CY74FCT162374TPVC/PVCT [TI]
16-Bit Registers; 16位寄存器
| 型号： | CY74FCT162374TPVC/PVCT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-Bit Registers |
| 文件： | 总21页 (文件大小：681K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1CY74FCT162374T
Data sheet acquired from Cypress Semiconductor Corporation.
Data sheet modified to remove devices not offered.
CY74FCT16374T
CY74FCT162374T
SCCS055C - August 1994 - Revised September 2001
16-Bit Registers
Features
Functional Description
• Ioff supports partial-power-down mode operation
• Edge-rate control circuitry for significantly improved
noise characteristics
• Typical output skew < 250 ps
• ESD > 2000V
• TSSOP (19.6-mil pitch) and SSOP (25-mil pitch)
packages
CY74FCT16374T and CY74FCT162374T are 16-bit D-type
registers designed for use as buffered registers in high-speed,
low power bus applications. These devices can be used as two
independent 8-bit registers or as a single 16-bit register by
connecting the output Enable (OE) and Clock (CLK) inputs.
Flow-through pinout and small shrink packaging aid in
simplifying board layout.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device
when it is powered down.
• Industrial temperature range of −40˚C to +85˚C
• VCC = 5V ± 10%
CY74FCT16374T Features:
The CY74FCT16374T is ideally suited for driving
high-capacitance loads and low-impedance backplanes.
• 64 mA sink current, 32 mA source current
• Typical VOLP (ground bounce) <1.0V at VCC = 5V,
TA = 25˚C
The CY74FCT162374T has 24-mA balanced output drivers
with current limiting resistors in the outputs. This reduces the
need for external terminating resistors and provides for
minimal undershoot and reduced ground bounce. The
CY74FCT162374T is ideal for driving transmission lines.
CY74FCT162374T Features:
• Balanced 24 mA output drivers
• Reduced system switching noise
• Typical VOLP (ground bounce) <0.6V at VCC = 5V,
TA= 25˚C
Logic Block Diagrams
Pin Configuration
SSOP/TSSOP
Top View
1
2
3
4
48
47
46
OE
O
CLK
1
1
1
D
1
1
1
2
O
D
2
1
1
GND
O
GND
D
45
44
43
42
41
OE
OE
2
1
5
1
1
3
4
1
1
3
4
O
D
6
CLK
CLK
2
1
V
CC
V
CC
7
O
5
O
6
D
D
1
1
1
1
5
6
8
D
C
D
C
D
1
D
1
1
2
9
40
39
38
37
36
35
34
33
32
31
O
1
O
1
1
2
GND
O
GND
D
10
11
1
1
7
8
1
1
7
8
O
D
12
13
O
O
D
D
2
2
1
2
2
1
2
14
15
16
17
18
2
TO 7 OTHER CHANNELS
TO 7 OTHER CHANNELS
GND
GND
O
3
O
4
D
D
2
2
3
FCT162374-1
FCT162374-2
2
2
4
V
CC
V
CC
O
5
D
5
19
20
21
22
23
24
30
29
28
27
26
25
2
2
2
2
O
6
D
6
GND
O
GND
D
2
2
7
8
2
7
8
O
D
2
2
OE
CLK
2
FCT162374-3
Copyright © 2001, Texas Instruments Incorporated
CY74FCT16374T
CY74FCT162374T
Maximum Ratings[2, 3]
Function Table[1]
Inputs
Outputs
(Above which the useful life may be impaired. For user
guidelines, not tested.)
D
X
X
L
CLK
L
OE
H
O
Z
Z
L
Function
Storage Temperature .............................. −55°C to +125°C
High-Z
Ambient Temperature with
Power Applied.......................................... −55°C to +125°C
H
H
L
Load
Register
DC Input Voltage................................................. −0.5V to +7.0V
DC Output Voltage.............................................. −0.5V to +7.0V
H
L
L
H
H
H
Z
Z
DC Output Current
(Maximum Sink Current/Pin)............................−60 to +120 mA
H
Power Dissipation ..........................................................1.0W
Pin Description
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Name
Description
D
Data Inputs
Clock Inputs
Operating Range
CLK
OE
O
Ambient
Temperature
Three-State Output Enable Inputs (Active LOW)
Three-State Outputs
Range
Industrial
VCC
−40°C to +85°C
5V ± 10%
Electrical Characteristics Over the Operating Range
Parameter
Description
Input HIGH Voltage
Test Conditions
Min.
Typ.[4]
Max.
Unit
VIH
VIL
VH
VIK
IIH
2.0
V
V
Input LOW Voltage
Input Hysteresis[5]
0.8
100
mV
V
Input Clamp Diode Voltage
Input HIGH Current
Input LOW Current
VCC=Min., IIN=−18 mA
VCC=Max., VI=VCC
−0.7
−1.2
±1
µA
µA
µA
IIL
VCC=Max., VI=GND
VCC=Max., VOUT=2.7V
±1
IOZH
High Impedance Output Current
(Three-State Output pins)
±1
IOZL
High Impedance Output Current
(Three-State Output pins)
VCC=Max., VOUT=0.5V
±1
µA
IOS
IO
Short Circuit Current[6]
Output Drive Current[6]
Power-Off Disable
VCC=Max., VOUT=GND
VCC=Max., VOUT=2.5V
VCC=0V, VOUT≤4.5V[7]
−80
−50
−140
−200
−180
±1
mA
mA
µA
IOFF
Output Drive Characteristics for CY74FCT16374T
Parameter
Description
Test Conditions
VCC=Min., IOH=−3 mA
Min.
2.5
Typ.[4]
3.5
Max.
Unit
V
VOH
Output HIGH Voltage
VCC=Min., IOH=−15 mA
VCC=Min., IOH=−32 mA
VCC=Min., IOL=64 mA
2.4
3.5
V
2.0
3.0
V
VOL
Output LOW Voltage
0.2
0.55
V
Notes:
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.
= LOW-to-HIGH Transition.
2. Operation beyond the limits set forth may impair the useful life of the device. Unless otherwise noted, these limits are over the operating free-air temperature
range.
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.
4. Typical values are at VCC= 5.0V, TA= +25˚C ambient.
5. This parameter is specified but not tested.
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter
tests, IOS tests should be performed last.
7. Tested at +25˚C.
2
CY74FCT16374T
CY74FCT162374T
Output Drive Characteristics for CY74FCT162374T
Parameter
IODL
Description
Output LOW Current[6]
Output HIGH Current[6]
Output HIGH Voltage
Output LOW Voltage
Test Conditions
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=5V, VIN=VIH or VIL, VOUT=1.5V
VCC=Min., IOH=−24 mA
Min.
60
Typ.[4]
115
Max.
150
Unit
mA
mA
V
IODH
−60
2.4
−115
3.3
−150
VOH
VOL
VCC=Min., IOL=24 mA
0.3
0.55
V
Capacitance[5] (TA = +25˚C, f = 1.0 MHz)
Parameter
CIN
Description
Input Capacitance
Output Capacitance
Test Conditions
VIN = 0V
Typ.[4] Max.
Unit
pF
4.5
5.5
6.0
8.0
COUT
VOUT = 0V
pF
Power Supply Characteristics
Parameter
Description
Test Conditions
Typ.[4]
Max.
Unit
ICC
Quiescent Power Supply Current VCC=Max.
V
V
IN≤0.2V,
IN≥VCC−0.2V
5
500
µA
∆ICC
QuiescentPowerSupplyCurrent VCC=Max.
(TTL inputs HIGH)
VIN=3.4V[8]
0.5
60
1.5
mA
ICCD
Dynamic Power Supply
Current[9]
VCC=Max., One Input
Toggling, 50% Duty Cycle,
Outputs Open, OE=GND
VIN=VCC or
VIN=GND
100
µA/
MHz
IC
Total Power Supply Current[10]
VCC=Max., f0=10 MHz,
f1=5 MHz, 50% Duty Cycle,
Outputs Open, One Bit
Toggling, OE=GND
VIN=VCC or
VIN=GND
0.6
1.1
3.0
7.5
1.5
3.0
mA
mA
mA
mA
VIN=3.4V or
VIN=GND
VCC=Max., f0=10 MHz,
f1=2.5 MHz, 50% Duty
Cycle, Outputs Open, Sixteen
Bits Toggling, OE=GND
VIN=VCC or
VIN=GND
5.5[11]
19.0[11]
VIN=3.4V or
VIN=GND
Note:
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.
10. IC
IC
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC
ICC+∆ICCDHNT+ICCD(f0/2 + f1N1)
Quiescent Current with CMOS input levels
Power Supply Current for a TTL HIGH input (VIN=3.4V)
Duty Cycle for TTL inputs HIGH
ICC
∆ICC
DH
NT
ICCD
f0
Number of TTL inputs at DH
Dynamic Current caused by an input transition pair (HLH or LHL)
Clock frequency for registered devices, otherwise zero
Input signal frequency
f1
N1
Number of inputs changing at f1
All currents are in milliamps and all frequencies are in megahertz.
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.
3
CY74FCT16374T
CY74FCT162374T
Switching Characteristics Over the Operating Range[12]
CY74FCT16374T
CY74FCT162374T
CY74FCT16374AT
CY74FCT162374AT
Fig.
Parameter
tPLH
tPHL
Description
Propagation Delay
CLK to O
Min.
Max.
Min.
Max.
Unit
No.[13]
2.0
10.0
2.0
6.5
ns
1, 5
tPZH
tPZL
Output Enable Time
1.5
1.5
2.0
1.5
5.0
12.5
8.0
1.5
1.5
2.0
1.5
5.0
6.5
5.5
ns
ns
ns
ns
ns
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1, 7, 8
tSU
Set-Up Time HIGH or LOW,
D to CLK
4
4
5
tH
Hold Time HIGH or LOW,
D to CLK
tW
CLK Pulse Width
HIGH or LOW
Output Skew[14]
tSK(O)
0.5
0.5
CY74FCT16374CT
CY74FCT162374CT
Fig.
Parameter
Description
Min.
Max.
Unit
No.[13]
tPLH
tPHL
Propagation Delay
CLK to O
2.0
5.2
ns
1, 5
tPZH
tPZL
Output Enable Time
1.5
1.5
2.0
1.5
3.3
5.5
5.0
ns
ns
ns
ns
ns
ns
1, 7, 8
tPHZ
tPLZ
Output Disable Time
1, 7, 8
tSU
Set-Up Time HIGH or LOW,
D to CLK
4
4
5
tH
Hold Time HIGH or LOW,
D to CLK
tW
CLK Pulse Width
HIGH or LOW
Output Skew[14]
tSK(O)
0.5
Notes:
12. Minimum limits are specified but not tested on Propagation Delays.
13. See “Parameter Measurement Information” in the General Information section.
14. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.
4
CY74FCT16374T
CY74FCT162374T
Ordering Information CY74FCT16374T
Speed
Package
Name
Operating
Range
(ns)
Ordering Code
CY74FCT16374CTPACT
CY74FCT16374CTPVC/PVCT
CY74FCT16374ATPACT
Package Type
48-Lead (240-Mil) TSSOP
5.2
Z48
O48
Z48
O48
O48
Industrial
Industrial
Industrial
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
6.5
CY74FCT16374ATPVC/PVCT
CY74FCT16374TPVC/PVCT
10.0
Ordering Information CY74FCT162374T
Speed
(ns)
Package
Operating
Range
Ordering Code
74FCT162374CTPACT
CY74FCT162374CTPVC
74FCT162374CTPVCT
74FCT162374ATPACT
CY74FCT162374ATPVC
74FCT162374ATPVCT
CY74FCT162374TPVC/PVCT
Name
Package Type
5.2
Z48
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
48-Lead (240-Mil) TSSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
48-Lead (300-Mil) SSOP
Industrial
Industrial
Industrial
O48
O48
Z48
6.5
O48
O48
O48
10.0
5
CY74FCT16374T
CY74FCT162374T
Package Diagrams
48-Lead Shrunk Small Outline PackageO48
48-Lead Thin Shrunk Small Outline Package Z48
6
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
PACKAGING INFORMATION
Orderable Device
74FCT162374ATPACT
74FCT162374ATPVCG4
74FCT162374ATPVCT
74FCT162374CTPACT
74FCT162374CTPVCG4
74FCT162374CTPVCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
SSOP
TSSOP
SSOP
SSOP
DL
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT162374ETPACT
74FCT162374ETPVCT
74FCT162374TPVCTG4
OBSOLETE TSSOP
DGG
DL
48
48
48
TBD
TBD
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OBSOLETE
ACTIVE
SSOP
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74FCT16374ATPACTE4
74FCT16374ATPACTG4
74FCT16374ATPVCG4
74FCT16374ATPVCTG4
74FCT16374CTPACTE4
74FCT16374CTPACTG4
74FCT16374CTPVCG4
74FCT16374CTPVCTG4
74FCT16374TPVCG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
SSOP
SSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SSOP
DGG
DGG
DL
48
48
48
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162374ATPVC
CY74FCT162374CTPVC
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT162374ETPAC
CY74FCT162374ETPVC
CY74FCT162374TPVCT
OBSOLETE TSSOP
DGG
DL
48
48
48
TBD
TBD
Call TI
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OBSOLETE
ACTIVE
SSOP
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT16374ATPACT
CY74FCT16374ATPVC
CY74FCT16374ATPVCT
CY74FCT16374CTPACT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
SSOP
DGG
DL
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
CY74FCT16374CTPVC
CY74FCT16374CTPVCT
ACTIVE
ACTIVE
SSOP
SSOP
DL
DL
48
48
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT16374ETPAC
CY74FCT16374ETPACT
CY74FCT16374ETPVC
CY74FCT16374ETPVCT
CY74FCT16374TPVC
OBSOLETE TSSOP
OBSOLETE TSSOP
DGG
DGG
DL
48
48
48
48
48
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
OBSOLETE
OBSOLETE
ACTIVE
SSOP
SSOP
SSOP
DL
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
FCT162374ATPACTE4
FCT162374ATPACTG4
FCT162374ATPVCTG4
FCT162374CTPACTE4
FCT162374CTPACTG4
FCT162374CTPVCTG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
SSOP
DGG
DGG
DL
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
SSOP
DGG
DGG
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 2
PACKAGE OPTION ADDENDUM
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11-Nov-2009
to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74FCT162374ATPACT TSSOP
74FCT162374ATPVCT SSOP
74FCT162374CTPACT TSSOP
74FCT162374CTPVCT SSOP
DGG
DL
48
48
48
48
48
48
48
48
48
2000
1000
2000
1000
1000
2000
1000
2000
1000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
32.4
24.4
32.4
32.4
24.4
32.4
24.4
32.4
8.6
11.35 16.2
8.6 15.8
15.8
1.8
3.1
1.8
3.1
3.1
1.8
3.1
1.8
3.1
12.0
16.0
12.0
16.0
16.0
12.0
16.0
12.0
16.0
24.0
32.0
24.0
32.0
32.0
24.0
32.0
24.0
32.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
DGG
DL
11.35 16.2
11.35 16.2
CY74FCT162374TPVCT SSOP
CY74FCT16374ATPACT TSSOP
CY74FCT16374ATPVCT SSOP
CY74FCT16374CTPACT TSSOP
CY74FCT16374CTPVCT SSOP
DL
DGG
DL
8.6
11.35 16.2
8.6 15.8
11.35 16.2
15.8
DGG
DL
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162374ATPACT
74FCT162374ATPVCT
74FCT162374CTPACT
74FCT162374CTPVCT
CY74FCT162374TPVCT
CY74FCT16374ATPACT
CY74FCT16374ATPVCT
CY74FCT16374CTPACT
CY74FCT16374CTPVCT
TSSOP
SSOP
TSSOP
SSOP
SSOP
TSSOP
SSOP
TSSOP
SSOP
DGG
DL
48
48
48
48
48
48
48
48
48
2000
1000
2000
1000
1000
2000
1000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
41.0
49.0
41.0
49.0
49.0
41.0
49.0
41.0
49.0
DGG
DL
DL
DGG
DL
DGG
DL
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
74FCT162374ATPACT
74FCT162374ATPVCG4
ACTIVE
ACTIVE
TSSOP
SSOP
DGG
DL
48
48
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
74FCT162374ATPVCT
74FCT162374CTPACT
OBSOLETE
ACTIVE
SSOP
DL
48
48
TBD
Call TI
Call TI
TSSOP
DGG
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
74FCT162374CTPVCG4
74FCT162374CTPVCT
ACTIVE
ACTIVE
SSOP
SSOP
DL
DL
48
48
Green (RoHS
& no Sb/Br)
1000
Green (RoHS
& no Sb/Br)
74FCT162374ETPACT
74FCT162374ETPVCT
74FCT162374TPVCTG4
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
SSOP
DGG
DL
48
48
48
TBD
TBD
Call TI
Call TI
Call TI
Call TI
DL
1000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
74FCT16374ATPACTE4
74FCT16374ATPACTG4
74FCT16374ATPVCG4
74FCT16374ATPVCTG4
74FCT16374CTPACTE4
74FCT16374CTPACTG4
74FCT16374CTPVCG4
74FCT16374CTPVCTG4
74FCT16374TPVCG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
TSSOP
SSOP
SSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
DGG
DGG
DL
48
48
48
48
48
48
48
48
48
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
2000
2000
25
Green (RoHS
& no Sb/Br)
DGG
DGG
DL
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
25
Green (RoHS
& no Sb/Br)
DL
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2012
Status (1)
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CY74FCT162374ATPVC
CY74FCT162374CTPVC
SSOP
SSOP
DL
DL
48
48
25
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CY74FCT162374ETPAC
CY74FCT162374ETPVC
CY74FCT162374TPVCT
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
SSOP
SSOP
DGG
DL
48
48
48
TBD
TBD
Call TI
Call TI
Call TI
Call TI
DL
1000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CY74FCT16374ATPACT
CY74FCT16374ATPVC
CY74FCT16374ATPVCT
CY74FCT16374CTPACT
CY74FCT16374CTPVC
CY74FCT16374CTPVCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TSSOP
SSOP
SSOP
TSSOP
SSOP
SSOP
DGG
DL
48
48
48
48
48
48
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
2000
25
Green (RoHS
& no Sb/Br)
DGG
DL
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
DL
1000
Green (RoHS
& no Sb/Br)
CY74FCT16374ETPAC
CY74FCT16374ETPACT
CY74FCT16374ETPVC
CY74FCT16374ETPVCT
CY74FCT16374TPVC
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
TSSOP
TSSOP
SSOP
SSOP
SSOP
DGG
DGG
DL
48
48
48
48
48
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
DL
DL
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
FCT162374ATPACTE4
FCT162374ATPACTG4
ACTIVE
ACTIVE
TSSOP
TSSOP
DGG
DGG
48
48
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
FCT162374ATPVCTG4
FCT162374CTPACTE4
ACTIVE
ACTIVE
SSOP
DL
48
48
TBD
Call TI
Call TI
TSSOP
DGG
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
FCT162374CTPACTG4
ACTIVE
TSSOP
DGG
48
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
23-Aug-2012
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
FCT162374CTPVCTG4
ACTIVE
SSOP
DL
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74FCT162374ATPACT TSSOP
74FCT162374CTPACT TSSOP
DGG
DGG
DL
48
48
48
48
48
48
48
48
2000
2000
1000
1000
2000
1000
2000
1000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
24.4
24.4
32.4
32.4
24.4
32.4
24.4
32.4
8.6
8.6
15.8
15.8
1.8
1.8
3.1
3.1
1.8
3.1
1.8
3.1
12.0
12.0
16.0
16.0
12.0
16.0
12.0
16.0
24.0
24.0
32.0
32.0
24.0
32.0
24.0
32.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
74FCT162374CTPVCT
SSOP
11.35 16.2
11.35 16.2
CY74FCT162374TPVCT SSOP
CY74FCT16374ATPACT TSSOP
CY74FCT16374ATPVCT SSOP
CY74FCT16374CTPACT TSSOP
CY74FCT16374CTPVCT SSOP
DL
DGG
DL
8.6
11.35 16.2
8.6 15.8
11.35 16.2
15.8
DGG
DL
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
74FCT162374ATPACT
74FCT162374CTPACT
74FCT162374CTPVCT
CY74FCT162374TPVCT
CY74FCT16374ATPACT
CY74FCT16374ATPVCT
CY74FCT16374CTPACT
CY74FCT16374CTPVCT
TSSOP
TSSOP
SSOP
DGG
DGG
DL
48
48
48
48
48
48
48
48
2000
2000
1000
1000
2000
1000
2000
1000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
45.0
45.0
55.0
55.0
45.0
55.0
45.0
55.0
SSOP
DL
TSSOP
SSOP
DGG
DL
TSSOP
SSOP
DGG
DL
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
0,25
1
24
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
A MAX
12,60
12,40
14,10
13,90
17,10
16,90
A MIN
4040078/F 12/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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