CC8520RHAT [TI]

2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING CC8520 - PurePath™ Wireless; 2.4 GHz射频片上系统的无线数字音频流CC8520 - PurePath™无线
CC8520RHAT
型号: CC8520RHAT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING CC8520 - PurePath™ Wireless
2.4 GHz射频片上系统的无线数字音频流CC8520 - PurePath™无线

电信集成电路 电信电路 射频 无线
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中文:  中文翻译
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CC8520  
www.ti.com  
SWRS091A – MARCH 2010  
2.4 GHz RF SoC FOR WIRELESS DIGITAL AUDIO STREAMING  
CC8520 - PurePath™ Wireless  
APPLICATIONS  
-
Suited for systems targeting compliance  
with worldwide radio frequency  
regulations: ETSI EN 300 328 and EN  
300 440 class 2 (Europe), FCC CFR47 Part  
15 (US) and ARIB STD-T66 (Japan)  
-
-
-
-
Wireless high-quality digital audio  
Wireless point-to-point audio link  
Wireless headphones  
Wireless loudspeakers  
Digital audio support  
FEATURES  
Built-in audio protocol  
-
Digital I2S audio interface supports 1 or 2  
audio channels at sample rates of 32,  
40.275, 44.1 and 48 kHz, and supports 16 bit  
word-widths  
-
-
CD-quality uncompressed audio  
Excellent robustness and co-existence  
through multiple techniques  
-
-
Audio latency down to 20 ms  
-
-
-
-
-
Adaptive Frequency Hopping  
Forward Error Correction  
Buffering and Retransmission  
Error Concealment  
Optional  
compression  
Data side-channel allows data to be sent  
alongside the audio between external host  
controllers  
high  
quality  
audio  
Development tools  
-
PC-based PurePath™ Wireless  
Configurator (PPW Configurator) for  
CC8520 configuration  
CC8520 User’s Guide  
CC85XXDK audio development kit  
No software development needed  
External system  
-
-
-
Seamless connection and control of  
selected TI audio codecs, DACs/ADCs and  
digital audio amplifiers using I2S and I2C  
HID functions like power control, binding,  
volume control, audio channel selection  
can be mapped to I/Os  
-
-
-
RoHS compliant 6mm x 6mm QFN-40  
package  
RF section  
-
-
-
5 Mbps over-the-air data rate  
Bandwidth-efficient modulation format  
Excellent link budget with programmable  
output power up to +3.5 dBm and -83 dBm  
sensitivity  
-
Seamless support for CC2590 range  
extender (+11dBm output power, -86dBm  
sensitivity)  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PurePath™ is a trademark for Texas Instruments  
All other trademarks are the property of their respective owners.  
Copyright © 2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
DESCRIPTION  
QFN-40 PACKAGE (TOP VIEW)  
The PurePath™ Wireless platform is a cost-  
effective and low-power solution optimized for  
wireless transmission of high-quality digital audio.  
The CC8520 includes a robust built-in wireless  
audio transmission protocol and can control  
selected external audio devices. Utilizing  
numerous coexistence mechanisms allows the  
CC8520 to avoid interfering with, or being  
interfered by other 2.4 GHz radio systems. The  
CC8520, which supports 2 audio channels, is the  
first device in the PurePath™ Wireless platform.  
The CC8520 operates autonomously, and can be  
used with or without an external MCU. An external  
host processor can be connected through SPI and  
control some aspects of its operation. The CC8520  
interfaces easily with other TI audio ICs and DSPs  
(using I2S and DSP/TDM interfaces).  
ABBREVIATIONS  
ADC  
ARIB  
BER  
Analog to Digital Converter  
Association of Radio Industries and Businesses  
Bit Error Rate  
LAN  
LED  
LNA  
MISO  
MOSI  
MCU  
PA  
Local Area Network  
Light Emitting Diode  
Low Noise Amplifier  
Master In Slave Out  
Master Out Slave In  
Microcontroller  
CODEC Coder/Decoder  
DAC  
DRC  
DSP  
EHIF  
ESD  
ETSI  
FCC  
FEC  
FSK  
FW  
Digital to Analog Converter  
Dynamic Range Control  
Digital Signal Processor  
Power Amplifier  
External Host Interface  
PCM  
PER  
PLL  
Pulse Code Modulation  
Packet Error Rate  
Electro Static Discharge  
European Telecommunications Standard Institute  
Federal Communications Commission  
Forward Error Correction  
Phase Lock Loop  
PM  
Protocol Master  
PPW  
PS  
PurePath™ Wireless  
Protocol Slave  
Frequency Shift Keying  
Firmware  
PWM  
RoHS  
RF  
Pulse Width Modulation  
Restriction of Hazardous Substances  
Radio Frequency  
HID  
Human Interface Device  
I2C  
Inter-Integrated Circuit (serial communications bus)  
Inter-IC Sound (serial bus for digital audio signals)  
Institute of Electrical and Electronics Engineers  
Industrial, Scientific, Medical  
I2S  
SPI  
Serial Peripheral Interface  
System-on-Chip  
IEEE  
ISM  
SoC  
STD  
TDM  
Standard  
JEDEC  
Joint Electron Device Engineering Council  
Time-Division Multiplexing  
2
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
ABSOLUTE MAXIMUM RATINGS(1)  
PARAMETER  
TEST CONDITIONS  
Min  
–0.3  
–0.3  
Max  
Unit  
V
Supply voltage  
All supply pins must have the same voltage  
3.9  
Voltage on any digital pin  
min(VDD +  
0.3, 3.9)  
V
Input RF level  
10  
85  
dBm  
°C  
Storage temperature range  
Reflow soldering temperature  
ESD (2)  
-40  
According to IPC/JEDEC J-STD-020  
260  
2000  
°C  
All pads, according to human-body model  
(HBM), JEDEC STD 22, method A114  
V
According to charged-device model (CDM),  
JEDEC STD 22, method C101E  
400  
V
(1)  
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2)  
CAUTION: ESD sensitive device. Precaution should be used when handing the device in order to prevent permanent damage.  
RECOMMENDED OPERATING CONDITIONS  
PARAMETER  
TEST CONDITIONS  
Min  
-40  
2.0  
Max  
+85  
3.6  
Unit  
°C  
Operating ambient temperature range, TA  
Operating supply voltage  
V
3
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
GENERAL CHARACTERISTICS  
Measured on Texas Instruments CC8520 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.  
PARAMETER  
RF frequency range  
Data rate  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
MHz  
2400  
2483.5  
Shaped 8FSK  
5
1
Mbps  
Current consumption,  
power down state  
Voltage regulator / crystal oscillator off – status  
lost (POWERED_DOWN state)  
µA  
Average current for audio sink with I2S interface  
active and uncompressed stereo audio link at 48  
kHz, 16 bits. (PCM16)  
Current consumption,  
audio sink  
25  
29  
mA  
Average current for audio source with I2S  
interface active and uncompressed stereo audio  
link at 48 kHz, 16 bits, maximum output power.  
(PCM16)  
Current consumption,  
audio source  
mA  
Latency between I2S interface on audio source  
and I2S interface on audio sink. Uncompressed  
16 bit. Audio latency is programmable using the  
PPW Configurator [1].  
Audio latency  
768  
2048  
Samples  
48  
44.1  
40.275  
32  
Audio sample rate is programmable using the  
PPW Configurator [1] (1)  
Audio sample rate  
kHz  
(1) ±2000ppm tolerance  
RF CHARACTERISTICS, CC8520  
Measured on Texas Instruments CC8520 EM reference designs with TA = 25°C and VDD = 3.3 V, unless otherwise noted.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
3.5  
-83  
-2  
MAX  
UNIT  
dBm  
dBm  
dBm  
Output power  
Maximum output power setting  
5 Mbps, 0.1 % BER  
Receiver sensitivity  
Saturation (maximum input level)  
5 Mbps, 0.1 % BER  
Adjacent channel, ±4MHz, wanted 3dB above  
sensitivity  
8
dB  
Selectivity  
Alternate channel, ±8MHz, wanted 3dB above  
sensitivity  
35  
dB  
Occupied bandwidth  
Spurious emission  
99% energy bandwidth  
3.8  
MHz  
Suitable for systems targeting compliance with EN 300 328, EN 300 440(1), FCC CFR47 Part 15  
and ARIB STD-T-66  
(1) Systems with external antenna connector: Margins for passing conducted requirements at sub 1GHz frequencies can be improved by  
using a simple band-pass filter connected between matching network and RF connector (1.6 pF in parallel with 1.6 nH); this filter must be  
connected to a good RF ground.  
48-MHz CRYSTAL REQUIREMENTS  
General parameters with TA = 25°C and VDD = 3.3 V, unless otherwise noted.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
MHz  
ppm  
ohm  
pF  
Crystal frequency  
48  
Crystal frequency accuracy requirement(1)  
ESR Equivalent series resistance  
C0 Crystal shunt capacitance  
CL Crystal load capacitance  
(1) Including aging and temperature dependency  
-50  
-
50  
60  
3
-
15  
16  
17  
pF  
4
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
AUDIO PLL CHARACTERISTICS  
TA = 25°C and VDD = 3.3 V, unless otherwise noted.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
32·FWCLK  
32·FWCLK  
31.936  
512·FWCLK  
256·FWCLK  
48.096  
MCLK Frequency range  
BCLK Frequency range  
WCLK Frequency range  
Programmable using the PPW Configurator [1]  
Programmable using the PPW Configurator [1]  
kHz  
ps  
80  
200  
RMS jitter  
RMS period jitter for 1000 periods  
1
PIN DESCRIPTION  
Figure 1 - CC8520 QFN Package Top View  
PIN  
PIN NAME  
PIN TYPE  
DESCRIPTION  
-
GND  
Ground  
The exposed die attach pad must be connected to a solid ground plane underneath the  
chip  
1
2
3
XANTN  
XANTP  
CS_N  
Digital I/O1  
Digital I/O1  
FW2.0: Controlling external antenna switch (FW1.0/FW1.1: NC)  
FW2.0: Controlling external antenna switch (FW1.0/FW1.1: NC)  
Serial SPI configuration interface, active low chip select  
Digital Input  
(pull-up)  
4
5
6
SCLK  
MOSI  
MISO  
Digital I/O1  
Digital I/O1  
Serial SPI configuration interface, clock input/output  
Serial SPI configuration interface, master data input, slave data output  
Serial SPI configuration interface, master data output, slave data input GIO0 output when  
CS_N is deasserted.  
Digital I/O1  
Digital I/O1  
GIO0  
GIO1  
General-purpose digital I/O pin 0  
7
General-purpose digital I/O pin 1  
Configurable with PurePath™ Wireless Configurator  
General-purpose digital I/O pin 2  
8
9
GIO2  
GIO3  
Digital I/O1  
Digital I/O2  
General-purpose digital I/O pin 3  
Configurable with PurePath™ Wireless Configurator  
5
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
PIN  
PIN NAME  
PIN TYPE  
DESCRIPTION  
10  
IODVDD  
Power  
Digital power supply for the digital I/Os in the SPI interface and GIO1-GIO3.  
(I/O pads)  
11  
12  
13  
RSTN  
Digital Input  
(pull-up)  
Active-low device reset  
IOVDD  
Power  
(I/O pins)  
Digital power supply for the RSTN and MCLK digital I/O pins.  
MCLK  
GIO4  
BCLK  
GIO5  
WCLK  
GIO6  
AD0  
Digital I/O1  
Digital I/O1  
Digital I/O1  
Digital I/O1  
Digital I/O1  
Master clock output for external audio devices  
General-purpose digital I/O pin 4  
14  
15  
16  
17  
I2S/DSP audio interface bit clock (in/out)  
General-purpose digital I/O pin 5  
I2S/DSP audio interface word clock (in/out)  
General-purpose digital I/O pin 6  
I2S/DSP audio interface data line 0 (in/out)  
General-purpose digital I/O pin 7  
GIO7  
AD1  
I2S/DSP audio interface data line 1 (in/out)  
General-purpose digital I/O pin 8  
GIO8  
IOVDD  
18  
19  
Power  
(I/O pins)  
Digital power supply for the digital I/Os in audio interface (BCLK-AD2).  
AD2  
GIO9  
AVDD  
XI  
Digital I/O2  
I2S/DSP audio interface data line 2 (in/out)  
Configurable with PurePath™ Wireless Configurator  
2.0-3.6V analog power supply connection  
20  
21  
22  
23  
24  
Power (Analog)  
Analog I/O  
Crystal oscillator pin input, or external clock input (48 MHz)  
Crystal oscillator pin output (48 MHz)  
XO  
Analog I/O  
AVDD  
RF_P  
Power (Analog)  
RF I/O  
Analog power supply connection  
Positive differential RF input signal to LNA in receive mode  
Positive differential RF output signal from PA in transmit mode  
Negative differential RF input signal to LNA in receive mode  
Negative differential RF output signal from PA in transmit mode  
Analog power supply connection  
25  
RF_N  
RF I/O  
26  
27  
28  
29  
AVDD  
AVDD  
AVDD  
VBAT  
Power (Analog)  
Power (Analog)  
Power (Analog)  
Analog input  
Analog power supply connection  
Analog power supply connection  
Battery voltage supervisor (threshold level programmable by external resistor to positive  
battery terminal)  
30  
31  
32  
RBIAS  
AVDD  
SCL  
Analog output  
Power (Analog)  
Digital I/O1  
External precision bias resistor for reference current. 56 k, 1%  
Analog power supply connection (Guard ring AVDD connection for digital noise isolation)  
I2C master clock line. Must be connected to external pull-up  
General-purpose digital I/O pin 10  
GIO10  
SDA  
33  
Digital I/O1  
I2C master data line. Must be connected to external pull-up  
General-purpose digital I/O pin 11  
GIO11  
GIO12  
GIO13  
XLNAEN  
IODVDD  
XPAEN  
34  
35  
36  
37  
38  
Digital I/O1  
Digital I/O1  
Digital I/O2  
General-purpose digital I/O pin 12  
General-purpose digital I/O pin 13  
Control external LNA  
Power (I/O pads) Digital power supply for SCL-GIO15 pins.  
Digital I/O2  
Control external PA  
6
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
PIN  
PIN NAME  
PIN TYPE  
DESCRIPTION  
39  
DCPL  
Power (Digital)  
1.7V-1.85 V linear voltage regulator output to which a 1 uF decoupling capacitor should be  
attached. For test-purposes an external digital supply voltage (1.62-1.98 V) can be applied  
here, bypassing the voltage regulator.  
NOTE: The voltage regulator is intended for use with the CC8520 chip only. It cannot be  
used to provide supply voltage to other devices.  
40  
DVDD  
Power (Digital)  
Digital power supply for the linear voltage regulator.  
1
2
Digital I/O pad with 4 mA source/sink capability, programmable direction and pull-up, pull-down or high-impedance.  
Digital I/O pad with 20 mA source/sink capability, programmable direction and pull-up, pull-down or high-impedance.  
2.0V-3.6V  
Power Supply  
C391  
Antenna  
(50 Ohm)  
CC2590 +  
Matching/  
Filtering  
Alternative:  
CC2590 External LNA/PA  
xANTM  
xANTP  
CSN  
RBIAS  
VBAT  
AVDD  
AVDD  
AVDD  
RF_N  
RF_P  
AVDD  
1
2
3
4
5
6
7
8
9
30  
29  
28  
27  
26  
25  
24  
23  
Antenna  
(50 Ohm)  
SCLK  
MOSI  
MISO  
GIO1  
GIO2  
GIO3  
C301  
L302  
CC8520  
Audio Device  
C306  
L303  
C303  
L304  
C305  
L301  
C302  
X0  
X1  
22  
21  
10 IOVDD  
Figure 2 - CC8520 Application Circuit  
7
Copyright ©2010, Texas Instruments Incorporated  
CC8520  
WWW.TI.COM  
SWRS091A – MARCH 2010  
2
SYSTEM DESCRIPTION  
The CC8520 is a 2.4GHz wireless SoC operating in the 2.4 GHz ISM band designed for streaming digital  
audio wirelessly. It is designated to operate autonomously (without any host MCU) but certain aspects of  
operation can be controlled by a host MCU.  
Before operation, the CC8520 must be programmed with a user-specific FW image, which can be created  
using the PPW Configurator [1]. The configuration file can be programmed into the on-chip Flash memory by  
using the PPW Configurator and the CC Debugger [2] and is also programmable in a production line. The  
configuration image contains information identifying the device as a master or a slave, how many channels are  
supported, the direction of the audio channels, HID support, audio device supported and more.  
If CC8520 is configured as a slave, it will automatically start searching for a valid audio network. If configured  
as a master, it will start a new network. As soon as a network is formed, audio transmission will commence.  
The CC8520 will automatically configure an attached supported audio IC (see compatibility list for a list of  
supported ICs in chapter 3).  
3
SUPPORTED AUDIO DEVICES  
Supported ADC/DAC/Codec/Amplifier Devices  
The following device drivers will initially be implemented:  
Device  
DESCRIPTION  
Low-Power Stereo Codec with 6 Inputs, 6 Outputs,  
Speaker/HP Amp and Enhanced Digital Effects  
AIC3101  
Low-Power Stereo CODEC with 6 Inputs, 6 Outputs, HP Amp  
and Enhanced Digital Effects  
92dB SNR Low-Power Stereo ADC with Digital Mic Support  
AIC3204: Very Low-Power Stereo Audio CODEC with Power  
Tune™ Technology  
AIC3104  
ADC3101  
AIC3204  
Note: The complete list of supported devices can be found in the PPW Configurator [1].  
Supported SPDIF-RX / SPDIF-TX / DSP Devices  
The following device drivers will be implemented:  
Device  
DIR9001  
DIT4096  
DSP  
DESCRIPTION  
96 kHz, 24-Bit Digital Audio Interface Receiver  
96 kHz, Digital Audio Transmitter  
Generic Digital Audio Device  
Note: The complete list of supported devices can be found in the PPW Configurator [1].  
Other audio devices  
The CC8520 is compatible with any I2S-based audio device that does not need to be configured at power-up  
and that is compatible with the requirements listed in the audio interface (Chapter 6). It is also compatible with  
a wide range of TI DSPs using an I2S interface.  
8
Copyright ©2010, Texas Instruments Incorporated  
 
CC8520  
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4
NETWORK TOPOLOGY AND NOMENCLATURE  
A CC8520 network consists of one Protocol Master (PM) and one or two Protocol Slave(s) (PS). The PM  
provides the audio reference clock and controls network association. The PS regenerate the audio reference  
clock based on the packets received. Audio can be transmitted from the PM to a PS. The device receiving the  
audio is called an Audio Sink, the device sending the audio is called an Audio Source. A device can be both  
Audio Sink and Audio Source at the same time (bidirectional audio will be supported in future revisions of the  
firmware). The CC8520 network also includes a Data Side-Channel which is a bi-directional data link between  
the PM and all PS in the network. This is further described in chapter 8.  
Figure 3 illustrates the different network topologies that can be formed with CC8520 using the different  
firmware versions.  
Audio channel  
FW1.0  
FW1.0  
PM  
PS  
PM  
PS  
Data channel  
2 audio channels:  
stereo audio PM to PS  
1 audio channel:  
mono audio PM to PS  
FW1.1  
FW1.1  
PS1  
PS1  
PM  
PM  
PS2  
PS2  
2 channels:  
2 channels:  
mono audio PM to PS1  
mono audio PM to PS2  
mono audio PS1 to PM  
mono audio PS2 to PM  
FW2.0  
FW2.0  
PS1  
PM  
PS  
PM  
PS2  
2 channels:  
mono audio PM to PS  
mono audio PS to PM  
2 channels:  
mono audio PM to PS1  
mono audio PS2 to PM  
Figure 3 CC8520 topologies supported for different CC8520 FW revisions  
(Yellow arrow = audio channel. Blue arrow = data side channel. PM = Protocol Master. PS = Protocol Slave)  
9
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10  
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CC8520  
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5
COEXISTENCE AND AUDIO COMPRESSION  
The CC8520 implements a wide range of techniques to maximize coexistence performance when operating in  
an environment with other 2.4 GHz wireless devices. The built-in protocol implements adaptive frequency  
hopping. This helps improve coexistence with RF sources that do not move around in frequency, such as IEEE  
802.11 (Wireless LAN) devices, as well as providing robust performance in a multipath RF environment. Audio  
is buffered in the receiver, and any data which is not correctly received, is retransmitted utilizing the high raw  
datarate (5Mbps). When link quality is poor (e.g. when moving out of range), audio is muted until a reliable link  
is restored.  
Forward Error Correction (FEC) is built into the CC8520 modulation scheme. Furthermore, packets are divided  
into independent sections so that an error in one section does not mean the whole packet is lost.  
The CC8520 supports uncompressed PCM16 audio, with no modifications made to the digital audio. High  
quality audio compression can optionally be enabled and effectively reducing average current consumption by  
lowering the radio duty-cycle. Compression improves robustness further, as there is less data sent and more  
time available for retransmission.  
6
AUDIO INTERFACE  
The CC8520 audio interface is I2S compatible and it supports up to 2 audio channels. The audio interface on  
the protocol master can be configured as clock master (supplied from the internal audio PLL) or as clock slave  
(clock supplied from external audio IC).  
The audio interface has 2 data pins. Each of these can be configured as an input, output or unused. The audio  
interface can be configured to support I2S. The CC8520 supports word widths of 16 to 24 bits, but over-the-air  
16 bits is always used.  
7
HUMAN INTERACTION DRIVERS (HID)  
The CC8520 supports basic HID functionality without an external MCU. This means that some basic  
functionality can be controlled on the slave remotely from the master. The HID functionality supported  
includes:  
-
-
-
-
power control (to turn devices on/off)  
network binding (to pair devices)  
volume control (volume control can be managed locally)  
Status LED (blinking diode to indicate the status of the RF link)  
All HID functions are configurable in the PPW Configurator [1] and can be mapped to the CC8520 I/O pins.  
8
EXTERNAL HOST INTERFACE (EHIF / Data side channel)  
The external host interface (EHIF) allows an external host device, e.g. a microcontroller, to:  
Control the operation of and poll status from the CC8520, mainly by taking over driver functionality.  
Communicate with other external host devices through an integrated data side-channel  
Get access to test functionality for audio, I/O and RF.  
The external host interface is available via SPI with a single interrupt pin. The external host will act as SPI  
master and CC8520 will act as SPI slave.  
User specified data can be transferred between the master EHIF and the slave EHIFs, in both directions using  
the data side-channel. The data side-channel establishes robust, ensured-delivery connections in both  
directions from any slave to the master or from master to any slave (direct slave to slave communication is not  
11  
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CC8520  
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SWRS091A – MARCH 2010  
available). There is no specified minimum throughput for the data side-channel but under normal operating  
conditions and data rate of up to 30 kbps is possible in each direction.  
More details can be found in the CC8520 User’s Guide [2].  
9
REFERENCES  
[1] PurePath™ Wireless Configurator  
[2] CC8520 product folder  
[3] CC-Debugger  
12  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Apr-2010  
PACKAGING INFORMATION  
Orderable Device  
CC8520RHAR  
CC8520RHAT  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
VQFN  
RHA  
40  
2500 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
VQFN  
RHA  
40  
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CC8520RHAR  
CC8520RHAT  
VQFN  
VQFN  
RHA  
RHA  
40  
40  
2500  
250  
330.0  
330.0  
16.4  
16.4  
6.3  
6.3  
6.3  
6.3  
1.5  
1.5  
12.0  
12.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CC8520RHAR  
CC8520RHAT  
VQFN  
VQFN  
RHA  
RHA  
40  
40  
2500  
250  
333.2  
333.2  
345.9  
345.9  
28.6  
28.6  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
Automotive  
www.ti.com/automotive  
www.ti.com/communications  
Communications and  
Telecom  
DSP  
dsp.ti.com  
Computers and  
Peripherals  
www.ti.com/computers  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
Consumer Electronics  
Energy  
www.ti.com/consumer-apps  
www.ti.com/energy  
Logic  
Industrial  
www.ti.com/industrial  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Medical  
www.ti.com/medical  
microcontroller.ti.com  
www.ti-rfid.com  
Security  
www.ti.com/security  
Space, Avionics &  
Defense  
www.ti.com/space-avionics-defense  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
Video and Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless-apps  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2010, Texas Instruments Incorporated  

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