CD54ACT112_08 [TI]
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET; 双JK负边沿触发触发器具有清零和预设
| 型号： | CD54ACT112_08 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS WITH CLEAR AND PRESET |
| 文件： | 总13页 (文件大小：546K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD54ACT112, CD74ACT112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS323 – JANUARY 2003
CD54ACT112 . . . F PACKAGE
CD74ACT112 . . . M PACKAGE
(TOP VIEW)
Inputs Are TTL-Voltage Compatible
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
1CLK
1K
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
12
Balanced Propagation Delays
1CLR
2CLR
2CLK
2K
±24-mA Output Drive Current
– Fanout to 15 F Devices
1J
1PRE
1Q
SCR-Latchup-Resistant CMOS Process and
Circuit Design
1Q
11 2J
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
10
9
2Q
2PRE
2Q
GND
description/ordering information
The ’ACT112 devices contain two independent J-K negative-edge-triggered flip-flops. A low level at the preset
(PRE) or clear (CLR) inputs sets or resets the outputs, regardless of the levels of the other inputs. When PRE
and CLR are inactive (high), data at the J and K inputs meeting the setup-time requirements is transferred to
the outputs on the negative-going edge of the clock pulse (CLK). Clock triggering occurs at a voltage level and
is not directly related to the fall time of the clock pulse. Following the hold-time interval, data at the J and K inputs
may be changed without affecting the levels at the outputs. These versatile flip-flops can perform as toggle
flip-flops by tying J and K high.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube
CD74ACT112M
SOIC – M
CDIP – F
ACT112M
CD54ACT112F3A
–55°C to 125°C
Tape and reel CD74ACT112M96
Tube CD54ACT112F3A
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
FUNCTION TABLE
(each flip-flop)
INPUTS
OUTPUTS
PRE
L
CLR
H
CLK
X
J
X
X
X
L
K
X
X
X
L
Q
H
L
Q
L
H
L
X
H
‡
‡
L
L
X
H
H
H
H
↓
Q
Q
0
0
H
H
↓
H
L
L
H
L
H
H
↓
H
H
X
L
H
H
H
↓
H
X
Toggle
H
H
H
Q
Q
0
0
‡
Output states are unpredictable if PRE and CLR go high
simultaneously after both being low at the same time.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT112, CD74ACT112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS323 – JANUARY 2003
logic diagram (positive logic)
Q
Q
PRE
CLR
K
J
CLK
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
CC
I
Input clamp current, I (V < 0 V or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
CC
Output clamp current, I
(V < 0 V or V > V ) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
OK
O O CC
Continuous output current, I (V > 0 V or V < V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Package thermal impedance, θ (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Storage temperature range, T
O
O
CC
O
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
JA
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
–55°C to
125°C
–40°C to
85°C
T
A
= 25°C
UNIT
MIN
4.5
2
MAX
MIN
4.5
2
MAX
MIN
MAX
V
V
V
V
V
Supply voltage
5.5
5.5
4.5
2
5.5
V
V
CC
IH
IL
High-level input voltage
Low-level input voltage
Input voltage
0.8
0.8
0.8
V
0
0
V
V
0
0
V
V
0
0
V
V
V
I
CC
CC
CC
Output voltage
V
O
CC
CC
CC
I
High-level output current
Low-level output current
Input transition rise or fall rate
–24
24
–24
24
–24
24
mA
mA
ns/V
OH
OL
I
∆t/∆v
10
10
10
NOTE 3: All unused inputs of the device must be held at V
or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT112, CD74ACT112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS323 – JANUARY 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
–55°C to
125°C
–40°C to
85°C
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
CC
UNIT
MIN
4.4
MAX
MIN
4.4
MAX
MIN
4.4
MAX
I
I
I
I
I
I
I
I
= –50 µA
= –24 mA
= –50 mA
= –75 mA
= 50 µA
4.5 V
4.5 V
5.5 V
5.5 V
4.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
OH
OH
OH
OH
OL
OL
OL
OL
3.94
3.7
3.8
V
V
V = V or V
IH
V
OH
I
IL
†
†
3.85
3.85
0.1
0.1
0.5
0.1
= 24 mA
0.36
0.44
V = V or V
V
OL
I
IH
IL
†
= 50 mA
= 75 mA
1.65
†
1.65
±1
I
I
V = V
or GND
or GND,
±0.1
±1
µA
µA
I
I
CC
CC
V = V
I
I
O
= 0
4
80
40
CC
4.5 V to
5.5 V
V = V
I
–2.1 V
2.4
3
2.8
mA
I
CC
CC
C
10
10
10
pF
i
†
Testoneoutputatatime, notexceeding1-secondduration. Measurementismadebyforcingindicatedcurrentandmeasuringvoltagetominimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
ACT INPUT LOAD TABLE
INPUT
J or CLK
K
UNIT LOAD
1
0.53
CLR or PRE
0.58
Unit Load is ∆I
electrical characteristics table
limit specified in
CC
(e.g., 2.4 mA at 25°C).
timing requirements over recommended operating conditions (unless otherwise noted)
–55°C to
125°C
–40°C to
85°C
UNIT
MIN
MAX
100
MIN
MAX
114
f
t
Clock frequency
Pulse duration
MHz
ns
clock
CLK high or low
CLR or PRE low
J or K
5
5.5
4
4.4
4.8
3.5
1
w
t
t
t
Setup time, before CLK↓
Hold time, after CLK↓
ns
ns
ns
su
J or K
1
h
Recovery time, before CLK↓
CLR↑ or PRE↑
2.5
2.2
rec
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT112, CD74ACT112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS323 – JANUARY 2003
switching characteristics over recommended operating free-air temperature range,
V
= 5 V ± 0.5 V, C = 50 pF (unless otherwise noted) (see Figure 1)
CC
L
–55°C to
125°C
–40°C to
85°C
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
100
2.6
MAX
MIN
114
2.7
MAX
f
t
MHz
ns
max
CLK
10.3
12.2
10.3
12.2
9.4
11.1
9.4
Q or Q
Q or Q
PLH
CLR or PRE
CLK
3.1
3.2
2.6
2.7
t
ns
PHL
CLR or PRE
3.1
3.2
11.1
operating characteristics, V
= 5 V, T = 25°C
CC
A
PARAMETER
TYP
UNIT
C
Power dissipation capacitance
56
pF
pd
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CD54ACT112, CD74ACT112
DUAL J-K NEGATIVE-EDGE-TRIGGERED FLIP-FLOPS
WITH CLEAR AND PRESET
SCHS323 – JANUARY 2003
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
TEST
S1
S1
t
t
/t
Open
R1 = 500 Ω
R2 = 500 Ω
PLH PHL
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
/t
PHZ PZH
C
= 50 pF
L
(see Note A)
t
w
3 V
0 V
1.5 V
1.5 V
Input
LOAD CIRCUIT
VOLTAGE WAVEFORMS
PULSE DURATION
3 V
Reference
Input
3 V
0 V
1.5 V
CLR
Input
1.5 V
0 V
t
t
h
su
t
rec
3 V
0 V
Data
Input
90%
t
90%
3 V
0 V
1.5 V
10%
1.5 V
10%
1.5 V
CLK
t
r
f
VOLTAGE WAVEFORMS
RECOVERY TIME
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
3 V
0 V
3 V
Input
1.5 V
1.5 V
Output
Control
1.5 V
1.5 V
0 V
t
t
PLH
PHL
90%
t
t
PLZ
PZL
V
OH
Output
Waveform 1
In-Phase
Output
90%
t
≈V
CC
50%
10%
50% V
10%
CC
V
20% V
20% V
CC
S1 at 2 × V
(see Note B)
CC
OL
CC
t
f
r
V
OL
t
t
PLH
PHL
90%
t
t
PHZ
PZH
V
V
OH
90%
Output
Waveform 2
S1 at GND
Out-of-Phase
Output
50% V
10%
50%
10%
CC
V
OH
80% V
80% V
CC
CC
OL
t
t
r
f
≈0 V
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A.
C includes probe and test-fixture capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
Phase relationships between waveforms are arbitrary.
D. For clock inputs, f is measured with the input duty cycle at 50%.
max
E. The outputs are measured one at a time with one input transition per measurement.
F.
G.
H.
t
t
t
and t
and t
and t
are the same as t
.
pd
PLH
PZL
PLZ
PHL
PZH
PHZ
are the same as t
are the same as t
.
en
dis
.
I. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
SOIC
Drawing
CD54ACT112F3A
CD74ACT112M
ACTIVE
ACTIVE
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74ACT112M96
CD74ACT112M96E4
CD74ACT112M96G4
CD74ACT112ME4
CD74ACT112MG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD74ACT112M96
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 16
SPQ
Length (mm) Width (mm) Height (mm)
333.2 345.9 28.6
CD74ACT112M96
D
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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