8.13 WLAN Transmitter Characteristics
表8-10. WLAN Transmitter Characteristics: 2.4 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V. Parameters measured at SoC pin on channel 6 (2437 MHz).(1) (2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Operating frequency range(3) (4)
2412
2472
MHz
1 DSSS
2 DSSS
11 CCK
18.0
18.0
18.3
17.3
17.3
17.0
16.0
14.5
13.0
6 OFDM
9 OFDM
18 OFDM
36 OFDM
54 OFDM
MCS7
Maximum RMS output power measured at 1
dB from IEEE spectral mask or EVM
dBm
ppm
Transmit center frequency accuracy
25
–25
(1) The OFDM and MCS7 edge channels (2412 and 2462 MHz) have reduced TX power to meet FCC emission limits.
(2) Power of 802.11b rates are reduced to meet ETSI requirements in Europe.
(3) Channels 1 (2142 MHz) through 11 (2462 MHz) are supported for FCC.
(4) Channels 1 (2142 MHz) through 13 (2472MHz) are supported for Europe and Japan. Note that channel 14 is not supported for Japan.
表8-11. WLAN Transmitter Characteristics: 5 GHz Band
TA = 25°C, VBAT = 2.1 V to 3.6 V.(1) Parameters measured at SoC pin are the average of channels 40, 56, 120, and 157.(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Operating frequency range(3) (4) (5)
5180
5825
MHz
6 OFDM
9 OFDM
18 OFDM
36 OFDM
54 OFDM
MCS7
18.1
18.1
18.1
16.6
15.0
14.0
Maximum RMS output power measured at 1
dB from IEEE spectral mask or EVM
dBm
Transmit center frequency accuracy
-20
20
ppm
(1) Transmit power will be reduced by 1.5dB for VBAT < 2.8V
(2) FCC, Europe, and Japan channel power limits per modulation rates can be found in the Uniflash with Image Creator User Guide.
(3) FCC band covers U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3 20-MHz BW modulations.
(4) Europe bands 1, 2 and 3, 20-MHz BW modulations are supported.
(5) For Japan, W52, W53 and W56, 20-MHz BW modulations are supported.
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8.14 WLAN Transmitter Out-of-Band Emissions
Both the 2.4 GHz and the 5 GHz RF paths require an external band-pass filter to meet the various emission
standards, including FCC. 表 8-12 and 表 8-13 presents the minimum attenuation requirements for the 2.4 GHz
and 5 GHz band-pass filter, respectively. TI recommends using the same filter, switch, diplexer, and so on, used
in the reference design to ease the process of certification.
表8-12. WLAN 2.4 GHz Filter Requirements
PARAMETER
FREQUENCY (MHz)
2412 to 2484
2412 to 2484
804 to 828
MIN
TYP
MAX
UNIT
dB
Return loss
Insertion loss(1)
10
1
42
23
49
52
30
27
42
44
30
50
1.5
dB
30
20
30
40
20
20
20
35
20
1608 to 1656
3216 to 3312
4020 to 4140
4824 to 4968
5628 to 5796
6432 to 6624
7200 to 7500
7500 to 10000
2412 to 2484
Bandpass
Attenuation
dB
Reference impendence
Filter type
Ω
(1) Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
表8-13. WLAN 5 GHz Filter Requirements
PARAMETER
FREQUENCY (MHz)
5150 to 5925
5150 to 5925
600 to 2700
MIN
TYP
MAX
UNIT
dB
Return loss
10
Insertion loss(1)
1
42
31
27
28
27
37
50
2
dB
41
27
20
20
20
25
2950 to 3850
4400 to 4600
6600 to 6900
7000 to 7775
10300 to 11850
5150 to 5925
Bandpass
Attenuation
dB
Reference impendence
Filter type
Ω
(1) Insertion loss directly impacts output power and sensitivity. At customer discretion, insertion loss can be relaxed to meet attenuation
requirements.
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8.15 BLE/2.4 GHz Radio Coexistence and WLAN Coexistence Requirements
For proper BLE/2.4 GHz radio coexistence, the following requirements needs to met:
表8-14. COEX Isolation Requirement
PARAMETER
Band
MIN
20(1)
20(2)
TYP
MAX
UNIT
Single antenna
Port-to-port isolation
dB
Dual antenna Configuration
(1) WLAN/BLE switch used must provide a minimum of 20 dB isolation between ports.
(2) For dual antenna configuration antenna placement must be such that isolation between the BLE and WLAN ports is at least 20 dB.
8.16 Thermal Resistance Characteristics for RGK Package
THERMAL METRICS(1)
°C/W(2) (3)
6.3
AIR FLOW (m/s)(4)
0.0051
0.0051
0.0051
0.765
Junction-to-case
RΘJC
RΘJB
RΘJA
Junction-to-board
Junction-to-free air
2.4
23
14.6
12.4
10.8
0.2
Junction-to-moving air
1.275
RΘJMA
2.55
0.0051
0.765
0.2
PsiJT
Junction-to-package top
0.3
1.275
0.1
2.55
2.3
0.0051
0.765
2.3
PsiJB
Junction-to-board
2.2
1.275
2.4
2.55
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/
JEDEC standards:
•
•
•
•
JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70°C is assumed.
(4) m/s = meters per second.
8.17 Timing and Switching Characteristics
8.17.1 Power Supply Sequencing
For proper operation of the CC3235x device, perform the recommended power-up sequencing as follows:
1. Tie the following pins together on the board:
• VBAT (pins 37, 39, and 44)
• VIO (pins 54 and 10)
2. Hold the RESET pin low while the supplies are ramping up. TI recommends using a simple RC circuit (100 K
||, 0.01 µF, RC = 1 ms).
3. For an external RTC, ensure that the clock is stable before RESET is deasserted (high).
For timing diagrams, see 节8.17.3.
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8.17.2 Device Reset
When a device restart is required, the user may issue a negative pulse to the nRESET pin. The user must follow
one of the following alternatives to ensure the reset is properly applied:
• A negative reset pulse (on pin 32) of at least 200-ms duration
• If the 200-ms pulse duration cannot be ensured, a pulldown resistor of 2 MΩmust be connected to pin 52
(RTC_XTAL_N). If implemented, a shorter pulse of at least 100 µs can be used.
To ensure a proper reset sequence, the user must call the sl_stop function prior to toggling the reset. When a
reset is required, it is preferable to use the software reset instead of an external trigger.
8.17.3 Reset Timing
8.17.3.1 nRESET (32-kHz Crystal)
图8-6 shows the reset timing diagram for the 32-kHz crystal first-time power-up and reset removal.
T1
T2
T3
T4
VBAT
VIO
nRESET
APP CODE
LOAD
APP CODE
EXECUTION
POWER
OFF
RESET
HW INIT
FW INIT
STATE
32-kHz
RTC CLK
图8-6. First-Time Power-Up and Reset Removal Timing Diagram (32-kHz Crystal)
表8-15 describes the timing requirements for the 32-kHz clock crystal first-time power-up and reset removal.
表8-15. First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
ITEM
NAME
DESCRIPTION
MIN
NOM
MAX
UNIT
nReset timing after VBAT and VIO
supply are stable
T1
T2
nReset timing
1
ms
Hardware wake-up time
25
ms
Time taken by ROM
firmware to initialize
hardware
Includes 32.768-kHz XOSC settling
time
T3
1.1
s
App code load time for
CC3235S
CC3235S
Image size (KB) × 1.7 ms
Image size (KB) × 0.06 ms
T4
App code integrity check
time for CC3235SF
CC3235SF
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8.17.3.2 nRESET (External 32-kHz Clock)
图8-7 shows the reset timing diagram for the external 32-kHz clock first-time power-up and reset removal.
T1
T2
T3
T4
VBAT
VIO
nRESET
STATE
APP CODE
EXECUTION
POWER
OFF
APP CODE
LOAD
RESET
HW INIT
FW INIT
32-kHz
RTC CLK
图8-7. First-Time Power-Up and Reset Removal Timing Diagram (External 32-kHz Clock)
表8-16 describes the timing requirements for the external 32-kHz clock first-time power-up and reset removal.
表8-16. First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz Clock)
ITEM
NAME
DESCRIPTION
MIN
NOM
MAX
UNIT
nReset timing after VBAT and VIO
supply are stable
T1
T2
nReset time
1
ms
Hardware wake-up time
25
ms
Time taken by ROM
firmware to initialize
hardware
CC3235S
10.3
T3
ms
CC3235SF
17.3
App code load time for
CC3235R and CC3235S
CC3235S
Image size (KB) × 1.7 ms
Image size (KB) × 0.06 ms
T4
App code integrity check
time for CC3235SF
CC3235SF
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8.17.4 Wakeup From HIBERNATE Mode
Note
The 32.768-kHz crystal is enabled by default when the chip goes into HIBERNATE mode.
表8-17 lists the software hibernate timing requirements.
表8-17. Software Hibernate Timing Requirements
ITEM
NAME
DESCRIPTION
MIN
TYP
MAX
UNIT
THIB_MIN
Minimum hibernate time
10
ms
Hardware wakeup time plus
firmware initialization time
(1)
Twake_from_hib
50(2)
ms
ms
App code load time for
CC3235S
CC3235S
Image size (KB) × 1.7 ms
Image size (KB) × 0.06 ms
T_APP_CODE_LOAD
App code load time for
CC3235SF
CC3235SF
(1) Twake_from_hib can be 200 ms on rare occasions when calibration is performed. Calibration is performed sparingly, typically when exiting
Hibernate and only if temperature has changed by more than 20°C or more than 24 hours have elapsed since a prior calibration.
(2) Wake-up time can extend to 75 ms if a patch is downloaded from the serial Flash.
图8-8 shows the timing diagram for wakeup from HIBERNATE mode.
Application software requests
entry to hibernate moade
Twake_from_hib
TAPP_CODE_LOAD
THIB_MIN
VBAT
nRESET
STATE
APP CODE
LOAD
ACTIVE
Hibernate
HW WAKEUP
FW INIT
EXECUTION
32-kHz
RTC CLK
图8-8. Wakeup From HIBERNATE Timing Diagram
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8.17.5 Clock Specifications
The CC3235x device requires two separate clocks for operation:
• A slow clock running at 32.768 kHz is used for the RTC.
• A fast clock running at 40 MHz is used by the device for the internal processor and the WLAN subsystem.
The device features internal oscillators that enable the use of less-expensive crystals rather than dedicated
TCXOs for these clocks. The RTC can also be fed externally to provide reuse of an existing clock on the system
and to reduce overall cost.
8.17.5.1 Slow Clock Using Internal Oscillator
The RTC crystal connected on the device supplies the free-running slow clock. The accuracy of the slow clock
frequency must be 32.768 kHz ±150 ppm. In this mode of operation, the crystal is tied between RTC_XTAL_P
(pin 51) and RTC_XTAL_N (pin 52) with a suitable load capacitance to meet the ppm requirement.
图8-9 shows the crystal connections for the slow clock.
51
RTC_XTAL_P
10 pF
GND
32.768 kHz
52
RTC_XTAL_N
10 pF
GND
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图8-9. RTC Crystal Connections
表8-18 lists the RTC crystal requirements.
表8-18. RTC Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
kHz
ppm
kΩ
Frequency
32.768
Frequency accuracy
Crystal ESR
Initial plus temperature plus aging
32.768 kHz
±150
70
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8.17.5.2 Slow Clock Using an External Clock
When an RTC oscillator is present in the system, the CC3235x device can accept this clock directly as an input.
The clock is fed on the RTC_XTAL_P line, and the RTC_XTAL_N line is held to VIO. The clock must be a CMOS-
level clock compatible with VIO fed to the device.
图8-10 shows the external RTC input connection.
32.768 kHz
RTC_XTAL_P
Host system
VIO
100 kΩ
RTC_XTAL_N
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图8-10. External RTC Input
表8-19 lists the external RTC digital clock requirements.
表8-19. External RTC Digital Clock Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Frequency
32768
Hz
Frequency accuracy
(Initial plus temperature plus aging)
±150
50%
ppm
ns
tr, tf
Input transition time tr, tf (10% to 90%)
Frequency input duty cycle
100
80%
20%
Vih
Vil
0.65 × VIO
VIO
V
Slow clock input voltage limits
Input impedance
Square wave, DC coupled
0
1
0.35 × VIO
Vpeak
MΩ
pF
5
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8.17.5.3 Fast Clock (Fref) Using an External Crystal
The CC3235x device also incorporates an internal crystal oscillator to support a crystal-based fast clock. The
crystal is fed directly between WLAN_XTAL_P (pin 23) and WLAN_XTAL_N (pin 22) with suitable loading
capacitors.
图8-11 shows the crystal connections for the fast clock.
23
WLAN_XTAL_P
6.2 pF
GND
40 MHz
22
WLAN_XTAL_N
6.2 pF
GND
SWAS031-030
A. The crystal capacitance must be tuned to ensure that the PPM requirement is met. See CC31xx & CC32xx Frequency Tuning for
information on frequency tuning.
图8-11. Fast Clock Crystal Connections
表8-20 lists the WLAN fast-clock crystal requirements.
表8-20. WLAN Fast-Clock Crystal Requirements
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
ppm
Ω
Frequency
40
Frequency accuracy
Crystal ESR
Initial plus temperature plus aging
40 MHz
±20
60
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8.17.5.4 Fast Clock (Fref) Using an External Oscillator
The CC3235x device can accept an external TCXO/XO for the 40-MHz clock. In this mode of operation, the
clock is connected to WLAN_XTAL_P (pin 23). WLAN_XTAL_N (pin 22) is connected to GND. The external
TCXO/XO can be enabled by TCXO_EN (pin 21) from the device to optimize the power consumption of the
system.
If the TCXO does not have an enable input, an external LDO with an enable function can be used. Using the
LDO improves noise on the TCXO power supply.
图8-12 shows the connection.
VCC
XO (40 MHz)
EN
CC3235x
TCXO_EN
82 pF
WLAN_XTAL_P
WLAN_XTAL_N
OUT
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图8-12. External TCXO Input
表8-21 lists the external Fref clock requirements.
表8-21. External Fref Clock Requirements (–40°C to +85°C)
CHARACTERISTICS
TEST CONDITIONS
MIN
TYP
MAX UNIT
Frequency
40.00
MHz
Frequency accuracy (initial plus temperature
plus aging)
±20 ppm
55%
Frequency input duty cycle
Clock voltage limits
45%
0.7
50%
Vpp
Sine or clipped sine wave, AC coupled
1.2
–125
Vpp
at 1 kHz
Phase noise at 40 MHz
at 10 kHz
at 100 kHz
dBc/Hz
–138.5
–143
Resistance
Input impedance
12
kΩ
Capacitance
7
pF
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8.17.6 Peripherals Timing
This section describes the peripherals that are supported by the CC3235x device:
• SPI
• I2S
• GPIOs
• I2C
• IEEE 1149.1 JTAG
• ADC
• Camera Parallel Port
• UART
• SD Host
• Timers
8.17.6.1 SPI
8.17.6.1.1 SPI Master
The CC3235x microcontroller includes one SPI module that can be configured as a master or slave device. The
SPI includes a serial clock with programmable frequency, polarity, and phase; a programmable timing control
between chip select and external clock generation; and a programmable delay before the first SPI word is
transmitted. Slave mode does not include a dead cycle between two successive words.
图8-13 shows the timing diagram for the SPI master.
T2
CLK
T6
T7
MISO
MOSI
T9
T8
图8-13. SPI Master Timing Diagram
表8-22 lists the timing parameters for the SPI master.
表8-22. SPI Master Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
F(1)
Tclk
D(1)
Clock frequency
Clock period
30
MHz
ns
(1)
T2
33.3
45%
1
Duty cycle
55%
(1)
T6
T7
T8
T9
tIS
RX data setup time
RX data hold time
TX data output delay
TX data hold time
ns
ns
ns
ns
(1)
tIH
2
(1)
(1)
tOD
tOH
8.5
8
(1) Timing parameter assumes a maximum load of 20 pF.
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8.17.6.1.2 SPI Slave
图8-14 shows the timing diagram for the SPI slave.
T2
CLK
T6
T7
MISO
MOSI
T9
T8
图8-14. SPI Slave Timing Diagram
表8-23 lists the timing parameters for the SPI slave.
表8-23. SPI Slave Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
Clock frequency at VBAT = 3.3 V
20
12
F(1)
MHz
ns
Clock frequency at VBAT ≤2.1 V
Clock period
(1)
T2
Tclk
D(1)
50
45%
4
Duty cycle
55%
(1)
T6
T7
T8
T9
tIS
RX data setup time
RX data hold time
TX data output delay
TX data hold time
ns
ns
ns
ns
(1)
tIH
4
(1)
(1)
tOD
tOH
20
24
(1) Timing parameter assumes a maximum load of 20 pF at 3.3 V.
8.17.6.2 I2S
The McASP interface functions as a general-purpose audio serial port optimized for multichannel audio
applications and supports transfer of two stereo channels over two data pins. The McASP consists of transmit
and receive sections that operate synchronously and have programmable clock and frame-sync polarity. A
fractional divider is available for bit-clock generation.
8.17.6.2.1 I2S Transmit Mode
图8-15 shows the timing diagram for the I2S transmit mode.
T2
T1
T3
McACLKX
T4
T4
McAFSX
McAXR0/1
图8-15. I2S Transmit Mode Timing Diagram
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表8-24 lists the timing parameters for the I2S transmit mode.
表8-24. I2S Transmit Mode Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
(1)
T1
T2
T3
T4
fclk
Clock frequency
Clock low period
Clock high period
TX data hold time
9.216
1/2 fclk
1/2 fclk
22
MHz
ns
tLP (1)
(1)
tHT
ns
(1)
tOH
ns
(1) Timing parameter assumes a maximum load of 20 pF.
8.17.6.2.2 I2S Receive Mode
图8-16 shows the timing diagram for the I2S receive mode.
T2
T1
T3
McACLKX
T5
T4
McAFSX
McAXR0/1
图8-16. I2S Receive Mode Timing Diagram
表8-25 lists the timing parameters for the I2S receive mode.
表8-25. I2S Receive Mode Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
(1)
T1
T2
T3
T4
T5
fclk
Clock frequency
Clock low period
Clock high period
RX data hold time
RX data setup time
9.216
1/2 fclk
1/2 fclk
0
MHz
ns
tLP (1)
(1)
tHT
ns
(1)
tOH
ns
(1)
tOS
15
ns
(1) Timing parameter assumes a maximum load of 20 pF.
8.17.6.3 GPIOs
All digital pins of the device can be used as general-purpose input/output (GPIO) pins. The GPIO module
consists of four GPIO blocks, each of which provides eight GPIOs. The GPIO module supports 24
programmable GPIO pins, depending on the peripheral used. Each GPIO has configurable pullup and pulldown
strength (weak 10 µA), configurable drive strength (2, 4, and 6 mA), and open-drain enable.
Note
Unless otherwise stated, GPIO specifications also applies to pins configured as COEX IOs and
network scripter interface
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图8-17 shows the GPIO timing diagram.
VDD
80%
20%
tGPIOF
tGPIOR
SWAS031-067
图8-17. GPIO Timing Diagram
8.17.6.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
表8-26 lists the GPIO output transition times for Vsupply = 3.3 V.
表8-26. GPIO Output Transition Times (Vsupply = 3.3 V)(1) (2)
tr
tf
DRIVE
STRENGTH (mA)
DRIVE STRENGTH
CONTROL BITS
UNIT
MIN
NOM
MAX
MIN
NOM
MAX
2MA_EN=1
4MA_EN=0
2MA_EN=0
4MA_EN=1
2MA_EN=1
4MA_EN=1
2(3)
4(3)
6
8.0
9.3
10.7
8.2
9.5
11.0
5.8
ns
ns
ns
6.6
3.2
7.1
3.5
7.6
3.7
4.7
2.3
5.2
2.6
2.9
(1) Vsupply = 3.3 V, T = 25°C, total pin load = 30 pF
(2) The transition data applies to the pins except the multiplexed analog-digital pins 29, 30, 45, 50, 52, and 53.
(3) The 2-mA and 4-mA drive strength does not apply to the COEX I/O pins. Pins configured as COEX lines are invariably driven at 6 mA.
8.17.6.3.2 GPIO Input Transition Time Parameters
表8-27 lists the input transition time parameters.
表8-27. GPIO Input Transition Time Parameters
MIN
1
MAX
UNIT
ns
tr
tf
3
3
Input transition time (tr, tf), 10% to 90%
1
ns
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8.17.6.4 I2C
The CC3235x microcontroller includes one I2C module operating with standard (100 kbps) or fast
(400 kbps) transmission speeds.
图8-18 shows the I2C timing diagram.
T2
T6
T5
I2CSCL
I2CSDA
T1
T7
T4
T8
T3
T9
图8-18. I2C Timing Diagram
表8-28 lists the I2C timing parameters.
表8-28. I2C Timing Parameters(1)
PARAMETER
NUMBER
MIN
MAX
UNIT
T2
T3
T4
T5
T6
T7
T8
T9
tLP
Clock low period
See (2)
System clock
ns
tSRT
tDH
tSFT
tHT
SCL/SDA rise time
Data hold time
See (3)
N/A
3
SCL/SDA fall time
Clock high time
ns
See (2)
tLP/2
36
System clock
System clock
System clock
System clock
tDS
Data setup time
tSCSR
tSCS
Start condition setup time
Stop condition setup time
24
(1) All timing is with 6-mA drive and 20-pF load.
(2) This value depends on the value programmed in the clock period register of I2C. Maximum output frequency is the result of the minimal
value programmed in this register.
(3) Because I2C is an open-drain interface, the controller can drive logic 0 only. Logic is the result of an external pullup resistor. Rise time
depends on the value of the external signal capacitance and external pullup register.
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8.17.6.5 IEEE 1149.1 JTAG
The Joint Test Action Group (JTAG) port is an IEEE standard that defines a test access port (TAP) and boundary
scan architecture for digital integrated circuits and provides a standardized serial interface to control the
associated test logic. For detailed information on the operation of the JTAG port and TAP controller, see the
IEEE Standard 1149.1,Test Access Port and Boundary-Scan Architecture.
图8-19 shows the JTAG timing diagram.
T2
T3
T4
TCK
TMS
TDI
T7
TMS Input Valid
T9 T10
TDI Input Valid
T8
T8
TMS Input Valid
T7
T9
T10
TDI Input Valid
T1
T11
TDO Output Valid
TDO
TDO Output Valid
图8-19. JTAG Timing Diagram
表8-29 lists the JTAG timing parameters.
表8-29. JTAG Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
T1
T2
T3
T4
T7
T8
T9
T10
T11
fTCK
Clock frequency
15
1 / fTCK
tTCK / 2
tTCK / 2
MHz
ns
tTCK
Clock period
tCL
Clock low period
Clock high period
TMS setup time
TMS hold time
TDI setup time
TDI hold time
ns
tCH
ns
tTMS_SU
tTMS_HO
tTDI_SU
tTDI_HO
tTDO_HO
1
16
1
ns
ns
ns
16
ns
TDO hold time
15
ns
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8.17.6.6 ADC
图8-20 shows the ADC clock timing diagram.
Repeats Every 16 µs
Internal Ch
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
2 µs
ADC CLOCK
= 10 MHz
Sampling
4 cycles
SAR Conversion
16 cycles
Sampling
4 cycles
SAR Conversion
16 cycles
Sampling
4 cycles
SAR Conversion
16 cycles
Sampling
4 cycles
SAR Conversion
16 cycles
EXT CHANNEL 0
EXT CHANNEL 1
INTERNAL CHANNEL
INTERNAL CHANNEL
图8-20. ADC Clock Timing Diagram
表 8-30 lists the ADC electrical specifications. See CC32xx ADC Appnote for further information on using the
ADC and for application-specific examples.
表8-30. ADC Electrical Specifications
TEST CONDITIONS and
PARAMETER
Nbits
DESCRIPTION
Number of bits
MIN
TYP
MAX
UNIT
ASSUMPTIONS
12
Bits
Worst-case deviation from
histogram method over full scale
(not including first and last three
LSB levels)
INL
Integral nonlinearity
2.5
LSB
–2.5
Worst-case deviation of any step
from ideal
DNL
Differential nonlinearity
4
1.4
LSB
V
–1
Input range
0
Driving source
impedance
100
Ω
Successive approximation input
clock rate
FCLK
Clock rate
10
MHz
pF
Input capacitance
12
2.15
0.7
ADC Pin 57
ADC Pin 58
ADC Pin 59
ADC Pin 60
Input impedance
kΩ
2.12
1.17
4
Number of channels
Fsample
Sampling rate of each pin
62.5
KSPS
kHz
F_input_max
Maximum input signal frequency
31
Input frequency DC to 300 Hz
and 1.4 Vpp sine wave input
SINAD
Signal-to-noise and distortion
Active supply current
55
60
dB
Average for analog-to-digital
during conversion without
reference current
I_active
1.5
mA
Total for analog-to-digital when
not active (this must be the SoC
level test)
Power-down supply current for
core supply
I_PD
1
µA
Absolute offset error
Gain error
FCLK = 10 MHz
±2
±2%
mV
Vref
ADC reference voltage
1.467
V
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8.17.6.7 Camera Parallel Port
The fast camera parallel port interfaces with a variety of external image sensors, stores the image data in a
FIFO, and generates DMA requests. The camera parallel port supports 8 bits.
图8-21 shows the timing diagram for the camera parallel port.
T3
T2
T4
pCLK
T6
T7
pVS, pHS
pDATA
图8-21. Camera Parallel Port Timing Diagram
表8-31 lists the timing parameters for the camera parallel port.
表8-31. Camera Parallel Port Timing Parameters
PARAMETER
NUMBER
MIN
MAX
UNIT
pCLK
Tclk
tLP
Clock frequency
Clock period
2
1/pCLK
Tclk/2
Tclk/2
2
MHz
ns
T2
T3
T4
T6
T7
Clock low period
Clock high period
RX data setup time
RX data hold time
Duty cycle
ns
tHT
tIS
ns
ns
tIH
2
ns
D
45%
55%
8.17.6.8 UART
The CC3235x device includes two UARTs with the following features:
• Programmable baud-rate generator allows speeds up to 3 Mbps
• Separate 16-bit × 8-bit TX and RX FIFOs to reduce CPU interrupt service loading
• Programmable FIFO length, including a 1-byte-deep operation providing conventional double-buffered
interface
• FIFO trigger levels of 1/8, 1/4, 1/2, 3/4, and 7/8
• Standard asynchronous communication bits for start, stop, and parity
• Generation and detection of line-breaks
• Fully programmable serial interface characteristics:
– 5, 6, 7, or 8 data bits
– Generation and detection of even, odd, stick, or no-parity bits
– Generation of 1 or 2 stop-bits
• RTS and CTS hardware flow support
• Standard FIFO-level and End-of-Transmission interrupts
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• Efficient transfers using µDMA:
– Separate channels for transmit and receive
– Receive single request asserted when data is in the FIFO; burst request asserted at programmed FIFO
level
– Transmit single request asserted when there is space in the FIFO; burst request asserted at programmed
FIFO level
• System clock is used to generate the baud clock.
8.17.6.9 SD Host
The CC3235x device provides an interface between a local host (LH), such as an MCU and an SD memory card,
and handles SD transactions with minimal LH intervention.
The SD host does the following:
• Provides SD card access in 1-bit mode
• Deals with SD protocol at the transmission level
• Handles data packing
• Adds cyclic redundancy checks (CRC)
• Start and end bit
• Checks for syntactical correctness
The application interface sends every SD command and either polls for the status of the adapter or waits for an
interrupt request. The result is then sent back to the application interface in case of exceptions or to warn of end-
of-operation. The controller can be configured to generate DMA requests and work with minimum CPU
intervention. Given the nature of integration of this peripheral on the CC3235x platform, TI recommends that
developers use peripheral library APIs to control and operate the block. This section emphasizes understanding
the SD host APIs provided in the peripheral library of the CC3235x Software Development Kit (SDK).
The SD Host features are as follows:
• Full compliance with SD command and response sets, as defined in the SD memory card
– Specifications, v2.0
– Includes high-capacity (size >2 GB) HC and SD cards
• Flexible architecture allows support for new command structure
• 1-bit transfer mode specifications for SD cards
• Built-in 1024-byte buffer for read or write
– 512-byte buffer for both transmit and receive
– Each buffer is 32-bits wide by 128-words deep
• 32-bit-wide access bus to maximize bus throughput
• Single interrupt line for multiple interrupt source events
• Two slave DMA channels (1 for TX, 1 for RX)
• Programmable clock generation
• Integrates an internal transceiver that allows a direct connection to the SD card without external transceiver
• Supports configurable busy and response timeout
• Support for a wide range of card clock frequency with odd and even clock ratio
• Maximum frequency supported is 24 MHz
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8.17.6.10 Timers
Programmable timers can be used to count or time external events that drive the timer input pins. The CC3235x
general-purpose timer module (GPTM) contains 16- or 32-bit GPTM blocks. Each 16- or 32-bit GPTM block
provides two 16-bit timers or counters (referred to as Timer A and Timer B) that can be configured to operate
independently as timers or event counters, or they can be concatenated to operate as one 32-bit timer. Timers
can also be used to trigger µDMA transfers.
The GPTM contains four 16- or 32-bit GPTM blocks with the following functional options:
• Operating modes:
– 16- or 32-bit programmable one-shot timer
– 16- or 32-bit programmable periodic timer
– 16-bit general-purpose timer with an 8-bit prescaler
– 16-bit input-edge count or time-capture modes with an 8-bit prescaler
– 16-bit PWM mode with an 8-bit prescaler and software-programmable output inversion of the PWM signal
• Counts up or counts down
• Sixteen 16- or 32-bit capture compare pins (CCP)
• User-enabled stalling when the microcontroller asserts CPU Halt flag during debug
• Ability to determine the elapsed time between the assertion of the timer interrupt and entry into the interrupt
service routine
• Efficient transfers using micro direct memory access controller (µDMA):
– Dedicated channel for each timer
– Burst request generated on timer interrupt
• Runs from system clock (80 MHz)
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9 Detailed Description
9.1 Overview
The CC3235x wireless MCU family has a rich set of peripherals for diverse application requirements. This
section briefly highlights the internal details of the CC3235x devices and offers suggestions for application
configurations.
9.2 Arm® Cortex®-M4 Processor Core Subsystem
The high-performance Arm® Cortex®-M4 processor provides a cost-conscious platform that meets the needs of
minimal memory implementation, reduced pin count, and low power consumption, while delivering outstanding
computational performance and exceptional system response to interrupts.
• The Arm Cortex-M4 core has low-latency interrupt processing with the following features:
– A 32-bit Arm® Thumb® instruction set optimized for embedded applications
– Handler and thread modes
– Low-latency interrupt handling by automatic processor state saving and restoration during entry and exit
– Support for Armv6 unaligned accesses
• Nested vectored interrupt controller (NVIC) closely integrated with the processor core to achieve low-latency
interrupt processing. The NVIC includes the following features:
– Bits of priority configurable from 3 to 8
– Dynamic reprioritization of interrupts
– Priority grouping that enables selection of preempting interrupt levels and nonpreempting interrupt levels
– Support for tail-chaining and late arrival of interrupts, which enables back-to-back interrupt processing
without the overhead of state saving and restoration between interrupts
– Processor state automatically saved on interrupt entry and restored on interrupt exit with no instruction
overhead
– Wake-up interrupt controller (WIC) providing ultra-low-power sleep mode support
• Bus interfaces:
– Advanced high-performance bus (AHB-Lite) interfaces: system bus interfaces
– Bit-band support for memory and select peripheral that includes atomic bit-band write and read operations
• Cost-conscious debug solution featuring:
– Debug access to all memory and registers in the system, including access to memory-mapped devices,
access to internal core registers when the core is halted, and access to debug control registers even while
SYSRESETn is asserted
– Serial wire debug port (SW-DP) or serial wire JTAG debug port (SWJ-DP) debug access
– Flash patch and breakpoint (FPB) unit to implement breakpoints and code patches
9.3 Wi-Fi® Network Processor Subsystem
The Wi-Fi network processor subsystem includes a dedicated Arm MCU to completely offload the host MCU
along with an 802.11a/b/g/n radio, baseband, and MAC with a powerful crypto engine for a fast, secure WLAN
and Internet connections with 256-bit encryption. The CC3235x devices support station, AP, and Wi-Fi Direct
modes. The device also supports WPA2 personal and enterprise security, WPS 2.0, and WPA3 personal and
enterprise11. The Wi-Fi network processor includes an embedded IPv6, IPv4 TCP/IP stack, TLS stack and
network applications such as HTTPS server.
11
See CC3235 SDK v3.40 or later for details. Limited to STA mode only.
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9.3.1 WLAN
The WLAN features are as follows:
• 802.11a/b/g/n integrated radio, modem, and MAC supporting WLAN communication as a BSS station, AP,
Wi-Fi Direct client, and group owner with CCK and OFDM rates in the 2.4 GHz band (channels 1 through 13),
and the 5 GHz 20-MHz BW U-NII bands (U-NII-1, U-NII-2A, U-NII-2C, and U-NII-3).
Note
802.11n is supported only in Wi-Fi station and Wi-Fi direct
• The automatically calibrated radio with a single-ended 50-Ωinterface enables easy connection to the
antenna without requiring expertise in radio circuit design.
• Advanced connection manager with multiple user-configurable profiles stored in serial flash allows automatic
fast connection to an access point without user or host intervention.
• Supports all common Wi-Fi security modes for personal and enterprise networks with on-chip security
accelerators, including: WEP, WPA/WPA2 PSK, WPA2 Enterprise (802.1x), WPA3 Personal, and WPA3
Enterprise.
• Smart provisioning options deeply integrated within the device providing a comprehensive end-to-end
solution. With elaborate events notification to the host, enabling the application to control the provisioning
decision flow. The wide variety of Wi-Fi provisioning methods include:
– Access Point with HTTP server
– WPS - Wi-Fi Protected Setup, supporting both push button and pin code options.
– SmartConfig™ Technology: TI proprietary, easy to use, one-step, one-time process used to connect a
CC3235x-enabled device to the home wireless network.
• 802.11 transceiver mode allows transmitting and receiving of proprietary data through a socket The 802.11
transceiver mode provides the option to select the working channel, rate, and transmitted power. The receiver
mode works with the filtering options.
• Antenna selection for best connection
• BLE/2.4 GHz radio coexistence mechanism to avoid interference
9.3.2 Network Stack
The Network Stack features are as follows:
• Integrated IPv4, IPv6 TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU,
microprocessor, or ASIC
Note
Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.
• Support of 16 simultaneous TCP, UDP, RAW, SSL\TLS sockets
• Built-in network protocols:
– Static IP, LLA, DHCPv4, DHCPv6 with DAD and stateless autoconfiguration
– ARP, ICMPv4, IGMP, ICMPv6, MLD, ND
– DNS client for easy connection to the local network and the Internet
• Built-in network applications and utilities:
– HTTP/HTTPS
• Web page content stored on serial flash
• RESTful APIs for setting and configuring application content
• Dynamic user callbacks
– Service discovery: Multicast DNS service discovery lets a client advertise its service without a centralized
server. After connecting to the access point, the CC3235x device provides critical information, such as
device name, IP, vendor, and port number.
– DHCP server
– Ping
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表9-1 describes the NWP features.
表9-1. NWP Features
Feature
Description
802.11a/b/g/n station
802.11a/b/g AP supporting up to four stations
Wi-Fi standards
Wi-Fi Direct client and group owner
2.4 GHz ISM and 5 GHz U-NII Channels
20 MHz
Wi-Fi channels
Channel Bandwidth
Wi-Fi security
Wi-Fi provisioning
IP protocols
WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x), WPA3 personal and enterprise (1)
SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP web server
IPv4/IPv6
IP addressing
Cross layer
Static IP, LLA, DHCPv4, DHCPv6 with DAD
ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP
UDP, TCP
Transport
SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2
RAW
Ping
HTTP/HTTPS web server
Network applications and
utilities
mDNS
DNS-SD
DHCP server
Host interface
UART/SPI
Device identity
Trusted root-certificate catalog
TI root-of-trust public key
The CC3235S and CC3235SF variants also support:
•
•
•
•
•
•
•
•
•
•
•
•
Secure key storage
Online certificate status protocol (OCSP)
Certificate signing request (CSR)
Unique per device Key-Pair
File system security
Security
Software tamper detection
Cloning protection
Secure boot
Validate the integrity and authenticity of the run-time binary during boot
Initial secure programming
Debug security
JTAG and debug
Power management
Other
Enhanced power policy management uses 802.11 power save and deep-sleep power modes
Transceiver
Programmable RX filters with event-trigger mechanism
Rx Metrics for tracking the surrounding RF environment
(1) See CC3235 SDK v3.40 or newer for details. Limited to STA mode only.
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9.4 Security
The SimpleLink™ Wi-Fi® CC3235x Internet-on-a chip device enhances the security capabilities available for
development of IoT devices, while completely offloading these activities from the MCU to the networking
subsystem. The security capabilities include the following key features:
Wi-Fi and Internet Security:
• Personal and enterprise Wi-Fi security
– Personal standards
• AES (WPA2-PSK)
• TKIP (WPA-PSK)
• WEP
– Enterprise standards
• EAP Fast
• EAP PEAPv0/1
• EAP PEAPv0 TLS
• EAP PEAPv1 TLS EAP LS
• EAP TLS
• EAP TTLS TLS
• EAP TTLS MSCHAPv2
• Secure sockets
– Protocol versions: OCSP, SSL v3, TLS 1.0, TLS 1.1, TLS 1.2
– Powerful crypto engine for fast, secure Wi-Fi and internet connections with 256-bit AES encryption for TLS
and SSL connections
– Ciphers suites
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_SSL_RSA_WITH_RC4_128_MD5
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_RC4_128_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_CBC_SHA
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_CBC_SHA
• SL_SEC_MASK_TLS_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_128_GCM_SHA256
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_AES_256_GCM_SHA384
• SL_SEC_MASK_TLS_ECDHE_ECDSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_ECDHE_RSA_WITH_CHACHA20_POLY1305_SHA256
• SL_SEC_MASK_TLS_DHE_RSA_WITH_CHACHA20_POLY1305_SHA256
– Server authentication
– Client authentication
– Domain name verification
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– Runtime socket upgrade to secure socket –STARTTLS
• Secure HTTP server (HTTPS)
• Trusted root-certificate catalog –Verifies that the CA used by the application is trusted and known secure
content delivery
• TI root-of-trust public key –Hardware-based mechanism that allows authenticating TI as the genuine origin
of a given content using asymmetric keys
• Secure content delivery –Allows encrypted file transfer to the system using asymmetric keys created by the
device
Code and Data Security:
• Network passwords and certificates are encrypted and signed.
• Cloning protection –Application and data files are encrypted by a unique key per device.
• Access control –Access to application and data files only by using a token provided in file creation time. If
an unauthorized access is detected, a tamper protection lock down mechanism takes effect.
• Secured boot –Authentication of the application image on every boot
• Code and data encryption –User application and data files can be encrypted in the serial flash
• Code and data authentication –User Application and data files are authenticated with a public key certificate
• Offloaded crypto library for asymmetric keys, including the ability to create key-pair, sign and verify data
buffer
• Recovery mechanism
Device Security:
• Separate execution environments –Application processor and network processor run on separate Arm
cores
• Initial secure programming –Allows for keeping the content confidential on the production line
• Debug security
– JTAG lock
– Debug ports lock
• True random number generator
图9-1 shows the high-level structure of the CC3235S and CC3235SF devices. The application image, user data,
and network information files (passwords, certificates) are encrypted using a device-specific key.
CC3235S and CC3235SF
Network Processor + MCU
MCU
Network Processor
Peripherals
ARM® Cortex®-M4
Processor
SPI and I2C
GPIO
Internet
Wi-Fi®
MAC
Internet
256KB RAM /
UART
HTTPS
TLS/SSL
TCP/IP
1MB Flash (CC3235SF)
PWM
ADC
Baseband
OEM
Application
Dual-Band Radio
•
Serial Flash
OEM
Application
Data Files
Network Information
图9-1. CC3235S and CC3235SF High-Level Structure
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9.5 FIPS 140-2 Level 1 Certification
The Federal Information Processing Standard (FIPS) Publication 140-2 is a U.S. government computer security
standard. It is commonly referred to as FIPS 140-2 and is used to accredit the design and implementation of
cryptographic modules. A cryptographic module within a security system is necessary to maintain the
confidentiality and integrity of the information protected by the device.
The security engines of the CC3235x device are FIPS validated for FIPS 140-2 level 1 certification 12. This
certification involves testing the device for all areas related to the secure design and implementation of the
cryptographic modules and covers topics such as: cryptographic specifications, ports and interfaces, a finite
state model for the cryptographic module, the operational environment of the module, and how cryptographic
keys are managed.
9.6 Power-Management Subsystem
The CC3235x power-management subsystem contains DC/DC converters to accommodate the different voltage
or current requirements of the system.
• Digital DC/DC (Pin 44)
– Input: VBAT wide voltage (2.1 to 3.6 V)
• ANA1 DC/DC (Pin 37)
– Input: VBAT wide voltage (2.1 to 3.6 V)
• PA DC/DC (Pin 39)
– Input: VBAT wide voltage (2.1 to 3.6 V)
• ANA2 DC/DC (Pin 47, CC3235SF only)
– Input: VBAT wide voltage (2.1 to 3.6 V)
The CC3235x device is a single-chip WLAN radio solution used on an embedded system with a wide-voltage
supply range. The internal power management, including DC/DC converters and LDOs, generates all of the
voltages required for the device to operate from a wide variety of input sources.
9.7 Low-Power Operating Mode
From a power-management perspective, the CC3235x device comprises the following two independent
subsystems:
• Arm® Cortex®-M4 application processor subsystem
• Networking subsystem
Each subsystem operates in one of several power states.
The Arm® Cortex®-M4 application processor runs the user application loaded from an external serial flash, or
internal flash (in CC3235SF). The networking subsystem runs preprogrammed TCP/IP and Wi-Fi data link layer
functions.
12
For exact status of FIPS certification for a specific part number, please refer to https://csrc.nist.gov/publications/fips.
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The user program controls the power state of the application processor subsystem. The application processor
can be in one of the five modes described in 表9-2.
表9-2. User Program Modes
APPLICATION PROCESSOR
DESCRIPTION
(MCU) MODE(1)
MCU active mode
MCU executing code at a state rate of 80 MHz
The MCU clocks are gated off in sleep mode and the entire state of the device is retained. Sleep mode
offers instant wakeup. The MCU can be configured to wake up by an internal fast timer or by activity
from any GPIO line or peripheral.
MCU sleep mode
State information is lost and only certain MCU-specific register configurations are retained. The MCU
can wake up from external events or by using an internal timer. (The wake-up time is less than 3 ms.)
Certain parts of memory can be retained while the MCU is in LPDS mode. The amount of memory
retained is configurable. Users can choose to preserve code and the MCU-specific setting. The MCU
can be configured to wake up using the RTC timer or by an external event on specific GPIOs as the
wake-up source.
MCU LPDS mode
The lowest power mode in which all digital logic is power-gated. Only a small section of the logic directly
powered by the input supply is retained. The RTC continues running and the MCU supports wakeup
from an external event or from an RTC timer expiry. Wake-up time is longer than LPDS mode at about
15 ms plus the time to load the application from serial flash, which varies according to code size. In this
mode, the MCU can be configured to wake up using the RTC timer or external event on a GPIO.
MCU hibernate mode
MCU shutdown mode
The lowest power mode system-wise. All device logics are off, including the RTC. The wake-up time in
this mode is longer than hibernate at about 1.1 s. To enter or exit the shutdown mode, the state of the
nRESET line is changed (low to shut down, high to turn on).
(1) Modes are listed in order of power consumption, with highest power modes listed first.
The NWP can be active or in LPDS mode and takes care of its own mode transitions. When there is no network
activity, the NWP sleeps most of the time and wakes up only for beacon reception (see
表9-3).
表9-3. Networking Subsystem Modes
NETWORK PROCESSOR
DESCRIPTION
MODE
Network active mode
Transmitting or receiving IP protocol packets
(processing layer 3, 2, and 1)
Network active mode
Transmitting or receiving MAC management frames; IP processing is not required
(processing layer 2 and 1)
Network active listen mode
Network connected Idle
Special power-optimized active mode for receiving beacon frames (no other frames are supported)
A composite mode that implements 802.11 infrastructure power-save operation. The CC3235x NWP
automatically enters LPDS mode between beacons and then wakes into active listen mode to receive a
beacon and determine if there is pending traffic at the AP. If not, the NWP returns to LPDS mode and
the cycle repeats.
Advanced features of long sleep interval and IoT low power for extending LPDS time for up to 22
seconds while maintaining Wi-Fi connection is supported in this mode.
Low-power state between beacons in which the state is retained by the NWP, allowing for a rapid wake
up
Network LPDS mode
Network disabled
The network is disabled
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The operation of the application and network processor ensures that the device remains in the lowest power
mode most of the time to preserve battery life.
The following examples show the use of the power modes in applications:
• A product that is continuously connected to the network in the 802.11 infrastructure power-save mode but
sends and receives little data spends most of the time in connected idle, which is a composite of receiving a
beacon frame and waiting for the next beacon.
• A product that is not continuously connected to the network but instead wakes up periodically (for example,
every 10 minutes) to send data, spends most of the time in hibernate mode, jumping briefly to active mode to
transmit data.
9.8 Memory
9.8.1 External Memory Requirements
The CC3235x device maintains a proprietary file system on the serial flash. The CC3235x file system stores the
MCU binary, service pack file, system files, configuration files, certificate files, web page files, and user files. By
using a format command through the API, users can provide the total size allocated for the file system. The
starting address of the file system cannot be set and is always at the beginning of the serial flash. The
applications microcontroller must access the serial flash memory area allocated to the file system directly
through the CC3235x file system. The applications microcontroller must not access the serial flash memory area
directly.
The file system manages the allocation of serial flash blocks for stored files according to download order, which
means that the location of a specific file is not fixed in all systems. Files are stored on serial flash using human-
readable filenames rather than file IDs. The file system API works using plain text, and file encryption and
decryption is invisible to the user. Encrypted files can be accessed only through the file system.
All file types can have a maximum of 100 supported files in the file system. All files are stored in 4-KB blocks and
thus use a minimum of 4KB of flash space. Fail-safe files require twice the original size and use a minimum of
8KB. Encrypted files are counted as fail-safe in terms of space. The maximum file size is 1MB.
表9-4 lists the minimum required memory consumption under the following assumptions:
• System files in use consume 64 blocks (256KB).
• Vendor files are not taken into account.
• MCU code is taken as the maximal possible size for the CC3235 with fail-safe enabled to account for future
updates, such as through OTA.
• Gang image:
– Storage for the gang image is rounded up to 32 blocks (meaning 128-KB resolution).
– Gang image size depends on the actual content size of all components. Additionally, the image should be
128KB aligned so unaligned memory is considered lost. Service pack, system files, and the 128KB
aligned memory are assumed to occupy 256KB.
• All calculations consider that the restore-to-default is enabled.
表9-4. Recommended Flash Size
ITEM
File system allocation table
System and configuration files(1)
Service pack(1)
CC3235S (KB)
CC3235SF (KB)
20
20
256
256
264
264
MCU Code(1)
512
2048
Gang image size
256 + MCU
1308 + MCU
16 MBit
16 MBit
256 + MCU
2844 + MCU
32 MBit
32 MBit
Total
Minimal flash size(2)
Recommended flash size(2)
(1) Including fail-safe.
(2) For maximum MCU size.
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Note
The maximum supported serial flash size is 32MB (256Mb) (see Using Serial Flash on CC3135/
CC3235 SimpleLink™ Wi-Fi® and Internet-of-Things Devices).
9.8.2 Internal Memory
The CC3235x device includes on-chip SRAM to which application programs are downloaded and executed. The
application developer must share the SRAM for code and data. The micro direct memory access (μDMA)
controller can transfer data to and from SRAM and various peripherals. The CC3235x ROM holds the rich set of
peripheral drivers, which saves SRAM space. For more information on drivers, see the CC3235x API list.
9.8.2.1 SRAM
The CC3235x family provides 256KB of on-chip SRAM. Internal RAM is capable of selective retention during
LPDS mode. This internal SRAM is at offset 0x2000 0000 of the device memory map.
Use the µDMA controller to transfer data to and from the SRAM.
When the device enters low-power mode, the application developer can choose to retain a section of memory
based on need. Retaining the memory during low-power mode provides a faster wakeup. The application
developer can choose the amount of memory to retain in multiples of 64KB. For more information, see the API
guide.
9.8.2.2 ROM
The internal zero-wait-state ROM of the CC3235x device is at address 0x0000 0000 of the device memory and
is programmed with the following components:
• Bootloader
• Peripheral driver library (DriverLib) release for product-specific peripherals and interfaces
The bootloader is used as an initial program loader (when the serial flash memory is empty). The CC3235x
DriverLib software library controls on-chip peripherals with a bootloader capability. The library performs
peripheral initialization and control functions, with a choice of polled or interrupt-driven peripheral support. The
DriverLib APIs in ROM can be called by applications to reduce flash memory requirements and free the flash
memory for other purposes.
9.8.2.3 Flash Memory
The CC3235SF device comes with an on-chip flash memory of 1MB that allows application code to execute in
place while freeing SRAM exclusively for read-write data. The flash memory is used for code and constant data
sections and is directly attached to the icode/dcode bus of the Arm Cortex-M4 core. A 128-bit-wide instruction
prefetch buffer allows maintenance of maximum performance for linear code or loops that fit inside the buffer.
The flash memory is organized as 2KB sectors that can be independently erased. Reads and writes can be
performed at word (32-bit) level.
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9.8.2.4 Memory Map
表 9-5 describes the various MCU peripherals and how they are mapped to the processor memory. For more
information on peripherals, see the API document.
表9-5. Memory Map
START ADDRESS
0x0000 0000
0x0100 0000
0x2000 0000
0x2200 0000
0x4000 0000
0x4000 4000
0x4000 5000
0x4000 6000
0x4000 7000
0x4000 C000
0x4000 D000
0x4002 0000
0x4002 0800
0x4002 4000
0x4003 0000
0x4003 1000
0x4003 2000
0x4003 3000
0x400F 7000
0x400F E000
0x400F F000
0x4200 0000
0x4401 0000
0x4401 8000
0x4401 C000
0x4402 0000
0x4402 1000
0x4402 5000
0x4402 6000
0x4402 D000
0x4402 E000
0x4402 F000
END ADDRESS
0x0007 FFFF
0x010F FFFF
0x2003 FFFF
0x23FF FFFF
0x4000 0FFF
0x4000 4FFF
0x4000 5FFF
0x4000 6FFF
0x4000 7FFF
0x4000 CFFF
0x4000 DFFF
0x4000 07FF
0x4002 0FFF
0x4002 4FFF
0x4003 0FFF
0x4003 1FFF
0x4003 2FFF
0x4003 3FFF
0x400F 7FFF
0x400F EFFF
0x400F FFFF
0x43FF FFFF
0x4401 0FFF
0x4401 8FFF
0x4401 DFFF
0x4402 1FFF
0x4402 2FFF
0x4402 5FFF
0x4402 6FFF
0x4402 DFFF
0x4402 EFFF
0x4402 FFFF
DESCRIPTION
On-chip ROM (bootloader + DriverLib)
On-chip flash (for user application code)
Bit-banded on-chip SRAM
Bit-band alias of 0x2000 0000 to 0x200F FFFF
Watchdog timer A0
COMMENT
CC3235SF device only
GPIO port A0
GPIO port A1
GPIO port A2
GPIO port A3
UART A0
UART A1
I2C A0 (master)
I2C A0 (slave)
GPIO group 4
General-purpose timer A0
General-purpose timer A1
General-purpose timer A2
General-purpose timer A3
Configuration registers
System control
µDMA
Bit band alias of 0x4000 0000 to 0x400F FFFF
SDIO master
Camera Interface
McASP
SSPI
Used for external serial flash
Used by application processor
GSPI
MCU reset clock manager
MCU configuration space
Global power, reset, and clock manager (GPRCM)
MCU shared configuration
Hibernate configuration
Crypto range (includes apertures for all crypto-related
blocks as follows)
0x4403 0000
0x4403 FFFF
0x4403 0000
0x4403 5000
0x4403 7000
0x4403 9000
0xE000 0000
0xE000 1000
0xE000 2000
0xE000 E000
0x4403 0FFF
0x4403 5FFF
0x4403 7FFF
0x4403 9FFF
0xE000 0FFF
0xE000 1FFF
0xE000 2FFF
0xE000 EFFF
DTHE registers and TCP checksum
MD5/SHA
AES
DES
Instrumentation trace Macrocell™
Data watchpoint and trace (DWT)
Flash patch and breakpoint (FPB)
NVIC
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表9-5. Memory Map (continued)
DESCRIPTION
START ADDRESS
0xE004 0000
END ADDRESS
0xE004 0FFF
0xE004 1FFF
0xE00F FFFF
COMMENT
Trace port interface unit (TPIU)
0xE004 1000
Reserved for embedded trace macrocell (ETM)
Reserved
0xE004 2000
9.9 Restoring Factory Default Configuration
The device has an internal recovery mechanism that allows rolling back the file system to its predefined factory
image or restoring the factory default parameters of the device. The factory image is kept in a separate sector on
the serial flash in a secure manner and cannot be accessed from the host processor. The following restore
modes are supported:
• None –no factory restore settings
• Enable restore of factory default parameters
• Enable restore of factory image and factory default parameters
The restore process is performed by calling software APIs, or by pulling or forcing SOP[2:0] = 110 pins and
toggling the nRESET pin from low to high.
The process is fail-safe and resumes operation if a power failure occurs before the restore is finished. The
restore process typically takes about 8 seconds, depending on the attributes of the serial flash vendor.
9.10 Boot Modes
9.10.1 Boot Mode List
The CC3235x device implements a sense-on-power (SOP) scheme to determine the device operation mode.
SOP values are sensed from the device pin during power up. This encoding determines the boot flow. Before the
device is taken out of reset, the SOP values are copied to a register and used to determine the device operation
mode while powering up. These values determine the boot flow as well as the default mapping (to JTAG, SWD,
UART0) for some of the pins. 表9-6 lists the pull configurations.
表9-6. CC3235x Functional Configurations
BOOT MODE NAME
SOP[2]
SOP[1]
SOP[0]
SOP MODE
COMMENT
Factory, lab flash, and SRAM loads
through the UART. The device waits
indefinitely for the UART to load code.
The SOP bits then must be toggled to
configure the device in functional mode.
Also puts JTAG in 4-wire mode.
UARTLOAD
Pullup
Pulldown
Pulldown LDfrUART
Functional development mode. In this
mode, 2-pin SWD is available to the
developer. TMS and TCK are available
for debugger connection.
FUNCTIONAL_2WJ
FUNCTIONAL_4WJ
Pulldown Pulldown
Pulldown Pulldown
Pullup
Fn2WJ
Functional development mode. In this
mode, 4-pin JTAG is available to the
developer. TDI, TMS, TCK, and TDO are
available for debugger connection.
Pulldown Fn4WJ
Supports flash and SRAM load through
UART and functional mode. The MCU
bootloader tries to detect a UART break
on UART receive line. If the break signal
UARTLOAD_FUNCTIONAL_4WJ
Pulldown Pullup
Pulldown LDfrUART_Fn4WJ is present, the device enters the
UARTLOAD mode, otherwise, the device
enters the functional mode. TDI, TMS,
TCK, and TDO are available for debugger
connection.
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表9-6. CC3235x Functional Configurations (continued)
BOOT MODE NAME
SOP[2]
SOP[1]
SOP[0]
SOP MODE
COMMENT
When device reset is toggled, the MCU
bootloader kick-starts the procedure to
restore factory default images.
RET_FACTORY_IMAGE
Pulldown Pullup
Pullup
RetFactDef
The recommended values of pull down resistors are 69.8-kΩ for SOP0 and SOP1 and 100-kΩ for SOP2. The
application can use SOP2 for other functions after the device has powered up. To avoid spurious SOP values
from being sensed at power up, TI strongly recommends using the SOP2 pin only for output signals. The SOP0
and SOP1 pins are used as 5 GHz control switch and are not available for other functions. Ensure the SOP pins
are configured as shown in 图 10-7, this is the recommended configuration to ensure the RF Switch, SOP boot
modes, and Factory restore process operates optimally without conflict.
9.11 Hostless Mode
The SimpleLink Wi-Fi CC3235 device incorporates a scripting ability that enables offloading of simple tasks from
the host processor. Using simple and conditional scripts, repetitive tasks can be handled internally, which allows
the host processor to remain in a low-power state. In some cases where the scripter is being used to send
packets, it reduces code footprint and memory consumption. The if-this-then-that style conditioning can include
anything from GPIO toggling to transmitting packets.
The conditional scripting abilities can be divided into conditions and actions. The conditions define when to
trigger actions. Only one action can be defined per condition, but multiple instances of the same condition may
be used, so in effect multiple actions can be defined for a single condition. In total, 16 condition and action pairs
can be defined. The conditions can be simple, or complex using sub-conditions (using a combinatorial AND
condition between them). The actions are divided into two types, those that can occur during runtime and those
that can occur only during the initialization phase.
The following actions can only be performed when triggered by the pre-initialization condition:
• Set roles AP, station, P2P, and Tag modes
• Delete all stored profiles
• Set connection policy
• Hardware GPIO indication allows an I/O to be driven directly from the WLAN core hardware to indicate
internal signaling
The following actions may be activated during runtime:
• Send transceiver packet
• Send UDP packet
• Send TCP packet
• Increment counter increments one of the user counters by 1
• Set counter allows setting a specific value to a counter
• Timer control
• Set GPIO allows GPIO output from the device using the internal networking core
• Enter Hibernate state
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Note
Consider the following limitations:
• Timing cannot be ensured when using the network scripter because some variable latency will
apply depending on the utilization of the networking core.
• The scripter is limited to 16 pairs of conditions and reactions.
• Both timers and counters are limited to 8 instances each. Timers are limited to a resolution of 1
second. Counters are 32 bits wide.
• Packet length is limited to the size of one packet and the number of possible packet tokens is
limited to 8.
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10 Applications, Implementation, and Layout
Note
以下应用部分中的信息不属于TI 器件规格的范围,TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计,以确保系统功能。
10.1 Application Information
10.1.1 BLE/2.4 GHz Radio Coexistence
The CC3235x device is designed to support BLE/2.4 GHz radio coexistence. Because WLAN is inherently more
tolerant to time-domain disturbances, the coexistence mechanism gives priority to the Bluetooth® low energy
entity over the WLAN. Bluetooth® low energy operates in the 2.4 GHz band, therefore the coexistence
mechanism does not affect the 5 GHz band. The CC3235x device can operate normally on the 5 GHz band,
while the Bluetooth® low energy works on the 2.4 GHz band without mutual interference.
The following coexistence modes can be configured by the user:
• Off mode or intrinsic mode
– No BLE/2.4 GHz radio coexistence, or no synchronization between WLAN and Bluetooth® low energy—in
case Bluetooth® low energy exists in this mode, collisions can randomly occur.
• Time Division Multiplexing (TDM, Single Antenna)
– 2.4 GHz Wi-Fi band (see 图10-1)
In this mode, the two entities share the antenna through an RF switch using two GPIOs (one input and
one output from the WLAN perspective).
– 5 GHz Wi-Fi band (see 图10-2)
In this mode, the WLAN operates on the 5 GHz band and Bluetooth® low energy operates on the 2.4 GHz
band. A 2.4- or 5 GHz diplexer is required for sharing the single antenna.
• Time Division Multiplexing (TDM, Dual Antenna)
– 2.4 GHz Wi-Fi Band (see 图10-3)
In this mode, the two entities have separate antennas. No RF switch is required and only a single GPIO
(one input from the WLAN perspective).
– 5 GHz Wi-Fi band (see 图10-4)
In this mode, the WLAN operates on the 5 GHz band and Bluetooth® low energy operates on the 2.4 GHz
band. No diplexer is required for the dual-antenna solution.
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BLE / 2.4 GHz Ant.
SPDT RF SWITCH
RF_BG
RF
WLAN
CC3235x
BLE
CCxxxx
CC_COEX_SW_OUT
CC_COEX_BLE_IN
Coex IO
图10-1. 2.4 GHz, Single-Antenna Coexistence Mode Block Diagram
图 10-2 shows the single antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. The SOP lines control the 5 GHz switch. The
Coex switch is controlled by a GPIO signal from the BLE device and a GPIO signal from the CC3235x device.
A_TX
5 GHz SPDT RF
SWITCH
A_RX
Dual band Ant.
SOP0
SOP1
5 GHz
BPF
WLAN
CC3235x
RF_BG
2.4 / 5 GHz
Diplexer
CC_COEX_SW_OUT
Coex SPDT RF
SWITCH
2.4 GHz
BPF
BLE
CCxxxx
Coex
IO
RF
CC_COEX_BLE_IN
图10-2. Single Antenna Coexistence Solution with 5 GHz Wi-Fi
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图 10-3 shows the dual antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. Note in this implementation no Coex switch
is required and only a single GPIO from the BLE device to the CC3235x device is required.
2.4 GHz Ant.
BLE Ant.
RF
RF_BG
WLAN
CC3235x
BLE
CCxxxx
CC_COEX_BLE_IN
Coex IO
图10-3. Dual-Antenna Coexistence Mode Block Diagram
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图 10-4 shows the dual antenna implementation of a complete Bluetooth® low energy and WLAN coexistence
network with the WLAN operating on either a 2.4- or a 5 GHz band. In this case the 2.4 GHz and 5 GHz Wi-Fi
share an antenna and the BLE has it's own dedicated antenna. The SOP lines control the 5 GHz switch. Note in
this implementation no Coex switch is required and only a single GPIO from the BLE device to the CC3235x
device is required.
A_TX
5 GHz SPDT RF
SWITCH
A_RX
Dual Band Ant.
SOP0
SOP1
5 GHz
BPF
WLAN
CC3235x
2.4 / 5 GHz
Diplexer
RF_BG
2.4 GHz
BPF
CC_COEX_SW_OUT
BLE
CCxxxx
CC_COEX_BLE_IN
Coex IO
RF
BLE Ant.
图10-4. Dual Antenna Coexistence Solution with 5 GHz Wi-Fi
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10.1.2 Antenna Selection
The CC3235x device is designed to also support antenna selection and is controlled from Image Creator. When
enabled, there are 3 options possible options:
• ANT 1: When selected, the GPIOs that are defined for antenna selection with set the RF path for antenna 1.
• ANT 2: When selected, the GPIOs that are defined for antenna selection will set the RF path for antenna 2.
• Autoselect: When selected, during a scan and prior to connecting to an AP, CC3235x device will determine
the best RF path and select the appropriate antenna 13 14. The result is the saved as port of the profile.
图10-5 shows the implementation of a complete Bluetooth® low energy and WLAN coexistence network with the
WLAN operating on either a 2.4- or a 5 GHz band with antenna selection. The SOP lines control the 5 GHz
switch. The Coex switch is controlled by a GPIO signal from the BLE device and a GPIO signal from the
CC3235x device. The Antenna switch is controlled by 2 GPIO lines from the CC3235x device.
A_TX
5 GHz SPDT RF
SWITCH
A_RX
Dual Band Ant. 1
SOP0
SOP1
5 GHz
BPF
WLAN
CC3235x
RF_BG
2.4 / 5 GHz
Diplexer
Antenna Selection
SPDT RF Switch
CC_COEX_SW_OUT
Coex SPDT RF
SWITCH
2.4 GHz
BPF
BLE
CCxxxx
CC_COEX_BLE_IN
Coex IO
RF
Dual Band Ant. 2
ANT_SEL_1
ANT_SEL_2
图10-5. Antenna Selection Solution with Coexistence Solution and 5 GHz Wi-Fi
13
14
When selecting Autoselect via the API, a reset is required in order for the CC3235x device to determine the best antenna for use.
Refer to the Uniflash with Image Creator User Guidefor more information.
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图10-6 shows the antenna selection implementation for Wi-Fi, with BLE operating on it's own antenna. The SOP
lines control the 5 GHz switch. Note in this implementation no Coex switch is required and only a single GPIO
from the BLE device to the CC3235x device is required. The Antenna switch is controlled by 2 GPIO lines from
the CC3235x device.
A_TX
5 GHz SPDT RF
SWITCH
Dual Band Ant. 2
A_RX
5 GHz
BPF
SOP0
SOP1
WLAN
CC3235x
2.4 / 5 GHz
Diplexer
Antenna Selection
SPDT RF Switch
RF_BG
2.4 GHz
BPF
CC_COEX_SW_OUT
Dual Band Ant. 2
BLE
CCxxxx
CC_COEX_BLE_IN
Coex IO
RF
ANT_SEL_1
ANT_SEL_2
BLE Ant.
图10-6. Coexistence Solution with Wi-Fi Antenna Selection and dedicated BLE antenna
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10.1.3 Typical Application
图 10-7 shows the schematic of the engine area for the CC3235x device in the wide-voltage mode of operation, with the corresponding bill of materials
show in 表 10-1. 图 10-8 provides the schematic for the RF implementation with and without BLE/2.4 GHz coexistence, with the corresponding bill of
materials shown in 表10-2. For a full operation reference design, see the CC3235x SimpleLink™ and Internet of Things Hardware Design Files.
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VBAT_CC
VBAT_CC
Optional:
Consider adding extra decoupling
capacitors if the battery cannot source
the peak currents.
VBAT_CC
R1
100k
VBAT_CC
CC_nRESET
CC_nRESET
C1
100µF
C2
100µF
RF_BG
C3
4.7uF
C4
4.7uF
C5
0.6pF
C6
4.7uF
C7
0.5pF
C8
0.1µF
C9
0.1µF
C10
0.01µF
See Figure 7.8 For
RF Configuration Options
GND
GND
A_TX
A_RX
GND
GND
GND
GND
GND
GND
GND
GND
VBAT_CC
U1
U2
VIN_IO1
VIN_IO2
8
L1
VCC
10
54
44
39
37
38
48
32
31
1
RESET
RF_BG
CS
SCLK
R2
100k
6
2.2uH
C11
0.1µF
5
SI/SIO0
SO/SIO1
2
VDD_ANA
28
27
3
VIN_DCDC_DIG
VIN_DCDC_PA
VIN_DCDC_ANA
DCDC_ANA_SW
VDD_ANA1
A_TX
A_RX
WP/SIO2
RESET/SIO3
7
4
GND
GND
14
13
12
11
SFL_CS
MX25R3235FM1IL0
FLASH_SPI_CS
FLASH_SPI_DIN
FLASH_SPI_DOUT
FLASH_SPI_CLK
SFL_DIN
SFL_DOUT
SFL_CLK
C12
10uF
C13
0.1µF
C14
0.2pF
C15
0.1uF
C16
0.6pF
GND
GND
GND
GND
GND
GND
R3 R4
100k 100k
50
55
57
58
59
60
61
62
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
P50_GPIO_00
P55_GPIO_01
P57_GPIO_02
P58_GPIO_03
P59_GPIO_04
P60_GPIO_05
P61_GPIO_06
P62_GPIO_07
36
25
L2
LDO_IN1
LDO_IN2
1uH
40
41
42
33
43
DCDC_PA_SW_P
DCDC_PA_SW_N
DCDC_PA_OUT
VDD_PA_IN
VDD_PA
GND GND
63
64
1
GPIO8
GPIO9
P63_GPIO_08
P64_GPIO_09
P01_GPIO_10
P02_GPIO_11
P03_GPIO_12
P04_GPIO_13
P05_GPIO_14
P06_GPIO_15
C17
22uF
C18
22uF
C19
1µF
TP1
TP2
TP3
TP4
TP5
L3
GPIO10
GPIO11
GPIO12
GPIO13
GPIO14
GPIO15
CC_nReset
P55_GPIO_01
P57_GPIO_02
SOP0
2
3
FLASH PROGRAMMING
INTERFACE
DCDC_DIG_SW
4
2.2uH
VDD_DIG
GND
GND
GND
9
56
5
VDD_DIG1
VDD_DIG2
Add provision on the board to isolate
GPIO_01 and GPIO_02 while programming
6
45
46
47
49
24
7
DCDC_ANA2_SW_P
DCDC_ANA2_SW_N
VDD_ANA2
GPIO16
GPIO17
GPIO22
GPIO28
GPIO30
P07_GPIO_16
P08_GPIO_17
P15_GPIO_22
P18_GPIO_28
P53_GPIO_30
C20
10uF
C21
0.1µF
C22
0.1µF
VBAT_CC
8
SOP2
15
18
53
Pins 45, 46 and 47:
Refer to BOM Table for notes on
device-dependent configurations.
L4
R5
0
GND
GND
GND
10uH
VDD_RAM
51
52
RTC_XTAL_P
RTC_XTAL_N
VDD_PLL
C23
10uF
26
23
22
2
1
NC
WLAN_XTAL_P
WLAN_XTAL_N
C24
0.1µF
C25
0.1uF
Y1
32.768kHz
35
34
21
SOP0
SOP1
SOP2
C26
10pF
C27
10pF
GND
30
29
65
GND
GND
GND
GND
C28
6.2pF
19
20
16
17
TCK
TMS
TDI
C29
0.6pF
C30
6.2pF
GND
GND
TDO
GND_TAB
Y2
40MHz
GND
VBAT_CC
CC3235SF12RGKR
GND
GND
GND
GND
GND
R6
270
R7
69.8k
R8
69.8k
SOP0
SOP1
SOP2
GND
P17_JTAG_TDO
P16_JTAG_TDI
P20_JTAG_TMS
P19_JTAG_TCK
JTAG
J1
J2
J3
R9
100k
R10
69.8k
R11
69.8k
GND
GND
GND
图10-7. CC3235x Engine Area
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表10-1. Bill of Materials for CC3235x Engine Area
Quantity
Designator
Value
Manufacturer
Part Number
Description
CAP, CERM, 100 µF, 10 V,
+/- 20%, X5R, AEC-Q200 Grade 3, 1210
2
3
3
1
7
1
3
1
2
2
1
2
C1, C2
100 µF
4.7 µF
0.6 pF
0.5 pF
0.1 µF
0.01 µF
10 µF
0.2 pF
0.1 µF
22 µF
1 µF
Taiyo Yuden
LMK325ABJ107MMHT
CAP, CERM, 4.7 uF, 6.3 V,
+/- 20%, X6S, 0402
C3, C4, C6
C5, C16, C29
C7
Taiyo Yuden
MuRata
JMK105BC6475MV-F
GJM0335C1ER60BB01D
GJM0335C1ER50BB01D
CL05B104KO5NNNC
0402B103K500CT
CAP, CERM, 0.6pF, 25 V,
+/- 16%, C0G/NP0, 0201
CAP, CERM, 0.5 pF, 25 V,
+/- 20%, C0G/NP0, 0201
Murata
C8, C9, C11, C13, C21,
C22, C24
CAP, CERM, 0.1 µF, 16 V,
+/- 10%, X7R, 0402
Walsin
CAP, CERM, 0.01 µF, 50 V,
+/- 10%, X7R, 0402
C10
Walsin
CAP, CERM, 10 uF, 10 V,
+/- 20%, X6S, 0603
C12, C20, C23
C14
Taiyo Yuden
MuRata
LMK107BC6106MA-T
GJM0335C1ER20BB01D
CL03A104KP3NNNC
GRM188C80G226ME15J
CL05A105MP5NNNC
0402N100J500CT
CAP, CERM, 0.2pF, 25 V,
+/- 50%, C0G/NP0, 0201
CAP, CERM, 0.1 uF, 10 V,
+/- 10%, X5R, 0201
C15, C25
C17, C18
C19
Samsung Electro-Mechanics
MuRata
CAP, CERM, 22 uF, 4 V,
+/- 20%, X6S, 0603
CAP, CERM, 1 µF, 10 V,
+/- 20%, X5R, 0402
Walsin
CAP, CERM, 10 pF, 50 V,
+/- 5%, C0G/NP0, 0402
C26, C27
10 pF
6.2 pF
Walsin
CAP, CERM, 6.2 pF, 50 V,
+/- 4%, C0G/NP0, 0402
2
3
2
C28, C30
J1, J2, J3
L1, L3
Walsin
0402N6R2C500CT
61300311121
Wurth Elektronik
MuRata
Header, 2.54 mm, 3x1, Gold, TH
Inductor, Multilayer, Ferrite,
2.2 uH, 1.2 A, 0.11 ohm, SMD
2.2 µH
1 µH
LQM2MPN2R2NG0
Inductor, Multilayer, Ferrite,
1 uH, 1.6 A, 0.055 ohm, SMD
1
1
L2
MuRata
TDK
LQM2HPN1R0MG0L
MLP2520S100MT0S1
Inductor, Multilayer, Ferrite,
10 uH, 0.7 A, 0.364 ohm, SMD
L4(1)
10 µH
RES, 100 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
5
1
1
R1, R2, R3, R4, R9
100k
0
Vishay-Dale
Panasonic
CRCW0402100KJNED
ERJ-2GE0R00X
R5(2)
R6
RES, 0, 5%, 0.063 W, 0402
RES, 270, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
270
Vishay-Dale
CRCW0402270RJNED
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表10-1. Bill of Materials for CC3235x Engine Area (continued)
Quantity
Designator
Value
Manufacturer
Part Number
Description
RES, 69.8 k, 1%, 0.063 W,
AEC-Q200 Grade 0, 0402
4
R7, R8, R10, R11
69.8k
Vishay-Dale
CRCW040269K8FKED
Ultra low power, 32M-bit
1
1
U1
U2
Macronix International Co., LTD MX25R3235FM1IL0
[x 1/x 2/x 4] CMOS MXSMIO(serial multi I/O)
Flash memory, SOP-8
SimpleLink Wi-Fi and Internet-of-Things
Solution, a Single-Chip Wireless MCU,
RGK0064B (VQFN-64)
Texas Instruments
CC3235SF12RGKR
1
1
Y1
Y2
Abracon Corporation
TXC Corporation
ABS07-32.768KHZ-9-T
8Y40072002
Crystal, 32.768KHz, 9PF, SMD
Crystal, 40 MHz, 8 pF, SMD
(1) For the CC3235SF device, L4 is populated. For the CC3235S device, L4 is not populated.
(2) For the CC3220SF device, R5 is not populated. For the CC3235S device if R5 is populated, Pin 45 can be used as GPIO_31.
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Fine tuning of DC blocking capacitor
values for C31, C32, and C33 may be
required for optimal performance.
U3
C31
1
3
2
6
4
5
RF1
VC1
VC2
RFC
RF_BLE
C32
68pF
RF2
C33
68pF
GND
R12
100k
C34
100pF
R13
100k
C35
100pF
68pF
RTC6608OSP
Circuit configuration for BLE/2.4-GHz
COEX only. If feature is not being used
GND these components are not required.
GND
GND
GND
GND
A DC blocking capacitor is required. If
the antenna match contains a series
capacitor, this is sufficient to meet the
requirement and thus C36 is not
required.
E1
FL1
Antenna match. Pi
network might be
required depending on
type of antenna.
1
3
IN
OUT
RF_BG
2
4
GND
GND
U4
C36
C37
1
3
5
LBP
CP
DEA202450BT-1294C1-H
8.2pF
2.2pF
2
4
6
HBP
GND
GND
GND
L5
3.9nH
GND
DPX165950DT-8148A1
U5
FL2
IN
C38
C39
GND
2
3
1
5
1
3
2
GND
RF2
RF1
RFC
VC2
VC1
OUT
GND
C40
1.6pF
1.9pF
4
6
A_RX
A_TX
GND
GND
GND
C41
4.7pF
L6
2.7nH
DEA165538BT-2236B1-H
4.7pF
GND
RTC6608OSP
GND
GND
SOP0
SOP1
C42
100pF
C43
100pF
GND
GND
图10-8. CC3235x RF Schematic Implementation with and without Coexistence
Note
The Following guidelines are recommended for implementation of the RF design:
• Ensure an RF path is designed with an impedance of 50 Ω
• Tuning of the antenna impedance πmatching network is recommended after manufacturing of the PCB to account for PCB parasitics
• πor L matching and tuning may be required between cascaded passive components on the RF path
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表10-2. Bill of Materials For CC3235x RF Section
Quantity
Designator
Value
Manufacturer
Part Number
Description
CAP, CERM, 68 pF, 50 V,
+/- 5%, C0G/NP0, 0201
3
C31(1), C32(1), C33(1)
68 pF
Murata
Yageo
GRM0335C1H680JA1D
CAP, CERM, 100 pF, 25 V,
+/- 5%, C0G/NP0, 0201
4
1
1
1
1
C34(1), C35(1), C42, C43
100 pF
8.2 pF
2.2 pF
1.6 pF
1.9 pF
4.7 pF
CC0201JRNPO8BN101
0402N8R2C500CT
CAP, CERM, 8.2 pF, 50 V,
+/- 3%, C0G/NP0, 0402
C36
C37
C38
C39
Walsin
CAP, CERM, 2.2 pF, 50 V,
+/- 4.5%, C0G/NP0, 0402
MuRata
MuRata
MuRata
MuRata
GJM1555C1H2R2BB01D
GRM0335C1H1R6BA01D
GJM1555C1H1R9WB01D
CAP, CERM, 1.6 pF, 50 V,
+/- 7%, C0G/NP0, 0201
CAP, CERM, 1.9 pF, 50 V,
+/- 2.6%, C0G/NP0, 0402
CAP, CERM, 4.7 pF, 50 V,
+/- 3%, C0G/NP0, 0201
2
1
1
C40, C41
E1
GRM0335C1H4R7BA01D
M830520
Ethertronics
TDK
WLAN Antenna 802.11, SMD
Multilayer Chip Band Pass Filter For 2.4 GHz
W-LAN/Bluetooth, SMD
FL1
DEA202450BT-1294C1-H
Multilayer Band Pass Filter For
5 GHz W-LAN/LTE-U
1
1
FL2
L5
TDK
DEA165538BT-2236B1-H
LQG15HS3N9S02D
Inductor, Multilayer, Air Core,
3.9 nH, 0.75 A, 0.14 ohm, SMD
3.9 nH
2.7 nH
100k
MuRata
Inductor, Multilayer, Air Core,
2.7 nH, 0.9 A, 0.07 ohm,
AEC-Q200 Grade 1, SMD
1
L6
MuRata
LQG15WH2N7C02D
RES, 100 k, 5%, 0.063 W,
AEC-Q200 Grade 0, 0402
2
2
R12(1), R13(1)
U3(1), U5
Vishay-Dale
Richwave
CRCW0402100KJNED
RTC6608OSP
0.03 GHz-6 GHz SPDT Switch
Multilayer Diplexer for 2.4 GHz W-LAN &
Bluetooth / 5 GHz
1
U4
TDK
DPX165950DT-8148A1
W-LAN
(1) If the BLE/2.4 GHz Coexistence features is not used, these components are not required.
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10.2 PCB Layout Guidelines
This section details the PCB guidelines to speed up the PCB design using the CC3235x VQFN device. Follow
these guidelines ensures that the design will minimize the risk with regulatory certifications including FCC, ETSI,
and CE. For more information, see CC3135 and CC3235 SimpleLink™ Wi-Fi® and IoT Solution Layout
Guidelines.
10.2.1 General PCB Guidelines
Use the following PCB guidelines:
• Verify the recommended PCB stackup in the PCB design guidelines, as well as the recommended layers for
signals and ground.
• Ensure that the VQFN PCB footprint follows the information in 节12.
• Ensure that the VQFN PCB GND and solder paste follow the recommendations provided in CC3135 and
CC3235 SimpleLink™ Wi-Fi® and IoT Solution Layout Guidelines.
• Decoupling capacitors must be as close as possible to the VQFN device.
10.2.2 Power Layout and Routing
Three critical DC/DC converters must be considered for the CC3235x device.
• Analog DC/DC converter
• PA DC/DC converter
• Digital DC/DC converter
Each converter requires an external inductor and capacitor that must be laid out with care. DC current loops are
formed when laying out the power components.
10.2.2.1 Design Considerations
The following design guidelines must be followed when laying out the CC3235x device:
• Ground returns of the input decoupling capacitors (C13, C15, and C22) should be routed on Layer 2 using
thick traces to isolate the RF ground from the noisy supply ground. This step is also required to meet the
IEEE spectral mask specifications.
• Maintain the thickness of power traces to be greater than 12 mils. Take special consideration for power
amplifier supply lines (pin 33, 40, 41, and 42), and all input supply pins (pin 37, 39, and 44).
• Ensure the shortest grounding loop for the PLL supply decoupling capacitor (pin 24).
• Place all decoupling capacitors as close to the respective pins as possible.
• Power budget—the CC3235x device can consume up to 450 mA for 3.3 V, 670 mA for 2.1 V, for
24 ms during the calibration cycle.
• Ensure the power supply is designed to source this current without any issues. The complete calibration (TX
and RX) can take up to 17 mJ of energy from the battery over a time of 24 ms.
• The CC3235x device contains many high-current input pins. Ensure the trace feeding these pins can handle
the following currents:
– VIN_DCDC_PA input (pin 39) maximum 1 A
– VIN_DCDC_ANA input (pin 37) maximum 600 mA
– VIN_DCDC_DIG input (pin 44) maximum 500 mA
– DCDC_PA_SW_P (pin 40) and DCDC_PA_SW_N (pin 41) switching nodes maximum 1 A
– DCDC_PA_OUT output node (pin 42) maximum 1 A
– DCDC_ANA_SW switching node (pin 38) maximum 600 mA
– DCDC_DIG_SW switching node (pin 43) maximum 500 mA
– VDD_PA_IN supply (pin 33) maximum 500 mA
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图10-9 shows the ground routing for the input decoupling capacitors.
C7: 0.5 pF
C5: 0.6 pF
C16: 0.6 pF
C14: 0.2 pF
C29: 0.6 pF
图10-9. Ground Routing for Input Decoupling Capacitors
Note
The ground returns for the input capacitors are routed on layer two to reduce the EMI and improve the
spectral mask. This routing must be strictly followed because it is critical for the overall performance of
the device.
Pin 37
Ground
Traces
Pin 37
Pin 37
图10-10. Ground Returns for Input Capacitors
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10.2.3 Clock Interface Guidelines
The following guidelines are for the slow clock:
• The 32.768-kHz crystal must be placed close to the VQFN package.
• Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within
±150 ppm.
• The ground plane on layer two is solid below the trace lanes, and there is ground around these traces on the
top layer.
The following guidelines are for the fast clock:
• The 40-MHz crystal must be placed close to the VQFN package.
• Ensure that the load capacitance is tuned according to the board parasitics to the frequency tolerance within
±10 ppm at room temperature. The total frequency across parts, temperature, and with aging must be ±20
ppm to meet the WLAN specification.
• To avoid noise degradation, ensure that no high-frequency lines are routed close to the routing of the crystal
pins.
• Ensure that crystal tuning capacitors are close to the crystal pads.
• Both traces (XTAL_N and XTAL_P) should be as close as possible to parallel and approximately the same
length.
• The ground plane on layer two is solid below the trace lines, and there should be ground around these traces
on the top layer.
• For frequency tuning, see CC31xx & CC32xx Frequency Tuning.
10.2.4 Digital Input and Output Guidelines
The following guidelines are for the digital I/Os:
• Route SPI and UART lines away from any RF traces.
• Keep the length of the high-speed lines as short as possible to avoid transmission line effects.
• Keep the line lower than 1/10 of the rise time of the signal to ignore transmission line effects (required if the
traces cannot be kept short). Place the resistor at the source end closer to the device that is driving the
signal.
• Add a series-terminating resistor for each high-speed line (for example, SPI_CLK or SPI_DATA) to match the
driver impedance to the line. Typical terminating-resistor values range from 27 to 36 Ωfor a 50-Ωline
impedance.
• Route high-speed lines with a continuous ground reference plane below it to offer good impedance
throughout. This routing also helps shield the trace against EMI.
• Avoid stubs on high-speed lines to minimize the reflections. If the line must be routed to multiple locations,
use a separate line driver for each line.
• If the lines are longer compared to the rise time, add series-terminating resistors near the driver for each
high-speed line to match the driver impedance to the line. Typical terminating-resistor values range from 27 to
36 Ωfor a 50-Ωline impedance.
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10.2.5 RF Interface Guidelines
The following guidelines are for the RF interface. Follow guidelines specified in the vendor-specific antenna
design guides (including placement of the antenna). Also see CC3135 and CC3235 SimpleLink™ Wi-Fi® and IoT
Solution Layout Guidelines for general antenna guidelines.
• Ensure that the antenna is matched for 50-Ω. A π-matching network is recommended. Ensure that the π
pad is available for tuning the matching network after PCB manufacture.
• A DC blocking capacitor is required before the antenna. If the antenna matching network contains a series
capacitor, this is sufficient to meet the requirement.
• Ensure that the area underneath the BPFs pads have a solid plane on layer 2 and that the minimum filter
requirements are met.
• Ensure that the area underneath the RF switch pads have a solid plane on layer 2 and that the minimum
switch isolation requirements are met.
• Ensure that the area underneath the diplexer pads have a solid plane on layer 2 and that the minimum
diplexer requirements are met.
• Verify that the Wi-Fi RF trace is a 50-Ω, impedance-controlled trace with a reference to solid ground.
• The RF trace bends must be made with gradual curves. Avoid 90-degree bends.
• The RF traces must not have sharp corners.
• There must be no traces or ground under the antenna section.
• The RF traces must have via stitching on the ground plane beside the RF trace on both sides.
• For optimal antenna performance, ensure adequate ground plane around the antenna on all layers.
• Ensure RF connectors for conducted testing are isolated from the top layer ground using vias.
• Maintain a controlled pad to trace shapes using filleted edges if necessary to avoid mismatch.
• Diplexers, switches, BPF, and other elements on the RF route should be isolated from the top layer ground
using vias.
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11 Device and Documentation Support
11.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
11.2 Tools and Software
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed in this section.
For the most up-to-date list of development tools and software, see the CC3235 Tools & Software product page.
Users can also click the "Alert Me" button on the top right corner of the CC3235 Tools & Software page to stay
informed about updates related to the CC3235x device.
Development Tools
Pin Mux Tool
The supported devices are: CC3200, CC3220x, and CC3235x.
The Pin Mux Tool is a software tool that provides a graphical user interface (GUI) for
configuring pin multiplexing settings, resolving conflicts and specifying I/O cell
characteristics for MPUs from TI. Results are output as C header/code files that can
be imported into software development kits (SDKs) or used to configure customers'
custom software. Version 3 of the Pin Mux Tool adds the capability of automatically
selecting a mux configuration that satisfies the entered requirements.
SimpleLink™ Wi-Fi®
Starter Pro
The supported devices are: CC3100, CC3200, CC3120R, CC3220x, CC3135 and
CC3235x.
The SimpleLink™ Wi-Fi® Starter Pro mobile App is a new mobile application for
SimpleLink™ provisioning. The app goes along with the embedded provisioning
library and example that runs on the device side (see SimpleLink™ Wi-Fi® SDK plugin
and TI SimpleLink ™ CC32XX Software Development Kit (SDK)). The new
provisioning release is a TI recommendation for Wi-Fi® provisioning using SimpleLink
™ Wi-Fi® products. The provisioning release implements advanced AP mode and
SmartConfig™ technology provisioning with feedback and fallback options to ensure
successful process has been accomplished. Customers can use both embedded
library and the mobile library for integration to their end products.
SimpleLink™ CC32XX
The CC3235x devices are supported.
Software Development
Kit (SDK)
The SimpleLink™ CC32XX SDK contains drivers for the CC3235 programmable
MCU, more than 30 sample applications, and documentation needed to use the
solution. It also contains the flash programmer, a command line tool for flashing
software, configuring network and software parameters (SSID, access point channel,
network profile, BS NIEW), system files, and user files (certificates, web pages, and
more). This SDK can be used with TI’s SimpleLink™ Wi-Fi® CC3235 LaunchPad™
development kits.
Uniflash Standalone
Flash Tool for TI
The supported devices are: CC3120R, CC3220x, CC3135 and CC3235x.
Microcontrollers (MCU), CCS Uniflash is a standalone tool used to program on-chip flash memory on TI MCUs
Sitara Processors &
SimpleLink Devices
and on-board flash memory for Sitara™ processors. Uniflash has a GUI, command
line, and scripting interface. CCS Uniflash is available free of charge.
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SimpleLink™ Wi-Fi®
Radio Testing Tool
The supported devices are: CC3100, CC3200, CC3120R, CC3220, CC3135 and
CC3235x.
The SimpleLink™ Wi-Fi® Radio Testing Tool is a Windows-based software tool for RF
evaluation and testing of SimpleLink™ Wi-Fi® CC3x20 and CC3x35 designs during
development and certification. The tool enables low-level radio testing capabilities by
manually setting the radio into transmit or receive modes. Using the tool requires
familiarity and knowledge of radio circuit theory and radio test methods.
Created for the internet-of-things (IoT), the SimpleLink™ Wi-Fi® CC31xx and CC32xx
family of devices include on-chip Wi-Fi®, Internet, and robust security protocols with
no prior Wi-Fi® experience needed for faster development. For more information on
these devices, visit SimpleLink™ Wi-Fi® family, Internet-on-a chip™ solutions.
UniFlash Standalone
Flash Tool for TI
Microcontrollers (MCU),
Sitara™ Processors and
SimpleLink™ Devices
CCS UniFlash is a standalone tool used to program on-chip flash memory on TI
MCUs and on-board flash memory for Sitara™ processors. UniFlash has a GUI,
command line, and scripting interface. CCS UniFlash is available free of charge.
TI Designs and Reference Designs
The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded
processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs
include schematic or block diagrams, BOMs, and design files to speed your time to market.
11.3 Firmware Updates
TI updates features in the service pack for this module with no published schedule. Due to the ongoing changes,
TI recommends that the user has the latest service pack in their module for production.
To stay informed, click the SDK “Alert me” button the top right corner of the product page, or visit SimpleLink
™ CC32XX SDK.
11.4 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of the
CC3235x device and support tools (see 图11-1).
X
CC
3
2
3
5
x
xx
xxx
x
PREFIX
X = Preproduction device
Null = Production device
PACKAGING
R = large reel
DEVICE FAMILY
CC = Wireless Connectivity
PACKAGE
RGK = 9-mm × 9-mm VQFN
SERIES NUMBER
3 = Wi-Fi Centric
MEMORY SIZE
M2 = 256KB RAM
12 = 1MB Flash and 256KB RAM
MCU / HOST
1 = No MCU
2 = MCU
DEVICE VARIANTS
S = Secured
SF = Secured Flash
DEVICE GENERATION
0 = Gen 1
2 = Gen 2
DUAL BAND
0 = 2.4-GHz only
5 = 2.4-GHz and 5-GHz supported
3 = Gen 3
图11-1. CC3235x Device Nomenclature
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11.5 Documentation Support
To receive notification of documentation updates—including silicon errata—go to the product folder for your
device on ti.com (CC3235). In the upper right corner, click the "Alert me" button. This registers you to receive a
weekly digest of product information that has changed (if any). For change details, check the revision history of
any revised document. The current documentation that describes the processor, related peripherals, and other
technical collateral follows.
The following documents provide support for the CC3235 device.
Application Reports
CC3135 and CC3235 SimpleLink ™ CC3135 and CC3235 SimpleLink Wi-Fi Embedded Programming User
Wi-Fi® Embedded Programming User Guide
Guide
SimpleLink™ CC3135, CC3235 Wi-Fi® This application report describes the best practices for power
Internet-on-a chip™ Networking Sub- management and extended battery life for embedded low-power Wi-Fi
System Power Management
devices such as the SimpleLink Wi-Fi Internet-on-a chip solution from
Texas Instruments.
SimpleLink™ CC31xx, CC32xx Wi-Fi® The SimpleLink Wi-Fi CC31xx and CC32xx Internet-on-a chip family of
Internet-on-a chip™ Solution Built-In devices from Texas Instruments offer a wide range of built-in security
Security Features
features to help developers address a variety of security needs, which
is achieved without any processing burden on the main microcontroller
(MCU). This document describes these security-related features and
provides recommendations for leveraging each in the context of
practical system implementation.
SimpleLink™ CC3135, CC3235 Wi-Fi® This document describes the OTA library for the SimpleLink Wi-Fi
and Internet-of-Things Over-the-Air CC3x35 family of devices from Texas Instruments and explains how to
Update
prepare a new cloud-ready update to be downloaded by the OTA
library.
SimpleLink™ CC3135, CC3235 Wi-Fi® This guide describes the provisioning process, which provides the
Internet-on-a chip™ Solution Device SimpleLink Wi-Fi device with the information (network name, password,
Provisioning
and so forth) needed to connect to a wireless network.
Transfer of TI's Wi-Fi® Alliance This document explains how to employ the Wi-Fi® Alliance (WFA)
Certifications to Products Based on derivative certification transfer policy to transfer a WFA certification,
SimpleLink™
already obtained by Texas Instruments, to a system you have
developed.
Using Serial Flash on SimpleLink™ This application note is divided into two parts. The first part provides
CC3135 and CC3235 Wi-Fi® and important guidelines and best- practice design techniques to consider
Internet-of-Things Devices
when choosing and embedding a serial Flash paired with the CC3135
and CC3235 (CC3x35) devices. The second part describes the file
system, along with guidelines and considerations for system designers
working with the CC3x35 devices.
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User's Guides
SimpleLink ™ Wi-Fi® and This document provides software (SW) programmers with all of the required
Internet-of-Things CC31xx knowledge for working with the networking subsystem of the SimpleLink Wi-Fi
and
Processor
CC32xx
Network devices. This guide provides basic guidelines for writing robust, optimized
networking host applications, and describes the capabilities of the networking
subsystem. The guide contains some example code snapshots, to give users an
idea of how to work with the host driver. More comprehensive code examples can
be found in the formal software development kit (SDK). This guide does not
provide a detailed description of the host driver APIs.
SimpleLink ™
Wi-Fi® This document provides the design guidelines of the 4-layer PCB used for the
CC3135 and CC3235 and CC3135 and CC3235 SimpleLink Wi-Fi family of devices from Texas Instruments.
IoT
Guidelines
Solution
Layout The CC3135 and CC3235 devices are easy to lay out and are available in quad
flat no-leads (QFNS) packages. When designing the board, follow the suggestions
in this document to optimize performance of the board.
SimpleLink™ CC3235 Wi- The CC3235 SimpleLink LaunchPad Development Kit (LAUNCHXL-CC3235) is a
Fi®
LaunchPad ™ cost-conscious evaluation platform for Arm Cortex-M4-based MCUs. The
Development Kit Hardware LaunchPad design highlights the CC3235 Internet-on-a chip solution and Wi-Fi
capabilities. The CC3235 LaunchPad also features temperature and
accelerometer sensors, programmable user buttons, three LEDs for custom
applications, and onboard emulation for debugging. The stackable headers of the
CC3235 LaunchPad XL interface demonstrate how easy it is to expand the
functionality of the LaunchPad when interfacing with other peripherals on many
existing BoosterPack™ Plug-in Module add-on boards, such as graphical displays,
audio codecs, antenna selection, environmental sensing, and more.
SimpleLink ™ Wi-Fi® and The Radio Tool serves as a control panel for direct access to the radio, and can be
Internet-on-a
chip ™ used for both the radio frequency (RF) evaluation and for certification purposes.
CC3235 This guide describes how to have the tool work seamlessly on Texas Instruments
evaluation platforms such as the BoosterPack™ plus FTDI emulation board for
CC3235 devices, and the LaunchPad™ for CC3235 devices.
CC3135
and
Solution Radio Tool
SimpleLink ™
Wi-Fi®
CC3235
This guide describes TI’s SimpleLink Wi-Fi provisioning solution for mobile
applications, specifically on the usage of the Android™ and IOS® building blocks
for UI requirements, networking, and provisioning APIs required for building the
mobile application.
CC3135
and
Provisioning for Mobile
Applications
More Literature
CC3235 SimpleLink™ Wi-Fi® and Internet This technical reference manual details the modules and
of Things Technical Reference Manual
peripherals of the CC3235 SimpleLink ™ Wi-Fi® MCU. Each
description presents the module or peripheral in a general sense.
Not all features and functions of all modules or peripherals may be
present on all devices. Pin functions, internal signal connections,
and operational parameters differ from device to device. The user
should consult the device-specific data sheet for these details.
CC3x35 SimpleLink™ Wi-Fi® Hardware
Design Checklist
CC3235S/CC3235SF SimpleLink™ Wi-Fi®
LaunchPad™ Design Files
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11.6 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
表11-1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
ORDER NOW
CC3235S
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
CC3235SF
11.7 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.8 Trademarks
WPA™, WPA2™, WPA3™, and are trademarks of Wi-Fi Alliance.
SimpleLink™, Internet-on-a chip™, LaunchPad™, BoosterPack™, SmartConfig™, Sitara™, TI E2E™ are
trademarks of Texas Instruments.
Macrocell™ is a trademark of Kappa Global Inc.
Android™ is a trademark of Google LLC.
Wi-Fi Alliance®, Wi-Fi CERTIFIED®, Wi-Fi®, and Wi-Fi Direct® are registered trademarks of Wi-Fi Alliance.
®, Arm®, Cortex®, and Thumb® are registered trademarks of Arm Limited.
Bluetooth® is a registered trademark of Bluetooth SIG Inc.
IOS® is a registered trademark of Cisco.
所有商标均为其各自所有者的财产。
11.9 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.10 Export Control Notice
Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as
defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled
product restricted by other applicable national regulations, received from disclosing party under nondisclosure
obligations (if any), or any direct product of such technology, to any destination to which such export or re-export
is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S.
Department of Commerce and other competent Government authorities to the extent required by those laws.
11.11 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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12 Mechanical, Packaging, and Orderable Information
12.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
12.1.1 Package Option Addendum
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ZHCSJC1D –APRIL 2019 –REVISED MAY 2021
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12.1.1.1 Packaging Information
Package
Type
Package
Drawing
Package
Qty
Lead/Ball
Finish(3)
Orderable Device
CC3235SM2RGKR
CC3235SF12RGKR
Status (1)
ACTIVE
ACTIVE
Pins
64
Eco Plan (2)
MSL Peak Temp (4)
Level-3-260C-168 HR
Level-3-260C-168 HR
Op Temp (°C)
–40 to 85
Device Marking(5) (6)
CC3235SM2
Green (RoHS &
no Sb/Br)
CU NIPDAU | CU
NIPDAUAG
VQFN
VQFN
RGK
RGK
2500
2500
Green (RoHS &
no Sb/Br)
CU NIPDAU | CU
NIPDAUAG
64
CC3235SF12
–40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD: Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1%
by weight in homogeneous material).
space
(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the
finish value exceeds the maximum column width.
space
(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
space
(6) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by
third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable
steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain
information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Copyright © 2021 Texas Instruments Incorporated
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CC3235S, CC3235SF
ZHCSJC1D –APRIL 2019 –REVISED MAY 2021
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12.1.1.2 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
P1
K0
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
CC3235SM2RGKR
CC3235SF12RGKR
VQFN
VQFN
RGK
RGK
64
64
2500
2500
330.0
330.0
16.4
16.4
9.3
9.3
9.3
9.3
1.1
1.1
12.0
12.0
16.0
16.0
Q2
Q2
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CC3235S, CC3235SF
ZHCSJC1D –APRIL 2019 –REVISED MAY 2021
www.ti.com.cn
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing
Pins
64
SPQ
2500
2500
Length (mm)
367.0
Width (mm)
367.0
Height (mm)
38.0
CC3235SM2RGKR
CC3235SF12RGKR
VQFN
VQFN
RGK
RGK
64
367.0
367.0
38.0
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: CC3235S CC3235SF
重要声明和免责声明
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务,TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
CC3235SF12RGKR
CC3235SM2RGKR
ACTIVE
VQFN
VQFN
RGK
64
64
2500 RoHS & Green NIPDAU | NIPDAUAG Level-3-260C-168 HR
-40 to 85
-40 to 85
CC3235SF
12
ACTIVE
RGK
2500 RoHS & Green NIPDAU | NIPDAUAG Level-3-260C-168 HR
CC3235S
M2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2021
Addendum-Page 2
PACKAGE OUTLINE
RGK0064B
VQFN - 1 mm max height
S
C
A
L
E
1
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
9.1
8.9
A
B
PIN 1 INDEX AREA
9.1
8.9
1.0
0.8
C
SEATING PLANE
0.08 C
0.05
0.00
2X 7.5
6.3 0.1
SYMM
(0.2) TYP
17
32
16
33
EXPOSED
THERMAL PAD
SYMM
65
2X 7.5
0.30
64X
1
48
60X 0.5
PIN 1 ID
0.18
64
49
0.1
C A B
0.5
0.3
0.05
64X
4222201/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
6.3)
SEE SOLDER MASK
DETAIL
SYMM
64X (0.6)
64
49
64X (0.24)
1
48
60X (0.5)
8X (1.1)
(R0.05) TYP
18X (1.2)
(0.6) TYP
SYMM
65
(8.8)
(
0.2) TYP
VIA
16
33
17
32
(0.6) TYP
18X (1.2)
8X
(1.1)
(8.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222201/B 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGK0064B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
64
(1.2) TYP
49
64X (0.6)
64X (0.24)
1
48
60X (0.5)
(R0.05) TYP
(1.2) TYP
65
SYMM
(8.8)
16
33
METAL
TYP
17
32
SYMM
(8.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 MM THICK STENCIL
SCALE: 10X
EXPOSED PAD 65
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4222201/B 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021,德州仪器 (TI) 公司
相关型号:
CC3235SF12RGKR
具有 1MB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU | RGK | 64 | -40 to 85
TI
CC3235SM2RGKR
具有 256kB RAM 的 SimpleLink™ 32 位 Arm Cortex-M4 双频带 Wi-Fi® 无线 MCU | RGK | 64 | -40 to 85
TI
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