CD4515BM96G4 [TI]
CMOS 4-BIT LATCH/4-TO-16 LINE DECODERS; CMOS 4位锁存器/ 4至16线路解码器
| 型号： | CD4515BM96G4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | CMOS 4-BIT LATCH/4-TO-16 LINE DECODERS |
| 文件： | 总15页 (文件大小：995K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The CD4514B and CD4515B types are supplied
in 16-lead hermetic dual-in-line ceramic
packages (F3A suffix), 16-lead dual-in-line
plastic packages (E suffix), and 16-lead
small-outline packages (M and M96 suffixes).
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
7703201JA
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
CDIP
PDIP
PDIP
J
24
24
24
1
TBD
Call TI
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
7703201JA
CD4515BF3A
CD4514BE
ACTIVE
ACTIVE
N
N
15
15
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
-55 to 125
CD4514BE
CD4514BEE4
Pb-Free
(RoHS)
-55 to 125
CD4514BE
CD4514BF
CD4514BF3A
CD4514BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
24
24
24
1
1
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
CD4514BF
CD4514BF3A
CD4514BM
TBD
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CD4514BM96
CD4514BM96E4
CD4514BM96G4
CD4514BME4
CD4514BMG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
DW
DW
24
24
24
24
24
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4514BM
CD4514BM
CD4514BM
CD4514BM
CD4514BM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
25
Green (RoHS
& no Sb/Br)
CD4514BNSR
CD4514BPWR
CD4515BE
OBSOLETE
OBSOLETE
ACTIVE
SO
NS
PW
N
24
24
24
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-55 to 125
-55 to 125
-55 to 125
TSSOP
PDIP
15
15
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4515BE
CD4515BE
CD4515BEE4
CD4515BF3A
CD4515BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
CDIP
SOIC
SOIC
N
J
24
24
24
24
Pb-Free
(RoHS)
CU NIPDAU
Call TI
N / A for Pkg Type
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
1
TBD
7703201JA
CD4515BF3A
DW
DW
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CD4515BM
CD4515BM96
2000
Green (RoHS
& no Sb/Br)
CD4515BM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4515BM96E4
CD4515BM96G4
CD4515BME4
CD4515BMG4
ACTIVE
SOIC
SOIC
SOIC
SOIC
DW
24
24
24
24
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CD4515BM
ACTIVE
ACTIVE
ACTIVE
DW
DW
DW
2000
25
Green (RoHS
& no Sb/Br)
CD4515BM
CD4515BM
CD4515BM
Green (RoHS
& no Sb/Br)
25
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4514B, CD4514B-MIL, CD4515B, CD4515B-MIL :
Catalog: CD4514B, CD4515B
•
Military: CD4514B-MIL, CD4515B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4514BM96
CD4514BM96G4
CD4515BM96
SOIC
SOIC
SOIC
DW
DW
DW
24
24
24
2000
2000
2000
330.0
330.0
330.0
24.4
24.4
24.4
10.75 15.7
10.75 15.7
10.75 15.7
2.7
2.7
2.7
12.0
12.0
12.0
24.0
24.0
24.0
Q1
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4514BM96
CD4514BM96G4
CD4515BM96
SOIC
SOIC
SOIC
DW
DW
DW
24
24
24
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
B
13
24
C
12
1
0.065 (1,65)
0.045 (1,14)
Lens Protrusion (Lens Optional)
0.010 (0.25) MAX
0.090 (2,29)
0.060 (1,53)
0.175 (4,45)
0.140 (3,56)
A
Seating Plane
0.018 (0,46) MIN
0.125 (3,18) MIN
0.022 (0,56)
0.014 (0,36)
0.100 (2,54)
0.012 (0,30)
0.008 (0,20)
24
28
32
40
PINS **
DIM
”A”
NARR
WIDE
NARR
WIDE
NARR
WIDE
NARR
WIDE
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99)
1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53)
1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61)
0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50)
MAX
MIN
MAX
MIN
”B”
”C”
MAX
MIN
4040084/C 10/97
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
N (R–PDIP–T24)
PLASTIC DUAL–IN–LINE
1.222 (31,04) MAX
24
13
0.360 (9,14) MAX
1
12
0.070 (1,78) MAX
0.200 (5,08) MAX
0.020 (0,51) MIN
0.425 (10,80) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.010 (0,25)
0’–15’
0.021 (0,53)
0.015 (0,38)
0.010 (0,25) NOM
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明