CDCU877ZQLT [TI]

1.8-V PHASE LOCK LOOP CLOCK DRIVER; 1.8 -V锁相环时钟驱动器


型号：	CDCU877ZQLT
厂家：	TEXAS INSTRUMENTS
描述：	1.8-V PHASE LOCK LOOP CLOCK DRIVER 1.8 -V锁相环时钟驱动器时钟驱动器逻辑集成电路
文件：	总23页 (文件大小：945K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

FEATURES

•

Low Static Phase Offset: ±50 ps

•

1.8-V Phase Lock Loop Clock Driver for

Double Data Rate (DDR II) Applications

Distributes One Differential Clock Input to Ten

Differential Outputs

•

Spread Spectrum Clock Compatible

Operating Frequency: 10 MHz to 400 MHz

Low Current Consumption: <135 mA

Low Jitter (Cycle-Cycle): ±30 ps

Low Output Skew: 35 ps

•

52-Ball μBGA (MicroStar™ Junior BGA,

0,65-mm pitch) and 40-Pin MLF

External Feedback Pins (FBIN, FBIN) are Used

to Synchronize the Outputs to the Input

Clocks

•

Meets or Exceeds JESD82-8 PLL Standard for

PC2-3200/4300

Low Period Jitter: ±20 ps

Low Dynamic Phase Offset: ±15 ps

Fail-Safe Inputs

DESCRIPTION

The CDCU877 is a high-performance, low-jitter, low-skew, zero-delay buffer that distributes a differential clock

input pair (CK, CK) to ten differential pairs of clock outputs (Yn, Yn) and to one differential pair of feedback clock

outputs (FBOUT, FBOUT). The clock outputs are controlled by the input clocks (CK, CK), the feedback clocks

(FBIN, FBIN), the LVCMOS control pins (OE, OS), and the analog power input (AV_DD). When OE is low, the

clock outputs, except FBOUT/FBOUT, are disabled while the internal PLL continues to maintain its locked-in

frequency. OS (output select) is a program pin that must be tied to GND or V_DD. When OS is high, OE functions

as previously described. When OS and OE are both low, OE has no affect on Y7/Y7, they are free running.

When AV_DDis grounded, the PLL is turned off and bypassed for test purposes.

When both clock inputs (CK, CK) are logic low, the device enters in a low power mode. An input logic detection

circuit on the differential inputs, independent from input buffers, detects the logic low level and performs in a low

power state where all outputs, the feedback, and the PLL are off. When the clock inputs transition from being

logic low to being differential signals, the PLL turns back on, the inputs and the outputs are enabled, and the

PLL obtains phase lock between the feedback clock pair (FBIN, FBIN) and the clock input pair (CK, CK) within

the specified stabilization time.

The CDCU877 is able to track spread spectrum clocking (SSC) for reduced EMI. This device operates from

—40°C to 85°C.

ORDERING INFORMATION

(1)

T_A

52-BALL BGA

CDCU877ZQL

CDCU877AZQL

CDCU877GQL

CDCU877AGQL

40-Pin MLF

CDCU877RHA

CDCU877ARHA

CDCU877RTB

CDCU877ARTB

-40°C to 85°C

(1) For the most current package and ordering information, see the

Package Option Addendum at the end of this document, or see the

TI website at www.ti.com.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

MicroStar is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

MicroStar Junior (ZQL) Package

(TOP VIEW)

GND

DDQ

FBIN

DDQ

FBIN

DDQ

FBOUT

AGND

DDQ

FBOUT

GND

A. NC = No Connection

B. NB = No Ball

RHA/RTB Package (MLF PAckage

(TOP VIEW)

40 39 38 37 36 35 34 33 32 31

V_DDQ

FBIN

FBOUT

V_DDQ

GND

V_DDQ

AGND

AV_DD

V_DDQ

GND

11 12 13 14 15 16 17 18 19 20

40-pin HP-VFQFP-N (6,0 x 6,0 mm Body Size,

0,5 mm Pitch, M0#220, Variation VJJD-2,

E2 = D2 = 2,9 mm ± 0,15 mm) Package Pinouts

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

TERMINAL FUNCTIONS

TERMINAL

GQL/ZQL

I/O

DESCRIPTION

NAME

RHA/RTB

AGND

AV_DD

Analog ground

Analog power

Clock input with a (10 kΩ to 100 kΩ) pulldown resistor

Complementary clock input with a (10 kΩ to 100 kΩ) pulldown

resistor

FBIN

FBOUT

Feedback clock input

Complementary feedback clock input

Feedback clock output

Complementary feedback clock output

Output enable (asynchronous)

Output select (tied to GND or V_DD

)

B2, B3, B4, B5,

C2, C5, H2, H5,

J2, J3, J4, J5

GND

Ground

D2, D3, D4, E2,

E5, F2, G2, G3,

G4, G5

1, 6, 9, 15, 20, 23,

28, 31, 36

V_DDQ

Y[0:9]

Logic and output power

Clock outputs

A2, A1, D1, J1, K3, 3, 11, 14, 16, 19,

A5, A6, D6, J6, K4 29, 33, 34, 38, 39

A3, B1, C1, K1,

2, 12, 13, 18, 17,

K2, A4, B6, C6,

30, 32, 35, 37, 40

K6, K5

Complementary clock outputs

FUNCTION TABLE

INPUTS

OUTPUTS

AVDD

FBOUT

PLL

GND

Bypassed/Off

L_Z

GND

Bypassed/Off

Y7 Active

1.8 V Nominal

L_Z

Y7 Active

1.8 V Nominal

Off

L_Z

Reserved

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

Figure 1. LOGIC DIAGRAM (POSITIVE LOGIC)

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

Absolute Maximum Ratings⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V_CC

V_I

Supply voltage range

Input voltage range⁽²⁾⁽³⁾

V_DDQor AV_DD

–0.5

2.5

–0.5 V_DDQ+ 0.5

V_O

I_IK

Output voltage range⁽²⁾⁽³⁾

–0.5 V_DDQ+ 0.5

Input clamp current

V_I< 0 or V_I> V_DDQ

V_O< 0 or V_O> V_DDQ

V_O= 0 to V_DDQ

±50

°C

I_OK

I_O

Output clamp current

Continuous output current

Continuous current through each V_DDQor GND

Storage temperature range

±50

±100

T_stg

–65

150

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(3) This value is limited to 2.5 V maximum.

Recommended Operating Conditions

MIN

NOM

1.8

MAX

UNIT

Output supply voltage, V_DDQ

1.7

1.9

V_CC

(1)

Supply Voltage, AV_DD

V_DDQ

V_IL

V_IH

I_OH

I_OL

V_IX

V_I

Low-level input voltage⁽²⁾

High-level input voltage⁽²⁾

OE, OS

CK, CK

0.35 x V_DDQ

0.65 x V_DDQ

High-level output current (see Figure 2)

Low-level output current (see Figure 2)

Input differential-pair cross voltage

Input voltage level

-9

(V_DDQ/2) - 0.15

(V_DDQ/2) + 0.15

V_DDQ+ 0.3

V_DDQ+ 0.4

-0.3

0.3

0.6

-40

Input differential voltage⁽²⁾

(see Figure 9 )

V_ID

T_A

Operating free-air temperature

°C

(1) The PLL is turned off and bypassed for test purposes when AV_DDis grounded. During this test mode, V_DDQremains within the

recommended operating conditions and no timing parameters are specified.

(2) V_IDis the magnitude of the difference between the input level on CK and the input level on CK, see Figure 9 for definition. The CK and

CK, V_IHand V_ILlimits define the dc low and high levels for the logic detect state.

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

AV_DD

V_DDQ

PARAMETER

TEST CONDITIONS

I_I= 18 mA

MIN TYP⁽¹⁾

MAX UNIT

V_IK

Input

1.7

-1.2

I_OH= –100 μA

I_OH= –9 mA

1.7 to 1.9 V_DDQ– 0.2

V_OH

High-level output voltage

Low-level output voltage

1.7

1.1

I_OL= 100 μA

0.1

0.6

V_OL

I_OL= 9 mA

1.7

1.9

I_O(DL)

V_OD

Low-level output current, dissabled

Differential output voltage⁽¹⁾

CK, CK

V_O(DL)= 100 mV, OE = L

100

0.5

μA

±250

±10

I_I

Input current

μA

OE, OS,

FBIN, FBIN

1.9

I_DD(LD)

Supply current, static (I_DDQ+ I_ADD

)

CK and CK = L

500

CK and CK = 270 MHz. All

outputs are open (not connected

to a PCB)

1.9

135

Supply current, dynamic (I_DDQ+ I_ADD

)

I_DD

(see Note ⁽²⁾for CPD calculation)

All outputs are loaded with 2 pF

and 120-Ω termination resistor

1.9

235

CK, CK

1.8

C_I

Input capacitance

V_I= V_DDor GND

FBIN, FBIN

CK, CK

0.25

C_I(Δ)

Change in input current

FBIN, FBIN

(1) V_ODis the magnitude of the difference between the true and complimentary outputs. See Figure 9 for a definition.

(2) Total I_DD= I_DDQ+ I_ADD= f_CK× C_PD× V_DDQ, solving for C_PD= (I_DDQ+ I_ADD)/(f_CK× V_DDQ) where f_CKis the input frequency, V_DDQis the

power supply, and C_PDis the power dissipation capacitance.

Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted)⁽¹⁾

PARAMETER

TEST CONDITIONS

MIN

MAX

400

340

60%

UNIT

MHz

Clock frequency (operating)⁽¹⁾⁽²⁾

Clock frequency (application)⁽¹⁾⁽³⁾

Duty cycle, input clock

f_CK

160

40%

AV_DD, V_DD= 1.8 V ±0.1 V

t_DC

t_L

(4)

Stabiliztion time

μs

(1) The PLL must be able to handle spread spectrum induced skew.

(2) Operating clock frequency indicates a range over which the PLL must be able to lock, but in which it is not required to meet the other

timing parameters (used for low speed system debug).

(3) Application clock frequency indicates a range over which the PLL must meet all timing parameters.

(4) Stabilization time is the time required for the integrated PLL circuit to obtain phase lock of its feedback signal to its reference signal after

power up. During normal operation, the stabilization time is also the time required for the integrated PLL circuit to obtain phase lock of

its feedback signal to its reference signal when CK and CK go to a logic low state, enter the power-down mode and later return to active

operation. CK and CK may be left floating after they have been driven low for one complete clock cycle.

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

Switching Characteristics

over recommended operating free-air temperature range (unless otherwise noted) (see ⁽¹⁾) AV_DD, V_DD= 1.8 V ± 0.1 V

PARAMETER

TEST CONDITIONS

See Figure 11

MIN

TYP

MAX

UNIT

t_en

Enable time, OE to any Y/Y

Disable time, OE to any Y/Y

t_dis

See Figure 11

t_jit(cc+)

t_jit(cc-)

t_jit(cc+)

t_jit(cc-)

t_(ω)

-40

-30

115

Cycle-to-cycle period jitter⁽²⁾

160 MHz to 190 MHz, see Figure 4

Cycle-to-cycle period jitter⁽²⁾

Static phase offset time⁽³⁾

160 MHz to 340 MHz, see Figure 4

See Figure 5

-50

-15

t_(ω)dynDynamic phase offset time

See Figure 10

t_sk(o)

Output clock skew

See Figure 6

160 MHz to 190 MHz, see Figure 7

190 MHz to 340 MHz, see Figure 7

160 MHz to 190 MHz, see Figure 8

190 MHz to 250 MHz, see Figure 8

250 MHz to 300 MHz, see Figure 8

300 MHz to 340 MHz, see Figure 8

See Figure 3 and Figure 9

-30

-20

-115

-70

-40

-60

0.5

(4)(2)

t_jit(per)Period jitter

t_jit(hper)Half-period jitter⁽⁴⁾⁽²⁾

Slew rate, OE

Input clock slew rate

Output clock slew rate⁽⁵⁾⁽⁶⁾(no load)

2.5

V/ns

1.5

(V_DDQ/2) -

0.1

(V_DDQ/2) +

0.1

CDCU877, See Figure 2

(7)

V_OX

Output differential-pair cross voltage

CDCU877A⁽⁸⁾, See Figure 2

(0 - 85°C)

(V_DDQ/2) -

0.1

(V_DDQ/2) +

0.1

SSC modulation frequency

SSC clock input frequency deviation

PLL loop bandwidth

kHz

-0.5%

MHz

(1) There are two different terminations that are used with the following tests. The load/board in Figure 2 is used to measure the input and

output differential-pair cross voltage only. The load/board in Figure 3 is used to measure all other tests. For consistency, equal length

cables must be used.

(2) This parameter is specifieded by design and characterization.

(3) Phase static offset time does not include jitter.

(4) Period jitter, half-period jitter specifications are separate specifications that must be met independently of each other.

(5) The output slew rate is determined from the IBIS model with a 120-Ω load only.

(6) To eliminate the impact of input slew rates on static phase offset, the input skew rates of reference clock input CK and CK and feedback

clock inputs FBIN and FBIN are recommended to be nearly equal. The 2.5-V/ns skew rates are shown as a recommended target.

Compliance with these typical values is not mandatory if it can adequately shown that alternative characteristics meet the requirements

of the registered DDR2 DIMM application.

(7) Output differential-pair cross voltage specified at the DRAM clock input or the test load.

(8) V_OXof CDCU877A is on average 30 mV lower than that of CDCU877 for the same application.

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

PARAMETER MEASUREMENT INFORMATION

CU877

SCOPE

GND

C = 10 pF

Z = 60 W

L = 2.97”

R = 1 MW

C = 1 pF

Z = 120 W

Z = 60 W

L = 2.97”

C = 1 pF

C = 10 pF

GND

Note: V = GND

Figure 2. Output Load Test Circuit 1

V /2

CU877

SCOPE

−V /2

C = 10 pF

Z = 60 W

Z = 50 W

L = 2.97”

R = 10 W

R = 50 W

Z = 60 W

Z = 50 W

L = 2.97”

R = 10 W

R = 50 W

C = 10 pF

−V /2

Note: V = GND

−V /2

Figure 3. Output Load Test Circuit 2

Yx, FBOUT

cycle n+1

cycle n

= t

− t

cycle n+1

jit(cc)

cycle n

Figure 4. Cycle-To-Cycle Period Jitter

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

PARAMETER MEASUREMENT INFORMATION (continued)

t_jn

t_jn+1

Figure 5. Static Phase Offset

å₁^{n = N}

tjn

tj =

(N is the large number of samples)

(N > 1000 samples)

(1)

Figure 6. Output Skew

Figure 7. Period Jitter

= t

cycle n

jit(per)

(f_Oaverage input frequency measured at CK/CK

(2)

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 8. Half-Period Jitter

= t

half period n

jit(hper)

2 x f

n = any half cycle

(f_Oaverage input frequency measured at CK/CK

(3)

80%

V_ID, V_OD

20%

Clock Inputs

and Outputs, OE

t_r(i), t_r(o)

t_f(i), t_f(o)

Figure 9. Input and Output Slew Rates

- V

20%

80%

20%

80%

slrr

slrf

(i/o)

f(i/o)

r(i/o)

(4)

t_j

t_jdyn

Figure 10. Dynamic Phase Offset

Submit Documentation Feedback

CDCU877, CDCU877A

1.8-V PHASE LOCK LOOP CLOCK DRIVER

www.ti.com

SCAS688D–JUNE 2005–REVISED JULY 2007

PARAMETER MEASUREMENT INFORMATION (continued)

Figure 11. Time Delay Between OE and Clock Output (Y, Y)

RECOMMENDED AV_DDFILTERING

Bead

0603

CARD

VIA

AV _DD

V_DDQ

1 W

0.1 mF

4.7 mF

2200 pF

0603

PLL

0603

1206

GND

AGND

CARD

VIA

A. Place the 2200-pF capacitor close to the PLL.

B. Use a wide trace for the PLL analog power and ground. Connect PLL and capacitors to AGND trace and connect

trace to one GND via (farthest from the PLL).

C. Recommended bead: Fair-Rite PN 2506036017Y0 or equilvalent (0.8 Ω dc maximum, 600 Ω at 100 MHz).

Figure 12. Recommended AV_DDFiltering

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

5-Apr-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

CDCU877AGQLT

NRND

BGA

GQL

250

TBD

SNPB

Level-2-235C-1 YEAR

-40 to 85

CDCU877A

MICROSTAR

JUNIOR

CDCU877ARHAR

CDCU877ARHARG4

CDCU877ARHAT

NRND

VQFN

RHA

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-3-260C-168 HR

-40 to 85

CDCU877A

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

CDCU877ARHATG4

250

Green (RoHS

& no Sb/Br)

CDCU877ARTBR

CDCU877AZQLR

OBSOLETE

NRND

RTB

ZQL

TBD

Call TI

-40 to 85

CDCU877A

BGA

MICROSTAR

JUNIOR

1000

250

Green (RoHS

& no Sb/Br)

SNAGCU

Level-2-260C-1 YEAR

CDCU877AZQLT

CDCU877GQLR

CDCU877GQLT

NRND

BGA

MICROSTAR

JUNIOR

ZQL

GQL

Green (RoHS

& no Sb/Br)

SNAGCU

SNPB

Level-2-260C-1 YEAR

Level-2-235C-1 YEAR

-40 to 85

CDCU877A

CDCU877

BGA

MICROSTAR

JUNIOR

1000

250

TBD

BGA

SNPB

MICROSTAR

JUNIOR

CDCU877RHAR

CDCU877RHARG4

CDCU877RHAT

CDCU877RHATG4

CDCU877RTBR

CDCU877RTBT

ACTIVE

VQFN

RHA

RTB

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Call TI

Level-3-260C-168 HR

Call TI

-40 to 85

CDCU877

Green (RoHS

& no Sb/Br)

ACTIVE

Green (RoHS

& no Sb/Br)

ACTIVE

250

Green (RoHS

& no Sb/Br)

OBSOLETE

Green (RoHS

& no Sb/Br)

TBD

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

5-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

CDCU877ZQLR

CDCU877ZQLT

ACTIVE

BGA

MICROSTAR

JUNIOR

ZQL

1000

Green (RoHS

& no Sb/Br)

SNAGCU

Level-2-260C-1 YEAR

-40 to 85

CDCU877

ACTIVE

BGA

MICROSTAR

JUNIOR

ZQL

250

Green (RoHS

& no Sb/Br)

Level-2-260C-1 YEAR

-40 to 85

CDCU877

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

CDCU877AGQLT

BGA MI

CROSTA

R JUNI

GQL

250

330.0

16.4

4.8

7.3

1.5

8.0

16.0

CDCU877ARHAR

CDCU877ARHAT

CDCU877AZQLR

VQFN

RHA

ZQL

2500

250

330.0

180.0

330.0

16.4

6.3

4.8

6.3

7.3

1.1

1.5

12.0

8.0

16.0

BGA MI

CROSTA

R JUNI

1000

CDCU877AZQLT

CDCU877GQLR

CDCU877GQLT

BGA MI

CROSTA

R JUNI

ZQL

GQL

250

1000

250

330.0

16.4

4.8

7.3

1.5

8.0

16.0

BGA MI

CROSTA

R JUNI

BGA MI

CROSTA

R JUNI

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

CDCU877RHAR

CDCU877RHAT

CDCU877ZQLR

VQFN

RHA

ZQL

2500

250

330.0

180.0

330.0

16.4

6.3

4.8

6.3

7.3

1.1

1.5

12.0

8.0

16.0

BGA MI

CROSTA

R JUNI

1000

CDCU877ZQLT

BGA MI

CROSTA

R JUNI

ZQL

250

330.0

16.4

4.8

7.3

1.5

8.0

16.0

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CDCU877AGQLT

BGA MICROSTAR

JUNIOR

GQL

250

336.6

28.6

CDCU877ARHAR

CDCU877ARHAT

CDCU877AZQLR

VQFN

RHA

ZQL

2500

250

367.0

210.0

336.6

367.0

185.0

336.6

38.0

35.0

28.6

BGA MICROSTAR

JUNIOR

1000

CDCU877AZQLT

CDCU877GQLR

BGA MICROSTAR

JUNIOR

ZQL

GQL

250

336.6

28.6

BGA MICROSTAR

JUNIOR

1000

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

CDCU877GQLT

BGA MICROSTAR

JUNIOR

GQL

250

336.6

28.6

CDCU877RHAR

CDCU877RHAT

CDCU877ZQLR

VQFN

RHA

ZQL

2500

250

367.0

210.0

336.6

367.0

185.0

336.6

38.0

35.0

28.6

BGA MICROSTAR

JUNIOR

1000

CDCU877ZQLT

BGA MICROSTAR

JUNIOR

ZQL

250

336.6

28.6

Pack Materials-Page 3

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

CDCU877ZQLT [TI]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E