CY74FCT2257CTQCT [TI]

Quad 2-Input Multiplexer; 四2输入多路复用器
CY74FCT2257CTQCT
型号: CY74FCT2257CTQCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Quad 2-Input Multiplexer
四2输入多路复用器

复用器
文件: 总6页 (文件大小:55K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1CY74FCT2257T  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT2257T  
SCCS038 - September 1994 - Revised March 2000  
Quad 2-Input Multiplexer  
Functional Description  
Features  
• Function and pinout compatible with FCT and F logic  
25output series resistors to reduce transmission line  
reflection noise  
• FCT-C speed at 4.3 ns max.,  
FCT-A speed at 5.0 ns max.  
• TTL output level versions of equivalent FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Power-off disable feature  
• Fully compatible with TTL input and output logic levels  
• ESD > 2000V  
Sink current 12 mA  
Source current15 mA  
The FCT2257T has four identical two-input multiplexers that  
select four bits of data from two sources under the control of a  
common data Select input (S). The I0 inputs are selected  
when the Select input is LOW and the I1 inputs are selected  
when the Select input is HIGH. Data appears at the output in  
true non-inverted form for the FCT2257T. On-chip termination  
resistors have been added to the outputs to reduce system  
noise caused by reflections. The FCT2257T can be used to  
replace the FCT257T to reduce noise in an existing design.  
The FCT2257T is a logic implementation of a four-pole,  
two-position switch where the position of the switch is  
determined by the logic levels supplied to the select input. Out-  
puts are forced to a high-impedance “OFF” state when the  
Output Enable input (OE) is HIGH.  
• Extended commercial temp. range of –40˚C to +85˚C  
• Three-state outputs  
All but one device must be in the high-impedance state to  
avoid currents exceeding the maximum ratings if outputs are  
tied together. Design of the output enable signals must ensure  
that there is no overlap when outputs of three-state devices  
are tied together.  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
Pin Configurations  
Logic Block Diagram  
I
0a  
I
1a  
I
0b  
I
1b  
I
0c  
I
1c  
I
0d  
I
1d  
S
SOIC/QSOP  
Top View  
S
V
16  
15  
14  
13  
12  
1
CC  
OE  
I
0a  
OE  
2
3
4
5
6
I
0c  
I
1a  
I
1c  
Y
a
I
Y
c
0b  
I
0d  
I
1b  
11  
10  
9
I
1d  
Y
b
7
8
GND  
Y
d
FCT2257T3  
Y
a
Y
b
Y
c
Y
d
FCT2257T1  
Pin Description  
Function Table[1]  
Inputs  
Output  
Y
Name  
Description  
OE  
S
I0  
I1  
I
Data Inputs  
H
L
L
L
L
X
H
H
L
X
X
X
L
X
L
H
X
X
Z
L
H
L
S
Common Select Input  
Enable Inputs (Active LOW)  
Data Outputs  
OE  
Y
L
H
H
Note:  
1. H = HIGH Voltage Level, L = LOW Voltage Level, X = Don’t Care,  
Z = High impedance (OFF) state.  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT2257T  
Maximum Ratings[2, 3]  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................65°C to +135°C  
Operating Range  
Ambient  
Supply Voltage to Ground Potential ............... –0.5V to +7.0V  
DC Input Voltage............................................ –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
Range  
Temperature  
VCC  
Commercial  
–40°C to +85°C  
5V ± 5%  
Electrical Characteristics Over the Operating Range  
Parameter  
VOH  
VOL  
ROUT  
VIH  
Description  
Output HIGH Voltage  
Output LOW Voltage  
Output Resistance  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
Test Conditions  
VCC=Min., IOH=–15 mA  
Min.  
Typ.[5]  
Max.  
Unit  
2.4  
3.3  
0.3  
25  
V
V
VCC=Min., IOL=12 mA  
VCC=Min., IOL=12 mA  
0.55  
40  
20  
2.0  
V
VIL  
0.8  
V
VH  
All inputs  
0.2  
V
VIK  
Input Clamp Diode Voltage  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
VCC=Max., VOUT=2.7V  
–0.7  
–1.2  
±1  
V
IIH  
µA  
µA  
µA  
IIL  
±1  
IOZH  
Off State HIGH-Level Output  
Current  
10  
IOZL  
Off State LOW-Level  
Output Current  
VCC=Max., VOUT=0.5V  
–10  
µA  
IOS  
Output Short Circuit Current[7] VCC=Max., VOUT=0.0V  
–60  
–120  
–225  
mA  
IOFF  
Power-Off Disable VCC=0V, VOUT=4.5V  
±1  
µA  
Capacitance[6]  
Parameter  
Description  
Test Conditions  
Typ.[5] Max.  
Unit  
pF  
CIN  
Input Capacitance  
5
9
10  
12  
COUT  
Output Capacitance  
pF  
Notes:  
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. TA is the “instant on” case temperature.  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY74FCT2257T  
Power Supply Characteristics  
Parameter  
Description  
Test Conditions  
VCC=Max., VIN < 0.2V,  
IN > VCC–0.2V  
Typ.[5]  
Max.  
Unit  
ICC  
Quiescent Power Supply Current  
0.1  
0.2  
mA  
V
ICC  
Quiescent Power Supply Current  
(TTL inputs)  
VCC=Max., VIN=3.4V,[8]  
f1=0, Outputs Open  
0.5  
2.0  
mA  
ICCD  
Dynamic Power Supply  
Current[9]  
VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open, OE=GND,  
0.06  
0.12  
mA/  
MHz  
VIN < 0.2V or VIN > VCC–0.2V  
IC  
Total Power Supply Current[10]  
VCC=Max., 50% Duty Cycle,  
Outputs Open,  
One Bit Toggling at f1=10 MHz,  
0.7  
1.0  
0.7  
1.7  
1.4  
2.4  
mA  
mA  
mA  
mA  
OE=GND,  
VIN < 0.2V or VIN > VCC–0.2V  
VCC=Max.,  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
OE=GND,  
VIN=3.4V or VIN=GND  
VCC=Max.,  
1.4[11]  
50% Duty Cycle, Outputs Open,  
Four Bits Toggling at f1=2.5 MHz,  
OE=GND,  
VIN < 0.2V or VIN > VCC–0.2V  
VCC=Max.,  
5.4[11]  
50% Duty Cycle, Outputs Open,  
Four Bits Toggling at f1=2.5 MHz,  
OE=GND,  
VIN=3.4V or VIN=GND  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC  
IC  
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input  
(VIN=3.4V)  
ICC  
ICC  
DH  
NT  
ICCD  
=
=
=
Duty Cycle for TTL inputs HIGH  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair  
(HLH or LHL)  
f0  
f1  
N1  
=
=
=
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
3
CY74FCT2257T  
Switching Characteristics Over the Operating Range[12]  
CY74FCT2257AT  
Commercial  
CY74FCT2257CT  
Commercial  
Parameter  
tPLH  
tPHL  
Description  
Min.  
Max.  
Min.  
Max.  
Unit  
Fig. No.[13]  
Propagation Delay  
Ia, Ib to Y  
1.5  
6.0  
1.5  
4.3  
5.2  
6.0  
5.0  
ns  
1, 3  
tPLH  
tPHL  
Propagation Delay  
S to O  
1.5  
1.5  
1.5  
10.5  
8.5  
1.5  
1.5  
1.5  
ns  
ns  
ns  
1, 3  
tPZH  
tPZL  
Output Enable Time  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
6.0  
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
Package Type  
16-Lead (150-Mil) QSOP  
4.3  
CY74FCT2257CTQCT  
CY74FCT2257CTSOC/SOCT  
CY74FCT2257ATQCT  
Q1  
S1  
Q1  
Commercial  
16-Lead (300-Mil) Molded SOIC  
16-Lead (150-Mil) QSOP  
5.0  
Commercial  
Notes:  
12. Minimum limits are specified but not tested on Propagation Delays  
13. See “Parameter Measurement Information” in the General Information section.  
4
CY74FCT2257T  
Package Diagrams  
16-Lead Quarter Size Outline Q1  
16-Lead Molded SOIC S1  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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