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CD4072BME4 [TI]

CMOS Dual 4-Input OR Gate 14-SOIC -55 to 125;
CD4072BME4
型号： CD4072BME4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

CMOS Dual 4-Input OR Gate 14-SOIC -55 to 125

栅 光电二极管 逻辑集成电路 触发器
文件： 总13页 (文件大小：531K)
中文：  中文翻译
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CD4071B Quad 2-Input OR Gate  
CD4072B Dual 4-Input OR Gate  
CD4075B Triple 3-Input OR Gate  
CD4071B, CD4072B, and CD4075B  
OR gates provide the system designer with  
direct implementation of the positive-logic OR  
function and supplement the existing family of  
CMOS gates.  
The CD4071B, CD4072B, and CD4075B types  
are supplied in 14-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 14-lead  
dual-in-line plastic packages (E suffix), 14-lead  
small-outline packages (M, MT, M96, and NSR  
suffixes), and 14-lead thin shrink small-outline  
packages (PW and PWR suffixes).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
PDIP  
Drawing  
7706002CA  
CD4071BE  
ACTIVE  
ACTIVE  
J
14  
14  
1
TBD  
Call TI  
N / A for Pkg Type  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4071BEE4  
ACTIVE  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4071BF  
CD4071BF3A  
CD4071BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4071BM96  
CD4071BM96E4  
CD4071BME4  
CD4071BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4071BMTE4  
CD4071BNSR  
CD4071BNSRE4  
CD4071BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4071BPWE4  
CD4071BPWR  
CD4071BPWRE4  
CD4072BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4072BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4072BF  
CD4072BF3A  
CD4072BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4072BM96  
CD4072BM96E4  
CD4072BME4  
CD4072BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4072BMTE4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2006  
Orderable Device  
CD4072BNSR  
CD4072BNSRE4  
CD4072BPW  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SO  
NS  
14  
14  
14  
14  
14  
14  
14  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4072BPWE4  
CD4072BPWR  
CD4072BPWRE4  
CD4075BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4075BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4075BF  
CD4075BF3A  
CD4075BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4075BM96  
CD4075BM96E4  
CD4075BME4  
CD4075BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4075BMTE4  
CD4075BNSR  
CD4075BNSRE4  
CD4075BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4075BPWE4  
CD4075BPWR  
CD4075BPWRE4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
JM38510/17101BCA  
JM38510/17103BCA  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
12-Jan-2006  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 3  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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