CY74FCT163646TSSOP [TI]

16-Bit Registered Transceiver; 16位寄存收发器
CY74FCT163646TSSOP
型号: CY74FCT163646TSSOP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-Bit Registered Transceiver
16位寄存收发器

文件: 总8页 (文件大小:73K)
中文:  中文翻译
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1CY74FCT163646  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT163646  
SCCS058 - March 1997 - Revised March 2000  
16-Bit Registered Transceiver  
Features  
Functional Description  
• Low power, pin-compatible replacement for LCX and  
LPT families  
• 5V tolerant inputs and outputs  
The CY74FCT163646 16-bit transceiver is a three-state,  
D-type register, and control circuitry arranged for multiplexed  
transmission of data directly from the input bus or from the  
internal registers. Data on the A or B bus will be clocked into  
the registers as the appropriate clock pin goes to a HIGH logic  
level. Output Enable (OE) and direction pins (DIR) are  
provided to control the transceiver function. In the transceiver  
mode, data present at the high impedance port may be stored  
in either the A or B register, or in both. The select controls can  
multiplex stored and real-time (transparent mode) data. The  
direction control determines which bus will receive data when  
the Output Enable (OE) is Active LOW. In the isolation mode  
(Output Enable (OE) HIGH), A data may be stored in the B  
register and/or B data may be stored in the A register.  
• 24 mA balanced drive outputs  
• Power-off disable outputs permits live insertion  
• Edge-rate control circuitry for reduced noise  
• FCT-C speed at 5.4 ns  
• Latch-up performance exceeds JEDEC standard no. 17  
• ESD > 2000V per MIL-STD-883D, Method 3015  
• Typical output skew < 250 ps  
• Industrial temperature range of –40˚C to +85˚C  
• TSSOP (19.6-mil pitch) or SSOP (25-mil pitch)  
• Typical Volp (ground bounce) performance exceeds Mil  
Std 883D  
• VCC = 2.7V to 3.6V  
The CY74FCT163646 has 24-mA balanced output drivers  
with current limiting resistors in the outputs. This reduces the  
need for external terminating resistors and provides for  
minimal undershoot and reduced ground bounce. The inputs  
and outputs were designed to be capable of being driven by  
5.0V buses, allowing them to be used in mixed voltage  
systems as translators. The outputs are also designed with a  
power-off disable feature enabling them to be used in  
applications requiring live insertion.  
Logic Block Diagrams  
OE  
2
OE  
1
DIR  
2
DIR  
CLKBA  
SBA  
CLKAB  
1
CLKBA  
2
1
SBA  
CLKAB  
2
1
2
1
SAB  
2
SAB  
1
B REG  
D
B REG  
D
C
C
A REG  
D
B
2
1
A REG  
D
B
1
1
A
2 1  
A
1 1  
C
C
TO 7 OTHER CHANNELS  
TO 7 OTHER CHANNELS  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT163646  
SSOP/TSSOP  
Top View  
Pin Configuration  
DIR  
OE  
1
1
1
2
56  
55  
CLKBA  
1
1
CLKAB  
SAB  
1
SBA  
3
4
54  
53  
1
GND  
GND  
B
A
1 1  
5
6
7
8
9
52  
51  
50  
49  
48  
1
1
2
A
1 2  
B
1
V
CC  
V
CC  
A
1 3  
B
1
3
4
5
A
1 4  
B
1
A
1 5  
B
1
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
GND  
GND  
B
A
1 6  
1
6
7
8
1
2
3
B
1
A
1 7  
A
1 8  
B
1
B
2
A
2 1  
A
2 2  
B
2
B
2
A
2 3  
GND  
GND  
B
A
2 4  
2
4
5
6
A
2 5  
B
2
A
2 6  
B
2
V
CC  
V
CC  
B
A
2 7  
2
7
8
A
2 8  
B
2
24  
25  
33  
32  
GND  
SAB  
GND  
SBA  
2
26  
27  
28  
31  
30  
29  
2
CLKAB  
CLKBA  
2
2
OE  
2
DIR  
2
Pin Description  
Pin Names  
Description  
A
Data Register A Inputs Data Register B Outputs  
Data Register B Inputs Data Register A Outputs  
Clock Pulse Inputs  
B
CLKAB, CLKBA  
SAB, SBA  
DIR  
Output Data Source Select Inputs  
Direction  
OE  
Output Enable (Active LOW)  
Function Table[1]  
Inputs  
Data I/O[2]  
Function  
OE  
DIR  
CLKAB  
CLKBA  
SAB  
SBA  
A
B
H
H
X
X
H or L  
H or L  
X
X
X
X
Input  
Input Isolation  
Store A and B Data  
L
L
L
L
X
X
X
X
X
L
H
Output Input Real Time B Data to A Bus  
Stored B Data to A Bus  
H or L  
L
L
H
H
X
X
X
L
H
X
X
Input Output Real Time A Data to Bus  
Stored A Data to B Bus  
H or L  
Notes:  
1. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care,  
= LOW-to-HIGH Transition  
2. The data output functions may be enabled or disabled by various signals at the OE or DIR inputs. Data input functions are always enabled, i.e., data at the  
bus pins will be stored on every LOW-to-HIGH transition on the clock inputs.  
2
CY74FCT163646  
BUS A  
BUS B  
BUS A  
BUS B  
DIR  
L
OE  
L
CLKAB  
X
CLKBA  
X
SAB  
X
SBA  
L
DIR  
H
OE  
L
CLKAB  
X
CLKBA  
X
SAB  
L
SBA  
X
Real-Time Transfer  
BusB to BusA  
Real-Time Transfer  
BusA to BusB  
BUS A  
BUS B  
BUS A  
BUS A  
[3]  
DIR  
H
L
OE  
L
L
H
SAB  
SBA  
X
X
DIR  
L
H
OE  
L
L
SAB  
X
H
SBA  
H
X
CLKAB  
X
CLKBA  
X
CLKAB  
X
H or L  
CLKBA  
H or L  
X
X
X
X
X
X
Storage from  
A and/or B  
Transfer Stored Data  
to A and/or B  
Maximum Ratings[4]  
DC Output Current  
(Maximum Sink Current/Pin) ...........................−60 to +120 mA  
(Above which the useful life may be impaired. For user  
guidelines, not tested.)  
Power Dissipation..........................................................1.0W  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature ............................... 55°C to +125°C  
Ambient Temperature with  
Power Applied............................................ 55°C to +125°C  
Operating Range  
Supply Voltage Range ..................................... 0.5V to +4.6V  
DC Input Voltage .................................................−0.5V to +7.0V  
DC Output Voltage ..............................................−0.5V to +7.0V  
Ambient  
Range  
Industrial  
Temperature  
VCC  
–40°C to +85°C  
2.7V to 3.6V  
Notes:  
3. Cannot transfer data to A-bus and B-bus simultaneously.  
4. Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of  
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect reliability.  
3
CY74FCT163646  
Electrical Characteristics Over the Operating Range VCC=2.7V to 3.6V  
Parameter  
Description  
Test Conditions  
Min.  
Typ.[5]  
Max.  
5.5  
Unit  
V
VIH  
VIL  
VH  
VIK  
IIH  
Input HIGH Voltage  
All Inputs  
2.0  
Input LOW Voltage  
Input Hysteresis[6]  
0.8  
V
100  
mV  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=18 mA  
VCC=Max., VI=5.5V  
VCC=Max., VI=GND  
VCC=Max., VOUT=5.5V  
0.7  
1.2  
±1  
µA  
µA  
µA  
IIL  
±1  
IOZH  
High Impedance Output Current  
(Three-State Output pins)  
±1  
IOZL  
IODL  
IODH  
VOH  
High Impedance Output Current  
(Three-State Output pins)  
VCC=Max., VOUT=GND  
±1  
µA  
mA  
mA  
V
Output LOW Dynamic Current[7]  
Output HIGH Dynamic Current[7]  
Output HIGH Voltage  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
45  
180  
VCC=3.3V, VIN=VIH  
or VIL, VOUT=1.5V  
–45  
–180  
VCC=Min., IOH= –0.1 mA  
VCC=3.0V, IOH= –8 mA  
VCC=3.0V, IOH= –24 mA  
VCC=Min., IOL= 0.1mA  
VCC=Min., IOL= 24 mA  
VCC=Max., VOUT=GND  
VCC=0V, VOUT4.5V  
VCC–0.2  
2.4[8]  
2.0  
3.0  
3.0  
VOL  
Output LOW Voltage  
0.2  
0.5  
V
0.3  
IOS  
Short Circuit Current[7]  
Power-Off Disable  
–60  
–135  
–240  
±100  
mA  
IOFF  
µA  
Capacitance[5] (TA = +25˚C, f = 1.0 MHz)  
Symbol  
Description[9]  
Conditions  
VIN = 0V  
Typ.  
4.5  
Max.  
Unit  
CIN  
Input Capacitance  
Output Capacitance  
6.0  
8.0  
pF  
pF  
COUT  
VOUT =0V  
5.5  
Notes:  
5. Typical values are at VCC=3.3V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting  
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametrics tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
8. VOH=VCC–0.6 V at rated current.  
9. This parameter is measured at characterization but not tested.  
4
CY74FCT163646  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
VIN<0.2V  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current VCC=Max.  
0.1  
10  
µA  
VIN>VCC0.2V  
ICC  
Quiescent Power Supply Current VCC=Max.  
TTL Inputs HIGH  
VIN=VCC–0.6V[10]  
2.0  
50  
30  
75  
µA  
ICCD  
Dynamic Power Supply  
Current[11]  
VCC=Max., Outputs Open  
VIN=VCC or  
VIN=GND  
µA/MHz  
DIR=OE=GND  
One-Bit Toggling  
50% Duty Cycle  
IC  
Total Power Supply Current[12]  
VCC=Max.,Outputs Open  
fo=10 MHz (CLKBA)  
50% Duty Cycle  
DIR=OE=GND  
One-BitToggling, f1=5MHz,  
VIN=VCC or  
VIN=GND  
0.5  
0.5  
0.8  
0.8  
mA  
VIN=VCC–0.6V or  
VIN=GND  
50% Duty Cycle  
VCC=Max., Outputs Open  
fo=10 MHz (CLKBA)  
50% Duty Cycle  
DIR=OE=GND  
Sixteen-Bits Toggling  
f1=2.5 MHz  
VIN=VCC or  
VIN=GND  
2.5  
2.6  
3.8[13]  
4.1[13]  
VIN=VCC–0.6V or  
VIN=GND  
50% Duty Cycle  
Notes:  
10. Per TTL driven input); all other inputs at VCC or GND.  
11. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
12. IC  
IC  
=
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0NC /2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
NC  
f1  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Number of clock inputs changing at f1  
Input signal frequency  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
13. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
5
CY74FCT163646  
Switching Characteristics Over the Operating Range VCC=3.0V to 3.6V[14,15]  
CY74FCT163646C  
Parameter  
Description  
Propagation Delay Bus to Bus  
Min.  
Max.  
Unit  
Fig. No.[16]  
tPLH  
1.5  
5.4  
ns  
1, 2  
tPHL  
tPZH  
tPZL  
Output Enable Time DIR or OE to Bus  
Output Disable Time DIR or OE to Bus  
Propagation Delay Clock to Bus  
1.5  
1.5  
1.5  
1.5  
7.8  
6.3  
5.7  
6.2  
ns  
ns  
ns  
ns  
1, 7, 8  
1, 7, 8  
1, 5  
tPHZ  
tPLZ  
tPLH  
tPHL  
tPLH  
tPHL  
Propagation Delay SBA or SAB to Bus  
1,5  
tSU  
tH  
Set-Up Time HIGH or LOW Bus to Clock  
Hold Time HIGH or LOW Bus to Clock  
Clock Pulse Width HIGH or LOW  
Output Skew[17]  
2.0  
1.5  
5.0  
ns  
ns  
ns  
ns  
4
4
tW  
6
tSK(O)  
0.5  
Ordering Information CY74FCT163646  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT163646CPACT  
CY74FCT163646CPVC/PVCT  
Package Type  
56-Lead (240-Mil) TSSOP  
56-Lead (300-Mil) SSOP  
5.4  
Z56  
O56  
Industrial  
Notes:  
14. Minimum limits are specified but not tested on Propagation Delays.  
15. For VCC =2.7, propagation delay, output enable and output disable times should be degraded by 20%.  
16. See “Parameter Measurement Information” in the General Information section.  
17. Skew any two outputs of the same package switching in the same direction. This parameter is ensured by design.  
6
CY74FCT163646  
Package Diagrams  
56-Lead Shrunk Small Outline Package O56  
56-Lead Thin Shrunk Small Outline Package Z56  
7
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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