CY74FCT574ATQCTG4 [TI]
8-BIT REGISTERS WITH 3-STATE OUTPUTS; 8位寄存器具有三态输出
| 型号： | CY74FCT574ATQCTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8-BIT REGISTERS WITH 3-STATE OUTPUTS |
| 文件： | 总15页 (文件大小：199K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
CY54FCT374T . . . D PACKAGE
CY74FCT374T . . . P, Q, OR SO PACKAGE
(TOP VIEW)
Function, Pinout, and Drive Compatible
With FCT and F Logic
Reduced V
of Equivalent FCT Functions
(Typically = 3.3 V) Versions
OH
OE
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
O
O
Edge-Rate Control Circuitry for
Significantly Improved Noise
Characteristics
0
7
D
0
D
7
D
D
1
6
O
O
D
D
O
O
O
D
D
1
2
2
3
3
6
5
5
4
I
Supports Partial-Power-Down Mode
off
Operation
Matched Rise and Fall Times
Fully Compatible With TTL Input and
Output Logic Levels
O
4
GND
CP
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
CY54FCT374T . . . L PACKAGE
(TOP VIEW)
– 1000-V Charged-Device Model (C101)
Edge-Triggered D-Type Inputs
250-MHz Typical Switching Rate
3
2
1
20 19
18
D
O
O
D
D
D
D
CY54FCT374T
– 32-mA Output Sink Current
– 12-mA Output Source Current
4
5
6
7
8
1
1
2
2
3
7
6
17
16
15
14
O
O
D
6
5
CY74FCT374T
– 64-mA Output Sink Current
– 32-mA Output Source Current
5
9 10 11 12 13
3-State Outputs
description
The ’FCT374T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for
each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and
output-enable (OE) inputs are common to all flip-flops. The eight flip-flops in the ’FCT374T store the state of
their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition.
When OE is low, the contents of the eight flip-flops are available at the outputs. When OE is high, the outputs
are in the high-impedance state. The state of OE does not affect the state of the flip-flops.
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the
off
off
outputs, preventing damaging current backflow through the device when it is powered down.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2001, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
unless otherwise noted. On all other products, production
testing of all parameters.
processing does not necessarily include testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
ORDERING INFORMATION
SPEED
(ns)
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
CY74FCT374CTQCT
CY74FCT374CTSOC
CY74FCT374CTSOCT
CY74FCT374ATPC
CY74FCT374ATQCT
CY74FCT374ATSOC
CY74FCT374ATSOCT
CY74FCT374TQCT
QSOP – Q
SOIC – SO
Tape and reel
Tube
5.2
5.2
5.2
6.5
6.5
6.5
6.5
10
FCT374C
FCT374C
Tape and reel
Tube
DIP – P
CY74FCT374ATPC
FCT374A
QSOP – Q
Tape and reel
Tube
–40°C to 85°C
SOIC – SO
QSOP – Q
SOIC – SO
FCT374A
FCT374
FCT374
Tape and reel
Tape and reel
Tube
10
10
CY74FCT374TSOC
CY74FCT374TSOCT
CY54FCT374CTDMB
CY54FCT374CTLMB
CY54FCT374ATDMB
CY54FCT374ATLMB
CY54FCT374TDMB
CY54FCT374TLMB
Tape and reel
Tube
CDIP – D
LCC – L
CDIP – D
LCC – L
CDIP – D
LCC – L
6.2
6.2
7.2
7.2
11
Tube
Tube
–55°C to 125°C
Tube
Tube
Tube
11
†
Packagedrawings,standardpackingquantities,thermaldata,symbolization,andPCBdesignguidelinesareavailable
at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OUTPUT
O
D
H
L
CP
↑
OE
L
H
L
↑
L
X
X
H
Z
H = High logic level, L = Low logic level,
X = Don’tcare,Z=High-impedancestate,
↑ = Low-to-high clock transition
logic diagram (positive logic)
1
OE
11
CP
C1
Q
1D
2
O
0
3
D
0
To Seven Other Channels
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
DC output current (maximum sink current/pin) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 mA
Package thermal impedance, θ (see Note 1): P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
JA
Q package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68°C/W
SO package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
Ambient temperature range with power applied, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 135°C
A
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functionaloperationofthedeviceattheseoranyotherconditionsbeyondthoseindicatedunder“recommendedoperatingconditions”isnotimplied.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 2)
CY54FCT374T
CY74FCT374T
MIN NOM MAX
UNIT
MIN NOM
MAX
V
V
V
Supply voltage
4.5
2
5
5.5
4.75
2
5
5.25
V
V
CC
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
Operating free-air temperature
IH
0.8
–12
32
0.8
–32
64
V
IL
I
I
mA
mA
°C
OH
OL
T
A
–55
125
–40
85
NOTE 2: All unused inputs of the device must be held at V
or GND to ensure proper device operation.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
CY54FCT374T
CY74FCT374T
PARAMETER
TEST CONDITIONS
UNIT
†
TYP
†
TYP
MIN
MAX
MIN
MAX
V
V
V
= 4.5 V,
= 4.75 V,
= 4.5 V,
I
I
I
I
I
I
I
= –18 mA
= –18 mA
–0.7
–1.2
CC
CC
CC
IN
V
V
IK
–0.7
–1.2
IN
= –12 mA
= –32 mA
= –15 mA
= 32 mA
= 64 mA
2.4
3.3
OH
OH
OH
OL
OL
V
OH
2
V
V
CC
= 4.75 V
2.4
3.3
V
V
= 4.5 V,
0.3
0.2
0.55
CC
V
V
V
V
OL
= 4.75 V,
0.3
0.2
0.55
CC
All inputs
hys
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 0 V,
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
= V
= V
5
±1
±1
IN
IN
IN
IN
IN
IN
CC
CC
I
µA
I
5
= 2.7 V
= 2.7 V
= 0.5 V
= 0.5 V
I
IH
µA
±1
I
I
I
µA
µA
IL
±1
±1
= 4.5 V
= 0 V
±1
off
OS
OUT
OUT
OUT
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
= 5.5 V,
= 5.25 V,
–60
–120
–225
‡
mA
= 0 V
–60
–120
–225
10
= 2.7 V
10
–10
0.2
IN
IN
IN
IN
IN
IN
I
I
I
µA
µA
OZH
OZL
CC
= 2.7 V
= 0.5 V
= 0.5 V
≤ 0.2 V,
≤ 0.2 V,
–10
0.2
2
V
V
≥ V
≥ V
– 0.2 V
– 0.2 V
0.1
0.5
IN
CC
mA
mA
0.1
0.5
IN
CC
§
= 5.5 V, V = 3.4 V , f = 0, Outputs open
IN
2
1
∆I
CC
§
= 5.25 V, V = 3.4 V , f = 0, Outputs open
IN
1
†
‡
Typical values are at V
= 5 V, T = 25°C.
CC
A
Notmorethanoneoutputshouldbeshortedatatime.Durationofshortshouldnotexceedonesecond.Theuseofhigh-speedtestapparatusand/or
sample-and-holdtechniquesarepreferabletominimizeinternalchipheatingandmoreaccuratelyreflectoperationalvalues.Otherwise,prolonged
shorting of a high output can raise the chip temperature well above normal and cause invalid readings in other parametric tests. In any sequence
of parameter tests, I
Per TTL-driven input (V = 3.4 V); all other inputs at V
tests should be performed last.
OS
§
or GND
IN CC
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
CY54FCT374T
CY74FCT374T
PARAMETER
TEST CONDITIONS
UNIT
†
TYP
†
TYP
MIN
MAX
MIN
MAX
V
= 5.5 V, Outputs open,
CC
One bit switching at 50% duty cycle, OE = GND,
0.06
0.12
V
≤ 0.2 V or V ≥ V
– 0.2 V
IN
IN CC
mA/
MHz
¶
I
CCD
V
CC
= 5.25 V, Outputs open,
One bit switching at 50% duty cycle, OE = GND,
0.06
0.12
V
IN
≤ 0.2 V or V ≥ V – 0.2 V
IN CC
One bit
switching
V
V
≤ 0.2 V or
IN
IN
0.7
1.2
1.6
3.9
1.4
3.4
≥ V
– 0.2 V
CC
at f = 5 MHz
1
at 50% duty
cycle
V
= 5.5 V,
= 10 MHz,
CC
V
IN
= 3.4 V or GND
f
0
Outputs open,
OE = GND
Eight bits
switching
V
IN
V
IN
≤ 0.2 V or
||
3.2
≥ V
– 0.2 V
CC
at f = 2.5 MHz
1
at 50% duty
cycle
||
12.2
V
IN
= 3.4 V or GND
I
C
mA
One bit
switching
V
V
≤ 0.2 V or
IN
IN
0.7
1.2
1.6
3.9
1.4
3.4
≥ V
– 0.2 V
CC
at f = 5 MHz
1
at 50% duty
cycle
V
= 5.25 V,
CC
= 10 MHz,
V
IN
= 3.4 V or GND
f
Outputs open,
OE = GND
Eight bits
switching
V
IN
V
IN
≤ 0.2 V or
||
3.2
≥ V
– 0.2 V
CC
at f = 2.5 MHz
1
at 50% duty
cycle
||
12.2
V
IN
= 3.4 V or GND
C
C
5
9
10
12
5
9
10
12
pF
pF
i
o
†
¶
#
Typical values are at V
CC
= 5 V, T = 25°C.
A
This parameter is derived for use in total power-supply calculations.
= I + ∆I × D × N + I (f /2 + f × N )
I
C
CC
CC
H
T
CCD
0
1
1
Where:
I
I
∆I
D
N
= Total supply current
= Power-supply current with CMOS input levels
C
CC
CC
H
T
= Power-supply current for a TTL high input (V = 3.4 V)
IN
= Duty cycle for TTL inputs high
= Number of TTL inputs at D
H
I
f
f
= Dynamic current caused by an input transition pair (HLH or LHL)
= Clock frequency for registered devices, otherwise zero
= Input signal frequency
CCD
0
1
N
= Number of inputs changing at f
1
1
All currents are in milliamperes and all frequencies are in megahertz.
||
Values for these conditions are examples of the I
CC
formula.
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY54FCT374T CY54FCT374AT CY54FCT374CT
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
t
w
t
su
t
h
Pulse duration, CP high or low
Setup time, data before CP↑
Hold time, data after CP↑
7
6
6
ns
ns
ns
2
2
2
1.5
1.5
1.5
timing requirements over recommended operating free-air temperature range (unless otherwise
noted) (see Figure 1)
CY74FCT374T CY74FCT374AT CY74FCT374CT
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
t
w
t
su
t
h
Pulse duration, CP high or low
Setup time, data before CP↑
Hold time, data after CP↑
7
5
5
ns
ns
ns
2
2
2
1.5
1.5
1.5
switching characteristics over operating free-air temperature range (see Figure 1)
CY54FCT374T CY54FCT374AT CY54FCT374CT
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
2
MAX
11
11
14
14
8
MIN
2
MAX
7.2
7.2
7.5
7.5
6.5
6.5
MIN
2
MAX
6.2
6.2
6.2
6.2
5.7
5.7
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
CP
OE
OE
O
O
O
2
2
2
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
8
switching characteristics over operating free-air temperature range (see Figure 1)
CY74FCT374T CY74FCT374AT CY74FCT374CT
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
ns
MIN
2
MAX
10
MIN
2
MAX
6.5
6.5
6.5
6.5
5.5
5.5
MIN
2
MAX
5.2
5.2
5.5
5.5
5
t
t
t
t
t
t
PLH
PHL
PZH
PZL
PHZ
PLZ
CP
OE
OE
O
O
O
2
10
2
2
1.5
1.5
1.5
1.5
12.5
12.5
8
1.5
1.5
1.5
1.5
1.5
1.5
1.5
1.5
ns
ns
8
5
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
CY54FCT374T, CY74FCT374T
8-BIT REGISTERS
WITH 3-STATE OUTPUTS
SCCS022A – MAY 1994 – REVISED OCTOBER 2001
PARAMETER MEASUREMENT INFORMATION
7 V
Open
GND
S1
500 Ω
From Output
Under Test
From Output
Under Test
Test
Point
TEST
/t
S1
t
Open
7 V
PLH PHL
C
= 50 pF
C
= 50 pF
L
L
500 Ω
500 Ω
t
/t
PLZ PZL
/t
(see Note A)
(see Note A)
t
Open
PHZ PZH
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
LOAD CIRCUIT FOR
3-STATE OUTPUTS
3 V
0 V
1.5 V
Timing Input
Data Input
t
w
t
h
t
3 V
su
3 V
0 V
1.5 V
Input
1.5 V
1.5 V
1.5 V
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3 V
0 V
3 V
0 V
Output
Control
1.5 V
1.5 V
1.5 V
1.5 V
Input
t
t
t
t
t
t
PLH
PHL
PLH
PZL
PZH
PLZ
≈3.5 V
V
Output
Waveform 1
(see Note B)
OH
In-Phase
Output
1.5 V
1.5 V
1.5 V
1.5 V
V
V
+ 0.3 V
OL
V
OL
V
OL
t
t
PHL
PHZ
V
V
V
OH
OH
Output
Waveform 2
(see Note B)
Out-of-Phase
Output
– 0.3 V
OH
1.5 V
1.5 V
≈0 V
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. includes probe and jig capacitance.
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
LCCC
CDIP
LCCC
CDIP
LCCC
CDIP
CDIP
CDIP
LCCC
LCCC
CDIP
LCCC
LCCC
PDIP
Drawing
5962-9221802M2A
5962-9221802MRA
5962-9221804M2A
5962-9221804MRA
5962-9221806M2A
5962-9221806MRA
5962-9222203M2A
5962-9222203MRA
5962-9222205MRA
CY54FCT374ATDMB
CY54FCT374ATLMB
CY54FCT374CTLMB
CY54FCT374TDMB
CY54FCT374TLMB
CY54FCT574ATLMB
CY74FCT374ATPC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
20
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB N / A for Pkg Type
POST-PLATE N / A for Pkg Type
FK
J
FK
J
FK
J
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
J
FK
FK
J
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
FK
FK
N
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
Pb-Free
(RoHS)
CY74FCT374ATPCE4
CY74FCT374ATQCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
N
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SSOP/
QSOP
DBQ
DBQ
DBQ
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
CY74FCT374ATQCTE4
CY74FCT374ATQCTG4
CY74FCT374ATSOC
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT374ATSOCE4
CY74FCT374ATSOCG4
CY74FCT374ATSOCT
CY74FCT374ATSOCTE4
CY74FCT374ATSOCTG4
CY74FCT374CTQCT
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
DBQ
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
CY74FCT374CTQCTE4
CY74FCT374CTQCTG4
CY74FCT374CTSOC
CY74FCT374CTSOCE4
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Orderable Device
CY74FCT374CTSOCG4
CY74FCT374CTSOCT
CY74FCT374CTSOCTE4
CY74FCT374CTSOCTG4
CY74FCT374TQCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
DW
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
DBQ
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
CY74FCT374TQCTE4
CY74FCT374TQCTG4
CY74FCT374TSOC
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT374TSOCE4
CY74FCT374TSOCG4
CY74FCT374TSOCT
CY74FCT374TSOCTE4
CY74FCT374TSOCTG4
CY74FCT574ATQCT
CY74FCT574ATQCTE4
CY74FCT574ATQCTG4
CY74FCT574ATSOC
CY74FCT574ATSOCE4
CY74FCT574ATSOCG4
CY74FCT574ATSOCT
CY74FCT574ATSOCTE4
CY74FCT574ATSOCTG4
CY74FCT574CTQCT
CY74FCT574CTQCTE4
CY74FCT574CTQCTG4
CY74FCT574CTSOC
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
DBQ
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
DBQ
DW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Orderable Device
CY74FCT574CTSOCE4
CY74FCT574CTSOCG4
CY74FCT574CTSOCT
CY74FCT574CTSOCTE4
CY74FCT574CTSOCTG4
CY74FCT574TQCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
20
20
20
20
20
20
20
20
20
20
20
20
20
20
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
DW
DW
DW
DW
DBQ
DBQ
DBQ
DW
DW
DW
DW
DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
CY74FCT574TQCTE4
CY74FCT574TQCTG4
CY74FCT574TSOC
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CY74FCT574TSOCE4
CY74FCT574TSOCG4
CY74FCT574TSOCT
CY74FCT574TSOCTE4
CY74FCT574TSOCTG4
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
330
330
330
330
330
330
(mm)
16
24
16
24
16
24
16
24
16
24
16
24
CY74FCT374ATQCT
CY74FCT374ATSOCT
CY74FCT374CTQCT
CY74FCT374CTSOCT
CY74FCT374TQCT
CY74FCT374TSOCT
CY74FCT574ATQCT
CY74FCT574ATSOCT
CY74FCT574CTQCT
CY74FCT574CTSOCT
CY74FCT574TQCT
CY74FCT574TSOCT
DBQ
DW
20
20
20
20
20
20
20
20
20
20
20
20
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
6.5
10.8
6.5
9.0
13.0
9.0
2.1
2.7
2.1
2.7
2.1
2.7
2.1
2.7
2.1
2.7
2.1
2.7
8
12
8
16
24
16
24
16
24
16
24
16
24
16
24
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
DBQ
DW
10.8
6.5
13.0
9.0
12
8
DBQ
DW
10.8
6.5
13.0
9.0
12
8
DBQ
DW
10.8
6.5
13.0
9.0
12
8
DBQ
DW
10.8
6.5
13.0
9.0
12
8
DBQ
DW
10.8
13.0
12
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CY74FCT374ATQCT
CY74FCT374ATSOCT
CY74FCT374CTQCT
CY74FCT374CTSOCT
CY74FCT374TQCT
CY74FCT374TSOCT
CY74FCT574ATQCT
CY74FCT574ATSOCT
CY74FCT574CTQCT
DBQ
DW
20
20
20
20
20
20
20
20
20
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
MLA
0.0
333.2
0.0
0.0
333.2
0.0
0.0
31.75
0.0
DBQ
DW
333.2
0.0
333.2
0.0
31.75
0.0
DBQ
DW
333.2
0.0
333.2
0.0
31.75
0.0
DBQ
DW
333.2
0.0
333.2
0.0
31.75
0.0
DBQ
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-May-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CY74FCT574CTSOCT
CY74FCT574TQCT
CY74FCT574TSOCT
DW
DBQ
DW
20
20
20
MLA
MLA
MLA
333.2
0.0
333.2
0.0
31.75
0.0
333.2
333.2
31.75
Pack Materials-Page 3
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
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Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
RFID
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lpw
Telephony
Low Power
Wireless
Video & Imaging
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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