CD4029BPWR [TI]

CMOS PRESETTABLE UP/DOWN COUNTER;


型号：	CD4029BPWR
厂家：	TEXAS INSTRUMENTS
描述：	CMOS PRESETTABLE UP/DOWN COUNTER
文件：	总17页 (文件大小：878K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data sheet acquired from Harris Semiconductor

SCHS034C − Revised October 2003

The CD4029B-series types are supplied in

16-lead

packages (F3A suffix), 16-lead dual-in-line

plastic packages (E suffix), 16-lead

hermetic

dual-in-line

ceramic

small-outline packages (M, M96, MT, and NSR

suffixes), and 16-lead thin shrink small-outline

packages (PW and PWR suffixes).

PACKAGE OPTION ADDENDUM

www.ti.com

11-Nov-2009

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

PDIP

Drawing

8101602EA

CD4029BE

ACTIVE

TBD

A42

N / A for Pkg Type

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

CD4029BEE4

ACTIVE

PDIP

Pb-Free

(RoHS)

CU NIPDAU N / A for Pkg Type

CD4029BF

CD4029BF3A

CD4029BM

ACTIVE

CDIP

SOIC

TBD

A42

N / A for Pkg Type

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4029BM96

CD4029BM96E4

CD4029BM96G4

CD4029BME4

ACTIVE

SOIC

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4029BMG4

CD4029BMT

40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4029BMTE4

CD4029BMTG4

CD4029BNSR

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

CD4029BNSRE4

CD4029BNSRG4

CD4029BPWR

CD4029BPWRE4

CD4029BPWRG4

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

TSSOP

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Nov-2009

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

19-Mar-2008

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0 (mm)

B0 (mm)

K0 (mm)

Pin1

Diameter Width

(mm) W1 (mm)

(mm) (mm) Quadrant

CD4029BM96

CD4029BNSR

CD4029BPWR

SOIC

2500

2000

330.0

16.4

12.4

6.5

8.2

7.0

10.3

10.5

5.6

2.1

2.5

1.6

8.0

12.0

8.0

16.0

12.0

TSSOP

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

19-Mar-2008

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CD4029BM96

CD4029BNSR

CD4029BPWR

SOIC

2500

2000

333.2

346.0

345.9

346.0

28.6

33.0

29.0

TSSOP

Pack Materials-Page 2

MECHANICAL DATA

MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999

PW (R-PDSO-G**)

PLASTIC SMALL-OUTLINE PACKAGE

14 PINS SHOWN

0,30

0,19

0,10

0,65

0,15 NOM

4,50

4,30

6,60

6,20

Gage Plane

0,25

0°–8°

0,75

0,50

Seating Plane

0,10

0,15

0,05

1,20 MAX

PINS **

DIM

3,10

2,90

5,10

4,90

5,10

4,90

6,60

6,40

7,90

9,80

9,60

A MAX

A MIN

7,70

4040064/F 01/97

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-153

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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Products

Amplifiers

Applications

Audio

Automotive

Broadband

Digital Control

Medical

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Security

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

www.ti.com/audio

Data Converters

DLP® Products

DSP

Clocks and Timers

Interface

www.ti.com/automotive

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www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

dsp.ti.com

www.ti.com/clocks

interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

www.ti-rfid.com

Logic

Power Mgmt

Microcontrollers

RFID

Telephony

Video & Imaging

Wireless

RF/IF and ZigBee® Solutions www.ti.com/lprf

www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

CD4029BPWR [TI]

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