CSD95495QVM [TI]
采用 4x5 SON 小型封装的 50A 同步降压 NexFET 智能功率级;
| 型号： | CSD95495QVM |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 4x5 SON 小型封装的 50A 同步降压 NexFET 智能功率级 |
| 文件： | 总14页 (文件大小：675K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
CSD95495QVM
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
CSD95495QVM 同步降压 NexFET™智能功率级
1 特性
2 应用
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
具有 50A 的持续工作电流能力
•
多相位同步降压转换器
电流为 25A 时，系统效率大于 93.5%
工作频率高（高达 1.25MHz）
二极管仿真功能
–
–
高频 应用
高电流、低占空比 应用
•
•
•
负载点 (POL) 直流/直流转换器
温度补偿双向电流检测
模拟温度输出
内存和图形卡
台式机和服务器 VR12.x/VR13.x VRM 同步降压转
换器
故障监控
3.3V 和 5V 脉宽调制 (PWM) 信号兼容
三态 PWM 输入
3 说明
CSD95495QVM NexFET™功率器件是经过高度优化
的设计，用于高功率、高密度场合的同步降压转换器。
这款产品集成了驱动器 IC 和功率 MOSFET 来完善功
率级开关功能。该组合器件具有高电流、高效率以及高
速开关功能，采用 4mm × 5mm 小外形尺寸封装。它
还集成了准确电流感测和温度感测功能，以简化系统设
计并提高准确度。此外，PCB 封装已经过优化，可帮
助减少设计时间并简化总体系统设计。
集成自举开关
用于击穿保护的经优化死区时间
高密度 4mm × 5mm VSON 封装
超低电感封装
系统已优化的 PCB 封装
符合 RoHS 环保标准 – 无铅引脚镀层
无卤素
器件信息(1)
应用图表
器件
包装介质
数量
封装
发货
CSD95495QVM
13 英寸卷带
2500
VSON
4.00mm × 5.00mm
封装
卷带
封装
P12V
TPS53679
BOOT BOOT_R
AVSP
AVSN
VIN
CSD95495QVMT
7 英寸卷带
250
VOS
PWM
PWM1
ASKIP#
CSD95495QVM
EN/FCCM
P5V
VSW
TAO
VDD
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
LOAD
LSET
PGND IOUT REFIN
ACSP1
TSEN
典型功率级效率与功率损耗
100
95
90
85
80
75
70
65
60
55
50
15
13.5
12
10.5
9
P12V
P5V
BOOT BOOT_R
VOS
VIN
APWM6
PWM
CSD95495QVM
EN/FCCM
VREF
3.3V
VSW
TAO
ADDR
VDD
LSET
PGND IOUT REFIN
V3P3
VDD = 5 V
VIN = 12 V
VOUT = 1.8 V
LOUT = 150 nH
fSW = 500 kHz
TA = 25èC
ACSP6
VREF
P12V
7.5
6
VIN_CSNIN
CSPIN
BVSN
BVSP
VCCIO
BEN_VCCIO
4.5
3
P12V
P5V
SCLK
SDIO
BOOT BOOT_R
VOS
VIN
SALERT#
PIN_ALT#
VR_HOT#
SMB_CLK
SMB_ALERT#
SMB_DIO
AVR_RDY
BVR_RDY
AVR_EN
VR_FAULT#
RESET#
PWM
BPWM1
BSKIP#
CSD95492QVM
EN/FCCM
VSW
TAO
1.5
0
VDD
LOAD
LSET
PGND IOUT REFIN
0
5
10
15
20
25
30
35
40
45
50
Output Current (A)
BCSP1
D000
AGND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLPS671
CSD95495QVM
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
Application Schematic .......................................... 5
8
9
器件和文档支持........................................................ 6
8.1 接收文档更新通知 ..................................................... 6
8.2 社区资源.................................................................... 6
8.3 商标........................................................................... 6
8.4 静电放电警告............................................................. 6
8.5 Glossary.................................................................... 6
机械、封装和可订购信息 ......................................... 7
9.1 机械制图.................................................................... 7
9.2 推荐 PCB 焊盘图案 ................................................... 8
9.3 建议模版开孔............................................................. 9
7
4 Revision History
Changes from Original (June 2017) to Revision A
Page
•
更正了特性 部分和器件信息 表中的封装类型 ......................................................................................................................... 1
2
Copyright © 2017–2018, Texas Instruments Incorporated
CSD95495QVM
www.ti.com.cn
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
5 Pin Configuration and Functions
Top View
Pin Functions
PIN
DESCRIPTION
NAME
REFIN
IOUT
LSET
VDD
NO.
1
2
External reference voltage input for current sensing amplifier.
Output of current sensing amplifier. V(IOUT) – V(REFIN) is proportional to the phase current.
A resistor from this pin to PGND pin sets the inductor value for the internal current sensing circuitry.
Supply voltage for gate drivers and internal circuitry.
3
4
VOS
5
Output voltage sensing pin for the internal current sensing circuitry.
SW
6-9
10-13
14
Phase node connecting the HS MOSFET source and LS MOSFET drain – pin connection to the output inductor.
Input voltage pin. Connect input capacitors close to this pin.
VIN
BOOTR
Return path for HS gate driver. It is connected to VSW internally.
Bootstrap capacitor connection. Connect a minimum 0.1-µF, 16-V, X5R ceramic cap from BOOT to BOOTR pins.
The bootstrap capacitor provides the charge to turn on the control FET. The bootstrap diode is integrated.
BOOT
15
Tri-state input from external controller. Logic low sets control FET gate low and sync FET gate high. Logic high
sets control FET gate high and sync FET gate low. Both MOSFET gates are set low if PWM stays in Hi-Z for
greater than the tri-state shutdown holdoff time (t3HT).
PWM
16
This dual function pin either enables the diode emulation function or can be used as a simple enable for the
device. When this pin is driven into the tri-state window and held there for more than the tri-state holdoff time,
Diode Emulation Mode is enabled for sync FET. When the pin is high, device operates in Forced Continuous
Conduction Mode. When the pin is low, both FETs are held off. An internal resistor pulls this pin low if left
floating.
EN/FCCM
17
Temperature Amplifier Output. Reports a voltage proportional to the IC temperature. An ORing diode is
integrated in the IC. When used in multiphase application, a single wire can be used to connect the TAO pins of
all the ICs. Only the highest temperature will be reported. TAO will be pulled up to 3.3 V if thermal shutdown,
LSOC, or HSS detection circuit is tripped.
TAO/FAULT
PGND
18
19
Power ground.
Copyright © 2017–2018, Texas Instruments Incorporated
3
CSD95495QVM
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
TA = 25°C (unless otherwise stated)(1)
MIN
–0.3
–0.3
MAX
UNIT
V
VIN to PGND
20
VIN to VSW
20
V
VIN to VSW (10 ns)
VSW to PGND
23
V
–0.3
–7
20
V
VSW to PGND (10 ns)
VDD to PGND
23
V
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–55
–55
7
VDD + 0.3
7
V
(2)
EN/FCCM, TAO/FLT, LSET to PGND
IOUT, VOS, PWM to PGND
REFIN
V
V
3.6
V
BOOT to BOOTR(2)
VDD + 0.3
30
V
BOOT to PGND
V
TJ
Operating junction temperature
Storage temperature
150
°C
°C
Tstg
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Should not exceed 7 V.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM)
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM)
6.3 Recommended Operating Conditions
TA = 25°C (unless otherwise stated)
MIN
4.5
MAX
5.5
UNIT
VDD
Driver supply voltage
Input supply voltage(1)
Output voltage
V
V
VIN
4.5
16
VOUT
PWM
IOUT
5.5
V
PWM to PGND
VDD
50
V
Continuous output current
A
VIN = 12 V, VDD = 5 V, VOUT = 1.2 V,
ƒSW = 500 kHz(2)
IOUT-PK Peak output current(3)
75
A
ƒSW
Switching frequency
CBST = 0.1 µF (min), VOUT = 2.5 V (max)
ƒSW = 1 MHz
1250
85%
kHz
On-time duty cycle
Minimum PWM on-time
Operating junction temperature
20
ns
°C
–40
125
(1) Operating at high VIN can create excessive AC voltage overshoots on the switch node (VSW) during MOSFET switching transients. For
reliable operation, the switch node (VSW) to ground voltage must remain at or below the Absolute Maximum Ratings.
(2) Measurement made with six 10-µF (TDK C3216X7R1C106KT or equivalent) ceramic capacitors across VIN to PGND pins.
(3) System conditions as defined in Note 2. Peak output current is applied for tp = 50 µs.
4
Copyright © 2017–2018, Texas Instruments Incorporated
CSD95495QVM
www.ti.com.cn
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
7 Application Schematic
P12V
P5V
TPS53679
BOOT BOOT_R
AVSP
VIN
VOS
PWM
AVSN
PWM1
ASKIP#
CSD95495QVM
EN/FCCM
VSW
TAO
VDD
LOAD
LSET
PGND IOUT REFIN
ACSP1
TSEN
P12V
P5V
BOOT BOOT_R
VOS
VIN
PWM
APWM6
CSD95495QVM
EN/FCCM
VREF
VSW
TAO
ADDR
VDD
LSET
PGND IOUT REFIN
3.3V
V3P3
ACSP6
VREF
P12V
VIN_CSNIN
CSPIN
BVSN
BVSP
VCCIO
BEN_VCCIO
P12V
P5V
SCLK
SDIO
BOOT BOOT_R
VOS
VIN
SALERT#
PIN_ALT#
VR_HOT#
SMB_CLK
SMB_ALERT#
SMB_DIO
AVR_RDY
BVR_RDY
AVR_EN
VR_FAULT#
RESET#
PWM
BPWM1
BSKIP#
CSD95492QVM
EN/FCCM
VSW
TAO
VDD
LOAD
LSET
PGND IOUT REFIN
BCSP1
AGND
Copyright © 2016, Texas Instruments Incorporated
Figure 1. Application Schematic
Note: The schematic in Figure 1 is a conceptual drawing only. Actual designs may require additional components
not shown.
版权 © 2017–2018, Texas Instruments Incorporated
5
CSD95495QVM
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
www.ti.com.cn
8 器件和文档支持
8.1 接收文档更新通知
要接收文档更新通知，请导航至TI.com 上的器件产品文件夹。单击右上角的通知我进行注册，即可每周接收产品信
息更改摘要。
8.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
8.3 商标
NexFET, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
8.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
8.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6
版权 © 2017–2018, Texas Instruments Incorporated
CSD95495QVM
www.ti.com.cn
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
9 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知和修
订此文档。如欲获取此数据表的浏览器版本，请参阅左侧的导航。
9.1 机械制图
4.1
3.9
B
A
PIN 1 INDEX AREA
5.1
4.9
1.05 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
0.6
0.4
2X
2.4 0.1
(0.2) TYP
EXPOSED
THERMAL PAD
2X (0.31)
9
10
2X
4
4.4 0.1
1
18
0.3
16X 0.5
18X
0.2
0.1
0.05
0.6
0.4
10X
PIN 1 ID
C A B
C
(OPTIONAL)
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 必须在印刷电路板上焊接封装散热焊盘，以获得良好的散热和机械性能。
版权 © 2017–2018, Texas Instruments Incorporated
7
CSD95495QVM
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
www.ti.com.cn
9.2 推荐 PCB 焊盘图案
(2.5)
SYMM
10X (0.7)
1
18
2X
(1.275)
10X (0.25)
8X (0.5)
2X
(0.725)
SYMM
5
14
13
(4.5)
6
(R0.05) TYP
2X
(1.85)
METAL UNDER
SOLDER MASK
10
9
SOLDER MASK
OPENING
2X (0.31)
2X (0.8)
2X (1)
(
0.2) VIA
TYP
(3.7)
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 此封装设计用于焊接到电路板的散热焊盘上。有关更多信息，请参阅《QFN/SON PCB 连接》(SLUA271)。
8
版权 © 2017–2018, Texas Instruments Incorporated
CSD95495QVM
www.ti.com.cn
ZHCSHB8A –JUNE 2017–REVISED JANUARY 2018
9.3 建议模版开孔
SYMM
METAL
TYP
10X (0.7)
(0.655)
(R0.05) TYP
18
1
10X (0.25)
8X
(0.5)
(1.45)
TYP
SYMM
5
6
14
13
2X (1.75)
6X
(1.25)
10
9
2X (0.31)
2X (0.7)
6X (1.11)
(3.7)
1. 所有线性尺寸的单位均为毫米。括号中的任何尺寸仅供参考。尺寸和公差值符合 ASME Y14.5M 标准。
2. 本图如有变更，恕不另行通知。
3. 具有漏斗形壁和圆角的激光切割孔可提供更佳的锡膏脱离。IPC-7525 可能提供替代设计建议。
版权 © 2017–2018, Texas Instruments Incorporated
9
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
250
(1)
(2)
(3)
(4/5)
(6)
CSD95495QVM
CSD95495QVMT
ACTIVE
VSON-CLIP
VSON-CLIP
DMH
18
18
RoHS-Exempt
& Green
NIPDAU | SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-55 to 150
-55 to 150
95495QM
95495QM
ACTIVE
DMH
RoHS-Exempt
& Green
NIPDAU | SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2021
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Apr-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CSD95495QVM
CSD95495QVM
CSD95495QVMT
CSD95495QVMT
VSON-
CLIP
DMH
DMH
DMH
DMH
18
18
18
18
2500
2500
250
330.0
330.0
180.0
180.0
12.4
12.4
12.4
12.4
4.3
4.3
4.3
4.3
5.3
5.3
5.3
5.3
1.3
1.3
1.3
1.3
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
VSON-
CLIP
VSON-
CLIP
VSON-
CLIP
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Apr-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CSD95495QVM
CSD95495QVM
CSD95495QVMT
CSD95495QVMT
VSON-CLIP
VSON-CLIP
VSON-CLIP
VSON-CLIP
DMH
DMH
DMH
DMH
18
18
18
18
2500
2500
250
367.0
346.0
213.0
210.0
367.0
346.0
191.0
185.0
38.0
33.0
35.0
35.0
250
Pack Materials-Page 2
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023，德州仪器 (TI) 公司
相关型号：
SI9130DB
5- and 3.3-V Step-Down Synchronous ConvertersWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135LG-T1-E3
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9135_11
SMBus Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9136_11
Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
-
VISHAY
©2020 ICPDF网 联系我们和版权申明