CD4010BQDRQ1 [TI]
CMOS HEX BUFFER/CONVERTER; CMOS六缓冲器/转换器
| 型号： | CD4010BQDRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS HEX BUFFER/CONVERTER |
| 文件： | 总14页 (文件大小：4471K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD4010B-Q1
www.ti.com
SCHS379A –MARCH 2010–REVISED JANUARY 2012
CMOS HEX BUFFER/CONVERTER
Check for Samples: CD4010B-Q1
1
FEATURES
D PACKAGE
(TOP VIEW)
•
•
•
Qualified for Automotive Applications
100% Tested for Quiescent Current at 20 V
Maximum Input Current of 1 µA at 18 V Over
Full Package-Temperature Range:
100 nA at 18 V and 25°C
•
•
5-V, 10-V, and 15-V Parametric Ratings
Latch-Up Performance Meets 100 mA per
JESD 78, Class I
APPLICATIONS
•
•
•
•
CMOS to DTL/TTL Hex Converter
CMOS Current "Sink" or "Source" Driver
CMOS High-to-Low Logic-Level Converter
Multiplexer: 1-to-6 or 6-to-1
DESCRIPTION
CD4010B hex buffer/converter may be used as CMOS to TTL or DTL logic-level converters or CMOS
high-sink-current drivers.
The CD4050B is the preferred hex buffer replacement for the CD4010B in all applications except multiplexers.
For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is
recommended.
The CD4010B is supplied in 16-lead hermetic dual-in-line ceramic (D) packages.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
CD4010BQ
–40°C to 125°C
SOIC – D
Reel of 2500
CD4010BQDRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
CD4010B-Q1
SCHS379A –MARCH 2010–REVISED JANUARY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 1. Schematic Diagram – One of Six Identical Stages
Functional Diagram
2
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Product Folder Link(s): CD4010B-Q1
CD4010B-Q1
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SCHS379A –MARCH 2010–REVISED JANUARY 2012
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
–0.5 to +20
–0.5 to VDD +0.5
±10
UNIT
V
VDD DC supply voltage range, voltages referenced to VSS terminal
Input voltage range, all inputs
V
DC input current, any one input
mA
TA = –40°C to +100°C
500
PD
Power dissipation per package
mW
Derate linearly at
12 mW/°C to 200 mW
TA = +100°C to +125°C
Device dissipation per output
transistor
TA = full package-temperature range
(all packages types)
100
mW
TA
Operating temperature range
Storage temperature range
–40 to +125
–65 to +150
100
°C
°C
Tstg
Latch-up performance per JESD 78, Class I
mA
Human-body model (HBM)
Machine model (MM)
500
ESD Electrostatic discharge rating(2)
100
V
Charged-Device Model (CDM)
1000
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance with AEC-Q100.
RECOMMENDED OPERATING CONDITIONS
MIN
3
MAX
18
UNIT
V
VDD
VCC
VI
Supply voltage range(1)
Input voltage range
3
VDD
VDD
VCC
V
(1) The CD4010B has high-to-low level voltage conversion capability, but not low-to-high level; therefore, it is recommended that
DD > VI > VCC
V
.
Copyright © 2010–2012, Texas Instruments Incorporated
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CD4010B-Q1
SCHS379A –MARCH 2010–REVISED JANUARY 2012
www.ti.com
STATIC ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
TEST CONDITIONS
PARAMETER
LIMITS AT INDICATED TEMPERATURES (°C)
+25
UNIT
VO
VIN
VDD
–40
+85
+125
MIN
TYP
0.02
0.02
0.02
0.04
3.4
4
MAX
0, 5
0, 10
0, 15
0,20
0, 5
5
10
15
20
4.5
5
1
2
30
60
30
60
1
2
IDD Max
IOL Min
IOH Min
Quiescent device current
Output low (sink) current
Output high (source) current
µA
mA
mA
4
120
600
2.1
2.4
6.4
19
120
600
1.8
2.1
5.6
16
4
20
3.1
3.6
9.6
40
20
0.4
0.4
0.5
1.5
4.6
2.5
9.5
13.5
2.6
3
0, 5
0, 10
0, 15
0, 5
10
15
5
8
10
24
36
–0.23 –0.18 –0.15
–0.2
–0.8
–0.45
–1.5
–0.4
–1.6
–0.9
–3
0, 5
5
–0.9
–0.5
–1.6
–0.65 –0.58
–0.38 –0.33
0, 10
0, 15
0, 5
10
15
5
–1.25
0.05
0.05
0.05
4.95
9.95
14.95
1.5
3
–1.1
0
0.05
0.05
0.05
VOL Max
VOH Min
VIL Max
Output voltage: Low-level
Output voltage: High-level
Input low voltage
0, 10
0, 15
0, 5
10
15
5
0
V
V
V
0
4.95
9.95
5
0, 10
0, 15
10
15
5
10
14.95
15
0.5
1
1.5
3
10
15
5
1.5
4.5
9
4
4
3.5
7
3.5
7
VIH Min
IIN Max
Input high voltage
Input current
10
15
18
V
13.5
11
11
0, 18
±0.1
±1
±1
±10–5
±0.1
µA
4
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Product Folder Link(s): CD4010B-Q1
CD4010B-Q1
www.ti.com
SCHS379A –MARCH 2010–REVISED JANUARY 2012
DYNAMIC ELECTRICAL CHARACTERISTICS
TA = 25°C, Input tr/tf = 20 ns, CL = 50 pf, RL = 200 kΩ
TEST CONDITIONS
LIMITS ALL PKGS
PARAMETER
UNIT
VDD
(V)
VI
(V)
VCC
(V)
TYP
MAX
5
5
5
10
5
100
50
50
35
35
65
35
30
25
20
150
75
55
35
20
15
5
200
100
100
70
10
10
15
15
5
10
10
15
15
5
tPLH
Propagation delay time: low-to-high
ns
15
5
70
5
130
70
10
10
15
15
5
10
10
15
15
5
10
5
tPHL
Propagation time: high-to-low
Transition time: low-to-high
70
ns
ns
15
5
50
40
5
350
150
110
90
tTLH
10
15
5
10
15
5
10
15
5
tTHL
Transition time: high-to-low
Input capacitance
10
15
10
15
10
15
45
ns
40
CIN
7.5
pF
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SCHS379A –MARCH 2010–REVISED JANUARY 2012
www.ti.com
TYPICAL CHARACTERISTICS
Figure 2. Minimum and Maximum Voltage Transfer
Characteristics (VDD = 5 V)
Figure 3. Minimum and Maximum Voltage Transfer
Characteristics (VDD = 10 V)
Figure 4. Minimum and Maximum Voltage Transfer
Characteristics (VDD = 15 V)
Figure 5. Typical Voltage Transfer Characteristics as a
Function of Temperature
Figure 6. Typical Output Low (Sink) Current
Characteristics
Figure 7. Minimum Output Low (Sink) Current
Characteristics
6
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SCHS379A –MARCH 2010–REVISED JANUARY 2012
TYPICAL CHARACTERISTICS (continued)
Figure 8. Typical Output High (Source) Current
Characteristics
Figure 9. Minimum Output High (Source) Current
Characteristics
Figure 10. Typical Low-to-High Propagation Delay Time vs
Load Capacitance
Figure 11. Typical High-to-Low Propagation Delay Time vs
Load Capacitance
Figure 12. Typical Low-to-High Transition Time vs Load
Capacitance
Figure 13. Typical High-to-Low Transition Time vs Load
Capacitance
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SCHS379A –MARCH 2010–REVISED JANUARY 2012
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TYPICAL CHARACTERISTICS (continued)
Figure 14. Typical Dissipation Characteristics
8
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CD4010B-Q1
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SCHS379A –MARCH 2010–REVISED JANUARY 2012
PARAMETER MEASUREMENT INFORMATION
Figure 15. Quiescent Device Current Test Circuit
Figure 16. Noise Immunity Test Circuit
Figure 17. Input Current Test Circuit
Note: Dimensions in parentheses are in millimeters and are dereived from the basic inch dimensions as indicated. Grid
graduation are in mils (10–3 inch).
Figure 18. Dimensions and Layout
Copyright © 2010–2012, Texas Instruments Incorporated
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CD4010B-Q1
SCHS379A –MARCH 2010–REVISED JANUARY 2012
www.ti.com
REVISION HISTORY
Changes from Original (March 2010) to Revision A
Page
•
Changed STATIC ELECTRICAL CHARACTERISTICS table to correct typos and misplaced data .................................... 4
10
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Product Folder Link(s): CD4010B-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Apr-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CD4010BQDRQ1
ACTIVE
SOIC
D
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4010B-Q1 :
Catalog: CD4010B
Military: CD4010B-MIL
•
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
•
•
Addendum-Page 1
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