CD74HC7266E [TI]
High Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate; 高速CMOS逻辑四路2输入异或非门型号: | CD74HC7266E |
厂家: | TEXAS INSTRUMENTS |
描述: | High Speed CMOS Logic Quad 2-Input EXCLUSIVE NOR Gate |
文件: | 总5页 (文件大小:39K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CD74HC7266
Data sheet acquired from Harris Semiconductor
SCHS219
High Speed CMOS Logic
Quad 2-Input EXCLUSIVE NOR Gate
August 1997
Features
Description
• Four Independent EXCLUSIVE NOR Gates
• Buffered Inputs and Outputs
• Logical Comparators
The Harris CD74HC7266 contains four independent
Exclusive NOR gates in one package. They provide the
system designer with a means for implementation of the
EXCLUSIVE NOR function.
[ /Title
(CD74H
C7266)
/Subject
(High
• Parity Generators and Checkers
• Adders/Subtracters
This device is functionally the same as the TTL226. They
differ in that the HC7266 has active high and low outputs
whereas the 226 has open collector outputs.
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
Speed
CMOS
Logic
Quad 2-
Input
EXCLU-
SIVE
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
PKG.
NO.
o
PART NUMBER TEMP. RANGE ( C) PACKAGE
• Significant Power Reduction Compared to LSTTL
Logic ICs
CD74HC7266E
CD74HC7266M
NOTES:
-55 to 125
-55 to 125
14 Ld PDIP
E14.3
14 Ld SOIC M14.15
• HC Types
- 2V to 6V Operation
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
- High Noise Immunity: N = 30%, N = 30%of V
IL IH
at
CC
V
= 5V
CC
2. Die for this part number is available which meets all electrical
specifications. Please contact your local sales office or Harris
customer service for ordering information.
Pinout
CD74HC7266
(PDIP, SOIC)
TOP VIEW
1A
1B
1
2
3
4
5
6
7
14 V
CC
13 4B
12 4A
11 4Y
10 3Y
1Y
2Y
2A
2B
9
8
3B
3A
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
File Number 1780.1
Copyright © Harris Corporation 1997
1
CD74HC7266
Functional Diagram
1
2
1A
1B
3
1Y
2Y
5
6
4
2A
2B
8
9
10
3A
3B
3Y
4Y
12
13
11
4A
4B
GND = 7
= 14
V
CC
TRUTH TABLE
INPUTS
OUTPUT
nA
L
nB
L
nY
H
L
L
H
L
H
H
L
H
H
NOTE: H = High Voltage Level, L = Low Voltage Level
Logic Symbol
nA
nB
nY
2
CD74HC7266
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 3)
θ
( C/W)
CC
DC Input Diode Current, I
For V < -0.5V or V > V
JA
IK
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
90
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
175
o
DC Output Diode Current, I
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
o
DC Output Source or Sink Current per Output Pin, I
O
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
(SOIC - Lead Tips Only)
DC V
or Ground Current, I
I
. . . . . . . . . . . . . . . . . .±50mA
CC
CC or GND
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θ is measured with the component mounted on an evaluation PC board in free air.
JA
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
3.15
4.2
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
3.15
4.2
-
-
1.5
3.15
4.2
-
-
V
V
V
V
V
V
V
V
V
V
V
IH
-
-
-
-
-
-
Low Level Input
Voltage
V
-
2
0.5
0.5
0.5
IL
4.5
6
-
1.35
-
1.35
-
1.35
-
1.8
-
1.8
-
1.8
High Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
4.4
5.9
3.98
5.48
-
-
-
-
-
1.9
4.4
5.9
3.84
5.34
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
OH
-0.02
-0.02
-4
4.5
6
High Level Output
Voltage
TTL Loads
4.5
6
-5.2
Low Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
0.02
0.02
0.02
4
2
4.5
6
-
-
-
-
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
0.1
0.1
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
V
V
V
V
V
OL
0.1
0.1
Low Level Output
Voltage
TTL Loads
4.5
6
0.26
0.26
0.33
0.33
5.2
3
CD74HC7266
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
TYP
-
-40 C TO 85 C -55 C TO 125 C
V
(V)
CC
PARAMETER
Input Leakage
SYMBOL
V (V)
I
(mA)
O
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
I
I
V
or
-
6
-
±0.1
-
±1
-
±1
µA
I
CC
Current
GND
Quiescent Device
Current (Note)
I
V
GND
or
0
6
-
-
2
-
20
-
40
µA
CC
CC
NOTE:
4. For dual-supply systems theorectical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
Switching Specifications Input t , t = 6ns
r
f
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
TEST
PARAMETER
HC TYPES
SYMBOL
CONDITIONS
V
(V)
TYP
MAX
MAX
MAX
UNITS
CC
Propagation Delay
t
t
C = 50pF
2
4.5
6
-
-
115
23
30
-
145
29
25
-
150
35
30
-
ns
ns
ns
ns
PLH, PHL
L
-
Propagation Delay Time, Any
Input
t
t
C = 15pF
5
9
PLH, PHL
L
Output Transition Times
(Figure 1)
t
, t
TLH THL
C = 50pF
L
2
4.5
6
-
-
75
15
13
10
-
95
19
16
10
-
110
22
19
10
-
ns
ns
ns
pF
pF
-
Input Capacitance
C
-
-
-
IN
Power Dissipation
Capacitance
C
C = 15pF
5
33
PD
L
NOTE:
2
5. C
is used to determine the dynamic power consumption per gate, P = V
f (C + C ) where f = Input Frequency, C = Output
PD L i L
PD
Load Capacitance, V
D
CC
i
= Supply Voltage.
CC
Test Circuit and Waveform
t = 6ns
t = 6ns
f
r
V
CC
90%
50%
10%
INPUT
GND
t
t
TLH
THL
90%
50%
10%
INVERTING
OUTPUT
t
t
PLH
PHL
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
4
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1998, Texas Instruments Incorporated
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