CD74HC173M [TI]

High Speed CMOS Logic Quad D-Type Flip-Flop, Three-State; 高速CMOS逻辑四路D型触发器,三态
CD74HC173M
型号: CD74HC173M
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High Speed CMOS Logic Quad D-Type Flip-Flop, Three-State
高速CMOS逻辑四路D型触发器,三态

触发器 锁存器
文件: 总10页 (文件大小:59K)
中文:  中文翻译
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CD74HC173,  
CD74HCT173  
Data sheet acquired from Harris Semiconductor  
SCHS158  
High Speed CMOS Logic  
February 1998  
Quad D-Type Flip-Flop, Three-State  
Features  
Description  
• Three-State Buffered Outputs  
• Gated Input and Output Enables  
The Harris CD74HC173 and CD74HCT173 high speed  
three-state quad D-type flip-flops are fabricated with silicon  
gate CMOS technology. They possess the low power con-  
sumption of standard CMOS Integrated circuits, and can  
operate at speeds comparable to the equivalent low power  
Schottky devices. The buffered outputs can drive 15 LSTTL  
loads. The large output drive capability and three-state fea-  
ture make these parts ideally suited for interfacing with bus  
lines in bus oriented systems.  
[ /Title  
(CD74H  
C173,  
CD74H  
CT173)  
/Subject  
(High  
Speed  
CMOS  
Logic  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
The four D-type flip-flops operate synchronously from a com-  
mon clock. The outputs are in the three-state mode when  
either of the two output disable pins are at the logic “1” level.  
The input ENABLES allow the flip-flops to remain in their  
present states without having to disrupt the clock If either of  
the 2 input ENABLES are taken to a logic “1” level, the Q  
outputs are fed back to the inputs, forcing the flip-flops to  
remain in the same state. Reset is enabled by taking the  
MASTER RESET (MR) input to a logic “1” level. The data  
outputs change state on the positive going edge of the clock.  
• HC Types  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
CC  
IL  
IH  
at V  
= 5V  
CC  
Quad D-  
Type  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I 1µA at V , V  
l
OL OH  
The CD74HCT173 logic family is functionally, as well as pin  
compatible with the standard 74LS logic family.  
Pinout  
Ordering Information  
CD74HC173, CD74HC173  
(PDIP, SOIC)  
TEMP. RANGE  
PKG.  
NO.  
o
TOP VIEW  
PART NUMBER  
CD74HC173E  
CD74HCT173E  
CD74HC173M  
CD74HCT173M  
NOTES:  
( C)  
PACKAGE  
16 Ld PDIP  
16 Ld PDIP  
16 Ld SOIC  
16 Ld SOIC  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
E16.3  
OE  
1
2
3
4
5
6
7
8
16 V  
CC  
15 MR  
14 D0  
13 D1  
12 D2  
11 D3  
10 E2  
OE2  
E16.3  
Q
Q
Q
Q
0
1
2
3
M16.15  
M16.15  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
CP  
9
E1  
GND  
2. Wafer and die for this part number is available which meets all  
electrical specifications. Please contact your local sales office or  
Harris customer service for ordering information.  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
File Number 1641.1  
Copyright © Harris Corporation 1998  
1
CD74HC173, CD74HCT173  
Functional Diagram  
E1  
E2  
10  
9
14  
13  
12  
11  
7
3
D0  
D1  
D2  
D3  
CP  
Q
Q
Q
Q
0
1
2
3
4
5
6
15  
1
2
MR  
OE1  
OE2  
TRUTH TABLE  
INPUTS  
DATA ENABLE  
DATA  
OUTPUT  
MR  
CP  
X
L
E1  
X
X
H
X
L
E2  
X
X
X
H
L
D
X
X
X
X
L
Q
n
H
L
L
Q
Q
Q
0
0
0
L
L
L
L
L
L
L
H
H
NOTE:  
When either OE1 or OE2 (or both) is (are) high the output is disabled  
to the high-impedance state, however, sequential operation of the  
flip-flops is not affected.  
H = High Voltage Level  
L
X
= Low Voltage Level  
= Irrelevant  
= Transition from Low to High Level  
Q = Level Before the Indicated Steady-State Input Conditions Were  
0
Established  
2
CD74HC173, CD74HCT173  
Logic Diagram  
9
E1  
10  
E2  
V
CC  
D
Q
14  
P
D0  
3
Q
0
7
CP  
CP  
Q
N
R
15  
MR  
1
OE1  
2
OE2  
13  
D1  
4
5
6
Q
Q
Q
1
2
3
12  
3 CIRCUITS IDENTICAL TO ABOVE CIRCUIT  
IN DASHED ENCLOSURE  
D2  
11  
D3  
3
CD74HC173, CD74HCT173  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
90  
For V < -0.5V or V > V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
160  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
(SOIC - Lead Tips Only)  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±70mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
3.15  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
3.15  
4.2  
-
-
1.5  
3.15  
4.2  
-
-
V
V
V
V
V
V
V
V
V
V
V
IH  
4.5  
-
-
-
6
2
-
-
-
Low Level Input  
Voltage  
V
-
0.5  
0.5  
0.5  
IL  
4.5  
6
-
1.35  
-
1.35  
-
1.35  
-
1.8  
-
1.8  
-
1.8  
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
4.4  
5.9  
3.98  
5.48  
-
-
-
-
-
1.9  
4.4  
5.9  
3.84  
5.34  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
OH  
IH  
V
IL  
-0.02  
-0.02  
-6  
4.5  
6
High Level Output  
Voltage  
TTL Loads  
4.5  
6
-7.8  
Low Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
0.02  
0.02  
0.02  
6
2
4.5  
6
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
V
V
V
V
V
OL  
IH  
IL  
0.1  
0.1  
Low Level Output  
Voltage  
TTL Loads  
4.5  
6
0.26  
0.26  
0.33  
0.33  
7.8  
Input Leakage  
Current  
I
V
or  
-
6
6
-
-
-
-
±0.1  
-
-
±1  
-
-
±1  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
0
8
80  
160  
CC  
CC  
GND  
4
CD74HC173, CD74HCT173  
DC Electrical Specifications  
(Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
Three-State Leakage  
Current  
I
V
V
or  
-
6
-
-
±0.5  
-
±0.5  
-
±10  
µA  
OZ  
IL  
IH  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
V
IL  
High Level Output  
Voltage  
TTL Loads  
-6  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or  
0.02  
6
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IH  
V
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
to  
0
0
-
5.5  
5.5  
-
-
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
(Note 4)  
I  
V
4.5 to  
5.5  
100  
360  
450  
CC  
CC  
-2.1  
Three-State Leakage  
Current  
I
V
V
or  
-
5.5  
-
-
±0.5  
-
±5.0  
-
±10  
µA  
OZ  
IL  
IH  
NOTE:  
4. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
D0-D3  
UNIT LOADS  
0.15  
0.15  
0.25  
0.2  
E1 and E2  
CP  
MR  
OE1 and OE2  
0.5  
NOTE: Unit Load is I  
CC  
Specifications table, e.g., 360µA max at 25 C.  
limit specified in DC Electrical  
o
5
CD74HC173, CD74HCT173  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
PARAMETER  
HC TYPES  
SYMBOL  
CONDITIONS  
V
(V)  
TYP  
MAX  
MAX  
MAX  
UNITS  
CC  
Propagation Delay, Clock to  
Output  
t
, t  
C = 50pF  
2
-
-
200  
40  
-
250  
50  
-
300  
60  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
MHz  
pF  
pF  
PLH PHL  
L
4.5  
C = 15pF  
L
5
6
2
17  
-
CL = 50pF  
34  
175  
35  
-
43  
220  
44  
-
51  
265  
53  
-
Propagation Delay, MR to  
Output  
t
C = 50pF  
-
PHL  
L
4.5  
5
-
C = 15pF  
L
12  
-
CL = 50pF  
CL = 50pF  
6
30  
150  
30  
-
37  
190  
38  
-
45  
225  
45  
-
Propagation Delay Output  
Enable to Q (Figure 6)  
t
t
, t  
PLZ PHZ  
2
, t  
PZL PZH  
C = 50pF  
4.5  
5
L
C = 15pF  
L
12  
CL = 50pF  
6
26  
60  
12  
10  
-
33  
75  
15  
13  
-
38  
90  
18  
15  
-
Output Transition Times  
t
, t  
TLH THL  
C = 50pF  
2
-
-
L
4.5  
6
-
Maximum Clock Frequency  
Input Capacitance  
f
C = 15pF  
L
5
60  
-
MAX  
C
-
-
-
10  
10  
10  
10  
10  
10  
IN  
Three-State Output  
Capacitance  
C
-
-
O
Power Dissipation  
Capacitance  
C
-
5
29  
-
-
-
pF  
PD  
(Notes 5, 6)  
HCT TYPES  
Propagation Delay, Clock to  
Output  
t
, t  
PLH PHL  
C = 50pF  
4.5  
5
-
40  
-
50  
-
60  
-
ns  
ns  
L
C = 15pF  
17  
-
L
Propagation Delay, MR to  
Output  
t
C = 50pF  
4.5  
5
44  
-
55  
-
66  
-
ns  
PHL  
L
C = 15pF  
L
18  
ns  
Propagation Delay Output  
Enable to Q (Figure 6)  
t , t  
PZL PZH  
CL = 50pF  
2
150  
30  
-
190  
38  
-
225  
45  
-
ns  
C = 50pF  
4.5  
5
ns  
L
C = 15pF  
L
14  
ns  
CL = 50pF  
6
26  
15  
-
33  
19  
-
38  
22  
-
ns  
Output Transition Times  
Maximum Clock Frequency  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
4.5  
5
-
ns  
L
f
C = 15pF  
L
60  
-
MHz  
pF  
pF  
MAX  
C
-
-
-
10  
-
10  
-
10  
-
IN  
Power Dissipation  
Capacitance  
C
5
34  
PD  
(Notes 5, 6)  
NOTES:  
5. C  
PD  
is used to determine the dynamic power consumption, per package.  
2
2
6. P = V  
CC  
f + (C V  
+ f ) where f = Input Frequency, f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.  
CC  
D
i
L
CC  
O
i
O
L
6
CD74HC173, CD74HCT173  
Prerequisite For Switching Specifications  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL  
V
(V)  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
CC  
Maximum Clock Frequency  
f
2
6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5
24  
28  
100  
20  
17  
100  
20  
17  
75  
15  
13  
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4
20  
24  
120  
24  
20  
120  
24  
20  
90  
18  
15  
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MHz  
MHz  
MHz  
ns  
MAX  
4.5  
30  
35  
80  
16  
14  
80  
16  
14  
60  
12  
10  
3
6
2
MR Pulse Width  
t
t
w
w
4.5  
6
ns  
ns  
Clock Pulse Width  
2
ns  
4.5  
6
ns  
ns  
Set-up Time, Data to Clock  
and E to Clock  
t
2
ns  
SU  
4.5  
6
ns  
ns  
Hold Time, Data to Clock  
Hold Time, E to Clock  
t
t
2
ns  
H
H
4.5  
6
3
3
3
ns  
3
3
3
ns  
2
0
0
0
ns  
4.5  
6
0
0
0
ns  
0
0
0
ns  
Removal Time, MR to Clock  
t
2
60  
12  
10  
75  
15  
13  
90  
18  
15  
ns  
REM  
4.5  
6
ns  
ns  
HCT TYPES  
Maximum Clock Frequency  
f
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
4.5  
20  
15  
25  
12  
18  
0
-
-
-
-
-
-
-
-
16  
19  
31  
15  
23  
0
-
-
-
-
-
-
-
-
13  
22  
38  
18  
27  
0
-
-
-
-
-
-
-
-
MHz  
ns  
MAX  
MR Pulse Width  
t
w
w
Clock Pulse Width  
t
ns  
Set-up Time, E to Clock  
Set-up Time, Data to Clock  
Hold Time, Data to Clock  
Hold Time, E to Clock  
Removal Time, MR to Clock  
t
t
ns  
SU  
ns  
SU  
t
t
ns  
H
0
0
0
ns  
H
t
12  
15  
18  
ns  
REM  
7
CD74HC173, CD74HCT173  
Test Circuits and Waveforms  
I
t
+ t =  
WH  
WL  
I
t C = 6ns  
fC  
r
L
t
+ t  
=
L
WL  
WH  
t C = 6ns  
t C  
f
L
f
t C  
f
L
CL  
r
L
3V  
V
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
CLOCK  
50%  
10%  
1.3V  
0.3V  
50%  
t
50%  
1.3V  
t
1.3V  
GND  
GND  
t
t
WH  
WL  
WH  
WL  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
NOTE: Outputs should be switching from 10% V  
to 90% V  
in  
CC  
CC  
CC  
CC  
accordance with device truth table. For f  
, input duty cycle = 50%. accordance with device truth table. For f , input duty cycle = 50%.  
MAX  
MAX  
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND  
PULSE WIDTH  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGA-  
TION DELAY TIMES, COMBINATION LOGIC  
FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
t C  
t C  
t C  
t C  
r
L
f
L
f
L
r
L
V
3V  
CC  
90%  
10%  
2.7V  
0.3V  
CLOCK  
INPUT  
CLOCK  
INPUT  
50%  
1.3V  
GND  
GND  
t
t
t
t
H(L)  
H(H)  
H(H)  
H(L)  
V
3V  
CC  
DATA  
INPUT  
DATA  
INPUT  
50%  
1.3V  
t
SU(L)  
1.3V  
1.3V  
GND  
GND  
t
t
t
SU(H)  
SU(H)  
SU(L)  
t
t
90%  
50%  
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
90%  
1.3V  
OUTPUT  
OUTPUT  
10%  
10%  
t
t
t
PLH  
t
PHL  
PHL  
PLH  
t
REM  
t
REM  
V
3V  
CC  
SET, RESET  
OR PRESET  
SET, RESET  
OR PRESET  
50%  
1.3V  
GND  
GND  
IC  
IC  
C
C
L
L
50pF  
50pF  
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,  
AND PROPAGATION DELAY TIMES FOR EDGE  
TRIGGERED SEQUENTIAL LOGIC CIRCUITS  
8
Test Circuits and Waveforms (Continued)  
6ns  
6ns  
t
6ns  
t
6ns  
r
f
V
3V  
CC  
OUTPUT  
DISABLE  
OUTPUT  
DISABLE  
90%  
2.7  
50%  
t
1.3  
10%  
0.3  
GND  
GND  
t
t
t
t
PZL  
PZL  
PLZ  
PLZ  
OUTPUT LOW  
TO OFF  
OUTPUT LOW  
TO OFF  
50%  
50%  
1.3V  
10%  
90%  
10%  
90%  
t
t
PZH  
PHZ  
PHZ  
t
PZH  
OUTPUT HIGH  
TO OFF  
OUTPUT HIGH  
TO OFF  
1.3V  
OUTPUTS  
ENABLED  
OUTPUTS  
ENABLED  
OUTPUTS  
DISABLED  
OUTPUTS  
ENABLED  
OUTPUTS  
DISABLED  
OUTPUTS  
ENABLED  
FIGURE 7. HC THREE-STATE PROPAGATION DELAY  
WAVEFORM  
FIGURE 8. HCT THREE-STATE PROPAGATION DELAY  
WAVEFORM  
OTHER  
OUTPUT  
= 1kΩ  
INPUTS  
TIED HIGH  
OR LOW  
IC WITH  
THREE-  
STATE  
R
L
V
FOR t AND t  
PLZ  
CC  
GND FOR t  
PZL  
AND t  
PHZ  
PZH  
C
L
OUTPUT  
50pF  
OUTPUT  
DISABLE  
NOTE: Open drain waveforms t  
PLZ  
and t are the same as those for three-state shown on the left. The test circuit is Output R = 1kto  
PZL L  
V
, C = 50pF.  
CC  
L
FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT  
9
IMPORTANT NOTICE  
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pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
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Copyright 1999, Texas Instruments Incorporated  

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