CY74FCT540CTQCTE4 [TI]
8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS;
| 型号： | CY74FCT540CTQCTE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8-BIT BUFFERS/LINE DRIVERS WITH 3-STATE OUTPUTS 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总13页 (文件大小：465K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
CY54FCT541T . . . D PACKAGE
CY74FCT541T . . . P, Q, OR SO PACKAGE
(TOP VIEW)
Function, Pinout, and Drive Compatible
With FCT and F Logic
Reduced V
of Equivalent FCT Functions
(Typically = 3.3 V) Versions
OH
OE
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
A
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
D
D
D
D
D
D
D
D
OE
0
1
2
3
4
5
6
7
B
O
0
O
1
O
I
Supports Partial-Power-Down Mode
2
off
O
3
Operation
O
4
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
O
O
O
5
6
7
GND
– 1000-V Charged-Device Model (C101)
Matched Rise and Fall Times
CY54FCT541T . . . L PACKAGE
(TOP VIEW)
Fully Compatible With TTL Input and
Output Logic Levels
CY54FCT541T
– 48-mA Output Sink Current
– 12-mA Output Source Current
3
2
1
20 19
18
D
D
D
D
D
O
O
O
O
O
4
5
6
7
8
2
3
4
5
6
0
1
2
3
4
CY74FCT541T
– 64-mA Output Sink Current
– 32-mA Output Source Current
17
16
15
14
3-State Outputs
9 10 11 12 13
description
The ’FCT541T noninverting buffers/line drivers
can be employed as memory address drivers,
clock drivers, and bus-oriented transmitters/receivers. These devices provide speed and drive capabilities
equivalent to their fastest bipolar-logic counterparts, while reducing power dissipation. The input and output
voltage levels allow direct interface with TTL, NMOS, and CMOS devices without external components.
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the
off
off
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
unless otherwise noted. On all other products, production
testing of all parameters.
processing does not necessarily include testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
ORDERING INFORMATION
SPEED
(ns)
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
CY74FCT541CTQCT
CY74FCT541CTSOC
CY74FCT541CTSOCT
CY74FCT541ATPC
CY74FCT541ATQCT
CY74FCT541ATSOC
CY74FCT541ATSOCT
CY74FCT541TSOC
CY74FCT541TSOCT
CY54FCT541CTDMB
CY54FCT541TDMB
CY54FCT541TLMB
QSOP – Q
SOIC – SO
Tape and reel
Tube
4.1
4.1
4.1
4.8
4.8
4.8
4.8
8
FCT541C
FCT541C
Tape and reel
Tube
DIP – P
CY74FCT541ATPC
FCT541A
–40°C to 85°C
QSOP – Q
Tape and reel
Tube
SOIC – SO
SOIC – SO
FCT541A
FCT541
Tape and reel
Tube
Tape and reel
Tube
8
CDIP – D
CDIP – D
LCC – L
4.6
8
–55°C to 125°C
Tube
Tube
8
†
Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailable
at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUT
O
OE
L
OE
L
D
L
A
B
L
H
Z
L
L
H
X
H
H
H = High logic level, L = Low logic level,
X = Don’t care, Z = High-impedance state
logic diagram (positive logic)
1
OE
OE
A
19
B
2
18
D
O
0
0
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
†
absolute maximum rating over operating free-air temperature range (unless otherwise noted)
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θ (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
JA
Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
A
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder“recommendedoperatingconditions”isnotimplied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
CY54FCT541T
CY74FCT541T
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.75
2
5
5.25
V
V
CC
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
Operating free-air temperature
IH
0.8
–12
48
0.8
–32
64
V
IL
I
mA
mA
°C
OH
OL
I
T
A
–55
125
–40
85
NOTE 2: All unused inputs of the device must be held at V
or GND to ensure proper device operation.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CY54FCT541T
CY74FCT541T
PARAMETER
TEST CONDITIONS
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
V
= 4.5, V
= 4.75 V,
=4.5 V,
I
I
I
I
I
I
I
= –18 mA
= –18 mA
–0.7
–1.2
CC
CC
CC
IN
V
V
IK
–0.7
–1.2
IN
= –12 mA
= –32 mA
= –15 mA
= 48 mA
= 64 mA
2.4
3.3
OH
OH
OH
OL
OL
V
OH
2
V
V
CC
= 4.75 V
2.4
3.3
V
V
= 4.5 V,
0.3
0.2
0.55
CC
V
V
V
V
OL
= 4.75 V,
0.3
0.2
0.55
CC
All inputs
hys
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 0 V,
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= V
= V
5
±1
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
IN
IN
IN
IN
IN
IN
CC
CC
I
I
I
I
I
µA
I
5
±1
= 2.7 V
= 2.7 V
= 0.5 V
= 0.5 V
µA
µA
µA
µA
IH
±1
IL
±1
= 2.7 V
= 2.7 V
= 0.5 V
= 0.5 V
= 0 V
10
OUT
OUT
OUT
OUT
OUT
OUT
OUT
OZH
OZL
10
–10
–225
–10
–60
–120
‡
mA
µA
I
I
I
OS
= 0 V
–60
–120
–225
±1
= 4.5 V
±1
off
= 5.5 V,
= 5.25 V,
≤ 0.2 V,
V
V
≥ V
≥ V
– 0.2 V
– 0.2 V
0.1
0.5
0.2
IN
IN
IN
CC
mA
CC
≤ 0.2 V,
0.1
0.5
0.2
2
IN
CC
§
2
V
CC
V
CC
V
CC
= 5.5 V, V = 3.4 V , f = 0, Outputs open
IN
1
∆I
mA
CC
§
= 5.25 V, V = 3.4 V , f = 0, Outputs open
IN
1
= 5.5 V, 50% duty cycle, Outputs open,
One bit switching at f = 10 MHz,
OE = OE = GND or OE = GND and OE = V
1
0.06
0.12
,
A
B
A
B
CC
CC
V
IN
≤ 0.2 V or V ≥ V
– 0.2 V
mA/
MHz
IN CC
¶
I
CCD
V
CC
= 5.25 V, 50% duty cycle, Outputs open,
One bit switching at f = 10 MHz,
1
0.06
0.12
OE = OE = GND or OE = GND and OE = V
,
A
B
A
B
V
IN
≤ 0.2 V or V ≥ V
– 0.2 V
IN CC
†
‡
Typical values are at V
= 5 V, T = 25°C.
CC
A
Notmorethanoneoutputshouldbeshortedatatime.Durationofshortshouldnotexceedonesecond.Theuseofhigh-speedtestapparatusand/or
sample-and-holdtechniquesarepreferabletominimizeinternalchipheatingandmoreaccuratelyreflectoperationalvalues.Otherwise,prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, I
Per TTL-driven input (V = 3.4 V); all other inputs at V
This parameter is derived for use in total power-supply calculations.
tests should be performed last.
OS
§
¶
or GND
IN CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
CY54FCT541T
CY74FCT541T
PARAMETER
TEST CONDITIONS
UNIT
†
†
MIN TYP
MAX
MIN TYP
MAX
V
V
≤ 0.2 V or
One bit switching
IN
IN
0.7
1
1.4
V
= 5.5 V,
CC
Outputs open,
≥ V
– 0.2 V
at f = 10 MHz
CC
1
at 50% duty cycle
Eight bits switching
V
IN
= 3.4 V or GND
2.4
OE = OE
GND or
OE = GND and
OE = V
=
A
B
V
IN
V
IN
≤ 0.2 V or
||
2.6
1.3
≥ V
– 0.2 V
A
B
at f = 2.5 MHz
CC
1
CC
at 50% duty cycle
One bit switching
||
V
IN
= 3.4 V or GND
3.3 10.6
#
I
C
mA
V
IN
V
IN
≤ 0.2 V or
0.7
1
1.4
2.4
V
= 5.25 V,
CC
Outputs open,
≥ V
– 0.2 V
at f = 10 MHz
CC
1
at 50% duty cycle
Eight bits switching
V
IN
= 3.4 V or GND
OE = OE
GND or
OE = GND and
OE = V
=
A
B
V
IN
V
IN
≤ 0.2 V or
||
||
1.3
2.6
≥ V
– 0.2 V
A
B
at f = 2.5 MHz
CC
1
CC
at 50% duty cycle
V
IN
= 3.4 V or GND
3.3 10.6
C
C
5
9
10
12
pF
pF
i
o
†
#
Typical values are at V
CC
= 5 V, T = 25°C.
A
I
= I
+ ∆I
× D × N + I
(f /2 + f × N )
C
CC
CC
H
T
CCD 0 1 1
Where:
I
I
∆I
D
N
= Total supply current
= Power-supply current with CMOS input levels
= Power-supply current for a TTL high input (V = 3.4 V)
IN
= Duty cycle for TTL inputs high
C
CC
CC
H
T
= Number of TTL inputs at D
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
CCD
0
1
N
= Number of inputs changing at f
1
1
All currents are in milliamperes and all frequencies are in megahertz.
||
Values for these conditions are examples of the I
CC
formula.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
switching characteristics over operating free-air temperature range (see Figure 1)
CY54FCT541T CY54FCT541CT
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
4.6
4.6
6.5
6.5
5.7
5.7
t
t
t
t
t
t
8
PLH
PHL
PZH
PZL
PHZ
PLZ
D
O
O
O
8
10.5
10.5
10
ns
OE
OE
ns
10
switching characteristics over operating free-air temperature range (see Figure 1)
CY74FCT541T CY74FCT541AT CY74FCT541CT
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
4.8
4.8
6.2
6.2
5.6
5.6
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
4.1
4.1
5.8
5.8
5.2
5.2
t
t
t
t
t
t
8
PLH
PHL
PZH
PZL
PHZ
PLZ
D
O
O
O
8
10
ns
OE
OE
10
9.5
9.5
ns
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT541T, CY74FCT541T
8-BIT BUFFERS/LINE DRIVERS
WITH 3-STATE OUTPUTS
SCCS072 – OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7 V
Open
GND
S1
500 Ω
From Output
Under Test
From Output
Under Test
Test
Point
TEST
/t
S1
t
Open
7 V
PLH PHL
C
= 50 pF
C
= 50 pF
L
L
500 Ω
500 Ω
t
/t
PLZ PZL
/t
(see Note A)
(see Note A)
t
Open
PHZ PZH
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
LOAD CIRCUIT FOR
3-STATE OUTPUTS
3 V
0 V
1.5 V
Timing Input
Data Input
t
w
t
h
t
3 V
su
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
t
t
t
t
PLH
PHL
PLH
PZL
PZH
PLZ
≈3.5 V
V
Output
Waveform 1
(see Note B)
OH
In-Phase
Output
1.5 V
1.5 V
1.5 V
1.5 V
V
V
+ 0.3 V
OL
V
OL
V
OL
t
t
PHL
PHZ
V
V
V
OH
OH
Output
Waveform 2
(see Note B)
Out-of-Phase
Output
– 0.3 V
OH
1.5 V
1.5 V
≈0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-9223701M2A
5962-9223701MRA
5962-9223705MRA
CY54FCT541TDMB
CY54FCT541TLMB
CY74FCT541ATPC
CY74FCT541ATPCE4
CY74FCT541ATQCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
CDIP
CDIP
LCCC
PDIP
PDIP
SSOP
FK
J
20
20
20
20
20
20
20
20
1
1
TBD
TBD
Call TI
Call TI
A42
Call TI
Call TI
J
1
TBD
N / A for Pkg Type
N / A for Pkg Type
J
1
TBD
A42
FK
N
1
TBD
POST-PLATE N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
20
20
2500
Pb-Free (RoHS)
Pb-Free (RoHS)
N
DBQ
Green (RoHS
& no Sb/Br)
CY74FCT541ATQCTE4
CY74FCT541ATQCTG4
CY74FCT541ATSOC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SOIC
DBQ
DBQ
DW
20
20
20
20
20
20
20
20
20
20
20
20
2500
2500
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CY74FCT541ATSOCE4
CY74FCT541ATSOCG4
CY74FCT541ATSOCT
CY74FCT541ATSOCTE4
CY74FCT541ATSOCTG4
CY74FCT541CTQCT
DW
25
Green (RoHS
& no Sb/Br)
DW
25
Green (RoHS
& no Sb/Br)
DW
2000
2000
2000
2500
2500
2500
25
Green (RoHS
& no Sb/Br)
DW
Green (RoHS
& no Sb/Br)
DW
Green (RoHS
& no Sb/Br)
DBQ
DBQ
DBQ
DW
Green (RoHS
& no Sb/Br)
CY74FCT541CTQCTE4
CY74FCT541CTQCTG4
CY74FCT541CTSOC
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2012
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
CY74FCT541CTSOCE4
CY74FCT541CTSOCG4
CY74FCT541CTSOCT
CY74FCT541CTSOCTE4
CY74FCT541CTSOCTG4
CY74FCT541TQCT
SOIC
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
DW
DW
DW
DW
DW
DBQ
DBQ
DBQ
DW
DW
DW
20
20
20
20
20
20
20
20
20
20
20
25
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
2000
2000
2000
2500
2500
2500
25
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CY74FCT541TQCTE4
CY74FCT541TQCTG4
CY74FCT541TSOC
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CY74FCT541TSOCE4
CY74FCT541TSOCG4
25
Green (RoHS
& no Sb/Br)
25
Green (RoHS
& no Sb/Br)
CY74FCT541TSOCT
CY74FCT541TSOCTE4
CY74FCT541TSOCTG4
OBSOLETE
OBSOLETE
OBSOLETE
SOIC
SOIC
SOIC
DW
DW
DW
20
20
20
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2012
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CY74FCT541ATQCT
CY74FCT541ATSOCT
CY74FCT541CTQCT
CY74FCT541CTSOCT
CY74FCT541TQCT
SSOP
SOIC
SSOP
SOIC
SSOP
DBQ
DW
20
20
20
20
20
2500
2000
2500
2000
2500
330.0
330.0
330.0
330.0
330.0
16.4
24.4
16.4
24.4
16.4
6.5
10.8
6.5
9.0
13.0
9.0
2.1
2.7
2.1
2.7
2.1
8.0
12.0
8.0
16.0
24.0
16.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
DBQ
DW
10.8
6.5
13.0
9.0
12.0
8.0
DBQ
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CY74FCT541ATQCT
CY74FCT541ATSOCT
CY74FCT541CTQCT
CY74FCT541CTSOCT
CY74FCT541TQCT
SSOP
SOIC
SSOP
SOIC
SSOP
DBQ
DW
20
20
20
20
20
2500
2000
2500
2000
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
38.0
45.0
38.0
DBQ
DW
DBQ
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
CY74FCT540CTSOCR
Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOIC-20
CYPRESS
CY74FCT540TQC
Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, 0.150 INCH, QSOP-20
CYPRESS
CY74FCT540TSOC
Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOIC-20
CYPRESS
CY74FCT541ATQCT
Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO20, 0.150 INCH, QSOP-20
CYPRESS
©2020 ICPDF网 联系我们和版权申明