CY74FCT163500SSOP [TI]

18-Bit Registered Transceiver; 18位寄存收发器
CY74FCT163500SSOP
型号: CY74FCT163500SSOP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

18-Bit Registered Transceiver
18位寄存收发器

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Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT163500  
SCCS066 - June 1997 - Revised March 2000  
18-Bit Registered Transceiver  
Features  
Functional Description  
• Low power, pin-compatible replacement for LCX and  
LPT families  
• 5V tolerant inputs and outputs  
The CY74FCT163500 is an 18-bit universal bus transceiver  
that can be operated in transparent, latched, or clock modes  
by combining D-type latches and D-type flip-flops. Data flow in  
each direction is controlled by output-enable (OEAB and  
OEBA), latch enable (LEAB and LEBA), and clock inputs  
(CLKAB and CLKBA) inputs. For A-to-B data flow, the device  
operates in transparent mode when LEAB is HIGH. When  
LEAB is LOW, the A data is latched if CLKAB is held at a HIGH  
or LOW logic level. If LEAB is LOW, the A bus data is stored in  
the latch/flip-flop on the HIGH-to-LOW transition of CLKAB.  
OEAB performs the output enable function on the B port. Data  
flow from B-to-A is similar to that of A-to-B and is controlled by  
OEBA, LEBA, and CLKBA.  
• 24 mA balanced drive outputs  
• Power-off disable outputs permits live insertion  
• Edge-rate control circuitry for reduced noise  
• FCT-C speed at 4.6 ns  
• Latch-up performance exceeds JEDEC standard no. 17  
• ESD > 2000V per MIL-STD-883D, Method 3015  
• Typical output skew < 250ps  
• Industrial temperature range of –40˚C to +85˚C  
• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)  
• Typical Volp (ground bounce) performance exceeds Mil  
Std 883D  
The CY74FCT163500 has 24-mA balanced output drivers  
with current limiting resistors in the outputs. This reduces the  
need for external terminating resistors and provides for  
minimal undershoot and reduced ground bounce.The inputs  
and outputs are capable of being driven by 5.0V busses,  
allowing them to be used in mixed voltage systems as  
translators. The outputs are also designed with a power off  
disable feature enabling them to be used in applications  
requiring live insertion.  
• VCC = 2.7V to 3.6V  
Logic Block Diagram  
Pin Configuration  
SSOP/TSSOP  
Top View  
GND  
1
2
3
4
56  
55  
54  
OEAB  
LEAB  
CLKAB  
B
1
A
1
OEAB  
GND  
GND  
53  
52  
51  
50  
B
2
A
2
5
6
CLKBA  
B
V
A
3
3
V
CC  
CC  
LEBA  
OEBA  
7
B
A
4
4
5
6
49  
48  
47  
46  
8
A
A
B
B
5
6
9
CLKAB  
LEAB  
10  
11  
GND  
GND  
A
7
B
7
45  
44  
43  
12  
13  
A
A
B
B
B
8
9
8
C
D
C
D
14  
15  
16  
17  
18  
9
B
1
A
10  
42  
41  
A
1
10  
A
A
B
11  
B
12  
11  
12  
40  
39  
38  
GND  
GND  
C
D
C
D
A
A
A
B
13  
14  
15  
19  
20  
21  
22  
23  
13  
14  
15  
B
37  
36  
35  
34  
B
V
V
CC  
CC  
B
16  
A
16  
17  
A
33  
32  
31  
30  
29  
B
17  
24  
25  
TO 17 OTHER CHANNELS  
GND  
GND  
A
B
18  
26  
27  
28  
18  
OEBA  
LEBA  
CLKBA  
GND  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT163500  
Maximum Ratings[5, 6]  
Pin Summary  
Name  
Description  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
OEAB  
OEBA  
LEAB  
LEBA  
CLKAB  
CLKBA  
A
A-to-B Output Enable Input  
Storage Temperature ................................ 55°C to +125°C  
B-to-A Output Enable Input (Active LOW)  
A-to-B Latch Enable Input  
Ambient Temperature with  
Power Applied................................................. −55°C to +125°C  
B-to-A Latch Enable Input  
Supply Voltage Range..................................... 0.5V to +4.6V  
DC Input Voltage .................................................−0.5V to +7.0V  
DC Output Voltage ..............................................−0.5V to +7.0V  
A-to-B Clock Input (Active LOW)  
B-to-A Clock Input (Active LOW)  
A-to-B Data Inputs or B-to-A Three-State Outputs  
B-to-A Data Inputs or A-to-B Three-State Outputs  
DC Output Current  
(Maximum Sink Current/Pin) ...........................−60 to +120 mA  
B
Power Dissipation..........................................................1.0W  
Function Table[1, 2]  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Inputs  
Outputs  
Operating Range  
OEAB  
LEAB  
CLKAB  
A
X
L
B
Z
L
X
H
H
L
X
X
X
Ambient  
Temperature  
Range  
Industrial  
VCC  
H
H
H
H
H
H
L
40°C to +85°C  
2.7V to 3.6V  
H
L
H
L
L
H
X
X
H
L
H
L
B[3]  
B[4]  
L
Notes:  
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care. Z = HIGH Impedance.  
2. A-to-B data flow is shown, B-to-A data flow is similar but uses OEBA, LEBA, and CLKBA.  
3. Output level before the indicated steady-state input conditions were established.  
= HIGH-to-LOW Transition.  
4. Output level before the indicated steady-state input conditions were established, provided that CLKAB was LOW before LEAB went LOW.  
5. Operation beyond the limits set forth may impair the useful life of the device. Unless noted, these limits are over the operating free-air temperature range.  
6. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
2
CY74FCT163500  
Electrical Characteristics Over the Operating Range VCC=2.7V to 3.6V  
Parameter  
Description  
Input HIGH Voltage  
Test Conditions  
All Inputs  
Min.  
Typ.[7]  
Max.  
5.5  
Unit  
V
VIH  
VIL  
VH  
VIK  
IIH  
2.0  
Input LOW Voltage  
Input Hysteresis[8]  
0.8  
V
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=18 mA  
VCC=Max., VI=5.5V  
0.7  
1.2  
±1  
µA  
µA  
µA  
IIL  
VCC=Max., VI=GND.  
VCC=Max., VOUT=5.5V  
±1  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
±1  
IOZL  
IODL  
IODH  
VOH  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=GND  
±1  
µA  
mA  
mA  
Output LOW Current[9]  
Output HIGH Current[9]  
Output HIGH Voltage  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
45  
180  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
–45  
–180  
VCC=Min., IOH= –0.1 mA  
VCC=3.0V, IOH= –8 mA  
VCC=3.0V, IOH= –24 mA  
VCC=Min., IOL= 0.1mA  
VCC=Min., IOL= 24 mA  
VCC=Max., VOUT=GND  
VCC=0V, VOUT4.5V  
VCC–0.2  
2.4  
V
V
V
V
3.0  
3.0  
2.0  
VOL  
Output LOW Voltage  
0.2  
0.5  
0.3  
IOS  
Short Circuit Current[9]  
Power-Off Disable  
–60  
–135  
–240  
±100  
mA  
IOFF  
µA  
Capacitance[8] (TA = +25˚C, f = 1.0 MHz)  
Parameter  
Description  
Input Capacitance  
Output Capacitance  
Test Conditions  
Typ.[7] Max.  
Unit  
pF  
CIN  
VIN = 0V  
VOUT = 0V  
4.5  
5.5  
6.0  
8.0  
COUT  
pF  
Notes:  
7. Typical values are at VCC=3.3V, TA = +25˚C ambient.  
8. This parameter is specified but not tested.  
9. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
3
CY74FCT163500  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
VIN0.2V,  
Typ.[7]  
Max.  
Unit  
ICC  
Quiescent Power Supply Cur-  
rent  
VCC=Max.  
VCC=Max.  
0.1  
10  
µA  
VINVCC0.2V  
VIN=VCC–0.6V[10]  
ICC  
Quiescent Power Supply Cur-  
rent (TTL inputs HIGH)  
2.0  
50  
30  
75  
µA  
ICCD  
Dynamic Power Supply  
Current[11]  
VCC=Max., One Input Toggling, VIN=VCC or  
50%DutyCycle,OutputsOpen, VIN=GND  
OEAB=OEBA=VCC or GND  
µA/MHz  
IC  
Total Power Supply Current[12]  
VCC=Max., f0=10 MHz  
(CLKAB), f1=5 MHz, 50% Duty VIN=GND  
Cycle, Outputs Open,  
One Bit Toggling,  
OEAB=OEBA=VCC  
LEAB=GND  
VIN=VCC or  
0.5  
0.5  
0.8  
0.8  
mA  
mA  
VIN=VCC–0.6V or  
VIN=GND  
VCC=Max., f0=10 MHz,  
f1=2.5 MHz, 50% Duty  
Cycle, Outputs Open,  
Eighteen Bits Toggling,  
OEAB=OEBA=VCC  
LEAB=GND  
VIN=VCC or  
VIN=GND  
2.5  
2.6  
3.8[13]  
4.1[13]  
mA  
mA  
VIN=VCC–0.6V or  
VIN=GND  
Notes:  
10. Per TTL driven input; all other inputs at VCC or GND.  
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
12. IC  
=
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
IC  
ICC+ICCDHNT+ICCD(f0NC /2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
NC  
f1  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Number of clock inputs changing at f1  
Input signal frequency  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
4
CY74FCT163500  
Switching Characteristics Over the Operating Range VCC = 3.0V to 3.6V[,14, 15]  
CY74FCT163500A CY74FCT163500C  
Parameter  
Description  
Min.  
Max.  
150  
5.1  
Min.  
Max.  
150  
4.6  
Unit  
MHz  
ns  
Fig. No.[16]  
fMAX  
CLKAB or CLKBA frequency  
tPLH  
tPHL  
Propagation Delay  
A to B or B to A  
1.5  
1.5  
1.5  
1.5  
1.5  
3.0  
0
1.5  
1.5  
1.5  
1.5  
1.5  
3.0  
0
1, 3  
1, 5  
1, 5  
1, 7, 8  
1, 7, 8  
9
tPLH  
tPHL  
Propagation Delay  
LEBA to A, LEAB to B  
5.6  
5.6  
6.0  
5.6  
5.3  
5.3  
5.4  
5.2  
ns  
ns  
ns  
ns  
ns  
ns  
tPLH  
tPHL  
Propagation Delay  
CLKBA to A, CLKAB to B  
tPZH  
tPZL  
Output Enable Time  
OEBA to A, OEAB to B  
tPHZ  
tPLZ  
Output Disable Time  
OEBA to A, OEAB to B  
tSU  
Set-Up Time, HIGH or LOW  
A to CLKAB, B to CLKBA  
tH  
Hold Time, HIGH or LOW  
A to CLKAB, B to CLKBA  
9
tSU  
Set-Up Time, HIGH or LOW  
A to LEAB, B to LEBA  
Clock HIGH  
Clock LOW  
3.0  
1.5  
1.5  
3.0  
1.5  
1.5  
ns  
ns  
ns  
4
4
4
tH  
Hold Time, HIGH or LOW  
A to LEAB, B to LEBA  
tW  
LEAB or LEBA Pulse Width HIGH  
3.0  
3.0  
2.5  
3.0  
ns  
ns  
ns  
5
5
tW  
CLKAB or CLKBA Pulse Width HIGH or LOW  
Output Skew[17]  
tSK(O)  
0.5  
0.5  
Ordering Information CY74FCT163500  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
4.6  
CY74FCT163500CPACT  
Z56  
O56  
O56  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
56-Lead (300-Mil) SSOP  
Industrial  
CY74FCT163500CPVC/PVCT  
CY74FCT163500APVC/PVCT  
5.1  
Industrial  
Notes:  
14. Minimum limits are specified but not tested on Propagation Delays.  
15. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%.  
16. See “Parameter Measurement Information” in the General Information section.  
17. Skew between any two outputs of the same package switching in the same direction. This parameter is ensured by design.  
5
CY74FCT163500  
Package Diagrams  
56-Lead Shrunk Small Outline Package O56  
56-Lead Thin Shrunk Small Outline Package Z56  
6
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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