CD74HCT139M96G4 [TI]
High-Speed CMOS Logic Dual 2- to 4-Line Decoder/Demultiplexer; 高速CMOS逻辑双路2-4线译码器/多路解复用器
| 型号： | CD74HCT139M96G4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High-Speed CMOS Logic Dual 2- to 4-Line Decoder/Demultiplexer |
| 文件： | 总13页 (文件大小：415K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD54HC139, CD74HC139,
CD54HCT139, CD74HCT139
Data sheet acquired from Harris Semiconductor
SCHS148D
High-Speed CMOS Logic
Dual 2- to 4-Line Decoder/Demultiplexer
September 1997 - Revised October 2003
Features
Description
• Multifunction Capability
The ’HC139 and ’HCT139 devices contain two independent
binary to one of four decoders each with a single active low
enable input (1E or 2E). Data on the select inputs (1A0 and
1A1 or 2A0 and 2A1) cause one of the four normally high
outputs to go low.
- Binary to 1 of 4 Decoders or 1 to 4 Line
Demultiplexer
[ /Title
(CD74
HC139
,
CD74
HCT13
9)
• Active Low Mutually Exclusive Outputs
• Fanout (Over Temperature Range)
If the enable input is high all four outputs remain high. For
demultiplexer operation the enable input is the data input.
The enable input also functions as a chip select when these
devices are cascaded. This device is functionally the same
as the CD4556B and is pin compatible with it.
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
/Sub-
ject
The outputs of these devices can drive 10 low power
Schottky TTL equivalent loads. The HCT logic family is
functionally as well as pin equivalent to the LS logic family.
• Significant Power Reduction Compared to LSTTL
Logic ICs
(High
Speed
CMOS
Logic
Dual
2-to-4
Line
Decod
• HC Types
Ordering Information
- 2V to 6V Operation
- High Noise Immunity: N = 30%, N = 30%of V
IL IH
at
CC
TEMP. RANGE
o
V
= 5V
PART NUMBER
CD54HC139F3A
CD54HCT139F3A
CD74HC139E
( C)
PACKAGE
16 Ld CERDIP
16 Ld CERDIP
16 Ld PDIP
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
16 Ld PDIP
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
CC
• HCT Types
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL
IH
- CMOS Input Compatibility, I ≤ 1µA at V , V
OL OH
l
CD74HC139M
• Memory Decoding, Data Routing, Code Conversion
CD74HC139MT
CD74HC139M96
CD74HCT139E
CD74HCT139M
CD74HCT139MT
CD74HCT139M96
Pinout
CD54HC139, CD54HCT139
(CERDIP)
CD74HC139, CD74HCT139
(PDIP, SOIC)
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel of
250.
TOP VIEW
1E
1A0
1A1
1Y0
1Y1
1Y2
1Y3
GND
1
2
3
4
5
6
7
8
16 V
CC
15 2E
14 2A0
13 2A1
12 2Y0
11 2Y1
10 2Y2
9
2Y3
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD54HC139, CD74HC139, CD54HCT139, CD74HCT139
Functional Diagram
4 (12)
5 (11)
6 (10)
7 (9)
Y0
2 (14)
3 (13)
A0
A1
Y1
Y2
Y3
1 (15)
E
TRUTH TABLE
INPUTS ENABLE SELECT
OUTPUTS
Y2 Y1
E
0
0
0
0
1
A1
0
A0
0
Y3
1
Y0
0
1
1
0
1
1
1
0
1
1
0
1
1
1
1
1
0
1
1
1
1
0
1
X
X
1
1
X = Don’t Care, Logic 1 = High, Logic 0 = Low
Logic Diagram
4 (12)
Y0
2 (14)
A0
5 (11)
Y1
3 (13)
A1
6 (10)
Y2
7 (9)
Y3
1 (15)
E
2
CD54HC139, CD74HC139, CD54HCT139, CD74HCT139
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
DC Input Diode Current, I
For V < -0.5V or V > V
JA
IK
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
67
73
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
o
DC Output Diode Current, I
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
o
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
o
DC Output Source or Sink Current per Output Pin, I
O
For V > -0.5V or V < V
+ 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
O
O
CC
(SOIC - Lead Tips Only)
DC V
or Ground Current, I
I
. . . . . . . . . . . . . . . . . .±50mA
CC
CC or GND
Operating Conditions
o
o
Temperature Range (T ) . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
-
1.5
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
µA
IH
3.15
-
-
3.15
-
-
3.15
4.2
4.2
4.2
-
Low Level Input
Voltage
V
-
2
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
-
0.5
1.35
1.8
-
IL
4.5
6
-
-
-
-
-
-
High Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
1.9
1.9
OH
-0.02
-0.02
-
4.5
6
4.4
-
4.4
-
4.4
-
5.9
-
5.9
-
5.9
-
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-4
4.5
6
3.98
-
3.84
-
3.7
-
-5.2
0.02
0.02
0.02
-
5.48
-
5.34
-
5.2
-
Low Level Output
Voltage
CMOS Loads
V
V
or V
IH IL
2
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
-
-
-
-
-
0.1
0.1
0.1
-
OL
4.5
6
Low Level Output
Voltage
TTL Loads
-
4
4.5
6
0.26
0.26
±0.1
0.33
0.33
±1
0.4
0.4
±1
5.2
-
Input Leakage
Current
I
V
or
6
I
CC
GND
Quiescent Device
Current
I
V
GND
or
0
6
-
-
8
-
80
-
160
µA
CC
CC
3
CD54HC139, CD74HC139, CD54HCT139, CD74HCT139
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HCT TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage
CMOS Loads
V
V
V
or V
-0.02
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
IH
IL
High Level Output
Voltage
TTL Loads
-4
3.98
-
-
-
-
3.84
-
3.7
-
V
V
V
Low Level Output
Voltage
CMOS Loads
V
or V
0.02
4
-
-
0.1
0.26
-
-
0.1
0.33
-
-
0.1
0.4
OL
IL
Low Level Output
Voltage
TTL Loads
Input Leakage
Current
I
V
and
0
0
-
5.5
5.5
-
-
-
±0.1
8
-
-
-
±1
80
-
-
-
±1
µA
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
-
160
490
CC
CC
GND
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
CC
(Note 2)
V
4.5 to
5.5
100
360
450
CC
-2.1
NOTE:
2. For dual-supply systems theoretical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
All
UNIT LOADS
0.7
NOTE: Unit Load is ∆I
360µA max at 25 C.
limit specified in DC Electrical Table, e.g.,
CC
o
Switching Specifications Input t , t = 6ns
r
f
o
o
-40 C TO
-55 C TO
o
o
o
25 C
85 C
125 C
TEST
SYMBOL CONDITIONS
V
CC
(V)
PARAMETER
HC TYPES
MIN
TYP MAX MIN
MAX
MIN
MAX UNITS
Propagation Delay
A0, A1 to Outputs
t
t
C = 50pF
2
4.5
6
-
-
-
-
-
-
-
-
-
-
145
29
25
135
27
23
-
-
-
-
-
-
-
-
-
180
36
31
170
34
29
-
-
-
-
-
-
-
-
-
220
44
38
205
41
35
-
ns
ns
ns
ns
ns
ns
ns
ns
PLH, PHL
L
-
E to Outputs
t
t
C = 50pF
2
-
PLH, PHL
L
4.5
6
-
-
Select to Output
Enable to Output
t
t
t
C = 15pF
5
12
11
PLH, PHL
L
t
C = 15pF
5
-
-
-
PLH, PHL
L
4
CD54HC139, CD74HC139, CD54HCT139, CD74HCT139
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
o
-40 C TO
-55 C TO
o
o
o
25 C
85 C
125 C
TEST
V
CC
(V)
PARAMETER
SYMBOL CONDITIONS
MIN
TYP MAX MIN
MAX
95
19
16
-
MIN
MAX UNITS
Output Transition Time (Figure 1) t
, t
TLH THL
C = 50pF
L
2
4.5
6
-
-
-
-
-
-
75
15
13
-
-
-
-
-
-
-
-
-
110
22
19
-
ns
ns
ns
pF
-
Power Dissipation
Capacitance, (Notes 3, 4)
C
-
-
5
55
PD
Input Capacitance
C
-
-
-
10
-
10
-
10
pF
IN
HCT TYPES
Propagation Delay
A0, A1 to Outputs
t
t
,
C = 50pF
4.5
4.5
-
-
-
-
34
34
-
-
43
43
-
-
51
51
ns
ns
PLH
t
L
PHL
E to Outputs
,
C = 50pF
L
PLH
t
PHL
Select to Output
Enable to Output
t
t
t
t
C = 15pF
5
5
-
-
-
14
14
-
-
-
-
-
-
-
-
-
-
-
-
-
ns
ns
ns
PLH, PHL
L
t
C = 15pF
L
PLH, PHL
Output Transition Time
(Figure 2)
, t
C = 50pF
L
4.5
15
19
22
TLH THL
Power Dissipation
Capacitance, (Notes 3, 4)
C
-
-
5
-
-
-
59
-
-
-
-
-
-
-
-
pF
pF
PD
Input Capacitance
NOTES:
C
10
10
10
IN
3. C
is used to determine the dynamic power consumption, per decoder/demux.
2
PD
4. P = V
f (C
PD
+ C ) where: f = Input Frequency, C = Output Load Capacitance, V = Supply Voltage.
CC
D
CC
i
L
i
L
Test Circuits and Waveforms
t = 6ns
t = 6ns
f
r
t = 6ns
f
t = 6ns
r
V
CC
3V
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
TLH
THL
t
t
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
t
t
PLH
PLH
PHL
PHL
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
5
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
CDIP
PDIP
Drawing
CD54HC139F
CD54HC139F3A
CD54HCT139F
CD54HCT139F3A
CD74HC139E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
16
16
16
16
16
1
1
TBD
TBD
TBD
TBD
A42 SNPB
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
1
J
1
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC139EE4
CD74HC139M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
N
D
D
D
D
D
D
D
D
D
N
N
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC139M96
CD74HC139M96E4
CD74HC139M96G4
CD74HC139ME4
CD74HC139MG4
CD74HC139MT
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC139MTE4
CD74HC139MTG4
CD74HCT139E
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT139EE4
CD74HCT139M
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HCT139M96
CD74HCT139M96E4
CD74HCT139M96G4
CD74HCT139ME4
CD74HCT139MG4
CD74HCT139MT
CD74HCT139MTE4
CD74HCT139MTG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Oct-2007
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
CD74HC139M96
CD74HCT139M96
D
D
16
16
SITE 27
SITE 27
6.5
6.5
10.3
10.3
2.1
2.1
8
8
16
16
Q1
Q1
330
16
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CD74HC139M96
CD74HCT139M96
D
D
16
16
SITE 27
SITE 27
342.9
342.9
336.6
336.6
28.58
28.58
Pack Materials-Page 2
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Amplifiers
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DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
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Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
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