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CD74HCT11MTE4 [TI]

High-Speed CMOS Logic Triple 3-Input AND Gate; 高速CMOS逻辑三路3输入与门
CD74HCT11MTE4
型号： CD74HCT11MTE4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

High-Speed CMOS Logic Triple 3-Input AND Gate
高速CMOS逻辑三路3输入与门

栅极 触发器 逻辑集成电路 光电二极管
文件： 总11页 (文件大小：261K)
中文：  中文翻译
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CD54HC11, CD74HC11,  
CD54HCT11, CD74HCT11  
Data sheet acquired from Harris Semiconductor  
SCHS273E  
High-Speed CMOS Logic  
Triple 3-Input AND Gate  
August 1997 - Revised September 2003  
Features  
Description  
• Buffered Inputs  
The ’HC11 and ’HCT11 logic gates utilize silicon gate CMOS  
technology to achieve operating speeds similar to LSTTL  
gates with the low power consumption of standard CMOS  
integrated circuits. All devices have the ability to drive 10  
LSTTL loads. The HCT logic family is functionally pin  
compatible with the standard LS logic family.  
• Typical Propagation Delay: 8ns at V  
o
= 5V,  
[ /Title  
(CD54  
HCT11  
,
CD74  
HC11,  
CD74  
HCT11  
)
CC  
C = 15pF, T = 25 C  
L
A
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
Ordering Information  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
TEMP. RANGE  
o
PART NUMBER  
CD54HC11F3A  
CD54HCT11F3A  
CD74HC11E  
( C)  
PACKAGE  
14 Ld CERDIP  
14 Ld CERDIP  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
14 Ld SOIC  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
14 Ld SOIC  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
/Sub-  
ject  
(High  
• HC Types  
- 2V to 6V Operation  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
CD74HC11M  
at V  
= 5V  
CC  
CD74HC11MT  
CD74HC11M96  
CD74HCT11E  
CD74HCT11M  
CD74HCT11MT  
CD74HCT11M96  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I ≤ 1µA at V , V  
OL OH  
l
NOTE: When ordering, use the entire part number. The suffix 96  
denotes tape and reel. The suffix T denotes a small-quantity reel  
of 250.  
Pinout  
CD54HC11, CD54HCT11  
(CERDIP)  
CD74HC11, CD74HCT11  
(PDIP, SOIC)  
TOP VIEW  
1A  
1B  
1
2
3
4
5
6
7
14 V  
CC  
13 1C  
12 1Y  
11 3C  
10 3B  
2A  
2B  
2C  
2Y  
9
8
3A  
3Y  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © 2003, Texas Instruments Incorporated  
1
CD54HC11, CD74HC11, CD54HCT11, CD74HCT11  
Functional Diagram  
14  
13  
12  
11  
10  
9
1
2
3
4
5
6
7
V
1A  
1B  
CC  
1C  
1Y  
3C  
3B  
3A  
3Y  
2A  
2B  
2C  
2Y  
8
GND  
TRUTH TABLE  
INPUTS  
OUTPUT  
nA  
L
nB  
L
nC  
nY  
L
L
H
L
L
L
L
L
H
H
L
L
L
H
L
L
H
H
H
H
L
L
H
L
L
H
H
L
H
H
Logic Symbol  
nA  
nB  
nC  
nY  
2
CD54HC11, CD74HC11, CD54HCT11, CD74HCT11  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
JA  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80  
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86  
Maximum Junction Temperature (Hermetic Package or Die) . . . 175 C  
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
IK  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
DC Output Diode Current, I  
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
o
DC Output Source or Sink Current per Output Pin, I  
O
o
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
I
. . . . . . . . . . . . . . . . . .±50mA  
(SOIC - Lead Tips Only)  
CC  
CC or GND  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. The package thermal impedance is calculated in accordance with JESD 51-7.  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA  
IH  
4.5  
3.15  
-
-
3.15  
-
-
3.15  
6
2
4.2  
4.2  
4.2  
-
Low Level Input  
Voltage  
V
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
1.9  
1.9  
OH  
IH  
V
IL  
-0.02  
-0.02  
-
4.5  
6
4.4  
-
4.4  
-
4.4  
-
5.9  
-
5.9  
-
5.9  
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
-5.2  
0.02  
0.02  
0.02  
-
5.48  
-
5.34  
-
5.2  
-
Low Level Output  
Voltage  
V
V
or  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
OL  
IH  
V
IL  
4.5  
6
Low Level Output  
Voltage  
TTL Loads  
-
4
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
5.2  
-
Input Leakage  
Current  
I
V
or  
6
I
CC  
GND  
3
CD54HC11, CD74HC11, CD54HCT11, CD74HCT11  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
2
-
20  
-
40  
µA  
CC  
CC  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage CMOS Loads  
V
V
or  
IH  
-0.02  
4.5  
4.4  
3.98  
4.4  
3.84  
4.4  
3.7  
OH  
V
IL  
High Level Output  
Voltage  
-4  
4.5  
-
-
-
TTL Loads  
Low Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
IH  
0.02  
4.5  
4.5  
5.5  
5.5  
-
-
-
-
-
0.1  
-
-
-
0.1  
0.33  
±1  
-
-
-
0.1  
0.4  
±1  
V
V
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
4
-
0.26  
±0.1  
Input Leakage  
Current  
I
V
and  
GND  
µA  
I
CC  
Quiescent Device  
Current  
I
V
or  
-
-
-
-
-
2
-
-
20  
-
-
40  
µA  
µA  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
∆I  
CC  
(Note 2)  
V
4.5 to  
5.5  
100  
360  
450  
490  
CC  
- 2.1  
NOTE:  
2. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
All  
UNIT LOADS  
0.5  
NOTE: Unit Load is ∆I  
Specifications table, e.g. 360µA max at 25 C.  
limit specified in DC Electrical  
o
CC  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
HC TYPES  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
Propagation Delay,  
Input to Output (Figure 1)  
t
, t  
PLH PHL  
C = 50pF  
2
4.5  
6
-
-
-
-
-
-
100  
20  
17  
-
-
-
-
-
125  
25  
21  
-
-
-
-
-
150  
30  
26  
-
ns  
ns  
ns  
ns  
L
-
Propagation Delay, Data Input to  
Output Y  
t , t  
PLH PHL  
C = 15pF  
5
8
L
4
CD54HC11, CD74HC11, CD54HCT11, CD74HCT11  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
V
CC  
PARAMETER  
SYMBOL CONDITIONS (V)  
MIN TYP MAX  
MIN  
MAX  
95  
19  
16  
10  
-
MIN  
MAX  
110  
22  
UNITS  
ns  
Transition Times (Figure 1)  
t
, t  
TLH THL  
C = 50pF  
2
4.5  
6
-
-
-
-
-
-
-
75  
15  
13  
10  
-
-
-
-
-
-
-
-
-
-
-
L
ns  
-
19  
ns  
Input Capacitance  
C
C = 50pF  
-
-
10  
pF  
I
L
Power Dissipation Capacitance  
(Notes 3, 4)  
C
C = 15pF  
5
26  
-
pF  
PD  
L
HCT TYPES  
Propagation Delay, Input to  
Output (Figure 2)  
t
, t  
PLH PHL  
C = 50pF  
4.5  
5
-
-
-
28  
-
-
-
35  
-
-
-
42  
-
ns  
ns  
L
Propagation Delay, Data Input to  
Output Y  
t , t  
PLH PHL  
C = 15pF  
11  
L
Transition Times (Figure 2)  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
4.5  
-
-
-
-
-
-
15  
10  
-
-
-
-
19  
10  
-
-
-
-
22  
10  
-
ns  
pF  
pF  
L
C
C = 50pF  
L
I
Power Dissipation Capacitance  
(Notes 3, 4)  
C
-
5
28  
PD  
NOTES:  
3. C  
is used to determine the dynamic power consumption, per gate.  
2
PD  
4. P = V  
f (C  
PD  
+ C ) where f = input frequency, C = output load capacitance, V = supply voltage.  
CC  
D
CC  
i
L
i
L
Test Circuits and Waveforms  
t = 6ns  
f
t = 6ns  
t = 6ns  
t = 6ns  
r
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 1. HC TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
5
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
5962-8970901CA  
CD54HC11F  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
TBD  
TBD  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
A42 SNPB  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
CD54HC11F3A  
CD54HCT11F  
CD54HCT11F3A  
CD74HC11E  
J
1
J
1
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HC11EE4  
CD74HC11M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
N
D
D
D
D
D
D
N
N
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC11M96  
CD74HC11M96E4  
CD74HC11ME4  
CD74HC11MT  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC11MTE4  
CD74HCT11E  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HCT11EE4  
CD74HCT11M  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT11M96  
CD74HCT11M96E4  
CD74HCT11ME4  
CD74HCT11MT  
CD74HCT11MTE4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
6-Dec-2006  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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