CY74FCT573TSOCR [TI]

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CY74FCT573TSOCR
型号: CY74FCT573TSOCR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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Data sheet acquired from Cypress Semiconductor Corporation.  
Data sheet modified to remove devices not offered.  
CY54/74FCT373T  
CY54/74FCT573T  
SCCS021 - May 1994 - Revised February 2000  
8-Bit Latches  
Features  
Functional Description  
• Function and pinout compatible with FCT, and F logic  
• FCT-C speed at 4.2 ns max. (Com’l),  
FCT-A speed at 5.2 ns max. (Com’l)  
• Reduced VOH (typically = 3.3V) versions of equivalent  
FCT functions  
• Edge-rate control circuitry for significantly improved  
noise characteristics  
• Power-off disable feature  
• ESD > 2000V  
• Matched rise and fall times  
• Extended commercial range of 40˚C to +85˚C  
• Fully compatible with TTL input and output logic levels  
The FCT373T and FCT573T consist of eight latches with  
three-state outputs for bus organized applications. When latch  
enable (LE) is HIGH, the flip-flops appear transparent to the  
data. Data that meets the required set-up times are latched  
when LE transitions from HIGH to LOW. Data appears on the  
bus when the (OE) is LOW. When output enable is HIGH, the  
bus output is in the impedance state. In this mode, data may  
be entered into the latches. The FCT573T is identical to the  
FCT373T except for the flow-through pinout, which simplifies  
board design.  
The outputs are designed with a power-off disable feature to  
allow for live insertion of boards.  
• Sink current  
64 mA (Com’l), 32 mA (Mil)  
Source current 32 mA (Com’l), 12 mA (Mil)  
Logic Block Diagram  
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
LE  
CP  
D
Q
CP  
D
Q
CP  
D
Q
CP  
D
Q
CP  
D
Q
CP  
D
Q
CP  
D
Q
CP  
D
Q
OE  
O
0
O
1
O
2
O
3
O
4
O
5
O
6
O
7
Pin Configurations  
DIP/SOIC/QSOP  
Top View  
DIP/SOIC/QSOP  
Top View  
OE  
1
2
3
4
5
6
7
8
9
10  
V
OE  
20  
19  
18  
17  
CC  
1
2
3
4
5
6
7
8
9
10  
V
20  
19  
18  
17  
CC  
D
0
O
0
O
0
O
7
D
1
O
1
D
0
D
7
D
2
O
2
D
1
D
6
FCT573T  
D
3
FCT373T  
O
3
16  
O
1
O
6
16  
D
4
O
4
15  
14  
13  
12  
11  
O
2
O
5
15  
14  
13  
12  
11  
D
5
O
5
D
2
D
5
D
6
O
6
D
3
D
4
D
7
O
7
O
3
O
4
GND  
LE  
GND  
LE  
Logic Symbol  
D
0
D
1
D
2
D
3
D
4
D
5
D
6
D
7
LE  
OE  
O
0
O
1
O
2
O
3
O
4
O
5
O
6
O
7
Copyright © 2000, Texas Instruments Incorporated  
CY54/74FCT373T  
CY54/74FCT573T  
Function Table[1]  
Supply Voltage to Ground Potential............... –0.5V to +7.0V  
DC Input Voltage ........................................... –0.5V to +7.0V  
DC Output Voltage......................................... –0.5V to +7.0V  
DC Output Current (Maximum Sink Current/Pin) ......120 mA  
Power Dissipation..........................................................0.5W  
Inputs  
Outputs  
OE  
L
LE  
H
H
L
D
H
L
O
H
L
L
Static Discharge Voltage............................................>2001V  
(per MIL-STD-883, Method 3015)  
L
X
X
Q0  
Z
H
X
Operating Range  
Maximum Ratings[2, 3]  
Ambient  
Range  
Range  
Temperature  
–40°C to +85°C  
–55°C to +125°C  
VCC  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Commercial T, AT, CT  
Military[4]  
5V ± 5%  
5V ± 10%  
Storage Temperature .................................65°C to +150°C  
All  
Ambient Temperature with  
Power Applied.............................................65°C to +135°C  
Electrical Characteristics Over the Operating Range  
Parameter  
Description  
Test Conditions  
VCC=Min., IOH=–32 mA  
Min.  
2.0  
Typ.[5]  
Max.  
Unit  
V
VOH  
Output HIGH Voltage  
Com’l  
Com’l  
Mil  
VCC=Min., IOH=–15 mA  
VCC=Min., IOH=–12 mA  
VCC=Min., IOL=64 mA  
VCC=Min., IOL=32 mA  
2.4  
3.3  
3.3  
0.3  
0.3  
V
2.4  
V
VOL  
Output LOW Voltage  
Com’l  
Mil  
0.55  
0.55  
V
V
VIH  
VIL  
VH  
VIK  
II  
Input HIGH Voltage  
Input LOW Voltage  
Hysteresis[6]  
2.0  
V
0.8  
V
All inputs  
0.2  
V
Input Clamp Diode Voltage  
Input HIGH Current  
Input HIGH Current  
Input LOW Current  
VCC=Min., IIN=–18 mA  
VCC=Max., VIN=VCC  
VCC=Max., VIN=2.7V  
VCC=Max., VIN=0.5V  
VCC=Max., VOUT=2.7V  
–0.7  
–1.2  
5
V
µA  
µA  
µA  
µA  
IIH  
±1  
±1  
10  
IIL  
IOZH  
Off State HIGH-Level Output  
Current  
IOZL  
IOS  
Off State LOW-Level  
Output Current  
Output Short Circuit Current[7] VCC=Max., VOUT=0.0V  
VCC=Max., VOUT=0.5V  
–10  
µA  
–60  
–120  
–225  
mA  
IOFF  
Power-Off Disable VCC=0V, VOUT=4.5V  
±1  
µA  
Notes:  
1. H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Don’t Care  
Z = HIGH Impedance  
Qn = Previous state of flip flops (Qn-1  
)
2. Unless otherwise noted, these limits are over the operating free-air temperature range.  
3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground.  
4. TA is the “instant on” case temperature.  
5. Typical values are at VCC=5.0V, TA=+25˚C ambient.  
6. This parameter is specified but not tested.  
7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample  
and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of  
a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter  
tests, IOS tests should be performed last.  
2
CY54/74FCT373T  
CY54/74FCT573T  
Capacitance[6]  
Parameter  
CIN  
Description  
Typ.[5]  
Max.  
10  
Unit  
pF  
Input Capacitance  
Output Capacitance  
6
8
COUT  
12  
pF  
Power Supply Characteristics  
Parameter  
ICC  
Description  
Test Conditions  
Typ.[5]  
0.1  
Max.  
Unit  
Quiescent Power Supply Current  
VCC=Max., VIN 0.2V, VIN VCC – 0.2V  
VCC=Max., VIN=3.4V, f1=0, Outputs Open[8]  
0.2  
2.0  
mA  
mA  
ICC  
Quiescent Power Supply Current  
(TTL inputs HIGH)  
0.5  
ICCD  
Dynamic Power Supply Current[9] VCC=Max., One Input Toggling,  
50% Duty Cycle, Outputs Open,  
0.6  
0.7  
0.12  
1.4  
mA/MHz  
mA  
OE=GND, VIN 0.2V or VIN VCC – 0.2V  
IC  
Total Power Supply Current[10]  
VCC=Max., 50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
OE=GND, LE=VCC  
VIN 0.2V or VIN VCC – 0.2V  
VCC=Max., 50% Duty Cycle, Outputs Open,  
One Bit Toggling at f1=10 MHz,  
OE=GND, LE=VCC, VIN=3.4V or VIN=GND  
1.0  
1.3  
2.4  
mA  
mA  
VCC=Max., 50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
2.6[11]  
OE=GND, LE=VCC  
,
V
IN 0.2V or VIN VCC – 0.2V  
VCC=Max., 50% Duty Cycle, Outputs Open,  
Eight Bits Toggling at f1=2.5 MHz,  
3.3  
10.6[11]  
mA  
OE=GND, LE=VCCVIN=3.4V or VIN=GND  
Notes:  
8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND.  
9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations.  
10. IC  
IC  
= IQUIESCENT + IINPUTS + IDYNAMIC  
= ICC+ICCDHNT+ICCD(f0/2 + f1N1)  
ICC = Quiescent Current with CMOS input levels  
ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V)  
DH = Duty Cycle for TTL inputs HIGH  
NT  
= Number of TTL inputs at DH  
ICCD = Dynamic Current caused by an input transition pair (HLH or LHL)  
f0  
f1  
= Clock frequency for registered devices, otherwise zero  
= Input signal frequency  
N1  
= Number of inputs changing at f1  
All currents are in milliamps and all frequencies are in megahertz.  
11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested.  
3
CY54/74FCT373T  
CY54/74FCT573T  
e
Switching Characteristics Over the Operating Range[12]  
FCT373T/FCT573T  
FCT373AT/FCT573AT  
Military Commercial  
Military  
Commercial  
Fig.  
Parameter  
Description  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Unit No.[13]  
tPLH  
tPHL  
Propagation Delay  
D to O  
1.5  
2.0  
1.5  
1.5  
2.0  
8.5  
1.5  
8.0  
1.5  
2.0  
1.5  
1.5  
2.0  
5.6  
1.5  
5.2  
ns  
ns  
ns  
ns  
ns  
1, 3  
1, 5  
tPLH  
tPHL  
Propagation Delay  
LE to O  
15.0  
13.5  
10.0  
2.0  
1.5  
1.5  
2.0  
13.0  
12.0  
7.5  
9.8  
7.5  
6.5  
2.0  
1.5  
1.5  
2.0  
8.5  
6.5  
5.5  
tPZH  
tPZL  
Output Enable Time  
1, 7, 8  
1, 7, 8  
9
tPHZ  
tPLZ  
Output Disable Time  
tS  
Set-Up Time  
HIGH to LOW  
D to LE  
tH  
Set-Up Time  
HIGH to LOW  
D to LE  
1.5  
6.0  
1.5  
6.0  
1.5  
6.0  
1.5  
5.0  
ns  
ns  
9
5
tW  
LE Pulse  
Width HIGH  
FCT373CT/  
FCT573CT  
Commercial  
Parameter  
Description  
Min.  
Max.  
Unit  
Fig. No.[13]  
tPLH  
tPHL  
Propagation Delay D to O  
Propagation Delay LE to O  
Output Enable Time  
1.5  
4.2  
5.5  
5.5  
5.0  
ns  
ns  
ns  
ns  
1, 3  
tPLH  
tPHL  
2.0  
1.5  
1.5  
1, 5  
tPZH  
tPZL  
1, 7, 8  
1, 7, 8  
tPHZ  
tPLZ  
Output Disable Time  
tS  
tH  
Set-Up Time, HIGH to LOW D to LE  
Set-Up Time, HIGH to LOW D to LE  
LE Pulse Width HIGH  
2.0  
1.5  
5.0  
ns  
ns  
ns  
9
9
5
tW  
Note:  
12. Minimum limits are specified but not tested on Propagation Delays.  
13. See “Parameter Measurement Information” in the General Information section.  
4
CY54/74FCT373T  
CY54/74FCT573T  
Ordering Information–FCT373T  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT373CTQCT  
Package Type  
20-Lead (150-Mil) QSOP  
4.2  
Q5  
S5  
Q5  
S5  
D6  
S5  
D6  
Commercial  
CY74FCT373CTSOC/SOCT  
CY74FCT373ATQCT  
20-Lead (300-Mil) Molded SOIC  
20-Lead (150-Mil) QSOP  
5.2  
Commercial  
CY74FCT373ATSOC/SOCT  
CY54FCT373ATDMB  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
5.6  
8.0  
8.5  
Military  
CY74FCT373TSOC/SOCT  
CY54FCT373TDMB  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
Commercial  
Military  
Ordering Information—FCT573T  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
CY74FCT573CTQCT  
CY74FCT573CTSOC/SOCT  
CY74FCT573ATPC  
Package Type  
20-Lead (150-Mil) QSOP  
4.2  
Q5  
S5  
P5  
Q5  
S5  
Q5  
S5  
D6  
Commercial  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) Molded DIP  
20-Lead (150-Mil) QSOP  
5.2  
Commercial  
CY74FCT573ATQCT  
CY74FCT573ATSOC/SOCT  
CY74FCT573TQCT  
20-Lead (300-Mil) Molded SOIC  
20-Lead (150-Mil) QSOP  
8.0  
8.5  
Commercial  
Military  
CY74FCT573TSOC/SOCT  
CY54FCT573TDMB  
20-Lead (300-Mil) Molded SOIC  
20-Lead (300-Mil) CerDIP  
Document #: 38-00272-B  
5
CY54/74FCT373T  
CY54/74FCT573T  
Package Diagrams  
20-Lead (300-Mil) CerDIP D6  
MIL-STD-1835  
D-8 Config.A  
20-Lead (300-Mil) Molded DIP P5  
6
CY54/74FCT373T  
CY54/74FCT573T  
Package Diagrams (continued)  
20-Lead Quarter Size Outline Q5  
20-Lead (300-Mil) Molded SOIC S5  
7
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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