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CD54HC7266 [TI]

High-Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate; 高速CMOS逻辑四路2输入异或非门
CD54HC7266
型号： CD54HC7266
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

High-Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate
高速CMOS逻辑四路2输入异或非门

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CD54HC7266, CD74HC7266  
Data sheet acquired from Harris Semiconductor  
SCHS219D  
High-Speed CMOS Logic  
Quad 2-Input EXCLUSIVE NOR Gate  
August 1997 - Revised September 2003  
Features  
Description  
• Four Independent EXCLUSIVE NOR Gates  
• Buffered Inputs and Outputs  
• Logical Comparators  
The ’HC7266 contains four independent Exclusive NOR  
gates in one package. They provide the system designer  
with a means for implementation of the EXCLUSIVE NOR  
function.  
[ /Title  
(CD74H  
C7266)  
/Subject  
(High  
• Parity Generators and Checkers  
• Adders/Subtracters  
This device is functionally the same as the TTL226. They  
differ in that the ’HC7266 has active high and low outputs  
whereas the 226 has open collector outputs.  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
Speed  
CMOS  
Logic  
Quad 2-  
Input  
EXCLU-  
SIVE  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
TEMP. RANGE  
o
PART NUMBER  
CD54HC7266F3A  
CD74HC7266E  
( C)  
PACKAGE  
14 Ld CERDIP  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
14 Ld SOIC  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
• HC Types  
CD74HC7266M  
CD74HC7266MT  
CD74HC7266M96  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30%of V  
IL IH  
at  
CC  
V
= 5V  
CC  
NOTE: When ordering, use the entire part number. The suffix 96  
denotes tape and reel. The suffix T denotes a small-quantity reel  
of 250.  
Pinout  
CD54HC7266  
(CERDIP)  
CD74HC7266  
(PDIP, SOIC)  
TOP VIEW  
1A  
1B  
1
2
3
4
5
6
7
14 V  
CC  
13 4B  
12 4A  
11 4Y  
10 3Y  
1Y  
2Y  
2A  
2B  
9
8
3B  
3A  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © 2003, Texas Instruments Incorporated  
1
CD54HC7266, CD74HC7266  
Functional Diagram  
1
2
1A  
1B  
3
1Y  
2Y  
5
6
4
2A  
2B  
8
9
10  
3A  
3B  
3Y  
4Y  
12  
13  
11  
4A  
4B  
GND = 7  
= 14  
V
CC  
TRUTH TABLE  
INPUTS  
OUTPUT  
nA  
L
nB  
L
nY  
H
L
L
H
L
H
H
L
H
H
H = High Voltage Level, L = Low Voltage Level  
Logic Symbol  
nA  
nB  
nY  
2
CD54HC7266, CD74HC7266  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .  
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .  
80  
86  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
(SOIC - Lead Tips Only)  
DC V  
or Ground Current, I  
I
. . . . . . . . . . . . . . . . . .±50mA  
CC  
CC or GND  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. The package thermal impedance is calculated in accordance with JESD 51-7.  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL  
V (V)  
I
I
(mA)  
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
O
High Level Input  
Voltage  
V
-
-
-
2
4.5  
6
1.5  
3.15  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
3.15  
4.2  
-
-
1.5  
3.15  
4.2  
-
-
V
V
V
V
V
V
V
V
V
V
V
IH  
-
-
-
-
-
-
Low Level Input  
Voltage  
V
-
2
0.5  
0.5  
0.5  
IL  
4.5  
6
-
1.35  
-
1.35  
-
1.35  
-
1.8  
-
1.8  
-
1.8  
High Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
-0.02  
2
1.9  
4.4  
5.9  
3.98  
5.48  
-
-
-
-
-
1.9  
4.4  
5.9  
3.84  
5.34  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
OH  
-0.02  
-0.02  
-4  
4.5  
6
High Level Output  
Voltage  
TTL Loads  
4.5  
6
-5.2  
Low Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
0.02  
0.02  
0.02  
4
2
4.5  
6
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
V
V
V
V
V
OL  
0.1  
0.1  
Low Level Output  
Voltage  
TTL Loads  
4.5  
6
0.26  
0.26  
0.33  
0.33  
5.2  
3
CD54HC7266, CD74HC7266  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
Input Leakage  
SYMBOL  
V (V)  
I
(mA)  
O
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
I
V
or  
-
6
-
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
Current  
GND  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
2
-
20  
-
40  
µA  
CC  
CC  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
PARAMETER  
HC TYPES  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
MAX  
MAX  
UNITS  
CC  
Propagation Delay  
t
t
C = 50pF  
2
-
-
115  
23  
30  
-
145  
29  
25  
-
150  
35  
30  
-
ns  
ns  
ns  
ns  
PLH, PHL  
L
4.5  
6
5
-
Propagation Delay Time, Any  
Input  
t
t
C = 15pF  
9
PLH, PHL  
L
Output Transition Times  
(Figure 1)  
t
, t  
TLH THL  
C = 50pF  
L
2
-
-
75  
15  
13  
10  
-
95  
19  
16  
10  
-
110  
22  
19  
10  
-
ns  
ns  
ns  
pF  
pF  
4.5  
6
-
Input Capacitance  
C
-
-
-
IN  
Power Dissipation  
Capacitance  
C
C = 15pF  
5
33  
PD  
L
(Note 2)  
NOTE:  
2
2. C  
is used to determine the dynamic power consumption per gate, P = V  
f (C + C ) where f = Input Frequency, C = Output  
PD L i L  
PD  
Load Capacitance, V  
D
CC  
i
= Supply Voltage.  
CC  
Test Circuit and Waveform  
t = 6ns  
t = 6ns  
f
r
V
CC  
90%  
50%  
10%  
INPUT  
GND  
t
t
TLH  
THL  
90%  
50%  
10%  
INVERTING  
OUTPUT  
t
t
PLH  
PHL  
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC  
4
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
PDIP  
Drawing  
8404302CA  
CD54HC7266F3A  
CD74HC7266E  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
1
1
TBD  
TBD  
Call TI  
Call TI  
Level-NC-NC-NC  
Level-NC-NC-NC  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
CD74HC7266EE4  
CD74HC7266M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
N
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU Level-NC-NC-NC  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC7266M96  
CD74HC7266M96E4  
CD74HC7266ME4  
CD74HC7266MT  
CD74HC7266MTE4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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and applications, customers should provide adequate design and operating safeguards.  
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