CD40147BME4 [TI]

10-LINE TO 4-LINE BCD PRIORITY ENCODER; 10号线到4线BCD优先编码器


型号：	CD40147BME4
厂家：	TEXAS INSTRUMENTS
描述：	10-LINE TO 4-LINE BCD PRIORITY ENCODER 10号线到4线BCD优先编码器运算电路逻辑集成电路光电二极管编码器 CD
文件：	总10页 (文件大小：435K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data sheet acquired from Harris Semiconductor

SCHS102C − Revised October 2003

The CD40147B CMOS encoder features priority

encoding of the inputs to ensure that only the

highest-order data line is encoded. Ten data

input lines (0-9) are encoded to four-line

(8, 4, 2, 1) BCD. The highest priority line is line 9.

All four output lines are logic 1 (V ) when all

input lines are logic 0. All inputs and outputs are

buffered, and each output can drive one TTL

low-power Schottky load. The CD40147B is

functionally similar to the TTL54/74147 if pin 15

is tied low.

The CD40147B types are supplied in 16-lead

dual-in-line plastic packages (E suffix), 16-lead

small-outline packages (M, M96, MT, and NSR

suffixes), and 16-lead thin shrink small-outline

packages (PW and PWR suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

9-Aug-2005

PACKAGING INFORMATION

Orderable Device

CD40147BE

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

PDIP

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

CD40147BEE4

CD40147BM

PDIP

SOIC

Pb-Free

(RoHS)

CU NIPDAU Level-NC-NC-NC

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD40147BM96

CD40147BM96E4

CD40147BME4

CD40147BMT

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD40147BMTE4

CD40147BNSR

CD40147BNSRE4

CD40147BPW

CD40147BPWE4

CD40147BPWR

CD40147BPWRE4

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

9-Aug-2005

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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