CD74HCT139E [TI]

High-Speed CMOS Logic Dual 2-to-4 Line Decoder/Demultiplexer; 高速CMOS逻辑双路2至4线译码器/多路解复用器
CD74HCT139E
型号: CD74HCT139E
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

High-Speed CMOS Logic Dual 2-to-4 Line Decoder/Demultiplexer
高速CMOS逻辑双路2至4线译码器/多路解复用器

解码器 驱动器 解复用器 逻辑集成电路 光电二极管
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中文:  中文翻译
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CD74HC139,  
CD74HCT139  
Data sheet acquired from Harris Semiconductor  
SCHS148A  
High-Speed CMOS Logic  
September 1997 - Revised May 1999  
Dual 2-to-4 Line Decoder/Demultiplexer  
Features  
Description  
• Multifunction Capability  
The CD74HC139 and CD74HCT139 devices contain two  
independent binary to one of four decoders each with a  
single active low enable input (1E or 2E). Data on the select  
inputs (1A0 and 1A1 or 2A0 and 2A1) cause one of the four  
normally high outputs to go low.  
- Binary to 1 of 4 Decoders or 1 to 4 Line  
Demultiplexer  
[ /Title  
(CD74  
HC139  
,
CD74  
HCT13  
9)  
• Active Low Mutually Exclusive Outputs  
• Fanout (Over Temperature Range)  
If the enable input is high all four outputs remain high. For  
demultiplexer operation the enable input is the data input.  
The enable input also functions as a chip select when these  
devices are cascaded. This device is functionally the same  
as the CD4556B and is pin compatible with it.  
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads  
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads  
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C  
• Balanced Propagation Delay and Transition Times  
/Sub-  
ject  
The outputs of these devices can drive 10 low power  
Schottky TTL equivalent loads. The 74HCT logic family is  
functionally as well as pin equivalent to the 74LS logic family.  
• Significant Power Reduction Compared to LSTTL  
Logic ICs  
(High  
Speed  
CMOS  
Logic  
Dual  
2-to-4  
Line  
Decod  
• HC Types  
Ordering Information  
- 2V to 6V Operation  
PKG.  
- High Noise Immunity: N = 30%, N = 30%of V  
IL IH CC  
at  
o
PART NUMBER TEMP. RANGE ( C) PACKAGE  
NO.  
E16.3  
E16.3  
V
= 5V  
CC  
CD74HC139E  
CD74HCT139E  
CD74HC139M  
CD74HCT139M  
NOTES:  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
16 Ld PDIP  
16 Ld PDIP  
• HCT Types  
- 4.5V to 5.5V Operation  
- Direct LSTTL Input Logic Compatibility,  
16 Ld SOIC M16.15  
16 Ld SOIC M16.15  
V = 0.8V (Max), V = 2V (Min)  
IL IH  
- CMOS Input Compatibility, I 1µA at V , V  
OL OH  
l
• Memory Decoding, Data Routing, Code Conversion  
1. When ordering, use the entire part number. Add the suffix 96 to  
obtain the variant in the tape and reel.  
2. Die is available which meets all electrical specifications. Please  
contact your local sales office or customer service for ordering  
information.  
Pinout  
CD74HC139, CD74HCT139  
(PDIP, SOIC)  
TOP VIEW  
1E  
1A0  
1A1  
1Y0  
1Y1  
1Y2  
1Y3  
GND  
1
2
3
4
5
6
7
8
16 V  
CC  
15 2E  
14 2A0  
13 2A1  
12 2Y0  
11 2Y1  
10 2Y2  
9
2Y3  
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.  
Copyright © Texas Instruments Incorporated 1999  
1
CD74HC139, CD74HCT139  
Functional Diagram  
4 (12)  
Y0  
2 (14)  
5 (11)  
A0  
Y1  
6 (10)  
3 (13)  
Y2  
A1  
7 (9)  
Y3  
1 (15)  
E
TRUTH TABLE  
INPUTS ENABLE SELECT  
OUTPUTS  
Y2 Y1  
E
0
0
0
0
1
A1  
0
A0  
0
Y3  
1
Y0  
0
1
1
0
1
1
1
0
1
1
0
1
1
1
1
1
0
1
1
1
1
0
1
X
X
1
1
NOTE: X = Don’t Care, Logic 1 = High, Logic 0 = Low  
Logic Diagram  
4 (12)  
Y0  
2 (14)  
A0  
5 (11)  
Y1  
3 (13)  
A1  
6 (10)  
Y2  
7 (9)  
Y3  
1 (15)  
E
2
CD74HC139, CD74HCT139  
Absolute Maximum Ratings  
Thermal Information  
o
DC Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V Thermal Resistance (Typical, Note 3)  
θ
( C/W)  
CC  
DC Input Diode Current, I  
JA  
IK  
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
90  
For V < -0.5V or V > V  
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA  
OK  
For V < -0.5V or V > V  
I
I
CC  
115  
o
DC Output Diode Current, I  
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C  
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C  
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300 C  
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA  
O
O
CC  
o
DC Output Source or Sink Current per Output Pin, I  
O
For V > -0.5V or V < V  
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA  
O
O
CC  
(SOIC - Lead Tips Only)  
DC V  
or Ground Current, I  
I
. . . . . . . . . . . . . . . . . .±50mA  
CC  
CC or GND  
Operating Conditions  
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C  
A
Supply Voltage Range, V  
CC  
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V  
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V  
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V  
I
O
CC  
Input Rise and Fall Time  
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)  
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)  
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation  
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
NOTE:  
3. θ is measured with the component mounted on an evaluation PC board in free air.  
JA  
DC Electrical Specifications  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
TYP  
-40 C TO 85 C -55 C TO 125 C  
V
(V)  
CC  
PARAMETER  
HC TYPES  
SYMBOL  
V (V)  
I
I
(mA)  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
O
High Level Input  
Voltage  
V
-
-
-
2
4.5  
6
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA  
IH  
3.15  
-
-
3.15  
-
-
3.15  
4.2  
4.2  
4.2  
-
Low Level Input  
Voltage  
V
-
2
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
-
0.5  
1.35  
1.8  
-
IL  
4.5  
6
-
-
-
-
-
-
High Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
-0.02  
2
1.9  
1.9  
1.9  
OH  
-0.02  
-0.02  
-
4.5  
6
4.4  
-
4.4  
-
4.4  
-
5.9  
-
5.9  
-
5.9  
-
High Level Output  
Voltage  
TTL Loads  
-
-
-
-
-
-
-
-4  
4.5  
6
3.98  
-
3.84  
-
3.7  
-
-5.2  
0.02  
0.02  
0.02  
-
5.48  
-
5.34  
-
5.2  
-
Low Level Output  
Voltage  
CMOS Loads  
V
V
or V  
IH IL  
2
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
-
OL  
4.5  
6
Low Level Output  
Voltage  
TTL Loads  
-
4
4.5  
6
0.26  
0.26  
±0.1  
0.33  
0.33  
±1  
0.4  
0.4  
±1  
5.2  
-
Input Leakage  
Current  
I
V
or  
6
I
CC  
GND  
Quiescent Device  
Current  
I
V
GND  
or  
0
6
-
-
8
-
80  
-
160  
µA  
CC  
CC  
3
CD74HC139, CD74HCT139  
DC Electrical Specifications (Continued)  
TEST  
CONDITIONS  
o
o
o
o
o
25 C  
-40 C TO 85 C -55 C TO 125 C  
V
CC  
PARAMETER  
HCT TYPES  
SYMBOL  
V (V)  
I
I
(mA)  
(V)  
MIN  
TYP  
MAX  
MIN  
MAX  
MIN  
MAX  
UNITS  
O
High Level Input  
Voltage  
V
-
-
-
-
4.5 to  
5.5  
2
-
-
-
-
-
0.8  
-
2
-
-
0.8  
-
2
-
-
0.8  
-
V
V
V
IH  
Low Level Input  
Voltage  
V
4.5 to  
5.5  
IL  
High Level Output  
Voltage  
CMOS Loads  
V
V
V
or V  
-0.02  
4.5  
4.5  
4.5  
4.5  
4.4  
4.4  
4.4  
OH  
IH  
IH  
IL  
High Level Output  
Voltage  
TTL Loads  
-4  
3.98  
-
-
-
-
3.84  
-
3.7  
-
V
V
V
Low Level Output  
Voltage  
CMOS Loads  
V
or V  
0.02  
4
-
-
0.1  
0.26  
-
-
0.1  
0.33  
-
-
0.1  
0.4  
OL  
IL  
Low Level Output  
Voltage  
TTL Loads  
Input Leakage  
Current  
I
V
and  
0
0
-
5.5  
5.5  
-
-
-
±0.1  
8
-
-
-
±1  
80  
-
-
-
±1  
µA  
µA  
µA  
I
CC  
GND  
Quiescent Device  
Current  
I
V
or  
-
160  
490  
CC  
CC  
GND  
Additional Quiescent  
Device Current Per  
Input Pin: 1 Unit Load  
(Note 4)  
I  
V
4.5 to  
5.5  
100  
360  
450  
CC  
CC  
-2.1  
NOTE:  
4. For dual-supply systems theoretical worst case (V = 2.4V, V  
I
= 5.5V) specification is 1.8mA.  
CC  
HCT Input Loading Table  
INPUT  
All  
UNIT LOADS  
0.7  
NOTE: Unit Load is I  
360µA max at 25 C.  
limit specified in DC Electrical Table, e.g.,  
CC  
o
Switching Specifications Input t , t = 6ns  
r
f
o
o
-40 C TO  
-55 C TO  
o
o
o
25 C  
85 C  
125 C  
TEST  
SYMBOL CONDITIONS  
V
CC  
(V)  
PARAMETER  
HC TYPES  
MIN  
TYP MAX MIN  
MAX  
MIN  
MAX UNITS  
Propagation Delay  
A0, A1 to Outputs  
t
t
C = 50pF  
2
4.5  
6
-
-
-
-
-
-
-
-
-
-
145  
29  
25  
135  
27  
23  
-
-
-
-
-
-
-
-
-
180  
36  
31  
170  
34  
29  
-
-
-
-
-
-
-
-
-
220  
44  
38  
205  
41  
35  
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
PLH, PHL  
L
-
E to Outputs  
t
t
C = 50pF  
2
-
PLH, PHL  
L
4.5  
6
-
-
Select to Output  
Enable to Output  
t
t
t
C = 15pF  
5
12  
11  
PLH, PHL  
L
t
C = 15pF  
5
-
-
-
PLH, PHL  
L
4
CD74HC139, CD74HCT139  
Switching Specifications Input t , t = 6ns (Continued)  
r
f
o
o
-40 C TO  
-55 C TO  
o
o
o
25 C  
85 C  
125 C  
TEST  
SYMBOL CONDITIONS  
V
CC  
(V)  
PARAMETER  
MIN  
TYP MAX MIN  
MAX  
95  
MIN  
MAX UNITS  
Output Transition Time (Figure 1) t  
, t  
TLH THL  
C = 50pF  
L
2
4.5  
6
-
-
-
-
-
-
75  
15  
13  
-
-
-
-
-
-
-
-
-
110  
22  
19  
-
ns  
ns  
ns  
pF  
19  
16  
-
-
Power Dissipation  
Capacitance, (Notes 5, 6)  
C
-
-
5
55  
PD  
Input Capacitance  
C
-
-
-
10  
-
10  
-
10  
pF  
IN  
HCT TYPES  
Propagation Delay  
A0, A1 to Outputs  
t
t
,
C = 50pF  
4.5  
4.5  
-
-
-
-
34  
34  
-
-
43  
43  
-
-
51  
51  
ns  
ns  
PLH  
t
L
PHL  
E to Outputs  
,
C = 50pF  
L
PLH  
t
PHL  
Select to Output  
Enable to Output  
t
t
t
t
C = 15pF  
5
5
-
-
-
14  
14  
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
PLH, PHL  
L
t
C = 15pF  
L
PLH, PHL  
Output Transition Time  
(Figure 2)  
, t  
C = 50pF  
L
4.5  
15  
19  
22  
TLH THL  
Power Dissipation  
Capacitance, (Notes 5, 6)  
C
-
-
5
-
-
-
59  
-
-
-
-
-
-
-
-
pF  
pF  
PD  
Input Capacitance  
NOTES:  
C
10  
10  
10  
IN  
5. C  
is used to determine the dynamic power consumption, per decoder/demux.  
2
PD  
6. P = V  
f (C  
PD  
+ C ) where: f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.  
CC  
D
CC  
i
L
i
L
Test Circuits and Waveforms  
t = 6ns  
t = 6ns  
f
r
t = 6ns  
f
t = 6ns  
r
V
CC  
3V  
90%  
50%  
10%  
2.7V  
1.3V  
0.3V  
INPUT  
INPUT  
GND  
GND  
t
t
TLH  
THL  
t
t
THL  
TLH  
90%  
1.3V  
90%  
50%  
10%  
INVERTING  
OUTPUT  
INVERTING  
OUTPUT  
10%  
t
t
t
t
PLH  
PLH  
PHL  
PHL  
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-  
TION DELAY TIMES, COMBINATION LOGIC  
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION  
DELAY TIMES, COMBINATION LOGIC  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
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Copyright 1999, Texas Instruments Incorporated  

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