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CD74HCT126EE4 [TI]

High-Speed CMOS Logic Quad Buffer, Three-State; 高速CMOS逻辑四路缓冲器，三态
CD74HCT126EE4
型号： CD74HCT126EE4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

High-Speed CMOS Logic Quad Buffer, Three-State
高速CMOS逻辑四路缓冲器，三态
文件： 总14页 (文件大小：444K)
中文：  中文翻译
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CD54HC126, CD74HC126,  
CD54HCT126, CD74HCT126  
Data sheet acquired from Harris Semiconductor  
SCHS144C  
High-Speed CMOS Logic  
Quad Buffer, Three-State  
November 1997 - Revised September 2003  
Features  
Description  
• Three-State Outputs  
The ’HC126 and ’HCT126 contain four independent three-  
state buffers, each having its own output enable input, which  
when “low” puts the output in the high-impedance state.  
• Separate Output Enable Inputs  
[ /Title  
(CD74  
HC126  
,
CD74  
HCT12  
6)  
• Fanout (Over Temperature Range)  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
Ordering Information  
TEMP. RANGE  
o
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
PART NUMBER  
CD54HC126F3A  
CD54HCT126F3A  
CD74HC126E  
( C)  
PACKAGE  
14 Ld CERDIP  
14 Ld CERDIP  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
14 Ld SOIC  
14 Ld PDIP  
14 Ld SOIC  
14 Ld SOIC  
14 Ld SOIC  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
/Sub-  
ject  
• HC Types  
(High  
Speed  
CMOS  
Logic  
Quad  
Buffer,  
Three-  
State)  
- 2V to 6V Operation  
CD74HC126M  
- High Noise Immunity: N = 30%, N = 30% of V  
IL IH CC  
CD74HC126MT  
CD74HC126M96  
CD74HCT126E  
CD74HCT126M  
CD74HCT126MT  
CD74HCT126M96  
at V  
= 5V  
CC  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I ≤ 1µA at V , V  
OL OH  
l
NOTE: When ordering, use the entire part number. The suffix 96  
denotes tape and reel. The suffix T denotes a small-quantity reel of  
250.  
Pinout  
CD54HC126, CD54HC126  
(CERDIP)  
CD74HC126, CD74HC126  
(PDIP, SOIC)  
TOP VIEW  
1OE  
1A  
1
2
3
4
5
6
7
14 V  
CC  
13 4OE  
12 4A  
1Y  
2OE  
2A  
11 4Y  
10 3OE  
2Y  
9
8
3A  
3Y  
GND  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © 2003, Texas Instruments Incorporated  
1
CD54HC126, CD74HC126, CD54HCT126, CD74HCT126  
Functional Diagram  
1
2
1OE  
1A  
3
1Y  
2Y  
3Y  
4Y  
4
2OE  
2A  
6
5
10  
9
3OE  
3A  
8
13  
12  
4OE  
4A  
11  
GND = 7  
V
= 14  
CC  
TRUTH TABLE  
INPUTS  
OUTPUTS  
nA  
H
nOE  
H
nY  
H
L
L
H
X
L
Z
H= High Voltage Level  
L= Low Voltage Level  
X= Don’t Care  
Z= High Impedance, OFF State  
Logic Diagram  
P
n
nA  
nY  
nOE  
2
CD54HC126, CD74HC126, CD54HCT126, CD74HCT126  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V  
Thermal Resistance (Typical, Note 1)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
For V < -0.5V or V > V  
JA  
IK  
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .  
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .  
80  
86  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Drain Current, per Output, I  
O
For -0.5V < V < V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA  
O
CC  
(SOIC - Lead Tips Only)  
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
DC V  
or Ground Current, I  
. . . . . . . . . . . . . . . . . . . . . . . . .±70mA  
CC  
CC  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
1. The package thermal impedance is calculated in accordance with JESD 51-7.  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
HC TYPES  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
High Level Input  
Voltage  
V
-
-
-
2
1.5  
3.15  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
3.15  
4.2  
-
-
1.5  
3.15  
4.2  
-
-
V
V
V
V
V
V
V
V
V
V
V
IH  
4.5  
-
-
-
6
2
-
-
-
Low Level Input  
Voltage  
V
-
0.5  
0.5  
0.5  
IL  
4.5  
6
-
1.35  
-
1.35  
-
1.35  
-
1.8  
-
1.8  
-
1.8  
High Level Output  
Voltage  
CMOS Loads  
V
V
or  
-0.02  
2
1.9  
4.4  
5.9  
3.98  
5.48  
-
-
-
-
-
1.9  
4.4  
5.9  
3.84  
5.34  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
OH  
IH  
V
IL  
-0.02  
-0.02  
-6  
4.5  
6
High Level Output  
Voltage  
TTL Loads  
4.5  
6
-7.8  
Low Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
0.02  
0.02  
0.02  
6
2
4.5  
6
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
V
V
V
V
V
OL  
IH  
IL  
0.1  
0.1  
Low Level Output  
Voltage  
TTL Loads  
4.5  
6
0.26  
0.26  
0.33  
0.33  
7.8  
Input Leakage  
Current  
I
V
or  
-
6
-
-
±0.1  
-
±1  
-
±1  
µA  
I
CC  
GND  
3
CD54HC126, CD74HC126, CD54HCT126, CD74HCT126  
DC Electrical Specifications  
(Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C  
-55 C TO 125 C  
PARAMETER  
SYMBOL V (V)  
I
(mA)  
V
(V) MIN TYP MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
I
O
CC  
Quiescent Device  
Current  
I
V
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
GND  
Three-State Leakage  
Current  
I
V
V
or  
IL  
-
6
-
-
±0.5  
-
±5  
-
±10  
µA  
OZ  
IH  
HCT TYPES  
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
V
IL  
High Level Output  
Voltage  
TTL Loads  
-6  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or  
0.02  
6
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IH  
V
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
to  
0
0
-
5.5  
5.5  
-
-
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
∆I  
CC  
(Note 2)  
V
4.5 to  
5.5  
100  
360  
450  
CC  
-2.1  
Three-State Leakage  
Current  
I
V
V
or  
IL  
-
5.5  
-
-
±0.5  
-
±5  
-
±10  
µA  
OZ  
IH  
NOTE:  
2. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
nA, nOE  
UNIT LOADS  
1
NOTE: Unit Load is ∆I  
Specifications table, e.g., 360µA max at 25 C.  
limit specified in DC Electrical  
o
CC  
4
CD54HC126, CD74HC126, CD54HCT126, CD74HCT126  
Switching Specifications Input t , t = 6ns  
r
f
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
TEST  
CONDITIONS  
PARAMETER  
HC TYPES  
SYMBOL  
V
(V)  
TYP  
MAX  
MAX  
MAX  
UNITS  
CC  
Propagation Delay Data  
to Outputs  
t
, t  
C = 50pF  
2
-
-
100  
20  
-
125  
25  
-
150  
30  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
pF  
PLH PHL  
L
4.5  
C = 15pF  
L
5
6
2
8
-
CL = 50pF  
17  
125  
25  
-
21  
155  
31  
-
36  
190  
38  
-
Enable Delay Time  
t
t
C = 50pF  
-
PZL, PZH  
L
4.5  
5
-
C = 15pF  
L
10  
-
CL = 50pF  
CL = 50pF  
6
21  
125  
25  
-
26  
155  
31  
-
32  
190  
38  
-
Disabling Delay Time  
t
, t  
2
-
PLZ PHZ  
C = 50pF  
4.5  
5
-
L
C = 15pF  
L
10  
-
CL = 50pF  
6
21  
60  
12  
10  
10  
20  
26  
75  
15  
13  
10  
20  
32  
90  
18  
15  
10  
20  
Output Transition Times  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
2
-
4.5  
6
-
-
C
-
-
-
-
I
Three-State Output  
Capacitance  
C
-
-
O
Power Dissipation  
Capacitance  
C
-
5
30  
-
-
-
pF  
PD  
(Notes 3, 4)  
HCT TYPES  
Propagation Delay Time  
to Outputs  
t
, t  
C = 50pF  
4.5  
5
-
9
-
24  
-
30  
-
36  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
pF  
pF  
PLH PHL  
L
C = 15pF  
L
Output Enable Time  
t
t
C = 50pF  
4.5  
5
25  
-
31  
-
38  
-
PZL, PZH  
L
C = 15pF  
10  
-
L
Output Disabling Time  
t
, t  
PLZ PHZ  
C = 50pF  
4.5  
5
28  
-
35  
-
42  
-
L
C = 15pF  
11  
-
L
Output Transition Times  
Input Capacitance  
t
, t  
TLH THL  
C = 50pF  
L
4.5  
-
12  
10  
20  
15  
10  
20  
18  
10  
20  
C
-
-
-
I
Three-State Output  
Capacitance  
C
-
-
O
Power Dissipation  
Capacitance  
C
-
5
36  
-
-
-
pF  
PD  
(Notes 3, 4)  
NOTES:  
3. C  
is used to determine the dynamic power consumption, per multiplexer.  
2
PD  
4. P = V  
f (C  
PD  
+ C ) where f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.  
CC  
D
CC  
i
L
i
L
5
CD54HC126, CD74HC126, CD54HCT126, CD74HCT126  
Test Circuits and Waveforms  
t = 6ns  
t = 6ns  
t = 6ns  
t = 6ns  
r
f
r
f
V
3V  
CC  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
t
t
THL  
TLH  
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
PLH  
PHL  
t
t
PLH  
PHL  
FIGURE 6. HC TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
FIGURE 7. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
6ns  
6ns  
t
6ns  
t
6ns  
r
f
V
3V  
CC  
OUTPUT  
DISABLE  
OUTPUT  
DISABLE  
90%  
2.7  
50%  
t
1.3  
10%  
0.3  
GND  
GND  
t
t
t
t
PZL  
PZL  
PLZ  
PLZ  
OUTPUT LOW  
TO OFF  
OUTPUT LOW  
TO OFF  
50%  
50%  
1.3V  
10%  
90%  
10%  
90%  
t
t
PZH  
PHZ  
PHZ  
t
PZH  
OUTPUT HIGH  
TO OFF  
OUTPUT HIGH  
TO OFF  
1.3V  
OUTPUTS  
ENABLED  
OUTPUTS  
ENABLED  
OUTPUTS  
DISABLED  
OUTPUTS  
ENABLED  
OUTPUTS  
DISABLED  
OUTPUTS  
ENABLED  
FIGURE 8. HC THREE-STATE PROPAGATION DELAY  
WAVEFORM  
FIGURE 9. HCT THREE-STATE PROPAGATION DELAY  
WAVEFORM  
OTHER  
OUTPUT  
= 1kΩ  
INPUTS  
TIED HIGH  
OR LOW  
IC WITH  
THREE-  
STATE  
R
L
V
FOR t AND t  
PLZ  
CC  
GND FOR t  
PZL  
AND t  
PHZ  
PZH  
C
L
OUTPUT  
50pF  
OUTPUT  
DISABLE  
NOTE: Open drain waveforms t  
and t are the same as those for three-state shown on the left. The test circuit is Output R = 1kΩ to  
PZL L  
PLZ  
V
, C = 50pF.  
CC  
L
FIGURE 10. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT  
6
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
5962-9065101MCA  
CD54HC126F3A  
CD54HCT126F3A  
CD74HC126E  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
A42 SNPB  
A42 SNPB  
A42 SNPB  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HC126EE4  
CD74HC126M  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
N
D
D
D
D
D
D
D
D
D
N
N
D
D
D
D
D
D
D
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC126M96  
CD74HC126M96E4  
CD74HC126M96G4  
CD74HC126ME4  
CD74HC126MG4  
CD74HC126MT  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HC126MTE4  
CD74HC126MTG4  
CD74HCT126E  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD74HCT126EE4  
CD74HCT126M  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD74HCT126M96  
CD74HCT126M96E4  
CD74HCT126M96G4  
CD74HCT126ME4  
CD74HCT126MG4  
CD74HCT126MT  
CD74HCT126MTE4  
CD74HCT126MTG4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Oct-2007  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
CD74HC126M96  
CD74HCT126M96  
SOIC  
SOIC  
D
D
14  
14  
2500  
2500  
330.0  
330.0  
16.4  
16.4  
6.5  
6.5  
9.0  
9.0  
2.1  
2.1  
8.0  
8.0  
16.0  
16.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD74HC126M96  
CD74HCT126M96  
SOIC  
SOIC  
D
D
14  
14  
2500  
2500  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Amplifiers  
Data Converters  
DSP  
Clocks and Timers  
Interface  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/audio  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
Logic  
Military  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Optical Networking  
Security  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2008, Texas Instruments Incorporated  

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