CD4060BPWE4 [TI]
CMOS 14-STAGE Ripple-Carry Binary Counter/Divider and Oscillator; CMOS 14级纹波进位二进制计数器/除法器和振荡器
| 型号： | CD4060BPWE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS 14-STAGE Ripple-Carry Binary Counter/Divider and Oscillator |
| 文件： | 总27页 (文件大小：1530K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HCD4060B consists of an oscillator
section and 14 ripple-carry binary counter
stages. The oscillator configuration allows
design of either RC or crystal oscillator
circuits. A RESET input is provided which
resets the counter to the all-O’s state and
disables the oscillator. A high level on the
RESET line accomplishes the reset function.
All counter stages are master-slave flip-flops.
The state of the counter is advanced one step
in binary order on the negative transition of f
I
(and f ). All inputs and outputs are fully
O
buffered. Schmitt trigger action on the
input-pulse
line
permits
unlimited
input-pulse rise and fall times.
The CD4060B-series types are supplied in
16-lead hermetic dual-in-line ceramic packages
(F3A suffix), 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline
packages (M, M96, MT, and NSR suffixes), and
16-lead thin shrink small-outline packages (PW
and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
CD4060BE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4060BEE4
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4060BF
CD4060BF3A
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
SOIC
J
J
16
16
16
16
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4060BF3AS2534
CD4060BM
OBSOLETE
ACTIVE
J
Call TI
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4060BM96
CD4060BM96E4
CD4060BM96G4
CD4060BME4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4060BMG4
CD4060BMT
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4060BMTE4
CD4060BMTG4
CD4060BNSR
CD4060BNSRE4
CD4060BNSRG4
CD4060BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4060BPWE4
CD4060BPWG4
CD4060BPWR
CD4060BPWRE4
CD4060BPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD4060BM96
CD4060BNSR
CD4060BPWR
SOIC
SO
D
16
16
16
2500
2000
2000
330.0
330.0
330.0
16.4
16.4
12.4
6.5
8.2
7.0
10.3
10.5
5.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
NS
PW
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4060BM96
CD4060BNSR
CD4060BPWR
SOIC
SO
D
16
16
16
2500
2000
2000
333.2
346.0
346.0
345.9
346.0
346.0
28.6
33.0
29.0
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
PACKAGING INFORMATION
Orderable Device
CD4060BE
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
ACTIVE
PDIP
PDIP
N
16
16
25
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
-55 to 125 CD4060BE
-55 to 125 CD4060BE
CD4060BEE4
ACTIVE
N
Pb-Free
(RoHS)
N / A for Pkg Type
CD4060BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
16
16
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125 CD4060BF
CD4060BF3A
-55 to 125 CD4060BF3A
CD4060BF3AS2534
CD4060BM
OBSOLETE
ACTIVE
CDIP
SOIC
J
16
16
Call TI
Call TI
D
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125 CD4060BM
-55 to 125 CD4060BM
-55 to 125
CD4060BM96
ACTIVE
ACTIVE
SOIC
SOIC
D
D
16
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Call TI
CD4060BM96E4
TBD
CD4060BM96G4
CD4060BME4
OBSOLETE
ACTIVE
SOIC
SOIC
D
D
16
16
TBD
Call TI
Call TI
-55 to 125 CD4060BM
-55 to 125 CD4060BM
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD4060BMG4
CD4060BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SO
D
D
16
16
16
16
16
16
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125 CD4060BM
-55 to 125 CD4060BM
-55 to 125 CD4060BM
-55 to 125 CD4060BM
-55 to 125 CD4060B
-55 to 125 CD4060B
-55 to 125 CD4060B
-55 to 125 CM060B
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4060BMTE4
CD4060BMTG4
CD4060BNSR
CD4060BNSRE4
CD4060BNSRG4
CD4060BPW
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
CD4060BPWE4
CD4060BPWG4
CD4060BPWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
16
16
16
16
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125 CM060B
-55 to 125 CM060B
-55 to 125 CM060B
-55 to 125 CM060B
-55 to 125 CM060B
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
CD4060BPWRE4
CD4060BPWRG4
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-Mar-2013
OTHER QUALIFIED VERSIONS OF CD4060B, CD4060B-MIL :
Catalog: CD4060B
•
Military: CD4060B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4060BM96
CD4060BNSR
CD4060BPWR
SOIC
SO
D
16
16
16
2500
2000
2000
330.0
330.0
330.0
16.4
16.4
12.4
6.5
8.2
6.9
10.3
10.5
5.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
Q1
Q1
Q1
NS
PW
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4060BM96
CD4060BNSR
CD4060BPWR
SOIC
SO
D
16
16
16
2500
2000
2000
333.2
367.0
367.0
345.9
367.0
367.0
28.6
38.0
35.0
NS
PW
TSSOP
Pack Materials-Page 2
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SI9122E
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