CY74FCT2827ATQCT [TI]

10-Bit Buffer; 10位缓冲
CY74FCT2827ATQCT
型号: CY74FCT2827ATQCT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

10-Bit Buffer
10位缓冲

总线驱动器 总线收发器 逻辑集成电路 光电二极管 输出元件
文件: 总6页 (文件大小:44K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
1CY74FCT2827T  
Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY74FCT2827T  
10-Bit Buffer  
SCCS045 - May 1994 - Revised March 2000  
Features  
Functional Description  
• Function and pinout compatible with FCT, F, and  
AM29827 logic  
• FCT-C speed at 5.0 ns max. (Com’l),  
FCT-A speed at 8.0 ns max. (Com’l)  
25output series resistors to reduce transmission line  
reflection noise  
• Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Power-off disable feature  
• ESD > 2000V  
The FCT2827T 10-bit bus driver provides high-performance  
bus interface buffering for wide data/address paths or buses  
carrying parity. This 10-bit buffer has NAND-ed output enables for  
maximum control flexibility. The FCT2827T is designed for  
high-capacitance load drive capability, while providing low-capaci-  
tance bus loading at both inputs and outputs. All inputs have clamp  
diodesand all outputsare designedfor low-capacitancebus loading  
in the high impedance state. On-chip termination resistors have  
been added to the outputs to reduce system noise caused by re-  
flections. The FCT2827T can be used to replace the FCT827T to  
reduce noise in an existing design.  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
• Matched rise and fall times  
• Fully compatible with TTL input and output logic levels  
• Extended commercial temp. range of –40˚C to +85˚C  
• Sink current  
Source current  
12 mA  
15 mA  
Pin Configurations  
Logic Block Diagram  
SOIC/QSOP  
Top View  
OE  
V
CC  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
1
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
9
0
1
2
3
4
5
6
7
8
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
Y
0
2
Y
1
3
Y
2
4
Y
3
5
Y
4
6
Y
5
7
Y
6
8
Y
7
9
Y
8
10  
11  
12  
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
OE OE  
1
2
Y
9
FCT2827T3  
GND  
OE  
2
FCT2827T2  
Function Table[1]  
Inputs  
Outputs  
Y
OE1  
OE2  
D
Function  
L
L
L
L
L
H
L
H
Transparent  
H
X
X
H
X
X
Z
Z
Three-State  
Note:  
1. H = HIGH Voltage Level. L = LOW Voltage Level. X = Don’t Care.  
Copyright © 2000, Texas Instruments Incorporated  
CY74FCT2827T  
Maximum Ratings[2, 3]  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied.............................................65°C to +135°C  
Operating Range  
Ambient  
Supply Voltage to Ground Potential ............... –0.5V to +7.0V  
DC Input Voltage............................................ –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
Range  
Temperature  
VCC  
Commercial  
–40°C to +85°C  
5V ± 5%  
Electrical Characteristics Over the Operating Range  
Parameter  
VOH  
VOL  
ROUT  
VIH  
Description  
Output HIGH Voltage  
Output LOW Voltage  
Output Resistance  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[5]  
Test Conditions  
VCC = Min., IOH = –15 mA  
VCC = Min., IOL = 12 mA  
VCC = Min., IOL = 12 mA  
Min.  
Typ.[4]  
Max.  
Unit  
2.4  
3.3  
0.3  
25  
V
V
0.55  
40  
20  
2.0  
V
VIL  
0.8  
V
VH  
All inputs  
0.2  
V
VIK  
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC = Min., IIN = –18 mA  
VCC = Max., VIN = VCC  
VCC = Max., VIN = 2.7V  
VCC = Max., VIN = 0.5V  
VCC = Max., VOUT = 2.7V  
–0.7  
–1.2  
5
V
II  
µA  
µA  
µA  
µA  
IIH  
±1  
±1  
10  
IIL  
IOZH  
Off State HIGH-Level Output  
Current  
IOZL  
Off State LOW-Level  
Output Current  
VCC = Max., VOUT = 0.5V  
–10  
µA  
IOS  
Output Short Circuit Current[6] VCC = Max., VOUT = 0.0V  
–60  
–120  
–225  
mA  
IOFF  
Power-Off Disable  
VCC = 0V, VOUT = 4.5V  
±1  
µA  
Capacitance[5]  
Parameter  
Description  
Typ.[4]  
Max.  
10  
Unit  
pF  
CIN  
Input Capacitance  
Output Capacitance  
5
9
COUT  
12  
pF  
Notes:  
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
5. This parameter is specified but not tested.  
6. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY74FCT2827T  
Power Supply Characteristics  
Parameter  
ICC  
Description  
Test Conditions  
VCC=Max., VIN 0.2V,  
IN VCC-0.2V  
Typ.[4] Max.  
Unit  
Quiescent Power Supply Current  
0.1  
0.2  
mA  
V
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
VCC=Max., VIN=3.4V,[7]  
f1=0, Outputs Open  
0.5  
2.0  
mA  
ICCD  
Dynamic Power Supply  
Current[8]  
VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open,  
OE1 or OE2=GND,  
0.06  
0.12  
mA/  
MHz  
VIN 0.2V or VIN VCC-0.2V  
IC  
Total Power Supply Current[9]  
VCC=Max.,  
0.7  
1.0  
1.6  
1.4  
2.4  
mA  
mA  
mA  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
OE1 or OE2=GND,  
VIN 0.2V or VIN VCC-0.2V  
VCC=Max.,  
50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
OE1 or OE2=GND,  
VIN=3.4V or VIN=GND  
VCC=Max.,  
3.2[10]  
50% Duty Cycle, Outputs Open,  
Ten Bits Toggling at f1=2.5 MHz,  
OE1 or OE2=GND,  
VIN 0.2V or VIN VCC-0.2V  
VCC=Max., 50% Duty Cycle, Outputs Open,  
Ten Bits Toggling at f1=2.5 MHz,  
OE1 or OE2=GND,  
4.1 13.2[10] mA  
VIN=3.4V or VIN=GND  
Notes:  
7. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
8. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
9. IC  
IC  
=
=
=
=
IQUIESCENT + IINPUTS + IDYNAMIC  
ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
Quiescent Current with CMOS input levels  
Power Supply Current for a TTL HIGH input  
(VIN=3.4V)  
ICC  
ICC  
DH  
NT  
ICCD  
=
=
=
Duty Cycle for TTL inputs HIGH  
Number of TTL inputs at DH  
Dynamic Current caused by an input transition pair  
(HLH or LHL)  
f0  
f1  
N1  
=
=
=
Clock frequency for registered devices, otherwise zero  
Input signal frequency  
Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
10. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
]
3
CY74FCT2827T  
Switching Characteristics Over the Operating Range[11]  
CY74FCT2827AT CY74FCT2827CT  
Fig.  
Param.  
tPLH  
tPHL  
Description  
Test Load  
Min.  
Max.  
Min.  
Max.  
Unit No.[12]  
Propagation Delay D to Y  
CL=50 pF  
RL=500Ω  
1.5  
8.0  
1.5  
4.4  
ns  
ns  
ns  
ns  
ns  
ns  
1, 3  
tPLH  
tPHL  
Propagation Delay D to Y[5]  
Output Enable Time OE to Y  
Output Enable Time OE to Y[5]  
Output Disable Time OE to Y[5]  
Output Disable Time OE to Y  
CL=300 pF  
RL=500Ω  
1.5  
1.5  
1.5  
1.5  
1.5  
15.0  
12.0  
23.0  
9.0  
1.5  
1.5  
1.5  
1.5  
1.5  
10.0  
7.0  
1, 3  
tPZH  
tPZL  
CL=50 pF  
RL=500Ω  
1, 7, 8  
1, 7, 8  
1, 7, 8  
1, 7, 8  
tPZH  
tPZL  
CL=300 pF  
RL=500Ω  
14.0  
5.7  
tPHZ  
tPHL  
CL=5 pF  
RL=500Ω  
tPHZ  
tPHL  
CL=50 pF  
RL=500Ω  
9.0  
6.0  
Ordering Information  
Speed  
(ns)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
4.4  
CY74FCT2827CTQCT  
CY74FCT2827ATQCT  
Q13  
Q13  
24-Lead (150-Mil) QSOP  
24-Lead (150-Mil) QSOP  
Commercial  
Commercial  
8.0  
Note:  
11. Minimum limits are specified but not tested on Propagation Delays.  
12. See “Parameter Measurement Information” in the General Information section.  
Document #: 38-00347-A  
4
CY74FCT2827T  
Package Diagram  
24-Lead Quarter Size Outline Q13  
5
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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