CY74FCT2245CTSOC [TI]

8-Bit Transceiver; 8位收发器
CY74FCT2245CTSOC
型号: CY74FCT2245CTSOC
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

8-Bit Transceiver
8位收发器

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总7页 (文件大小:69K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT2245T  
SCCS037 - July 1994 - Revised March 2000  
8-Bit Transceiver  
Features  
Functional Description  
Function and pinout compatible with FCT and F logic  
25output series resistors to reduce transmission line  
reflection noise  
FCT-C speed at 4.1 ns max.  
FCT-A speed at 4.6 ns max.  
Edge-rate control circuitry for significantly improved  
noise characteristics  
The FCT2245T contains eight non-inverting, bidirectional buffers  
with three-state outputs intended for bus oriented applications.  
On-chip termination resistors have been added to the outputs to  
reduce system noise caused by reflections. For this reason, the  
FCT2245T can be used in an existing design to replace the  
FCT245T. The FCT2245T current sinking capability is 12 mA at the  
A and B ports.  
The Transmit/Receive (T/R) input determines the direction of data  
flow through the bidirectional transceiver. Transmit (Active HIGH)  
enables data from A ports to B ports; receive (Active LOW) enables  
data from B ports to A ports. The output enable (OE) input, when  
HIGH, disables both the A and B ports by putting them in a High Z  
condition.  
Power-off disable feature  
Fully compatible with TTL input and output logic levels  
ESD > 2000V  
• Sink current  
Source current  
12 mA  
15 mA  
Extended commercial temp. range of –40˚C to +85˚C  
• Three-state outputs  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
Logic Block Diagram  
Pin Configurations  
T/R  
OE  
DIP/SOIC/QSOP  
Top View  
A
0
20  
19  
18  
17  
16  
1
2
3
4
5
6
B
T/R  
V
CC  
0
OE  
A
0
A
1
A
1
B
0
B
B
1
2
A
2
B
B
B
1
2
3
A
2
A
3
15  
14  
A
4
A
5
7
B
B
4
5
A
3
13  
12  
11  
A
6
8
A
7
B
B
B
9
6
7
3
10  
GND  
A
4
FCT2245T3  
B
B
4
5
A
5
A
6
B
B
6
7
A
7
FCT2245T1  
Function Table[1]  
Inputs  
OE  
L
T/R  
L
Output  
Bus B Data to Bus A  
Bus A Data to Bus B  
High Z State  
L
H
H
X
Note:  
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT2245T  
Maximum Ratings[2,3]  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................65°C to +135°C  
Operating Range  
Ambient  
Supply Voltage to Ground Potential ............... –0.5V to +7.0V  
DC Input Voltage............................................ –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
Range  
Range  
Temperature  
VCC  
Commercial T, AT, CT  
–40°C to +85°C  
5V ± 5%  
Electrical Characteristics Over the Operating Range  
Parameter  
VOH  
VOL  
ROUT  
VIH  
Description  
Output HIGH Voltage  
Output LOW Voltage  
Output Resistance  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
Test Conditions  
Min.  
Typ.[5]  
3.3  
Max.  
Unit  
V
VCC=Min., IOH=–15 mA  
VCC=Min., IOL=12 mA  
VCC=Min., IOL=12 mA  
Com’l  
Com’l  
Com’l  
2.4  
0.3  
0.55  
40  
V
20  
25  
2.0  
V
VIL  
0.8  
V
VH  
All inputs  
0.2  
V
VIK  
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VIN=VCC  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
–0.7  
–1.2  
5
V
II  
µA  
µA  
µA  
mA  
µA  
IIH  
±1  
IIL  
±1  
IOS  
Output Short Circuit Current[7] VCC=Max., VOUT=0.0V  
–60  
–120  
–225  
±1  
IOFF  
Power-Off Disable VCC=0V, VOUT=4.5V  
Capacitance[6]  
Parameter  
Description  
Test Conditions  
Typ.[5] Max.  
Unit  
pF  
CIN  
Input Capacitance  
5
9
10  
12  
COUT  
Output Capacitance  
pF  
Notes:  
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. TA is the “instant on” case temperature.  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY74FCT2245T  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
VCC=Max., VIN < 0.2V,  
IN > VCC–0.2V  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current  
0.1  
0.2  
mA  
V
ICC  
Quiescent Power Supply Current  
(TTL inputs)  
VCC=Max., VIN=3.4V,[8]  
f1=0, Outputs Open  
0.5  
2.0  
mA  
ICCD  
Dynamic Power Supply  
Current[9]  
VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open,  
T/R=OE=GND,  
0.06  
0.12  
mA/MHz  
VIN < 0.2V or VIN > VCC–0.2V  
IC  
Total Power Supply Current[10]  
VCC=Max., 50% Duty Cycle,  
Outputs Open,  
One Bit Toggling at f1=10 MHz,  
0.7  
1.0  
1.3  
3.3  
1.4  
2.4  
mA  
mA  
mA  
mA  
T/R=OE=GND,  
VIN < 0.2V or VIN > VCC–0.2V  
VCC=Max.,  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
T/R=OE=GND,  
VIN=3.4V or VIN=GND  
VCC=Max.,  
2.6[11]  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
T/R=OE=GND,  
VIN < 0.2V or VIN > VCC–0.2V  
VCC=Max.,  
10.6[11]  
50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
T/R=OE=GND,  
VIN=3.4V or VIN=GND  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC  
IC  
=
=
=
=
=
=
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input (VIN=3.4V)  
Duty Cycle for TTL inputs HIGH  
ICC  
ICC  
DH  
NT  
ICCD  
f0  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair (HLH or LHL)  
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
f1  
N1  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
3
CY74FCT2245T  
]
Switching Characteristics—Over the Operating Range[12]  
FCT2245T  
Commercial  
FCT2245AT  
Commercial  
FCT2245CT  
Commercial  
Fig.  
Parameter  
Description  
Propagation Delay  
An to Bn or Bn to An  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit  
No.[13]  
tPLH  
tPHL  
1.5  
7.0  
1.5  
4.6  
1.5  
4.1  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
1.5  
1.5  
9.5  
7.5  
1.5  
1.5  
6.2  
5.0  
1.5  
1.5  
5.8  
4.5  
ns  
ns  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
Ordering Information—FCT2245T  
Speed  
Package  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT2245CTQCT  
CY74FCT2245CTSOC/SOCT  
CY74FCT2245ATPC  
Name  
Q5  
S5  
Package Type  
4.1  
20-Lead (150-Mil) QSOP  
Commercial  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) Molded DIP  
20-Lead (150-Mil) QSOP  
4.6  
P5  
Commercial  
CY74FCT2245ATQCT  
Q5  
S5  
CY74FCT2245ATSOC/SOCT  
CY74FCT2245TQCT  
20-Lead (300-Mil) Molded SOIC  
20-Lead (150-Mil) QSOP  
7.5  
Q5  
S5  
Commercial  
CY74FCT2245TSOC/SOCT  
20-Lead (300-Mil) Molded SOIC  
Notes:  
12. Minimum limits are specified but not tested on Propagation Delays.  
13. See “Parameter Measurement Information” in the General Information section.  
4
CY74FCT2245T  
Package Diagrams  
20-Lead (300-Mil) Molded DIP P5  
20-Lead Quarter Size Outline Q5  
5
CY74FCT2245T  
Package Diagrams (continued)  
20-Lead (300-Mil) Molded SOIC S5  
6
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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