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CD54HC221_15 [TI]

High-Speed CMOS Logic;
CD54HC221_15
型号： CD54HC221_15
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

High-Speed CMOS Logic
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CD54HC221, CD74HC221,  
CD74HCT221  
Data sheet acquired from Harris Semiconductor  
SCHS166F  
High-Speed CMOS Logic  
Dual Monostable Multivibrator with Reset  
November 1997 - Revised October 2003  
Features  
Description  
• Overriding RESET Terminates Output Pulse  
• Triggering from the Leading or Trailing Edge  
• Q and Q Buffered Outputs  
The ’HC221 and CD74HCT221 are dual monostable  
multivibrators with reset. An external resistor (R ) and an  
X
[ /Title  
(CD74  
HC221  
,
CD74  
HCT22  
1)  
external capacitor (C ) control the timing and the accuracy  
X
for the circuit. Adjustment of R and C provides a wide  
X
X
range of output pulse widths from the Q and Q terminals.  
Pulse triggering on the B input occurs at a particular voltage  
level and is not related to the rise and fall time of the trigger  
pulse.  
• Separate Resets  
• Wide Range of Output-Pulse Widths  
• Schmitt Trigger on B Inputs  
• Fanout (Over Temperature Range)  
Once triggered, the outputs are independent of further trigger  
inputs on A and B. The output pulse can be terminated by a  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads LOW level on the Reset (R) pin. Trailing Edge triggering (A)  
/Sub-  
ject  
and leading-edge-triggering (B) inputs are provided for  
triggering from either edge of the input pulse. On power up,  
the IC is reset. If either Mono is not used each input (on the  
unused device) must be terminated either high or low.  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
(High  
Speed  
CMOS  
Logic  
Dual  
Monos  
table  
Multi-  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
The minimum value of external resistance, R , is typically 500Ω.  
X
• HC Types  
The minimum value of external capacitance, C , is 0pF. The  
X
calculation for the pulse width is t = 0.7 R C at V = 4.5V.  
- 2V to 6V Operation  
W
X X  
CC  
- High Noise Immunity: N = 30%, N = 30% of V  
CC  
IL  
IH  
Ordering Information  
at V  
= 5V  
CC  
o
PART NUMBER  
CD54HC221F3A  
CD74HC221E  
TEMP. RANGE ( C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
PACKAGE  
16 Ld CERDIP  
16 Ld PDIP  
16 Ld SOIC  
16 Ld SOIC  
16 Ld SOIC  
16 Ld SOP  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
CD74HC221M  
- CMOS Input Compatibility, I ≤ 1µA at V , V  
l
OL OH  
CD74HC221MT  
CD74HC221M96  
CD74HC221NSR  
CD74HC221PW  
CD74HC221PWR  
CD74HC221PWT  
CD74HCT221E  
CD74HCT221M  
CD74HCT221MT  
CD74HCT221M96  
Pinout  
CD54HC221  
(CERDIP)  
CD74HC221  
16 Ld TSSOP  
16 Ld TSSOP  
16 Ld TSSOP  
16 Ld PDIP  
16 Ld SOIC  
16 Ld SOIC  
16 Ld SOIC  
(PDIP, SOIC, SOP, TSSOP)  
CD74HCT221  
(PDIP, SOIC)  
TOP VIEW  
1A  
1B  
1R  
1Q  
2Q  
1
2
3
4
5
6
7
8
16 V  
CC  
15 1C R  
X
X
NOTE: When ordering, use the entire part number. The suffixes 96  
and R denote tape and reel. The suffix T denotes a small-quantity  
reel of 250.  
14 1C  
X
13 1Q  
12 2Q  
11 2R  
10 2B  
2C  
X
X
2C R  
X
9
2A  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © 2003, Texas Instruments Incorporated  
1
CD54HC221, CD74HC221, CD74HCT221  
Functional Diagram  
1C  
1R  
X
X
V
CC  
14  
15  
1C R  
1C  
X
X
X
13  
4
1A  
1Q  
1Q  
1
2
MONO 1  
1B  
1R  
3
11  
2R  
2A  
5
9
2Q  
2Q  
MONO 2  
12  
10  
2B  
2C  
2C R  
X
X
X
6
7
V
CC  
2C  
2R  
X
X
TRUTH TABLE  
INPUTS  
OUTPUTS  
A
H
X
L
B
X
L
↑
R
H
H
H
Q
Q
H
H
L
L
↓
H
H
X
L
X
H
L
L
H
↑
(Note 3)  
(Note 3)  
H = High Voltage Level, L = Low Voltage Level, X = Irrelevant, ↑ = Transition from  
↓
Low to High Level, = Transition from High to Low Level,  
= One High Level  
Pulse,  
NOTE:  
= One Low Level Pulse  
1. For this combination the reset input must be low and the following sequence  
must be used: pin 1 (or 9) must be set high or pin 2 (or 10) set low; then pin 1  
(or 9) must be low and pin 2 (or 10) set high. Now the reset input goes from low-  
to-high and the device will be triggered.  
2
CD54HC221, CD74HC221, CD74HCT221  
Logic Diagram  
V
CC  
16  
C
P
R
N
X
A
B
R
1 (9)  
2 (10)  
3 (11)  
P
V
CC  
P
OP  
AMP  
R2  
R3  
R
D
C
RESET  
FF  
15 (7)  
R C  
-
+
X
X
Q
C
S
R
V
CC  
MIRROR VOLTAGE  
QM  
QM  
P P  
C
X
R
Q
MASK  
FF  
R1  
S
MAIN  
FF  
R4  
Q
PULLDOWN  
FF  
14 (6)  
N
V
CC  
C
8
X
D
C
C
Q
N
GND  
Q
4 (12)  
(13) 5  
R
Q
Q
+
-
OP AMP  
3
CD54HC221, CD74HC221, CD74HCT221  
Absolute Maximum Ratings  
Thermal Information  
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Package Thermal Impedance, θ (see Note 2):  
JA  
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .67 C/W  
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73 C/W  
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64 C/W  
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . 108 C/W  
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
o
IK  
o
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
DC Output Diode Current, I  
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Drain Current, per Output, I  
O
o
o
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA  
O
CC  
o
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
(SOIC - Lead Tips Only)  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time, t , t on Inputs A and R  
r
f
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
Input Rise and Fall Time, t , t on Input B  
r
f
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL  
V (V)  
I
I
(mA)  
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
O
High Level Input  
Voltage  
V
-
-
-
2
4.5  
6
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
IH  
3.15  
-
3.15  
-
3.15  
4.2  
-
0.5  
1.35  
1.8  
-
4.2  
-
0.5  
1.35  
1.8  
-
4.2  
-
Low Level Input  
Voltage  
V
-
2
-
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
1.9  
4.4  
5.9  
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
-0.02  
2
1.9  
1.9  
OH  
-0.02  
-0.02  
-
4.5  
6
4.4  
-
4.4  
-
-
5.9  
-
5.9  
-
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
5.2  
-
-
-5.2  
0.02  
0.02  
0.02  
-
5.48  
-
5.34  
-
-
Low Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
2
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
0.1  
0.1  
0.1  
-
OL  
4.5  
6
-
-
Low Level Output  
Voltage  
TTL Loads  
-
-
4
4.5  
6
0.26  
0.26  
0.33  
0.33  
-
0.4  
0.4  
5.2  
-
4
CD54HC221, CD74HC221, CD74HCT221  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
Input Leakage  
SYMBOL  
V (V)  
I
(mA)  
O
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
I
V
or  
-
6
-
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
Current  
GND  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or V  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
IH  
IL  
High Level Output  
Voltage  
TTL Loads  
-4  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or V  
0.02  
4
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
and  
0
0
-
5.5  
5.5  
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
-
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
∆I  
CC  
(Note 3)  
V
4.5 to  
5.5  
100  
360  
450  
CC  
-2.1  
NOTE:  
3. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
All Inputs  
UNIT LOADS  
0.3  
NOTE: Unit Load is ∆I  
360µA max at 25 C.  
limit specified in DC Electrical Table, e.g.,  
CC  
o
Prerequisite For Switching Function  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL  
V
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
CC  
Input Pulse Width  
A
t
2
70  
14  
12  
70  
14  
12  
-
-
-
-
-
-
-
-
-
-
-
-
90  
18  
15  
90  
18  
15  
-
-
-
-
-
-
105  
21  
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
WL  
4.5  
6
2
18  
Input Pulse Width  
B
t
105  
21  
WH  
4.5  
6
18  
5
CD54HC221, CD74HC221, CD74HCT221  
Prerequisite For Switching Function (Continued)  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
Input Pulse Width  
SYMBOL  
V
(V)  
MIN  
70  
14  
12  
0
TYP  
MAX  
MIN  
90  
18  
15  
0
MAX  
MIN  
105  
21  
18  
0
MAX  
UNITS  
ns  
CC  
t
2
-
-
-
-
-
-
-
-
-
-
WL  
Reset  
4.5  
-
-
-
ns  
6
2
-
-
-
ns  
Recovery Time  
R to A or B  
t
-
-
-
ns  
SU  
4.5  
6
0
-
-
0
-
-
0
-
-
ns  
0
0
0
ns  
Output Pulse Width Q or Q  
t
5
630  
770  
602  
798  
595  
805  
µs  
W
C
= 0.1µF R = 10kΩ  
X
X
Output Pulse Width Q or Q  
t
4.5  
-
140  
-
-
-
-
-
ns  
W
C
C
C
= 28pF, R = 2kΩ  
X
X
X
X
= 1000pF, R = 2kΩ  
t
t
4.5  
4.5  
-
-
1.5  
7
-
-
-
-
-
-
-
-
-
-
µs  
µs  
X
W
= 1000pF, R = 10kΩ  
X
W
HCT TYPES  
Input Pulse Width  
A
t
4.5  
4.5  
4.5  
4.5  
5
14  
14  
18  
0
-
-
18  
18  
23  
0
-
21  
21  
27  
0
-
ns  
ns  
ns  
ns  
µs  
ns  
WL  
Input Pulse Width  
B
t
-
-
-
-
WH  
Input Pulse Width  
Reset  
t
-
-
-
-
WL  
Recovery Time  
R to A or B  
t
-
-
-
770  
-
-
798  
-
-
805  
-
SU  
Output Pulse Width Q or Q  
t
630  
-
602  
-
595  
-
W
W
C
= 0.1µF R = 10kΩ  
X
X
Output Pulse Width Q or Q  
t
4.5  
140  
C
C
C
= 28pF, R = 2kΩ  
X
X
X
X
= 1000pF, R = 2kΩ  
t
t
4.5  
4.5  
-
-
1.5  
7
-
-
-
-
-
-
-
-
-
-
µs  
µs  
X
W
= 1000pF, R = 10kΩ  
X
W
Switching Specifications Input t , t = 6ns  
r
f
o
o
-40 C TO  
-55 C TO  
o
o
o
25 C  
85 C  
125 C  
TEST  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS  
V
(V) MIN  
TYP MAX  
MIN  
MAX  
MIN  
MAX UNITS  
CC  
Propagation Delay,  
Trigger A, B, R to Q  
t
C = 50pF  
2
-
-
-
210  
42  
36  
-
-
-
-
-
-
-
-
-
265  
53  
45  
-
-
-
-
-
-
-
-
-
315  
63  
54  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
PHL  
L
C = 50pF  
4.5  
6
-
-
-
-
-
-
-
L
C = 50pF  
-
L
C = 15pF  
5
18  
-
L
Propagation Delay,  
Trigger A, B, R to Q  
t
C = 50pF  
2
170  
34  
29  
-
215  
43  
37  
-
255  
51  
43  
-
L
C = 50pF  
4.5  
6
-
L
C = 50pF  
-
L
C = 15pF  
5
14  
L
6
CD54HC221, CD74HC221, CD74HCT221  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
-40 C TO  
-55 C TO  
o
o
o
25 C  
85 C  
125 C  
TEST  
PARAMETER  
Propagation Delay,  
SYMBOL CONDITIONS  
V
(V) MIN  
TYP MAX  
MIN  
MAX  
MIN  
MAX UNITS  
CC  
t
C = 50pF  
2
-
-
-
160  
32  
27  
180  
36  
31  
75  
15  
13  
10  
-
-
-
-
-
-
-
-
-
-
-
-
200  
40  
34  
225  
45  
38  
95  
19  
16  
10  
-
-
-
-
-
-
-
-
-
-
-
-
240  
48  
41  
270  
54  
46  
110  
22  
19  
10  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
%
PLH  
L
R to Q  
4.5  
6
-
-
-
-
-
-
-
-
-
-
-
Propagation Delay,  
R to Q  
t
C = 50pF  
2
-
PHL  
L
4.5  
6
-
-
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
2
-
4.5  
6
-
-
C
-
-
-
-
IN  
Pulse Width Match Between  
Circuits in the Same Package  
4.5 to  
5.5  
±2  
C
= 1000pF, R = 10kΩ  
X
X
Power Dissipation Capacitance  
(Notes 4, 5)  
CPD  
-
5
-
166  
-
-
-
-
-
pF  
HCT TYPES  
Propagation Delay,  
Trigger A, B, R to Q  
t
t
C = 50pF  
4.5  
5
-
-
-
-
-
-
18  
-
42  
-
-
-
-
-
-
-
-
-
-
-
-
-
63  
-
ns  
ns  
ns  
ns  
ns  
PLH  
L
C = 15pF  
L
Propagation Delay,  
Trigger A, B, R to Q  
C = 50pF  
4.5  
5
34  
-
43  
-
51  
-
PHL  
L
C = 15pF  
14  
-
L
Propagation Delay,  
R to Q  
t
t
C = 50pF  
4.5  
38  
-
57  
PLH  
L
Propagation Delay,  
R to Q  
C = 50pF  
4.5  
-
-
37  
-
-
-
56  
ns  
PHL  
L
Output Transition Time  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
2
4.5  
6
-
-
-
-
-
-
-
75  
15  
13  
10  
-
-
-
-
-
-
95  
19  
16  
10  
-
-
-
-
-
-
110  
22  
19  
10  
-
ns  
ns  
ns  
pF  
%
-
C
-
-
-
-
IN  
Pulse Width Match Between  
Circuits in the Same Package  
4.5 to  
5.5  
±2  
C
= 1000pF, R = 10kΩ  
X
X
Power Dissipation Capacitance  
(Notes 4, 5)  
CPD  
-
5
-
166  
-
-
-
-
-
pF  
NOTES:  
4. C  
is used to determine the dynamic power consumption, per multivibrator.  
2
PD  
5. P = (C  
+ C ) V  
CC  
f + Σ where f = input frequency, f = output frequency, C = output load capacitance, V  
= supply voltage.  
CC  
D
PD  
L
i
i
o
L
7
CD54HC221, CD74HC221, CD74HCT221  
Test Circuits and Waveforms  
I
t
+ t =  
WH  
WL  
I
t C = 6ns  
fC  
r
L
t
+ t  
=
L
WL  
WH  
t C = 6ns  
t C  
f
L
fC  
t C  
f
L
L
r
L
3V  
V
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
CLOCK  
50%  
10%  
1.3V  
0.3V  
50%  
t
50%  
1.3V  
t
1.3V  
GND  
GND  
t
t
WH  
WL  
WH  
WL  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
CC  
CC  
CC  
CC  
accordance with device truth table. For f  
, input duty cycle = 50%.  
accordance with device truth table. For f  
, input duty cycle = 50%.  
MAX  
MAX  
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
8
CD54HC221, CD74HC221, CD74HCT221  
Typical Performance Curves  
685  
680  
675  
R
V
= 10K  
= 5V  
R
= 10K  
o
X
X
T
= 25 C  
CC  
A
0.9  
0.8  
HCT  
C
= 1µF  
X
670  
665  
0.7  
0.6  
-75 -50 -25  
0
25  
50  
75 100 125 150 175  
o
0
2
4
6
8
10  
T , AMBIENT TEMPERATURE ( C)  
V
, SUPPLY VOLTAGE (V)  
CC  
A
FIGURE 5. HC/HCT221 OUTPUT PULSE WIDTH vs  
TEMPERATURE  
FIGURE 6. HC/HCT221 K FACTOR vs SUPPLY VOLTAGE  
6
6
10  
10  
V
= 4.5V  
CC  
V
= 2V  
CC  
5
4
3
2
5
10  
10  
10  
10  
10  
10  
10  
10  
4
3
2
R
= 100K  
R
= 100K  
X
X
R
R
= 50K  
= 10K  
X
R
R
= 50K  
= 10K  
X
X
10  
1
X
10  
1
R
= 2K  
X
R
= 2K  
X
0.1  
0.1  
2
3
4
5
6
7
8
10  
2
3
4
5
6
7
8
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
C , TIMING CAPACITANCE (pF)  
C , TIMING CAPACITANCE (pF)  
X
X
FIGURE 7. HC221 OUTPUT PULSE WIDTH vs C  
FIGURE 8. HC/HCT221 OUTPUT PULSE WIDTH vs C  
X
X
9
CD54HC221, CD74HC221, CD74HCT221  
10  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
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unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
5962-8780501EA  
CD54HC221F  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
16  
16  
16  
16  
1
1
TBD  
TBD  
TBD  
A42 SNPB  
A42 SNPB  
A42 SNPB  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CD54HC221F3A  
CD74HC221E  
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HC221EE4  
CD74HC221M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
N
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC221M96  
CD74HC221M96E4  
CD74HC221M96G4  
CD74HC221ME4  
CD74HC221MG4  
CD74HC221MT  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC221MTE4  
CD74HC221MTG4  
CD74HC221NSR  
CD74HC221NSRE4  
CD74HC221PW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC221PWE4  
CD74HC221PWR  
CD74HC221PWRE4  
CD74HC221PWT  
CD74HC221PWTE4  
CD74HCT221E  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HCT221EE4  
CD74HCT221M  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
SOIC  
SOIC  
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT221M96  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Apr-2007  
Orderable Device  
CD74HCT221M96E4  
CD74HCT221M96G4  
CD74HCT221ME4  
CD74HCT221MG4  
CD74HCT221MT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
D
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT221MTE4  
CD74HCT221MTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Apr-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Apr-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
0
(mm)  
16  
CD74HC221M96  
CD74HC221NSR  
CD74HC221PWR  
CD74HCT221M96  
D
NS  
PW  
D
16  
16  
16  
16  
FMX  
MLA  
MLA  
FMX  
6.5  
8.2  
7.0  
6.5  
10.3  
10.5  
5.6  
12.1  
2.5  
2
12  
8
16  
16  
12  
16  
Q1  
Q1  
Q1  
Q1  
330  
330  
0
16  
12  
1.6  
16  
10.3  
12.1  
2
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
CD74HC221M96  
CD74HC221NSR  
CD74HC221PWR  
CD74HCT221M96  
D
NS  
PW  
D
16  
16  
16  
16  
FMX  
MLA  
MLA  
FMX  
333.2  
333.2  
338.1  
333.2  
333.2  
333.2  
340.5  
333.2  
28.58  
28.58  
20.64  
28.58  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
30-Apr-2007  
Pack Materials-Page 3  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
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Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
microcontroller.ti.com  
www.ti.com/lpw  
Low Power  
Wireless  
Telephony  
www.ti.com/telephony  
Video & Imaging  
Wireless  
www.ti.com/video  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  

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